JP2003318599A - Method and system for mounting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a system for mounting a component accurately at a high speed in which components having a polarity, arranged at random in a component feeding section without recognizing its polarity, can be set in a state of arranged polarity at the time of mounting on a board. <P>SOLUTION: By means of a head 47 holding and transferring a package component 75, the package component 75 having a polarity arranged previously in the component feeding section 59 is chucked and mounted at a specified position on a circuit board 41. Based on image data obtained by imaging the package component 75, polarity direction of the package component 75 is recognized and the orientation of the chucked package component 75 is altered such that the recognized polarity direction is aligned with a specified direction. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and a component mounting apparatus for mounting a component at a predetermined position on a circuit board, and more particularly to a technique for mounting a component having polarity in a correct direction.

[0002]

2. Description of the Related Art In a component mounting apparatus for automatically mounting components such as electronic components on a circuit board, high-speed component mounting operation, accuracy, and multi-product compatibility are important factors for performance. There is. Regarding high speed, it has been attempted to increase the speed by providing a plurality of mounting heads that can pick up components at the same time on a transfer head that picks up and transfers components, and various optimization processes. Accurate component mounting has been realized by improving the assembly accuracy of each part of the device and controlling the precise movement system. Further, in order to deal with various types of components, the component library in which various component information is recorded is expanded, and the device library can be easily registered in the mounting program.

In such a component mounting apparatus, the component to be mounted is prepared in advance in the component supply unit in a state in which it can be sucked from the mounting head. This component supply is such that for small chip components and the like, the component supply unit accommodates them in a component tape and continuously supplies them, such as CSP (Chip size package) and BG.
For package parts such as A (Ball grid array),
Because of its relatively large size, as shown in FIG. 20, the package components 1 are arranged and placed on the tray 2 to be supplied. The control controller has a function of detecting the pickup posture after the pickup of the components, obtaining the amount of deviation of the package component 1 from the normal position, and correcting the amount.

[0004]

The package component 1 such as the CSP or BGA has a polarity, and it is necessary to mount the component 1 on the circuit board by aligning the direction of the component 1 with a specific direction.
However, although the controller corresponds to the correction of the suction posture of the component 1, for example, it has a function of determining the polarity by detecting a lead or the like on each side of the package component 1 having a substantially square front shape. No, we could not recognize the polarity of the parts. For this reason, when each package component 1 is placed on the tray 2, it is performed by artificially aligning the polarities of the components 1 in a certain direction.

Therefore, extra preparation man-hours for arranging the components 1 in a certain direction and man-hours for inspecting the mounted boards in the subsequent steps are required, which makes it difficult to improve productivity.
Furthermore, when the wrong mounting is performed due to the wrong polarity, a mounting time in the mounting direction is first recognized by a substrate inspection device or the like in a subsequent process, and thus a loss time is required, which requires a lot of time for this correction. In this way, CSP and BGA
In the mounting process for package components such as the above, there has been a problem that not only the productivity cannot be improved but also the quality of the board to be produced cannot be improved.

The present invention has been made in view of the above situation, and even if components having polarities are randomly arranged in the component supply unit without paying attention to the polarities, the polarities of the components are matched at the time of mounting on the substrate. An object of the present invention is to provide a component mounting method and a component mounting apparatus that can be set to a state, and to perform accurate and high-speed component mounting.

[0007]

According to a first aspect of the present invention, there is provided a component detecting method which is arranged in advance in a component supplying section by a component transferring means for holding and transferring a component. A component mounting method of taking out a component having a polarity and mounting the taken-out component at a predetermined position on the substrate, recognizing the polarity direction of the component based on image data obtained by imaging the component, The held component is mounted by changing its orientation so that the recognized polarity direction of the component and the polarity direction of the mounting destination of the component coincide with each other.

According to this component mounting method, even if components having polarities are randomly arranged in the component supply section without paying attention to the polarities, the polarities of the components are adjusted to predetermined positions when mounted on the substrate. Since it is set to, productivity can be improved and erroneous mounting due to polarity error can be prevented.

