JP2006351911A - Electronic-component mounting apparatus and method for verifying component sucking position of sucking nozzle present therein - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for verifying a relative sucking position of a sucking nozzle to a component fed to a component feeding place, based on the image information of photographing therein the component transferred to a verifying place which is separated from the component feeding place to the side of a substrate carrying apparatus, and to provide an electronic-component mounting apparatus. <P>SOLUTION: When verifying the relative sucking position of a sucking nozzle 21 to a component P fed to a component feeding place 24, in the state of the component being stored in a cavity 27b of a carrier tape 27 by a component feeding apparatus 22, the component P is transferred to a verifying place 25 which is separated by one pitch or plural pitches from the component feeding place to the side of a substrate carrying apparatus 12. The component transferred to the verifying place is so photographed by a substrate identifying camera 26 put side by side with the sucking nozzle in a component transferring apparatus 17 as to verify the relative sucking position of the sucking nozzle to the component fed to the component feeding place, based on the image information of the component. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for confirming a suction position of a suction nozzle for a component in an electronic component mounting apparatus, and an electronic component mounting apparatus.

  In the electronic component mounting apparatus, the printed circuit board is positioned at a predetermined position of the apparatus main body, the carrier tape in which the components are encapsulated at a predetermined pitch is sent one pitch at a time, and the component is supplied in a state where the component is stored in the cavity of the carrier tape. Are sequentially supplied. A component transfer device having a suction nozzle for sucking a component moves in two orthogonal directions on a horizontal plane, sucks the component supplied to the component supply location, transfers it to the mounting position, and mounts it on the printed board.

  However, in such a conventional apparatus, the component is stored in the cavity of the carrier tape and supplied to the component supply location due to the movement of the component in the cavity of the carrier tape or due to dimensional variation for each production lot of the carrier tape. May deviate from the normal position. In addition, when the cassette type feeder with the supply reel on which the carrier tape is wound is tilted in the lateral direction, the carrier tape is displaced in the lateral direction perpendicular to the feeding direction, and the cavity and the parts housed in this are positioned. Deviation may occur. When the component is displaced from the normal position at the component supply location in this way, the suction nozzle fails to suck the component, particularly a small component.

  In Patent Document 1, a component supply position recognition camera 14 is provided together with a suction nozzle 4 that sucks a component to the mounting head 5 in order to correct a deviation from a normal position of the component supplied to the component supply location by the carrier tape 10. An equipped component mounting device is disclosed. According to this, before the component of the component supply unit 2 is sucked by the suction nozzle 4 and mounted at a predetermined position on the printed circuit board, the position of the component supplied to the component supply location by the carrier tape 10 is used for component supply position recognition. The position deviation of the component recognized by the camera 14 a predetermined number of times and supplied to the component supply location based on this is calculated in advance, and when the component is sucked by the suction nozzle and mounted on the printed board, it is supplied to the component supply location. The suction position of the suction nozzle with respect to the component is corrected according to the calculated positional deviation.

Also, depending on the part shape and surface condition, the part suction position of the suction nozzle may be offset from the part center, and the part data such as the offset value from the part center of the part suction position is set based on CAD data or the like. , Input by the operator. However, because the operator's input error or the surface state of the part is unknown, the component pick-up position may deviate from the set position due to reasons such as the offset value is not set taking the surface state into account. In some cases, the surface is set to be uneven, and before starting production, it is confirmed whether or not the offset value is appropriate, and the offset value is corrected as necessary.
Japanese Patent Laid-Open No. 6-85492 (pages 2, 3 and 2)

  In the component mounting apparatus described above, the suction nozzle 4 that sucks the component and the component supply position recognition camera 14 are provided on the mounting head 5 at a predetermined distance, and the component supplied to the component supply location is replaced by the component supply position recognition camera 14. Since the image is taken and adsorbed by the adsorption nozzle 4, the mounting head 5 must be moved by a predetermined distance, the movement stroke of the mounting head becomes long, the apparatus becomes large, and the cost increases.

