JP2005140597A - Article recognition method and its system, surface mounting machine equipped with the system, component-testing arrangement, dispenser, mounted substrate inspection device and printed board inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an article recognition method and device having high recognition accuracy and being capable of reducing the cost, and to provide various devices which use it. <P>SOLUTION: An article recognition device 20 recognizes the state of articles, based on the image captured by photographing an electronic circuit constituting article C with a photographing means 18. The device comprises a conversion lens 23 provided in addition to the photographing means 18, capable of switching the focal length or the angle of view, a switching means 29 for switching its working state, and a recognition means for recognizing the state of the electronic circuit constituting article C, based on the image of the photographed electronic circuit constituting article C. The switching means 29 is constituted so as to switch the working state of the conversion lens 23 so that a proper focal length or an angle of view is determined for photographing the electronic circuit constituting article C. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an article recognition method and article recognition apparatus for recognizing the state of an electronic circuit component article (an electronic component such as an IC or a substrate on which the electronic circuit is mounted), a surface mounter including the article recognition apparatus, and the component The present invention relates to a test apparatus, a dispenser, a mounted board inspection apparatus, and a printed board inspection apparatus.

  2. Description of the Related Art Conventionally, a surface mounting machine configured to suck an electronic component such as an IC with a suction nozzle and transfer it to a predetermined position on a printed circuit board for mounting is generally known.

In this type of surface mounter, in order to prevent mounting failure due to component suction mistakes or suction shifts, the component recognition device using a CCD camera or the like is used to image the component and check for the presence or absence of components. Has been done. For example, Patent Document 1 discloses a case in which a suction nozzle and an imaging camera are both provided downward on a movable electronic component mounting head, and an upward fixed mirror is provided below the electronic component mounting head so that the electronic component mounting head passes over the mirror. 1 shows an electronic component mounting apparatus (mounting machine) in which an image of the lower surface of an electronic component sucked by a suction nozzle is reflected by a mirror and picked up. Further, in this apparatus, when the electronic component is attracted to the suction nozzle, the electronic component is directly imaged to recognize the component.
JP-A-6-216568

  A conventional mounting machine as disclosed in Patent Document 1 generally uses a camera having a single focus lens. This is simple in structure and advantageous in terms of cost for imaging with a fixed distance (optical path length) and angle of view (recognition visual field) between the camera and the subject.

  However, for example, when photographing subjects at different distances, since both cannot be focused, there arises a problem that at least one of the images becomes unclear. For example, in the apparatus disclosed in Patent Document 1, when mounting one electronic component, imaging is performed twice, at the time of component adsorption and at the time of recognition of the holding state after adsorption. In such a case, the distance between the camera and the electronic component at the time of picking up the component and the distance between the camera and the electronic component at the time of holding state recognition (the total length of the optical path folded by the mirror) are different (described in the same document). However, it can be understood from FIG. 1 of the same document) that a single-focus lens camera cannot obtain a clear image in which both are in focus, and it is difficult to obtain sufficient recognition accuracy. It is.

  In this way, the distance between the camera and the subject is not limited to the case where the image is taken in different places, but the size of the electronic component to be held (thickness in the optical path direction) is different even when the holding state of the electronic component is simply recognized. The same problem occurs because of the change.

  Also, for example, when recognizing electronic parts having different sizes (widths in the direction perpendicular to the optical path), the angle of view is constant in the single focus lens, so that when a small part is imaged, the image becomes small. Therefore, an appropriate resolution cannot be obtained, and it is difficult to obtain sufficient recognition accuracy.

  In each case as described above, in order to obtain a clear image in both cases, or in order to obtain an appropriate resolution in both cases, for example, the layout may be devised to align the distance and resolution, or two cameras may be installed. It is possible to take measures such as providing images separately, or providing a focus adjustment mechanism or a zoom mechanism on the camera side (however, Patent Document 1 does not describe them). However, these have complicated layouts and camera structures, and increase the cost.

  Such a problem is not limited to a mounting machine, but an apparatus (for example, a component testing apparatus, a dispenser) provided with an article recognition means for recognizing the state of an electronic circuit component article (an electronic component such as an IC or a board on which the electronic circuit component is mounted). , Mounting board inspection apparatus, printed board inspection apparatus, etc.).

