JP2010080697A - Apparatus for mounting electronic component, and image read device therein - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for mounting an electronic component that can shorten a necessary time for image reading and improve a cycle time of a component mounting operation, and to provide an image read device in the apparatus for mounting electronic component mounting device. <P>SOLUTION: In the apparatus for mounting the electronic component, an image read unit 6A (6B) operative to read an image of an electronic component held on a mounting head 14A (14B) from below is equipped with an X-column line sensor 24X and a Y-column line sensor 24Y and a half-mirror 25 for making imaging light incident on the two line sensors 24X and 24Y by the same optical system so as to read the image through either of a first-direction scanning operation and a second-direction scanning operation for reading the image by moving the mounting head in an X direction and a Y direction respectively. Consequently, the first-direction scanning operation or second-direction scanning operation which has smaller cycle time loss is selected for the component mounting operation. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate and an image reading apparatus for reading an image of the electronic component in the electronic component mounting apparatus.

Along with the advancement of required position accuracy when mounting electronic components such as semiconductor chips on a substrate, a method of correcting the positional deviation between the electronic component and the substrate during mounting by image recognition is widely used. This method performs position correction at the time of mounting based on a position detection result obtained by imaging and recognizing the electronic component held by the mounting head prior to mounting of the electronic component. In this part imaging, a line sensor in which imaging elements such as CCDs are arranged in a row has been widely used (for example, see Patent Document 1). This method reads an image of an electronic component by synthesizing a two-dimensional image in parallel with a one-dimensional image obtained by capturing an image while moving the electronic component relative to the line sensor. is there.
JP 2006-287116 A

  By the way, when an image is read by the line sensor, it is necessary to perform a scanning operation for relatively moving the electronic component to be read and the line sensor in a direction orthogonal to the element arrangement direction. In the arrangement, the moving direction of the mounting head when performing the scanning operation needs to be set in advance. In general, in an electronic component mounting apparatus having a configuration in which component supply units are arranged on both sides of a board conveyance path, the line sensor aligns the element arrangement direction with the board conveyance direction (first direction) or is orthogonal to the first direction. Arranged in two directions. However, any of the above-described line sensor arrangements has advantages and disadvantages from the viewpoint of optimizing the efficiency of component mounting operation by the mounting head.

  That is, when the line sensor is arranged with the element arrangement direction aligned with the first direction, the scanning operation for image reading is performed by moving the mounting head in the second direction. In this case, since the mounting head can move from the component supply unit to the substrate along the shortest path, there is an advantage that the moving distance is shortened, but there are two components facing each other across the substrate as a component mounting mechanism. When the mounting heads are provided, interference between the mounting heads may occur depending on the operation state of the opposing mounting heads. Therefore, it is not always possible to execute the scanning operation for image reading at an arbitrary timing. In such a case, a loss time is generated for a waiting time until the opposing mounting head completes the component mounting operation and retracts from the board.

  On the other hand, when the line sensor is arranged with the element arrangement direction aligned with the second direction, the scanning operation for image reading is performed by moving the mounting head in the first direction. In this case, since the mounting head performs the scanning operation by moving along the substrate conveyance path, there is an advantage that the scanning operation can be performed regardless of the operation state of the opposing mounting head. The moving distance of the mounting head is inevitably long, resulting in an increase in the time required for image reading. As described above, when reading an image in a conventional electronic component mounting apparatus, it is difficult to shorten the time required for reading an image due to restrictions on the operation of the mounting head due to the direction of the line sensor arrangement. There was a limit to improving the tact time.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and an image reading apparatus in the electronic component mounting apparatus that can shorten the time required for image reading and can improve the tact time of the component mounting operation. To do.

  An electronic component mounting apparatus according to the present invention includes a substrate transport mechanism that transports a substrate on which an electronic component is mounted in a first direction, a substrate positioning unit that is provided in a transport path by the substrate transport mechanism, and positions the substrate, and the substrate A component supply unit disposed on a side in a second direction orthogonal to the first direction across the transport mechanism, and a mounting head for taking out the electronic component from the component supply unit in the first direction and the second direction A head moving mechanism that moves in two directions, and a moving path of the mounting head by the head moving mechanism, and an image of the electronic component held by the mounting head by the mounting head performing a scanning operation for image reading. An image reading unit that reads from below, and the image reading unit is configured by linearly arranging a plurality of image sensors, and is arranged with the element array direction fixed in the first direction. A first line sensor, a second line sensor configured by linearly arranging a plurality of image sensors, and an element array direction fixed in the second direction, and a first line sensor Both the image sensor and the image sensor of the second line sensor have an optical system that forms an image of the electronic component.

