JP2005277132A - Surface mounting machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten a cycle time by recognizing more efficiently a part held by a mounting head. <P>SOLUTION: Imaging units 20, 21 each having a movable table 25 movable in an X-axis direction are provided between a part supply unit 4 of a surface mounting machine and a printed circuit board 3. Cameras 26a, 26b each containing a line sensor are mounted upward and moved rotatably around an optical axis in the movable table 25. During a packaging operation, a head unit 6 is linearly moved from a part sucking position to an initial part mounting position. On the other hand, prior to the conveying of this part, the movable table 25 is disposed under a part conveying passage, and the cameras 26a, 26b are controlled to be rotatably driven so that the element train of the line sensor is crossed perpendicularly to the part conveying passage. Thus, after the part is sucked, the head unit 6 passes on the movable table 25, thereby imaging the sucked parts by the respective cameras 26a, 26b. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is a surface mounter that holds electronic components such as ICs by suction with a mounting head and transports and mounts them on a substrate such as a printed circuit board, in particular, image recognition of the suction state of the components by the mounting head. The present invention relates to a surface mounter configured to mount a component after correcting the suction position error due to the above.

  Conventionally, a surface mounter configured to adsorb electronic components such as ICs from a component supply unit by means of a movable head unit equipped with a mounting head, and transport and mount it to a predetermined position on a printed circuit board. Is generally known.

In this type of surface mounter, in order to prevent mounting defects due to component suction errors or suction position shifts (errors) due to the mounting head, the suction component is image-recognized in advance (before mounting) and the suction state is checked. If the suction position deviation exceeds the allowable range, the deviation is corrected. Generally, after picking up the parts, the head unit is placed on the camera fixed at a specific position on the base. The suction part is moved and imaged (for example, Patent Document 1).
Japanese Patent Laid-Open No. 8-24297

  However, in such a configuration, it is necessary to move the head unit once to a specific position on the base after picking up the parts, so depending on the picking position of the parts, the moving distance of the head unit becomes long and the tact time is shortened. It is disadvantageous to do. For example, after a component is picked up, the head unit is moved to the camera position once past the component mounting position, the component is recognized, and then the head unit is returned to the component mounting position and the component is mounted again. May occur. Therefore, it is necessary to improve this point.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to shorten the tact time by more efficiently recognizing the components held on the head unit mounting head.

  In order to solve the above problems, a surface mounting machine according to claim 1 of the present invention has a head unit that is movable over a component supply unit and a mounting work position provided opposite to the component supplying unit. The mounting head mounted on the head unit picks up the component from the component supply unit, transports it onto the substrate at the mounting work position, and mounts it. In a surface mounter that mounts after image recognition, the head unit is provided between the component supply unit and the mounting work position so as to be movable in a direction orthogonal to the arrangement direction of the component supply unit and the line unit. In the component supply unit, the imaging unit that images the component adsorbed by the mounting head by passing through, a changing unit that changes the direction of the line sensor, After the component is sucked by the mounting head, the head unit is driven and controlled so as to linearly transport the mounted component from the component suction position to the mounting work position, and during the component transport, the head unit is moved to the imaging unit. Control means for driving and controlling the head unit and the imaging means so as to perform a component recognition operation for imaging by the imaging means of a component that is relatively moved relative to the mounting head. However, prior to the component recognition operation, the imaging unit is arranged below the moving path of the head unit, and the changing unit is further driven and controlled so that the imaging elements are arranged in a predetermined direction with respect to the moving path of the head unit. Thus, the direction of the line sensor is changed.

  According to this surface mounter, after the component suction, the head unit linearly moves from the component suction completion position to the component mounting position, while the imaging means moves below the movement path, and the direction orthogonal to the movement path The direction of the line sensor is changed so that the image pickup elements are lined up. That is, during component transportation, the head unit moves from the component supply unit to the mounting work position at the shortest distance, and moves relative to the image pickup means in the middle. As a result, the suction component is imaged by the imaging means (line sensor).

  Further, the surface mounting machine according to claim 2 has a head unit movable between a component supply unit and a mounting work position provided opposite to the component supply unit, and the mounting head mounted on the head unit A surface mounter that picks up components from the component supply unit, transports them on the substrate at the mounting work position, mounts them, picks up the picked up components with an imaging means prior to this mounting, and recognizes the picked-up state before mounting. And reflecting the image of the component disposed between the component supply unit and the mounting work position and attracted to the mounting head of the head unit, and the reflection surface of the component supply unit and the mounting work position. An optical member that is inclined in the arrangement direction, and a head unit support member that moves integrally with the head unit in the arrangement direction of the component supply unit and the mounting work position. The support member is supported so as to be movable in a direction orthogonal to the arrangement direction of the component supply unit and the mounting work position, and is provided with a line sensor so that a component image reflected by the optical member can be captured. The imaging unit, the changing unit capable of changing the direction of the line sensor, and the component supply unit sucking the component by the mounting head and then linearly transporting the mounting component from the component suction position to the mounting work position The head unit and the image pickup means are driven and controlled so as to execute a component recognition operation for picking up the suction component of the mounting head through the optical member by the image pickup means during the component conveyance. Control means, and the control means further includes the head unit in the component recognition operation prior to the component recognition operation. The image pickup means is moved in the head unit support member to a position where an image of the suction component reflected by the optical member when passing over the optical member can be picked up, and the change means is further driven to control the head unit. The direction of the line sensor is changed so that the imaging elements are arranged in a predetermined direction with respect to the movement path.

  According to this surface mounter, after the component suction, the head unit moves linearly from the component suction completion position to the component mounting position. At this time, the head unit and the imaging unit are integrated in the arrangement direction of the component supply unit and the mounting work position, and the head unit moves relative to the imaging unit in a direction orthogonal to the arrangement direction. And the image pickup means pass above the optical member, and the direction of the line sensor is changed so that the image pickup devices are arranged in a predetermined direction with respect to the moving path of the head unit. As a result, at the time of component conveyance, the head unit moves from the component supply unit to the mounting work position at the shortest distance, and the picked-up component image reflected on the optical member (reflected by the optical member) on the way is captured by the imaging means (line sensor) It will be imaged.

  Since the imaging means is supported by the head unit support member, the positional relationship between the imaging means and the head unit (mounting head) in the arrangement direction of the component supply unit and the mounting work position is kept constant. As described above, the reflection surface of the optical member is provided so as to be inclined in the moving direction of the head unit at the time of imaging of the component. As a result, the head unit is relative to the optical member in a state where the suction component is kept at a certain height position. Is moved, the suction part image reflected on the reflecting surface moves relative to the line sensor (the suction part is simulated with respect to the line sensor), and thereby the suction part is imaged by the imaging means. It becomes possible.

  In the surface mounter, the control unit preferably drives and controls the changing unit so that the imaging elements are arranged in a direction orthogonal to the movement path as the predetermined direction. .

  In other words, if the line sensor is not arranged so that the imaging element is orthogonal to the moving path of the head unit, distortion (diagonal distortion) occurs in the obtained suction component image. From the above, it is necessary to recognize the suction state of the component. However, according to the configuration according to claim 3, the obtained suction component image is not distorted.

  Further, the surface mounting machine according to claim 4 has a head unit movable between the component supply unit and a mounting work position provided opposite to the component supply unit, and the mounting head mounted on the head unit A surface mounter that picks up components from the component supply unit, transports them on the substrate at the mounting work position, mounts them, picks up the picked up components with an imaging means prior to this mounting, and recognizes the picked-up state before mounting. A line sensor provided between the component supply unit and the mounting work position so as to be movable in a direction orthogonal to the arrangement direction and in which the image pickup elements are arranged in the moving direction, and the head unit extends upward. The imaging means for imaging the component sucked by the mounting head by passing, and the component suction after the component is sucked by the mounting head in the component supply unit The head unit is driven and controlled to linearly transport the mounting component from the mounting position to the mounting work position, and the head unit is moved relative to the imaging means during the component transport to A control unit that drives and controls the head unit and the imaging unit to perform a component recognition operation for imaging a suction component by the imaging unit, and a mounting head or a suction component image captured by the imaging unit by the component recognition operation. Image correction means for correcting according to the movement path of the head unit relative to the line sensor, and recognition means for recognizing the suction state of the component by the mounting head based on the image corrected by the image correction means, Prior to the component recognition operation, the control means further arranges the imaging means below the moving path of the head unit. Those that are configured so that.

  According to this surface mounting machine, after the component suction, the head unit moves linearly from the component suction completion position to the component mounting position, while the imaging means moves below the movement path. That is, at the time of component conveyance, the suction unit is imaged by moving relative to the imaging means (line sensor) while moving the head unit from the component supply unit to the mounting work position at the shortest distance. It becomes. At this time, the suction component does not necessarily move in a direction orthogonal to the arrangement direction of the image sensors with respect to the line sensor, and therefore, the image may be distorted in relation to the movement path. Is corrected by the image correction means.

