JP2008235601A - Mounting line and mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting method and a mounting line which can quickly and easily determine the quality of mounting of a printed circuit board, not requiring a network between each mounting machine. <P>SOLUTION: The mounting line and the mounting method are provided with a camera means, an image taking in means, and an image processing and judging means in the each of a plurality of mounting machines, and include: a step of imaging the region in which electronic components should be mounted in the each mounting machine about a solder-printed first board by the camera means before mounting at the each mounting machine; a step of memorizing the image taken by the camera means as a partial image data by the image capturing means; a step of imaging the same region imaged at the first board after mounting about at least the board solder-printed on and after the second while mounting by the each mounting machine; and a step of determining the quality of mounting by the image processing and determining means about the image imaged after mounting of the board on and after the second at the each mounting machine by the image processing to compare with the partial image data. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting line and a mounting method capable of detecting solder printing abnormality and electronic component mounting abnormality when printing solder or mounting electronic components on a printed board.

  2. Description of the Related Art Conventionally, it is known that in a mounting line, a printed state of solder applied to a circuit board and an mounted state of mounted electronic components are inspected using AOI (Automated Optical Inspection). In this method, the circuit board is illuminated, the appearance of the surface of the circuit board (solder printing, mounting of electronic components, etc.) is captured by a CCD camera, and the quality of the circuit board is determined by image processing. Using this, for example, a solder printing device, a first electronic component mounting machine, a second electronic component mounting machine, a first large electronic component mounting machine, a second large electronic component mounting machine, and a reflow furnace. A mounting line for transporting the circuit board is constructed, and the first AOI is provided between the solder printing apparatus and the first electronic component mounting machine, and the second electronic component mounting machine and the first large electronic component. A second AOI is arranged between the mounting machine and a third AOI is arranged between the second large electronic component mounting machine and the reflow furnace. Here, the first AOI detects solder printing misalignment, printing presence / absence, and problems such as bridging, and the second AOI is used before a large electronic component such as a BGA is mounted. A defect such as a foreign substance at the mounting position of the large electronic component is detected by checking, and the third AOI confirms whether solder printing and electronic component mounting, which are the previous processes, are correctly performed before the reflow furnace. Then, the circuit board is sent to the reflow furnace to confirm whether or not the mounting can be confirmed.

 However, in this inspection method, all checks are made based on images after printing or mounting, and the solder and electronic parts that are the objects to be checked, and the background (the pattern of the board) that causes noise when checking for defects. And the pattern of the board and the solder) are reflected on the image at the same time, there is a possibility that the trouble of solder printing or electronic component mounting cannot be clearly recognized. Also, when recognizing a defect, AOI makes a determination by comparing it with a correct image. Therefore, the solder is correctly printed on the printed circuit board or the electronic component is correctly mounted, and an image obtained by capturing the image is prepared and input in advance. (Teaching) was necessary.

 Therefore, the applicant provided the technique shown in Patent Document 1. This is because the image data captured after mounting the printed circuit board is compared with the image data captured before mounting the printed circuit board, and noise is removed to simplify the image data. Therefore, it is not necessary to prepare an image in which electronic parts are correctly mounted and input them in advance (teaching).

However, in order to use this technology for a mounting line, it is necessary to construct a network between mounting machines on the mounting line and transmit image data before and after mounting between the mounting machines. For this reason, when it takes a long time to transmit the image data, there is a possibility that a waiting time may occur in the post-mounting operation depending on the data processing time or the data transmission processing time.
JP 2006-220426 A

  SUMMARY OF THE INVENTION The present invention has been made in view of the related problems, and a mounting method that can quickly and easily determine whether a printed circuit board is mounted or not without requiring a network between the mounting machines. And a mounting line.