  An image reading apparatus in an electronic component mounting apparatus according to the present invention includes a substrate transport mechanism that transports a substrate on which an electronic component is mounted in a first direction, and a substrate positioning unit that is provided in a transport path by the substrate transport mechanism and positions the substrate. A component supply unit disposed on a side in a second direction orthogonal to the first direction across the substrate transport mechanism, and a mounting head for taking out the electronic component from the component supply unit in the first direction and A head moving mechanism that moves in two directions of the second direction, and an electron held by the mounting head when the mounting head performs a scanning operation for image reading, provided in the moving path of the mounting head by the head moving mechanism. An image reading apparatus in an electronic component mounting apparatus that reads an image of a component from below, and is configured by arranging a plurality of image sensors in a straight line. And a first line sensor arranged in a fixed manner in the first direction, and a second line in which a plurality of image sensors are arranged in a straight line and the element arrangement direction is fixed in the second direction. A line sensor and an optical system that forms an image of the electronic component on both the image sensor of the first line sensor and the image sensor of the second line sensor.

  According to the present invention, in the electronic component mounting apparatus, the configuration of the image reading unit that reads the image of the electronic component held by the mounting head from below, the first direction that is the substrate transport direction of the mounting head, and the first direction. Each of the mounting heads has a configuration that includes a camera capable of reading an image by either the first direction scanning operation or the second direction scanning operation for reading an image by moving the image in a second direction orthogonal to each other. In the component mounting operation for transporting and mounting the electronic component taken out from the component supply unit on the board, either the first direction scanning operation or the second direction scanning operation is selected to read the image of the electronic component. Therefore, the time required for image reading can be shortened, and the tact time of the component mounting operation can be improved.

Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic circuit according to an embodiment of the present invention. 4 is an exploded perspective view showing a configuration of an image reading apparatus used in the component mounting apparatus, FIG. 4 is a sectional view of the image reading apparatus used in the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 5 is an embodiment of the present invention. FIG. 6 is a plan view of the image reading apparatus used in the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. FIG. 8 is a block diagram showing a configuration of a control system of an electronic component mounting apparatus according to an embodiment of the invention, FIG. 8 is a flowchart showing an image reading method in the electronic component mounting apparatus according to the embodiment of the present invention, and FIGS. Is an electronic component mounting of an embodiment of the present invention It illustrates the operation of the image reading method in location.

  First, the structure of the electronic component mounting apparatus 1 will be described with reference to FIGS. The electronic component mounting apparatus 1 is used in an electronic component mounting line for manufacturing a mounting board, and an electronic component mounting line is configured by connecting a plurality of electronic component mounting apparatuses 1 having the same structure. In FIG. 1, a substrate transport mechanism 2 is disposed in the X direction at the center of a base 1a. The board transport mechanism 2 transports the board 3 on which electronic components are mounted in the X direction (first direction). A substrate positioning unit that positions and holds the substrate at the mounting position is provided in the transport path by the substrate transport mechanism 2, and electronic components are mounted on the substrate 3 positioned by the substrate positioning unit.

  A first component supply unit 4A and a second component supply unit 4B are arranged on both sides in the Y direction (second direction) with the substrate transport mechanism 2 interposed therebetween, and the first component supply unit 4A, A plurality of tape feeders 5 are arranged in parallel in the second component supply unit 4B. The tape feeder 5 pitches a carrier tape containing electronic components, and supplies the electronic components to a component mounting mechanism described below, that is, a component mounting mechanism including a mounting head and a head moving mechanism that moves the mounting head.

  At one end of the base 1a in the X direction, a Y axis moving table 8 having a Y axis linear drive mechanism is disposed horizontally in the Y direction. The Y-axis moving table 8 is mainly composed of a beam member 8a provided in an elongated shape in the horizontal direction, and a linear rail 8b is disposed in the horizontal direction on the beam member 8a. A linear block 9 coupled to two rectangular coupling brackets 10A and 10B arranged in a vertical posture is fitted to the linear rail 8b so as to be slidable in the Y direction. A first X-axis movement table 11A and a second X-axis movement table 11B each having an X-axis linear drive mechanism are coupled to the two coupling brackets 10A and 10B.

  Each of the first X-axis moving table 11A and the second X-axis moving table 11B mainly includes a beam member 11a provided in an elongated shape in the X direction, and the linear rail 12 is arranged in the horizontal direction on the beam member 11a. It is installed. A rectangular coupling bracket 13 arranged in a vertical posture is mounted on the linear rail 12 so as to be slidable in the X direction via a linear block (not shown). A first mounting head 14A and a second mounting head 14B are mounted on the coupling brackets 13 of the first X-axis moving table 11A and the second X-axis moving table 11B, respectively. 14A and the second mounting head 14B move in the X direction by the linear drive mechanism coupled to the coupling bracket 13, respectively.