  Further, in the electronic component mounting apparatus in which the movement stroke of the mounting head 5 is short, the component supply position recognition camera 14 cannot be moved to above the component supply location, and the suction nozzle suctions the component supplied to the component supply location. The position could not be confirmed.

  The present invention relates to a method for confirming a suction position of a suction nozzle with respect to a component supplied to a component supply location based on image information obtained by photographing a component transferred to a check location separated from the component supply location toward the substrate transfer device. An object of the present invention is to provide an electronic component mounting apparatus.

  In order to solve the above-described problems, the structural feature of the invention according to claim 1 is that a substrate carrying device that is provided on a base for carrying in / out and carrying out positioning of the substrate, and components are enclosed at a predetermined pitch. A component feeding device that feeds the carrier tape one pitch at a time and sequentially feeds the component to a component supply location of the base in a state of being housed in a cavity of the carrier tape; and the component that is movably mounted on the base A component transfer device that sucks a component supplied to a supply location with a suction nozzle and mounts it on a substrate positioned and held by the substrate transfer device; and a substrate recognition device that is arranged in parallel with the suction nozzle on the component transfer device A mounting position is corrected based on image information obtained by photographing the substrate positioned and held by the substrate transfer device with the substrate recognition camera, and the substrate is sucked by the suction nozzle. In an electronic component mounting apparatus for mounting a product on the substrate, the component supply device stores the component in a cavity of the carrier tape, and is separated from the component supply location by one pitch or a plurality of pitches toward the substrate transport device. And confirming the suction position of the suction nozzle with respect to the component supplied to the component supply location based on image information obtained by photographing the component transferred to the confirmation location with the substrate recognition camera. is there.

  The structural feature of the invention according to claim 2 is that in claim 1, the confirmation of the suction position of the suction nozzle with respect to the component supplied to the component supply location is performed by recognizing the component transferred to the confirmation location as the substrate. A captured image of the part photographed by the camera for use, and at least one of the graphic image of the part and the graphic image of the suction nozzle located at the normal position of the confirmation location are simultaneously displayed on a display device, and the graphic image of the part is displayed. Correcting by performing at least one of relatively moving and superimposing with the captured image of the component and relatively moving the graphic image of the suction nozzle to the suction position on the captured image of the component. is there.

  The structural feature of the invention according to claim 3 is that a substrate transport device that is provided on the base and carries in and out the substrate and positions and holds and a carrier tape in which components are enclosed at a predetermined pitch are sent one pitch at a time. A component supply device that sequentially supplies the components to the component supply location of the base while being housed in the cavity of the carrier tape, and a component that is movably mounted on the base and supplied to the component supply location. A component transfer device mounted on a substrate sucked by a suction nozzle and positioned and held by the substrate transfer device; and a substrate recognition camera arranged in parallel with the suction nozzle on the component transfer device, the substrate transfer The mounting position is corrected based on image information obtained by photographing the substrate positioned and held by the apparatus with the substrate recognition camera, and the component sucked by the suction nozzle is mounted on the substrate. In the child component mounting apparatus, means for transferring the component by the component supply device from the component supply location to a confirmation location separated by one pitch or a plurality of pitches from the component supply location toward the substrate transport device in a state of being housed in the cavity of the carrier tape; And a correction means for correcting the suction position of the suction nozzle with respect to the component supplied to the component supply location based on image information obtained by photographing the component transferred to the confirmation location with the substrate recognition camera. It is.

  The structural feature of the invention according to claim 4 is that, in claim 3, the suction nozzle is provided closer to the component supply location than the board recognition camera.

  According to the first aspect of the invention configured as described above, the substrate is positioned and held by the substrate transfer device, the carrier tape in which the components are enclosed at a predetermined pitch is sent one pitch at a time, and the components are placed in the cavity of the carrier tape. It is supplied to the parts supply location in the housed state. The component transfer device sucks the component supplied to the component supply location with a suction nozzle, and transports and mounts the component on the substrate.