  In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that a solder printing machine that prints solder on a printed circuit board and a plurality of mountings that mount electronic components on the printed circuit board on which the solder is printed. And the camera means capable of keeping the field of view of the mounting range of the printed circuit board, and the image quality in which the electronic component is mounted on the printed circuit board is compared with the image on which the electronic component is not mounted by the image processing. In the mounting line including the image processing determination unit for determining the image processing unit, the camera unit and the image capturing unit that captures and stores the image captured by the camera unit as image data in each of the plurality of mounting machines. And the image processing determination means, wherein the same kind of electronic components are arranged in the same manner, and solder is printed on a printed circuit board mounted by a series of production lots. The step of transporting the printed circuit board from the solder printer to each mounting machine on the downstream side, and the range in which the electronic component is mounted on each mounting machine for the first printed circuit board carried in each mounting machine. A step of taking an image by the camera means without mounting an electronic component; and a step of taking in and storing an image taken by the camera means by the image taking means as initial partial image data in each mounting machine; With respect to a printed circuit board on which solder is printed at least on the second printed circuit board mounted by the production lot, each mounting machine mounts an electronic component and the same image is captured of the first printed circuit board. The step of imaging the range by the camera means after mounting, and the image captured after mounting the second and subsequent printed boards in each mounting machine, Serial image capturing means step of determining acceptability of implementation by the image processing determination unit by the image processing to be compared with the previously stored first printed board of an initial partial image data by, is that with the.

  The structural features of the invention according to claim 2 are a solder printer that prints solder on a printed circuit board, a plurality of mounting machines that mount electronic components on the printed circuit board on which the solder is printed, and a printed circuit board that is mounted. Image processing determination that determines whether the mounting is good or not by image processing that compares the image of the printed circuit board on which the electronic component is mounted and the image of the printed circuit board on which the electronic component is mounted with the camera means capable of keeping the field of view about the range Each of the plurality of mounting machines includes the camera unit, an image capturing unit that captures and stores an image captured by the camera unit as image data, and the image processing Determining means, and control means for controlling the operation of the camera means, the image capturing means, and the image processing determining means, and the control means includes electronic components of the same type. The first printed circuit board on which the solder is printed out of the printed circuit boards that are mounted in a series of production lots in the same arrangement, is imaged by the camera means without mounting the range in which the electronic component is mounted in each mounting machine The image captured by the camera unit is captured and stored as initial partial image data by the image capturing unit, and at least second and subsequent solder printed on the printed circuit board mounted by the production lot. For the printed circuit board, the same range where the first printed circuit board was imaged is imaged by the camera means after mounting, and the image captured after the second and subsequent printed circuit boards are mounted by each mounting machine, the image The image is obtained by image processing for comparison with the initial partial image data of the first printed circuit board stored by the capturing means. It is to determine the quality of the mounting sense determining means.

  According to the first aspect of the present invention, the first printed circuit board on which the image captured after mounting at least the second and subsequent printed circuit boards in each mounting machine is captured and stored by the image capturing means is mounted. Since image processing is simplified by removing noise unnecessary for mounting abnormality detection by image processing that compares with partial image data that is not present, each mounting machine can quickly and easily detect mounting abnormality caused by mounting work be able to. In this way, it is not necessary to construct a network for inspection of mounting among a plurality of mounting machines, and each mounting machine can determine mounting abnormality. There is no waiting time for the mounting work. Therefore, the mounting operation can be speeded up and the production efficiency can be improved. In addition, since image processing is performed only for a narrow range mounted by each mounting machine, the amount of image data required for processing is small, and image processing can be performed quickly. In addition, since each mounted machine performs processing by comparing a mounted image captured by the same camera means with an image not mounted, an image difference caused by a difference in camera performance that occurs when images are captured by different cameras. Therefore, it is possible to inspect with high accuracy.

  According to the second aspect of the present invention, it is not necessary to construct a network for inspection of mounting between a plurality of mounting machines, and each mounting machine can determine a mounting abnormality. There is no waiting time in the post-mounting operation. In addition, since a narrow range to be mounted by each mounting machine is imaged and image processing is performed, the amount of data necessary for this processing is small and image processing can be performed quickly. In addition, since each mounted machine performs processing by comparing a mounted image captured by the same camera means with an image not mounted, an image difference caused by a difference in camera performance that occurs when images are captured by different cameras. Therefore, it is possible to inspect with high accuracy. Therefore, it is possible to provide a mounting line having such effects.

