JP2012181114A - Appearance inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inspect the front and rear surfaces of an inspection target at a time with one camera.SOLUTION: An appearance inspection device 1 includes a camera 4 and an optical system 15. A front surface 20a of an inspection target 20 is arranged in the field of view 4b of the camera 4. The optical system 15 changes the direction of light 102 from a rear surface 20b so that the camera 4 can photograph the front surface 20a and the rear surface 20b of the inspection target 20 simultaneously.

Description

  The present invention relates to an appearance inspection apparatus and an appearance inspection method, and more particularly to an appearance inspection apparatus and an appearance inspection method for a semiconductor package and a method for manufacturing a semiconductor package.

  Japanese Unexamined Patent Application Publication No. 2010-014735 discloses an appearance inspection apparatus for inspecting the appearance of an inspection object such as a tablet. The appearance inspection apparatus includes an imaging unit installed to image one of the upper surface and the side surface of the tablet, and the other of the upper surface and the side surface so as to capture the other image of the upper surface and the side surface. Changing the direction of the light from the optical path length of the first optical path from the other of the upper surface and the side surface to the imaging means to the optical path length of the second optical path from one of the upper surface and the side surface to the imaging means In order to match, an optical path redundancy means for making the second optical path redundant is provided.

  Japanese Unexamined Patent Application Publication No. 2009-276338 discloses an appearance inspection apparatus for inspecting the appearance of a device such as a semiconductor device. This appearance inspection apparatus includes an imaging unit in which the bottom surface of the device and the imaging surface face each other, and mirrors provided corresponding to the four side surfaces of the device. The mirror reflects the images of the four side surfaces of the device toward the imaging surface. The imaging means captures four side images in addition to the bottom image.

JP 2010-014735 A JP 2009-276338 A

  The present inventor has recognized that the above-described appearance inspection apparatus cannot inspect the front and back of the inspection object at once with a single camera.

  An object of the present invention is to provide an appearance inspection apparatus, an appearance inspection method, and a semiconductor package manufacturing method capable of inspecting the front and back of an inspection object at once with a single camera.

  The means for solving the problem will be described below using the numbers used in the (DETAILED DESCRIPTION). These numbers are added to clarify the correspondence between the description of (Claims) and (Mode for Carrying Out the Invention). However, these numbers should not be used to interpret the technical scope of the invention described in (Claims).

  The visual inspection apparatus (1) according to the first aspect of the present invention includes a camera (4) and the inspection object (20) having a front surface (20a, 24, 28a) disposed in a visual field (4b) of the camera. And an optical system (15) for changing the direction of the first light beam (102) from the back surface so that the camera can simultaneously photograph the front surface and the back surface (20b, 23, 28b, 27b). .

  The visual inspection method according to the second aspect of the present invention includes the step of placing the front surface (20a, 24, 28a) of the inspection object (20) in the visual field (4b) of the camera (4), and the back surface of the inspection object. Based on the step of changing the direction of the first light beam (102) from (20b, 23, 28b, 27b) and the light beam (101) from the first light beam and the front surface, the camera And simultaneously photographing.

  A method of manufacturing a semiconductor package according to a third aspect of the present invention includes the steps of packaging a semiconductor chip to form a semiconductor package (20), and inspecting the appearance of the semiconductor package. The step of inspecting the appearance of the semiconductor package includes the step of placing the front surface (20a, 24, 28a) of the semiconductor package in the field of view (4b) of the camera (4), and the rear surface (20b, 23, 28b, 27b) changing the direction of the first light beam (102) and, based on the first light beam and the front light beam (101), the camera simultaneously photographing the front surface and the back surface. Including.

  ADVANTAGE OF THE INVENTION According to this invention, the external appearance inspection apparatus which can test | inspect the front and back of a test object at once with one camera, the external appearance inspection method, and the manufacturing method of a semiconductor package are provided.