  When confirming the suction position of the suction nozzle with respect to the component supplied to the component supply location, the component supply device is separated from the component supply location by one pitch or a plurality of pitches from the component supply location to the substrate transport device while being stored in the cavity of the carrier tape. It is transferred to the confirmation place. The component transferred to the confirmation location is photographed by the substrate recognition camera installed in parallel with the suction nozzle on the component transfer device, and the suction position of the suction nozzle for the component supplied to the component supply location based on the image information of this component Is confirmed. The parts transferred from the parts supply part to the confirmation part located on the board transfer device side are photographed by the board recognition camera, so the moving stroke of the part transfer device can be shortened, and the electronic component mounting device can be downsized. Can be

  Then, the parts are transferred to the confirmation place by the parts supply device in the state of being stored in the cavity of the carrier tape in the same manner as when the parts are supplied to the parts supply place. The amount of deviation displaced from the normal position is almost the same as the amount of deviation of the component supplied to the component supply location from the normal position at the component supply location. Thereby, the suction position of the suction nozzle with respect to the component supplied to the component supply location can be confirmed based on image information obtained by photographing the component transferred to the verification location with the substrate recognition camera. Furthermore, since the component transferred to the confirmation location is imaged by the substrate position recognition camera that images the substrate in order to correct the substrate positioning error, it is not necessary to separately provide a camera for imaging the component, thereby reducing costs. Can do.

  According to the invention according to claim 2 configured as described above, a captured image of a component captured by the substrate recognition camera, and a graphic image of a component located at a normal position of the verification location, At least one of the graphic images of the suction nozzle is simultaneously displayed on the display device. Then, by moving at least one of relatively moving the graphic image of the component to overlap with the captured image of the component and relatively moving the graphic image of the suction nozzle to the suction position on the captured image of the component The suction position of the suction nozzle with respect to the component supplied to the component supply location can be easily set and corrected. In addition, by moving the graphic image of the suction nozzle relative to the part suitable for suction while avoiding the uneven surface on the shot image of the part while observing the captured image of the part, the suction position of the suction nozzle on the part is appropriately adjusted. Can be set to

  According to the invention according to claim 3 configured as described above, the substrate is positioned and held by the substrate transfer device, the carrier tape in which the components are enclosed at a predetermined pitch is fed one pitch at a time, and the components are placed in the cavity of the carrier tape. It is supplied to the parts supply location in the housed state. The component transfer device sucks the component supplied to the component supply location with a suction nozzle, and transports and mounts the component on the substrate. In order to confirm the suction position of the suction nozzle with respect to the component supplied to the component supply location, one or more pitches from the component supply location to the substrate transport device side while the component is stored in the cavity of the carrier tape by the component supply device It is transferred to a separate confirmation location. The component transferred to the confirmation location is photographed by the substrate recognition camera installed in parallel with the suction nozzle on the component transfer device, and the suction position of the suction nozzle for the component supplied to the component supply location based on the image information of this component Is confirmed. This makes it possible to shorten the movement stroke of the component transfer device to move in order to photograph the component with the substrate recognition camera, and further to capture the substrate in order to correct the positioning error of the substrate. Since the parts transferred to the confirmation location are photographed, it is not necessary to separately provide a camera for photographing the parts, and it is possible to provide an electronic component mounting apparatus that is small in size and requires a small installation space.

  According to the invention according to claim 4 configured as described above, since the suction nozzle is provided in the component transfer device on the component supply location side of the substrate recognition camera, the component can be moved with a small movement stroke of the component transfer device. The parts at the supply location are picked up by the suction nozzle, and the parts at the confirmation location separated from the component supply location to the substrate transfer device and the substrate positioned and held by the substrate transfer device can be efficiently imaged by the substrate recognition camera. And an electronic component mounting apparatus can be reduced in size.