  The first mounting head 14 </ b> A and the second mounting head 14 </ b> B are multiple heads each having a plurality of unit mounting heads 15, and the nozzle mounting portion provided at the lower end of each unit mounting head 15 includes A suction nozzle 15a for sucking and holding electronic components is mounted. The suction nozzle 15 a is moved up and down by a nozzle lifting mechanism built in the unit mounting head 15. By driving the Y-axis movement table 8 and the first X-axis movement table 11A, the first mounting head 14A moves in the X direction and the Y direction, whereby each unit mounting head 15 supplies the first component. The electronic component is taken out from the tape feeder 5 of the section 4A and transferred and mounted on the substrate 3 positioned by the substrate transport mechanism 2.

Similarly, by driving the Y-axis movement table 8 and the second X-axis movement table 11B, the second mounting head 14B moves in the X direction and the Y direction, whereby each unit mounting head 15 is moved to the second direction. The electronic component is taken out from the tape feeder 5 of the component supply unit 4B, and transferred and mounted on the substrate 3 positioned by the substrate transfer mechanism 2. In the above configuration, the Y-axis movement table 8, the first X-axis movement table 11A, the Y-axis movement table 8, and the second X-axis movement table 11B are composed of the first component supply unit 4A and the second component supply unit 4B. The first head moving mechanism for respectively moving the first mounting head 14A and the second mounting head 14B that take out the electronic components from the X direction (first direction) and the Y direction (second direction), respectively. 17A and 2nd head moving mechanism 17B are comprised.

  Between the substrate transport mechanism 2 and the first component supply unit 4A and the second component supply unit 4B, that is, the first mounting head 14A and the second by the first head moving mechanism 17A and the second head moving mechanism 17B. A first image reading device 6A (first image reading unit) and a second image reading device 6B (second image reading unit) are disposed in the movement path of the mounting head 14B. The first image reading device 6A and the second image reading device 6B have the same configuration, and the first mounting head 14A and the second mounting head 14B that take out electronic components from the respective component supply units are used for image reading. By performing this scanning operation, it has a function of reading the image of the electronic component held by the mounting head from below. By performing a recognition process on the read image, a position shift of the electronic component in the state held by the mounting head is detected.

  As shown in FIG. 2, the first mounting head 14A and the second mounting head 14B include a substrate recognition camera unit 16 that moves together as a first X-axis movement table 11A and a second X-axis movement table 11B. It is attached to the position below. The substrate recognition camera unit 16 is attached to the coupling bracket 13 in a posture in which the imaging optical axis is directed downward, and moves together with the mounting head 17 above the substrate 3 to image the substrate 3. By recognizing the imaging result, the positional deviation of the mounting point on the substrate 3 is detected. When the electronic component is mounted on the substrate 3, position correction at the time of mounting the component is performed based on the detection result of the positional deviation of the electronic component and the detection result of the positional deviation of the mounting point.

  Next, the configuration and function of the first image reading device 6A and the second image reading device 6B will be described with reference to FIGS. As shown in FIG. 3 and FIG. 4, the first image reading device 6A and the second image reading device 6B are combined with a lens optical system 21 above the line sensor unit 20 and further mounted with an illumination unit 22 above that. It has become the composition. The line sensor unit 20 reads the imaging light reflected from the image reading target (here, the electronic components held by the first mounting head 14A and the second mounting head 14B) as a one-dimensional image by the line sensor and outputs an image signal. Has a function of outputting.

  That is, the line sensor unit 20 is configured by combining two sensor boards 23A and 23B on which line sensors (X-row line sensor 24X and Y-row line sensor 24Y) are mounted. Each of the X-row line sensor 24X and the Y-row line sensor 24Y is configured by linearly arranging a plurality of image sensors such as CCDs, and each image sensor receives an image light to output a one-dimensional image signal. To do.

  On the upper surface of the sensor substrate 23A horizontally disposed below, the X-row line sensor 24X is disposed with the element arrangement direction fixed in the X direction, and is disposed perpendicular to the sensor substrate 23A. On the inner side surface of the sensor substrate 23B, the Y row line sensor 24Y is arranged with the element arrangement direction fixed in the Y direction. That is, the line sensor unit 20 is configured by arranging a plurality of imaging elements in a straight line, and is arranged with the element arrangement direction fixed in the X direction (first direction) and arranged in an X column line sensor 24X (first line sensor). And a Y line line sensor 24Y (second line sensor) arranged by arranging a plurality of image sensors in a straight line and arranged with the element arrangement direction fixed in the Y direction (second direction). It has become.

