KR200176154Y1 - The apparatus for inspecting three dimensional outside of IC and the patterned wafer using a 3D sensor - Google Patents

Abstract

The present invention captures a plurality of semiconductor packages mounted on a tray one by one while irradiating vertical light using a beam splitter and metering with an annular light source, and performs three-dimensional visual inspection according to gray level values of the captured image. It relates to a three-dimensional image inspection apparatus for IC and patterned wafer using a 3D sensor.

The device of the present invention is installed in a direction perpendicular to the object to be inspected to shoot light reflected in different amounts according to the height of the test object, and a 3D sensor outputting photographed image data representing different gray levels according to the amount of reflected light. (15), and a microcomputer 11 for outputting a video image and a real height to the monitor 16 and the printer 17 by converting the height of the real thing according to each gray level from the image data output from the 3D sensor; Arranged between the 3D sensor 15 and the tray 23 to vertically illuminate the light source driver 12 for driving the light sources 13 and 21 under the control of the microcomputer and the object to be photographed by the 3D sensor. And a beam splitter 14 for transflecting the irradiation light from the side light source 13 and a beam splitter 14 disposed under the beam splitter and providing photometric illumination to the inspected object, thereby providing accurate three-dimensional images. A plurality of light sources to form a gray level is characterized in that consisting of a light source for light metering 21 for the three-stage annular downward facing a predetermined angle.

Description

The apparatus for inspecting three dimensional outside of IC and the patterned wafer using a 3D sensor}

The present invention is a 3D to examine the three-dimensional appearance by taking a light with a 3D sensor and reflects the light reflected by the amount of the test object in different amounts according to the height of the test object and converting the gray level of the photographed image to the height A three-dimensional appearance inspection apparatus for an IC and a patterned wafer using a sensor.

Recently, due to the development of semiconductor manufacturing technology, the package of semiconductor is becoming more complicated and the number of leads is increasing. Since such a semiconductor is deformed even by a slight defect of a package, equipment for inspecting such a defect is urgently required.

In general, an inspection apparatus widely used includes an IC appearance inspection apparatus using a laser. The IC exterior inspection apparatus using a laser irradiates a laser beam and detects a reflected laser beam by mounting a plurality of ICs in a tray and scanning the entire tray on which the IC is mounted at a time, thereby detecting the three-dimensional appearance of the IC. To check.

However, in the conventional IC exterior inspection apparatus using the laser, since the material of the tray is made of plastic, it is easily dissolved by the laser beam in the irradiation process to generate steam, and the vapor caused by the dissolution of the plastic contaminates the IC. There is a problem to delay the test time.

In addition, the IC exterior inspection apparatus using a laser has a low accuracy in measuring 3D images because the laser beam is divided and irradiated at regular intervals, and the semiconductor packages mounted on the tray are arranged in a straight line because the laser beam is irradiated at a predetermined interval as described above. Should be located at To this end, the conventional IC exterior inspection apparatus using a laser requires a separate device for position alignment by shaking the tray, and a separate process for aligning the semiconductor package of the tray is required.

In addition to the IC appearance inspection apparatus using the laser, there is an IC appearance inspection apparatus using a camera, for example, US Patent No. 5,828,449.

US Patent No. 5,828,449 shows an IC appearance inspection apparatus using a camera having a ring illumination device.

The ring illumination device is composed of a plurality of light sources facing downward at a predetermined angle and disposed under the illumination detection device so as to irradiate the IC to be inspected as a whole.

However, when irradiating the solder ball or the lead using the ring illuminator as described above, since the light is not irradiated to the center and the edge of the solder ball and the non-inclined part of the lead, accurate image measurement is difficult, and the measured solder ball The height was estimated only by the difference in the width of the image, and it was difficult to measure the exact height.