  Embodiments of a mounting line according to the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a mounting line, and FIG. 2 is a diagram showing an outline of a mounting machine constituting the mounting line. As shown in FIG. 1, the mounting line 2 of the present embodiment includes a first transport device 6 that transports a printed circuit board 4 from a substrate supply device (not shown), a cream solder printer 8 as a solder printer, and cream solder. A second transport device 10 that transports the printed circuit board 4 from the printing machine 8 to a mounting machine (first mounting machine) in the next process, a first mounting machine 12 that mounts relatively small electronic components, and a relatively large electronic device. A second mounter 14 for mounting components and the like and a third mounter 16 for mounting relatively small electronic components are included. The printed circuit board 4 is solder-printed by the cream solder printer 8, and then conveyed in the order of the first mounting machine 12, the second mounting machine 14, and the third mounting machine 16 to mount electronic components.

  In the first transport device 6, a conveyor 22 including a pair of guide rails and a pair of transport belts is extended on the base 6 in the transport direction (X direction).

  The cream solder printing machine 8 includes a positioning portion that holds the printed circuit board 4 by a clamper (not shown), and a screen mask (not shown) is disposed above the positioning portion. The screen mask is configured by mounting a mask plate on a holder (not shown). On the screen mask, a squeegee unit (not shown) is disposed so as to be able to reciprocate in the horizontal direction. In a state where the printed circuit board 4 is in contact with the lower surface of the screen mask, paste-like cream solder 5 is supplied onto the mask plate, and the squeegee constituting the squeegee unit is slid on the mask plate. The cream solder 5 is printed on the printed circuit board 4 through the pattern holes provided in (see FIG. 4).

  As shown in FIG. 2, the first mounting machine 12 carries a printed board 4 into a carry-in position and positions the printed board 4 at a predetermined position, and the X direction (carrying direction) and Y with respect to the base 28. A component transfer device 34 having a component mounting head 32 provided on a moving table 30 supported so as to be movable in a direction (a direction perpendicular to the X direction), and a board recognition camera provided on the moving table 30. Then, the CCD camera 24 as camera means capable of keeping in the field of view the mounting area of the printed circuit board 4 that has been positioned and placed at a predetermined position, and the image captured by the CCD camera 24 is captured and stored as image data An image capturing device 37 serving as an image capturing device, and an image processing determining device that determines whether the printed circuit board is mounted by processing an image captured by the CCD camera 24 An image processing determination unit 42, and a, a control unit 38 for controlling the image processing and the determination operation by mounting the image processing determination apparatus 42 according to the imaging and the component transfer device 34 by the CCD camera 24.

  The substrate transfer device 26 is arranged in parallel along a guide rail extending in the X direction (transfer direction) and conveys the printed circuit board 4 to a positioned position, and a support frame that supports the loaded printed circuit board 4 (Not shown), a lifting device (not shown) for raising the supported printed circuit board 4 to a mounting position (predetermined position), and a clamping device (not shown) for clamping the printed circuit board 4 at the mounting position. And.

  A Y-direction beam 44 extending in the Y direction is provided above the substrate transfer device 26, and the Y-direction beam 44 is placed on an X-direction rail (not shown) so as to be movable in the X direction. The Y-direction beam 44 is provided with a moving table 30 so as to be movable in the Y direction. The moving table 30 holds a component transfer device 34 having a component mounting head 32 and a CCD camera (substrate recognition camera) 24. The component transfer device 34 and the CCD camera (substrate recognition camera) 24 are defined as Y. The directional beam 44 is configured to be movable in the X direction by moving in the X direction. The movement of the Y direction beam 44 in the X direction is driven by an X direction linear guide (not shown) and an X axis servo motor (not shown) via a ball screw (not shown). The movement of the movable table 30 in the Y direction is driven by a Y direction linear guide (not shown) and a Y-axis servo motor (not shown) via a ball screw (not shown). These servo motors are controlled by the control device 38.