Here, the arrangement positional relationship between the X-row line sensor 24X and the Y-row line sensor 24Y is such that the normal line of the light-receiving surface of the image sensor in the X-row line sensor 24X and the normal line of the light-receiving surface of the image sensor in the Y-row line sensor 24Y. Are in such a positional relationship that they intersect each other. In such an arrangement positional relationship, by arranging the half mirror 25 in an oblique direction (45-degree direction) in the middle of the sensor substrates 23A and 23B, the imaging light from above is transmitted through the half mirror 25 and the X row line. In addition to being incident on the sensor 24X, it can be reflected in the horizontal direction by the half mirror 25 and incident on the Y-row line sensor 24Y.

  The lens optical system 21 includes a lens for imaging the imaging light on the light receiving surfaces of the X-row line sensor 24X and the Y-row line sensor 24Y, and the imaging light incident from above is refracted by the lens optical system 21 and X An image of the imaging target is formed on the light receiving surfaces of the column line sensor 24X and the Y column line sensor 24Y. The illumination unit 22 includes illumination boards 22a in which light-emitting elements such as LEDs are assembled in four directions. By operating the illumination board 22a, illumination light is irradiated obliquely upward as shown in FIG. Arrow a). The illuminated illumination light is reflected downward by the electronic component P held by the suction nozzle 15a provided in each unit mounting head 15 in the first mounting head 14A and the second mounting head 14B, and the first mounting head 14A and the second mounting head 14B. Is incident on the image reading device 6A and the second image reading device 6B from above (arrow b).

  Next, the imaging light is refracted by the lens optical system 21 and travels downward. Among these refracted lights, the imaging light that has passed through the half mirror 25 forms an image on the imaging element that constitutes the light receiving surface of the X-row line sensor 24X (arrow c). Further, the imaging light reflected laterally by the half mirror 25 forms an image on the imaging element that forms the light receiving surface of the Y-row line sensor 24Y (arrow d). That is, the lens optical system 21 and the half mirror 25 constitute an optical system that forms an image of the electronic component on both the imaging device of the X-row line sensor 24X and the imaging device of the Y-row line sensor 24Y.

  The X-row line sensor 24X and the Y-row line sensor 24Y are connected to an imaging control unit 26A (imaging control unit 26B) that is a camera controller. The imaging control unit 26A (imaging control unit 26B) has a function of controlling the imaging processing by the X-row line sensor 24X and the Y-row line sensor 24Y and outputting the imaging result as an image signal. That is, the X-row line sensor 24X and the Y-row line sensor 24Y sequentially output a plurality of one-dimensional images corresponding to the image capture ranges shown below at predetermined intervals, and parallelize the plurality of output one-dimensional images. Thus, a two-dimensional image of the object to be imaged is created, and an image signal of the two-dimensional image is output.

  At this time, an image signal of a one-dimensional image is always output from the X-row line sensor 24X and the Y-row line sensor 24Y, and the imaging control unit 26A (imaging control unit 26B) receives the X-row line sensor 24X and the Y-row line sensor. A process of selecting an image signal from one line sensor designated by an external command from two image signals output in parallel from 24Y, and generating and outputting an image signal of a two-dimensional image Do. That is, in the line sensor unit 20 configured as described above, an image of the imaging target can be read by either the X-row line sensor 24X or the Y-row line sensor 24Y.

  FIG. 5 is a plan view showing an image capturing range in which an image can be read by the first image reading device 6A and the second image reading device 6B. That is, by using the line sensor unit 20 having the above configuration, the X column line sensor 24X uses the X column line sensor 24X and the Y column line sensor 24Y uses the Y column line sensor 24Y. It is possible to realize an image capturing range in which the image capturing range AY having a reading range of the dimension Y1 corresponding to the element arrangement length in the direction is combined in a cross shape.

Here, the dimensions X1 and Y2 that define the size of the image capturing range AX and the image capturing range AY are the same as the suction nozzles 15a of all the unit mounting heads 15 in the first mounting head 14A and the second mounting head 14B. It is determined based on the dimensions required to read these images all together while the electronic component is held. In the line sensor unit 20, by adjusting the vertical position of the Y column line sensor 24Y, the image capturing range AX is not a cross shape in which the respective center points of the image capturing range AX and the image capturing range AY intersect. It is also possible to form a T-shaped image capturing range in which the center of the image and one end of the image capturing range AY are close to each other and have a T shape.