  Further, the surface mounter according to claim 5 has a head unit that is movable between a component supply unit and a mounting work position provided opposite to the component supply unit, and a mounting head mounted on the head unit. A surface mounter that picks up components from the component supply unit, transports them on the substrate at the mounting work position, mounts them, picks up the picked up components with an imaging means prior to this mounting, and recognizes the picked-up state before mounting. And reflecting the image of the component disposed between the component supply unit and the mounting work position and attracted to the mounting head of the head unit, and the reflection surface of the component supply unit and the mounting work position. An optical member that is inclined in the arrangement direction, and a head unit support member that moves integrally with the head unit in the arrangement direction of the component supply unit and the mounting work position. A component that is provided so as to be movable in a direction orthogonal to the arrangement direction of the component supply unit and the mounting work position with respect to the support member, and that is provided with a line sensor in which imaging elements are arranged in the movement direction, and is reflected by the optical member The image pickup means provided so as to be able to pick up an image, and after the component is sucked by the mounting head in the component supply unit, the head unit is driven to linearly transport the mounted component from the component suction position to the mounting work position. Control means for driving and controlling the head unit and the imaging means to perform a component recognition operation for imaging the suction component of the mounting head via the optical member by the imaging means during the component conveyance, A mounting head or suction component image picked up by the image pickup means by a component recognition operation is used as a head unit for the line sensor. Image correction means for correcting according to the movement path of the image, and recognition means for recognizing the suction state of the component by the mounting head based on the image corrected by the image correction means. Prior to the component recognition operation, the imaging unit in the head unit support member at a position where an image of the suction component reflected by the optical member when the head unit passes over the optical member in the component recognition operation can be captured. Is configured to move.

  According to this surface mounter, after the component suction, the head unit moves linearly from the component suction completion position to the component mounting position. At this time, the head unit and the imaging unit are integrated in the arrangement direction of the component supply unit and the mounting work position, and the head unit moves relative to the imaging unit in a direction orthogonal to the arrangement direction. The unit and the imaging means pass over the optical member. As a result, at the time of component conveyance, the head unit moves from the component supply unit to the mounting work position at the shortest distance, and the suction component reflected on the optical member (reflected by the optical member) is imaged by the imaging means (line sensor). Will be. In this configuration, similarly to the second aspect, the suction component image reflected on the reflecting surface moves relative to the line sensor (the suction component is simulated with respect to the line sensor). It becomes possible to image the suction component from the imaging means. In addition, the suction component does not necessarily move in a direction orthogonal to the direction in which the image sensors are arranged with respect to the line sensor. Therefore, the image may be distorted in relation to the movement path. Distortion is corrected by the image correction means.

  In the surface mounting machine according to claim 2 or 5, the optical member is provided to be movable in a direction orthogonal to the arrangement direction of the component supply unit and the mounting work position, and the control means further includes the optical member. It is preferable that the optical member and the imaging unit are interlocked according to the movement path of the head unit during component conveyance so that the component can be imaged by the imaging unit while being driven and controlled. (Claim 6).

  In this surface mounter, the optical member moves in a region between the component supply unit and the mounting work position, and the optical member and the imaging unit move as a pair so that the picked-up component can be imaged.

  In this configuration, a holding member that movably holds the optical member is provided, and an illumination device that provides illumination for imaging by the imaging unit is provided integrally with at least one of the holding member or the optical member. It is more preferable (Claim 7).

  According to this configuration, illumination can be provided from a position close to the subject (suction part), and the influence on the image due to distortion of the reflecting surface can be reduced by using a small optical member. It becomes possible.

  The surface mounting machine according to claim 1, wherein the head unit includes a plurality of mounting heads, and the line sensor is mounted on each mounting head while the head unit moves along the moving path. It is preferable that the number of image pickup elements capable of picking up images of the parts adsorbed on the surface is provided.

  According to this configuration, it is possible to pick up an image of each suction component and to recognize the suction state thereof while conveying a plurality of suction components at the shortest distance at a time.

  According to the surface mounting machine according to any one of claims 1 to 8, the suction component is linearly transported from the component suction operation completion position to the first component mounting position using a device equipped with a line sensor as an imaging means for the suction component. However, because it is configured to image the part in the middle, always transport the part from the part supply unit to the mounting work position at the shortest distance, regardless of where the part adsorption operation completion position by the head unit is In addition, it is possible to image-recognize the suction state of the component without the operation of temporarily stopping the component during conveyance. Therefore, after picking up the components, the head unit is moved to a specific position on the base and then the component recognition process needs to be performed. As a result, the tact time can be effectively shortened.

  The best mode for carrying out the present invention will be described with reference to the drawings.

  1 and 2 schematically show a first embodiment of a surface mounter (hereinafter abbreviated as a mounter) according to the present invention. As shown in the figure, a printed circuit board conveying conveyor 2 is disposed on a base 1 of the mounting machine, and the printed circuit board 3 is conveyed on the conveyor 2 to a predetermined mounting work position (shown in the figure). It stops at the position of the printed circuit board. In the present embodiment, the printed circuit board 3 is carried in from the right side of FIGS. 1 and 2 and carried out to the left side.

  On both sides of the conveyor 2, component supply units 4 are arranged. In these component supply units 4, for example, multiple rows of tape feeders 4a (component suction points) are arranged in the X-axis direction. Each tape feeder 4a is configured such that small chip components such as ICs, transistors, capacitors, etc. are accommodated at predetermined intervals, and the held tape is led out from the reel. It is configured to intermittently feed out the parts as it is taken out.

  Above the base 1, a head unit 6 for component mounting is provided. The head unit 6 is movable over the component supply unit 4 and the mounting work position where the printed circuit board 3 is located, and the X-axis direction (the direction of the conveyor 2) and the Y-axis direction (the direction perpendicular to the X-axis on the horizontal plane). ) Can be moved to.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. The nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The Y-axis servo motor 9 and the X-axis servo motor 15 are provided with encoders 9a and 15a, respectively, so that the movement position of the head unit 6 is detected.

  The head unit 6 is provided with a plurality of mounting heads 16 configured in an axial shape. In this embodiment, the six mounting heads 16 are arranged in a line at equal intervals in the X-axis direction. It is mounted in the state. In the following description, when it is necessary to distinguish each mounting head 16 in particular, the first mounting head, the second mounting head, etc. in order from the right end (substrate carry-in side) in FIGS. It will be referred to as 6 mounting head.

  These mounting heads 16 can be moved in the Z-axis direction and rotated around the R-axis (nozzle center axis) with respect to the frame of the head unit 6, respectively, and ascending / descending drive means using a servo motor as a drive source and rotation It is driven by driving means. Each mounting head 16 is provided with a suction nozzle 16a at its tip (lower end), and negative pressure is supplied to the tip of the suction nozzle from a negative pressure supply means (not shown). Parts are attracted by suction force.

  On the base 1, when the head unit 6 is further moved between the component supply unit 4 and the mounting work position, a pair of imaging units for imaging the components adsorbed by the mounting head 16 from directly below. Units 20 and 21 are provided.

  As shown in FIGS. 1 and 3, the imaging units 20 and 21 are provided in each space between the conveyor 2 and the component supply units 4 on both sides thereof, and a pair of cameras for imaging the suction components, respectively. 26a, 26b (imaging means) and the illuminating device 27 are integrally moved in the X-axis direction. That is, in the space between the conveyor 2 and the component supply unit 4 on the base 1, the X-axis direction is driven to rotate by a pair of parallel fixed rails 22 extending in the X-axis direction and the servomotor 23. The ball screw shaft 24 is provided. A movable table 25 is movably mounted on the fixed rail 22, and the ball screw shaft 24 is screwed into the movable table 25. The cameras 26a and 26b and the illumination device 27 are integrally mounted on the movable table 25, and the cameras 26a and 26b and the like are integrated with the movable table 25 along the fixed rail 22 by the operation of the servo motor 23. Configured to move in the direction. The servo motors 23 of the imaging units 20 and 21 are each provided with an encoder 23a (shown in FIG. 5), so that the moving position of the movable table 25 is detected.

  Each of the cameras 26 a and 26 b is a camera incorporating a CCD line sensor and an imaging lens, and is provided upward with respect to the movable table 25. Further, as schematically shown in FIG. 4, these cameras 26a and 26b are supported so as to be rotatable around the optical axis (Z axis) with respect to the movable table 25, and a servo motor 30 (see FIG. 5) is supported. It is configured to be rotationally driven in the same direction by the same angle by a rotational drive mechanism as a drive source. That is, in this embodiment, the controller 30 and the rotation mechanism constitute the changing means of the present invention that changes the orientation of the imaging means. In FIG. 4, reference numerals 260a and 260b denote element lines of CCD line sensors built in the cameras 26a and 26b. Each camera 26a, 26b is provided with a slit facing the element row for guiding only light in a certain direction to the element row.

