JP3341382B2 - Apparatus for visual inspection of semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an appearance inspection apparatus for inspecting the appearance of a semiconductor device having a plurality of leads extending from a package.

[0002]

2. Description of the Related Art A semiconductor device provided with a package made of a mold resin or the like has a plurality of leads extending from a side surface of the package so that a semiconductor element sealed in the package can be electrically connected to an external circuit. It has become. Leads extending from such a package are prepared in various shapes according to the form of connection with an external circuit. For example, a gull-wing type lead is suitable for mounting a semiconductor device on a surface, and a so-called Quad Flat Package in which a plurality of leads extend from four sides of a package when the number of inputs and outputs of a semiconductor element is large.
There is also a semiconductor device called e (hereinafter referred to as QFP).

In recent years, semiconductor devices having a large number of leads and a narrow pitch have been actively used, and demands for lead inspection in a manufacturing stage have become severe. Conventionally, a visual inspection apparatus for a semiconductor device measures a bend, a pitch, and a lift of a lead by arranging an optical reading mechanism such as a CCD camera on a side of a lead extending from a package and taking in projection light of the lead. I was However, in such a visual inspection device, it is necessary to dispose an optical reading mechanism on each side of the package from which the lead extends, which leads to complication of equipment and cost increase.

In view of the above, a visual inspection apparatus 1 for a semiconductor device 10 shown in FIG. 5 arranges reflecting means such as a prism 3 outside a package 11 from which a lead 12 extends, and reflects the lead 12 reflected by the prism 3. The projection light is collectively taken in by the optical reading mechanism 4 arranged above the package 11. Thus, the projection light of all the leads 12 can be taken in by one optical reading mechanism 4, so that the equipment can be simplified.

[0005]

However, such a lead inspection apparatus for a semiconductor device has the following problems. That is, in this lead inspection apparatus, although one optical reading mechanism can receive the projection light of all leads, the field of view is extended to a range outside the package in order to receive the projection light from the reflection means. Therefore, the magnification of the optical reading mechanism must be set lower. For this reason, it is difficult to perform a highly accurate lead inspection, and especially when the lead pitch is narrow, the inspection accuracy is reduced.

[0006] Further, since the projection light of the lead is received near the outer periphery of the lens of the optical reading mechanism, it is susceptible to the aberration of the lens, and there is a problem that the inspection accuracy is reduced due to the distortion of the image. SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device appearance inspection apparatus capable of performing lead inspection with high accuracy using simple equipment.

[0007]

SUMMARY OF THE INVENTION The present invention is an apparatus for inspecting the appearance of a semiconductor device which has been made to solve such problems. That is, a semiconductor device appearance inspection device in which a plurality of leads extend from a package, wherein a mounting table is configured from a mounting portion for mounting the leads of the semiconductor device and an opening provided inside the mounting portion. The reflecting means for reflecting the projection light of the light emitted from the side of the lead to the lower side of the mounting table through the opening is disposed on the mounting section from the inside of the opening of the mounting table.
This is an appearance inspection device for a semiconductor device in which an optical reading mechanism for receiving projection light reflected by a reflection unit is disposed over a package side .

Further, the mounting portion of the mounting table is composed of a light transmitting member, and the transmitted light transmitted through the mounting portion is also received by the optical reading mechanism, and is reflected from the back surface of the package by the optical reading mechanism. It is also a visual inspection device for a semiconductor device that also receives light.

[0009]

Since the reflecting means is arranged inside the mounting portion on which the lead of the semiconductor device is mounted, the projection light of the lead can be reflected on the package side with respect to the lead. For this reason, the projection light of the lead is reflected inside the outer shape of the semiconductor device, and the field of view of the optical reading mechanism can be set smaller than the outer shape of the semiconductor device. Moreover, the reflection means is placed from inside the opening
Since it is arranged from the part to the package side, the mounting part
Can reflect the projected light of the light along the surface of the
Can accurately capture the lift and bend of the lead
become able to.