  That is, both the first image reading device 6A and the second image reading device 6B are cross-sectional in plan view by combining the image capturing range by the X-row line sensor 24X and the image capturing range by the Y-row line sensor 24Y. It has a configuration having a shape or T-shaped image capture range. Accordingly, the first image reading device 6A and the second image reading device 6B shown in the present embodiment read the image by moving the mounting head corresponding to the image reading unit in the X direction and the Y direction, respectively. The camera has a camera capable of reading an image by both the first direction scanning operation and the second direction scanning operation.

  In order to obtain a configuration in which an image can be read by either the first direction scanning operation or the second direction scanning operation of reading the image by moving the mounting head in the X direction and the Y direction, respectively. 3 is not limited to the first image reading device 6A and the second image reading device 6B configured as shown in FIG. 3, and for example, an image reading device configured as shown in FIG. 6 may be used. First, the image reading device 27 shown in FIG. 6A shows an example in which line sensors 27X and 27Y in which a plurality of image sensors are arranged in a straight line are combined in a cross shape.

  The image reading device 28 shown in FIG. 6B shows an example in which line sensors 28X and 28Y in which a plurality of image sensors are arranged in a straight line are combined in a T shape. Further, FIG. 6C shows an image reading device 29A including a line sensor 29X in which a plurality of image sensors are linearly arranged in the X direction, and a line sensor 29Y in which the plurality of image sensors are linearly arranged in the Y direction. The example which arrange | positions the provided image reading apparatus 29B adjacent is shown. In each of these examples, an image can be read by either the first direction scanning operation or the second direction scanning operation. Note that, instead of combining two line sensors as in the above examples, even if an area camera having a two-dimensional planar image capturing range is used, either the first direction scanning operation or the second direction scanning operation is used. Can also read images.

  Next, the configuration of the control system of the electronic component mounting apparatus 1 will be described with reference to FIG. In FIG. 7, the apparatus main body control unit 30 includes a position detection unit 31, an image reading control unit 32, a recognition processing unit 33, a position correction calculation unit 34, and a mechanism control unit 35. The position detector 31 receives signals from the X-axis encoder 11AE and the Y-axis encoder 8AE respectively provided in the X-axis linear drive mechanism 11AL and the Y-axis linear drive mechanism 8AL constituting the first head moving mechanism 7A. Thus, the position of the first mounting head 14A is detected, and the X-axis encoder 11BE and Y-axis respectively provided in the X-axis linear drive mechanism 11BL and the Y-axis linear drive mechanism 8BL constituting the second head moving mechanism 7B. By receiving a signal from the encoder 8BE, the position of the second mounting head 14B is detected.

  The image reading control unit 32 controls the imaging control unit 26A and the imaging control unit 26B of the first image reading device 6A and the second image reading device 6B based on the position detection result of the position detection unit 31. That is, in the scanning operation of moving the first mounting head 14A and the second mounting head 14B in the scanning direction and reading the image of the electronic component held by the first mounting head 14A and the second mounting head 14B, Imaging control of the timing at which the X-row line sensor 24X or the Y-row line sensor 24Y starts to output an image signal based on the position detection results of the first mounting head 14A and the second mounting head 14B by the position detection unit 31. Commands the unit 26A and the imaging control unit 26B.

  As will be described later, the image reading control unit 32 performs the scanning operation for reading the image of the electronic component on the X column line sensor 24X or the Y column line sensor 24Y, that is, the second direction scanning operation. The selection of the first direction scanning operation to be performed is selected according to the operation state of the first mounting head 14A and the second mounting head 14B, and the imaging control unit 26A and the imaging control unit 26B are selected. It has a function of commanding to it. This operation state is determined based on the positions of the first mounting head 14A and the second mounting head 14B detected by the position detector 31. This selection is performed based on scanning operation selection conditions that are set in advance and stored in the storage device of the apparatus main body control unit 30.

  That is, the image reading control unit 32 transfers the electronic components taken out from the respective component supply units by the first mounting head 14A and the second mounting head 14B to the substrate 3 positioned in the substrate positioning unit of the substrate transport mechanism 2. In the component mounting operation to be mounted, in order to read the image of the electronic component, whether the first mounting head 14A or the second mounting head 14B is to perform the first direction scanning operation or the second direction scanning operation is determined. The selection is made based on a preset scanning operation selection condition.

