KR20110094972A - Flip chip mounter - Google Patents

Flip chip mounter Download PDF

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Publication number
KR20110094972A
KR20110094972A KR1020100014733A KR20100014733A KR20110094972A KR 20110094972 A KR20110094972 A KR 20110094972A KR 1020100014733 A KR1020100014733 A KR 1020100014733A KR 20100014733 A KR20100014733 A KR 20100014733A KR 20110094972 A KR20110094972 A KR 20110094972A
Authority
KR
South Korea
Prior art keywords
flip chip
mirror
picker
stage
flux
Prior art date
Application number
KR1020100014733A
Other languages
Korean (ko)
Inventor
이정진
Original Assignee
삼성테크윈 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성테크윈 주식회사 filed Critical 삼성테크윈 주식회사
Priority to KR1020100014733A priority Critical patent/KR20110094972A/en
Publication of KR20110094972A publication Critical patent/KR20110094972A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes

Abstract

According to the present invention, a flip chip mounter includes: a stage on which a flux is applied on an upper surface thereof, a picker on which a flip chip is seated on a lower end thereof, and a picker disposed to be accessible and spaced apart from the stage so that the flip chip is in contact with the flux; A flux receiving portion for applying the flux to the upper surface of the stage while passing between the picker and the stage when the picker is spaced apart from the stage and moving between the picker and the stage together with the flux receiving portion. And a photographing unit configured to photograph the flip chip located above the stage.

Description

Flip Chip Mounter

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip mounter for mounting a flip chip on a substrate, and more specifically, a flip that can significantly reduce work time by simultaneously performing fluxing and alignment inspection. It is about a chip mounter.

Unlike the wire bonding process, the flip chip mounting process does not require a process of connecting wires several times, and thus has an advantageous advantage in terms of yield and speed of the process. Due to these advantages, flip chip processes are widely used in recent years, and flip chip mounters for performing such flip chip processes are also widely used.

The flip chip mounter is a device that repeats the operation of lifting a flip chip placed on a flip chip feeder with a picker and lowering the flip chip onto a printed circuit board. Vision-checking the alignment of the flip chip lifted by the picker to put it down, and applying flux to the bottom of the flip chip to keep the flip chip in position on the printed circuit board Do this.

The conventional flip chip mounter is provided with an alignment inspection module for inspecting the alignment of the flip chip and a stage coated with flux to be buried on the bottom surface of the flip chip. Therefore, the picker needs to put flux on the flip chip at the stage and then move the flip chip to the alignment inspection module. Due to the movement of the picker, there is a limit in reducing the movement of the picker, and as a result, there is a difficulty in increasing the working speed of the flip chip mounter.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a flip chip mounter capable of significantly reducing the picker's copper wire.

In order to achieve the above object, a flip chip mounter according to the present invention includes a stage on which a flux is applied to an upper surface, a flip chip is seated on a lower end thereof, and the flip chip mounter is accessible and spaced apart from the stage so that the flip chip is in contact with the flux. A picker disposed thereon, a flux receiving portion passing the picker and the stage when the picker is spaced apart from the stage and applying the flux to the upper surface of the stage, and the picker together with the flux receiving portion And a photographing unit arranged to move between the stages and photographing the flip chip located above the stage.

According to the flip chip mounter according to the present invention, since the copper line of the picker can be significantly reduced, the working speed is greatly improved. Therefore, the flip chip can be mounted on the printed circuit board at a high speed, and the product yield per unit time is greatly increased.

1 is a schematic perspective view of a flip chip mounter according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view taken along the line II-II of the flip chip mounter of FIG. 1. FIG.
3 is a schematic cross-sectional view of a photographing unit of the flip chip mounter of FIG. 1.
FIG. 4 is a view schematically illustrating an operation sequence of the flip chip mounter of FIG. 1.
5 is a schematic cross-sectional view of a flip chip mounter according to another embodiment of the present invention.

Hereinafter, a flip chip mounter according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a schematic perspective view of a flip chip mounter according to an embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken along line II-II of the flip chip mounter of FIG. 1, and FIG. 3 is a schematic view of a photographing unit of the flip chip mounter of FIG. 1. It is a cross section. 4 is a view schematically illustrating an operation of the flip chip mounter of FIG. 1.