[0010] Further, when the mounting portion of the lead of the mounting table is made of a light transmitting member, the image of the lead can be taken into the optical reading mechanism via the mounting portion. That is, the image in the plane direction and the image in the side direction of the lead can be simultaneously obtained by the optical reading mechanism. Also, by taking in the optical reading mechanism the reflected light from the back surface of the package through the opening, it is possible to obtain a collective image of the lead and the package.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of a semiconductor device appearance inspection apparatus according to the present invention. FIG. 1 is a schematic cross-sectional view illustrating a semiconductor device appearance inspection apparatus according to the present invention.
That is, the appearance inspection apparatus 1 is for inspecting the appearance of the semiconductor device 10 in which a plurality of leads 12 extend from the package 11, and mainly mounts the mounting table 2 on which the semiconductor device 10 is mounted and reflects the projection light. Prism 3 for
And an optical reading mechanism 4 for receiving projection light.

The mounting table 2 includes a mounting portion 21 for mounting the leads 12 of the semiconductor device 10 and an opening 22 provided inside the mounting portion 21. In this state, the lead 12 comes into contact with the upper surface of the mounting portion 21. Opening 22 of this mounting part 21
For example, a reflecting means composed of the prism 3 is disposed from the inside of the device to the package 11 side from the mounting portion 21, and reflects projection light of light emitted from the outside of the lead 12 through the opening 22. To the mounting table 2.

The prisms 3 are arranged corresponding to the sides of the package 11 from which the leads 12 extend. For example, in the case of a semiconductor device 10 made of QFP, the prisms 3 correspond to the four sides of the package 11. The three prisms 3 are respectively arranged.

In order to inspect the appearance of the semiconductor device 10 using the appearance inspection apparatus 1, first, light is emitted from a side of the lead 12 by a light source (not shown) while the semiconductor device 10 is mounted on the mounting table 2. Irradiate. The light hits each lead 12, and the projection light is incident on the prism 3 arranged inside the mounting portion 21. The projection light is reflected by the prism 3, travels below the mounting table 2, and is captured by the optical reading mechanism 4.

The optical reading mechanism 4 is set to have a visual field capable of receiving the projection light reflected by the prism 3.
In other words, this field of view may be smaller than the outer shape of the semiconductor device 10, and sufficient projection light can be captured even when the magnification of the optical reading mechanism 4 is increased.

FIGS. 2A and 2B are views for explaining an image captured by the optical reading mechanism 4. FIG. 2A is an overall view and FIG. 2B is an enlarged view. That is, in the captured image 40, the lead image 12a, the placement unit image 21a, and the package back surface image 11a are shown as shadows. Note that the captured image 40 is an image of the semiconductor device 10 composed of a QFP, and is a projection of light reflected by the prisms 3 arranged corresponding to the four sides of the package 11. Then, based on the captured image 40, the lead 1
Measure the bend and lift of 2.

That is, the receiver image 21a and the lead image 1
By measuring the gap with the lead 2a, it is possible to inspect the floating of the lead 12, and by measuring the arrangement of the lead images 12a, it is possible to inspect the bending of the lead 12. Further, at the same time as the inspection of the leads 12, the inspection of the package 11 for defects or the like can be performed based on the package back surface image 11a.

As described above, by obtaining the projection light reflected by each prism 3, the inspection of the leads 12 extending from the package 11 of the semiconductor device 10 can be performed collectively.

Next, another embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 3, the visual inspection apparatus 1 includes the mounting table 2 on which the semiconductor device 10 is mounted, the prism 3 and the optical reading mechanism 4 as described above. The mounting portion 21 is formed of a light transmitting member made of glass or the like.

Therefore, when light is irradiated from the side of the lead 12 in a state where the semiconductor device 10 is mounted on the mounting table 2, the projection light of the lead 12 is reflected by the prism 3 and guided to below the mounting table 2. Then, light passes through the mounting portion 21 made of a light transmitting member and is taken in by the optical reading mechanism 4.

