JP5954757B2 - Appearance inspection device - Google Patents

Description

The present invention relates to an appearance inspection apparatus for inspecting the appearance of an electronic component.

Various electronic components such as bare chips and CSP (Chip Size Package) are shipped after the appearance is imaged and the presence or absence of cracks, chips or wrinkles is inspected. For example, in an electronic component having a wiring layer inside, if there is a crack that has penetrated to the inside, disconnection of the wiring is suspected. For this reason, the appearance inspection is important for determining defective electronic components.
Patent Document 1 describes a specific example of an appearance inspection apparatus that images an upper part and two side parts of an electronic component (semiconductor element) with a single camera. By performing imaging of the upper part and two side parts of the electronic component with one camera, the number of cameras can be suppressed.

JP 2003-254726 A

By the way, in recent years, with the downsizing of electronic parts, in the appearance inspection, accuracy on the order of micrometers is often required, and a camera with a high pixel count is employed.
However, if a camera with a large number of pixels is used, the data of the captured image becomes large, and it takes a long time for data transfer and image analysis processing. As a result, it is necessary for visual inspection of each electronic component. The problem that time will become long arises.
The present invention is made in view of such circumstances, and an object of the present invention is to provide an appearance inspection apparatus for inspecting an inspection target region of a rectangular parallelepiped electronic component while suppressing an increase in processing time. To do.

The appearance inspection apparatus according to the present invention that meets the above-described object is an appearance inspection apparatus that visually inspects an inspection target area of a rectangular parallelepiped electronic component having opposing side parts A and B , wherein the inspection target area is the side part A. The first and second imaging means for imaging different portions of the inspection target area , which are present on one side and the other side, and one side and the other side of the side part B, respectively, change the traveling direction of light. Thus, the first image picked up by the first image pickup means is caused to contain one side of the side part A and one side of the side part B, and the second image pickup means is picking up an image. Optical path adjusting means for accommodating the other side of the side part A and the other side of the side part B on the second image, and illuminations a and b for irradiating the light reflected by the side parts A and B, respectively. wherein the optical path adjusting means, the side a, the beam splitter A1 which respectively face the B, B The light emitted from the illumination a passes through the beam splitter A1, is reflected by the side surface A, passes through the beam splitter A1, and travels toward the first and second imaging means, and the illumination b. The light emitted from the beam splitter B1 passes through the beam splitter B1, is reflected by the side surface B, passes through the beam splitter B1, travels toward the first and second imaging means, and the beam splitter A1 and the illumination a are The side portions A and B can be moved together in the facing direction, and the beam splitter B1 and the illumination b can be moved together in the facing direction. The The rectangular parallelepiped shape includes a cubic shape.

In the appearance inspection apparatus according to the present invention, the optical path adjusting means further accommodates one side of each of the side part A side and the side part B side of the bottom part of the electronic component in the first image, It is preferable that the second image further includes the other side of the bottom portion on the side A side and the side B side.

In the appearance inspection apparatus according to the present invention, the optical path adjusting means further includes a beam splitter A2 provided below the beam splitter A1 and a beam splitter B2 provided below the beam splitter B1, and the illumination The light emitted from a further passes through the beam splitter A2, is reflected on the side A side of the bottom, passes through the beam splitter A2, and travels toward the first and second imaging means, The light emitted from the illumination b further passes through the beam splitter B2 and is reflected on the side B side of the bottom, passes through the beam splitter B2 and passes to the first and second imaging means. Oppositely, the beam splitter A2 is integrated with the beam splitter A1 and the illumination a and is movable in a direction in which the side portions A and B face each other. Splitter B2, the become a beam splitter B1 and the illumination b integral with the side A, B is preferably movable in opposite directions.

In the appearance inspection apparatus according to the present invention, it is preferable that the first and second images are combined to obtain an image of the entire side portion A and an image of the entire side portion B.

The visual inspection apparatus according to the present invention further includes N imaging means for imaging the side portions A and B of the electronic component, and the optical path adjustment means is configured to display the images captured by the N imaging means, A part of the side part A and a part of the side part B are respectively accommodated, and the first and second images and the images picked up by the N imaging means are combined, An image of the entire side portion B can be obtained. However, N is a natural number.

In the appearance inspection apparatus according to the present invention, the optical path adjusting means refracts or reflects light so that the entire image of the side part A and the entire image of the side part B are stored in parallel within a virtual frame. It is preferable that the first and second imaging means capture one side and the other side of the virtual frame.

In the visual inspection apparatus according to the present invention, an optical path shift mechanism that refracts or reflects light and causes the first imaging unit that has captured one side of the virtual frame to capture the center side of the virtual frame, It is preferable to provide.

In the appearance inspection apparatus according to the present invention, the position of the first imaging unit along the imaging direction of the first imaging unit, and the imaging direction of the second imaging unit of the second imaging unit. It is preferable to further include a positioning mechanism that adjusts the position along the line.

The visual inspection apparatus according to the present invention includes first and second imaging units that respectively image different parts (for example, one side and the other side) of the inspection target area of the electronic component. The image is divided into images picked up by a plurality of image pickup means. For this reason, compared with imaging with only one imaging unit, an area unnecessary for appearance inspection in the entire captured image is suppressed, and as a result, processing time for performing appearance inspection can be shortened.
Since the optical path adjustment means is provided, it is possible to suppress the arrangement of the first and second imaging means from being limited.