  The recognition processing unit 33 receives the image signals output from the imaging control unit 26A and the imaging control unit 26B of the first image reading device 6A and the second image reading device 6B, and performs recognition processing to thereby perform the mounting head. In this state, the electronic component is identified and misalignment is detected. The position correction calculation unit 34 performs calculations necessary for position correction when the electronic component is mounted on the substrate by the mounting head based on the positional deviation information of the electronic component obtained by the recognition processing unit 33. In the example shown in FIG. 7, a configuration example in which the image reading control unit 32 and the recognition processing unit 33 are included in the apparatus main body control unit 30 is shown, but the image reading control unit 32 and the recognition processing unit 33 are controlled by the apparatus main body control. You may make it provide as a separate image recognition process part independent of the part 30. FIG.

  The mechanism control unit 35 controls the first head moving mechanism 7A, the first mounting head 14A, the second head moving mechanism 7B, and the second mounting head 14B, so that the electrons taken out from the respective component supply units A component mounting operation for transferring and mounting the component on the substrate 3 is executed. At this time, each mounting head is caused to perform either the first direction scanning operation or the second direction scanning operation selected by the image reading control unit 32. When the held electronic component is mounted on the substrate 3, the first mounting head 14 </ b> A and the second mounting head 14 </ b> B are aligned based on the positional deviation correction calculation result obtained by the position correction calculation unit 34. Do.

  The electronic component mounting apparatus 1 according to the present embodiment is configured as described above. Hereinafter, the electronic component mounting apparatus 1 reads an image of the electronic component held by the first mounting head 14A and the second mounting head 14B. An image reading method in the electronic component mounting apparatus will be described with reference to the drawings along the flow of FIG.

  First, at the start of the component mounting operation, the first mounting head 14A and the second mounting head 14B extract electronic components from the respective component supply units (ST1) (component extraction step). FIG. 9A shows that the first mounting head 14A in the first component supply unit 4A is moved to take out an electronic component by the plurality of unit mounting heads 15 (arrow e), and the second component supply unit 4B shows a state in which the second mounting head 14B holds the electronic components in all of the plurality of unit mounting heads 15 and the component extraction process is completed.

Next, scanning operation selection is performed (ST2). That is, it is selected based on a preset scanning operation selection condition whether the second mounting head 14B that has completed the component extraction process is to perform the first direction scanning operation or the second direction scanning operation ( Scanning operation selection step). Here, when the component mounting operation by the opposing mounting head is not performed on the substrate 3 positioned by the substrate transport mechanism 2 when the component extraction process is completed, the second direction scanning operation is selected, and the component When the component mounting operation is performed on the board 3 at the time when the extraction process is completed, the scanning operation selection condition is set in advance so as to select the first direction scanning operation.

  That is, in the state shown in FIG. 9A, at the time when the component extraction process by the second mounting head 14B is completed in the second component supply unit 4B, the component extraction process is still in the first component supply unit 4A. Is not completed, and the opposing first mounting head 14A does not exist on the substrate 3. Therefore, in this case, the second direction scanning operation is selected as the scanning operation to be performed by the second mounting head 14B that has completed the component extraction process. As a result, the second mounting head 14B can move from the second component supply unit 4B toward the substrate 3 by the shortest path, and the movement tact time can be shortened by shortening the moving distance in the component mounting operation. it can.

  Next, a scanning operation is performed (ST3). Here, the second mounting head 14B is caused to perform the selected second direction scanning operation (scanning process). That is, as shown in FIG. 9B, the second mounting head 14B holding the electronic component to be scanned is moved in the Y direction and reaches the substrate 3 (arrow g). When moving in the Y direction, the second mounting head 14B moves above the second image reading device 6B at a prescribed scanning speed, and at this time, a plurality of electronic components to be imaged are captured by the X-row line sensor 24X. One-dimensional images are sequentially read at predetermined intervals. Next, an image signal is acquired from the second image reading device 6B (image acquisition step). That is, the imaging control unit 26B of the second image reading device 6B that has read the image generates a two-dimensional image created by paralleling a plurality of one-dimensional images obtained by the above-described scanning operation of the electronic component to be imaged. It outputs to the recognition process part 33 as an image signal.

  Thereafter, a scanning operation for the first mounting head 14A is executed. In this case, when the component removal process by the first mounting head 14A is completed, since the opposing second mounting head 14B already exists on the substrate 3, the first direction scanning operation is selected. Then, in parallel with the second direction scanning operation for the second mounting head 14B, the first mounting head 14A that has completed the component extraction process in the first component supply unit 4A is shown in FIG. 9B. Thus, in order to perform the selected first direction scanning operation, the first image reading device 6A is moved to the side (arrow f).