According to a second aspect of the present invention, there is provided a component mounting method, wherein the component has a substantially quadrangular shape on a front surface and has a polarity display portion indicating a polarity direction at any one of the corners. It is characterized in that the presence or absence of the polarity display section is detected from the picked-up images obtained by sequentially picking up images and the polarity direction of the component is recognized.

According to this component mounting method, the polarity display portion is present at which corner portion by detecting the polarity display portion from the picked-up images obtained by sequentially picking up the respective corner portions of the substantially square front component. Is calculated, and the polarity direction of the component is recognized.

According to a third aspect of the component mounting method, when the polarity display portion is detected from a captured image of any one of the corner portions of the component, the corner portion that has not been imaged is imaged. It is characterized by not to.

According to this component mounting method, unnecessary detection processing is not required, so that the time required for the detection processing of the polarity display portion can be minimized.

According to another aspect of the present invention, there is provided a component mounting apparatus, wherein a component transfer means for holding and transporting a component takes out a component having a polarity arranged in advance in a component supply section, and takes out the taken-out component on the substrate. A component mounting apparatus which mounts at a predetermined position, and detects the presence / absence of an image pickup unit for picking up an image of a component and the presence / absence of a polarity display section that indicates the polarity direction of the component from the image captured by the image pickup unit. The component held by the component transfer means such that the polarity recognition means for recognizing the component, the polarity direction recognized by the polarity recognition means, and the polarity direction on the board on which the component is mounted match. And a correction means for changing the direction of the.

According to this component mounting apparatus, it is possible to automatically recognize the polarity of the component and correct it, thereby improving productivity and preventing erroneous mounting due to incorrect polarity. The quality can be improved.

According to a fifth aspect of the present invention, there is provided a component mounting apparatus, wherein the image pickup means is provided below the component transfer means, and images the component held by the component transfer means from a lower surface side. .

According to this component mounting apparatus, since it is possible to image the back surface of the component while picking up the component and confirm the polarity direction, it is easy to control the polarity direction confirmation process.

According to a sixth aspect of the present invention, there is provided a component mounting apparatus, wherein the image pickup means is provided integrally with the component transfer means and picks up an image of the component arranged in the component supply section from the upper surface side.

According to this component mounting apparatus, since the polarity direction of the component can be confirmed during the process of taking out the component by the component transfer means, the movement amount of the transfer head can be small, and the polarity direction confirmation process of the component can be performed. The time required can be shortened.

According to a seventh aspect of the present invention, there is provided a component mounting apparatus, wherein the correction means rotationally drives a suction nozzle provided on the transfer head for holding a component by suction.

According to this component mounting apparatus, the suction direction of the component is corrected by rotating the suction nozzle while sucking the component. Accordingly, the correction process can be performed together with the correction of the suction posture of the component with a simple correction mechanism.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a component mounting method and a component mounting apparatus according to the present invention will be described in detail below with reference to the drawings. 1 is a perspective view showing a schematic configuration of a component mounting apparatus according to the present invention, FIG. 2 is a perspective view showing a configuration of a component mounting head, FIG. 3 is an operation explanatory diagram of a transfer head, and FIG.
FIG. 2 is a block diagram showing a control system of the component mounting apparatus shown in FIG.

As shown in FIG. 1, a loader section 33, a board holding section 35, and an unloader section 37 are provided on the base 10 of the component mounting apparatus 100, and a transfer section consisting of a pair of guide rails 39 is provided between them. Is provided. By the synchronous drive of the conveyor belt provided on the guide rail 39,
The circuit board 41 is loaded from the loader section 33 on one end side to the board holding section 3
It is conveyed to the unloader unit 37 on the other end side via the No. 5.