1 is a side view of an appearance inspection apparatus according to an embodiment of the present invention. It is explanatory drawing of the same external appearance inspection apparatus. It is explanatory drawing of the image settled in a virtual frame. (A), (B) is explanatory drawing of an optical path shift mechanism, respectively. It is explanatory drawing of the external appearance inspection apparatus which concerns on a 1st modification. (A), (B) is explanatory drawing of the image imaged with the 1st and 2nd imaging means of the same external appearance inspection apparatus, respectively. (A), (B) is explanatory drawing which shows a mode that a beam splitter and illumination each move. It is a side view of the external appearance inspection apparatus which concerns on a 2nd modification. It is explanatory drawing of the same external appearance inspection apparatus. It is a side view of the external appearance inspection apparatus which concerns on a 3rd modification. It is explanatory drawing of the same external appearance inspection apparatus.

Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
As shown in FIG. 1 and FIG. 2, an appearance inspection apparatus 10 according to an embodiment of the present invention picks up images of different portions of an inspection target area of a rectangular parallelepiped (including cubic) electronic component 11. Means 12 (first image pickup means) and image pickup means 13 (second image pickup means), and an optical path adjusting means 14 for changing the traveling direction of light, are provided opposite to the electronic component 11 (provided on both sides in the width direction). This is an apparatus for inspecting the appearance of the side portion 15 (side portion A) and the side portion 16 (side portion B). In the present embodiment, the inspection target regions exist on one side and the other side of the side portion 15 and on one side and the other side of the side portion 16, respectively. Details will be described below.

As shown in FIGS. 1 and 2, the electronic component 11 having a rectangular shape in a plan view in which an appearance inspection is performed by the appearance inspection apparatus 10 has a width and a depth that are longer than a thickness and includes a rectangle (including a square, The same).
The appearance inspection apparatus 10 includes a plurality of nozzles (an example of a work holding unit) 17 that sucks the upper side of the electronic component 11, and each cylindrical nozzle 17 holds the electronic component 11 that is sucked and held horizontally. Sequentially, the side portions 15 and 16 are conveyed to one position where they are imaged (hereinafter also referred to as “inspection position P”).

As shown in FIG. 1, an optical path adjusting unit 14 is provided in the vicinity of the electronic component 11 transported to the inspection position P, and the optical path adjusting unit 14 includes a plurality of beams arranged at positions away from the electronic component 11. Splitters 18 to 26 are provided. The following description is based on the assumption that the electronic component 11 is arranged at the inspection position P.
The beam splitters 18 and 19 as viewed from the side are provided at the same height as the electronic component 11, and the beam splitters 20 and 21 having the same shape as the beam splitters 18 and 19 are in close contact with the beam splitters 18 and 19, respectively. In the state, it is arranged to face the side portions 15 and 16.

Viewed from the side, the parallelogram beam splitters 22 and 23 are fixed to the lower part of the beam splitter 20 and the lower part of the beam splitter 21, respectively. The beam splitters 24 and 25 are disposed below the beam splitters 22 and 23 and spaced from the beam splitters 22 and 23. The beam splitters 24 and 25 having the same shape are provided in close contact with each other. Below the beam splitters 24 and 25, a beam splitter 26 is provided at a position away from the beam splitters 24 and 25.
The beam splitters 18 to 26 are fixed by a support member (not shown). The optical path adjusting means may be formed by a beam splitter having a shape other than the beam splitters 18 to 26.

At the same height position as the beam splitters 18 and 20, an illumination 27 is provided on the opposite side of the electronic component 11 from the beam splitters 18 and 20, and is provided at the same height position as the beam splitters 19 and 21. An illumination 28 is provided on the side opposite to the electronic component 11 at a distance from the beam splitters 19 and 21. The illuminations 27 and 28 are arranged so as to illuminate the beam splitters 18 and 20 and the beam splitters 19 and 20, respectively.

As shown in FIGS. 1 and 2, the imaging unit 12 is supported by the fixing member 29 at the same height as the beam splitters 24 and 25, and the imaging direction of the imaging unit 12 is directed toward the beam splitters 24 and 25. It is kept horizontal. The imaging unit 13 is supported by the fixing member 30 at the same height as the beam splitter 26, and the imaging direction of the imaging unit 13 is kept horizontal toward the beam splitter 26.

The imaging directions of the imaging units 12 and 13 are the same (that is, the imaging direction of the imaging unit 12 and the imaging direction of the imaging unit 13 are parallel). Hereinafter, the imaging direction of the imaging units 12 and 13 is defined as the Y direction (Y direction positive direction), and the horizontal direction orthogonal to the Y direction is defined as the X direction.
In the electronic component 11, the longitudinal directions of the side portions 15 and 16 are along the X direction, and the side portion 16 is arranged on the Y direction positive side of the side portion 15. As shown in FIG. 2, the side 15 is viewed in the positive direction of the Y direction (when the side 15 is viewed from the front), the right side of the side 15 is the positive side in the X direction, and the left side of the side 15 is negative in the X direction. Let it be the side.
The imaging unit 13 is arranged at a position lower than the imaging unit 12 on the X direction positive side and the Y direction positive side from the imaging unit 12.

