JP2008270696A - Component mounting position correcting method and component mounting apparatus - Google Patents

Component mounting position correcting method and component mounting apparatus Download PDF

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Publication number
JP2008270696A
JP2008270696A JP2007174390A JP2007174390A JP2008270696A JP 2008270696 A JP2008270696 A JP 2008270696A JP 2007174390 A JP2007174390 A JP 2007174390A JP 2007174390 A JP2007174390 A JP 2007174390A JP 2008270696 A JP2008270696 A JP 2008270696A
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Japan
Prior art keywords
component
position
mounting
mounted
solder printing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2007174390A
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Japanese (ja)
Inventor
Yutaka Ogura
Takahiro Ohashi
隆弘 大橋
豊 小倉
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Juki Corp
Juki株式会社
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Publication date
Priority to JP2006194441 priority Critical
Priority to JP2007081557 priority
Application filed by Juki Corp, Juki株式会社 filed Critical Juki Corp
Priority to JP2007174390A priority patent/JP2008270696A/en
Priority claimed from US11/826,259 external-priority patent/US20080014772A1/en
Publication of JP2008270696A publication Critical patent/JP2008270696A/en
Application status is Pending legal-status Critical

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting position correcting method and a component mounting apparatus which can correct a component mounting position efficiently in a short time of detection of solder printing misalignment. <P>SOLUTION: In order to correct a component mounting position according to a misalignment amount between a position of a component electrode on a board 32 and a printing position of a solder printed on the component electrode, mounting positions 36-1 to 36-4 of a predetermined correction object component are corrected according to a misalignment amount of the solder printing positions of predetermined detection object electrodes 34-1 to 34-4. Plural combinations of the detection object electrodes 34-1 to 34-4 and the correction object component whose mounting positions are corrected according to the misalignment amount of the solder can be set on the board. In a multi-chamfered board where a plurality of circuit assemblies are disposed, positions can be corrected by using the results of misalignement of solder printing positions, common to the plurality of circuit assemblies. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a component mounting position correction method and a component mounting apparatus, and in particular, a component mounting position on a substrate suitable for use when mounting an electronic component (also simply referred to as a component) on a substrate in the component mounting apparatus. Component mounting position correction method capable of detecting a positional deviation amount of a solder printing position, correcting the deviation, and mounting a component on a board with high accuracy, and a component mounting apparatus employing the component mounting position correction method About.

  A component mounting apparatus (also referred to as a component mounter) for mounting a component on a substrate is known.

  In Patent Document 1, in this component mounting apparatus, in order to mount components on the board with high accuracy, as a preparation before the printed board is loaded into the apparatus and mounted, the printed board is fixed to the mounting execution unit, A technique for recognizing a printed reference mark and correcting a positional deviation of the printed board is described.

  Further, in Patent Document 2, a solder printing inspection machine detects the printing position of cream solder printed on at least three places on a printed circuit board, and performs solder printing according to the amount of positional deviation from a preset position. The correction of the position of the mask provided in the machine is described.

  Further, in Patent Documents 3 to 5, in order to correct a positional shift amount between a mounting position of a board to be mounted and a solder printing position printed on the board, the printing position of the solder printed on the electrode is set in the imaging device. And correcting the mounting coordinates by calculating the amount of positional deviation with respect to the substrate.

JP-A-5-267899 Japanese Patent No. 3071569 JP 2002-271096 A JP 2003-92496 A Japanese Patent No. 3656533

  However, Patent Document 1 is a technique related to positioning displacement when fixing a printed circuit board to a mounting implementation unit of a component mounting apparatus, and does not consider positional displacement of a solder printing position printed on the circuit board. The problem with respect to the positional deviation remains.

  Further, the technique of Patent Document 2 only checks the positional deviation of the solder printing position, and does not consider the correction of the mounting position.

  Further, in Patent Documents 3 to 5, since all the images of the electrodes of the solder printing pattern at the mounting position are captured and recognized by the imaging device, recognition time is required depending on the number of mounting points or the number of electrodes, and a tact for correction is required. It had the problem that.

  In addition, it is necessary to produce on a circuit-by-circuit basis when using the function to discriminate part of a circuit and skip the mounting of a specific circuit component on a multi-chamfer board with multiple circuit assemblies. However, since the positional deviation of the solder printing position is recognized for each circuit, it takes time to recognize depending on the number of circuits, and there is a problem that it takes a tact for correction.

  It is an object of the present invention to efficiently correct a component mounting position in a short time so as to eliminate the conventional problems.