  The component transfer device 34 is supported by the support base 46 attached to the moving table 30, and is supported by the support base 46 so as to be movable up and down in the Z direction perpendicular to the X direction and the Y direction, and is moved up and down by a servo motor (not shown). The component mounting head 32 to be driven and the suction nozzle 50 projecting downward from the component mounting head 32 are configured. The suction nozzle 50 is formed in a cylindrical shape, and holds electronic components by suction at the lower end. The mounting operation of the component transfer device 34 is controlled by the control device 38.

  As shown in FIG. 1, component supply devices 52 are arranged on both sides of the first mounting machine 12 with the substrate transfer device 26 interposed therebetween, and these component supply devices 52 have a large number of cassette-type feeders 54 that can be attached and detached. Is configured. The cassette type feeder 54 holds a supply reel (not shown) wound with a long and narrow tape in which electronic components are sealed at a predetermined pitch. The tape is pulled out from the supply reel at a predetermined pitch, and the electronic components are released from the encapsulated state and sequentially fed into a component take-out portion (not shown).

  As shown in FIG. 2, a component recognition camera 56 is provided between the substrate transfer device 26 and the component supply device 52, and the electronic component sucked by the suction nozzle 50 is imaged by the component recognition camera 56. Whether the suction state is good or bad and whether the part itself is good or bad are determined.

  For the second mounting machine 14 in the subsequent process of the first mounting machine 12, one of the component supply devices is constituted by a tray type in which components such as relatively large electronic components and shield cases are arranged on the tray 58, Since the configuration other than this point is the same, the description thereof is omitted. Further, the configuration of the third mounting machine 16 in the subsequent process of the second mounting machine 14 is the same as that of the first mounting machine, and thus the description thereof is omitted.

The operation of the embodiment configured as described above will be described below with reference to the drawings.

  First, a first printed circuit board (for example, the first printed circuit board) 4 on which solder is printed out of the printed circuit boards 4 mounted in a series of production lots with the same arrangement of electronic components of the same type as shown in FIG. Then, it is transported to the first transport device 6. As shown in FIG. 3, the first printed circuit board 4 shows an outer shape of the printed circuit board 4, multiple holes 4 a provided on the surface of the printed circuit board 4, and a circuit diagram (not shown).

  Next, the first printed circuit board 4 is transported to the cream solder printer 8, and a screen mask (not shown) having pattern holes opened in accordance with the print target portion is set on the printed circuit board 4. Then, paste-like solder is applied onto the screen mask, and a squeegee (not shown) is slid from the paste onto the screen mask, so that the cream is applied onto the printed circuit board 4 through the pattern holes as shown in FIG. Solder is pattern printed.

  Next, the first printed circuit board 4 is transported from the cream solder printer 8 to the second transport device 10 and transported from the second transport device 10 to the first mounting machine 12. The first printed circuit board 4 carried into the first mounting machine 12 is carried into the carrying position positioned by the board carrying device 26 and supported by the support frame. The supported printed circuit board 4 is raised to a position where an electronic component is mounted by the lifting device, and is clamped and fixed by the clamping device. The fixed first printed circuit board 4 is imaged by the CCD camera 24 of the first mounting machine 12. At this time, as shown in FIG. 4, the CCD camera 24 picks up an image of the area SA where the square chip P1 of the printed circuit board 4 is to be mounted, as shown in FIG. The mounting range SA is determined based on board marks FM provided diagonally at two corners of the printed circuit board 4 with electronic component mounting coordinates determined by the mounting program of the first mounting machine 12.

  Here, in the area SA where the electronic component is mounted on the printed circuit board 4, the multiple holes 4 a provided on the surface of the printed circuit board 4, pattern-printed solder 5, and an unillustrated circuit diagram are imaged. The partial image data of the range SA imaged at this time is captured and stored in the image capturing device 37 of the first mounting machine 12, and stored as reference data so that it can be recalled when necessary. The first printed circuit board 4 is transported to the second mounting machine 14 without being mounted.