The fixing members 29 and 30 are fixed to a nut block 32 attached to the screw shaft 31. The screw shaft 31 is arranged in the Y direction and rotates by driving a motor 33 coupled to the screw shaft 31 to move the nut block 32. The imaging units 12 and 13 move in the Y direction positive direction or the Y direction negative direction together with the nut block 32 by the rotation of the screw shaft 31. The direction in which the imaging means 12 and 13 move is determined by the direction in which the motor 33 rotates.
Note that the mechanism for moving the imaging means 12 and 13 is not limited to one having a screw shaft and a nut block. Furthermore, the mechanism for moving the imaging unit 12 and the mechanism for moving the imaging unit 13 may be independent of each other.

Hereinafter, a state in which the imaging units 12 and 13 image the side portions 15 and 16 of the electronic component 11 will be described.
First, as shown in FIG. 1, the light emitted from the illumination 27 is transmitted through the beam splitters 18 and 20 in order, reflected by the side portion 15 of the electronic component 11, and proceeds in the negative direction of the Y direction. After entering the beam splitter 20, the beam is reflected downward at the boundary between the beam splitters 18 and 20 and enters the beam splitter 22. The light reflected twice in the beam splitter 22 travels downward, exits the beam splitter 22, enters the beam splitter 24, and then reflects the light reflected at the boundary between the beam splitters 24, 25 and the beam splitter 25. Branches into the light entering the. The boundaries of the beam splitters 24 and 25 are inclined in a direction that decreases toward the Y direction negative side.

The light reflected at the boundary between the beam splitters 24 and 25 travels in the negative direction in the Y direction toward the image pickup means 12, and is within the image 12a (first image) shown in FIG. It is stored in.
On the other hand, the light that has entered the beam splitter 25 travels downward, enters the beam splitter 26, travels in the negative direction of the Y direction, and is imaged by the imaging means 13 as shown in FIG. Image).

As shown in FIG. 2, the imaging unit 12 is in a position for imaging the X direction negative side (one side) of the electronic component 11, and the imaging unit 13 images the X direction positive side (the other side) of the electronic component 11. It is in the position to do. The lower half of the image 12a captures the region from the X direction negative side to the center of the side portion 15, and the lower half of the image 13a captures the region of the side portion 15 from the X direction positive side to the center. It is done. The imaging means 12 and 13 are arranged so that the image of the entire side part 15 of the electronic component 11 can be obtained by combining the image 12a and the image 13a.

As shown in FIG. 1, the light emitted from the illumination 28 sequentially passes through the beam splitters 19 and 21, is reflected in the positive direction in the Y direction by the side portion 16 of the electronic component 11, and enters the beam splitter 21. After that, the light is reflected downward at the boundary between the beam splitters 19 and 21 and enters the beam splitter 23. The light reflected twice in the beam splitter 23 travels downward, exits the beam splitter 23 and enters the beam splitter 24, and then reflects the light reflected at the boundary between the beam splitters 24 and 25 and the beam splitter 25. Branches into the light entering the.

The light reflected at the boundary between the beam splitters 24 and 25 travels in the negative direction in the Y direction toward the image pickup means 12, and is within the image 12a (first image) shown in FIG. It is stored in.
On the other hand, the light that has entered the beam splitter 25 travels downward, enters the beam splitter 26, travels in the negative direction of the Y direction, and is imaged by the imaging means 13 as shown in FIG. Image).

As a result, in the image 12a in which the region from the X direction negative side to the center of the side portion 15 of the electronic component 11 is captured in the lower half, the X direction negative side of the side portion 16 of the electronic component 11 is displayed in the upper half. The area from the center to the center is captured as an upside down image. Then, in the image 13a in which the region from the X direction positive side to the center of the side portion 15 of the electronic component 11 is captured in the lower half, the region from the X direction positive side to the center of the side portion 16 is displayed in the upper half. Is captured as an upside down image. That is, the optical path adjusting unit 14 stores the X direction negative side (one side) of the side part 15 of the electronic component 11 and the X direction negative side (one side) of the side part 16 in the image 12a, The X direction positive side (other side) of the side part 15 of the component 11 and the X direction positive side (other side) of the side part 16 are accommodated.
Therefore, an image of the entire side portion 16 of the electronic component 11 is obtained by combining the image 12a and the image 13a. In the present embodiment, a part of the image of each of the side parts 15 and 16 of the electronic component 11 captured in the image 12a is a part of the image of each of the side parts 15 and 16 of the electronic component 11 captured in the image 13a. Duplicate with some.

Here, it is assumed that the rectangular virtual frame 34 is arranged horizontally and kept between the beam splitters 22 and 23 and the beam splitters 24 and 25 as shown in FIG. Looking up at the virtual frame 34 from below, as shown in FIG. 3, the image of the entire side part 16 of the electronic component 11 is placed in the virtual frame 34 in a state along the X direction in the Y direction positive half. The entire image of the side part 15 of the electronic component 11 is accommodated in the X direction negative half in the Y direction negative half.

Therefore, the beam splitters 18, 19, 20, 21, 22, 23 as a whole reflect light, so that the image of the entire side part 15 of the electronic component 11 and the image of the entire side part 16 of the electronic component 11 are virtual frames 34. It will be stored in parallel.
In the present embodiment, an optical path adjustment block is mainly configured by the beam splitters 18, 19, 20, 21, 22, and 23.
Then, the imaging means 12 images the X direction negative side of each of the side parts 15 and 16 of the electronic component 11, and the imaging means 13 images the X direction positive side of each of the side parts 15 and 16 of the electronic component 11. This means that the imaging means 12 and 13 are arranged so as to capture the X direction negative side (one side) and the X direction positive side (other side) of the virtual frame 34, respectively.