  The present invention provides a predetermined component when correcting the mounting position of the component according to the mounting position where the component on the board is to be mounted and the amount of misalignment of the solder printing position printed on the electrode corresponding to the component. The above-described problem is solved by correcting the mounting position of a predetermined component to be mounted according to the amount of positional deviation of the solder printing position on the electrode. Here, the component mounting position is registered in advance in the mounting program as coordinates for mounting the component.

  The solder printing position deviation amount is obtained by imaging the solder printed on the predetermined component electrode on the substrate, and the mounting position where the predetermined component is to be mounted, and the plurality of solder printing images where the same predetermined component is mounted. It can be recognized from the position of the midpoint position shift.

  Further, a plurality of combinations of mounting positions on the board, the mounting positions where the predetermined parts are to be mounted, and the mounting positions which are to be corrected according to the amount of misalignment between the middle points of the plurality of solder printing positions where the same predetermined parts are to be mounted. Can be set.

  The present invention also provides an image pickup means for picking up an image of solder printed on an electrode on which a component is to be mounted and a mounting on which the component on the substrate is to be mounted in a component mounting apparatus for mounting the component on the substrate. A position, means for recognizing the positional deviation amount of the imaged solder printing position, and means for correcting a mounting position of a predetermined component to be mounted according to the positional deviation amount of the solder printing position. The component mounting apparatus characterized by the above is provided.

  A combination of a mounting position on which the predetermined component is to be mounted and a mounting-scheduled component that corrects the mounting position in accordance with a middle point positional deviation amount of the plurality of solder printing positions on which the same predetermined component is to be mounted, A plurality of means can be provided above.

  In addition, in the multi-sided substrate on which the plurality of circuit assemblies are arranged, there is provided a means for correcting using the midpoint position shift result of the plurality of solder printing positions where the predetermined components are to be mounted which are common to the plurality of circuit assemblies. be able to.

  According to the present invention, instead of recognizing and correcting the solder printing misalignment at all points as in the techniques of Patent Documents 3 to 5, only the preset solder printing misalignment amount of the detection target electrode is recognized. Since it did in this way, the detection time of the solder printing position shift amount can be shortened. In addition, according to the solder printing position deviation amount of the detection target electrode, instead of correcting the mounting position of all components, only the mounting position of the correction target component set in advance within a predetermined range is corrected. It becomes possible to mount components with high accuracy against a solder printing position shift.

  For example, when a light component is reflowed with solder, the component flows together with the solder due to surface tension to the proper mounting position. Therefore, it is preferable to correct the mounting position of the component in accordance with the amount of misalignment of the solder printing position, Since heavy components do not flow with the solder, it is preferable to mount the components aiming at the position of the original component electrodes without performing correction in accordance with the amount of misalignment of the solder printing position. It is possible to selectively use the presence or absence of correction according to the weight of the component.

  In particular, when multiple combinations of the detection target electrode and the correction target component that corrects the mounting position according to the solder printing position deviation amount can be set on the board, it corresponds to the difference in expansion and contraction depending on the position of the board. It is possible to mount the solder printing position deviation correction.

  Further, since the component mounting apparatus can detect the solder printing position shift amount by its own image pickup device and determine the solder printing failure, an expensive solder inspection apparatus is not required.

  Also, even when there are multiple circuit assemblies, a common solder print misregistration recognition result can be shared, so there is no need to recognize the amount of solder print misregistration for each circuit, and the detection time of the solder print misregistration is shortened. can do. Furthermore, since the solder is printed using a screen mask that has less expansion / contraction than the printed circuit board, it is possible to recognize a set of solder printing position deviation on the board without recognizing the solder printing position deviation on a circuit basis. The positional deviation can be corrected with high accuracy.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a schematic diagram of an electronic component mounting machine to which the present invention is applied. This electronic component mounting machine 10 is a little rearward from the center for transporting a component supply unit 20 disposed on the front (lower left side in the figure) and a substrate 32 on which the component 22 is mounted. A board conveyance unit 30 extending in the direction and an XY transfer unit 40 including an X-axis gantry 40X and a Y-axis gantry 40Y, which are movably disposed in the front part of the electronic component mounting machine 10, are provided.

  The component supply unit 20 is provided with a large number of tape feeders 24 in which a large number of components 22 are stored.

  In the XY transfer unit 40, a suction head unit 42 having a suction nozzle 44 for sucking the component 22 by the component supply unit 20 and mounting it on the substrate 32 is movable in the vertical direction (Z-axis direction). It is installed.