  Then, as shown in FIG. 9C, in parallel with the component mounting operation (arrow h) on the substrate 3 by the second mounting head 14B, the first mounting head 14A is attached to the first image reading device 6A. A first direction scanning operation (arrow i) that moves upward in the X direction at a prescribed scanning speed is executed. After completing the first direction scanning operation, the first mounting head 14A stands by at the side of the first image reading device 6A. Since such a first direction scanning operation can be performed without interfering with the component mounting operation of the second mounting head 14B facing the first scanning head 14A, the first mounting head 14A performs the first component supply unit. It is possible to prevent occurrence of a loss time for waiting without moving at 4A.

Thereafter, as shown in FIG. 10A, the second mounting head 14B that has finished the component mounting operation on the substrate 3 moves to the second component supply unit 4B to execute the next component extraction process. (Arrow j). Thereafter, as shown in FIG. 10B, the first mounting head 14A in the standby state immediately moves above the board 3 (arrow k), and the second component supply unit 4B 2 mounting head 14B is moved to take out the component (arrow l). Thereafter, the second mounting head 14B completes the component taking-out process. At this time, as shown in FIG. 10C, the first mounting head 14A exists on the substrate 3 and the component mounting operation ( When the arrow m) is being executed, the first direction scanning operation is selected as the scanning operation to be performed by the second mounting head 14B. Then, the second mounting head 14B moves to the side of the second image reading device 6B in order to execute the first direction scanning operation that moves in the X direction above the second image reading device 6B (arrow n). ).

  Thereafter, the component mounting operation is repeatedly executed by the first mounting head 14A and the second mounting head 14B. In this component mounting operation, an electronic component is taken out from the first component supply unit 4A and the second component supply unit 4B and moved above the first image reading device 6A and the second image reading device 6B to be electronic. A scanning operation for reading an image of a component is executed. In this scanning operation, one of the first direction scanning operation and the second direction scanning operation is selected in accordance with the operation state of the component mounting mechanism facing each other with the substrate transport mechanism 2 interposed therebetween.

  That is, in the above-described image reading method, the first mounting head 14 </ b> A and the second mounting head 14 </ b> B extract the electronic component from the respective component supply units, and the first mounting head 14 </ b> A reads the image of the electronic component. A scanning operation selection step of selecting whether the mounting head 14A or the second mounting head 14B is to perform the first direction scanning operation or the second direction scanning operation based on a preset scanning operation selection condition; A scanning process for causing the first mounting head 14A and the second mounting head 14B to perform the selected scanning operation, and an image acquisition process for acquiring image signals from the first image reading unit 6A and the second image reading unit 6B. It is a form including.

  In the scanning operation selection step, the second direction scanning operation is selected when the component mounting operation by the opposing mounting head is not performed on the substrate 3 positioned on the substrate transport mechanism 2 at the time when the component extraction step is completed. When the component mounting operation is performed at the time when the component extraction process is completed, the first direction scanning operation is selected.

  As described above, the electronic component mounting apparatus 1 shown in the present embodiment includes the first component supply unit 4A, the second component supply unit 4B, and the first mounting head on both sides of the board conveyance mechanism 2, respectively. In an electronic component mounting apparatus having a configuration in which a component mounting mechanism for mounting electronic components by 14A and the second mounting head 14B is arranged, images of the electronic components held by the first mounting head 14A and the second mounting head 14B The first image reading unit 6A and the second image reading unit 6B that respectively read the image reading head from below, the mounting direction of the mounting head of the image reading unit being the substrate transport direction, the first direction, and the second direction orthogonal to the first direction. And a camera capable of reading an image by both the first direction scanning operation and the second direction scanning operation of reading the image by moving each of the images.

  Thereby, in the component mounting operation in which the electronic components taken out from the first component supply unit 4A and the second component supply unit 4B corresponding to the first mounting head 14A and the second mounting head 14B are transferred and mounted on the substrate 3. In order to read the image of the electronic component, one of the first direction scanning operation and the second direction scanning operation with no tact time loss can be selected according to the operation state of the opposing component mounting mechanism. As a result, the tact time loss can be eliminated as much as possible, the time required for image reading can be shortened, and the tact time of the component mounting operation can be improved.

  In the above embodiment, in the electronic component mounting apparatus in which the component mounting mechanisms are provided on both sides of the board conveying mechanism, the first image reading unit 6A (second image reading unit 6B) shown in FIG. Although an example of use is shown, the effect of using a configuration having a camera capable of reading an image by either the first direction scanning operation or the second direction scanning operation as an image reading unit sandwiches the substrate transport mechanism. The present invention is not limited to an electronic component mounting apparatus having a component mounting mechanism on both sides.

