KR100604317B1 - Device for mounting of electrical parts and method for mounting of Electrical Parts using the same - Google Patents

Abstract

According to the present invention, an electronic component mounting apparatus and a method for mounting an electronic component using the same are disclosed. The electronic component mounting apparatus is orthogonal to each other, and allows relative movement, each of which moves on an X-axis frame, a Y-axis frame, and an X-axis frame extending in the left and right directions and at the front and rear directions, respectively, and absorbs the components to be mounted on the circuit board. A head module having at least one nozzle and a first mirror rotatably mounted at the front of the nozzle to reflect an image of a component adsorbed on the nozzle, and a plurality of parts disposed at the front of the head module and mounted on a circuit board. An image is reflected by the first mirror, which is disposed between the component supply apparatus for supplying and the rear of the head module, and is movable in the horizontal direction between the PCB transfer means for transferring the circuit board in the left and right directions, the head module and the PCB transfer means. A camera module having a second mirror for refracting the light and at least one area camera for capturing an image reflected by the second mirror. It should. According to the disclosed electronic component mounting apparatus and the electronic component mounting method using the same, the copper wire of the head module is minimized, the head module is lighter, and the mounting work time is shortened.

Description

Device for mounting of electrical parts and method for mounting of electrical parts using the same

1 is a perspective view showing a conventional electronic component mounting apparatus,

2 is a side view showing the function of the line scan camera of FIG.

3 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention,

FIG. 4 is a side view of the electronic component mounting apparatus shown in FIG. 3.

5 is a plan view of the electronic component mounting apparatus shown in FIG.

6A to 6I are diagrams schematically showing a series of operating steps of the electronic component mounting apparatus shown in FIG. 3.

<Description of Symbols for Major Parts of Drawings>

111: first Y-axis frame 112: second Y-axis frame

115: X axis frame 120: head module

122: first mirror 125: nozzle

125a: first nozzle 125b: second nozzle

130: camera module 132: second mirror

135: area camera 140: parts supply device

141: electronic component 150: PCB transfer device

152: circuit board

The present invention relates to an electronic component mounting apparatus and a method for mounting an electronic component using the same, and more particularly, an improved electronic component mounting apparatus for minimizing copper wires of a head module, lightening the head module, and shortening mounting time. The present invention relates to a mounting method of an electronic component using the same.

An electronic component mounting apparatus is a device for mounting a component such as a semiconductor package on a circuit board. Recently, not only individual electronic components, but also circuit boards have become more dense and highly functional, and thus the number of electronic components mounted on circuit boards has increased significantly. Accordingly, the necessity of accurately operating the electronic component mounting apparatus at a high speed has greatly increased.

1 is a schematic perspective view of a conventional electronic component mounting apparatus. Referring to the drawings, the electronic component mounting apparatus is largely divided into a first Y-axis frame 11, a second Y-axis frame 12, an X-axis frame 15, a head module 20, a PCB transfer means 50, and A component supply device 40 is provided.

The first Y-axis frame 11 and the second Y-axis frame 12 extending in the Y-axis direction are provided at predetermined intervals, and the X-axis frame 15 is provided thereon. The head module 20 installed in the X-axis frame 15 is moved along the X-axis frame 15 in the X-axis direction, and the position in the X-axis direction is set, and the first Y-axis frame 11 and the second Y are set. The X-axis frame 15 having both ends mounted on the axial frame 12 moves in the Y-axis direction, whereby the position in the Y-axis direction is set. The head module 20 is equipped with nozzles 25 to adsorb the components 41 supplied from the component supply device 40, and the components 41 on the circuit board 52 transferred by the PCB transfer means 50. Will be mounted. That is, the nozzles 25 of the head module 20 descend to adsorb the electronic parts 41 of the part supply device 40 and rise together with the parts 41, and the X-axis frame 15 and the first Y By moving the shaft frame 11 and the second Y-axis frame 12, the head module 20 moves to the circuit board 52 fixed to a predetermined position by the PCB transfer means 50, and the nozzle 25 Are lowered to mount the components 41 at predetermined positions on the circuit board 52.

