JP2513153B2 - Bonding wire inspection device - Google Patents
Bonding wire inspection deviceInfo
- Publication number
- JP2513153B2 JP2513153B2 JP5318685A JP31868593A JP2513153B2 JP 2513153 B2 JP2513153 B2 JP 2513153B2 JP 5318685 A JP5318685 A JP 5318685A JP 31868593 A JP31868593 A JP 31868593A JP 2513153 B2 JP2513153 B2 JP 2513153B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- image
- lead frame
- image forming
- binarizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Description
【０００１】[0001]
【産業上の利用分野】本発明はボンディングワイヤ検査
装置に関し、特にボンディングワイヤの最高点高さを測
定するボンディングワイヤ検査装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding wire inspection device, and more particularly to a bonding wire inspection device for measuring the maximum height of a bonding wire.
【０００２】[0002]
【従来の技術】近年、半導体の高集積化・高機能化が進
むにつれ、集積回路のリードは多ピン化・狭ピッチ化す
る傾向にある。これは集積回路チップとリードフレーム
のインナーリードとを接続するワイヤボンディングにお
いても同様であり、多ピン化・狭ピッチ化・長ワイヤ化
が進んでいる。更に、集積回路パッケージの高さを低く
するために、ボンディングワイヤのループ高さも低くな
る傾向にある。このため、ボンディング後のモールド工
程におけるボンディングワイヤの断線・ショートを防止
するために、ボンディングワイヤのループ形状をより厳
しく管理する必要があり、ボンディングワイヤのループ
形状を検査する自動外観検査装置が強く望まれている。2. Description of the Related Art In recent years, as semiconductors have become highly integrated and highly functional, the leads of integrated circuits tend to have a large number of pins and a narrow pitch. This also applies to wire bonding for connecting the integrated circuit chip and the inner lead of the lead frame, and the number of pins, pitches, and wires are increasing. Further, the loop height of the bonding wire tends to be low in order to reduce the height of the integrated circuit package. For this reason, it is necessary to manage the loop shape of the bonding wire more strictly in order to prevent disconnection and short circuit of the bonding wire in the molding process after bonding, and an automatic visual inspection device for inspecting the loop shape of the bonding wire is strongly desired. It is rare.
【０００３】図６は、たとえば特開昭６３−３０４１４
４号公報に示されている従来のボンディングワイヤ検査
装置を示す構成図である。図６を参照すると、照明装置
１８はリング形状の投光部を備え、被検査物であるボン
ディングワイヤ１９の立ち上がり部分に全周方向から照
明光を投光する。撮像装置２０はレンズ２１およびＣＣ
Ｄセンサ２２から構成されており、ボンディングワイヤ
１９の立ち上がり部分に焦点が合わされている。FIG. 6 shows, for example, Japanese Patent Laid-Open No. 63-30414.
It is a block diagram which shows the conventional bonding wire inspection apparatus shown by the 4th publication. Referring to FIG. 6, the illuminating device 18 includes a ring-shaped light projecting unit, and projects the illuminating light to the rising portion of the bonding wire 19 as the inspection object from the entire circumferential direction. The imaging device 20 includes a lens 21 and a CC
It is composed of a D sensor 22 and is focused on the rising portion of the bonding wire 19.
【０００４】図７は撮像装置２０によって撮像された画
像である。図７を図６に併せて参照すると、ボンディン
グワイヤ１９の立ち上がり部分２３に対し、全周方向か
ら照明光が投光されているので、この部分が極めて強く
輝くとともに、この部分に撮像装置２０の焦点を合わせ
ているので、立ち上がり部分２３の画像を得ることがで
きる。このようにボンディングワイヤ１９の立ち上がり
部分２３のみを明るい画像として得ることができるの
で、撮像装置２０により得られた画像データから立ち上
がり部分２３の長さを算出することができる。FIG. 7 shows an image picked up by the image pickup device 20. Referring to FIG. 7 together with FIG. 6, since the illumination light is projected from the entire circumferential direction to the rising portion 23 of the bonding wire 19, this portion shines extremely strongly and the imaging device 20 is lit in this portion. Since the focus is adjusted, the image of the rising portion 23 can be obtained. Since only the rising portion 23 of the bonding wire 19 can be obtained as a bright image in this way, the length of the rising portion 23 can be calculated from the image data obtained by the imaging device 20.