That is, even in an electronic component mounting apparatus having a component mounting mechanism disposed only on one side of the board transport mechanism, it is possible to select the first direction scanning operation and the second direction scanning operation in the image reading operation after component removal. As a result, it is possible to select a shorter moving path of the mounting head from the component supply unit to the board mounting point, and it is possible to improve the tact time of the component mounting operation. In this case, the scanning operation in which the moving path from the position of the mounting head at the time when the component supply process is completed in the component supply unit to the mounting point of the substrate in the component mounting operation is shortened is selected. Scanning operation selection conditions are set. However, this tact time improvement effect becomes more prominent in an electronic component mounting apparatus having a configuration in which component mounting mechanisms are disposed on both sides of the board transport mechanism, as shown in the present embodiment.

  The electronic component mounting apparatus and the image reading apparatus in the electronic component mounting apparatus according to the present invention have the effect that the time required for image reading can be shortened and the tact time of the component mounting operation can be improved. This is useful in the field of component mounting in which an image of an electronic component taken out from a supply unit is read to recognize the position and then mounted on a substrate.

The perspective view of the electronic component mounting apparatus of one embodiment of this invention The top view of the electronic component mounting apparatus of one embodiment of this invention 1 is an exploded perspective view showing a configuration of an image reading apparatus used in an electronic component mounting apparatus according to an embodiment of the present invention. Sectional drawing of the image reading apparatus used for the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the image capture range of the image reading apparatus used for the electronic component mounting apparatus of one embodiment of this invention The top view of the image reader used for the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the electronic component mounting apparatus of one embodiment of this invention The flowchart which shows the image reading method in the electronic component mounting apparatus of one embodiment of this invention Operation explanatory diagram of the image reading method in the electronic component mounting apparatus of one embodiment of the present invention Operation explanatory diagram of the image reading method in the electronic component mounting apparatus of one embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Board | substrate conveyance mechanism 3 Board | substrate 4A 1st component supply part 4B 2nd component supply part 6A 1st image reading apparatus 6B 2nd image reading apparatus 7A 1st head moving mechanism 7B 2nd Head moving mechanism 14A First mounting head 14B Second mounting head 20 Line sensor unit 24X X-row line sensor 24Y Y-row line sensor

Claims (4)

A substrate transport mechanism for transporting the substrate on which the electronic component is mounted in the first direction; a substrate positioning unit that is provided in a transport path by the substrate transport mechanism and positions the substrate;
A component supply unit disposed laterally with respect to a second direction orthogonal to the first direction across the substrate transport mechanism;
A head moving mechanism for moving a mounting head for taking out the electronic component from the component supply unit in two directions of the first direction and the second direction;
An image reading unit that is provided in a moving path of the mounting head by the head moving mechanism and that reads an image of an electronic component held by the mounting head from below by performing a scanning operation for image reading by the mounting head;
The image reading unit is configured by arranging a plurality of image sensors in a straight line, the first line sensor arranged with the element arrangement direction fixed in the first direction, and the plurality of image sensors arranged in a straight line The second line sensor configured to be arranged with the element arrangement direction fixed in the second direction, and the electronic component in any of the image sensor of the first line sensor and the image sensor of the second line sensor And an optical system for forming an image of the electronic component mounting apparatus. A substrate transport mechanism that transports a substrate on which an electronic component is mounted in a first direction, a substrate positioning portion that is provided in a transport path by the substrate transport mechanism, and that positions the substrate, and the first direction across the substrate transport mechanism And a head moving mechanism that moves a mounting head that takes out the electronic component from the component supply section in two directions, the first direction and the second direction, and a component supply section that is disposed laterally in a second direction orthogonal to the first direction. An image in the electronic component mounting apparatus that is provided in the movement path of the mounting head by the head moving mechanism and reads the image of the electronic component held by the mounting head from below by performing a scanning operation for image reading. A reading device,
A first line sensor configured by arranging a plurality of image sensors in a straight line and having an element array direction fixed in the first direction, and an element array configured by arranging a plurality of image sensors in a straight line The image of the electronic component is formed on any of the second line sensor arranged with the direction fixed in the second direction, the image sensor of the first line sensor, and the image sensor of the second line sensor. An image reading apparatus in an electronic component mounting apparatus, comprising: an optical system.   3. A cross-shaped or T-shaped image capturing range in a plan view is obtained by combining an image capturing range by the first line sensor and an image capturing range by the second line sensor. An image reading apparatus in the electronic component mounting apparatus described.   The first line sensor and the second line sensor are arranged so that the normal lines of the respective light receiving surfaces intersect each other, and further, the imaging light from the electronic component is transmitted to the first line sensor and the second line sensor. 4. An image reading apparatus in an electronic component mounting apparatus according to claim 3, further comprising a half mirror that is incident on any light receiving surface of the sensor.

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