TWI810859B - Package inspection apparatus and tray structure thereof - Google Patents

Abstract

A package inspection apparatus includes a carrying platform, a tray, an image capturing module and a light source module. The carrying platform includes a base and a backlight module disposed on the base. The try is disposed on the backlight module and includes a plurality of carrying units for carrying a plurality of package structures respectively. Each of the carrying units includes a plurality of grooves exposing a peripheral region of the corresponding package structure. The image capturing module is disposed over the carrying platform and configured to capture an image of at least a part of the package structures. The light source module is disposed between the image capturing module and the carrying platform.

Description

Packaging inspection machine and its tray structure

The present disclosure relates to a testing machine and its tray structure, and in particular to a package testing machine and its supporting tray structure.

Semiconductor packaging technology includes many packaging forms, among which Thin Small Outline Package (TSOP) form is a very widely used packaging form in IC packaging at present. In the conventional manufacturing method of thin small After the chip is placed on the carrier (such as a lead frame) for electrical connection, part of the lead frame and the chip are covered by the encapsulant, and pins for external electrical connection are formed around the encapsulant, and then After cutting into a single body, it is directly attached to the surface of the printed circuit board using SMT technology (surface mount technology).

However, when the encapsulant covers the lead frame, since the leads of the lead frame directly contact the encapsulant, it is easy for the encapsulant to overflow to the lower surface of the pin and the gap between the leads, thereby affecting the lead frame. electrical reliability. Therefore, during the production process, it is necessary to pay attention to whether the encapsulant has overflowed glue and whether the overflowed glue exceeds the allowable range. In the past, the above-mentioned inspection work was carried out manually and visually, but this method is not only labor-intensive, but also lacks objective standards in the implementation, so it needs further review and seeks a feasible solution.

The disclosure provides a packaging inspection machine and its tray structure, which can automatically detect the degree of glue overflow of the packaging structure, and can improve the detection accuracy.

A packaging inspection machine disclosed in the present disclosure includes a carrier platform, a tray, an image capture module, and a light source module. The carrying platform includes a base and the backlight module is arranged on the base. The tray is disposed on the backlight module and includes a plurality of carrying units for carrying a plurality of packaging structures respectively, wherein each carrying unit includes a plurality of grooves exposing a peripheral area of the corresponding packaging structure. The image capturing module is arranged above the carrying platform and is used for capturing at least part of the images of the plurality of packaging structures. The light source module is arranged between the image capture module and the carrying platform.

The present disclosure discloses a tray structure for a package inspection machine. The tray is used for setting on the backlight module and includes a plurality of carrying units, wherein the plurality of carrying units are respectively used to carry a plurality of packaging structures, and each of the carrying units includes an exposed Corresponding to a plurality of grooves in a peripheral region of the packaging structure.

Based on the above, the carrying platform of the packaging inspection machine of the present disclosure is provided with a backlight module, and the tray for carrying the packaging structure is arranged on the backlight module, and the tray structure of the packaging inspection machine includes a plurality of carrying units, and each The carrying unit includes a plurality of grooves for exposing peripheral regions of the corresponding packaging structure (for example, corresponding to outer leads of the packaging structure). With such a configuration, the surface light source provided by the backlight module under the tray can penetrate through the groove, thereby further illuminating at least the peripheral area of the package structure, so as to improve the light and dark contrast between the package structure and the background, and to facilitate the package inspection machine. The interpretation of the image captured by its image capture module can further improve the accuracy of the image interpretation of the package inspection machine.

The aforementioned and other technical contents, features and effects of the present disclosure will be clearly presented in the following detailed descriptions of the embodiments with reference to the drawings. The directional terms mentioned in the following embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the attached drawings. Accordingly, the directional terms used are for illustration, not for limitation of the present disclosure. Also, in the following embodiments, the same or similar components will be given the same or similar symbols.

FIG. 1 is a schematic diagram of a package inspection machine according to an embodiment of the present disclosure. Please refer to FIG. 1 , in some embodiments, the package inspection machine 100 may include a carrier table 110 , a tray 120 , an image capture module 130 and a light source module 140 . In one embodiment, the package inspection machine 100 may be, for example, an automated optical inspection (Automated Optical Inspection, AOI) machine. In this embodiment, the carrying platform 110 may further include a base 112 and a backlight module 114 disposed on the base 112 . In this embodiment, the backlight module 114 can be disposed on the carrying platform 110 , for example. Further, the base 112 of the carrier 110 may have, for example, a setting groove 1121, so that the backlight module 114 is disposed in the setting groove 1121 of the base 112, and the packaging structure may also be set in the setting groove 1121. And placed on the backlight module 114 . With such a configuration, the packaging inspection machine 100 can provide a surface light source from the bottom to the top through the backlight module 114 located on the carrier 110, so that the image capture module 130 and/or human eyes can inspect the defects of the packaging structure ( defect) situation.