  The suction head portion 42 is mounted with a substrate recognition camera 50 for photographing the substrate 32 from above and its illumination 52 so as to be attached to the support member. Further, for example, a component recognition camera 60 and its illumination 62 for photographing the component sucked by the suction nozzle 44 from below are provided at a position beside the component supply unit 20.

  The suction head unit 42 is provided with a laser unit 46 for checking the presence or absence and shape of the parts sucked by the suction nozzle 44.

  Further, an operation monitor 70 of the electronic component mounter 10 is disposed above the electronic component mounter 10.

  In addition, a control unit 72 that performs arithmetic processing on images taken by the board recognition camera 50 and the component recognition camera 60 and calculates a mounting error according to the present invention is disposed below the electronic component mounting machine 10.

  Next, in the electronic component mounting machine 10, according to the first embodiment of the present invention, the solder printing positions of a plurality of component electrodes are recognized at the time of board positioning, and the misalignment amount of the solder printing position with respect to the component mounting position is detected. The procedure for correcting the mounting position is shown.

  The detection target electrode position of the solder printing position deviation amount is registered and set in the mounting program in advance by teaching work or in advance as mounting coordinates. For example, as shown in FIG. 2, the component electrodes 34-1 and 34-2 are set as detection target electrodes of the solder printing position deviation amount on the substrate 32 in a state where the solder is printed. Further, the correction target component that corrects the mounting position according to the simple average value of the solder printing position deviation amount of the detection target electrode or the ratio of the deviation amount of the solder printing position of each detection target electrode and the distance of the correction target component. The electrodes are set as, for example, correction target component positions 36-1, 36-2, 36-3, 34-1 and 34-2. Similarly, the component electrodes 34-3 and 34-4 are set as the solder printing position deviation detection target electrodes, and the simple average value of the solder printing position deviation amounts of the detection target electrodes or the solder printing position of each detection target electrode position are set. For example, the electrodes of the correction target component for correcting the mounting position according to the ratio between the deviation amount and the distance of the correction target component are set as correction target component positions 36-4, 34-3, and 34-4.

  As described above, when the detection target electrode and the correction target component are set and the production of the substrate 32 is started, before the mounting machine 10 mounts the component 22, the substrate recognition camera 50 is set to a predetermined detection target electrode position. Moves, and recognizes the positional deviation amount of solder printing (also simply referred to as solder deviation amount). In accordance with the solder misalignment amount (Δx, Δy), a preset mounting position (coordinate) of the component is corrected, and each component is mounted. As illustrated in FIG. 3, the solder misalignment amount (Δx, Δy) corresponds to the component mounting position A to be originally mounted (designally equivalent to the electrode midpoint position of the pair of component electrodes 34). The amount of deviation from the midpoint position (also referred to as the solder center) B of the pair of solders 38 can be set. At this time, the position of each solder 38 can be, for example, the position of the center of gravity of each solder 38. Alternatively, the center position of each solder 38 may be obtained by detecting the edge of each solder 38.

  The correction amount obtained from the solder printing position deviation amount between the component mounting position A to be mounted and the midpoint position B of the pair of solders 38 is calculated according to a preset coefficient k. For example, when k = 0.5, the coefficient k can be arbitrarily set by correcting the solder printing position misalignment amount (Δx, Δy) by 0.5 with respect to the conventional mounting position. To do.

  Further, when a plurality (set) of detection target electrodes are set, the simple average value can be used as the solder printing position deviation amount. In the example of FIG. 2, for example, the correction target components 36-1 to 36-3 and the detection target electrodes 34-1 and 34-2 are mounted based on a simple average value of the solder printing position deviation amounts of the detection target electrodes 34-1 and 34-2. The position is corrected, and the mounting position of the correction target component 36-4 and the detection target electrodes 34-3 and 34-4 is corrected by a simple average value of the solder printing position deviation amounts of the detection target electrodes 34-3 and 34-4. Can do.

  Also, referring to the preset allowable value for the difference between the mounting position coordinate of the component to be mounted and the printing position coordinate of the solder, if it exceeds, the component is not mounted and an alarm for printing misalignment is issued. Output and prevent mounting defects in advance.

  FIG. 4 shows a processing procedure when there are two detection target electrodes for detecting the solder printing position deviation amount.

  First, in step 100, a substrate is carried in. Next, in step 110, the position is moved to a preset first component mounting position (the midpoint position of the detection target electrode), the image is input in step 120, and in step 130, the pair of solder 38 in FIG. The midpoint position of the solder printing position is calculated.