FIG. 1 is a schematic view of an appearance inspection apparatus according to the first embodiment of the present invention. FIG. 2 is a schematic view of an appearance inspection apparatus according to the second embodiment of the present invention. FIG. 3 is a plan view showing the arrangement of mirrors and inspection objects of the appearance inspection apparatus according to the second embodiment. FIG. 4 is a functional block diagram of an appearance inspection apparatus according to the second embodiment. FIG. 5 is a conceptual diagram illustrating image acquisition by the appearance inspection apparatus according to the second embodiment. FIG. 6 shows an example of an image of the inspection object acquired by the appearance inspection apparatus according to the second embodiment. FIG. 7 shows another example of the image of the inspection object acquired by the appearance inspection apparatus according to the second embodiment. FIG. 8 shows a BGA package as an inspection object. FIG. 9 shows an example of an image of the BGA package acquired by the appearance inspection apparatus according to the second embodiment. FIG. 10 shows a QFN package as an inspection object. FIG. 11 shows an example of an image of the QFN package acquired by the appearance inspection apparatus according to the second embodiment. FIG. 12 is a schematic view of an appearance inspection apparatus according to the third embodiment of the present invention. FIG. 13 is a schematic diagram of an appearance inspection apparatus according to a modification of the third embodiment. FIG. 14 is a functional block diagram of an appearance inspection apparatus according to the fourth embodiment of the present invention. FIG. 15 is a conceptual diagram showing an example of the effect of the appearance inspection apparatus according to the fourth embodiment. FIG. 16 is a conceptual diagram illustrating another example of the effect of the appearance inspection apparatus according to the fourth embodiment. FIG. 17 is a conceptual diagram illustrating another example of the effect of the appearance inspection apparatus according to the fourth embodiment. FIG. 18 is a schematic view of an appearance inspection apparatus according to the fifth embodiment of the present invention. FIG. 19 is a functional block diagram of an appearance inspection apparatus according to the sixth embodiment of the present invention. FIG. 20 is a plan view showing the arrangement of mirrors and inspection objects of the visual inspection apparatus according to the sixth embodiment. FIG. 21 is a schematic view of an appearance inspection apparatus according to the seventh embodiment of the present invention.

  With reference to the accompanying drawings, embodiments for carrying out an appearance inspection apparatus, an appearance inspection method, and a semiconductor package manufacturing method according to the present invention will be described below.

(First embodiment)
With reference to FIG. 1, the external appearance inspection apparatus 1 which concerns on the 1st Embodiment of this invention is demonstrated. The appearance inspection apparatus 1 includes a camera 4 and an optical system 15. An X direction, a Y direction, and a Z direction are defined for the appearance inspection apparatus 1. The X direction, the Y direction, and the Z direction are perpendicular to each other. In the following description, the Z direction is perpendicular to the horizontal plane. The camera 4 is a two-dimensional camera, for example. The camera 4 faces downward so that the shooting axis 4a of the camera 4 is parallel to the Z direction. The X direction component, the Y direction component, and the Z direction component of the vector of the imaging axis 4a are zero, zero, and negative, respectively. The inspection object 20 whose appearance is inspected by the appearance inspection apparatus 1 includes a front surface 20a, a back surface 20b, and a side surface 20c. The back surface 20b is the opposite side of the front surface 20a. The inspection object 20 is disposed below the camera 4 with the front surface 20 a facing the camera 4. Since the front surface 20 a is arranged in the field of view 4 b of the camera 4, the light beam 101 from the front surface 20 a reaches the camera 4 directly. The light beam 102 from the back surface 20 b is changed in direction by the optical system 15 and reaches the camera 4. The camera 4 photographs the front surface 20a and the back surface 20b simultaneously based on the light beams 101 and 102. Thereby, one image in which both the front surface 20a and the back surface 20b are copied is obtained.

  According to this embodiment, it is possible to inspect the front and back of the inspection object 20 at a time with one camera, and the inspection time is shortened. According to this embodiment, since the front and back of the inspection object 20 can be inspected with one inspection stage, the space for inspection can be small. Furthermore, a pick-up hand for transporting the semiconductor package 20 between the inspection stages is unnecessary, and the front and back of the inspection object 20 are inspected with a single camera, so that the apparatus cost is reduced.

(Second Embodiment)
An appearance inspection apparatus 1 according to the second embodiment of the present invention will be described below. This embodiment is the same as the first embodiment except for the following description.

  Referring to FIG. 2, inspection object 20 is a semiconductor package (hereinafter referred to as “semiconductor package 20”). The semiconductor package 20 is formed by packaging a semiconductor chip. The semiconductor package 20 includes a rectangular plate-shaped package body 21 and a plurality of external terminals 22. The package body 21 includes a semiconductor chip. The plurality of external terminals 22 are electrically connected to a circuit in the semiconductor chip. The package body 21 includes a front surface 24 as a part of the front surface 20a, a back surface 23 as a part of the back surface 20b, and a side surface 25 as a part of the side surface 20c. The back surface 23 is a rectangular surface facing the printed wiring board when the semiconductor package 20 is mounted on the printed wiring board. The front surface 24 is a rectangular surface opposite to the back surface 23 and is parallel to the back surface 23.