  As shown in FIG. 3, the illuminating device 27 has a plurality of LEDs 27a disposed over the entire circumference of the cameras 26a and 26b. These LEDs 27a are fixed to the movable table 25 so as to be directed obliquely upward toward the optical axes of the cameras 26a and 26b. That is, when the head unit 6 passes above the movable table 25, the illumination light emitted from the LED 27a is reflected by the lower surface of the component adsorbed by the mounting head 16, and the reflected light is CCD of the cameras 26a and 26b. By being incident on the line sensor, the lower surface image (directly below image) of the suction component is captured.

  In the present embodiment, the image of the component adsorbed by the first to third mounting heads 16 among the mounting heads 16 forms an image on the CCD line sensor (imaging device) of the camera 26a on one side. The number of CCD line sensor elements in the cameras 26a and 26b is set so that the image of the suction component of the fourth to sixth mounting heads 16 is formed on the CCD line sensor (imaging element) of the camera 26b on the other side. An optical system such as a lens is configured.

  FIG. 5 is a schematic block diagram showing the control system of the mounting machine.

  The mounting machine of this embodiment is composed of a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU in advance, a RAM that temporarily stores various data during operation of the apparatus, and the like. The controller 40 is provided. The controller 40 includes a main control unit 42, an axis control unit 44, an imaging unit drive control unit 45, an illumination control unit 46, a camera control unit 47, a camera posture switching control unit 48, and an image processing unit 49 as functional configurations. Yes.

  The main control unit 42 controls the operation of the mounting machine in an integrated manner, and controls the drive of the servo motors 9 and 15 and the like via the axis control unit 44 so as to operate the head unit 6 and the like according to a program stored in advance. At the same time, the suction state of the component based on the component images picked up by the cameras 26a and 26b, specifically, the suction displacement amount in the X-axis and Y-axis directions with respect to the nozzle center and the suction displacement around the nozzle center axis (R-axis). The amount is calculated.

  At the time of mounting, as described later, the head unit is based on board information stored in a mounting data storage unit (not shown), that is, information on the type of the printed circuit board 3 and the type and mounting position of components mounted thereon. 6 is used to obtain a part conveyance path (movement path of the head unit 6), and based on this movement path, the imaging positions (coordinate positions) of the cameras 26a and 26b and the orientations of the cameras 26a and 26b (rotation angles around the optical axis) ) Is calculated. Specific operation control of the mounting machine will be described later.

  The axis control unit 44 drives and controls the Y-axis servo motor 9 and the X-axis servo motor 15 while detecting the current position (X, Y) of the head unit 6 based on signals from the encoders 9a and 15a. Move to a predetermined position. Although not shown, the shaft control unit 44 similarly performs drive control on the servo motors of the elevation drive means and the rotation drive means of the mounting head 16.

  The imaging unit drive control unit 45 drives and controls the servo motor 20 to detect the current position (X coordinate) of the movable table 25 (cameras 26a and 26b) based on a signal from the encoder 23a, thereby moving the movable table 25 to the imaging position. Move to.

  The illumination control unit 46 and the camera control unit 47 drive and control the illumination device 27 and the cameras 26a and 26b mounted in the imaging units 20 and 21.

  The camera attitude switching control unit 48 controls the rotation of the cameras 26a and 26b, and controls the driving of the servo motor 30 while detecting the rotation angle position of the cameras 26a and 26b based on a signal from the encoder 30a incorporated in the servo motor 30. As a result, the cameras 26a and 26b are rotated to change the direction, that is, the arrangement direction of the element arrays 260a and 260b.

  The image processing unit 49 generates image data suitable for component recognition by performing predetermined processing on the image signals output from the cameras 26 a and 26 b and outputs the image data to the main control unit 42.

  Next, an example of operation control of the mounting machine by the controller 40 will be described with reference to the flowchart of FIG.

  In the mounting operation, first, suction component information from the board information stored in the mounting data storage unit of the controller 40, that is, the type of the target component first taken out from the component supply unit 4, the position of the tape feeder 4a to which the target component is supplied, Information on the type of the target component, the position of the mounting head 16 that sucks the component, the suction order, and the like, and the mounting position information on the mounting position, the mounting order, etc. of the target component on the printed circuit board 3 are read (step S1, S1). S2).

  Then, a conveyance path of the component in which the final component suction position in the component supply unit 4 and the first component mounting position on the printed circuit board 3 are connected by a straight line is obtained, and the suction components are imaged by the cameras 26a and 26b based on the conveyance path. The position and the rotation angle of the cameras 26a and 26b are obtained (step S3). Specifically, the imaging position is obtained so that the cameras 26a and 26b can be arranged below the transport path of the head unit 6, and the element lines 260a and 260b of the CCD line sensor are arranged as the head unit as shown by the solid line in FIG. 6, the rotation angles of the cameras 26 a and 26 b are obtained so as to be orthogonal to the parts transport path R.

  Next, the servo motor 23 is driven and controlled to move the movable table 25 so that the cameras 26a and 26b are arranged at the imaging position, and the servo motor 30 is driven and changed to change the orientation of the cameras 26a and 26b ( Step S4).

  In step S <b> 5, the head unit 6 is moved to the component supply unit 4, and components are sucked from the tape feeder 4 a by each mounting head 16. At this time, if possible, the components are sucked from the tape feeder 4a by the plurality of mounting heads 16 at the same time. Note that steps S3 and S4 may be performed in parallel with step S5.

  When the suction of the components by all the mounting heads 16 is completed, it is determined whether or not the cameras 26a and 26b are arranged at the imaging position (step S6). If YES is determined here, the component supply unit 4 is determined. The head unit 6 is moved linearly along the component conveyance path obtained in step S3 from the head to the printed circuit board 3 and the lighting unit 27 is controlled to be turned on during the movement, so that the head unit 6 is controlled by the camera 26a. , 26b, the components picked up by the mounting heads 16 are imaged (step S7). That is, when the head unit 6 passes through the cameras 26a and 26b, the illumination device 27 is turned on, whereby the illumination light is reflected by the lower surface of the suction component, and the reflected light enters the cameras 26a and 26b. With each movement, the suction component image for one line in the main scanning direction (direction of the element rows 260a and 260b) is continuously displayed in the sub-scanning direction (direction perpendicular to the element rows 260a and 260b; component conveyance direction). The image is picked up by 26b. At this time, the suction component by the first to third mounting heads 16 is imaged by the camera 26a on one side, and the suction component by the fourth to sixth mounting heads 16 is imaged by the other camera 26b. That is, the element rows 260a and 260b of the CCD line sensors of the cameras 26a and 26b have a sufficient number of elements that can capture all the suction component images of the first to sixth mounting heads 16 together. Furthermore, depending on the orientation of the cameras 26a and 26b and the component conveying direction, it may happen that the suction component of either the third or fourth mounting head 16 or both is imaged by the cameras 26a and 26b. In this case, however, the suction part images of the first to sixth mounting heads 16 are taken out in an identifiable manner in the course of image processing.

  After passing over the cameras 26a and 26b, the suction state of the component by each mounting head 16 is image-recognized based on the image of each suction component, and the components around the X, Y, and R axes of the suction nozzle 16a. A suction position error is obtained, and correction amounts (ΔX, ΔY, ΔR) are calculated based on this error (step S8). Then, the target position is reset based on the correction amount, and the head unit 6 is driven and controlled according to the reset target position, so that the components sucked by the mounting heads 16 are sequentially placed on the printed circuit board 3. (Step S9).

  Next, it is determined whether or not all mounting processes on the printed circuit board 3 have been completed (step S10). If NO is determined here, the next suction component information is read and the last component on the printed circuit board 3 is read. The movement path of the head unit 6 that connects the position where the sensor is mounted and the tape feeder 4a that next sucks the component with a straight line is obtained (step S12), and the imaging position (position where the cameras 26a and 26b are to be disposed) is determined based on this movement path. ) Is calculated (step S13), and the servomotor 23 is driven and controlled to move the movable table 25 so as to place the cameras 26a and 26b at the imaging positions (step S14). In steps S13 and S14, similarly to the processes in steps S3 and S4, the rotation angles of the cameras 26a and 26b are obtained so that the element lines 260a and 260b of the CCD line sensor are orthogonal to the movement path of the head unit 6. The servo motors 23 and 30 are driven and controlled.

  Then, it is determined whether or not the cameras 26a and 26b are arranged at the imaging position (step S15). If YES is determined here, the head unit 6 is moved along the movement path obtained in step S13. Each mounting head is moved while the head unit 6 passes over the cameras 26a and 26b by moving the mounting device from the mounting work position (printed circuit board 3) to the component supply unit 4 and controlling the lighting device 27 during lighting. The imaging process of the 16 suction nozzle tips is performed (step S16).