Referring to FIG. 2, the line scan camera 30 is disposed on the movement path of the head module 20, and photographs the bottom surface of the part 41 attached to the nozzle 25, thereby necessary for mounting the part 41. Enable position control. That is, as the part 41 passes through the line scan camera 30, the line scan camera 30 outputs image data of continuous lines. The image data output from the line scan camera 30 is provided to the vision system included in the electronic component mounting apparatus, and the components are recognized by the vision system, so that mounting at the correct position on the circuit board is possible.

According to the prior art, the head module 20 must pass the upper side of the line scan camera 30 at a uniform speed to obtain a precise image. In addition, the illuminance of the illumination system 31 coupled to the line scan camera 30 should be very high, and the illuminance should be uniform in all recesses.

Although not shown in the drawings, a method of recognizing parts by attaching an area camera to the head module is also used. However, due to the area camera attached to the head module, the weight of the head module is increased, which causes the The burden on the electric motor not only lowers the driving efficiency, but also makes the high speed movement of the head module impossible, thereby delaying the work time. In addition, the head module may be provided with a plurality of nozzles. In this case, a camera must be installed at each nozzle position, thereby increasing the manufacturing cost of the electronic component mounting apparatus.

In order to solve the above problems and other problems, an object of the present invention is to provide an electronic component mounting apparatus and a method for mounting electronic components using the same, which minimizes the copper wire of the head module and limits the illumination.

Another object of the present invention is to provide an electronic component mounting apparatus in which a head module is reduced in weight, and a method of mounting an electronic component using the same.

Still another object of the present invention is to provide an electronic component mounting apparatus and a method for mounting an electronic component using the same, which shortens the mounting work time.

In order to achieve the above object, the electronic component mounting apparatus of the present invention,

 Orthogonal to each other and capable of relative movement, each of which includes an X-axis frame and a Y-axis frame extending in left and right directions;

A head having at least one nozzle moving on the X-axis frame and adsorbing a component to be mounted on a circuit board, and a first mirror rotatably mounted in front of the nozzle to reflect an image of the component adsorbed on the nozzle module;

A component supply device disposed in front of the head module and supplying a plurality of components mounted on a circuit board;

A PCB transfer means disposed at the rear of the head module and transferring the circuit board in left and right directions; And

At least one area camera which is movable in the horizontal direction between the head module and the PCB transfer means, and which captures an image reflected by the second mirror and a second mirror that refracts the image reflected by the first mirror It includes; a camera module having a.

In the electronic component mounting apparatus of the present invention, it is preferable that the head module includes at least two heads, and each head includes a first nozzle and a second nozzle spaced apart from each other in the left and right directions. In this case, the camera module preferably includes at least two area cameras corresponding to each head.

In the electronic component mounting apparatus of the present invention, it is preferable that the head module is equipped with a light source for illuminating a component adsorbed to the nozzle, and the camera module is also equipped with a light source for illuminating the first mirror.

On the other hand, the electronic component mounting method according to another aspect of the present invention,

A first suction step of lowering the first nozzle of the head module to suck the electronic component supplied by the predetermined transfer lane provided in the component supply apparatus;

A first inspection step of photographing an electronic component adsorbed while the first nozzle is raised by the area camera;

A second suction step of lowering the second nozzle of the head module to suck the electronic parts supplied by the remaining transfer lanes of the parts supply device;

A second inspection step of aligning the area camera with the second nozzle, and imaging the adsorbed electronic component with the area camera while the second nozzle is raised;

And a mounting step of mounting the electronic components adsorbed to the first nozzle and the second nozzle on the circuit board transferred by the PCB transfer means by moving the head module.

Here, the area camera is preferably provided in the movable camera module.

In addition, in the first inspection step and the second inspection step, an image of a component reflected by the first mirror mounted at the front of the nozzle is rotated by a predetermined angle backward and reflected by the second mirror provided in the first mirror and the camera module. It is preferable to allow this to flow into the area camera.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a perspective view of an embodiment of an electronic component mounting apparatus according to the present invention, FIG. 4 is a side view of the electronic component mounting apparatus illustrated in FIG. 3, and FIG. 5 shows the electronic component mounting apparatus of FIG. 3 from above. One floor plan. For reference, the X-axis direction and the Y-axis direction shown in the drawings mean the left and right directions and the front and rear directions, respectively, and the Z direction represents the vertical direction.