By adopting a structure in which an image of the entire side part 15 of the electronic component 11 and an image of the entire side part 16 of the electronic component 11 are accommodated in parallel in the virtual frame 34, images captured by the imaging units 12 and 13 respectively. Therefore, the design for accommodating the entire image of the side portions 15 and 16 of the electronic component 11 is facilitated.
The optical path adjustment block uses only the refraction of light or uses the reflection and refraction of light to display the image of the entire side part 15 of the electronic component 11 and the image of the entire side part 16 of the electronic component 11. It may be designed to fit within the virtual frame 34.

As shown in FIG. 2, the image processing means 40 is connected to the imaging means 12 and 13, and the image processing means 40 acquires the data of the image 12a and the data of the image 13a from the imaging means 12 and 13, respectively, and the software program Are used to inspect the side parts 15 and 16 of the electronic component 11 for cracks and chips (in the present embodiment, the entire side part 15 and the entire side part 16 are inspection target areas). The inspection for the presence or absence of cracks or chips may be performed on each of the images 12a and 13a, or the images 12a and 13a are synthesized to obtain an image of the entire side part 15 and an image of the entire side part 16 of the electronic component 11. The image of the entire side portion 15 and the image of the entire side portion 16 may be performed. The image processing means 40 includes a storage medium storing a software program, a CPU, and a memory.

Since the light receiving range of a normal image pickup means is a square shape, the image is picked up particularly when an image of an electronic component such as the electronic component 11 in which the lateral widths of the side portions A and B are longer than the thickness is taken by one image pickup means. The image includes many regions other than the side portions A and B. As a result, the data size of the image captured for the appearance inspection of the entire side part A and the entire side part B increases, the time for transferring the captured image to the image processing means, and the appearance inspection by the image processing means The processing time becomes longer.
On the other hand, when two images 12a and 13a are obtained using two image pickup units 12 and 13 as in the present embodiment, one image pickup unit having a larger number of pixels than the image pickup units 12 and 13 is used. Compared to the above, it is possible to suppress the increase in the data of the entire image, and the processing time for transferring the captured image and the appearance inspection by the image processing means 40 is shortened, and the entire side part A and side part B of one electronic component are reduced. The time required for the overall appearance inspection can be shortened. Furthermore, for the two image data, the transfer of the image data and the appearance inspection processing of the two images by the image processing means can be performed in parallel. Inspection time can be shortened.
In addition, in the present embodiment using a plurality of image pickup means, it is possible to suppress a decrease in the number of pixels corresponding to the entire side part A and the entire side part B of the electronic component in the picked-up image, resulting in a decrease in inspection accuracy. Can also be avoided.

In the present embodiment, a single-focus camera is employed for each of the imaging means 12 and 13. For this reason, in order to clearly image the side parts A and B for various sizes of electronic components having different distances between the side part A and the side part B, the distance between the side part A and the side part B is set to be the same. Accordingly, it is necessary to adjust the optical distance of the imaging means 12 and 13.
In the appearance inspection apparatus 10, the position of the imaging unit 12 along the Y direction (that is, the imaging direction of the imaging unit 12) and the Y direction of the imaging unit 13 (that is, imaging of the imaging unit 13) by the operation of the motor 33. The optical distance of the imaging means 12 and 13 is adjusted by changing the position along the direction.
In the present embodiment, the positioning mechanism is mainly composed of the screw shaft 31, the nut block 32, and the motor 33.

Further, an optical path shift mechanism 35 shown in FIG. 4A that reflects light may be provided between the beam splitters 24 and 25 and the imaging unit 12. As shown in FIG. 4A, the optical path shift mechanism 35 includes a plurality of beam splitters 36, 37, and 38. The beam splitters 36 and 37 are in close contact with each other, and the beam splitter 38 is provided at a position having a distance from the beam splitter 37 in the negative direction of the X direction.

The light traveling in the Y direction negative direction from the beam splitter 24 passes through the beam splitters 36 and 37 while reflecting, enters the beam splitter 38, exits from the beam splitter 38 in the Y direction negative direction, and is imaged. Head to 12. The light emitted from the beam splitter 38 travels on the negative side in the X direction compared to when entering the beam splitter 36. Therefore, the optical path shift mechanism 35 can reflect the light and cause the imaging unit 12 that has captured the X direction negative side of the virtual frame 34 to capture the center side of the virtual frame 34.
For this reason, when the entire side part A and the entire side part B are electronic components having a size that can be accommodated in an image captured by the imaging unit 12, the imaging unit 12 can be used by using the optical path shift mechanism 35. It is possible to fit the entire side part A and side part B into one image.

The optical path shift mechanism is not limited to the one provided with a plurality of beam splitters. For example, even if the optical path shift mechanism 35a is composed of one beam splitter 39 that is rectangular in plan view as shown in FIG. Good. As shown in FIG. 4B, the beam splitter 39 is arranged to be inclined with respect to the X direction and the Y direction, and uses the light refraction to capture the negative side of the virtual frame 34 in the X direction. The means 12 is made to grasp the center side of the virtual frame 34, and the entire side part A and side part B of the electronic component are accommodated in one image.