1 to 3, the flip chip mounter 1 according to the exemplary embodiment includes a stage 100, a picker 200, a flux receiving unit 300, and a photographing unit 400.

The stage 100 is formed in a plane in which the upper surface is horizontal, and the flux 102 is applied to the upper surface.

The picker 200 lifts the flip chip 210 from the flip chip supply device (not shown) and moves the flip chip 210 to the printed circuit board. The picker 200 has a suction nozzle at its lower end to allow the flip chip 210 to be seated at its lower end by adsorption. In the present embodiment, the pickers 200 are installed in the head 202 and are provided in plural so as to move the plurality of flip chips 210 at one time. In order to bury the flux 102 on the bottom surface of the flip chip 210 before the flip chip 210 is mounted on the printed circuit board, the picker 200 may approach and be spaced apart from the stage 100 in the vertical direction (V). It is arranged to be movable. When the picker 200 descends downward to approach the stage 100, the flux 102 is buried on the lower surface of the flip chip 210 seated at the lower end of the picker 200.

The flux receiver 300 receives the flux 102 and is disposed to pass between the picker 200 and the stage 100 while the picker 200 is spaced apart from the stage 100. Since the flux receiving portion 300 is formed in a cylindrical shape having an open lower side and moves while contacting the upper surface of the stage 100, the flux receiving portion 300 passes through the upper surface of the stage 100 and moves the flux 102 accommodated therein into the stage 100. Apply on the top of).

The flux receiver 300 is fixedly coupled to the ball nut 320 disposed below the stage 100. The flux receiver 300 and the ball nut 320 are fixedly coupled to each other by the receiver bridge 310. The receiver bridge 310 passes through the slot 112 formed in the stage support 110 so that the flux receiver 300 above the stage 100 and the ball nut 320 below the stage 100 can move together. By connecting the flux receiving unit 300 and the ball nut 320. Since the ball nut 320 is coupled to the ball screw 610 rotated by the motor 600, as the motor 600 is rotated, the flux receiving portion 300 moves in the horizontal direction (H).

When the flux receiver 300 passes between the picker 200 and the stage 100, the photographing unit 400 photographs the flip chip 210 positioned above the stage 100 to perform vision inspection. It is to. In the present embodiment, the photographing unit 400 includes a barrel 410, a mirror 420, a camera module 430, and an illumination unit 700.

The barrel 410 is fixedly coupled to the flux receiving portion 200 by a barrel bridge 350. Therefore, the barrel 410 is integrally moved with the flux receiving portion 300. A space is formed inside the barrel 410, and a lens 412 is installed at an upper side of the barrel 410 to allow light to enter the inner space of the barrel 410. The lens 412 is disposed so that the flux receiver 300 is positioned between the stage 100 and the picker 200 when the flux receiver 300 passes between the picker 200 and the stage 100, and is seated on the picker 200. An image of the chip 210 may be introduced into the barrel 410.

The barrel 410 is coupled to the guide 500 which is fixed relative to the stage 100. The guide 500 slidably grips the barrel 410, and includes a fixing bar 510 disposed above the barrel 410.

The barrel 410 is formed to protrude therefrom, and when the moving distance of the barrel 410 reaches a predetermined amount, the stoppers 402 and 404 are caught by the fixing bar 510 of the guide 500 to limit the moving range of the barrel 410. It is provided. In the present embodiment, two stoppers 402 and 404 are provided, and when the barrel 410 moves by a predetermined distance in the horizontal direction H, one of the two stoppers 402 and 404 is caught by the fixing bar 510. do. Therefore, the movement range of the barrel 410 is limited to the interval between the two stoppers 402 and 404, and the barrel 410 is prevented from moving beyond the interval.

