JPH06265323A - Outer shape inspection device - Google Patents

Outer shape inspection device

Info

Publication number
JPH06265323A
JPH06265323A JP5054476A JP5447693A JPH06265323A JP H06265323 A JPH06265323 A JP H06265323A JP 5054476 A JP5054476 A JP 5054476A JP 5447693 A JP5447693 A JP 5447693A JP H06265323 A JPH06265323 A JP H06265323A
Authority
JP
Japan
Prior art keywords
image
camera
lead
mirror surface
profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5054476A
Other languages
Japanese (ja)
Inventor
Hisafumi Hamachi
尚史 浜地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Hokkai Semiconductor Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Hokkai Semiconductor Ltd, Hitachi Ltd filed Critical Hitachi Hokkai Semiconductor Ltd
Priority to JP5054476A priority Critical patent/JPH06265323A/en
Publication of JPH06265323A publication Critical patent/JPH06265323A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To inspect both the profile and rear surface of an object to be inspected with one camera by providing a profile image reflection member with a mirror surface part for reflecting the image of the profile of the object to be inspected (lead wire of IC, etc.). CONSTITUTION:A profile image reflection member 9 consists of a mirror surface part 8 consisting of a prism and a mirror surface part retention member 8a for retaining it at both sides, thus forming the stand for an IC 4. The IC 4 is placed on the member 9 and a camera 10 is placed at a specific position. The camera image picked up and output by the camera 10 consists of the image obtained by reflecting the image of the profile of the inside of a lead 4a of the IC4 on the mirror surface part 8 (a flatness inspection image 11 of the lead 4a) and the image of the rear surface of the lead 4a (a side-bending inspection image 12), thus capturing both images of the inspection images 11 and 12 into the visual field of one camera 10. The mirror surface part 8 may be formed by performing plating treatment to a metal member and then finishing it to a mirror-surface state and the member 9 may be formed by providing a light source inside the member made of a transparent resin such as acryl.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子部品など、例えば
半導体製造技術における半導体集積回路装置(以下、I
Cと称する)の外観を検査する外観検査技術に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device (hereinafter referred to as I
(Referred to as “C”) for the appearance inspection technique for inspecting the appearance.

【0002】[0002]

【従来の技術】従来、ICなどのリードの外観検査を実
施する場合、前記リードの横曲がりと平坦度との2つの
項目を検査している。
2. Description of the Related Art Conventionally, when conducting a visual inspection of a lead such as an IC, two items of lateral bending and flatness of the lead are inspected.

【0003】例えば、ICの種類の1つであるJリード
形ICのリードを検査する場合、リードを2つの方向か
らカメラによって撮影し、それぞれ横曲がり検査用の画
像と平坦度検査用の画像とが必要である。
For example, when inspecting leads of a J-lead type IC, which is one of the types of ICs, the leads are photographed from two directions by a camera, and an image for lateral bending inspection and an image for flatness inspection are respectively obtained. is necessary.

【0004】ここで、本発明者が考えた外観検査装置の
構造の一例を図5の構成図に、また、その外観検査装置
におけるカメラ画像の一例を図6(a)〜(c)の画像
解説図に示し、図6(a)は第1カメラによる画像、
(b)は第2カメラによる画像、(c)は第3カメラに
よる画像解説図である。
Here, an example of the structure of the appearance inspection apparatus considered by the present inventor is shown in the block diagram of FIG. 5, and an example of the camera image in the appearance inspection apparatus is shown in the images of FIGS. 6 (a) to 6 (c). It is shown in the explanatory diagram, and FIG. 6A shows an image by the first camera,
(B) is an image taken by the second camera, and (c) is an explanatory view of an image taken by the third camera.

【0005】図5および図6を用いて、本発明者が考え
た外観検査装置の構成を説明すると、被検査物であるI
C4のリード4aを前記IC4の裏側から撮影する第1
カメラ1と、前記IC4のリード4aの側面を水平横方
向から撮影する第2カメラ2と、同じくIC4のリード
4aの反対側の側面を水平横方向から撮影する第3カメ
ラ3と、前記第1カメラ1〜第3カメラ3による出力画
像である第1カメラ画像5と、第2カメラ画像6、およ
び第3カメラ画像7とから構成されるものである。
The structure of the appearance inspection apparatus considered by the present inventor will be described with reference to FIGS.
The first to photograph the lead 4a of C4 from the back side of the IC4
A camera 1, a second camera 2 that photographs the side surface of the lead 4a of the IC 4 from the horizontal lateral direction, a third camera 3 that also photographs the side surface of the IC 4 opposite to the lead 4a from the horizontal lateral direction, and the first camera It is composed of a first camera image 5, which is an output image from the cameras 1 to 3, a second camera image 6, and a third camera image 7.