The Y-axis robot 4 is provided above the base 10.
3, 43 are provided, and these two Y-axis robots 43,
An X-axis robot 45 is suspended between 43, and the X-axis robot 45 can be moved back and forth in the Y-axis direction by driving the Y-axis robots 43, 43. Further, a transfer head 47, which is a component transfer means, is attached to the X-axis robot 45, and the transfer head 47 can be moved back and forth in the X-axis direction. It is movable in the Y plane.

X-axis robot 45, Y-axis robots 43 and 4
The transfer head 47 mounted on the XY robot 49 composed of 3 and freely moving on the XY plane includes a parts feeder 50 and a CSP to which relatively small electronic parts such as chip resistors and chip capacitors are supplied. A desired electronic component is sucked through a suction nozzle 52 attached to a component mounting head 51 from a component supply unit 59 including a component tray 101 that supplies a relatively large package component such as a BGA or the like, and the circuit board 41 It is configured so that it can be mounted in the component mounting position. At the side end of the transfer head 47, a board recognition device (camera) 53 as an image pickup means for recognizing a board mark or the like provided on the circuit board 41 for alignment is attached. The mounting operation of such an electronic component is controlled based on a preset mounting program.

Here, the mounting program is an NC having information on components to be input and mounted in the component mounting apparatus 100.
It is a program in which the rearranged data created by rearranging the mounting order for information is converted into a command form for driving the XY robot 49, the suction nozzle 52 of the transfer head 47, and the like. In creating this mounting program, an NC program 76 in which information such as the mounting position of each component is recorded, a component library 75 in which information such as the electrode shape of each component is registered, and board information are recorded. The board data 79, the nozzle data 81 in which the nozzle type corresponding to the mounted component is recorded, and the like are used with an input from the operator. By executing the mounting program created in this way by the control device 70, the circuit board 4 of the component
1 is implemented.

On the side of the guide rail 39, the two-dimensional positional deviation (suction posture) of the component sucked by the component mounting head 51 is detected, and the electronic component sucked by the component mounting head 51 is detected. A component recognition device 5 as an image pickup means for determining pass / fail (for example, a defect such as bending of a lead).
7 is provided. The detected positional deviation is used for generation of data to be corrected on the transfer head 47 side so as to be corrected at the time of mounting. The component recognition device 57
Two-dimensional imaging of a plurality of components suction-held by the component mounting head 51 is provided below the head movement plane and is moving at high speed from the component supply unit 59 to the mounting position without stopping the transfer head 47. An image is picked up by a posture recognition camera (not shown) of the component recognition device 57 including elements.

A plurality of light emitting elements such as light emitting diodes (LEDs) for illuminating the components sucked by the suction nozzles 52 are provided in multiple stages on the inner surface of the housing around the attitude recognition camera of the component recognition device 57. ing. Thereby, the mounting surface of the component can be irradiated with light from a desired angle, and an image can be picked up at an appropriate illumination angle according to the type of the component.

The component mounting head 51 of the transfer head 47 is
As shown in FIG. 2, a plurality of component mounting heads 51a, 51b, 51c and 51d (only four are shown in the drawing) are connected side by side to form a multiple head. The component mounting heads 51a, 51b, 51c, 51d have the same structure, and have a suction nozzle 52, an actuator 61 for causing the suction nozzle 52 to perform a vertical movement, and a suction nozzle 52 for correcting the posture of the sucked component. A motor 63, a timing belt 65, and a pulley 6 for causing the device to perform θ rotation.
7 and 7. The motor 63 selectively rotates the two suction nozzles 52, 52, respectively.

The suction nozzles 52 of the component mounting heads 51a to 51d are replaceable, and the other suction nozzles 52 are previously stored in a nozzle stocker 69 provided on the side of the guide rail 39 (see FIG. 1) of the component mounting apparatus 100. It is housed.
The suction nozzle 52 includes, for example, an S size nozzle that adsorbs a minute chip component of about 1.0 × 0.5 mm, an M size nozzle that adsorbs an 18 mm square QFP, etc., and is selected according to the type of electronic component to be mounted. Is used.