【０００５】[0005]
【発明が解決しようとする課題】この従来のボンディン
グワイヤ検査装置はボンディングワイヤ立ち上がり部分
の高さを照明で明るく光らせて観察するため、ボンディ
ングワイヤ最高点がワイヤループの途中にある場合はそ
の最高点のワイヤ高さが測定できない。また、実際に検
査するボンディングワイヤの手前にあるボンディングワ
イヤを避けるために撮像装置で斜め上方から観察する必
要があるので、ボンディングワイヤの立ち上がり部分が
斜めになっていると立ち上がり高さの測定に誤差を生じ
る。This conventional bonding wire inspection apparatus observes the height of the rising portion of the bonding wire by illuminating it brightly. Therefore, when the highest point of the bonding wire is in the middle of the wire loop, the highest point is obtained. The wire height cannot be measured. In addition, since it is necessary to observe the bonding wire from diagonally above in order to avoid the bonding wire in front of the bonding wire to be actually inspected, if the rising portion of the bonding wire is oblique, there is an error in measuring the rising height. Cause
【０００６】[0006]
【課題を解決するための手段】本発明のボンディングワ
イヤ検査装置は、ボンディングワイヤが張られたリード
フレームの側方から照明光を投光する照明手段と、前記
ボンディングワイヤに関して前記照明手段の反対側に配
置され光軸が前記リードフレーム面と平行である結像手
段と、この結像手段によって形成された前記ボンディン
グワイヤ像を撮像する撮像手段と、前記結像手段を前記
光軸方向に移動させ前記ボンディングワイヤの最高点に
焦点を合わせる焦点合わせ手段と、前記撮像手段によっ
て得られた画像に対して所定の閾値で２値化を行う２値
化手段と、前記焦点合わせ手段によって焦点位置を変え
た複数の画像に対し前記２値化手段によって２値化を行
った結果の２値化画像の論理和を演算する演算手段と、
前記演算手段によって得られた画像データから前記ボン
ディングワイヤの前記最高点を検出する最高点検出手段
とを備える。A bonding wire inspection apparatus according to the present invention comprises an illuminating means for projecting an illuminating light from a side of a lead frame on which the bonding wire is stretched, and an opposite side of the illuminating means with respect to the bonding wire. An image forming means arranged in the optical axis parallel to the lead frame surface, an image capturing means for capturing the bonding wire image formed by the image forming means, and the image forming means moved in the optical axis direction. Focusing means for focusing on the highest point of the bonding wire, binarizing means for binarizing the image obtained by the image pickup means with a predetermined threshold, and focus position by the focusing means. Computing means for computing the logical sum of the binarized images resulting from binarizing the plurality of images by the binarizing means,
A highest point detecting means for detecting the highest point of the bonding wire from the image data obtained by the arithmetic means.
【０００７】また、本発明のボンディングワイヤ検査装
置は、前記リードフレームの上部に設けらる前記照明手
段から下方に出射される前記照明光を前記リードフレー
ムの側方から投光するように反射せしめる第１の反射手
段と、前記ボンディングワイヤ部を通過した前記照明光
を前記リードフレームの上部に設けられる前記結像手段
に導入されるように反射せしめる第２の反射手段とを備
える。Further, in the bonding wire inspection apparatus of the present invention, the illumination light emitted downward from the illumination means provided on the upper portion of the lead frame is reflected so as to be projected from the side of the lead frame. A first reflecting means and a second reflecting means for reflecting the illumination light passing through the bonding wire portion so as to be introduced into the image forming means provided on the lead frame are provided.