【0006】次に、図6を用いて、前記第1カメラ1〜
第3カメラ3が撮影する画像について説明すると、図6
(a)は第1カメラ1によって撮影された第1カメラ画
像5であり、リード4aをIC4の裏面から撮影し、前
記リード4aの横曲がりを検査する画像である。
Next, referring to FIG. 6, the first cameras 1 to
The image captured by the third camera 3 will be described with reference to FIG.
(A) is a first camera image 5 photographed by the first camera 1, which is an image in which the lead 4a is photographed from the back surface of the IC 4 and the lateral bending of the lead 4a is inspected.

【0007】また、図6(b)は第2カメラ2によって
撮影された第2カメラ画像6であり、リード4aの側面
をIC4の水平横方向から撮影し、前記リード4aの平
坦度を検査する画像である。
FIG. 6B is a second camera image 6 taken by the second camera 2. The side surface of the lead 4a is taken from the horizontal direction of the IC 4 to inspect the flatness of the lead 4a. It is an image.

【0008】さらに、図6(c)は第3カメラ3によっ
て撮影された第3カメラ画像7であり、前記第2カメラ
2が撮影したリード4aの側面と反対側の側面を撮影
し、リード4aの平坦度を検査する画像である。
Further, FIG. 6 (c) is a third camera image 7 photographed by the third camera 3, wherein the side face opposite to the side face of the lead 4a photographed by the second camera 2 is photographed and the lead 4a is photographed. 2 is an image for inspecting the flatness of the.

【0009】したがって、上記の外観検査装置において
は、少なくとも3台のカメラによって1個のICのリー
ド横曲がりや平坦度の検査をするのが一般的である。
Therefore, in the above appearance inspection apparatus, it is general that at least three cameras inspect the lead lateral bending and flatness of one IC.

【0010】[0010]

【発明が解決しようとする課題】ところが、前記した従
来技術においては、1個のICのリードを検査するの
に、3台のカメラが必要とされるため、フレームメモリ
(ディジタル変換された画素データを取り込むメモリ)
もカメラの台数に応じた数が必要とされる場合が多い。
However, in the above-mentioned prior art, three cameras are required to inspect the lead of one IC, so that the frame memory (pixel data converted into digital data is required). Memory to capture)
In many cases, a number corresponding to the number of cameras is required.

【0011】また、前記フレームメモリを複数用いない
場合であっても、検査時にはカメラを順次切換え、その
都度画像処理を行っているため、検査時間が非常に長く
なるという問題がある。
Even when a plurality of frame memories are not used, the inspection time becomes very long because the cameras are sequentially switched during the inspection and the image processing is performed each time.

【0012】本発明の目的は、ICのリードなどを検査
する外観検査装置において、1台のカメラで被検査物の
側面と裏面との両方を検査する外観検査装置を提供する
ことにある。
It is an object of the present invention to provide an appearance inspection apparatus for inspecting IC leads and the like, which inspects both the side surface and the back surface of an object to be inspected by one camera.

【0013】本発明の前記ならびにその他の目的と新規
な特徴は、本明細書の記述および添付図面から明らかに
なるであろう。
The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

【0014】[0014]

【課題を解決するための手段】本願において開示される
発明のうち、代表的なものの概要を簡単に説明すれば、
以下のとおりである。
Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

【0015】すなわち、被検査物の外観を検査する装置
であって、被検査物の側面の像を反射させる鏡面部を備
えた側面像反射部材が設けられるものである。
That is, the apparatus for inspecting the appearance of an object to be inspected is provided with a side surface image reflecting member having a mirror surface portion for reflecting the image of the side surface of the object to be inspected.

【0016】また、前記側面像反射部材は、少なくとも
前記鏡面部がプリズムによって構成されるものである。
Further, at least the mirror surface portion of the side image reflecting member is constituted by a prism.