Next, the electronic component mounting apparatus 100 having the above configuration
The basic operation of will be described. As shown in FIG. 3, when the circuit board 41 loaded from the loader unit 33 (see FIG. 1) of the guide rail 39 is transported to a predetermined mounting position, the transfer head 47 is moved by the XY robot 49 in the XY plane. Move to parts feeder 50 (or parts tray 101)
A desired electronic component is adsorbed from the component supply unit 59 such as based on the mounting program, and is moved onto the posture recognition camera of the component recognition device 57. The component recognition device 57 recognizes the suction posture of the electronic component based on the component recognition data, and performs the correction operation of the suction posture. As this correction operation, the XY robot 49 is provided with an offset amount in the X and Y directions as an offset, and the offset amount of the rotational component is corrected by rotating the suction nozzle 52 by the motor 63. Then the circuit board 4
The electronic component is mounted at a predetermined position of 1.

The mounting of the electronic component on the circuit board 41 is completed by repeating the suction of the electronic component and the mounting operation on the circuit board 41. The circuit board 41 that has been mounted is carried out from the mounting position to the unloader section 37, while a new circuit board 41 is carried into the loader section 33, and the above operation is repeated.

A component mounting apparatus 100 having a basic operation function for mounting the electronic components is a control device 70 shown in FIG.
have. The control device 70 mainly includes the loader unit 3
3, a substrate holding unit 35, an unloader unit 37, an XY robot 49, a component supply unit 59, a component recognition device 57, etc. are connected. Further, the control unit 70 includes a database unit 7
1, a transfer head 47, etc. are connected, and the database unit 71 includes a parts library 75, an NC program 76,
It has substrate data 79 and nozzle data 81. Further, the component mounting head 51, the board recognition device 53, and the like are connected to the transfer head 47.

Here, the procedure for mounting the package components such as CSP and BGA on the circuit board 41 with the polarity direction aligned with the specified direction will be described. Since the package parts are relatively large parts, they are housed in the parts tray 101 in the parts supply section 59. This parts tray 101
1 has a structure in which one component 75 is accommodated in each of the lattice-shaped component accommodating masses, as shown in FIG. In the present embodiment, the package component 75 to be accommodated
As an example, a case where a CSP in which a large number of solder balls are provided as connection terminals on the back surface of the component is supplied will be described.

In this type of package component, the polarity direction is determined, and generally, one of the corners of the front square shape is provided with a polarity display portion (mark) or the like indicating the polarity direction. ing. In mounting this package component, it is necessary to match the polarity direction of the component with the specified direction. The present invention is characterized in that the component mounting apparatus automatically rotates and mounts the component so that the polarity direction becomes an appropriate direction without paying particular attention to the polarity direction.

First, in order to detect the polarity direction of such a package component and align it with a specific direction, the package component 75 is suction-held by the suction nozzle 52 of the transfer head 47, and the back surface of the package component is imaged. A method of determining the polarity from the obtained image will be described. FIG. 5 shows the component back surface of the package component 75 as an example. The positions of the solder balls 77 of the package component 75 having a substantially square front surface are arranged substantially symmetrically in the vertical and horizontal directions.
At any one corner of the package component 75, the solder balls 77a not present at the other corners are arranged. The corners where the solder balls 77a are present represent the polar directions. That is, in the case of this package component 75, the solder ball 77a serves as a polarity display portion, and the solder ball 77a
This means that there is a connection point commonly referred to as No. 1 at the corner where there is.

FIG. 6 is a flow chart showing the mounting procedure of the package component 75 described above. The mounting process will be sequentially described below based on this flowchart. First,
As shown in FIG. 7, the substrate recognition device 53 of the transfer head 47.
The package component 75 at a predetermined position on the parts tray 101 is imaged to recognize the presence or absence of the component (step 11, hereinafter abbreviated as S11). When it is confirmed that there is a component, the transfer head 47 is moved to XY as shown in FIG.
The robot 49 moves to place the predetermined component mounting head 51 of the component mounting head 51 above the recognized package component 75. At this position, the suction nozzle 52
Is moved down to adsorb the package component 75 (S1
2).