  Next, it is determined whether or not there is a component carried from the mounting operation position to the component supply unit 4 without being mounted based on the tip image of each mounting head 16 (component take-out check), and whether or not the tip of the suction nozzle 16a is dirty ( (Nozzle dirt check) is performed (steps S17 and S18), and if NO is determined, for example, it can be determined that the take-out of the component has occurred because the contour of the tip image clearly matches the contour of the component. If it can be determined that solder or the like is attached to the tip of the nozzle 16a, the process proceeds to step S19, where a display device (not shown) such as a liquid crystal display is operated to display an error and the mounting machine is operated. Then, the voice device (not shown) is activated to call the operator's attention.

  In response to this, the operator determines whether or not a predetermined recovery process has been performed (step S20). If YES is determined, the process proceeds to step S21, and all mounting processes on the printed circuit board 3 are completed again. Determine whether or not. If NO is determined here, the process proceeds to step S2 to proceed to the next component mounting operation. On the other hand, if it is determined YES, the printed circuit board 3 at the mounting work position is unloaded and this flowchart is ended.

  If YES is determined in step S10, information (reset position information) relating to the predetermined standby position of the head unit 6 is read (step S11), and then the process proceeds to step S13. That is, when the process of step S11 is performed, the imaging position (the positions of the cameras 26a and 26b) is calculated based on the reset position information in step S13, and the cameras 26a and 26b are arranged at the obtained imaging positions. Therefore, the movable table 25 is moved. Specifically, the movement path of the head unit 6 that connects the position where the component was last mounted on the printed circuit board 3 and the reset position of the head unit 6 with a straight line is obtained, and the cameras 26a and 26b can be arranged below this path. The rotation angle of each camera 26a, 26b is determined so that the element line 260a, 260b of the CCD line sensor is orthogonal to the movement path of the head unit 6, and the servo motors 23, 30 are driven and controlled. Will be.

  In the above flow chart, the same determination result is always obtained in step S10 and step S21. That is, if NO in step S10, NO is determined in step S21, and if YES in step S10, YES is determined in step S21. Further, in order to determine whether or not to end in step S10, information for determining whether or not to end is necessary as a premise. In this case, it is possible to recognize that it is the last suction component information in the next suction component information given in step S12, and to recognize that it is the end (final part) when the suction is finished in step S5. Alternatively, the information on the reset position (standby position) of the head unit 6 and the fact that there is no next suction component is given as the suction component information after all necessary component mounting has been completed in the board information itself. By doing so, steps S10 and S11 can be omitted. In this case, what is necessary is just to make it transfer to step S12 after step S9.

  FIG. 7 shows a summary of the mounting operations as described above. First, the head unit 6 moves to the component supply unit 4 to absorb the component, and moves linearly from the component supply unit 4 to the mounting work position on the printed circuit board 3. At this time, the movable table 25 (cameras 26 a and 26 b) moves below the component conveyance path, so that the head unit 6 is attracted to each mounting head 16 while moving from the component supply unit 4 onto the printed circuit board 3. The part is imaged (operation indicated by [1] in the figure). When the component mounting is completed, the head unit 6 linearly moves from the mounting position to the component supply unit 4 or the standby position, and at this time, the movable table 25 (cameras 26a and 26b) moves below the moving path. As a result, the tip of each suction nozzle 16a is imaged while the head unit 6 moves from the printed circuit board 3 to the component supply unit 4 or the like (operation indicated by [2] in the figure). In any recognition operation, the orientations of the cameras 26a and 26b are controlled so that the element lines 260a and 260b of the CCD line sensor are orthogonal to the movement path of the head unit 6.

  As described above, in this mounting machine, the cameras 26a and 26b having line sensors are provided between the component supply unit 4 and the mounting work position (printed circuit board 3) so as to be movable in the X-axis direction. The head unit 6 is linearly moved from the position where the component is picked up to the first component mounting position, and prior to this component transport, the CCD line sensor element rows 260a and 260b are orthogonal to the moving path of the head unit 6. As described above, the cameras 26a and 26b are moved downward in the movement path with the orientations of the cameras 26a and 26b set, so that the position of the component suction by the head unit 6 is always at any position. The parts can be transported from the parts supply unit to the mounting work position at the shortest distance, and the parts are temporarily stopped during the transportation. Ukoto no can image recognize attracted state of the component. Therefore, after picking up the components, the head unit is moved to a specific position on the base and then the component recognition process needs to be performed. As a result, the tact time can be effectively shortened.

  In addition, after the component is mounted on the printed circuit board 3, the tip of the mounting head 16 (suction nozzle 16a) is image-recognized in the same procedure as the recognition of the suction component by the mounting head 16, thereby determining whether the component has been brought home. Since it is configured to determine (determining whether the mounting operation is good or not), it is possible to prevent the occurrence of trouble such as the operation being continued with a mounting failure (miss) occurring. In addition, even if no parts are taken home, it is configured to further determine the presence or absence of nozzle contamination. Can also be avoided in advance. Therefore, necessary components can be reliably and accurately mounted on the printed circuit board 3.

  In this embodiment, the two cameras 26a and 26b mounted on the movable table 25 are arranged in a line in the X-axis direction, but may be arranged slightly shifted in the Y-axis direction, for example. That is, regardless of the movement path of the head unit 6 according to the specific configuration such as the number of arrangements of the tape feeders 4a and the distance between the tape feeders 4a and the printed circuit board 3, The suction parts of the mounting head 16 can be appropriately imaged by the camera 26a on one side, and the suction parts of the third to sixth mounting heads 16 can be appropriately imaged by the camera 26b on the other side. What is necessary is just to set the arrangement direction.

  In addition, the orientation of the cameras 26a and 26b with respect to the movement path (part conveyance path) of the head unit 6 when picking up the suction component is not necessarily limited to the direction in which the element rows 260a and 260b are orthogonal to the conveyance path. The direction may be close to. For example, as shown in FIG. 4B, R, [b] is a component transport path that connects the last component suction position ([a] position) and the first component mounting position ([b] position) with a straight line. When the axis parallel to the Y axis passing through the position is Y ′, the angle between the axis Y ′ and the transport path R is θ, and the element rows 260a and 260b are aligned in the X-axis direction, the element rows 260a and 260b are An axis parallel to the X axis passing through is X ′, an intersection of the axis X ′ and the transport path R is O, and a direction passing through the point O and perpendicular to the transport path R is L. Both cameras so that the element rows 260a and 260b coincide with each other in an arbitrary direction passing through the point O within the range of the angle θ in both the forward and reverse directions (that is, the range surrounded by the axis X ′ and the line segment L ′ in the drawing). The direction of 26a and 26b may be set. If it is within this range, the degree of distortion of the image is comparatively small, so that it is possible to easily obtain an image of a suction part or the like close to the substance by distortion correction.

  In addition to changing the direction of the two cameras 26a and 26b for each path according to the transport path R, for example, according to the angle formed by the X axis and the transport path R, both cameras are within a certain range. 26a and 26b may be set in a fixed direction. In this case, a table in which the range of the angle between the X axis and the transport path R and the orientations of both cameras 26a and 26b in the range is stored in advance, and both the cameras 26a are stored in accordance with the transport path R and this table. , 26b may be switched and controlled. According to this, it becomes possible to reduce the burden of switching control of the orientations of both cameras 26a and 26b.

  Next, a second embodiment of the surface mounter according to the present invention will be described with reference to FIGS. 1 to 3 and FIG.

  The overall configuration of the mounting machine according to the second embodiment is the same as that of the mounting machine according to the first embodiment shown in FIGS. 1 to 3 except for the following points. That is, in the mounting machine of the second embodiment, the cameras 26a and 26b of the imaging units 20 and 21 are fixedly provided on the movable table 25, and the configuration is different from the first embodiment in this respect. . Specifically, the cameras 26a and 26b are fixedly provided with respect to the movable table 25 in a state where the element rows 260a and 260b of the CCD line sensors are arranged in a line in the X-axis direction. The rotational drive mechanism of the cameras 26a and 26b as in the embodiment is not provided.

  FIG. 8 is a schematic block diagram showing a control system of the mounting machine according to the second embodiment.

  Similarly to the controller 40 of the first embodiment, the controller 40 ′ of the second embodiment also has a main controller 42, an axis controller 44, an imaging unit drive controller 45, an illumination controller 46, a camera controller 47, and an image. The processing unit 49 is included as a functional configuration, and the main control unit 42 controls the drive of the servo motors 9, 15 and the like via the axis control unit 44 so as to operate the head unit 6 and the like according to a program stored in advance. In addition, the component suction position error is calculated based on the component images captured by the cameras 26a and 26b. However, the configuration is different from the controller 40 of the first embodiment in the following points.