Up to this point, the appearance inspection apparatus 10 that images the side portions 15 and 16 of the electronic component 11 using the imaging units 12 and 13 has been described. However, the appearance inspection apparatus 50 illustrated in FIG. In addition to the 11 side portions 15 and 16, a part of the bottom 51 of the electronic component 11 is imaged. Hereinafter, the appearance inspection apparatus 50 will be described. However, the same components as those of the appearance inspection apparatus 10 are denoted by the same reference numerals and detailed description thereof is omitted.

As shown in FIG. 5, the appearance inspection apparatus 50 includes an optical path adjustment unit 52 that changes the traveling direction of light. In addition to the beam splitters 24, 25, and 26, the optical path adjusting unit 52 is provided with beam splitters 53 and 54 that face the side portions 15 and 16 of the electronic component 11, and beam splitters 55 and 56 that are provided below the beam splitter 53, respectively. Beam splitters 57 and 58 provided below the beam splitter 54 and beam splitters 59 and 60 disposed below the electronic component 11 are provided.
The beam splitters 53 and 56 are in close contact with the beam splitter 55, the beam splitters 54 and 58 are in close contact with the beam splitter 57, and the beam splitter 59 is in contact with the beam splitter 60.

Below the beam splitter 56, a diffusing plate 61 and an illumination 62 for irradiating upward are arranged. A diffusion plate 63 and an illumination 64 for irradiating upward are also arranged below the beam splitter 58.
The light emitted from the illumination 62 and transmitted through the diffusion plate 61 sequentially passes through the beam splitters 56, 55, 53, then reflects off the side part 15 of the electronic component 11, and passes through the beam splitters 53, 55, 59 in order. And enters the beam splitter 24. The light that has entered the beam splitter 24 branches off at the boundary surface between the beam splitters 24 and 25, one of which travels in the negative direction in the Y direction and goes to the imaging unit 12, and the other passes through the beam splitters 25 and 26. Then, it proceeds toward the imaging means 13 in the negative direction of the Y direction.

The light emitted from the illumination 64 and transmitted through the diffusion plate 63 sequentially passes through the beam splitters 58, 57, and 54, then reflects off the side part 16 of the electronic component 11, and passes through the beam splitters 54, 57, and 60 in order. And enters the beam splitter 24. The light that has entered the beam splitter 24 branches off at the boundary surface between the beam splitters 24 and 25, one of which travels in the negative direction in the Y direction and goes to the imaging unit 12, and the other passes through the beam splitters 25 and 26. Then, it proceeds toward the imaging means 13 in the negative direction of the Y direction.

As a result, as shown in FIG. 6A, the image 12b (first image) captured by the imaging unit 12 includes an area from the negative side in the X direction to the center of the side portion 15 of the electronic component 11, and the electronic A region from the X direction negative side to the center of the side part 16 of the component 11 is captured. On the other hand, the image 13b (second image) captured by the imaging unit 13 includes an area from the X-direction positive side to the center of the side portion 15 of the electronic component 11 and the electronic component as shown in FIG. The area | region from the X direction positive side of the 11 side parts 16 to the center is caught.
By combining the images 12b and 13b, an image of the entire side part 15 of the electronic component 11 and an image of the entire side part 16 of the electronic component 11 are obtained.

Further, as shown in FIG. 5, the light emitted from the illumination 62 and transmitted through the diffusion plate 61 sequentially passes through the beam splitters 56 and 55, and then the Y direction negative side (side portion) of the bottom 51 of the electronic component 11. (15 side) is also reflected. The light reflected on the Y direction negative side of the bottom 51 of the electronic component 11 passes through the beam splitters 55 and 59, travels downward, and enters the beam splitter 24. The light that has entered the beam splitter 24 branches off at the boundary surface between the beam splitters 24 and 25, one of which travels in the negative direction in the Y direction and heads toward the imaging unit 12, and the other passes through the beam splitters 25 and 26. Then, it proceeds in the negative direction of the Y direction and heads for the imaging means 13.

The light emitted from the illumination 64 and transmitted through the diffusion plate 63 passes through the beam splitters 58 and 57 in order, and is also reflected on the Y direction positive side (side 16 side) of the bottom 51 of the electronic component 11. The light reflected on the Y direction positive side of the bottom 51 of the electronic component 11 passes through the beam splitters 57 and 60, travels downward, and enters the beam splitter 24. The light that has entered the beam splitter 24 branches off at the boundary surface between the beam splitters 24 and 25, one of which travels in the negative direction in the Y direction and heads toward the imaging unit 12, and the other passes through the beam splitters 25 and 26. Then, it proceeds in the negative direction of the Y direction and heads for the imaging means 13.

As a result, in the image 12b, as shown in FIG. 6A, in addition to the X direction negative side of each of the side portions 15 and 16 of the electronic component 11, the Y direction negative side (side) of the bottom 51 of the electronic component 11 is shown. The X direction negative side (one side) of the part 15 side and the X direction negative side (one side) of the Y direction positive side (side part 16 side) of the bottom 51 of the electronic component 11 are housed. 6B, in addition to the X direction positive side of each of the side portions 15 and 16 of the electronic component 11, the image 13b includes the Y direction negative side (side portion) of the bottom 51 of the electronic component 11. 15 side) and the X direction positive side (other side) of the Y direction positive side (side portion 16 side) of the bottom 51 of the electronic component 11 are housed.
In the present embodiment, the optical distance between the side portions 15 and 16 of the electronic component 11 and the imaging means 12 and the bottom 51 of the electronic component 11 and the imaging means are determined using the difference in refractive index between the beam splitter and air. The optical distances of 12 are aligned, and the side parts 15 and 16 and the bottom part 51 of the electronic component 11 are focused on the imaging unit 12. This is the same for the imaging means 13.
Further, in the present embodiment, the images 12 b and 13 b are combined with the imaging means 12 and 13, and the entire X direction on the Y direction negative side of the bottom 51 of the electronic component 11 and the Y direction positive side of the bottom 51 of the electronic component 11 are combined. The entire X direction is stored.