Next, as shown in FIG. 9, the suction nozzle 52
To move the transfer head 47 in the XY directions,
The picked-up package component 75 is arranged above the component recognition device 57. Then, the rear surface of the package component 75 is imaged by the attitude recognition camera of the component recognition device 57, and the suction position shift and the rotation shift are measured (S13). Further, the polarity of the package component 75 is determined by the polarity direction confirmation process described later (S14). Thereafter, if necessary, the motor 63 (see FIG. 2) of the component mounting head 51 is rotated to align the polar direction of the package component 75 with the specified direction, and the positional deviation in the rotational direction is corrected by suction of the package component 75 (S15). ). Next, as shown in FIG. 10, the transfer head 47 is moved to a position above the substrate 41, and the sucked package component 75 is mounted at a predetermined position on the circuit substrate 41 (S16).

Here, the polarity direction confirmation processing (S14) of the package component 75 in FIG. 9 described above will be described in detail. In the component recognition device 57, as shown in FIG. 11, the back surface of the package component 75 is divided into four regions A, B, C, D every 90 °. Then, the first imaging area 102a to the fourth imaging area 102 of the component 75 in each of the areas A to D.
By capturing at most three image capturing areas out of d, as shown in FIG.
Which corner of the solder ball 77a shown in FIG.

For example, if it is assumed that the solder balls 77a that do not exist in the other corners are present in the first picked-up image 102a as shown in FIG. As for the state in the polar direction, FIG.
The states shown in (b) to (d) are obtained. That is, FIG. 12 (b)
When the solder ball 77a exists in the second imaging area 102b as shown in FIG.
If 7a is present in the third imaging area 102c, FIG.
As shown in (d), the solder ball 77a is in the fourth imaging area 10.
2d, the direction of the polarity of the package component 75 is changed according to the direction of the motor 63 of the component mounting head 51.
Is rotated to make a correction so as to match FIG.

Here, if the solder ball 77a is detected in any of the picked-up images from the first pick-up area 102a to the third pick-up area 102c, the polarity direction confirmation processing of the package component 75 is finished at that point, and the rest. It is possible to omit the image pickup for the image pickup area and the polarity direction confirmation processing in the image pickup image. For example, if the solder ball 77a is recognized in the first imaging area 102a that is first imaged, it is not necessary to perform further imaging and recognition.

FIG. 13 shows a flowchart for explaining the detailed procedure of the polarity direction confirmation processing. Hereinafter, the polarity direction confirmation processing will be described based on this flowchart. First,
The component recognition device 57 captures an image of the first image capturing area 102a of the package component 75, and determines whether or not the mark indicating the polarity direction, that is, the solder ball 77a is present in the captured image (S21). When the presence of the solder ball 77a is confirmed, it is determined that the so-called first connection point exists in the area A (S24). On the other hand, if it is determined that the solder ball 77a is not present, then the second imaging area 102b is imaged, and the solder ball 77a indicating the polarity direction is included in the captured image.
It is determined whether or not exists (S22). If the presence of the solder balls 77a is confirmed here, the area B is commonly called 1
It is determined that the connection point of No. exists (S24). On the other hand, if it is determined that the solder ball 77a does not exist, then the third imaging region 102c is imaged and it is determined whether or not the solder ball 77a indicating the polarity direction is present in the captured image (S23). ). If the presence of the solder ball 77a is confirmed here, it is determined that the so-called first connection point exists in the region C (S24). When it is determined that the solder ball 77a does not exist, it is determined that the so-called first connection point exists in the remaining area D (S24).