  Next, in step 140, the position is moved to the second component mounting position (the midpoint position of the detection target electrode), an image is input in step 150, and the midpoint position of the solder printing position is calculated in step 160.

  Next, in step 170, the solder misalignment amount n between the two component mounting positions (midpoint positions of the detection target electrodes) and the midpoint positions of the solder printing positions is calculated. Next, at step 180, it is determined whether each solder displacement amount n is less than or equal to an allowable value m. If the determination result is greater than or equal to the allowable value, an alarm is output in step 200 and the process ends.

  On the other hand, when it is determined in step 180 that the solder displacement amount n is less than or equal to the allowable value m, it is determined in step 210 whether or not all detection target electrodes have been completed.

  If all the detection target electrode positions are not completed, in step 220, the board recognition camera 50 is moved to the next component mounting position (the midpoint position of the detection target electrode), and steps 110 to 180 are repeated.

  On the other hand, when it is determined in step 210 that all the detection target electrode positions have been completed, the process proceeds to step 230, where the simple average value of the two solder printing position deviation amounts calculated in step 170 and a preset correction coefficient are obtained. The mounting position correction amount is calculated according to k. Next, in step 220, the component is mounted reflecting the mounting position correction amount.

  In the present embodiment, since the combination of the detection target electrode and the correction target component is set for each region on the substrate, it is possible to cope with a difference in the amount of solder printing misalignment due to a difference in expansion / contraction depending on the location of the substrate.

  Even in the region corresponding to the detection target electrode, for example, a heavy component or a component such as QFP can be mounted reliably by mounting it at the position of the original component electrode regardless of the solder printing position deviation amount. be able to.

  In the above description, the position of a two-terminal component such as a resistor or a capacitor is a recognition target. However, the recognition target is not limited to a two-terminal component. For example, a part of a component electrode having three or more terminals such as a transistor is set. Or the center and center of gravity of all electrodes may be set.

  Next, a second embodiment of the present invention applied to a multi-sided board on which a plurality of circuit assemblies are arranged will be described.

  FIG. 5 shows a multi-sided board 33 on which a total of six circuit assemblies, two rows in the vertical direction and three rows in the horizontal direction, are the objects of the second embodiment. FIG. 6 shows a processing procedure when the detection target electrode position for detecting the amount of solder deviation is a multi-planar substrate in which a plurality of circuit assemblies are arranged at the following two detection target electrodes 35-1 and 35-2. An example is shown.

  In this embodiment, the detection target electrodes are set on the basis of, for example, the coordinate system of the lower left circuit across a plurality of circuits, such as 35-1 and 35-2. For the detection target electrodes extending over the plurality of circuits, the processing of steps 110 to 180 is repeated in the same manner as in FIG. 4 to detect the solder printing position deviation amount prior to component mounting. When the detection of the solder printing position deviation amount is completed, in step 230, based on the simple average value of the two solder printing position deviation amounts calculated in step 170, the mounting position correction amount is determined in accordance with a preset correction coefficient k. calculate. The mounting position of the first mounting point of the first circuit is detected, and the component is mounted in step 240.

  Next, in step 250, it is determined whether or not the in-circuit mounting is completed. If the determination result is negative, the process moves to the next mounting position in step 260, and the processing in steps 230 to 260 is performed until the determination result in step 250 becomes positive. To complete the mounting of all components of the first circuit.

  When the mounting of all the components in the circuit is completed, it is determined in step 270 whether all the circuits have been mounted. If the determination result is negative, the circuit moves to the next circuit position in step 280, and the determination result in step 270 is correct. Steps 230 to 280 are repeated until all circuit parts are mounted. At this time, the recognition results in steps 110 to 180 are used as correction values for the common mounting position in each circuit.

  In the second embodiment, the detection target electrodes 35-1 and 35-2 are provided across a plurality of circuits. However, as in the first embodiment, the detection target electrodes may be provided in one circuit. .

  Further, by storing the components and coordinates actually corrected and mounted according to the recognition result of the solder printing position deviation amount in the present invention as a file inside the mounting machine 10, the machine operator can refer to the data later. Is possible. Further, in a system capable of directly communicating this data with the host machine, it is possible to refer to the history of correction mounting by correcting the solder printing position even at a remote place.