  The semiconductor package 20 is, for example, an SOP (Small Outline Package) or a QFP (Quad Flat Package). Each external terminal 22 is a gull-wing shaped lead (hereinafter referred to as “lead 22”). The lead 22 protrudes from the side surface 25 of the package body 21.

  In addition to the camera 4 and the optical system 15, the appearance inspection apparatus 1 according to the second embodiment illuminates the illumination device 3 that illuminates the front surface 24, the illumination device 3 that illuminates the back surface 23, and a pedestal on which the semiconductor package 20 is mounted. 2 is provided. The pedestal 2 supports the semiconductor package 20 so that the surface 24 faces the camera 4 in a state perpendicular to the Z direction. Each of the illumination device 3 that illuminates the front surface 24 and the illumination device 3 that illuminates the back surface 23 illuminates the semiconductor package 20 obliquely with respect to the Z direction.

  The optical system 15 includes mirrors 5 and 6. The mirror 5 is disposed on the back surface 23 side of the semiconductor package 20 (that is, the back surface 20b side). For example, the mirror 5 is attached to the side surface of the base 2. The mirror 6 is disposed away from the semiconductor package 20 in the X direction. The positions of the mirror 6 and the semiconductor package 20 are substantially the same in the Z direction. For example, there is a plane having a common point with both the mirror 6 and the semiconductor package 20 and perpendicular to the Z direction. The X-direction component, the Y-direction component, and the Z-direction line segment of the normal vector of the reflecting surface of the mirror 5 are positive, zero, and positive, respectively. The X-direction component, the Y-direction component, and the Z-direction line segment of the normal vector of the reflection surface of the mirror 6 are negative, zero, and positive, respectively.

  Referring to FIG. 3, the package body 21 is rectangular when viewed in parallel with the Z direction. The rectangle includes a side 21a and a side 21b. The side 21a and the side 21b are perpendicular to each other. The pedestal 2 supports the semiconductor package 20 so that the side 21a is parallel to the Y direction. A plurality of leads 22 are arranged along the side 21a. In order to inspect the leads 22 arranged along the side 21a, the reflecting surface of the mirror 5 is a rectangle having a long side parallel to the Y direction, and the reflecting surface of the mirror 6 has a long side parallel to the Y direction. A rectangular shape is preferred.

  When the semiconductor package 20 is QFP, a plurality of leads arranged along the side 21b are added. In this case, it is preferable to provide a pair of mirrors corresponding to the mirrors 5 and 6 in order to inspect the leads arranged along the side 21b.

  With reference to FIG. 4, the appearance inspection apparatus 1 according to the present embodiment includes an image processing device 16, a storage device 17, and an output device 18. The output device 18 is a display device, for example. The camera 4, the image processing device 16, the storage device 17, and the output device 18 are connected so that they can exchange data with each other.

  Referring to FIG. 5, lead 22 is formed to extend in a plane perpendicular to the Y direction when surface 24 is perpendicular to the Z direction and side 21a is parallel to the Y direction. The lead 22 includes a base portion 26 extending in parallel to the front surface 24 and the back surface 23 from the side surface 25 of the package body 21, an intermediate portion 27 extending from the front end of the base portion 26 toward the back surface 23, and the front surface 24 and the back surface from the front end of the intermediate portion 27. 23 and an end portion 28 extending substantially parallel to the end portion 23. The intermediate part 27 may be referred to as a hypotenuse part. The end 28 may be referred to as a lead foot. The intermediate portion 27 is slightly inclined with respect to the normal line of the front surface 24 and the back surface 23. The end portion 28 is slightly inclined with respect to the front surface 24 and the back surface 23. When the semiconductor package 20 is mounted on the printed wiring board, the end portion 28 is soldered to the printed wiring board. The end portion 28 includes a front surface 28a as a part of the front surface 20a, a back surface 28b as a part of the back surface 20b, and a side surface 28c as a part of the side surface 20c. The side surface 28 c is an end surface of the end portion 28.