As described above, according to the component mounting method and the component mounting apparatus 100 of the present invention, even if the package components 75 having polarity are randomly arranged in the component supply unit 59 without paying attention to the polarity direction thereof, the circuit board Since the polarity direction of the package component 75 is corrected so as to match the specified direction at the time of mounting on the package 41, when each package component 75 is placed on the parts tray 101, the package component 75 is artificially moved. It is not necessary to align the polar directions in a certain direction.

Therefore, the preparation man-hours for arranging the package parts 75 on the parts tray 101 in a certain direction, the man-hours for inspecting the mounted circuit board 41 in the polarity direction in the subsequent process, etc. are unnecessary, and the productivity can be improved. . further,
Since erroneous mounting due to an error in the polarity direction is eliminated, a mistake in the polarity direction will not be recognized for the first time by a substrate inspection apparatus or the like in a subsequent process, and a loss time that requires a lot of time for this correction is eliminated. In this way, CSP and BG
For the mounting process for the package component 75 such as A,
A circuit board 41 that can be produced while improving its productivity
Can improve the quality of.

Of the corners of the package component 75,
When the presence of the solder ball 77a can be confirmed from the captured image of any one of the corners, the imaging and detection processing for the other corners is omitted, so that the detection processing of the solder ball 77a for one package component 75 is omitted. The time required for can be minimized.

The component recognizing device 57 of the component mounting apparatus 100 is provided below the transfer head 47 and images the package component 75 held by the transfer head 47 from the lower surface side. It is possible to perform the polarity direction determination without moving the transfer head 47 largely, and to control the polarity direction determination process easily. Further, since the motor 63 as a correcting means for correcting the sucked package component 75 drives the suction nozzle 52, which is provided on the transfer head 47 and suction-holds the package component 75, to rotate.
It is possible to consistently perform the measurement of the displacement of the suction position and the correction of the polarity direction while the package component 75 is being sucked, and thus the mounting time of the package component 75 can be shortened.

Next, as the package component 75, a QFP or SOP having a mark indicating the polar direction on the component surface is provided.
A component mounting method for mounting the same components in the same polarity direction will be described. As shown in FIG. 14A, a notch 131 as a polarity display portion may be provided at a predetermined corner of a package component 130 having a substantially square front shape such as QFP, or the like.
As shown in (b), the notch 1 is formed even for a component such as a SOP having a notch 133 as a polarity display portion on a predetermined side surface side of a substantially square front package component 132.
By recognizing 31, 133, the polarity direction of the package component can be confirmed. In addition to the above, the notch may be printed or provided with a point having a glossy surface to form the polarity display portion, but it can be recognized in substantially the same manner as the case of the notch.

As shown in FIG. 15, the notch 131 of FIG. 14 (a) is chamfered at about 45 °, and the chamfered side has a length t of about 0.5 mm. The optical magnification of the image pickup system and the number of effective pixels of the light receiving element of the camera are set so that they can be recognized.

In this way, when the notches 131 and 133 have a polarity display portion which can be recognized from the upper surface side of the package component 75, the package components 130 and 132 are placed on the parts tray 101 before being taken out from the parts tray 101. The polarity direction confirmation process is performed using the substrate recognition device 53 of the transfer head 47 as it is.

Here, FIG. 16 shows a procedure of component mounting on the package component 130. First, the board recognition device 5
The package parts 13 in the parts tray 101 by 3
The presence or absence of 0 is confirmed (S21). Next, parts tray 1
When the presence of the package component 130 in 01 is confirmed (S22), as shown in FIG. 17, a polarity direction confirmation process is performed for this package component 130 (S23). The polarity direction confirmation processing is performed here from the component front side in the same manner as the above-described method of performing imaging from the component back side.
An image is picked up by the board recognition device 53 mounted on the board. The specific polarity direction confirmation process is the same as the polarity display portion, which is the cutout 131, and is the same as the detection of the cutout 131, and thus the description thereof is omitted. When the polarity direction is confirmed, information on the polarity direction is recorded in the storage unit 72.