  In the second embodiment, since the cameras 26a and 26b are fixedly provided with respect to the movable table 25 as described above, the camera posture switching control unit 48 as in the first embodiment is not provided, but instead. The image processing unit 49 includes a skew distortion correction unit 49a. When the head unit 6 is moved in an oblique direction with respect to the element array of the line sensor 22, the skew distortion correcting unit 49 a is picked up in a state where each suction component image is obliquely distorted. The distortion is corrected in accordance with the movement path of the center of each nozzle at the time of imaging the component. This point will be described later.

  The operation control of the mounting machine by the controller 40 'of the second embodiment is the same as the operation control of the first embodiment described using the flowchart of FIG. 6 except for the rotational drive control of the cameras 26a and 26b. That is, after the component is sucked from the component supply unit 4 by the head unit 6, the head unit 6 is linearly moved from the final component suction position to the first mounting placement on the printed circuit board 3, and the camera is moved prior to this movement. By moving the parts 26a and 26b (movable table 25) below the moving path of the head unit 6, the head unit 6 is moved relative to the cameras 26a and 26b after picking up the parts, thereby picking up the picked-up parts. The image of the suction state is recognized. In addition, after the component suction, the head unit 6 is linearly moved from the mounting position to the component supply unit 4 or the standby position, and the camera 26a, 26b (movable table 25) is moved along the movement path of the head unit 6 prior to this movement. By moving downward, after mounting the component, the tip of the suction nozzle 16a is imaged and its state is recognized.

  In the mounting machine of the second embodiment, since the cameras 26a and 26b are fixedly provided on the movable table 25b in the imaging units 20 and 21, as described above, the movement path of the head unit 6 with respect to the cameras 26a and 26b. Depending on the case, the part image may be distorted. That is, when the head unit 6 moves in a direction orthogonal to the element rows 260a and 260b of the CCD line sensor (that is, the Y-axis direction), the component image is not distorted, but is oblique to the element rows 260a and 260b. When moving to, the component image is distorted in a diamond shape according to the angle formed by the moving direction and the element rows 260a and 260b.

  Therefore, in the second embodiment, such image distortion is corrected by the distortion correction unit 49a, and the component suction state is recognized based on the corrected image. As a specific method for correcting image distortion, for example, a method disclosed in a previous application (Japanese Patent Application No. 2003-382691) of the applicant of the present application is applied. Specifically, the main control unit 42 obtains an angle formed by the velocity vector of the head unit 6 during component conveyance and its X-axis direction component, and based on this angle, the skew distortion correction unit 49a actually obtained it. Image distortion is corrected by performing coordinate conversion of the suction component image. That is, in the present embodiment, the image processing unit 49 (skew distortion correction unit 49a) functions as the image correction unit of the present invention, and the main control unit 42 functions as the recognition unit of the present invention.

  Also in the mounting machine according to the second embodiment as described above, the head unit 6 is always moved from the component supply unit to the mounting work position at the shortest distance after the component suction regardless of the final component suction position. The image of the suction state of the component can be recognized. Therefore, similarly to the mounting machine of the first embodiment, the suction component can be recognized efficiently, and as a result, the tact time can be effectively shortened.

  However, in the second embodiment, since the cameras 26a and 26b are fixedly provided on the movable table 25 as described above, the rotation drive mechanism and the like of the cameras 26a and 26b are not required. Compared with the embodiment, the configuration of the imaging units 20 and 21 can be simplified and reduced in price. Further, since the rotational drive control of the cameras 26a and 26b is not required, there is an advantage that the control burden on the main control unit 42 is reduced.

  By the way, in the first and second embodiments described above, the cameras 26a and 26b are fixed upward on the movable table 25 of the imaging units 20 and 21, and the suction parts are directly imaged by the cameras 26a and 26b. For example, as shown in FIG. 9, the total reflection mirror 29 is provided on the movable table 25 in an inclined posture, and the cameras 26 a and 26 b are mounted on the movable table 25 so as to capture the suction part image reflected on the mirror 29 from the side. It is good also as the structure which carried out. For example, in the configuration of the cameras 26a and 26b, when the camera 26a and 26b are provided upward as in the above embodiment, the occupied space in the Z-axis direction becomes large, by adopting the configuration shown in FIG. There is an advantage that the entire movable table 25 including the cameras 26a and 26b can be made compact in the Z-axis direction. The mirror 29 is attached so that the normal line of the mirror 29 divides the angle formed by the optical axis (horizontal) of the cameras 26a and 26b and the Z axis into two equal parts. Further, in this configuration, as an optical member for reflecting (reflecting) the suction component, a half mirror, a prism, or the like may be used in addition to the total reflection mirror 29.

  Next, a third embodiment of the surface mounter according to the present invention will be described with reference to FIGS. The basic configuration of the mounting machine of the third embodiment is the same as that of the mounting machine of the first embodiment. Therefore, common parts are denoted by the same reference numerals, description thereof is omitted, and only differences are described below. Will be described in detail.

  As shown in FIGS. 10 to 12, in the third embodiment, a camera unit is used instead of the imaging units 20 and 21 of the first embodiment as a configuration for imaging the component sucked by the mounting head 16. 50, a mirror 62, and the like.

  The camera unit 50 is integrally provided with a pair of cameras 52a and 52b incorporating a CCD line sensor and an illuminating device 51, and is supported by the lower surface of the support member 11 along the X axis along the support member 11. It is provided to be movable in the direction.

  More specifically, the lower surface of the support member 11 is provided with a fixed rail 55 extending in the X-axis direction and a ball screw shaft 57 in the X-axis direction that is rotationally driven by a servo motor 56. 50 is movably mounted and the ball screw shaft 57 is screwed into the camera unit 50. With this configuration, when the servo motor 56 is operated, the camera unit 50 is configured to move along the fixed rail 55 in the X-axis direction. The servo motor 56 is fixed to the support member 11 while being arranged in the Y-axis direction with respect to the ball screw shaft 57, and is configured to drive the ball screw shaft 57 by, for example, a belt transmission mechanism. . That is, a drive pulley 58a is mounted on the output shaft of the servo motor 56, a pulley 58b is mounted on the ball screw shaft 57, and a drive belt 59 is mounted across the pulleys 58a and 58b.

  Each of the cameras 52a and 52b is a camera incorporating a CCD line sensor, an imaging lens, and the like, and is obliquely downward with respect to the camera unit 50. Specifically, the camera 52a and 52b is disposed above a mirror 62 described later provided on the base 1. When the head unit 6 moves, the head unit 6 is fixed obliquely downward with respect to the camera unit 50 at an angle at which a suction component image reflected on the mirror 62 can be captured. The cameras 52a and 52b are supported so as to be rotatable around the optical axis with respect to the camera unit 50, and are rotated at the same angle in the same direction by a rotation drive mechanism using a servo motor 60 (see FIG. 13) as a drive source. It is configured to be rotationally driven only in conjunction with each other. That is, in this embodiment, the controller 60, the rotation mechanism, and the like constitute the changing means of the present invention that changes the orientation of the imaging means.

  In this embodiment as well, an image of a component sucked by the first to third mounting heads 16 among the suction component images reflected on the mirror 62 is formed on the CCD line sensor (imaging device) of the camera 52a on one side. On the other hand, the number of elements of the CCD line sensor in each of the cameras 52a and 52b so that the image of the component attracted by the fourth to sixth mounting heads 16 is formed on the CCD line sensor (imaging element) of the camera 52b on the other side. And an optical system such as a lens is configured.

  Although not shown in detail, the illuminating device 51 has a plurality of LEDs 51a arranged around both cameras 52a and 52b. These LEDs 51a are fixed to the camera unit 50 in a state of being directed downward in parallel with the optical axes of the cameras 52a and 52b, and when the head unit 6 moves above the mirror 62 described later, The mounting head 16 is configured to irradiate illumination light from below.

  When the head unit 6 moves from the component supply unit 4 to the printed circuit board 3 in the space between the conveyor 2 and the component supply unit 4 on the base 1, each mounting head 16 (suction nozzle 16 a ) Is provided with a pair of mirrors 62 and 62 (optical members) for projecting (reflecting) a directly below image (bottom surface image) of the component adsorbed on.

  These mirrors 62 are rectangular total reflection mirrors that are elongated in the X-axis direction. As shown in FIG. 12, when the mounting heads 16 are positioned above the mirrors 62, the mirrors 62 are connected to the cameras 52a and 52a, respectively. In a state where the reflecting surface is directed upward so as to be directed to 52b, and in an inclined posture that is inclined downward from the front side of the apparatus to the rear side (from the lower side to the upper side in FIG. 10), in detail, the normal line of the mirror 62 is It is fixedly provided in each space between the conveyor 2 and the component supply unit 4 at an angle that bisects the angle between the optical axis M1 of the cameras 52a and 52b and the Z axis.