1 is a perspective view showing an overall configuration of an electronic component mounting machine to which the present invention is applied, with a part cut away. The top view which shows the example of the process target board | substrate of 1st Embodiment of this invention. Detail view showing examples of component electrodes and solder images Flow chart showing the processing procedure of the first embodiment The top view which shows the example of the multi-sided board | substrate with which the several circuit assembly which is the process target of 2nd Embodiment of this invention is arrange | positioned. Flow chart showing the processing procedure of the second embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting machine 22 ... Component 32 ... Board | substrate 33 ... Multi-chamfer board | substrate 34-1-4, 35-1-2 ... Detection object electrode 36-1-4 ... Correction object component position 38 ... Solder 50 ... Board recognition camera 72. Control unit

Claims (6)

  1. When correcting the mounting position of the component according to the mounting position where the component on the board should be mounted and the positional deviation amount of the solder printing position printed on the electrode corresponding to the component,
    A component mounting position correction method, comprising: correcting a mounting position of a predetermined component to be mounted according to a positional deviation amount of a solder printing position on a predetermined component electrode.
  2.   The amount of misalignment of the solder printing position is obtained by imaging the solder printed on the predetermined component electrode on the substrate, and mounting positions where the predetermined component is to be mounted, and a plurality of the captured predetermined predetermined components are mounted. The component mounting position correction method according to claim 1, wherein the component mounting position is recognized based on a misalignment amount of a middle point of a solder printing position.
  3.   A plurality of combinations of a mounting position on which the predetermined part is to be mounted and a part to be mounted that corrects the mounting position in accordance with the amount of misalignment between the middle positions of a plurality of solder printing positions on which the same predetermined part is to be mounted are set on the substrate. The component mounting position correction method according to claim 1, wherein:
  4. In a component mounting device for mounting components on a board,
    An imaging means for imaging the solder printed on the electrode on which the component on the substrate is to be mounted;
    Means for recognizing a mounting position on which a component on the board is to be mounted, and a positional deviation amount of the imaged solder printing position;
    Means for correcting a mounting position of a part to be mounted in advance according to the amount of positional deviation of the solder printing position;
    A component mounting apparatus comprising:
  5.   A combination of a mounting position on which the predetermined component is to be mounted and a mounting-scheduled component that corrects the mounting position in accordance with a middle point positional deviation amount of the plurality of solder printing positions on which the same predetermined component is to be mounted, The component mounting apparatus according to claim 4, further comprising a plurality of setting means.
  6.   In a multi-sided board on which a plurality of circuit assemblies are arranged, there is provided means for correcting by using the midpoint misalignment result of a plurality of solder printing positions that are common to the plurality of circuit assemblies and on which a predetermined component is to be mounted. The component mounting apparatus according to claim 4, wherein:
JP2007174390A 2006-07-14 2007-07-02 Component mounting position correcting method and component mounting apparatus Pending JP2008270696A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006194441 2006-07-14
JP2007081557 2007-03-27
JP2007174390A JP2008270696A (en) 2006-07-14 2007-07-02 Component mounting position correcting method and component mounting apparatus

Applications Claiming Priority (2)

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JP2007174390A JP2008270696A (en) 2006-07-14 2007-07-02 Component mounting position correcting method and component mounting apparatus
US11/826,259 US20080014772A1 (en) 2006-07-14 2007-07-13 Component mounting position correcting method and component mouting apparatus

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WO2014103260A1 (en) * 2012-12-25 2014-07-03 パナソニック株式会社 Electronic component mounting system and electronic component mounting method
JP2014127483A (en) * 2012-12-25 2014-07-07 Panasonic Corp Electronic component mounting system and electronic component mounting method
JP2014127482A (en) * 2012-12-25 2014-07-07 Panasonic Corp Electronic component mounting system and electronic component mounting method
US10165719B2 (en) 2012-12-25 2018-12-25 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system and electronic component mounting method
JP2014154649A (en) * 2013-02-07 2014-08-25 Panasonic Corp Production data creation device and production data creation method
US20160234983A1 (en) * 2015-02-10 2016-08-11 Panasonic Intellectual Property Management Co., Ltd. Component mounting apparatus, component mounting method and component mounting line
US10076070B2 (en) * 2015-02-10 2018-09-11 Panasonic Intellectual Property Management Co., Ltd. Component mounting method
US10149419B2 (en) * 2015-02-10 2018-12-04 Panasonic Intellectual Property Management Co., Ltd. Component mounting method
US20160234984A1 (en) * 2015-02-10 2016-08-11 Panasonic Intellectual Property Management Co., Ltd. Component mounting apparatus, component mounting method and component mounting line

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