The mirror 420 is disposed inside the barrel 410 and is fixedly installed under the lens 412. Since the mirror 420 is fixedly disposed in the barrel 410, the mirror 420 is moved together with the flux receiver 300. The mirror 420 is disposed to be positioned between the picker 200 and the stage 100 when the flux receiver 300 passes between the picker 200 and the stage 100. The mirror 420 reflects the image of the flip chip 210 disposed above the mirror chip 420 in the direction of movement of the picker 200, that is, the direction crossing the vertical direction V. FIG. In the present embodiment, the mirror 420 is disposed to form an angle of 45 degrees with respect to the horizontal direction (H) to reflect the image of the flip chip 210 in the horizontal direction (H).

The camera module 430 is fixedly installed inside the barrel 410 and is disposed to face the mirror 420. Therefore, the camera module 430 may capture an image of the flip chip 210 reflected from the mirror 420. In general, the camera module 430 should secure the distance between the image pickup device and the objective lens to secure the focal length. However, in the present embodiment, since the camera module 430 is disposed in the horizontal direction (H) instead of the vertical direction (V), the camera module 430 is disposed in the horizontal direction (V) rather than the camera module 430 in the horizontal direction (V). The thickness can be effectively reduced.

The lighting unit 700 is fixedly installed on the barrel 410 such that the mirror 420 is positioned below the flip chip 210, and positioned between the mirror 420 and the flip chip 210. Since the mirror 420 and the barrel 410 are relatively fixed to each other, the lighting unit 700 is also relatively fixed to the mirror 420. The lighting unit 700 illuminates the flip chip 210 so that the camera module 430 can clearly photograph the flip chip 210.

In the present embodiment, the lighting unit 700 includes a first light 710 and a second light 720. The first light 710 is disposed to emit light toward the optical path P between the mirror 420 and the flip chip 210 when the mirror 420 is positioned below the flip chip 210. . The first lighting 710 is formed in a ring shape, and light emitting diodes are arranged in a line around an inner circumference thereof. Since the first lighting 710 is formed in a ring shape, the light uniformly shines on the surface of the spherical solder ball attached to the flip chip 210, so that vision inspection of the solder ball is effectively performed. To lose. In addition, since the first lighting 710 includes small light emitting diodes arranged in a line, the first lighting 710 has a small thickness, and consequently, helps to reduce the overall thickness of the photographing unit 400.

The second illumination 720 is disposed along the circumference of the optical path P between the first illumination 710 and the mirror 420 and between the mirror 420 and the flip chip 210 and the flip chip 210. It is arranged to emit light toward the lower surface of the. The second lighting 720 is also formed in a ring shape and the light emitting diodes are arranged in a line around the inner circumference thereof. The inner circumference of the second light 720 is inclined at an angle of about 45 degrees with respect to the horizontal direction H, and emits light toward the flip chip 210 located above. The second illumination 720 illuminates the entire flip chip 210 so that the camera module 430 obtains a clear image of the flip chip 210, thereby effectively performing the alignment inspection of the flip chip 210. . Since the second lighting 720 also includes small light emitting diodes arranged in a row, the thickness of the second lighting 720 is small, which helps to reduce the thickness of the photographing unit 400.

Hereinafter, an operation method and effects of the flip chip mounter 1 according to the present embodiment will be described.

The picker 200 picks up the flip chip 210 in a flip chip supply device (not shown), and is positioned above the stage 100 to which the flux 102 is applied (I in FIG. 4).

The picker 200 approaches the stage 100 to bury the flux 102 on the bottom surface of the flip chip 210, and then separate from the stage 100 again (II in FIG. 4). When the flip chip 210 is in contact with the flux 102, the flux 102 is buried in the bottom surface of the flip chip 210 and the contact marks 104 of the flip chip 210 remain in the flux 102. Only a small amount of flux 102 remains in the portion where the contact marks 104 are formed in the flip chip 210.

When the picker 200 is spaced apart from the stage 100, the flux receiving unit 300 and the photographing unit 400 pass between the picker 200 and the stage 100 together (III in FIG. 4). The flux receiver 300 moves the upper surface of the stage 100 by the motor 600, and applies the flux 102 accommodated therein to the upper surface of the stage 100. Accordingly, the marks 104 in which the flip chip 210 is in contact with the flux 102 disappear, and the flux 102 is evenly applied to the upper surface of the stage 100. When the photographing unit 400 is horizontally moved and the lens 412 is positioned below the flip chip 210 positioned at the left edge, the motor 600 stops rotating so that the flux receiving unit 200 and the photographing unit 400 Is stopped. When the photographing unit 400 is stopped, the first light 710 and the second light 720 are turned on, and the camera module 430 photographs the flip chip 210.