  Each mirror 62 has a length dimension in the X-axis direction so as to include at least the component supply unit 4, and a component adsorbed by the mounting head 16, specifically, a component of the maximum size among the mounted components The length dimension in the Y-axis direction (inclination direction) is set so that the entire directly below image (bottom surface image) of the part is reflected (reflected) when adsorbed.

  FIG. 13 is a schematic block diagram showing a control system of the mounting machine according to the third embodiment.

  Similarly to the controller 40 of the first embodiment, the controller 41 of the third embodiment includes a main control unit 42, an axis control unit 44, an illumination control unit 46, a camera control unit 47, and an image processing unit 49 as functional configurations. In order to operate the head unit 6 and the like according to a program stored in advance, the main control unit 42 controls the drive of the servo motors 9 and 15 and the like via the axis control unit 44 and the cameras 52a and 52b. A component suction position error is calculated based on a captured component image. However, the configuration is different from the controller 40 of the first embodiment in the following points.

  First, the main control unit 42 is configured to cause the camera unit 50 and the head unit 6 to execute a predetermined component recognition operation for imaging a component adsorbed by the mounting head 16 during the mounting operation. Servo motors 9, 15, 56 and the like are driven and controlled via a camera unit drive controller 61 which will be described later. Detailed component recognition operation will be described later in detail.

  Further, a camera unit drive control unit 61 is provided in place of the imaging unit drive control unit 45 of the first embodiment. The camera unit drive control unit 61 drives the servo motor 56 to control the camera unit 50 in a predetermined manner while detecting the current position (X coordinate position) of the camera unit 50 based on a signal from an encoder 56a incorporated in the servo motor 56. It moves to the imaging position.

  Further, an image processing unit 49 including a mirror distortion correction unit 49b and a magnification correction unit 49c is provided.

  The mirror distortion correction unit 49b performs image correction based on the imaging position on the mirror 62 by the cameras 52a and 52b and the distortion component data stored in the storage unit (not shown). That is, the storage unit measures how much the image reflected on the mirror 62 is shifted from the reference position due to the image distortion component of the mirror 62 by dividing the reflection surface of the mirror 62 into a plurality of partial areas. Data is stored in advance, and the mirror distortion correction unit 49b performs image correction based on the imaging position and distortion component data of the partial region corresponding to the position. For example, a distortion obtained by reversing the positive / negative of the distortion component is applied to the picked-up image of the suction component, thereby removing the distortion.

  The magnification correction unit 49c corrects a magnification error that occurs in the picked-up component image captured based on a component recognition operation described later. This point will be described later.

  In the controller 41 of the third embodiment, the illumination control unit 46 includes the illumination device 51 of the camera unit 50, the camera control unit 47 includes the cameras 52 a and 52 b of the unit 50, and the camera posture switching control unit 48. Are electrically connected to a servo motor 60 of the unit 50 and an encoder 60a built in the motor 60.

  Here, a method for recognizing the suction component in the mounting machine of the third embodiment will be described in detail. In the following description, for the sake of convenience, the case where the head unit 6 is moved straight in the Y-axis direction and the orientations of the cameras 52a and 52b are controlled so that the element lines of the CCD line sensor are aligned in the X-axis direction will be described. To do.

  In the third embodiment, the suction member images of the mounting heads 16 reflected on the mirror 62 are captured by the cameras 52a and 52b while the support member 11 is moved in the Y-axis direction with respect to the mirror 62. In this case, since the head unit 6 and the camera unit 50 are both supported by the support member 11 as described above and move integrally in the Y-axis direction, the suction parts are imaged by the cameras 52a and 52b (CCD line sensors). However, as a result of providing the mirror 62 on the base 1 in an inclined posture as described above, the suction parts are moved relative to the mirror 62 in the Y-axis direction. 52b and the suction component can be pseudo-moved relative to each other in the Y-axis direction, and as a result, the suction component can be imaged by the cameras 52a and 52b.

Hereinafter, the principle will be described with reference to FIG. The figure schematically shows the positional relationship among the cameras 52a and 52b, the mounting head 16, the suction component C, and the mirror 62. In this figure, consider the case where the head unit 6 and the camera unit 50 move from the left side to the right side (Y-axis direction) with respect to the mirror 62. here,
The optical path length from the cameras 52a and 52b before movement to the mirror 62 (reflection surface); L1
-Optical path length from the mirror 62 (reflection surface) before the movement to the suction component C; L2
-Optical path length from the camera 52a, 52b to the mirror 62 after movement; L1 '
The optical path length from the moved mirror 62 (reflection surface) to the suction component C; L2 ′
The inclination angle of the mirror 62 (angle formed by the reflecting surface and the horizontal surface); θ
-Movement distance of the head unit 6; Δd
And Further, it is assumed that the imaging positions (positions of the optical axis L2) by the cameras 52a and 52b before the movement coincide with the center of the nozzle.

If the head unit 6 and the camera unit 50 are moved in the Y-axis direction relative to the mirror 62 while the suction component C is maintained at a certain height from this state, the mirror 62 is inclined. The imaging positions (positions of the optical axis L2 ′) after movement by 52a and 52b are shifted in the Y-axis direction by a displacement amount y from the center of the nozzle. That is, from the figure, Δd · tan θ = y · tan θ + y / tan 2θ
Because
y = ((tan θ · tan 2θ) / (tan θ · tan 2θ + 1)) · Δd
As a result, the cameras 22 and 23 and the suction component C are pseudo-relatively moved. In other words, the cameras 52a and 52b and the mirror image of the suction component C move relatively.

  Therefore, as a result of the pseudo relative movement between the cameras 52a and 52b and the suction component C as described above occurring while the head unit 6 and the camera unit 50 are integrally moved in the Y-axis direction as described above. The suction part C can be imaged by the cameras 52a and 52b.

  Note that when the suction component C is imaged using the above-described pseudo relative movement, the imaging distance between the cameras 52a and 52b and the subject (suction component C) changes as the head unit 6 moves. . That is, since the image magnification changes, it is necessary to correct the magnification when recognizing the part.

Specifically, when the difference in the optical path length from the cameras 52a and 52b before and after the movement to the mirror 62 (reflection surface) is a, and the difference in the optical path length from the mirror 32 to the suction component C before and after the movement is b, from FIG.
・ A = y / sin2θ
・ B = y / tan2θ
Therefore, if the magnification deviation before and after movement is e,
E = (L1 ′ + L2 ′) / (L1 + L2)
= (L1 + L2- (y / sin2θ + y / tan2θ)) / (L1 + L2)
It becomes.

  In this way, when the picked-up component C is imaged using pseudo relative movement, a magnification shift e corresponding to the amount of movement of the cameras 52a and 52b in the Y-axis direction is generated in the image. Therefore, in this embodiment, such a magnification deviation e is calculated by the main control unit 32, and image correction (magnification correction) is performed by the magnification correction unit 49c of the image processing unit 49 based on the magnification deviation e. It is configured.

  The operation control of the mounting machine by the controller 41 of the third embodiment is the same as the operation control of the first embodiment described using the flowchart of FIG. 6 except for the following points.

  In the third embodiment, in step S3 (and step S13) in FIG. 6, the picked-up component imaging positions by the cameras 52a and 52b, that is, the camera unit 50 on the support member 11 based on the component conveyance path by the head unit 6. In addition to obtaining the X-axis coordinate position, the rotation angles of the cameras 52a and 52b are obtained, and in step S4 (and step S14), the servo motor 56 is driven and controlled to move the cameras 52a and 52b to this imaging position. The head unit 60 is driven and controlled to change the directions of the 52a and 52b. Specifically, as shown in FIG. 15, when the head unit 6 passes over the mirror 62 along the component conveyance path R, the coordinate position where the suction component image can be captured via the mirror 62 is obtained. The rotation angles of the cameras 52 a and 52 b are obtained so that the element line of the CCD line sensor is orthogonal to the transport path R of the head unit 6. Then, by driving and controlling the servo motors 56 and 60, respectively, the camera unit 50 is moved to the coordinate position and the directions of the cameras 52a and 52b are changed. In step S7 (and step S16) in FIG. 6, the lighting device 51 of the camera unit 50 is controlled to be lit.

  As a result, after the component suction, the component sucked to each mounting head 16 while the head unit 6 passes over the mirror 62 while moving the head unit 6 linearly from the component suction position to the first component mounting position. The imaging process is performed. That is, when the lighting device 51 is turned on while the head unit 6 passes over the mirror 62 while moving the head unit 6 along the transport path R, the illumination light is reflected by the mirror 62 and the lower surface of the suction component. Then, the reflected light reflected by the lower surface of the suction component is reflected again by the mirror 62 and enters the cameras 52a and 52b. On the other hand, when the head unit 6 moves, the pseudo relative movement as described above occurs between the suction component and the cameras 52a and 52b, so that the suction component for one line in the main scanning direction (element array direction). Images are continuously taken in the sub-scanning direction (direction orthogonal to the element array; component conveyance direction), and as a result, the suction components are imaged by the cameras 52a and 52b.