  Hereinafter, an embodiment of a component suction position confirmation method of a suction nozzle and an electronic component mounting device in an electronic component mounting apparatus according to the present invention will be described. FIG. 1 is a top view schematically showing the electronic component mounting apparatus 10. The base 11 of the electronic component mounting apparatus 10 is provided with a board transfer device 12 that transfers the board S in the Y direction. The substrate transport device 12 transports the substrate S in the Y direction, and includes first and second guide rails 14 and 15 assembled to the base 11. The first and second guide rails 14 and 15 extend in the transport direction and are arranged to face each other in parallel, and guide the substrate S in the transport direction. In addition, a pair of conveyor belts provided in parallel to each other are provided in parallel in the substrate transport device 12 immediately below the first and second guide rails 14 and 15. These conveyor belts support the substrate S and transport it in the transport direction. The substrate transport device 12 is provided with a clamping device that pushes up and clamps the substrate S transported to a predetermined position. Thereby, the board | substrate S is carried in on the board | substrate conveyance apparatus 12, is conveyed to a predetermined position, is positioned and hold | maintained, and is carried out after completion | finish of mounting of an electronic component.

  Above the substrate transfer device 12, a moving table 18 of the component transfer device 17 is mounted on an elongated slide 16 so as to be movable in the Y direction, and the slide 16 is attached to a fixed rail 19 extending in the X direction perpendicular to the Y direction. It is supported so as to be movable in the X direction. The movement of the movable table 18 and the slide 16 in the Y and X directions is controlled by a servo motor via a ball screw.

  The component transfer device 17 includes a component mounting head 20 that is mounted on a movable table 18 so as to be movable up and down in a Z direction perpendicular to the X direction and the Y direction, and whose elevation is controlled by a servo motor via a ball screw. A cylindrical suction nozzle 21 that protrudes downward from the mounting head 20 and holds an electronic component at the lower end is provided.

  In the electronic component mounting apparatus 10, a component supply device 22 including a plurality of cassette-type feeders 23 is attached to the base 11 on the rear side in the X direction from the substrate transfer device 12. Each cassette type feeder 23 has one or more pitches from the main body 23a, the supply reel 23b provided at the rear of the main body 23a, the component take-out location 23c provided at the front end of the main body 23a, and the component take-out location 23c toward the substrate transfer device 12 A component position confirmation portion 23d spaced apart from the pitch is provided. Therefore, as shown in FIG. 2, when the component supply device 22 is mounted on the base 11, the component take-out location 23 c and the component position confirmation location 23 d of each cassette type feeder 23 are the component supply locations set on the base 11. 24 and the confirmation part 25 are located in a state of being shifted by a manufacturing error. Each supply reel 23b holds a carrier tape 27 in which a part P is stored in a cavity 27b provided at a predetermined pitch in the tape body 27a and sealed with a cover, and the carrier tape 27 is sent at a predetermined pitch by a sprocket. Then, the cover is peeled off before the component take-out location 23 c and the component is stored in the cavity 27 b of the carrier tape 27 and sent to the component supply location 24 and the confirmation location 25.

  A substrate recognition camera 26 is juxtaposed with the suction nozzle 21 on the movable table 18, and the substrate recognition camera 26 images the substrate S positioned and held by the substrate transport device 12 and transmits image information to the control device 30. The control device 30 corrects the mounting position of the component P on the substrate S based on the image information captured by the substrate recognition camera 26 according to the positioning error of the substrate S. The component transfer device 17 sucks the component P supplied to the component supply location 24 by the suction nozzle 21 provided on the component supply location 24 side from the substrate recognition camera 26 and is positioned and held by the substrate transport device 12. It is transported to the mounting position on S and mounted.