As the flux receiver 300 and the imaging unit 400 continue to move, the imaging unit 400 is a flip chip 210 seated on the center picker 200 and a flip chip seated on the picker 200 positioned at the right edge. (210) is taken in sequence (IV in Fig. 4). At this time, the stopper 402 is caught by the fixing bar 510 so that the photographing unit 400 is no longer moved to the right.

After the photographing of all the flip chips 210 is finished, the flux receiving unit 300 and the photographing unit 400 return to their original positions (V in FIG. 4). The flux accommodating part 300 applies the flux 102 evenly to the upper surface of the stage 100 once again while returning to the original position. At this time, the stopper 404 is caught by the fixing bar 510 so that the photographing unit 400 is no longer leftward. Meanwhile, the picker 200 moves the flip chip 210 to the upper side of the printed circuit board, and then mounts the flip chip 210 on the printed circuit board. In this case, the image of the flip chip 210 photographed by the photographing unit 400 is used to calculate a position relative to the picker 200 of the flip chip 210, and the picker 200 uses the calculation result. The flip chip 210 is seated in the correct position on the printed circuit board.

According to the flip chip mounter 1 according to the present embodiment as described above, the flux 102 is applied to the flip chip 210, and the alignment state of the flip chip 210 and the solder ball are attached by vision. Inspection is done in the same place. Therefore, according to the present exemplary embodiment, unlike the conventional flip chip mounter, the picker 200 does not need to be horizontally moved to the upper side of the photographing unit after fluxing, and thus the copper line becomes very short. Therefore, the working speed of the flip chip mounter 1 can be greatly improved.

In addition, since the picker 200 should be sufficiently spaced apart from the stage 100 so that the flux receiving unit 300 and the photographing unit 400 can pass under the picker 200, The smaller the thickness, the shorter the copper wire of the picker 200. In particular, it is not difficult to reduce the thickness of the flux accommodating part 300, but the thickness of the photographing part 400 is difficult to reduce in order to secure a sufficient focal length. However, in the present exemplary embodiment, the photographing unit 400 may include the mirror 420 and the camera module 430 arranged horizontally, so that the thickness thereof may be effectively reduced. Therefore, according to the flip chip mounter 1 according to the present exemplary embodiment, since the copper wire of the picker 200 can be shortened, the working speed can be further increased.

Next, a flip chip mounter according to another embodiment of the present invention will be described with reference to the accompanying drawings.

5 is a schematic cross-sectional view of a flip chip mounter according to another embodiment of the present invention. In Fig. 5, the components having the same member numbers as those shown in Figs. 1 to 4 mean that they are substantially the same.

Referring to FIG. 5, the flip chip mounter 2 according to the present exemplary embodiment is similar to the flip chip mounter 1 illustrated in FIG. 1, and the stage 100, the picker 200, the flux receiving unit 300, and the photographing unit 430 is provided.

Since the stage 100, the picker 200, and the flux receiving unit 300 are the same as those of the flip chip mounter 1 illustrated in FIG. 1, the detailed description thereof will be omitted.

In the present embodiment, the photographing unit 430 is the camera module 430 fixed to the flux receiving unit 300 and is disposed in the vertical direction. Accordingly, the photographing unit 430 photographs the flip chip 210 while moving between the location shown by the solid line and the position shown by the virtual line in FIG. 5 together with the flux receiving unit 300.

Therefore, even if the flip chip mounter 2 according to the present embodiment is moved only in the vertical direction V in place without the picker 200 moving in the horizontal direction H, fluxing and alignment inspection may be performed. As a result, the copper wire of the picker 200 is reduced, so that the working speed of the flip chip mounter 2 is effectively improved.