Further, in the appearance inspection apparatus 50, as shown in FIGS. 7A and 7B, the beam splitters 53, 55, and 56, the diffusion plate 61, and the illumination 62 are designed to be movable in the Y direction as a unit. The beam splitters 54, 57, 58, the diffusion plate 63, and the illumination 64 are also designed to be movable in the Y direction as a unit.
This is because the distance between the side parts A and B or the thickness of the electronic part is different from that of the electronic part 11, and the imaging means 12 and 13 have the side parts A and B, the side part A side of the bottom part, and the bottom part. The optical distance is adjusted so that each side B side is clearly imaged.

In the electronic component 66 shown in FIG. 7B, the distance between the side portion 67 (side portion A) and the side portion 68 (side portion B) is longer than that of the electronic component 11, and the beam splitters 53, 55, and 56, and the diffusion plate 61. And the group of the illumination 62 and the group of beam splitters 54, 57, and 58, the diffuser plate 63, and the illumination 64 are moved away from each other in the Y direction.
The group of beam splitters 53, 55, 56, diffuser plate 61 and illumination 62 and the group of beam splitters 54, 57, 58, diffuser plate 63 and illumination 64 are designed to be movable vertically in addition to the Y direction. May be.

In the appearance inspection apparatus 10, the imaging units 12 and 13 are arranged at different positions in the X direction. However, the imaging units 12 and 13 may be arranged at the same position in the X direction. The appearance inspection apparatus 70 shown in FIG. 8 and FIG. 9 has a side portion 71 (side portion) that is opposite to the side portions 15 and 16 of the electronic component 11 by the imaging means 12 and 13 provided at the same position in the X direction. A) and the side part 72 (side part B) are imaged.
Hereinafter, the same components as those in the appearance inspection apparatus 10 are denoted by the same reference numerals and detailed description thereof is omitted, and the appearance inspection apparatus 70 will be described.

In the electronic component 11, the side portions 71 and 72 are perpendicular to the side portions 15 and 16 as shown in FIG. 8 and FIG. When the electronic component 11 is transported to the inspection position Q where the side parts 71 and 72 are imaged, the side parts 71 and 72 are in a state along the Y direction (that is, the imaging direction of the imaging means 12 and 13). The side portion 71 is located on the positive side in the X direction with respect to the side portion 72.
The imaging unit 13 is disposed on the positive side in the Y direction from the imaging unit 12 and at a position lower than the imaging unit 12.

In the vicinity of the electronic component 11 arranged at the inspection position Q, an optical path adjusting means 73 for changing the traveling direction of light is provided. The optical path adjusting means 73 includes a plurality of beam splitters 18 to 23 and 74 to 76. The following description is based on the assumption that the electronic component 11 is arranged at the inspection position Q.
The closely-contacted beam splitters 18 and 20 are disposed to face the side portion 71 of the electronic component 11, and the closely-contacted beam splitters 19 and 21 are disposed to face the side portion 72 of the electronic component 11.
The positional relationship of each of the beam splitters 18 to 23 with respect to each of the other beam splitters 18 to 23 is the same as that of the optical path adjusting unit 14.

The beam splitters 74 and 75 are provided in close contact with each other at a position lower than the beam splitters 22 and 23 and at the same height as the imaging unit 12. The surface to which the beam splitters 74 and 75 are in contact with each other is inclined in a direction that decreases toward the Y direction negative side.
The beam splitter 76 is disposed at the same height as the imaging unit 13 at a position lower than the beam splitters 74 and 75.
Although not shown in FIGS. 8 and 9, illumination that illuminates the beam splitters 18 and 20 is provided at the same height as the beam splitters 18 and 20 on the side opposite to the electronic component 11. At the same height as the beam splitters 19 and 21, illumination for illuminating the beam splitters 19 and 21 is provided on the side opposite to the electronic component 11.

The light irradiated from the illumination for illuminating the beam splitters 18 and 20 and reflected on the Y direction negative side (one side) of the side portion 71 of the electronic component 11 enters the beam splitter 20, and at the boundary between the beam splitters 18 and 20. After reflecting downward, it enters the beam splitter 22. The light that has entered the beam splitter 22 is reflected twice, then exits downward from the beam splitter 22, enters the beam splitter 74, and the boundary between the beam splitters 74 and 75 (the surface where the beam splitters 74 and 75 are in close contact with each other). ) And proceeds toward the imaging unit 12 toward the Y direction negative side.
The light irradiated from the illumination that illuminates the beam splitters 19 and 21 and reflected on the Y-direction negative side (one side) of the side portion 72 of the electronic component 11 also proceeds in the same manner in the beam splitters 21, 23, and 74 in order. Head to 12.