  The component P transferred to the confirmation location 25 is photographed by the board recognition camera 26, and image information of the component P is transmitted to the control device 30, and the suction position of the suction nozzle 21 with respect to the component P supplied to the component supply location 24. Is confirmed. That is, the component P is transferred from the component supply location 24 to the substrate transport device 12 side to the confirmation location 25 separated by one pitch or a plurality of pitches while being accommodated in the cavity 27b of the carrier tape 27 by the component supply device 22. The component P transferred to the confirmation location 25 is photographed by a substrate recognition camera 26 provided in parallel with the suction nozzle 21 in the component transfer device 17 and supplied to the component supply location 24 based on the image information of the component P. The suction position of the suction nozzle 21 with respect to the component P is confirmed.

  Similarly to the case where the component P is supplied to the component supply location 24, the component P is transferred to the confirmation location 25 by being stored in the cavity 27 b of the carrier tape 27 by the component supply device 22. The amount of deviation in which the component P is displaced from the normal position at the confirmation location 25 is almost the same as the amount of deviation in which the component P supplied to the component supply location 24 is displaced from the normal position in the component supply location 24. Based on the image information of the component P transferred to the confirmation location 25, the suction position of the suction nozzle 21 with respect to the component P supplied to the component supply location 24 can be confirmed. The component transfer device 17 sucks the component P at the component supply location 24 with the suction nozzle 21 with a short movement stroke, and also moves the component P to the confirmation location 25 separated from the component supply location 24 toward the substrate transport device 12. The substrate S positioned and held by P and the substrate transfer device 12 can be efficiently imaged by the substrate recognition camera 26.

  As shown in FIG. 3, the substrate transfer device 12, the component transfer device 17, the component supply device 22, the substrate recognition camera 26 and the like are connected to the control device 30. In the control device 30, a program for correcting the mounting position of the component P on the substrate S based on image information taken by the substrate recognition camera 30, and the component P transferred to the component supply location 24 is sucked by the suction nozzle 21. Then, the suction position of the suction nozzle 21 with respect to the component P supplied to the component supply location 24 based on the program to be mounted on the substrate S and the image information obtained by photographing the component P transferred to the confirmation location 25 by the substrate recognition camera 26 A program for confirming is stored. An input device 31, a display device 32, and a storage device 33 are connected to the control device 30. The input device 31 is operated by an operator to input information, data, and the like necessary for board mounting. The storage device 33 stores various programs and data necessary for mounting.

  Next, the operation of the present embodiment will be described. When the component P is mounted on the board S, when the mounting start switch is pushed by the operator, the microcomputer of the control device 30 executes the mounting program, and each device operates based on the control signal from the control device 30. Is done. That is, the substrate transfer device 12 carries the substrate S to a predetermined position, and is positioned and held by the clamp device at that position. The substrate recognition camera 26 is moved onto the substrate transport device 12 by the moving table 18, images the substrate S that has been positioned and held, and transmits image information to the control device 30. Based on this image information, the control device 30 corrects the mounting position of the component P on the substrate S according to the positioning error of the substrate S. The suction nozzle 21 is positioned by the movement of the moving table 18 at the component supply location 24 corresponding to the component take-out portion 41c of the cassette type feeder 23 that stores the component P placed on the substrate S, and the component transfer device 17 is Then, the component P supplied to the component supply location 24 by the suction nozzle 21 is sucked, moved to the mounting position on the substrate S, and mounted on the substrate S.

  When the type of the substrate S changes, the component supply device 22 including the cassette type feeder 23 that stores the component P to be mounted is attached to the base 11. The amount of movement of the component P supplied to the component supply location 24 in the state of being accommodated in the cavity 27b of the carrier tape 27 by the component supply device 22 varies depending on the component P, and is thus supplied to the component supply location 24. The amount by which the part P deviates from the normal position varies depending on the part P. Further, due to dimensional variation for each production lot of the carrier tape and the cassette type feeder 23 being inclined in the lateral direction, the part 27 accommodated in the cavity 27b is displaced from the normal position at the part supply point 24. Sometimes. When the component P deviates from the normal position at the component supply location 24 in this manner, the suction nozzle 21 may fail to suck the component P, particularly a small component.