Meanwhile, in the flip chip mounter 1 illustrated in FIG. 1, the barrel 410 of the photographing unit 400 is disposed in a direction parallel to the moving direction of the flux receiving unit 300, but the barrel 410 is configured to accommodate the flux. It may be arranged in a direction perpendicular to the movement direction of the unit 300 and the movement direction of the picker 200 at the same time.

In addition, in the flip chip mounter 1 illustrated in FIG. 1, the first light 710 and the second light 720 are described as having a light emitting diode, but the first light 710 and the second light 720 are described. In addition to the light emitting diode,) may include various kinds of light sources such as filament.

In addition, the flip chip mounters 1 and 2 according to the exemplary embodiment have been described as capturing the flip chip 210 while the picker 200 is fixed and the photographing unit 400 is moved. The flip chip 210 may be photographed by allowing the picker 200 to pass through the upper side of the photographing unit 400 in a state where the image is stopped above the stage 100.

As mentioned above, although some embodiments of the present invention have been described, the present invention is not limited thereto and may be embodied in various forms within the scope of the technical idea of the present invention.

1,2 ... flip chip mounter 100 ... stage
102 ... Flux 200 ... Picker
210 ... flip chip 300 ... flux receptacle
400 ... shooting 420 ... mirror
430 ... Camera Module 500 ... Guide
600 ... motor 610 ... ball screw

Claims (8)

A stage on which flux is applied to the upper surface;
A picker having a flip chip seated at a lower end thereof, the picker being disposed to be accessible and spaced apart from the stage such that the flip chip contacts the flux;
A flux accommodating part for applying the flux to an upper surface of the stage while passing between the picker and the stage when the picker is spaced apart from the stage; And
A flip chip mounter disposed to move between the picker and the stage together with the flux receiving part and to photograph the flip chip positioned above the stage. The method of claim 1,
Wherein,
A mirror for reflecting an image of a flip chip positioned on an upper side in a direction crossing the moving direction of the picker;
A flip chip mounter disposed to face the mirror and having a camera module for capturing an image of the flip chip reflected from the mirror. The method of claim 2,
And the camera module moves with the mirror and is fixed relative to the mirror. The method of claim 2,
And a lighting unit arranged to be fixed relative to the mirror so as to be positioned between the mirror and the flip chip when the mirror is positioned below the flip chip, and having an illumination unit for illuminating the flip chip. The method of claim 4, wherein
The lighting unit,
And a first light disposed around a light path between the mirror and the flip chip, the first light emanating light toward the light path. The method of claim 5,
The lighting unit,
And a second light disposed between the first light and the mirror along a circumference of an optical path between the mirror and the flip chip and arranged to emit light toward the flip chip. Mounter. The method of claim 2,
Wherein,
A mirror through which the mirror and the camera module are fixed,
A guide for holding the barrel so as to be slidably movable;
And a stopper provided to protrude from the barrel and limiting the range of movement of the barrel when the moving distance of the barrel reaches a predetermined distance. The method of claim 2,
The picker is composed of a plurality of arranged parallel to the direction of movement of the flux receiving portion,
And the mirror and the camera module move together with the flux accommodating unit to photograph the flip chips in sequence.
KR1020100014733A 2010-02-18 2010-02-18 Flip chip mounter KR20110094972A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100014733A KR20110094972A (en) 2010-02-18 2010-02-18 Flip chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100014733A KR20110094972A (en) 2010-02-18 2010-02-18 Flip chip mounter

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101340486B1 (en) * 2012-08-06 2013-12-12 한미반도체 주식회사 Flip chip bonding apparatus and controlling method thereof
KR101360007B1 (en) * 2012-09-27 2014-02-07 한미반도체 주식회사 Flip chip bonding apparatus
KR101380627B1 (en) * 2013-01-16 2014-04-04 한미반도체 주식회사 Flip chip bonding device and control method of the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101340486B1 (en) * 2012-08-06 2013-12-12 한미반도체 주식회사 Flip chip bonding apparatus and controlling method thereof
KR101360007B1 (en) * 2012-09-27 2014-02-07 한미반도체 주식회사 Flip chip bonding apparatus
KR101380627B1 (en) * 2013-01-16 2014-04-04 한미반도체 주식회사 Flip chip bonding device and control method of the same

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