Subsequently, the component suction by the component mounting head 51 (S24) and the component recognition by the component recognition device 57 (S2).
5) Rotation / deviation correction of the suction position of the package component 130 is performed (S26). During this correction process, the storage unit 72
By referring to the information of the polarity direction recorded in step S1, the motor M (see FIG. 2) is driven and corrected so that the component is oriented in the normal polarity direction when mounted on the board. Then, component mounting (S27) is performed with the polar directions aligned.

According to the component mounting method of the present embodiment, since the polarity direction is recognized while the package component 130 placed on the parts tray 101 is placed, the control of the device is simplified. Further, since the board recognition device 53 used as the image pickup means is provided integrally with the transfer head 47, the transfer head 47 is moved to confirm the polarity direction of the package component 130 and suck the component to the suction nozzle 52. The distance can be shortened, which can reduce the mounting time.

In each of the above-described embodiments, the package components are mounted one by one by confirming their polar directions. However, as shown in FIG. 18A, the representative point 101a on the parts tray 101 is determined and It is also possible to perform the polarity direction confirmation processing by the board recognition device 53 only on the package component 130 arranged at the representative point 101a. This method can be applied when the package parts 130 placed on the parts trays 101 all have the correct orientation, but the orientation of the parts tray 101 itself may be erroneously supplied.

Further, as shown in FIG. 18B, before mounting the components, the board recognizing device 53 is moved in advance to the position of each package component 130 on the parts tray 101 to confirm the polar directions of all the package components 130. It is also possible to perform the processing collectively. In this case, it is not necessary to perform the polarity direction confirmation process during the actual component mounting operation, and the time required to mount the component can be shortened.

Further, as shown in FIG. 18C, all the package parts 130 on the parts tray 101 are provided by the board recognition device 53 which can be switched to the wide-angle lens or the imaging range can be changed by the zoom lens.
It is also possible to pick up the image at once and confirm the polarity direction of each package component 130 included in the picked-up image by image processing or the like. In this case, the information on the polarity direction of each confirmed package component is temporarily recorded in the storage unit 72, and the information on the polarity direction is read and corrected again when the component is mounted.
It should be noted that a wide-angle wide-angle imaging camera may be additionally provided without changing the focus of the lens. According to this method, the work of confirming the polarity direction is simplified, and the processing speed is further increased.

In each of the above embodiments, the package component 1
Before mounting the circuit board 41 on the circuit board 41, the polarity direction confirmation processing is performed and then the circuit board 41 is mounted. However, as shown in FIG. 19, after the package component 130 is mounted on the circuit board 41, the polarity direction confirmation is performed. Processing can also be performed. In this case, after the mounting is completed, the board recognition device 53 is imaged toward each mounted package component. For the circuit board 41 in which the polarity direction is not the normal direction and there are mounted components, it is recorded in the data that it is an NG product, or the unloader unit 37 excludes this circuit board 41. In this method, since the polarity direction is not checked during component mounting, the time required for component mounting can be shortened.

In the component mounting method described above, the case where the package component is mainly taken out from the parts tray 101 is shown. However, even when the package component is taken out from the parts feeder 50, the same control is performed to determine the polarity direction. Can be oriented.

[0057]

As described above, according to the component mounting method and the component mounting apparatus of the present invention, even if the components having the polarity are randomly arranged in the component supply section without paying attention to the polarity, the components can be mounted on the substrate. Since the polarities of the components are set to a predetermined position at the time of mounting, it is possible to improve the productivity and prevent erroneous mounting due to an incorrect polarity to provide a high-quality circuit board.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of a component mounting apparatus according to the present invention.

FIG. 2 is a perspective view showing a configuration of a component mounting head.

FIG. 3 is an operation explanatory diagram of a transfer head.

4 is a block diagram showing a control system of the component mounting apparatus shown in FIG.

FIG. 5 is a diagram showing a back surface of a package component.

FIG. 6 is a flowchart showing a mounting procedure of package components.