In addition, since the ring illuminator irradiates from the side of the IC appearance inspection apparatus, the IC mounted on the tray is covered by the shadow of the tray. In order to avoid the effect of the shadow of the tray, the ICs mounted on the trays are transferred to the inspection device one by one, and the camera is taken.In the process of moving the IC from the tray to the inspection device for inspection, and then back to the tray, damage to the IC occurs. There is a problem that the test time is delayed by the above process.

Disclosure of Invention An object of the present invention for solving the above problems is to vertically irradiate the solder ball or lead of a semiconductor package to inspect the irradiation light from the light source on the side by a beam splitter disposed under the 3D sensor, and The 3D sensor converts the height from the gray level of the photographed image by radiating light reflected by a different amount depending on the height by irradiating with metering light so as to overlap with the irradiation light area by the beam splitter by an annular light source disposed below the splitter. The present invention provides a three-dimensional appearance inspection apparatus for an IC and a patterned wafer using a 3D sensor capable of three-dimensional appearance inspection.

1 is a configuration diagram of a three-dimensional appearance inspection apparatus of an IC and a patterned wafer using a 3D sensor according to the present invention,

2A is a view showing a path of light when light is irradiated onto a solder ball;

2B is a view showing a path of light when light is irradiated to the lead;

Figure 3a is a view showing the height of the solder ball according to the gray level change,

3b is a view showing a height difference between solder balls having different gray levels;

4A to 4C are views each showing an external appearance according to an image form of a solder ball,

5 is a view showing a height difference between leads having different gray levels;

6 is a flow chart showing a three-dimensional appearance inspection process of the IC and the patterned wafer by the device of the present invention.

<Explanation of symbols for main parts of the drawings>

11: micom 12: light source driver

13, 21: light source 14: beam splitter

15: 3D sensor 16: monitor

17: printer 18: memory

19: interface device 20: control computer

23 tray 30 semiconductor package

31: solder ball

In order to achieve the above object, the three-dimensional appearance inspection apparatus of the IC and the patterned wafer using the 3D sensor of the present invention is installed in a vertical direction with respect to the semiconductor package disposed on the tray, each different according to the solder ball height of the semiconductor package 3D sensor for photographing the light reflected by the amount and outputting a photographed image representing different gray levels in the form of a predetermined byte frame according to the amount of reflected light, and input image data of the semiconductor package output from the 3D sensor A microcomputer for outputting an image image and a real height to a monitor and a printer by converting the height of the object according to the gray level of the light source, a light source driver for driving a light source under the control of the microcomputer, and a semiconductor package to be photographed by the 3D sensor Light source on the side, placed between the 3D sensor and the tray for vertical illumination A beam splitter for receiving light from the semi-transmissive beam and a plurality of light sources disposed below the beam splitter and provided with a plurality of light sources at a predetermined angle so as to provide photometric illumination to the semiconductor package on the tray to create a precise three-dimensional image gray level. Characterized in that it comprises a three-stage annular light source for illumination.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

1 is a block diagram of a three-dimensional appearance inspection apparatus of an IC and a patterned wafer using a 3D sensor according to the present invention.

As shown in the drawing, a three-dimensional appearance inspection apparatus for IC and patterned wafer using a 3D sensor is installed perpendicularly to a semiconductor package disposed on a tray or a reel tape, and is illuminated on the solder ball height of the semiconductor package by illumination. 3D sensor 15 for photographing light reflected by a different amount and the image data of the semiconductor package having a different gray level according to the solder ball height photographed by the 3D sensor is input and the actual height according to the gray level A microcomputer 11 for outputting a video image and an actual height to the monitor 16 and the printer 17 by converting the?, A light source driver 12 for driving the light sources 13 and 21 under the control of the microcomputer, and It is disposed between the 3D sensor 15 and the tray 23 to vertically illuminate the semiconductor package to be photographed by the 3D sensor, and receives the irradiated light from the light source 13 on the side thereof to make it transflective. Includes a beam splitter 14 and a light source 21 for metering illumination controlled by the light source driver 12 to provide metering illumination to the semiconductor package on the tray to produce a precise three-dimensional image gray level. It is configured by.