【０００８】さらに、本発明のボンディングワイヤ検査
装置は、前記リードフレーム下側を通過する前記照明光
を遮断するために前記結像手段の光軸に対し前記ボンデ
ィングワイヤがある側半分のみを開口するように前記結
像手段の一部を遮閉する遮蔽手段を備える。Further, in the bonding wire inspection apparatus of the present invention, in order to block the illumination light passing through the lower side of the lead frame, only the side half where the bonding wire is located with respect to the optical axis of the image forming means is opened. Thus, a shielding means for shielding a part of the image forming means is provided.
【０００９】[0009]
【実施例】次に、本発明について図面を参照して説明す
る。図１は本発明の一実施例を示す構成図である。図１
を参照すると、この実施例のボンディングワイヤ検査装
置は、被検査物であるボンディングワイヤ１が張られた
集積回路２およびリードフレーム３の上方に配置され照
明光を下方に投光する照明装置４と、この照明装置４か
ら投光された照明光をボンディングワイヤ１の側方から
照射するように光路変更するミラー５と、ボンディング
ワイヤ１に関してミラー５の反対側に置かれボンディン
グワイヤ１を通過する照明光をリードフレーム３の上方
に光路変更するミラー６と、このミラー６によって反射
された照明光を導入してボンディングワイヤ１の像を結
像するレンズ７とこのレンズ７の結像位置に置かれたＣ
ＣＤセンサ８とを含んで構成される撮像装置９と、レン
ズ７の光軸に対しリードフレーム３の下側に対応するレ
ンズ７の開口部の半分を遮光するマスク１０と、ボンデ
ィングワイヤ１に焦点合わせを行うためにレンズ７を光
軸方向に移動せしめるレンズ駆動機構１１と、撮像装置
９によって得られる画像に対して所定の閾値で２値化を
行う２値化回路１２と、レンズ駆動機構１１によりレン
ズ７を移動させ焦点位置を変えた複数の画像データに対
し２値化回路によって２値化することにより得られる複
数の２値化画像の論理和を演算する演算回路１３と、こ
の演算回路１３によって得られた１個の画像データから
ボンディングワイヤ１の最高点高さを検出する最高点検
出回路１４とから構成される。Next, the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of the present invention. FIG.
Referring to FIG. 3, the bonding wire inspection apparatus of this embodiment includes an illuminating device 4 which is disposed above the integrated circuit 2 and the lead frame 3 on which the bonding wire 1 as the inspection object is stretched and which projects the illumination light downward. , A mirror 5 for changing the optical path so that the illumination light projected from the illuminating device 4 is irradiated from the side of the bonding wire 1, and an illumination which is placed on the opposite side of the mirror 5 with respect to the bonding wire 1 and passes through the bonding wire 1. A mirror 6 for changing the optical path of the light above the lead frame 3, a lens 7 for forming an image of the bonding wire 1 by introducing the illumination light reflected by the mirror 6, and a lens 7 placed at the image forming position of the lens 7. C
An imaging device 9 including a CD sensor 8, a mask 10 that shields half of the opening of the lens 7 corresponding to the lower side of the lead frame 3 with respect to the optical axis of the lens 7, and a focus on the bonding wire 1. A lens driving mechanism 11 for moving the lens 7 in the optical axis direction for performing matching, a binarizing circuit 12 for binarizing an image obtained by the imaging device 9 with a predetermined threshold, and a lens driving mechanism 11 An arithmetic circuit 13 for arithmetically operating a logical sum of a plurality of binarized images obtained by binarizing a plurality of image data obtained by moving the lens 7 to change the focal position by the binarizing circuit, and this arithmetic circuit. And a highest point detection circuit 14 for detecting the highest point height of the bonding wire 1 from one image data obtained by 13.