  The light beam 101 from the surface 28a reaches the camera 4 directly. The light beam 102 is a light beam reflected by the back surface 28b. The mirror 5 reflects the light beam 102 from the back surface 28 b to the mirror 6. The mirror 6 reflects the light beam 102 from the mirror 5 and the light beam 103 from the side surface 28 c to the camera 4. The camera 4 obtains an image 30 by simultaneously photographing the front surface 28a, the back surface 28b, and 28c based on the light beams 101, 102, and 103. The image 30 includes a front image 31 as an image of the front surface 28 a based on the light beam 101, a back image 32 as an image of the back surface 28 b based on the light beam 102, and a side image 33 as an image of the side surface 28 c based on the light beam 103. . A V direction and a W direction are defined for the image 30. The V direction corresponds to the X direction and the Z direction. The W direction corresponds to the Y direction.

  When the mirror 5 reflects the light beam 102 from the back surface 28b to the mirror 6, the sign of the component in the X direction of the direction vector of the light beam 102 is reversed. Therefore, the back surface 28b on the back side as viewed from the mirror 6 is photographed.

  In the appearance inspection of the semiconductor package 20, the image processing device 16 performs image processing on the image 30. The image processing device 16 detects foreign matters attached to the front surface 28a and scratches formed on the back surface 28b by image processing. Foreign objects and scratches are shown in image 30 as foreign object image 201 and scratch image 202, respectively. The storage device 17 stores the image 30 and the image processing result of the image processing device 16. The output device 18 outputs the image 30 and the image processing result of the image processing device 16. Based on the image 30 output by the inspector, foreign matter adhering to the front surface 28a and scratches formed on the back surface 28b may be detected.

  It is preferable that the appearance inspection apparatus 1 removes the foreign matter adhering to the surface 28a by blowing off with air. In this case, the manufacturing method of the semiconductor package 20 includes a step of packaging the semiconductor chip to form the semiconductor package 20, a step of executing an appearance inspection of the semiconductor package 20, and foreign matter found in the appearance inspection from the semiconductor package 20. Removing.

  The appearance inspection apparatus 1 can inspect not only the foreign matters and scratches of the semiconductor package 20 but also the bending, floating, lead foot angle, and coplanarity of the leads 22. Hereinafter, these inspections will be described.

  FIG. 6 shows an image 30 and a reference line S acquired when the plurality of leads 22 included in the semiconductor package 20 are formed as designed. The reference line S is parallel to the W direction. The image 30 includes a first image group 41 to an eighth image group 48 for each of the first lead 22 to the eighth lead 22. Each of the first image group 41 to the eighth image group 48 includes a front image 31, a back image 32, and a side image 33. For all of the first image group 41 to the eighth image group 48, the amount of deviation from the reference line S of the side image 33 is zero.

  FIG. 7 shows an image 30 and reference lines S, S41 to S47 acquired when some of the plurality of leads 22 included in the semiconductor package 20 are not formed as designed. The reference line S is parallel to the W direction. Each of the reference lines S41 to S47 is parallel to the V direction. The image 30 includes a first image group 41 to a seventh image group 47 for each of the first lead 22 to the seventh lead 22. Each of the first image group 41 to the seventh image group 47 includes a front image 31, a back image 32, and a side image 33.

  Referring to FIG. 7, in the first image group 41, the front image 31, the back image 32, and the side image 33 are arranged along the reference line S41, and the amount of deviation from the reference line S of the side image 33 is zero. Therefore, it is detected that the first lead 22 is formed as designed. It is detected from the second image group 42 that the end portion 28 of the second lead 22 is bent. In the third image group 43, since the side image 33 is shifted from the reference line S to the negative side in the V direction, it is detected that the end portion 28 of the third lead 22 is floating. In each of the fourth image group 44 and the fifth image group, the lengths in the V direction of the front surface image 31 and the back surface image 32 are different from those in the first image group 41. It is detected that the angle 28 (lead foot angle) is not appropriate.

  The image processing device 16 inspects the coplanarity based on the image 30 as described below. Since the external terminal 22 of the semiconductor package 20 is a lead, a three-point installation method of JEITA (Japan Electronics and Information Technology Industries Association) is used. For all the leads 22 of the semiconductor package 20, a deviation amount in the V direction from the reference line S of the side image 33 is detected. Here, when the side image 33 is shifted from the reference line S to the positive side in the V direction, the shift amount is a positive value. When the side image 33 is shifted to the negative side in the V direction, the shift amount is a negative value. . In order from the largest deviation amount, three points are extracted in such a manner that a triangle having the three points as vertices includes the center of the semiconductor package 20. The equation of the plane passing through the three points is calculated. The distance from the plane to the side surface 28c is calculated for all the leads 22. The maximum value of the calculated distance is calculated as the coplanarity. The calculated coplanarity is compared with a reference value.