FIG. 7 is an explanatory diagram showing a state in which a package component is imaged and the presence or absence of the component is confirmed.

FIG. 8 is an explanatory diagram showing a state of sucking a package component.

FIG. 9 is an explanatory diagram showing a manner of imaging the back surface of the package component.

FIG. 10 is an explanatory diagram showing how package components are mounted on a substrate.

FIG. 11 is a diagram showing each imaging area of a package component.

FIG. 12 is an explanatory diagram illustrating a polarity direction confirmation process due to the presence of a solder ball.

FIG. 13 is a flowchart showing a polarity confirmation processing procedure.

FIG. 14 is a diagram showing an example of another package component.

FIG. 15 is an enlarged view showing the cutout of FIG.

FIG. 16 is a flowchart showing polarity direction confirmation processing in the second embodiment.

FIG. 17 is an explanatory diagram showing how to confirm the polarity direction in the second embodiment.

FIG. 18 is an explanatory diagram showing an example of polarity direction confirmation processing,
(A) is a figure which shows a case where only a representative point is imaged, (b) shows a case where all parts are imaged one by one, and (c) shows a case where all parts are imaged at once.

FIG. 19 is an explanatory diagram showing a case where polarity direction confirmation processing is performed on a component on a circuit board after mounting.

FIG. 20 is a diagram showing a state in which package parts are arranged on a conventional parts tray.

[Explanation of symbols]

41 circuit board 47 Transfer Head (Part Transfer Device) 51 Parts mounting head 52 Suction nozzle 53 Board recognition device (imaging means) 57 Parts recognition device (imaging means) 59 Parts Supply Department 63 motor (correction means) 72 memory 75,130,132 Package parts 77 Solder Ball 77a Solder ball (polarity indicator) 100 component mounting equipment

Continued front page    (72) Inventor Junichi Hata             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5E313 AA02 AA11 AA18 AA23 CC03                       CC04 EE02 EE03 EE24 EE25                       EE33 EE35 EE37 FF24 FF26                       FF28 FF32

Claims (7)

[Claims] 1. A component mounting method for picking up a component having polarity arranged in advance in a component supply unit by a component transfer means for holding and transferring the component and mounting the taken-out component at a predetermined position on the substrate. The polarity direction of the component is recognized based on the image data obtained by imaging the component, and the recognized polarity direction of the component and the polarity direction on the board on which the component is mounted are A component mounting method, characterized in that the orientation of the held component is changed so that the components are mounted. 2. A component having a substantially quadrangular shape on the front and having a polarity display portion indicating a polarity direction at any one of the corners, and a captured image obtained by sequentially capturing the corners of the component. 2. The component mounting method according to claim 1, wherein the presence / absence of the polarity display section is detected to recognize the polarity direction of the component. 3. When the polarity display unit is detected from a captured image of any one of the corners of the component,
The component mounting method according to claim 2, wherein imaging is not performed on an unimaged corner. 4. A component mounting device for picking up a component having a polarity, which is arranged in advance in a component supply unit, by a component transfer means for holding and transferring the component, and mounting the taken-out component at a predetermined position on the substrate. And a polarity recognizing unit that recognizes the polarity direction of the component by detecting the presence or absence of a polarity display unit that indicates the polarity direction of the component from an image captured by the image capturing unit, Correction means for changing the orientation of the component held by the component transfer means so that the polarity direction recognized by the polarity recognition means and the polarity direction on the board on which the component is mounted match. A component mounting apparatus comprising: 5. The component mounting apparatus according to claim 4, wherein the image pickup unit is provided below the component transfer unit, and images the component held by the component transfer unit from a lower surface side. . 6. The component mounting apparatus according to claim 4, wherein the image pickup unit is provided integrally with the component transfer unit and picks up an image of the component arranged in the component supply unit from an upper surface side. 7. The component mounting apparatus according to claim 4, wherein the correction unit rotationally drives a suction nozzle provided on the transfer head for suction-holding a component. .