【0017】[0017]

【作用】前記した手段によれば、被検査物の側面の像を
反射させる鏡面部を備えた側面像反射部材が設けられる
ことによって、被検査物の側面の像と裏面の像との両方
の像を1台のカメラ視野に取り込むことができる。
According to the above-mentioned means, by providing the side surface image reflecting member having the mirror surface portion for reflecting the image of the side surface of the object to be inspected, both the image of the side surface of the object to be inspected and the image of the back surface Images can be captured in the field of view of a single camera.

【0018】[0018]

【実施例】図1は本発明の一実施例である外観検査装置
の構成の一例を示す構成解説図であり、また、図2は本
発明の一実施例である外観検査装置におけるカメラ画像
の一例を示す画像解説図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a structural explanatory view showing an example of the structure of an appearance inspection apparatus which is an embodiment of the present invention, and FIG. 2 shows a camera image in the appearance inspection apparatus which is an embodiment of the present invention. It is an image explanatory view showing an example.

【0019】図1および図2を用いて、本実施例の外観
検査装置の構成を説明すると、被検査物であるIC4の
置台であり、さらにIC4のリード4aの内側の側面の
像を鏡面部8に反射させる側面像反射部材9と、前記鏡
面部8に反射するリード4aの内側の側面の像とリード
4aの裏面の像との2つの像をIC4の裏側から取り込
むように設置されたカメラ10と、前記カメラ10の出
力であるカメラ画像13とから構成されるものである。
The configuration of the appearance inspection apparatus of this embodiment will be described with reference to FIGS. 1 and 2, which is a table for an IC4 to be inspected, and an image of the inner side surface of the lead 4a of the IC4 is a mirror surface portion. 8, a side image reflection member 9 for reflecting the image on the side surface of the lead 4a, and a camera installed so as to capture two images from the back side of the IC 4; 10 and a camera image 13 which is an output of the camera 10.

【0020】次に、図3は本発明の一実施例である外観
検査装置における側面像反射部材9の一例を示す断面図
である。
Next, FIG. 3 is a sectional view showing an example of the side image reflecting member 9 in the appearance inspection apparatus according to the embodiment of the present invention.

【0021】図3を用いて、本実施例の外観検査装置に
おける側面像反射部材9の構成を説明すると、プリズム
などからなる鏡面部8と、前記鏡面部8を両側に保持す
る鏡面部保持部材8aとから構成されるものである。
The configuration of the side image reflection member 9 in the appearance inspection apparatus of this embodiment will be described with reference to FIG. 3. The mirror surface portion 8 made of a prism and the mirror surface portion holding member for holding the mirror surface portion 8 on both sides. And 8a.

【0022】次に、図1および図2を用いて、カメラ1
0が撮影して出力するカメラ画像13について説明す
る。
Next, referring to FIGS. 1 and 2, the camera 1 will be described.
The camera image 13 captured and output by 0 will be described.

【0023】まず、図2に示すカメラ画像13は、リー
ド4aの内側の側面の像が側面像反射部材9の鏡面部8
に反射して得られる像と、リード4aの裏面の像とから
構成され、前者はリード4aの平坦度検査像11であ
り、後者はリード4aの横曲がり検査像12である。
First, in the camera image 13 shown in FIG. 2, the image of the inner side surface of the lead 4a is the mirror surface portion 8 of the side image reflecting member 9.
The image is a flatness inspection image 11 of the lead 4a, and the latter is a lateral bending inspection image 12 of the lead 4a.

【0024】したがって、1台のカメラ10の視野に、
リード4aの内側の側面の像(平坦度検査像11)と、
リード4aの裏面の像(横曲がり検査像12)との両方
の像を取り込むことができる。
Therefore, in the field of view of one camera 10,
An image of the inner side surface of the lead 4a (flatness inspection image 11),
Both the image of the back surface of the lead 4a (horizontal bending inspection image 12) can be captured.

【0025】以上、本発明者によってなされた発明を実
施例に基づき具体的に説明したが、本発明は前記実施例
に限定されるものではなく、その要旨を逸脱しない範囲
で種々変更可能であることは言うまでもない。
Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

【0026】例えば、本実施例においては、側面像反射
部材の鏡面部はプリズムなどから成るものと説明した
が、金属部材にめっき処理を施し、鏡面状態に仕上げた
ものや、図4に示すようにアクリルなどの透明樹脂によ
って作られた部材の内部に光源14が設けられたもので
あってもよい。
For example, in the present embodiment, it has been described that the mirror surface portion of the side image reflecting member is composed of a prism or the like, but a metal member is plated to finish the mirror surface state, or as shown in FIG. The light source 14 may be provided inside a member made of transparent resin such as acrylic.