  The storage device 17 stores the calculated coplanarity and the comparison result between the calculated coplanarity and the reference value. The output device 18 outputs the calculated coplanarity and the comparison result between the calculated coplanarity and the reference value.

  Referring to FIG. 8, semiconductor package 20 may be a BGA (Ball Grid Array) package (hereinafter referred to as “BGA package 20”). The BGA package 20 includes a package main body 21 and solder balls as external terminals 22 (hereinafter referred to as “solder balls 22”). When the solder balls 22 are provided only on the peripheral edge portion of the back surface 23 of the package main body 21, the appearance inspection apparatus 1 can execute a coplanarity inspection on the BGA package 20.

  FIG. 9 shows an image 30 and a reference line S obtained by photographing the BGA package 20. The image 30 includes a front image 31, a back image 32, and a side image 33. In the surface image 31, the surface 24 of the package body 21 is shown. The back image 32 shows the back surface 23 of the package body 21 and the solder balls 22. In the side image 33, the side surface 25 of the package body 21 and the solder ball 22 are shown.

  In the case of the BGA package 20, the image processing apparatus 16 inspects the coplanarity using a least square plane method instead of the three-point installation method.

  Referring to FIG. 10, semiconductor package 20 may be a QFN (Quad Flat No-Lead) package (hereinafter referred to as “QFN package 20”). The QFN package 20 includes a package body 21 and pads 22 (hereinafter referred to as “pads 22”) as external terminals 22. When the pad 22 is provided only on the peripheral portion of the back surface 23 of the package body 21, the appearance inspection apparatus 1 can execute the coplanarity inspection for the QFN package 20.

  FIG. 11 shows an image 30 and a reference line S taken from the QFN package 20. The image 30 includes a front image 31, a back image 32, and a side image 33. In the surface image 31, the surface 24 of the package body 21 is shown. In the back image 32, the back surface 23 and the pad 22 of the package body 21 are copied. In the side image 33, the side surface 25 and the pad 22 of the package body 21 are copied.

  In the case of the QFN package 20, the image processing device 16 inspects the coplanarity using a least square plane method instead of the three-point installation method.

  According to the present embodiment, it is possible to perform the inspection of the attached matter and scratches on the front and back of the lead 22 and the inspection of the position of the end portion 28 of the lead 22 in the Z direction on one inspection stage. Therefore, the space for inspection can be small. Furthermore, since a pick-up hand for transporting the semiconductor package 20 between inspection stages is not required, the apparatus cost is reduced. Since the position in the Z direction of the end portion 28 of the lead 22 can be inspected without using an expensive three-dimensional inspection apparatus, the apparatus cost is reduced.

(Third embodiment)
An appearance inspection apparatus 1 according to the third embodiment of the present invention will be described below. This embodiment is the same as the second embodiment except for the following description.

  Referring to FIG. 12, the appearance inspection apparatus 1 according to this embodiment includes a support column 8 that supports the base 2. The pedestal 2 includes an upper surface 2a that contacts the back surface 23 of the semiconductor package 20, and a lower surface 2b opposite to the upper surface 2a. The support column 8 is connected to the center of the lower surface 2b. The mirror 5 is supported by the support column 8.

  Since the mirror 5 is supported by the support column, the appearance of the vicinity of the center of the back surface 23 can be inspected. In addition, it is preferable that the base 2 is reduced in size.

(Modification of the third embodiment)
An appearance inspection apparatus 1 according to a modification of the third embodiment will be described below.

  Referring to FIG. 13, pedestal 2 is preferably formed of a translucent material. In this case, it is easier to inspect the appearance of the vicinity of the center of the back surface 23. Even when the base 2 is large, the appearance of the vicinity of the center of the back surface 23 can be inspected. The large base 2 is advantageous for stably supporting the semiconductor package 20.

(Fourth embodiment)
An appearance inspection apparatus 1 according to the fourth embodiment of the present invention will be described below. This embodiment is the same as the second or third embodiment except for the following description.