On the other hand, the light irradiated from the illumination for illuminating the beam splitters 18 and 20 and reflected on the Y direction positive side (the other side) of the side portion 71 of the electronic component 11 passes through the beam splitter 20 and enters the beam splitter 22. After exiting the beam splitter 22 downward, it passes through the beam splitters 74 and 75, enters the beam splitter 76, reflects, changes the path to the Y direction negative side, exits the beam splitter 76, Head to the imaging means 13.
The light irradiated from the illumination that illuminates the beam splitters 19 and 21 and reflected on the Y-direction positive side (the other side) of the side portion 72 of the electronic component 11 also travels the beam splitters 21, 23, 74, 75, and 76 in the same manner. To the imaging means 13.

As a result, the image 77 (first image) captured by the imaging unit 12 captures a region from the Y-direction negative side to the center of the side portion 72 of the electronic component 11 in the left half as shown in FIG. In the right half, a region from the Y-direction negative side to the center of the side portion 71 of the electronic component 11 is captured. The side portions 71 and 72 of the electronic component 11 are positioned above the negative side in the Y direction in the image 77.

In the image 78 (second image) captured by the imaging means 13, a region from the positive side in the Y direction of the side portion 72 of the electronic component 11 to the center is captured in the left half, and the electronic component 11 is captured in the right half. A region from the positive side in the Y direction of the side portion 71 to the center is captured. In the image 78, the side portions 71 and 72 of the electronic component 11 have their Y-direction positive sides positioned above their respective centers.
The images 77 and 78 can be combined to obtain an entire image of the side portion 71 of the electronic component 11 and an entire image of the side portion 72 of the electronic component 11.

In addition, by combining the appearance inspection apparatuses 10 and 70, it is possible to configure an appearance inspection facility that performs an appearance inspection of the four side portions 15, 16, 71, and 72 of the electronic component 11. In the appearance inspection facility, a rotating body (turret) in which a plurality of nozzles 17 are circularly attached at a predetermined pitch is provided on the outer peripheral portion, and each nozzle 17 can be moved up and down. The rotating body whose rotation axis extends in the vertical direction intermittently rotates by a predetermined angle, and sequentially transports the electronic components 11 held by the nozzles 17 to the inspection positions P and Q. Each electronic component 11 is held by each nozzle 17 in a state where the side portions 15 and 16 are along the conveying direction of the electronic component 11, and the side portions 15 and 16 are visually inspected at the inspection position P, and at the inspection position Q. The side parts 71 and 72 are visually inspected.

In the appearance inspection apparatus 10, the X direction in the appearance inspection apparatus 10 is provided at the inspection position P in an arrangement along the conveying direction of the electronic component 11, and the appearance inspection apparatus 70 has the X direction in the appearance inspection apparatus 70 in the electronic component 11. Is provided at the inspection position Q in an arrangement along the transport direction.
The nozzle 17 may be in an ascending position or a descending position when the electronic component 11 is transported to the inspection position P and when the electronic component 11 is transported from the inspection position P to another position. On the other hand, when the electronic component 11 is transported to the inspection position Q and when the electronic component 11 is transported from the inspection position Q to another position, the nozzle 17 is disposed at the raised position. This is because when the electronic component is transported with the nozzle 17 lowered at the inspection position Q, the electronic component 11 contacts the beam splitters 18, 19, 20, 21 and the like, but does not contact at the inspection position P. Because.

Up to this point, the first and second images have been combined to obtain an image of the entire side A of the electronic component and an image of the entire side B of the electronic component. Even if the images are combined, an image of the entire electronic component A and an image of the entire side B of the electronic component are not obtained, and using three or more imaging means including the first and second imaging means, An image of the entire electronic component A and an image of the entire side B of the electronic component may be obtained. When three or more imaging means are used, in addition to the first and second imaging means, N imaging means for imaging the side parts A and B of the electronic component arranged at the inspection position are provided (N is a natural number) ), A part of the side part A and a part of the side part B are respectively stored in the optical path adjusting means in the images picked up by the N imaging means, and the first and second images and the N images are picked up. The images captured by the means can be combined to obtain an image of the entire side part A of the electronic component and an image of the entire side part B of the electronic component.

Moreover, the region to be inspected may include a part other than the side parts A and B, may be a part other than the side parts A and B, and may be only one of the side parts A and B. There may be. Hereinafter, an appearance inspection apparatus 90 shown in FIGS. 10 and 11 in which only the side portion 16 of the electronic component 11 is an inspection target area will be described. In addition, about the structure similar to the external appearance inspection apparatus 10, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.
As shown in FIGS. 9 and 10, the appearance inspection apparatus 90 does not include the beam splitters 18, 20, and 22 and the illumination 27 as compared with the appearance inspection apparatus 10, and the optical path adjustment unit 91 includes the beam splitter. 19, 21, 23, 24, 25, 26. Accordingly, the image 92 (first image) captured by the imaging unit 12 captures from one side to the center of the side part 16 of the electronic component 11, and the image 93 (second image) captured by the imaging unit 13. The other side to the center of the side part 16 of the electronic component 11 is captured.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all changes in conditions and the like that do not depart from the gist are within the scope of the present invention.
For example, an electronic component subjected to appearance inspection may be provided with a plurality of terminals made of metal wires on the side.
In addition, the optical path adjusting means is disposed between at least one of the optical path between the electronic component and the first image pickup means and between the electronic component and the optical path of the second image pickup means. It is also possible to divide the bottom portion into first and second images while suppressing one of the imaging means from entering the other imaging range.