【００１０】照明装置４によって投光される照明光は被
検査物であるボンディングワイヤ１を通過し、ＣＣＤセ
ンサ８上にはボンディングワイヤ１の影が投影される。
ここでボンディングワイヤ１の最高点がＣＣＤセンサ８
上に結像されるようにレンズ駆動機構１１によって焦点
合わせを行うことにより、ＣＣＤセンサ８で得られる画
像からボンディングワイヤ１の最高高さを求めることが
できる。図２は図１に示すこの実施例における結像の様
子を示す説明図である。図２では簡単のためにミラー６
を省略してある。図２におけるボンディングワイヤ１は
ループ途中に最高点１５があり、図中実線で示すレンズ
７の位置において最高点１５の影がＣＣＤセンサ８に結
像される。また図中点線で示すレンズ７の位置７１また
は７２はボンディングワイヤ１の立ち上がり部分１６ま
たはスロープ部分１７に焦点を合わせたときのレンズ７
の位置を示している。The illumination light projected by the illuminating device 4 passes through the bonding wire 1 which is the object to be inspected, and the shadow of the bonding wire 1 is projected on the CCD sensor 8.
Here, the highest point of the bonding wire 1 is the CCD sensor 8
By focusing with the lens driving mechanism 11 so as to form an image on the top, the maximum height of the bonding wire 1 can be obtained from the image obtained by the CCD sensor 8. FIG. 2 is an explanatory diagram showing a state of image formation in this embodiment shown in FIG. In FIG. 2, the mirror 6 is shown for simplicity.
Is omitted. The bonding wire 1 in FIG. 2 has the highest point 15 in the middle of the loop, and the shadow of the highest point 15 is imaged on the CCD sensor 8 at the position of the lens 7 shown by the solid line in the figure. The position 71 or 72 of the lens 7 indicated by the dotted line in the figure is the lens 7 when the rising portion 16 or the slope portion 17 of the bonding wire 1 is focused.
The position of is shown.
【００１１】図３（ａ）〜（ｃ）は図２に示した立ち上
がり部分１６、最高点１５およびスロープ部分１７に焦
点を合わせたときに得られる画像を示している。これら
の画像は焦点の合ったところが最も暗い部分として観察
されるので、画面中最も暗い部分の上下方向の位置を検
出することにより、そのとき焦点の合っている位置のボ
ンディングワイヤ１の高さを求めることができる。図１
に示した実施例では図３（ａ）〜（ｃ）に示したような
画像データを２値化回路１２によって２値化し、それら
２値化画像の論理和を演算回路１３によって演算する。
図４（ａ）〜（ｃ）は図３（ａ）〜（ｃ）に示した画像
データを２値化回路１２によって２値化した結果の２値
化画像である。図４（ａ）〜（ｃ）の２値化画像は焦点
の合っている位置のボンディングワイヤ１と集積回路２
の部分が白、その他の部分が黒になっている。演算回路
１３によってこれらの２値化画像の論理和を演算した結
果が図５である。図５に示した画像データから最も高い
ボンディングワイヤ１のデータの位置Ｐを検出すること
によりボンディングワイヤ１の最高点１５の高さを求め
ることができる。FIGS. 3A to 3C show images obtained when the rising portion 16, the highest point 15 and the slope portion 17 shown in FIG. 2 are focused. Since these images are observed as the darkest part where the focus is achieved, the height of the bonding wire 1 at the focused position is detected by detecting the position of the darkest part in the screen in the vertical direction. You can ask. FIG.
In the embodiment shown in FIG. 3, the image data as shown in FIGS.
4A to 4C are binarized images obtained by binarizing the image data shown in FIGS. 3A to 3C by the binarizing circuit 12. The binarized images of FIGS. 4A to 4C show the bonding wire 1 and the integrated circuit 2 at the in-focus position.
Is white and the other parts are black. FIG. 5 shows the result of calculating the logical sum of these binary images by the arithmetic circuit 13. The height of the highest point 15 of the bonding wire 1 can be obtained by detecting the position P of the highest data of the bonding wire 1 from the image data shown in FIG.
【００１２】このように、焦点位置をずらした複数の画
像データからボンディングワイヤ１の最高点１５を検出
するので、最高点１５がループの中のどこにあっても自
動的に最高点１５の高さを求めることができる。また、
図２に示した実施例によれば、リードフレーム３とレン
ズ７の光軸とは平行なため、最高点１５の位置が光軸方
向すなわちリードフレーム３と平行な方向に変わっても
ＣＣＤセンサ８に投影される像高さに変化はないから、
最高点１５の位置にかかわらず高精度な高さ測定が可能
である。As described above, the highest point 15 of the bonding wire 1 is detected from a plurality of image data whose focal positions are shifted, so that the highest point 15 is automatically located at any height in the loop. Can be asked. Also,
According to the embodiment shown in FIG. 2, since the lead frame 3 and the optical axis of the lens 7 are parallel, even if the position of the highest point 15 changes in the optical axis direction, that is, in the direction parallel to the lead frame 3, the CCD sensor 8 Since there is no change in the image height projected on,
Highly accurate height measurement is possible regardless of the position of the highest point 15.