  Even in the mounting machine according to the third embodiment as described above, the head unit 6 is always moved from the component supply unit to the mounting work position at the shortest distance after the component suction, regardless of the final component suction position. The image of the suction state of the component can be recognized. Therefore, similarly to the mounting machines of the first and second embodiments, the suction component can be recognized efficiently, and as a result, the tact time can be effectively shortened.

  In the third embodiment, the illumination device 51 is provided in the camera unit 50. However, the illumination device 51 may be provided on the base 1 side. Specifically, the LED 51a may be arranged along the mirror 62 in the entire region, and the main control unit 32 may be configured to control the lighting of the necessary LED 51a according to the movement path of the head unit 6 during component imaging. Good. According to this configuration, the LED 51 a is arranged in the vicinity of the mirror 62, so that illumination light can be irradiated from a position closer to the component attracted by the mounting head 16. Therefore, there is an advantage that a clearer image suitable for component recognition can be taken.

  As a modification of the third embodiment, as shown in FIGS. 16 to 18, a configuration in which optical units 70 and 71 are provided instead of the mirror 62 and the illumination device 51 can be adopted. Hereinafter, this example (referred to as the fourth embodiment) will be described.

  As shown in FIGS. 16 and 17, the optical units 70 and 71 are respectively provided in spaces between the conveyor 2 and the component supply units 4 on both sides thereof, and mirrors 76 (optical members) for reflecting the suction component images. ) And the illumination device 77 are integrally moved in the X-axis direction. That is, in the space between the conveyor 2 and the component supply unit 4 on the base 1, the X-axis direction rotated by a pair of parallel fixed rails 72 and servomotors 73 extending in the X-axis direction. The ball screw shaft 74 is provided, a movable table 75 (holding member) is movably mounted on the fixed rail 72, and the ball screw shaft 74 is screwed into the movable table 75. . The mirror 76 and the illumination device 77 are integrally mounted on the movable table 75, and the mirror 76 and the like move together with the movable table 75 in the X-axis direction along the fixed rail 72 by the operation of the servo motor 73. It is configured.

  The mirrors 76 are formed of rectangular total reflection mirrors that are elongated in the X-axis direction. As shown in FIG. 17, when the mounting heads 16 are positioned above the mirrors 76, the mirrors 76 are connected to the cameras 52a and 52b. Is mounted (held) on the movable table 75 in a state where the reflecting surface faces upward so as to be directed toward the rear and from the front side of the apparatus to the rear side (from the lower side to the upper side in FIG. 16) with a slight downward inclination. Yes. Note that the size of the mirror 76 in the X-axis direction is such that a component adsorbed by all the mounting heads 16 of the head unit 6, specifically, a directly below image of the component when a component of the maximum size among the mounted components is adsorbed. The distance between the mounting heads 16 at both ends is set to be appropriately longer so that the (lower surface image) is reflected (reflected) at the same time. Further, the size in the Y-axis direction is set so that the above-mentioned maximum size component can be seen with a margin. Although not shown in detail, the illumination device 77 has a plurality of LEDs 77 a arranged over the entire circumference of the mirror 76. These LEDs 77a are fixed to the movable table 75 so as to be directed almost directly above. When the head unit 6 is located above the movable table 75, the suction parts of the mounting heads 16 are illuminated from below. It is comprised so that light may be irradiated.

  As shown in FIG. 18, the control system of the fourth embodiment has a configuration in which an optical unit drive control unit 64 is further provided in the controller 41 of the second embodiment.

  The optical unit drive control unit 64 controls the operation of the movable table 75 of the optical units 70 and 71. A current position (X coordinate) of the movable table 75 is determined by a signal from an encoder 73a built in the servo motor 73. The movable table 75 is moved to a predetermined position by driving and controlling the servo motor 73 while detecting the position).

  In the controller 41, the illumination control unit 46 is connected to the illumination devices 77 of the optical units 70 and 71, and the illumination control unit 46 controls the lighting of the illumination devices 77. .

  In the fourth embodiment, the movable table 75 of the optical units 70 and 71 is provided below the component conveyance path by the head unit 6 so that the pickup of components by the cameras 52a and 52b can be taken after the components are sucked by the head unit 6. In addition to the movement, the cameras 52a and 52b (camera unit 50) are moved along the component conveyance path to positions where the suction component image can be picked up via the mirror 76 when the head unit 6 passes over the movable table 75. It is like that. Thus, after the completion of component suction, the head unit 6 is linearly moved from the final component suction position to the first component mounting position and passed over the mirror 76 in the same manner as in the third embodiment. The suction part image shown in 76 is picked up by the cameras 52a and 52b.

  As described above, in the fourth embodiment, instead of providing the long mirror 62 over the entire arrangement direction of the tape feeder 4a, the small mirror 76 is movably provided so that the suction component can be imaged. The cameras 52a and 52b (camera unit 50) and the mirror 76 (movable table 75) are moved. That is, the cameras 52a and 52b (camera unit 50) and the mirror 76 (movable table 75) are interlocked. It is a thing.

  According to the configuration of the fourth embodiment as described above, since the mirror 76 is downsized, it is difficult for the mirror 76 itself to be distorted, and the occurrence of distortion of the mirror 76 due to an increase in ambient temperature is also reduced. . Accordingly, it is possible to effectively reduce the influence on the image due to the distortion of the mirror 76 itself. Further, by reducing the size of the mirror 76 as described above, the burden of collecting data for correcting image distortion, that is, the burden of collecting distortion component data used for the distortion correction processing in the mirror distortion correcting unit 49b is reduced. Therefore, it becomes easy to examine the distortion component for the entire mirror 76 (the entire reflecting surface). Accordingly, in total, it is possible to reduce the influence on the image due to the distortion of the mirror 76, and there is an advantage that the image recognition accuracy of the suction component can be increased as compared with the third embodiment. is there.

  In addition, since the illumination device 77 is integrally mounted on the movable table 75 that holds the mirror 76, it is possible to provide illumination from a position closer to the suction component, and it is clearer and more suitable for component recognition. There is also an advantage that it becomes possible to obtain a simple image.

  However, in the fourth embodiment, since it is necessary to provide a drive mechanism for the movable table 75, wiring for the illumination device 77, etc. in the space between the conveyor 2 and the component supply unit 4, only the mirror 62 is provided in the same space. Compared to the third embodiment to be arranged, it is difficult to narrow the interval between the component supply unit 4 and the conveyor 2. Therefore, the third embodiment is slightly advantageous in that the total moving distance of the head unit 6 in a series of mounting operations is shortened, that is, the tact time is shortened.

  In the fourth embodiment, the illumination device 77 may be mounted on the camera unit 50 as in the case of the second embodiment, or may be fixedly provided on the base 1, specifically. The LED may be arranged side by side along the moving path of the movable table 75, and the LED corresponding to the position of the movable table 75 may be lit.

  By the way, the mounting machines of the first to fourth embodiments described above are the best embodiments of the surface mounting machine according to the present invention, and the specific configuration thereof is within the scope not departing from the gist of the present invention. Needless to say, it can be changed as appropriate. For example, in the third and fourth embodiments, the total reflection mirror 62 (mirror 76) is applied as an optical member for reflecting (reflecting) the component adsorbed on the mounting head 16. Other optical members such as a half mirror and a prism can also be applied.

  In the mounting machines according to the third and fourth embodiments, for example, the cameras 52a and 52b are fixed to the camera unit 50, specifically, the element lines of the CCD line sensor are aligned in the X-axis direction. Cameras 52a and 52b are fixedly arranged so that they are arranged, and a skew distortion correction unit (image correction unit) that corrects the distortion of the component image according to the movement path of the head unit 6 is provided in the image processing unit 49 of the controller 41. You may comprise so that it may provide. In other words, as in the third and fourth embodiments, while configured to image the suction component using the pseudo relative movement between the mounting head 16 (suction component) and the cameras 52a and 52b, The image distortion caused by the fixed provision of the cameras 52a and 52b, that is, the image distortion caused by the head unit 6 moving obliquely with respect to the element array of the CCD is the same as that of the second embodiment. You may comprise so that it may correct | amend according to a movement path | route. According to such a configuration, the configuration of the camera unit 50 can be simplified and reduced, and the rotational drive control of the cameras 52a and 52b is not required, so that the control burden on the main control unit 42 is reduced. There is an advantage.