  Referring to FIG. 14, the appearance inspection apparatus 1 according to the present embodiment includes drive units 51 and 52.

  Referring to FIG. 15, drive unit 51 rotates mirror 5 around an axis parallel to the Y direction, and moves mirror 5 in the Z direction. For example, the drive unit 51 rotates the mirror 5 by means similar to the rotating means of the galvanometer. The drive unit 52 moves the mirror 6 in the Z direction and the Y direction.

  According to the present embodiment, the appearance inspection can be executed without preparing a different mirror for each type of the semiconductor package 20. Further, the focal point can be freely changed by changing the distance between the mirror 5 and the semiconductor package 20 and the distance between the mirror 6 and the semiconductor package 20. Moreover, according to this embodiment, an index becomes early.

  Furthermore, the appearance inspection of the back surface 27b of the intermediate portion 27 can be performed precisely. The back surface 27b is a portion that is difficult to inspect even if the image is taken from below the semiconductor package 20 using a camera facing the positive side in the Z direction.

  Further, since the position of the mirror 6 in the Z direction can be adjusted, when the package body 21 is warped so that the back surface 23 becomes concave as shown in FIG. 16, and when the back surface 23 becomes convex as shown in FIG. In both cases where the package main body 21 is warped, the side image 33 includes both the image of the end of the package main body 21 and the image of the end of the base 2. Therefore, the standoff SO can be measured from the positional relationship between the image at the end of the package body 21 and the image at the end of the base 2.

(Fifth embodiment)
An appearance inspection apparatus 1 according to the fifth embodiment of the present invention will be described below. This embodiment is the same as the second to fourth embodiments except for the following description.

  With reference to FIG. 18, the appearance inspection apparatus 1 according to the present embodiment includes illumination apparatuses 10, 11, and 14 in addition to the illumination apparatus 3 described above. The illumination device 3 is formed in a ring shape or a bar shape. The illumination device 10 illuminates the inspection object 20 in parallel with the front surface 24 and the back surface 23. The illumination device 10 is formed in a ring shape or a bar shape. The illumination device 14 includes a light source 12 and a half mirror 13. The half mirror 13 is disposed on an extension of the photographing axis 4 a of the camera 4. The light source 12 illuminates the front surface 20 a of the inspection object 20 through the half mirror 13. The camera 4 images the inspection object 20 through the half mirror 13. The illumination device 14 illuminates the front surface 20a of the inspection object 20 coaxially with the imaging axis 4a. The illumination device 11 includes an illumination device 11 that illuminates the front surface 20a of the inspection object 20 from the inner surface of the dome, and an illumination device 11 that illuminates the back surface 20b of the inspection object 20 from the inner surface of the dome.

  According to the present embodiment, the inspection object 20 is illuminated from various directions.

  In the second to fifth embodiments, it is preferable that the illumination devices 3, 10, 11, and 14 are configured to switch the wavelength of light that illuminates the inspection object 20. The focus position can be changed by changing the illumination wavelength. For example, the image of the inspection object 20 is obtained by simultaneously photographing the front surface 20a and the back surface 20b of the inspection object 20 while illuminating the inspection object 20 with light of a first color (for example, red light). An image 30 is acquired by simultaneously photographing the front surface 20a and the back surface 20b of the inspection target 20 while illuminating with light of a second color different from the color (for example, blue light). By photographing with light of different colors, the probability that a transparent foreign substance attached to the inspection object 20 can be found increases. Here, the output device 18 preferably displays the image 30 captured with the first color light and the image 30 captured with the second color light side by side.

(Sixth embodiment)
An appearance inspection apparatus 1 according to the sixth embodiment of the present invention will be described below. This embodiment is the same as the second to fifth embodiments except for the following description.

  Referring to FIG. 19, the appearance inspection apparatus 1 according to this embodiment includes a plurality of pedestals 2 and a drive unit 53 that rotates each of the plurality of pedestals 2 around a rotation axis parallel to the Z direction.

  Referring to FIG. 20, a plurality of pedestals 2 are arranged side by side in the Y direction so that a plurality of semiconductor packages 20 are supported side by side in the Y direction. The mirror 5 and the mirror 6 have a sufficient length in the Y direction so that the camera 4 can simultaneously photograph the back surfaces 20 b of the plurality of semiconductor packages 20. The camera 4 can photograph the front surface 20a and the back surface 20b of the plurality of semiconductor packages 20 simultaneously.