  As shown in FIG. 4, the first printed circuit board 4 carried into the second mounting machine 14 is imaged by a CCD camera 24 in a range SB where a BGA (BALL GRID ARRAY) PB is mounted. The mounted range SB is also determined in the same manner as the range SA. Here, as shown in FIG. 4, similarly, for the range SB of the printed circuit board 4, the multiple holes 4 a provided in the surface of the first printed circuit board 4, pattern-printed solder 5, and a circuit diagram (not shown). Is imaged. The partial image data of the range SB captured at this time is similarly captured and stored in the image capturing device 37 of the second mounting machine 14, and is stored as reference data so that it can be recalled when necessary. The first printed circuit board 4 is transported to the third mounting machine 16 without being mounted.

  Next, the first printed circuit board 4 is conveyed to the third mounting machine 16. As shown in FIG. 4, the printed circuit board 4 carried into the third mounting machine 16 is imaged by the CCD camera 24 in the range SC where the square chip P <b> 2 is mounted. The range SC to be mounted is also determined in the same manner as the range SA. Also in this case, as shown in FIG. 4, similarly, for the range SC of the printed circuit board 4, the multiple holes 4 a provided in the surface of the printed circuit board 4, the pattern-printed solder 5, and an unillustrated circuit diagram are imaged. . The partial image data of the range SC imaged at this time is similarly captured and stored in the image capturing device 37 of the third mounting machine 16, and stored as reference data so that it can be recalled when necessary. Then, the imaged first printed circuit board 4 is carried out without being mounted from the third mounting machine 16.

  Next, at least the second printed board 4 among the printed boards 4 mounted in the same series of production lots is similarly carried into the cream solder printer 8, and the solder 5 is pattern-printed.

  Then, the printed second printed circuit board 4 is conveyed to the first mounting machine 12. The printed circuit board 4 carried into the first mounting machine 12 is mounted with a square chip P1 as an electronic component in the range SA. In mounting, the position of the board mark FM provided on the printed circuit board 4 that is positioned and held is detected by a board recognition camera (also used as a CCD camera that images the mounting range) 24, and based on the position of the board mark FM. Position correction is performed to calculate the coordinate position to be mounted. Then, with respect to the corner tip P1 sucked at the tip of the suction nozzle 50, the component misalignment of the corner tip P1 with respect to the center line of the suction nozzle 50 is detected by the component recognition camera 56, and the amount of movement of the suction nozzle 50 in the X and Y directions is detected. Is mounted at the coordinate position on the printed circuit board 4.

  The mounted printed circuit board 4 is imaged by the CCD camera 24 of the first mounting machine 12 imaged earlier. Here, as shown in FIG. 5, images of the same range SA of the printed circuit board 4 as the first printed circuit board 4 are taken, and a plurality of holes 4 a provided on the surface of the printed circuit board 4, pattern-printed solder 5, and FIG. In addition to the schematic circuit diagram, the corner chip P1 of the mounted electronic component is imaged.

  The image data captured at this time is the initial partial image data captured by the CCD camera 24 of the first mounting machine 12 before the square chip P1 is mounted on the first printed circuit board 4 and stored in the image capturing device 37. Image processing is performed in comparison with (the range SA in FIG. 4). As shown in FIG. 8, only the electronic component P1 mounted on the range SA is displayed as simplified image data. The simplified image data is determined by the image processing determination device 42 to determine whether the electronic component (square chip) P1 mounted based on the component type data and mounting coordinate data for the electronic component input in advance at the time of production is acceptable. Is done.