Referring to FIG. 3, the electronic component 141 mounting apparatus of the present invention may have a predetermined distance from the first Y-axis frame 111 and the first Y-axis frame 111 extending in the Y-axis direction (front and rear direction). An X-axis frame 115 having a second Y-axis frame 112 spaced apart from each other and movably coupled to the first and second Y-axis frames 111 and 112 and extending in an X-axis direction (left and right directions) ). The head module 120 which is driven by itself is slidably coupled to the X-axis frame 115. Referring to FIG. 5, the head module 120 includes, for example, three individual heads 121, each head 121 having a first nozzle 125a and a second spaced apart from each other in left and right directions. The nozzle 125b is provided. According to the pressure change of the nozzle 125, the electronic components 141 supplied by the feeder 140 are adsorbed or mounted on the circuit board 152. That is, the head module 120 absorbs the electronic components 141 from the front component supply device 140, and then moves backward to transfer the circuit board 152 to the mounting work position by the PCB transfer means 150. ) The electronic component 141 is mounted.

Referring to FIG. 4, the first mirror 122 is mounted in front of the head module 120. The first mirror 122 reflects the image of the component 141 to the second mirror 132 of the camera module 130 while the nozzle 125 that absorbs the component 141 is raised. That is, the first mirror 122 disposed below the front of the nozzle 125 is rotated at a predetermined angle while the nozzle 125 picks up and lifts the component 141 and is positioned below the component 141. . The image of the component 141 captured by the first mirror 122 is reflected by the second mirror 132 and flows into the area camera 135 of the camera module 130. The first mirror 122 is lowered by the actuator so that the nozzle 125 does not interfere with the movement of the nozzle 125 while the nozzle 125 is lowered to pick up the component 141 or to be mounted on the circuit board. Be placed parallel to the direction.

The light source 123 is provided above the first mirror 122. As the light source 123, for example, a light emitting diode may be used. Accurate image data must be obtained to accurately detect the position of the component 141. At least two light sources 123 may be disposed to face each other so that illuminance is uniform for all imaging areas. A plurality of first mirrors 122 may be mounted corresponding to each component 141 adsorbed to each nozzle 125, or a plurality of nozzles 125 may be mounted by one first mirror 122. All the components 141 adsorbed on the substrate may be captured. However, when one first mirror 122 is provided, the driving device of the first mirror 122 may be more simplified.

The component supply device 140 supplies electronic components 141 mounted on a circuit board. As shown in FIG. 5, several rows of transfer lanes, that is, A and B, can be simultaneously picked up so that several electronic components 141 can be picked up. It may be provided with transfer lanes of, C, D, E, F. The PCB transfer means 150 includes a rail 151 extending in the X-axis direction to transfer each circuit board 152 to a mounting work position.

The camera module 130 includes a driving means (not shown) to move in the X-axis direction. Although not shown in the drawings, the camera module may be guided by a rail installed in the X-axis direction. The camera module 130 detects a positional error of the component 141 adsorbed to the nozzle 125. Referring to FIG. 4, the camera module 130 is extended by a predetermined angle toward the front to be reflected by the second mirror 132 and the second mirror 132 that refracts the image reflected by the first mirror 122. And a region camera 135 that captures and captures an image introduced through the lens 133 by focusing the captured image into the region camera 135.

The second mirror 132 changes the flow of the component image reflected by the first mirror 122 of the head module 120 to be introduced into the area camera 135. The second mirror 132 has an inclination of a predetermined angle, and this angle may be provided at the same angle as a predetermined angle at which the first mirror 122 rotates to acquire an image of the component 141. In this case, the part image flows into the area camera 135 disposed under the camera module 130. A light source 131 may be provided in front of the second mirror 132, and another light source 131 may be provided at opposite positions to obtain uniform illuminance.