  In addition, when new part data is created for the first part and the part suction position of the suction nozzle 21 is offset from the part center, whether the offset value is appropriate or not before the first production is started. It is necessary to confirm whether or not is necessary.

  Furthermore, after the start of production, when an abnormality occurs in the adsorption of the component P by the adsorption nozzle 21 and the apparatus stops, or the normal adsorption rate of the adsorption nozzle 21 during production is monitored for each type of component, It is necessary to confirm whether or not the component suction position of the suction nozzle is appropriate when a suction abnormality occurs for a component that falls below the set suction rate.

  When the input device 31 inputs the start of confirmation of the suction position of the suction nozzle 21 with respect to the component P supplied to the component supply location 24, the microcomputer of the control device 30 causes the component suction position confirmation program of FIG. Each device is operated based on a control signal from the control device 30. That is, the components P stored in each cassette type feeder 23 of the component supply device 22 are transferred to each confirmation location 25 while being stored in the cavity 27b of the carrier tape 27 by the component supply device 22 (step S1). The board recognition camera 26 is transferred to each confirmation location 25 by the moving platform 18, and the parts P transferred to each confirmation location 25 are sequentially photographed (step S2), and a captured image 34 of the component P is transmitted to the control device. As shown in FIG. 5, the control device 30 picks up the picked-up image 34 of each part P picked up by the board recognition camera 26 and the pick-up located at an appropriate pick-up position with respect to the part P located at the regular position of each check point 25. The graphic image 35 of the nozzle 21 is simultaneously displayed on the display device 32 (step S3). By looking at the screen on which the captured image 34 of the component P and the graphic image 35 of the suction nozzle 21 are simultaneously displayed, the suction position of the suction nozzle 21 with respect to the component P can be confirmed. When the suction position needs to be corrected, each graphic image 35 of the suction nozzle 21 is moved to an appropriate suction position on the captured image 34 of each component P by the input device 31 such as a mouse (step S4). The amount of movement of the suction nozzle 21 in the X and Y directions of the graphic image 35 is detected (step S5), and the suction position of the suction nozzle 21 with respect to the component P supplied to each component supply location 24 corresponding to each cassette type feeder 23. Corrections are made. When the graphic image 35 of the suction nozzle 21 is displayed on the uneven surface of the captured image 34 of the component P, the graphic image 35 of the suction nozzle 21 is suitable for suction without unevenness while viewing the captured image 34 of the component P. It can be moved to the part. Alternatively, it is confirmed whether the offset value is appropriate and whether an offset is necessary.

  In step 3, the captured image 34 of the component P and the graphic image 35 of the component P located at the normal position of the confirmation location 25 may be simultaneously displayed on the display device 32. In this case, the suction position of the suction nozzle 21 relative to the part P is corrected by moving the graphic image 35 of the part P and superimposing it with the captured image 34 of the part P. Furthermore, in step 3, the captured image 34 of the part P, the graphic image 35 of the suction nozzle 21 located at an appropriate suction position for the part P located at the normal position of the confirmation place 25, and the part located at the normal position of the confirmation place 25. The P graphic image 35 may be simultaneously displayed on the display device 32. Further, in step S4, an appropriate suction position on the captured image 34 of the component P may be moved onto the graphic image 35 of the suction nozzle 21 by moving the captured image 34 of the component P.

  In the above embodiment, the part P located at the confirmation location 25 is photographed by the board recognition camera 26, the photographed image 34 is taken into the control device 30 of the electronic component mounting apparatus 10, and the display device, the input device, etc. Although the suction position of the suction nozzle with respect to P is confirmed and corrected, the photographed image of the part P is transferred to the host computer or data creation machine and displayed on the display device to indicate the suction position of the suction nozzle with respect to the part P. The suction position may be corrected by the input device as necessary.