  Next, the second printed circuit board 4 is carried into the second mounting machine 14, and as shown in FIG. 6, BGABP is mounted as an electronic component, and thereafter, the image of the range SB is similarly taken. And the image data imaged at this time is the initial partial image data imaged by the CCD camera 24 of the second mounting machine 14 on the first printed circuit board 4 before mounting the BGABP (the range SB in FIG. 4). As shown in the range SB in FIG. 9, only the mounted BGAPB is displayed as simplified image data. Similarly, the simplified image data is determined by the image processing determination device 42 as to whether the electronic component (BGA) PB mounted based on the component type data and the mounting coordinate data for the electronic component input in advance at the time of production is acceptable. Determined.

  Next, the second printed circuit board 4 is carried into the third mounting machine 16. As shown in FIG. 7, the square chip P <b> 2 is mounted as an electronic component, and thereafter the range SC is similarly imaged. . The image data captured at this time is the initial partial image data captured before the mounting of the square chip P2 on the first printed circuit board 4 by the CCD camera 24 of the third mounting machine 16 (the range SC in FIG. 4). As shown in the range SC of FIG. 10, only the mounted corner chip P2 is simplified and displayed as image data. Similarly, the simplified image data is determined by the image processing determination device 42 based on the component type data and the mounting coordinate data of the electronic component input in advance at the time of production. Is determined. The third and subsequent printed circuit boards 4 are similarly subjected to mounting and captured image processing to determine whether the mounting is good or bad.

  As described above, according to the mounting line of the present embodiment, the images captured after the second and subsequent printed circuit boards 4 are mounted in the respective mounting machines 12, 14, and 16 are stored in the first image storage device 37. The image data is simplified by removing noise unnecessary for detection of mounting abnormality by image processing that is compared with the initial partial image data that is not mounted on the printed circuit board 4, so that each mounting machine 12, 14, 16 can be mounted. A mounting abnormality caused by the work can be detected quickly and easily. In this way, it is not necessary to construct a network for mounting inspection among a plurality of mounting machines, and each mounting machine 12, 14, 16 can determine a mounting abnormality, and therefore delay in transmission of image data. Therefore, there is no waiting time in the post-mounting operation. Therefore, the mounting operation can be speeded up and the production efficiency can be improved. In addition, since image processing is performed only for a narrow range (mounting range SA, SB, SC) to be mounted by each mounting machine 12, 14, 16, it is possible to perform image processing quickly with a small amount of image data required for processing. it can. In addition, in each of the mounting machines 12, 14 and 16, the unmounted image captured by the same camera means (CCD camera 24) and the mounted image are compared and processed, so that images are captured by different cameras. Since there is no image difference due to the individual difference between cameras, the inspection can be performed with high accuracy.

  In addition, since the component type data and mounting coordinate data used to determine the quality of mounting are data input to the production program, the inspection content is managed in the production program without creating a separate inspection program, Inspection results can be fed back to production.

  In the above embodiment, the camera means (CCD camera) that captures the mounted range is also used as the substrate recognition camera. However, the present invention is not limited to this. It is good also as a camera for exclusive use which images the range to be mounted. The camera means is not limited to a CCD camera, and for example, a CMOS sensor or a line sensor camera may be used.

  The first printed circuit board refers to a printed circuit board to be used as reference data for a printed circuit board printed and mounted after the printed circuit board, and is not necessarily limited to the first printed circuit board. Similarly, at least a second printed circuit board refers to a printed circuit board that is mounted after the first printed circuit board, and the quality of mounting is determined using the first printed circuit board as reference data. It is.

  Also, for example, when a network is constructed between mounting machines on the mounting line, the first printed board among the same type of printed boards printed in series is the first mounting machine and the subsequent mounting machine. It is possible to inspect by mounting each of the mounting ranges and transmitting only the image data required by each mounting machine in the subsequent process from the captured image data via the network. By transmitting the image data in this way, there is no need to transport the first printed circuit board to a mounting machine in a subsequent process.

  In addition, the image data simplified by the image processing is determined based on the component type data and the mounting coordinate data, and the quality of the mounting is determined. However, the present invention is not limited to this. For example, simplified image data It is good also as what determines by comparing with the image data of the printed circuit board mounted correctly.