In an embodiment, the carrying platform 110 may serve as a carrying body of the package inspection machine 100 for placing multiple package structures (such as the package structure 200 shown in FIG. 3 ) thereon. In some embodiments, the carrying platform 110 can be further coupled to a combination of various types of mechanical components that can drive the connecting elements to move or rotate, such as a robot arm, a height adjustment mechanism, a slide rail, a turntable, a screw, a motor, and/or a cylinder. Lifting, moving and/or rotating the packaging structure 200 placed on the carrier platform 110 .

In some embodiments, the image capturing module 130 is movably disposed above the carrying platform 110 and used for capturing at least a part of the image of the package structure 200 . For example, the image capture module 130 can be a device such as a camera, a video camera, etc., and the image capture module 130 can also include an image sensor (for example, a charge coupled device (Charge Coupled Device, CCD), a complementary metal oxide semiconductor (Complementary Metal-Oxide-Semiconductor, CMOS), etc.), optical lens, image control circuit and other components. In this embodiment, the optical lens of the image capture module 130 may include a fisheye lens. Here, a fisheye lens refers to a lens whose viewing angle is close to or equal to 180°. The focal length of this type of lens is extremely short. Generally speaking, a lens with a focal length of 16mm or shorter can usually be considered a fisheye lens. Of course, the present disclosure is not limited thereto, and the lens specifications (for example, image capture aperture, magnification, focal length, image capture viewing angle, image sensor size, etc.) and quantity of the image capture module 130 can be adjusted according to actual needs. Adjustment.

In some embodiments, the light source module 140 is disposed between the image capture module 130 and the carrying platform 110 . Further, the light source module 140 can be movably arranged above the carrying platform 110, and the light source module 140 can be a coaxial light source, a backlight light source, a ring light source, a hemispherical light source, a bar light source, a point light source, a bar light source, etc. Various types of light sources such as rotatable border light sources are formed. In some embodiments, the light source module 140 can move about one, two or more axes relative to the carrying platform 110 . For example, the light source module 140 can be lifted, moved, and/or rotated relative to the carrying platform 110 . In addition, the number of light source modules 140 can be adjusted according to actual needs, and the brightness distribution provided by the light source modules 140 can also be adjusted.

FIG. 2 is a schematic diagram of a tray of a package inspection machine according to an embodiment of the present disclosure. FIG. 3 is a schematic diagram of a package structure applied to a package inspection machine according to an embodiment of the present disclosure. Please refer to FIG. 1 to FIG. 3 at the same time. In some embodiments, the tray 120 is disposed on the backlight module 114 , and the tray 120 may include a plurality of carrying units 122 for carrying a plurality of packaging structures 200 respectively. In one embodiment, each carrying unit 122 includes an opening 1222 and a plurality of grooves 1221, wherein the opening 1222 is used to expose the central area of the corresponding packaging structure 200, and the groove 1221 is used to expose the corresponding packaging structure 200 surrounding area. In this embodiment, the trenches 1221 can respectively surround at least two opposite sides of the opening 1222 . With such a configuration, the surface light source provided by the backlight module 114 below the tray 120 can penetrate through the groove 1221 and further illuminate the peripheral area of the package structure 200 to facilitate the identification by the image capture module 130 above.

Specifically, in this embodiment, the encapsulation structure 200 may include an encapsulant 210 and a plurality of external leads 220 extending from the encapsulant 210 as shown in FIG. 3 . In one embodiment, the packaging structure 200 can be a thin small outline package (Thin small outline package, TSOP), which can include a lead frame (lead frame) and an encapsulating compound 210 encapsulating the lead frame, wherein the lead frame Including the chip seat and the plurality of external pins 220 , the chip seat is encapsulated in the encapsulant 210 for disposing the chip, and the external leads 220 can extend out of the encapsulant 210 . Generally speaking, during the manufacturing process of the package structure 200 , the encapsulation compound 210 is easy to overflow to the lower surface of the outer leads 220 and the gap between the outer leads 220 , thereby affecting the electrical reliability of the package structure 200 . Therefore, it is necessary to use the package inspection machine 100 to detect whether the encapsulant 210 is overflowing and whether the extent of the overflow exceeds the allowable range.