FIG. 4 is a view for explaining a captured image processing apparatus using the optical reading mechanism 4 of the visual inspection apparatus 1.
(A) is an overall view and (b) is an enlarged view. That is, the lead image 12a and the transmission image 12b can be simultaneously obtained from the captured image 40. For example, Q
In the case of the semiconductor device 1 composed of FP, the package 11
Of the leads 12 extending from the four sides can be obtained.

The lead image 12a of the captured image 40
Based on the transmitted image 12b, the bending and lifting of the lead 12 are measured. For example, in order to measure the floating of the lead 12, the gap between the receiver image 21a and the lead image 12a may be obtained. At the same time, the package backside image 11a
Then, the appearance inspection of the back surface of the package 11 may be performed.

In any of the embodiments, the semiconductor device 1
Since the image of the lead 12 can be obtained in a field of view smaller than the outer shape of 0, the magnification of the optical reading mechanism 4 can be increased. In addition, since the peripheral portion of the lens of the optical reading mechanism 4 does not need to be used when capturing the projection light due to such a visual field, distortion of the captured image 40 due to lens aberration does not matter.

In this embodiment, the case where the external appearance of the semiconductor device 10 made of a QFP is inspected has been described as an example. In addition, a J-shaped lead 12 shown in FIG.
Device 1 made of so-called SOJ or QFJ
Inspection can be performed even in the case of 0.

That is, the J-shaped lead 12 is mounted on the mounting portion 21 of the mounting table 2, and the prism 3 is arranged inside the lead. As a result, the projection light of the light emitted from the side of the lead 12 is reflected by the prism 3, guided to below the mounting table 2, and can be received by the optical reading mechanism 4.

In this embodiment, the prism 3 is used as the reflection means for reflecting the projection light. However, the present invention is not limited to this, and the same applies to a half mirror or another reflection plate. Further, the shape of the lead 12 is not limited to the gull-wing type or the J-type, and even if it is an insertion type or another shape, it can be inspected.

[0027]

As described above, the appearance inspection apparatus for a semiconductor device according to the present invention has the following effects. That is, since the projection light of the lead can be received in a field of view smaller than the outer shape of the semiconductor device, the magnification of the captured image can be increased, and the accuracy of the optical reading mechanism is not affected by the aberration of the lens. It is possible to perform a high lead inspection.

Further, by forming the mounting portion of the lead with a light-transmitting member, it is possible to receive an image of the lead in the plane direction and perform various inspections based on one captured image. Become. Further, images of the back surface of the package can be captured at the same time, and many appearance inspections can be performed even with simple equipment.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view illustrating an appearance inspection apparatus according to the present invention.

FIGS. 2A and 2B are diagrams illustrating a captured image, wherein FIG. 2A is an overall view and FIG. 2B is an enlarged view.

FIG. 3 is a schematic sectional view illustrating another example.

FIG. 4 is a view for explaining a captured image of another example, and FIG.
Is an overall view, and (b) is an enlarged view.

FIG. 5 is a schematic cross-sectional view illustrating inspection of another lead shape.

FIG. 6 is a schematic sectional view illustrating a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Appearance inspection apparatus 2 Mounting base 3 Prism 4 Optical reading mechanism 10 Semiconductor device 11 Package 12 Lead 21 Mounting part 22 Opening

Claims (3)

(57) [Claims] 1. A visual inspection apparatus for a semiconductor device in which a plurality of leads extend from a package, comprising a mounting portion for mounting the leads of the semiconductor device, and an opening inside the mounting portion. A mounting table provided with: a package from the mounting section described above from inside the opening of the mounting table.
Receiving a reflection means for reflecting the projection light of light irradiated from the side of the deployed the lead toward di-side through the opening downwardly of said mounting base, said projected light reflected by said reflecting means A visual inspection device for a semiconductor device, comprising: 2. The semiconductor device according to claim 1, wherein the mounting portion of the mounting table is formed of a light transmitting member, and the optical reading mechanism also receives transmitted light transmitted through the mounting portion. Visual inspection equipment. 3. The visual inspection device for a semiconductor device according to claim 1, wherein the optical reading mechanism also receives light reflected from the back surface of the package.