The imaging directions of the first and second imaging means may be non-parallel. When the imaging directions of the first and second imaging means are non-parallel, the first imaging means is The hardware for moving the first imaging unit at a position along the imaging direction of the first imaging unit may be provided independently of the hardware for moving the second imaging unit at a position along the imaging direction of the second imaging unit. .
Further, the optical path adjusting means may include a mirror that reflects light in addition to the beam splitter, and the image of the entire side part A of the electronic component and the entire side part B of the electronic component are included in the virtual frame. It need not be designed to fit the images in parallel.

10: Appearance inspection apparatus, 11: Electronic component, 12: Imaging means, 12a, 12b: Image, 13: Imaging means, 13a, 13b: Image, 14: Optical path adjustment means, 15, 16: Side, 17: Nozzle, 18-26: Beam splitter, 27, 28: Illumination, 29, 30: Fixing member, 31: Screw shaft, 32: Nut block, 33: Motor, 34: Virtual frame, 35, 35a: Optical path shift mechanism, 36-39 : Beam splitter, 40: Image processing means, 50: Visual inspection device, 51: Bottom, 52: Optical path adjusting means, 53-60: Beam splitter, 61: Diffuser, 62: Illumination, 63: Diffuser, 64: Illumination , 66: Electronic parts, 67, 68: Side, 70: Appearance inspection apparatus, 71, 72: Side, 73: Optical path adjustment means, 74-76: Beam splitter, 77, 78: Image, 90: Appearance inspection Location, 91: optical path adjusting means, 92 and 93: Image

Claims (8)

In the appearance inspection apparatus for inspecting the appearance of the inspection target area of the rectangular parallelepiped electronic component having the side portions A and B facing each other ,
The region to be inspected exists on one side and the other side of the side portion A, and one side and the other side of the side portion B,
First and second imaging means for imaging different portions of the inspection target area,
While changing the traveling direction of light, the first image picked up by the first image pickup means is caused to contain one side of the side portion A and one side of the side portion B, and the second image pickup. Optical path adjusting means for accommodating the other side of the side part A and the other side of the side part B in a second image captured by the means ;
Illuminations a and b that respectively irradiate light reflected by the side portions A and B, and
The optical path adjusting means includes beam splitters A1 and B1 facing the side portions A and B, respectively.
The light emitted from the illumination a passes through the beam splitter A1, is reflected by the side surface A, passes through the beam splitter A1, travels to the first and second imaging means, and is emitted from the illumination b. The light passes through the beam splitter B1, is reflected by the side surface B, passes through the beam splitter B1, and travels toward the first and second imaging means.
The beam splitter A1 and the illumination a are integrated and movable in a direction in which the side portions A and B are opposed to each other, and the beam splitter B1 and the illumination b are integrated and the side portions A and B are integrated. There appearance inspection apparatus according to claim moveable der Rukoto in opposite directions. The appearance inspection apparatus according to claim 1 , wherein the optical path adjustment unit further stores one side of each of the side part A side and the side part B side of the bottom part of the electronic component in the first image, An appearance inspection apparatus, wherein the second image is further accommodated on each of the other sides of the bottom part on the side part A side and the side part B side. 3. The visual inspection apparatus according to claim 2 , wherein the optical path adjusting means further includes a beam splitter A2 provided below the beam splitter A1 and a beam splitter B2 provided below the beam splitter B1, The light emitted from the illumination a further passes through the beam splitter A2, reflects on the side A side of the bottom, passes through the beam splitter A2, and travels toward the first and second imaging means. The light emitted from the illumination b further passes through the beam splitter B2 and is reflected on the side B side of the bottom, passes through the beam splitter B2, and the first and second imaging means. The beam splitter A2 is movable together with the beam splitter A1 and the illumination a in a direction in which the side portions A and B face each other. Beam splitter B2, the beam splitter B1 and the become illuminated b integral with the side A, the appearance inspection apparatus B is characterized in that it is movable in opposite directions. The visual inspection apparatus according to any one of claims 1 to 3, wherein the first and second images are combined to obtain an image of the entire side part A and an image of the entire side part B. Appearance inspection device. In the appearance inspection apparatus according to any one of claims 1 to 3, the electronic component side A, B further comprises N imaging means for imaging the said optical path adjusting means, said N imaging means In each of the images captured by each of the images, a part of the side part A and a part of the side part B are accommodated, and the first and second images and the images captured by the N imaging means are combined. An appearance inspection apparatus for obtaining an image of the entire side part A and an image of the entire side part B. However, N is a natural number. The visual inspection apparatus according to any one of claims 1 to 5, wherein the optical path adjustment unit refracts or reflects light so that an image of the entire side A and an image of the entire side B are within a virtual frame. And an optical path adjustment block arranged in parallel with each other, and the first and second imaging means capture one side and the other side of the virtual frame, respectively. The optical path shift mechanism according to claim 6, wherein the first imaging means that refracts or reflects light and captures one side of the virtual frame captures the center side of the virtual frame. An appearance inspection apparatus further comprising: 8. The appearance inspection apparatus according to claim 6, wherein the position of the first imaging unit along the imaging direction of the first imaging unit and the second imaging unit of the second imaging unit. An appearance inspection apparatus further comprising a positioning mechanism for adjusting a position along the imaging direction.

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