1 is a top view schematically showing an electronic component mounting apparatus according to an embodiment of the present invention. The figure which shows the components pick-up location and component location confirmation location of a cassette type feeder. The block diagram which shows a control relationship. The figure which shows a component adsorption position confirmation program. The figure which shows the picked-up image of components, and the graphic image of a suction nozzle.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus, 11 ... Base, 12 ... Board | substrate conveyance apparatus, 17 ... Component transfer apparatus, 18 ... Moving stand, 20 ... Component mounting head, 21 ... Adsorption nozzle, 22 ... Component supply apparatus, 23 ... Cassette Type feeder, 23c ... Part removal location, 23d ... Part location confirmation location, 24 ... Part supply location, 25 ... Verification location, 26 ... Substrate recognition camera, 30 ... Control device, 31 ... Input device, 32 ... Display device, 33 ... Storage device 34... Captured image of part 35. Graphic image of suction nozzle S. Substrate P. Part.

Claims (4)

A substrate carrying device that is provided on the base and carries in / out and positions and holds the substrate, and a state in which the carrier tape in which the components are sealed at a predetermined pitch is sent one pitch at a time and the components are stored in the cavity of the carrier tape The component supply device that sequentially supplies the components to the component supply location of the base and the component that is movably mounted on the base and supplied to the component supply location are adsorbed by the suction nozzle and are positioned and held by the substrate transfer device. A component transfer device mounted on the substrate, and a substrate recognition camera arranged in parallel with the suction nozzle on the component transfer device, and the substrate positioned and held by the substrate transfer device is used for the substrate recognition. In the electronic component mounting apparatus that corrects the mounting position based on image information photographed by the camera and mounts the component sucked by the suction nozzle on the substrate,
The component is transferred from the component supply point to the substrate transfer device side by one pitch or a plurality of pitches in a state where the component is housed in the carrier tape cavity by the component supply device,
An electronic component mounting apparatus for confirming a suction position of the suction nozzle with respect to a component supplied to the component supply location based on image information obtained by photographing the component transferred to the check location with the substrate recognition camera For confirming the component suction position of the suction nozzle. 2. The confirmation of the suction position of the suction nozzle with respect to the component supplied to the component supply location according to claim 1, wherein a captured image of a component obtained by capturing the component transferred to the verification location with the substrate recognition camera, and the confirmation At least one of the graphic image of the part and the graphic image of the suction nozzle at the regular position is simultaneously displayed on a display device, and the graphic image of the part is relatively moved to overlap the captured image of the part And correcting the graphic image of the suction nozzle by at least one of moving the graphic image of the suction nozzle to a suction position on the captured image of the component. How to check the position. A substrate carrying device that is provided on the base and carries in / out and positions and holds the substrate, and a state in which the carrier tape in which the components are sealed at a predetermined pitch is sent one pitch at a time and the components are stored in the cavity of the carrier tape The component supply device that sequentially supplies the components to the component supply location of the base and the component that is movably mounted on the base and supplied to the component supply location are adsorbed by the suction nozzle and are positioned and held by the substrate transfer device. A component transfer device mounted on the substrate, and a substrate recognition camera arranged in parallel with the suction nozzle on the component transfer device, and the substrate positioned and held by the substrate transfer device is used for the substrate recognition. In the electronic component mounting apparatus that corrects the mounting position based on image information photographed by the camera and mounts the component sucked by the suction nozzle on the substrate,
Means for transferring the component by the component supply device from the component supply location to a confirmation location separated by one pitch or a plurality of pitches from the component supply location in a state of being accommodated in the cavity of the carrier tape;
Confirmation means for confirming the suction position of the suction nozzle with respect to the component supplied to the component supply location based on image information obtained by photographing the component transferred to the confirmation location with the substrate recognition camera;
An electronic component mounting apparatus comprising: 4. The electronic component mounting apparatus according to claim 3, wherein the suction nozzle is provided closer to the component supply location than the board recognition camera.

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