The area camera 135 is based on an area sensor so that an image can be captured in a fixed state. In order to detect accurate data, conventional line scan cameras require relatively high illuminance and uniform illuminance throughout the imaging area, while the area camera is relatively accurate even though it is relatively limited in this light source. Data can be harvested. The area camera 135 may be provided corresponding to the number of heads 121 provided in the head module 120. For example, as shown in FIG. 5, when three heads 121 are provided in the head module 120, the camera module 130 may include three area cameras 135. Meanwhile, reference numeral 160, which is not described, is a storage box for accommodating various nozzles mounted on the head module.

Hereinafter, the driving of the electronic component mounting apparatus of the present invention will be described in detail with reference to FIGS. 5 to 6I.

First, the head module 120 is X so that a specific transfer lane of the component supply device 140, for example, the X-axis position of the B, D, and F lanes coincides with the X-axis center position of the first nozzles 125a. Move in the axial direction. This movement is performed by the head module 120 running on the X-axis frame 115. FIG. 5 illustrates a state in which the head module 120 is moved to align the first nozzles 125a and the B, D, and F lanes in the X-axis direction.

Next, as shown in FIG. 6A, the first nozzles 125a are lowered to adsorb the components 141 supplied by the B, D, and F lanes (first adsorption step). The first nozzles 125a are raised together with the adsorbed parts 141, and with this, the first mirror 122 is rotated at a predetermined angle and disposed below the adsorbed parts 141 (FIG. 6B). . Here, the images of the components 141 reflected by the first mirror 122 are introduced into the lower area camera 135 through the second mirror 132 and the lens 133 of the camera module 130. The imported image is converted into image data by the area camera 135 and transferred to the vision system in the mounting apparatus. After imaging is performed by the area camera 135 (first inspection step), the first mirror 122 is rotated in the opposite direction and disposed in parallel with the extending direction of the first nozzle 125a (FIG. 6C).

Next, as shown in Figure 6d, the head module 120 is moved in the X-axis direction, the X-axis center position of the second nozzle (125b) and the remaining lanes of the component supply device 140, that is, A, C , E Match the X-axis position of lanes. This movement is made by the movement of the head module 120 moving on the X-axis frame 115. In addition, the camera module 130 also moves in the X-axis direction so that the position of the X-axis center of the second nozzle 125b coincides with the imaging center of the area camera 135. The camera module 130 may be moved by a driving means (not shown) provided therein, and may be guided by a rail (not shown) installed in the X-axis direction.

Next, the second nozzles 125b of the head module are lowered to adsorb the components 141 supplied by the lanes (see FIG. 6A). After adsorbing the components 141 (second adsorption step), the second nozzles 120 are raised, at which time the first mirror 122 is rotated backwards and adsorbed by the second nozzles 120. The captured image of the parts 141 is captured and reflected by the second mirror 132, and the image refracted by the second mirror 132 is captured by the area camera 135 (second inspection step, see FIG. 6B). ). After the imaging is performed, the first mirror 122 is rotated forward again and disposed in parallel with the nozzle 120 (see FIG. 6C). In these processes, the first nozzles 125a maintain the adsorption of the components 141 previously picked up.

Next, as shown in FIG. 6E, the camera module 130 moves in the X-axis direction and moves to the X-axis position deviated from the head module 120. The head module 120 which absorbs the components 141 to the first nozzles 125a and the second nozzles 125b moves in the Y-axis direction and is transferred to the mounting work position by the PCB transfer means 150. It moves to the printed circuit board 152 (FIG. 6F). Here, as shown in Figure 6g, the nozzles 125 are lowered to prepare for mounting. In the prior art, the position detection of components is performed by a line scan camera while the head module moves to the circuit board. After the movement of the head module is performed, the nozzle data must be lowered to ensure accurate position data of the components. Is harvested. In the present invention, since the position data of the parts are already obtained in the adsorption process of the parts, the nozzles may be lowered together in the movement of the head module. This means that the work time required for the mounting can be shortened by that much. On the other hand, the movement of the head module 120 in the Y-axis direction is performed by the movement of the X-axis frame 115 moving on the Y-axis frame.