In view of this, in this embodiment, the plurality of grooves 1221 of each carrying unit 122 can be used to expose the peripheral area of the corresponding package structure 200 (for example, corresponding to the outer pin 220 of the package structure 200), that is, The opening 1222 of the carrying unit 122 may correspond to the encapsulant 210 , and the groove 1221 may correspond to at least part of the external pins 122 . With such a configuration, the surface light source provided by the backlight module 114 under the tray 120 can penetrate through the groove 1221, thereby further illuminating the area near the outer pins 220 of the packaging structure 200, so as to facilitate the packaging inspection machine 100 to Interpretation of images captured by the image capture module 130 . In addition, in this embodiment, the color of the tray 120 can be light. Specifically, the color gradation of the tray 120 can differ from the color gradation of the encapsulant 210 by more than 20 steps, so as to further improve the quality of the external pins. The light-dark contrast between the packaging colloid 210 (if any) and the background between 220 , thereby improving the correct rate of image interpretation by the packaging inspection machine 100 .

FIG. 4 is a partially enlarged schematic view of the package structure in FIG. 3 . In one embodiment, please refer to FIG. 1 and FIG. 4 , the image capture module 130 is used to capture images of at least two adjacent outer pins 220 (such as the image shown in FIG. 4 ). Moreover, the package inspection machine 100 may further include a processor 150 as shown in FIG. Whether the ratio of the maximum glue overflow depth L1 of the overflowing encapsulant 212 between the pins 220 to the length L2 of the outer lead 110 is greater than a preset ratio. In this embodiment, the preset ratio may be about 25%, for example. That is to say, if the processor 150 determines that the ratio of the maximum glue overflow depth L1 to the length L2 of the outer lead 110 is substantially greater than 25%, the processor 150 determines that the defect of the package structure 200 is greater than the acceptable range and accordingly Make an interpretation result (such as judging that the encapsulation structure is unqualified (fail)), and then perform exception handling such as discarding it.

5 to 7 are schematic views of the carrying unit of the package inspection machine according to different embodiments of the present disclosure. It must be noted here that the carrying unit 122 of the packaging inspection machine 100 of this embodiment is similar to the previous embodiment, therefore, this embodiment follows the component numbers and part of the content of the previous embodiment, wherein the same number is used to indicate the same or similar elements, and descriptions of the same technical content are omitted. For the description of the omitted part, reference may be made to the foregoing embodiments, and this embodiment will not be repeated. The difference between the carrying unit 122 of the packaging inspection machine 100 of this embodiment and the previous embodiments will be described below.

In some embodiments, the groove 1221 of the bearing unit 122 can have various configurations according to product characteristics. For example, please refer to FIG. 5 first. In this embodiment, corresponding to the shape of the package structure, the carrying unit 122 can have a pair of long sides 1223 and a pair of short sides 1224, and the grooves 1221 can at least be opposite to each other along the The two long sides 1223 are arranged to expose the outer pins 122 arranged along the two opposite long sides in the package structure 200 shown in FIG. and shine through to illuminate the area near the outer leads 220 of the package structure 200 . Further, each groove 1221 can extend along the corresponding long side 1223 , and can extend from opposite ends of the long side 1223 toward the center of the short side 1224 respectively. In this embodiment, the plurality of grooves 1221 may be arranged symmetrically with a certain distance therebetween.

Referring to FIG. 6 again, in an embodiment, the external leads of the package structure may be disposed along two opposite short sides, for example. Correspondingly, the groove 1221a for carrying the carrying unit 122a of the package structure can be disposed at least along two short sides 1224 opposite to each other, so as to expose the external leads disposed along the two opposite short sides of the package structure. Further, each groove 1221 a can extend along the corresponding short side 1224 , and can extend from opposite ends of the short side 1224 toward the center of the long side 1223 respectively. In this embodiment, the plurality of grooves 1221a may be arranged symmetrically with a certain distance therebetween.

Referring to FIG. 7 again, in an embodiment, the external leads of the package structure may be arranged along each side of the package structure, for example, arranged along a pair of long sides and a pair of short sides respectively. Correspondingly, the grooves 1221b for carrying the carrying unit 122b of the above-mentioned packaging structure can be respectively arranged along the two long sides 1223 and the two short sides 1224 opposite to each other, so as to expose the external parts arranged along each side of the packaging structure. pin. Further, each groove 1221b may be separated from each other by a specific distance.