  In the mounting machines according to the first and second embodiments described above, the two cameras 26a and 26b are mounted on the movable table 25, and the mounting machine according to the third and fourth embodiments is a camera unit 50. Although two cameras 52a and 52b are mounted on the camera, the number of cameras for imaging the suction component is not necessarily limited to two. The number and arrangement of the mounting heads 16 provided in the head unit 6; Further, it may be appropriately selected according to the magnification at the time of imaging.

It is a top view which shows 1st Embodiment of the surface mounting machine which concerns on this invention. It is a front view which shows the surface mounting machine which concerns on this invention. It is a side view which shows the structure of a head unit and an imaging unit. (A) is a schematic plan view showing a movable table and a camera mounted on the movable table, and (b) is a schematic diagram for explaining a relationship between a part conveyance path and a camera direction. It is a block diagram which shows the control system of the surface mounter which concerns on 1st Embodiment. It is a flowchart which shows an example of mounting operation control. It is a schematic diagram explaining the operation control for imaging an adsorption | suction component. It is a block diagram which shows the control system of the surface mounter which concerns on the 2nd Embodiment of this invention. It is a side view of the head unit and imaging unit (movable table) which show the modification of the surface mounter concerning the 1st and 2nd embodiment. It is a top view which shows 3rd Embodiment of the surface mounter which concerns on this invention. It is a front view which shows the surface mounting machine which concerns on this invention. It is a side view which shows the structure of a head unit and an imaging unit. It is a block diagram which shows the control system of the surface mounter which concerns on 3rd Embodiment. It is a schematic diagram explaining the component recognition method applied to the surface mounting machine which concerns on 3rd Embodiment, and its principle. It is a schematic diagram explaining the operation control for imaging an adsorption | suction component. It is a top view which shows 4th Embodiment (The modification of the surface mounter which concerns on 3rd Embodiment) of the surface mounter which concerns on this invention. It is a side view which shows the structure of a head unit and an optical unit. It is a block diagram which shows the control system of the surface mounter which concerns on 4th Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 3 Printed circuit board 6 Head unit 16 Mounting head 16a Suction nozzle 20, 21 Imaging unit 25 Movable table 26a, 26b Camera (imaging means)
40 controller (control means)
42 Main control unit 44 Axis control unit 45 Imaging unit drive control unit 46 Illumination control unit 47 Camera control unit 48 Camera posture switching control unit 49 Image processing unit

Claims (8)

It has a head unit that can move over a component supply unit and a mounting work position provided opposite to the component supply unit, and the mounting work position is obtained by sucking the component from the component supply unit by the mounting head mounted on the head unit. In a surface mounter that mounts after transporting and mounting on the substrate, and picking up the suction component by imaging means prior to this mounting and recognizing the suction state,
Provided between the component supply unit and the mounting work position so as to be movable in a direction perpendicular to the arrangement direction, and provided with a line sensor, and the head unit is adsorbed by the mounting head when passing above. The imaging means for imaging the selected component;
Changing means for changing the direction of the line sensor;
After the component is picked up by the mounting head in the component supply unit, the head unit is driven and controlled to linearly transfer the mounted component from the component suction position to the mounting work position. A control unit that drives and controls the head unit and the imaging unit to execute a component recognition operation of moving the unit relative to the imaging unit and imaging the component adsorbed on the mounting head by the imaging unit. Prepared,
Prior to the component recognition operation, the control means arranges the imaging means below the movement path of the head unit and further controls the change means to drive the imaging element in a predetermined direction with respect to the movement path of the head unit. The surface mounter is configured to change the direction of the line sensor so that the lines are arranged. It has a head unit that can move over a component supply unit and a mounting work position provided opposite to the component supply unit, and the mounting work position is obtained by sucking the component from the component supply unit by the mounting head mounted on the head unit. In a surface mounter that mounts after transporting and mounting on the substrate, and picking up the suction component by imaging means prior to this mounting and recognizing the suction state,
An image of a component disposed between the component supply unit and the mounting work position and attracted to the mounting head of the head unit is reflected, and the reflection surface is an array of the component supply unit and the mounting work position. An optical member provided inclined in a direction;
The head unit support member that moves integrally with the head unit in the arrangement direction of the component supply unit and the mounting work position, and a direction orthogonal to the arrangement direction of the component supply unit and the mounting work position with respect to the support member The image pickup means that is supported so as to be movable, includes a line sensor, and is provided so as to be able to pick up an image of a component reflected by the optical member;
Change means capable of changing the direction of the line sensor;
After the component is sucked by the mounting head in the component supply unit, the head unit is driven and controlled to linearly transport the mounted component from the component suction position to the mounting work position, and the imaging is performed during the component transport. Control means for driving and controlling the head unit and the imaging means to execute a component recognition operation for imaging the suction component of the mounting head via the optical member by means,
Prior to the component recognition operation, the control means supports the head unit at a position at which a suction component image reflected by the optical member can be captured when the head unit passes over the optical member in the component recognition operation. The image sensor is moved by a member, and the change unit is further driven and controlled to change the direction of the line sensor so that the image sensors are arranged in a predetermined direction with respect to the movement path of the head unit. A surface mounting machine characterized by In the surface mounting machine according to claim 1 or 2,
The surface mounting machine, wherein the control means drives and controls the changing means so that the imaging elements are arranged in a direction orthogonal to the movement path as the predetermined direction. It has a head unit that can move over a component supply unit and a mounting work position provided opposite to the component supply unit, and the mounting work position is obtained by sucking the component from the component supply unit by the mounting head mounted on the head unit. In a surface mounter that mounts after transporting and mounting on the substrate, and picking up the suction component by imaging means prior to this mounting and recognizing the suction state,
A line sensor is provided between the component supply unit and the mounting work position so as to be movable in a direction perpendicular to the arrangement direction and the image sensors are arranged in the movement direction, and the head unit passes above. The imaging means for imaging the component adsorbed by the mounting head,
After the component is picked up by the mounting head in the component supply unit, the head unit is driven and controlled to linearly transfer the mounted component from the component suction position to the mounting work position. Control means for driving and controlling the head unit and the imaging means so as to execute a component recognition operation for moving the unit relative to the imaging means and imaging the suction component of the mounting head by the imaging means;
Image correction means for correcting the mounting head or suction component image imaged by the imaging means by the component recognition operation in accordance with the movement path of the head unit relative to the line sensor;
Recognizing means for recognizing the suction state of the component by the mounting head based on the image corrected by the image correcting means,
Prior to the component recognition operation, the control means is configured to dispose the imaging means below the moving path of the head unit. It has a head unit that can move over a component supply unit and a mounting work position provided opposite to the component supply unit, and the mounting work position is obtained by sucking the component from the component supply unit by the mounting head mounted on the head unit. In a surface mounter that mounts after transporting and mounting on the substrate, and picking up the suction component by imaging means prior to this mounting and recognizing the suction state,
An image of a component disposed between the component supply unit and the mounting work position and attracted to the mounting head of the head unit is reflected, and the reflection surface is an array of the component supply unit and the mounting work position. An optical member provided inclined in a direction;
The head unit support member that moves integrally with the head unit in the arrangement direction of the component supply unit and the mounting work position, and a direction orthogonal to the arrangement direction of the component supply unit and the mounting work position with respect to the support member The image pickup means provided with a line sensor in which the image pickup device is arranged in the moving direction, and is provided so as to be able to pick up a component image reflected by the optical member;
After the component is sucked by the mounting head in the component supply unit, the head unit is driven and controlled to linearly transport the mounted component from the component suction position to the mounting work position, and the imaging is performed during the component transport. Control means for driving and controlling the head unit and the imaging means to execute a component recognition operation for imaging the suction component of the mounting head via the optical member by means;
Image correction means for correcting the mounting head or suction component image imaged by the imaging means by the component recognition operation in accordance with the movement path of the head unit relative to the line sensor;
Recognizing means for recognizing the suction state of the component by the mounting head based on the image corrected by the image correcting means,
Prior to the component recognition operation, the control means supports the head unit at a position where an image of a suction component reflected by the optical member when the head unit passes over the optical member in the component recognition operation can be captured. A surface mounter characterized in that the imaging means is moved in a member. In the surface mounting machine according to claim 2 or 5,
The optical member is provided movably in a direction orthogonal to the arrangement direction of the component supply unit and the mounting work position,
The control means further controls the driving of the optical member and interlocks the optical member and the imaging means in accordance with the movement path of the head unit during parts conveyance so that the imaging of the parts can be performed by the imaging means. A surface mounting machine characterized by causing In the surface mounting machine according to claim 6,
A holding member that movably holds the optical member is provided, and an illumination device that provides illumination for imaging by the imaging unit is provided integrally with at least one of the holding member or the optical member. Surface mount machine. In the surface mounter according to any one of claims 1 to 7,
The head unit includes a plurality of mounting heads, and the line sensor has a number of image sensors that can image the components adsorbed on each mounting head while the head unit moves along the movement path. A surface-mount machine characterized by

Images