When the head module 120 moves above the circuit board (FIG. 6H), the nozzles 125 mount the adsorbed components 141 on the circuit board (FIG. 6I). Here, the nozzles 125 are lowered and rotated to place each component 141 in a predetermined position (mounting step).

On the other hand, in the present specification, the camera module 130 is configured such that both the first nozzle 125a and the second nozzle 125b provided in each head are captured by one area camera 135, but the present invention is The present invention is not limited thereto, and for example, the first nozzle and the second nozzle may be configured to be picked up by the respective area cameras, and in this case, part pick-ups of the first nozzle and the second nozzle need to be performed respectively for the pick-up. At the same time without the pick-up of the first nozzle and the second nozzle can be made.

According to the electronic component mounting apparatus and the mounting method of the electronic component using the same according to the present invention having the above structure, the following effects can be obtained.

First, the movement of the head module is minimized. According to the present invention, by having a camera module moving along the head module, there is no need to move the head module separately for imaging the parts. That is, the head module picked up the parts can be moved directly to the mounting work position, the copper wire of the head module is minimized, and the work delay for component recognition does not occur.

Second, the camera for imaging is mounted on a separate camera module, it is possible to reduce the weight of the head module. Therefore, the load capacity of the motor driving the head module can be reduced, and the movement of the head module can be made quickly.

Third, the imaging for the component recognition is performed in the pickup process of the parts, so that the nozzle is lowered in the process of moving the head module which picked up the parts to the mounting work position, so that the mounting can proceed quickly. Time can be minimized.

Fourth, there is provided an electronic component mounting apparatus that is less restricted by illumination. In the present invention, by performing the part recognition using the area camera instead of the line scan camera which is heavily influenced by the lighting, it is possible to harvest the accurate position data for the part while being limited in the lighting.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and any person skilled in the art to which the present invention pertains may have various modifications and equivalent other embodiments. Will understand. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (7)

Orthogonal to each other and capable of relative movement, each of which includes an X-axis frame and a Y-axis frame extending in left and right directions; A head having at least one nozzle moving on the X-axis frame and adsorbing a component to be mounted on a circuit board, and a first mirror rotatably mounted in front of the nozzle to reflect an image of the component adsorbed on the nozzle module; A component supply device disposed in front of the head module and supplying a plurality of components mounted on a circuit board; A PCB transfer means disposed at the rear of the head module and transferring the circuit board in left and right directions; And At least one area camera which is movable in the horizontal direction between the head module and the PCB transfer means, and which captures an image reflected by the second mirror and a second mirror that refracts the image reflected by the first mirror Electronic component mounting apparatus comprising; a camera module having a. The electronic component mounting apparatus of claim 1, wherein the head module includes at least two heads, and each head includes a first nozzle and a second nozzle spaced apart from each other in left and right directions. The electronic component mounting apparatus of claim 2, wherein the camera module includes at least two area cameras corresponding to each head. The electronic component mounting apparatus according to claim 1, wherein the head module is equipped with a light source for illuminating a component adsorbed to the nozzle, and the camera module is equipped with a light source for illuminating the first mirror. A first suction step of lowering the first nozzle of the head module to suck the electronic component supplied by the predetermined transfer lane provided in the component supply apparatus; A first inspection step of photographing an electronic component adsorbed while the first nozzle is raised by the area camera; A second suction step of lowering the second nozzle of the head module to suck the electronic parts supplied by the remaining transfer lanes of the parts supply device; A second inspection step of aligning the area camera with the second nozzle, and imaging the adsorbed electronic component with the area camera while the second nozzle is raised; And a mounting step of mounting the electronic components adsorbed to the first nozzle and the second nozzle on the circuit board transferred by the PCB transfer means by moving the head module. The method of claim 5, wherein the area camera is provided in a movable camera module. The method of claim 5, wherein in the first inspection step and the second inspection step, the first mirror mounted at the front of the nozzle is rotated backward by a predetermined angle, and is reflected by the second mirror provided in the first mirror and the camera module. The electronic component mounting method, characterized in that the image of the parts are introduced into the area camera.

Images