The top view of the mounting line which concerns on this invention. Schematic which shows the structure of a mounting machine. The figure which shows the external appearance of the printed circuit board before printing. The figure which shows the range in which the printed circuit board after printing and the electronic component of the printed circuit board are mounted. The figure which shows the image of the printed circuit board in which the electronic component was mounted. The figure which shows the image of the printed circuit board in which BGA was mounted. The figure which shows the image of the printed circuit board in which the electronic component was mounted. The figure which shows the image of the printed circuit board by which the image processing was carried out about the one part mounted range. The figure which shows the image of the printed circuit board by which the image processing was carried out about the one part mounted range. The figure which shows the image of the printed circuit board by which the image processing was carried out about the one part mounted range.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Mounting line, 4 ... Printed circuit board, 6 ... Printing machine (cream solder printing machine), 12 ... Mounting machine (1st mounting machine), 14 ... Mounting machine (2nd mounting machine), 16 ... Mounting machine (3rd Mounting device), 24 ... Camera means (CCD camera), 38 ... Control device, 37 ... Image capturing means (image capturing device), 42 ... Image processing determining means (image processing determining device), PB ... Electronic component (BGA) ), P1 ... electronic component (square chip), P2 ... electronic component (square chip), SA ... mounting range, SB ... mounting range, SC ... mounting range.

Claims (2)

A solder printer that prints solder on the printed circuit board, a plurality of mounting machines that mount electronic components on the printed circuit board on which the solder is printed, and camera means that can keep a view of the mounting range of the printed circuit board, In a mounting line comprising image processing determination means for determining whether the mounting is good or not by image processing for comparing an image in which an electronic component is mounted on a printed circuit board with an image in which the electronic component is not mounted,
Each of the plurality of mounting machines includes the camera unit, an image capturing unit that captures and stores an image captured by the camera unit as image data, and the image processing determination unit.
Transporting a first printed circuit board on which solder is printed among printed circuit boards mounted in a series of production lots with the same arrangement of electronic components of the same type from the solder printer to each downstream mounting machine; ,
With respect to the first printed circuit board that has been carried in, a step of imaging the range in which the electronic component is mounted in each mounting machine by the camera means without mounting the electronic component in each mounting machine;
In each mounting machine, capturing and storing the image captured by the camera unit as initial partial image data by the image capturing unit;
With respect to a printed circuit board on which solder is printed at least on the second printed circuit board mounted by the production lot, each mounting machine mounts an electronic component and the same image is captured of the first printed circuit board. Imaging a range by the camera means after mounting;
In each mounting machine, the image captured after mounting the second and subsequent printed circuit boards is compared with the initial partial image data of the first printed circuit board stored by the image capturing means. A step of determining the quality of the mounting by the image processing determination means;
A mounting method characterized by comprising: A solder printer that prints solder on the printed circuit board, a plurality of mounting machines that mount electronic components on the printed circuit board on which the solder is printed, and camera means that can keep a view of the mounting range of the printed circuit board, In a mounting line comprising image processing determination means for determining the quality of mounting by image processing for comparing an image of a printed circuit board on which electronic components are mounted with an image of a printed circuit board on which electronic components are not mounted,
Each of the plurality of mounting machines is
The camera means, image capturing means for capturing and storing an image captured by the camera means as image data, the image processing determining means, the camera means, the image capturing means, and the image processing determining means Control means for controlling the operation of
The control means includes
Without mounting the range where electronic components are mounted in each mounting machine on the first printed circuit board on which solder is printed among the printed circuit boards mounted in a series of production lots with the same arrangement of electronic components of the same type The image taken by the camera means, and the image taken by the camera means is captured and stored as initial partial image data by the image capture means,
Among the printed boards mounted by the production lot, for at least the second and subsequent printed boards printed with solder, the same range where the first printed board is imaged is mounted by the camera means after mounting,
In each mounting machine, the image captured after mounting the second and subsequent printed circuit boards is compared with the initial partial image data of the first printed circuit board stored by the image capturing means. A mounting line characterized by having the image processing determination means determine the quality of mounting.

Images