FIG. 8 is a schematic diagram of a light source module of a package inspection machine according to an embodiment of the present disclosure. Please refer to FIG. 1 and FIG. 8 , in this embodiment, the light source module 140 can be a hemispherical diffused light source. Specifically, the light source module 140 of this embodiment has a hemispherical reflective diffuser lampshade, a plurality of light sources 142 are arranged in the hemispherical lampshade, and the light sources (such as light emitting diodes) 142 illuminate the hemisphere upwards. Shaped lampshade, in this way, the light emitted by the light source 142 is diffused by the diffuser lampshade to form a uniform lighting area under the light source 142, which is obviously different from the general direct light source lighting effect. In this embodiment, the light source module 140 may have an opening 144 so that the image capture module 130 disposed above can capture an image of the package structure through the opening 144 . Under such a configuration, the light source module 140 illuminates the image captured by the image capture module 130 without obvious shadows, and the smooth surface does not have strong reflected light, which can avoid shadows or shadows when capturing images. The influence of reflection can reduce the difficulty of image processing.

To sum up, the supporting platform of the packaging inspection machine of the present disclosure is provided with a backlight module, and the tray for carrying the packaging structure is arranged on the backlight module, and the tray structure of the packaging inspection machine includes a plurality of carrying units, And each carrying unit includes a plurality of grooves for exposing the peripheral area of the corresponding packaging structure (for example, corresponding to the outer pins of the packaging structure). With such a configuration, the surface light source provided by the backlight module under the tray can penetrate through the groove, thereby further illuminating at least the peripheral area of the package structure, so as to improve the light and dark contrast between the package structure and the background, and to facilitate the package inspection machine. The interpretation of the image captured by its image capture module can further improve the accuracy of the image interpretation of the package inspection machine.

100: Package inspection machine 110: bearing platform 112: base 1121: set the groove 114:Backlight module 120: tray 122, 122a, 122b: carrying unit 1221, 1221a, 1221b: grooves 1222: opening 1223: long side 1224: short side 130: Image capture module 140:Light source module 142: light source 144: opening 150: Processor 200: package structure 210: Packaging Colloid 220: external pin L1: maximum glue overflow depth L2: Length

FIG. 1 is a schematic diagram of a package inspection machine according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram of a tray of a package inspection machine according to an embodiment of the present disclosure. FIG. 3 is a schematic diagram of a package structure applied to a package inspection machine according to an embodiment of the present disclosure. FIG. 4 is a partially enlarged schematic view of the package structure in FIG. 3 . 5 to 7 are schematic views of the carrying unit of the package inspection machine according to different embodiments of the present disclosure. FIG. 8 is a schematic diagram of a light source module of a package inspection machine according to an embodiment of the present disclosure.

100: Package inspection machine

110: bearing platform

112: base

1121: set the groove

114:Backlight module

120: tray

130: Image capture module

140:Light source module

142: light source

144: opening

150: Processor

Claims (8)

A package inspection machine platform, comprising: a carrying platform, which includes a base and a backlight module set on the base; a tray, set on the backlight module and including a plurality of carrying units, wherein the multiple Each of the carrying units is used to carry a plurality of packaging structures, and each of the carrying units includes a plurality of grooves exposing a plurality of outer pins of the corresponding packaging structure, and each of the packaging structures includes a packaging compound and the packaging compound. A plurality of external pins extending outward; an image capture module, arranged above the carrying platform and used to capture at least part of the images of the plurality of packaging structures; a processor, coupled to the image capture module, and used to judge the image captured by the image capture module; and a light source module is arranged between the image capture module and the carrying platform. The packaging inspection machine as claimed in claim 1, wherein each of the carrying units further includes an opening for exposing a central area of the corresponding packaging structure, and the grooves respectively surround at least two opposite sides of the opening. The package inspection machine as claimed in claim 1, wherein each of the carrying units further includes an opening corresponding to the encapsulant, and the plurality of grooves correspond to at least part of the plurality of external leads. The package inspection machine as claimed in claim 1, wherein the image capture module is used to capture at least two adjacent images of the plurality of external leads. The package inspection machine as claimed in Claim 1, wherein a color level of the tray is different from a color level of the encapsulant by more than 20 levels. The packaging inspection machine as claimed in claim 1, wherein the light source module includes a hemispherical diffused light source. The package inspection machine as claimed in item 1, wherein the lens of the image capture module includes a fisheye lens. A tray structure for a packaging inspection machine, comprising: a tray for being arranged on a backlight module and including a plurality of carrying units, wherein the plurality of carrying units are respectively used to carry a plurality of packaging structures, and each of the carrying units A cell includes a plurality of trenches at a plurality of outer pins exposing a corresponding package structure.