【００１３】レンズ７の下半分を遮光するマスク１０
は、リードフレーム３下側を通過した照明光がレンズ７
に入り込みノイズとなるのを防ぐ。この実施例はリード
フレーム３の上側に張られているボンディングワイヤ１
を観察するものであるので、リードフレーム３の下側を
通過する光は不必要であり、この光はボンディングワイ
ヤ１の像形成においてノイズとなる。レンズ７の上半分
だけでもボンディングワイヤ１の像を投影することはで
きるので、レンズ７の下半分をマスク１０で遮光するこ
とによりノイズの少ない良好なボンディングワイヤ１の
画像を得ることができる。Mask 10 for shielding the lower half of the lens 7
Means that the illumination light passing through the lower side of the lead frame 3 is reflected by the lens 7
Prevent it from getting into noise. In this embodiment, the bonding wire 1 stretched over the lead frame 3 is used.
Therefore, the light passing under the lead frame 3 is unnecessary, and this light becomes noise in the image formation of the bonding wire 1. Since the image of the bonding wire 1 can be projected only by the upper half of the lens 7, by shielding the lower half of the lens 7 with the mask 10, a good image of the bonding wire 1 with less noise can be obtained.
【００１４】[0014]
【発明の効果】以上説明したように、本発明によれば、
ボンディングワイヤを観察する結像手段の光軸をリード
フレームに平行にしているため、ボンディングワイヤの
最高点位置に関わらず最高点のワイヤ高さを精度良く測
定することができる。また、被検査物であるボンディン
グワイヤの像形成にかかわらない光が結像手段内に入り
込まないように結像手段の一部を遮蔽手段で遮光するこ
とによって、ノイズの少ない良好なボンディングワイヤ
の画像を得ることでき、検査精度が向上する。As described above, according to the present invention,
Since the optical axis of the image forming means for observing the bonding wire is parallel to the lead frame, the wire height at the highest point can be accurately measured regardless of the highest point position of the bonding wire. Further, by shielding a part of the image forming means by the shielding means so that the light unrelated to the image formation of the bonding wire as the inspection object does not enter the image forming means, the image of the good bonding wire with less noise is formed. Therefore, the inspection accuracy is improved.
【図１】本発明の一実施例の構成を示す構成図である。FIG. 1 is a configuration diagram showing a configuration of an embodiment of the present invention.
【図２】この実施例における像投影の様子を示す説明図
である。FIG. 2 is an explanatory diagram showing a state of image projection in this embodiment.
【図３】この実施例における撮像装置で撮像された画像
イメージを示す。FIG. 3 shows an image image picked up by an image pickup apparatus in this embodiment.
【図４】図３に示す画像イメージの２値化画像を示す。FIG. 4 shows a binarized image of the image shown in FIG.
【図５】図４に示す２値化画像の論理和を示す。5 shows a logical sum of the binarized images shown in FIG.
【図６】従来例の構成を示す構成図である。FIG. 6 is a configuration diagram showing a configuration of a conventional example.
【図７】従来例の撮像装置で撮像された画像イメージを
示す。FIG. 7 shows an image image taken by a conventional imaging device.