Here, the photometric illumination light source 21 is disposed below the beam splitter 14, and a plurality of light sources are formed in a three-stage annular shape inclined inward at a predetermined angle.

In addition, the microcomputer 11 includes a monitor 16 and a printer 17 for outputting a video image of a semiconductor package photographed by a 3D sensor, and a memory 18 in which an own program of the microcomputer 11 is stored. Is connected.

In addition, the microcomputer 11 is connected to the control computer 20 for the overall control of the inspection apparatus by the user through the interface device 19.

Under the beam splitter, a shelf 22 on which a tray 23 on which a plurality of semiconductor packages for inspection are mounted is placed.

The operation of the 3D image inspection apparatus of the IC and the patterned wafer using the 3D sensor configured as described above is as follows.

First, when a user outputs a control signal to the inspection apparatus through the control computer 20 to perform the 3D image photographing operation, the control signal is input to the microcomputer 11 through the interface device 19.

The microcomputer 11 outputs a predetermined control signal to the light source driver 12 and the 3D sensor 15 according to the control signal input of the control computer 20. The light source driver 12 drives the light sources 13 and 21 by the control signal of the microcomputer.

The light source 13 driven by the light source driver 12 irradiates the irradiation light perpendicularly to the semiconductor package 30 through the beam splitter 14, and the light source 21 is irradiated by the light source 13. Irradiation is performed by photometry so as to overlap the area of the semiconductor package.

As described above, the controlled 3D sensor 15 turned on by the microcomputer 11 in a state in which irradiation light is irradiated onto the semiconductor package photographs light reflected by different amounts according to the height of solder balls or leads on the semiconductor package. The obtained image is transferred to the microcomputer 11 in the form of a frame of a predetermined byte.

The 3D sensor 15 is moved by up, down, left, and right moving means (not shown) to measure three-dimensional images of a plurality of semiconductor packages mounted on a tray or a reel tape, one by one, in area units. The vertical movement means may be installed in the tray.

Thereafter, the microcomputer 11 inputs the image data of the semiconductor package photographed by the 3D sensor, converts the gray level of the input image data into the real height, and photographs the image so that the user can observe whether there is a defect. The actual height is output to the monitor 16 and the printer 17.

FIG. 2A is a view illustrating a path of light when light is irradiated onto a solder ball, in which irradiation light by the light source 13 is incident perpendicularly to an upper surface of the solder ball through a beam splitter, and the light source 21 Indicates that the incident light is incident on the side surface of the solder ball.

2B is a view showing a path of light when light is irradiated to the lead, and the light emitted by the light source 13 is incident perpendicularly to the upper surface of the lead through the beam splitter, It shows that the irradiation light is incident on the side of the lead.

3A is a view illustrating the height of solder balls according to gray level changes.

As shown in the figure, the white part in the center represents the highest amount of light reflected by the gray level at 256 levels, that is, the highest part, and the black part at the edge shows the amount of light reflected by the gray level as 1 level. This shows the smallest part, that is, the part with the lowest height.

As can be seen from the above, since the image measured by the 3D sensor appears in different gray levels according to the amount of reflected light, it is possible to accurately measure the height and appearance of the inspected object by converting the height according to each gray level. .

3b is a view showing the difference in height between solder balls having different gray levels, in which an image of a solder ball having a higher height as shown in the left side of the drawing is shown in the center of white compared to an image of a solder ball having a lower height on the right side of the drawing. The part appears wider. Therefore, it can be seen that the images of the solder balls having different heights have different gray levels as shown in the drawing.

4A to 4C are diagrams each illustrating an external appearance according to the image form of the solder ball.

First, FIG. 4A shows an image in the case of a normal solder ball, and it can be seen that the white part in the center has a uniform shape as a whole, and shows a darker color toward the edge.

FIG. 4B shows an image in the case where the upper part is an uneven solder ball, and it can be seen that the white part in the center has an uneven shape.