  According to the present embodiment, the front surface 20a and the back surface 20b of the plurality of semiconductor packages 20 can be inspected at a time.

  Further, the drive unit 53 rotates each of the plurality of semiconductor packages 20 by 90 degrees around the rotation axis parallel to the Z direction, so that the external terminals 22 are arranged along both the sides 21 a and 21 b of the semiconductor package 20. Even in this case, the appearance inspection can be performed in a short time. In the present embodiment, the mirror 5 is configured not to move even when the pedestal 2 rotates.

  If only the SOP is inspected, the appearance inspection apparatus 1 does not have to rotate the semiconductor package 20 around the rotation axis parallel to the Z direction.

(Seventh embodiment)
An appearance inspection apparatus 1 according to a seventh embodiment of the present invention will be described below. This embodiment is the same as the second to sixth embodiments except for the following description.

  Referring to FIG. 21, the appearance inspection apparatus 1 according to this embodiment does not include the mirror 6. The light beam 101 from the front surface 20a of the inspection target 20 reaches the camera 4 directly. The mirror 5 reflects the light beam 102 from the back surface 20 b of the inspection object 20 to the camera 4. The camera 4 images the front surface 20a and the back surface 20b simultaneously based on the light beams 101 and 102.

  The appearance inspection apparatus, the appearance inspection method, and the semiconductor package manufacturing method according to the present invention have been described above with reference to the embodiments. However, the present invention is not limited to the above-described embodiments. For example, although the case where the inspection object 20 arranged below the camera 4 is photographed by the downward camera 4 in the above embodiment has been described, the inspection object 20 arranged above the camera 4 is directed upward. You may shoot with In this case, it is preferable that the inspection object 20 is held by a holding unit that sucks the back surface 20b (for example, the back surface 23) of the inspection object 20.

  The optical system 15 can include a prism in place of either or both of the mirrors 5 and 6.

  It is possible to combine the above embodiments.

DESCRIPTION OF SYMBOLS 1 ... Appearance inspection apparatus 2 ... Base 2a ... Upper surface 2b ... Lower surface 3 ... Illumination device 4 ... Camera 4a ... Shooting axis 4b ... Field of view 5, 6 ... Mirror 8 ... Post 10 ... Illumination device 11 ... Illumination device 12 ... Light source 13 ... Half Mirror 14 ... Illuminating device 15 ... Optical system 16 ... Image processing device 17 ... Storage device 18 ... Output device 20 ... Inspection object (semiconductor package)
20a ... Front 20b ... Back 20c ... Side 21 ... Package body 21a, 21b ... Side 22 ... External terminal 23 ... Back 24 ... Surface 25 ... Side 26 ... Base 27 ... Intermediate 27b ... Back 28 ... End 28a ... Surface 28b ... Back side 28c ... Side face 30 ... Image 31 ... Front side image 32 ... Back side image 33 ... Side face images 41-48 ... First image group to eighth image group 51-53 ... Drive units 101-103 ... Light ray 201 ... Foreign object image 202 ... Scratch image S, S41 to S47 ... reference line SO ... standoff

Claims (21)