１ ボンディングワイヤ ２ 集積回路 ３ リードフレーム ４ 照明装置 ５ ミラー ６ ミラー ７ レンズ ８ ＣＣＤセンサ ９ 撮像装置 １０ マスク １１ レンズ駆動機構 １２ ２値化回路 １３ 演算回路 １４ 最高点検出回路 １５ 最高点 １６ 立ち上がり部分 １７ スロープ部分 1 Bonding Wire 2 Integrated Circuit 3 Lead Frame 4 Illumination Device 5 Mirror 6 Mirror 7 Lens 8 CCD Sensor 9 Imaging Device 10 Mask 11 Lens Drive Mechanism 12 Binarization Circuit 13 Arithmetic Circuit 14 Highest Point Detection Circuit 15 Highest Point 16 Rising Part 17 Slope part
Claims (3)
レームの側方から照明光を投光する照明手段と、前記ボ
ンディングワイヤに関して前記照明手段の反対側に配置
され光軸が前記リードフレーム面と平行である結像手段
と、この結像手段によって形成された前記ボンディング
ワイヤ像を撮像する撮像手段と、前記結像手段を前記光
軸方向に移動させ前記ボンディングワイヤの最高点に焦
点を合わせる焦点合わせ手段と、前記撮像手段によって
得られた画像に対して所定の閾値で２値化を行う２値化
手段と、前記焦点合わせ手段によって焦点位置を変えた
複数の画像に対し前記２値化手段によって２値化を行っ
た結果の２値化画像の論理和を演算する演算手段と、前
記演算手段によって得られた画像データから前記ボンデ
ィングワイヤの前記最高点を検出する最高点検出手段と
を備えることを特徴とするボンディングワイヤ検査装
置。1. An illuminating means for projecting illuminating light from a side of a lead frame on which a bonding wire is stretched, and an optical axis which is arranged on the opposite side of the illuminating means with respect to the bonding wire and whose optical axis is parallel to the lead frame surface. A certain image forming means, an image capturing means for capturing the bonding wire image formed by the image forming means, and a focusing means for moving the image forming means in the optical axis direction to focus on the highest point of the bonding wire. A binarizing means for binarizing the image obtained by the image pickup means with a predetermined threshold; and a binarizing means for binarizing the plurality of images whose focal positions are changed by the focusing means. An arithmetic means for operating the logical sum of the binarized image resulting from the binarization, and the bonding wire of the bonding wire based on the image data obtained by the arithmetic means. A bonding wire inspection apparatus comprising: a highest point detecting means for detecting the highest point.
記照明手段から下方に出射される前記照明光を前記リー
ドフレームの側方から投光するように反射せしめる第１
の反射手段と、前記ボンディングワイヤ部を通過した前
記照明光を前記リードフレームの上部に設けられる前記
結像手段に導入されるように反射せしめる第２の反射手
段とを備えることを特徴とする請求項１記載のボンディ
ングワイヤ検査装置。2. The first reflection means for reflecting the illumination light emitted downward from the illumination means provided on the upper portion of the lead frame so as to project the illumination light from the side of the lead frame.
And a second reflecting means for reflecting the illumination light that has passed through the bonding wire portion so as to be introduced into the image forming means provided on the upper portion of the lead frame. Item 1. The bonding wire inspection device according to item 1.
照明光を遮断するために前記結像手段の光軸に対し前記
ボンディングワイヤがある側半分のみを開口するように
前記結像手段の一部を遮閉する遮蔽手段を備えることを
特徴とする請求項１または請求項２記載のボンディング
ワイヤ検査装置。3. A part of the image forming means so as to open only a side half where the bonding wire is located with respect to an optical axis of the image forming means in order to block the illumination light passing under the lead frame. The bonding wire inspection apparatus according to claim 1 or 2, further comprising a shielding unit that shields the wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5318685A JP2513153B2 (en) | 1993-12-17 | 1993-12-17 | Bonding wire inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5318685A JP2513153B2 (en) | 1993-12-17 | 1993-12-17 | Bonding wire inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07176574A JPH07176574A (en) | 1995-07-14 |
| JP2513153B2 true JP2513153B2 (en) | 1996-07-03 |
Family
ID=18101881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5318685A Expired - Lifetime JP2513153B2 (en) | 1993-12-17 | 1993-12-17 | Bonding wire inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2513153B2 (en) |
-
1993
- 1993-12-17 JP JP5318685A patent/JP2513153B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07176574A (en) | 1995-07-14 |
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