In addition, Figure 4c shows the difference in the image according to the presence or absence of the solder ball, the image with a white part in the center of the left side is the presence of the solder ball, as shown in the right side there is no white part and the overall gray is the solder ball It does not exist.

FIG. 5 is a view illustrating height differences between leads having different gray levels. As shown in the left side of the drawing, an image of a lead having a higher height appears wider in white than an image of a lead having a lower height on the right side of the drawing. Gray levels are more widely distributed. Accordingly, it can be seen that the images of the leads having different heights have different gray levels as shown in the drawing.

6 is a flowchart showing a three-dimensional appearance inspection process of the IC and the patterned wafer by the device of the present invention.

As shown in the figure, in step 101, it is determined whether or not the initial shooting start area n is set, and if the initial shooting start area n is set, step 102 is executed to input a shooting start signal. Determine whether or not.

When the photographing start signal is input in step 102, the area n set in step 103 is photographed by the 3D sensor.

Thereafter, it is determined whether the photographed area n in step 104 is the shooting end area m, and if it is not the shooting end area m, step 105 is executed and the shooting end area m If it is determined to be, step 106 is executed.

In step 105, the 3D sensor is moved to the n (= n + 1) area, and then the process returns to step 103 to photograph the moved area.

In step 106, the photographing operation of the 3D sensor is stopped.

Next, in step 107, the actual height is converted from the gray level of the photographed image for the m areas, and finally, in step 108, the user can observe whether the semiconductor package solder ball is defective. The height and m photographed images of the m images converted at 107 are output to the monitor and the printer.

In the step 107, the converted height is determined by the height value corresponding to each gray level input in advance.

For example, as shown in FIG. 4A, the irradiation light is reflected in different amounts depending on the height of the solder ball, and thus the photographed image has different gray levels according to the amount of reflected light. Here, the white part in the center of the image is the most reflected light amount, the gray level is 256 levels, and the amount of reflected light decreases gradually from the center to the outside, and the edge of the image is the amount of reflected light. As the smallest part, the gray level is one level. As described above, the height of the real object can be accurately measured by each gray level of the photographed image.

According to the three-dimensional image inspection device of the IC and the patterned wafer using the 3D sensor of the present invention as described above, it is perpendicular to the irradiation light by the light source on the side using the beam splitter and the photometric illumination light source disposed below the beam splitter. And by irradiating the inspected object in the lateral direction, and converting the gray level of the photographed image to the real height by capturing light reflected by a different amount depending on the height of the inspected object with the 3D sensor, thereby enabling accurate height measurement. There is.

In addition, since the irradiation light from the light source is irradiated perpendicularly to the inspected object by the beam splitter, the 3D sensor measures the semiconductor packages mounted on the tray in area units one by one without being affected by the shadow of the tray. There is an effect that can reduce breakage and inspection time.

Claims (1)

It is installed in a vertical direction with respect to the semiconductor package disposed on the tray to take light reflected in different amounts according to the solder ball height of the semiconductor package, and take a photographed image representing different gray levels according to the amount of reflected light. 3D sensor 15 for outputting in the form of a byte frame and the image data of the semiconductor package output from the 3D sensor is input and the height of the real according to each gray level is converted into an image to the monitor 16 and the printer 17 In order to vertically illuminate a microcomputer 11 for outputting an image and a real height, a light source driver 12 for driving light sources 13 and 21 under the control of the microcomputer, and a semiconductor package to be photographed by the 3D sensor. A beam splitter 14 disposed between the 3D sensor 15 and the tray 23 and transflecting the irradiation light from the light source 13 on the side; And a light source 21 for metering illumination disposed in a three-stage annular shape in which a plurality of light sources are directed downwards at a predetermined angle so as to provide metering illumination to the semiconductor package on the tray to create a precise three-dimensional image gray level. Three-dimensional appearance inspection apparatus of the IC and patterned wafer using a 3D sensor, characterized in that.