A camera,
An optical system that changes the direction of the first light beam from the rear surface so that the camera can simultaneously photograph the front surface and the rear surface of the inspection object whose front surface is arranged in the field of view of the camera. Appearance inspection device. The orientation of the camera is parallel to the first direction;
The optical system is
A first mirror disposed on the back side of the inspection object;
A second mirror disposed away from the inspection object in a second direction perpendicular to the first direction,
The first mirror reflects the first light beam from the back surface to the second mirror;
The visual inspection apparatus according to claim 1, wherein the second mirror reflects the first light beam from the first mirror to the camera. The inspection object is a semiconductor package,
The semiconductor package is:
A rectangular plate-shaped package body;
An external terminal arranged along the side of the package body,
The first light beam is a light beam reflected by the external terminal in a state where the semiconductor package is arranged so that the side is perpendicular to the first direction and the second direction,
The visual inspection according to claim 2, wherein when the first mirror reflects the first light beam from the external terminal to the second mirror, the sign of the second direction component of the direction vector of the first light beam is reversed. apparatus. The second mirror reflects the second light beam from the side surface to the camera so that the camera can simultaneously photograph the front surface, the back surface, and the side surface of the inspection object. 3. Visual inspection apparatus. A pedestal on which the inspection object is placed;
And further comprising a column supporting the pedestal,
The pedestal is
An upper surface that contacts the back surface;
A lower surface opposite to the upper surface,
The support column is connected to the lower surface;
The appearance inspection apparatus according to claim 2, wherein the first mirror is supported by the support column. The visual inspection apparatus according to claim 5, wherein the pedestal is formed of a translucent material. The visual inspection apparatus according to claim 2, further comprising a first driving unit that rotates the first mirror about an axis perpendicular to the first direction and the second direction. The visual inspection apparatus according to claim 2, further comprising a second drive unit that moves the first mirror in the first direction. The visual inspection apparatus according to claim 2, further comprising a third drive unit that moves the second mirror in the first direction. The optical system allows the camera to simultaneously photograph the front and back surfaces of the inspection object and the front and back surfaces of other inspection objects whose front surfaces are arranged in the field of view of the camera. , Configured to change the direction of the third light beam from the back surface of the other inspection object,
The first mirror reflects the third light beam from the back surface of the other inspection object to the second mirror;
The visual inspection apparatus according to claim 2, wherein the second mirror reflects the third light beam from the first mirror to the camera. A fourth driving unit configured to rotate the inspection object around a first rotation axis parallel to the first direction and rotate the other inspection object around a second rotation axis parallel to the first direction; The appearance inspection apparatus according to claim 10. The appearance inspection apparatus according to claim 1, further comprising an illumination device configured to switch a wavelength of light that illuminates the inspection object. Placing the front of the inspection object in the field of view of the camera;
Changing the direction of the first light beam from the back surface of the inspection object;
A step of simultaneously photographing the front surface and the back surface by the camera based on the first light beam and the light beam from the front surface. The orientation of the camera is parallel to the first direction;
A first mirror is disposed on the back side of the inspection object;
A second mirror is disposed away from the inspection object in a second direction perpendicular to the first direction;
The step of changing the direction of the first ray comprises:
The first mirror reflecting the first light beam from the back surface to the second mirror;
The visual inspection method according to claim 13, wherein the second mirror includes a step of reflecting the first light beam from the first mirror to the camera. The inspection object is a semiconductor package,
The semiconductor package is:
A rectangular plate-shaped package body;
An external terminal arranged along the side of the package body,
The first light beam is a light beam reflected by the external terminal in a state where the semiconductor package is arranged so that the side is perpendicular to the first direction and the second direction,
15. The sign of the second direction component of the direction vector of the first light beam is reversed in the step in which the first mirror reflects the first light beam from the back surface to the second mirror. Inspection method. The second mirror further comprising reflecting a second light beam from a side surface of the inspection object to the camera;
In the step in which the camera captures the front surface and the back surface at the same time, the camera detects the front surface of the inspection object based on the first light beam, the light beam from the front surface, and the second light beam, The appearance inspection method according to claim 14 or 15, wherein a back surface and the side surface are photographed simultaneously. Placing the front of another inspection object in the field of view of the camera;
The first mirror reflecting a third light beam from the back surface of the other inspection object to the second mirror;
The second mirror further comprising reflecting the third light beam from the first mirror to the camera;
In the step in which the camera captures the front surface and the back surface simultaneously, the camera detects the first light beam, the light beam from the front surface of the inspection object, the third light beam, and the other inspection object. The visual inspection according to claim 14, wherein the front and back surfaces of the inspection object and the front and back surfaces of the other inspection object are simultaneously photographed based on light rays from the front surface. Method. Rotating the inspection object around a first rotation axis parallel to the first direction;
The visual inspection method according to claim 17, further comprising a step of rotating the other inspection object around a second rotation axis parallel to the first direction. The step in which the camera captures the front and the back at the same time,
Photographing the front and back surfaces of the inspection object simultaneously while illuminating the inspection object with light of a first color;
The step of simultaneously photographing the front surface and the back surface of the inspection object while illuminating the inspection object with light of a second color different from the first color. Appearance inspection method. Packaging a semiconductor chip to form a semiconductor package;
A method for manufacturing a semiconductor package, comprising: performing an appearance inspection method according to claim 13 to inspect the appearance of the semiconductor package. 21. The method of manufacturing a semiconductor package according to claim 20, further comprising a step of removing from the semiconductor package the foreign matter found in the step of inspecting the appearance of the semiconductor package.

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