【0027】また、撮影するカメラの台数を増やして画
像の分解能を上げることにより、検査精度を高くするこ
とも可能である。
It is also possible to increase the inspection accuracy by increasing the number of cameras for photographing and increasing the resolution of the image.

【0028】さらに、本実施例において説明した側面像
反射部材は、2方向にリードを備える種類のICに対応
するものであるが、4方向にリードを備える種類のIC
に対応するように、4方向に鏡面部を備える側面像反射
部材であってもよい。
Further, although the side image reflecting member described in this embodiment corresponds to an IC of the type having leads in two directions, an IC of the type having leads in four directions.
The side image reflection member may be provided with mirror surface portions in four directions so as to correspond to.

【0029】[0029]

【発明の効果】本願において開示される発明のうち、代
表的なものによって得られる効果を簡単に説明すれば、
下記のとおりである。
The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

【0030】(1).1台のカメラで被検査物の側面の
像と裏面の像との両方の像を取り込むことができるた
め、従来使用していたカメラの台数を大幅に削減でき、
装置全体の小形化、低コスト化を計ることができる。
(1). Since one camera can capture both the side image and the back image of the object to be inspected, the number of cameras used conventionally can be greatly reduced.
The overall size and cost of the device can be reduced.

【0031】(2).1台のカメラで撮影できるため、
同一のフレームメモリ上において、被検査物の側面の像
と裏面の像との両方の画像データを処理できるため、検
査時のスピードを大幅に向上させることができる。
(2). Because you can shoot with one camera,
Since the image data of both the side image and the back side image of the inspection object can be processed in the same frame memory, the inspection speed can be greatly improved.

【0032】(3).1台のカメラで撮影できるため、
フレームメモリそのものの数も削減でき、低価格化を計
ることができる。
(3). Because you can shoot with one camera,
The number of frame memories themselves can be reduced, and the price can be reduced.

【0033】(4).本発明による外観検査装置は、光
学系と回路系とを小形化することができるため、検査精
度に関する高信頼性を実現することができる。
(4). Since the appearance inspection apparatus according to the present invention can downsize the optical system and the circuit system, high reliability regarding inspection accuracy can be realized.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例である外観検査装置の構成の
一例を示す構成解説図である。
FIG. 1 is a configuration explanatory view showing an example of the configuration of an appearance inspection apparatus that is an embodiment of the present invention.

【図2】本発明の一実施例である外観検査装置における
カメラ画像の一例を示す画像解説図である。
FIG. 2 is an image explanation diagram showing an example of a camera image in the visual inspection apparatus which is an embodiment of the present invention.

【図3】本発明の一実施例である外観検査装置における
側面像反射部材の一例を示す断面図である。
FIG. 3 is a cross-sectional view showing an example of a side image reflection member in the visual inspection apparatus that is an embodiment of the present invention.

【図4】本発明の一実施例である外観検査装置における
側面像反射部材の他の実施例を示す断面図である。
FIG. 4 is a cross-sectional view showing another embodiment of the side image reflecting member in the visual inspection apparatus which is an embodiment of the present invention.

【図5】本発明者が考えた外観検査装置の構造の一例を
示す構成図である。
FIG. 5 is a configuration diagram showing an example of a structure of an appearance inspection device considered by the present inventor.

【図6】本発明者が考えた外観検査装置におけるカメラ
画像の一例を示す画像解説図であり、(a)は第1カメ
ラによる画像、(b)は第2カメラによる画像、(c)
は第3カメラによる画像を示す画像解説図である。
6A and 6B are image explanatory diagrams showing an example of a camera image in the appearance inspection apparatus considered by the present inventor, where FIG. 6A is an image taken by a first camera, FIG. 6B is an image taken by a second camera, and FIG.
[Fig. 6] is an image explanation diagram showing an image taken by a third camera.

【符号の説明】[Explanation of symbols]

1 第1カメラ 2 第2カメラ 3 第3カメラ 4 IC 4a リード 5 第1カメラ画像 6 第2カメラ画像 7 第3カメラ画像 8 鏡面部 8a 鏡面部保持部材 9 側面像反射部材 10 カメラ 11 平坦度検査像 12 横曲がり検査像 13 カメラ画像 14 光源 1 1st camera 2 2nd camera 3 3rd camera 4 IC 4a lead 5 1st camera image 6 2nd camera image 7 3rd camera image 8 Mirror surface part 8a Mirror surface part holding member 9 Side image reflection member 10 Camera 11 Flatness inspection Image 12 Lateral bend inspection image 13 Camera image 14 Light source

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 被検査物の外観を検査する装置であっ
て、該被検査物の側面の像を反射させる鏡面部を備えた
側面像反射部材が設けられることを特徴とする外観検査
装置。
1. An appearance inspection apparatus for inspecting the appearance of an object to be inspected, comprising a side image reflection member having a mirror surface portion for reflecting an image of a side surface of the object to be inspected.
【請求項2】 前記側面像反射部材は、少なくとも前記
鏡面部がプリズムであることを特徴とする請求項1記載
の外観検査装置。
2. The appearance inspection apparatus according to claim 1, wherein at least the mirror surface portion of the side image reflecting member is a prism.
【請求項3】 前記側面像反射部材は、金属部材にめっ
き処理が施されたものであることを特徴とする請求項1
記載の外観検査装置。
3. The side image reflecting member is formed by plating a metal member.
Appearance inspection device described.
【請求項4】 前記側面像反射部材は、透明部材と該透
明部材の内部に設置される光源とから成ることを特徴と
する請求項1記載の外観検査装置。
4. The appearance inspection apparatus according to claim 1, wherein the side image reflection member includes a transparent member and a light source installed inside the transparent member.
JP5054476A 1993-03-16 1993-03-16 Outer shape inspection device Pending JPH06265323A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5054476A JPH06265323A (en) 1993-03-16 1993-03-16 Outer shape inspection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5054476A JPH06265323A (en) 1993-03-16 1993-03-16 Outer shape inspection device

Publications (1)

Publication Number Publication Date
JPH06265323A true JPH06265323A (en) 1994-09-20

Family

ID=12971727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5054476A Pending JPH06265323A (en) 1993-03-16 1993-03-16 Outer shape inspection device

Country Status (1)

Country Link
JP (1) JPH06265323A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09229643A (en) * 1996-02-21 1997-09-05 Nec Yamaguchi Ltd Apparatus for inspecting semiconductor device
WO2000033027A1 (en) * 1998-11-30 2000-06-08 Rahmonic Resources Pte Ltd. An apparatus and method to transport, inspect and measure objects and surface details at high speeds
JP2003065754A (en) * 2001-08-24 2003-03-05 Ricoh Co Ltd Method and device for measuring flatness of semiconductor device package
KR100605051B1 (en) * 1998-06-01 2006-07-26 프리스케일 세미컨덕터, 인크. Apparatus, tool and method for visually inspecting an object
TWI396824B (en) * 2010-03-02 2013-05-21 Witrins S R O Method and device for optically measuring the surface of a product

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09229643A (en) * 1996-02-21 1997-09-05 Nec Yamaguchi Ltd Apparatus for inspecting semiconductor device
KR100605051B1 (en) * 1998-06-01 2006-07-26 프리스케일 세미컨덕터, 인크. Apparatus, tool and method for visually inspecting an object
WO2000033027A1 (en) * 1998-11-30 2000-06-08 Rahmonic Resources Pte Ltd. An apparatus and method to transport, inspect and measure objects and surface details at high speeds
GB2361313A (en) * 1998-11-30 2001-10-17 Rahmonic Resources Pte Ltd An apparatus and method to transport, inspect and measure objects and surface details at high speeds
GB2361313B (en) * 1998-11-30 2003-06-11 Rahmonic Resources Pte Ltd An apparatus and method to transport, inspect and measure objects and surface details at high speeds
JP2003065754A (en) * 2001-08-24 2003-03-05 Ricoh Co Ltd Method and device for measuring flatness of semiconductor device package
JP4557471B2 (en) * 2001-08-24 2010-10-06 株式会社リコー Method and apparatus for testing flatness of semiconductor device package
TWI396824B (en) * 2010-03-02 2013-05-21 Witrins S R O Method and device for optically measuring the surface of a product

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