  The present invention has been made in view of such circumstances, and clearly captures images with different distances between the imaging means and the subject, or images different recognition fields of view with appropriate resolution. An object of the present invention is to provide an article recognition method and apparatus capable of reducing cost while achieving high recognition accuracy by realizing with a simple structure, and to provide various apparatuses using them.

  In order to solve the above-described problems, the present invention provides an article recognition method in which an electronic circuit component article is picked up by an image pickup unit and the state of the article is recognized based on the image. A conversion lens for changing the angle of view is prepared, and a state in which the conversion lens is interposed on an optical path between the electronic circuit component and the imaging means so as to obtain an appropriate focal length or angle of view and the light The electronic circuit component article is imaged by switching the state to be removed from the road, and the state of the electronic circuit component article is recognized based on the captured image.

  Here, the electronic circuit component article refers to an electronic component such as an IC as described above, and a substrate (before and after mounting) on which the electronic component is mounted. The conversion lens is a known lens that is added to the imaging lens in order to change the focal length or the angle of view. For example, there is a teleconversion lens for the telephoto side or a wide conversion lens for the wide angle side. .

  Another aspect of the present invention is an article recognition apparatus for imaging an electronic circuit component article by an imaging unit and recognizing the state of the article based on the image, and adding the electronic circuit component article to the imaging unit. A conversion lens that can be switched between a state of being interposed on the optical path between the imaging unit and a state of being removed from the optical path, and that can change a focal length or an angle of view, and the switching of the conversion lens. Switching means for performing, and recognition means for recognizing the state of the electronic circuit component article based on the captured image of the electronic circuit component article, wherein the switching means has an appropriate focal length when imaging the electronic circuit component article Alternatively, the switching of the conversion lens is performed so as to obtain an angle of view (claim 2).

  In this configuration, the conversion lens changes the focal length, and the switching means may perform the switching of the conversion lens in accordance with the required optical path length of imaging.

  Alternatively, the conversion lens may change the angle of view, and the switching unit may perform the switching of the conversion lens in accordance with the width of the field of view to be recognized, and the electronic component may be in a predetermined position. When recognizing a state in which a plurality of components are arranged, the imaging unit images a plurality of electronic components at the same time when the conversion lens is switched to at least a large angle of view (Claim 3). Is also suitable.

  In addition, when making the said article recognition apparatus a part of other apparatuses, it is not necessarily required to have an independent external appearance, and it is set as an article recognition apparatus by the component group which has the function.

  It is also preferable that each of the following devices (1) to (5) is provided with the article recognition device according to claim 2 or 3.

  (1) A surface mounter for transferring and mounting an electronic component, which is an electronic circuit component article, from a component supply unit to a predetermined position on a substrate, and further taking out and holding the electronic component from the component supply unit A holding means; and a driving means for moving the holding means to a predetermined position on the substrate in the electronic component holding state, and at least during the movement of the holding means, the article recognition device recognizes the holding state of the electronic component. A surface-mounting machine (claim 4), characterized in that

  (2) A component testing apparatus for performing various inspections by transferring an electronic component, which is an electronic circuit component article, from a component supply unit to a predetermined position of an inspection means, and further taking out the electronic component from the component supply unit Holding means for holding, and driving means for moving the holding means to a predetermined position of the inspection means in the electronic component holding state, and holding the electronic component by the article recognition device at least during the movement of the holding means The component testing apparatus is characterized by recognizing the above (Claim 5).

  (3) A dispenser for applying a coating agent for fixing an electronic component to a predetermined coating position on a substrate which is an electronic circuit component article, and further a dispenser head for discharging the coating agent at the coating position, and the dispenser head And a drive means for moving the material on the substrate, and the article recognition device recognizes the application position on the substrate or the application state of the coating agent (Claim 6).

  (4) A mounting board inspection apparatus for inspecting a mounting state of a substrate after mounting, which is an electronic circuit component article, and further checking based on the mounting state of the mounted board recognized by the article recognition apparatus. A mounting board inspection apparatus comprising: an inspection means for determining

  (5) A printed circuit board inspection apparatus for inspecting an application printing state of a printed circuit board printed substrate that is an electronic circuit component article, and further printing the printed circuit board recognized by the article recognition apparatus. A printed circuit board inspection apparatus comprising: an inspection unit that determines pass / fail of inspection based on a state (claim 8).

  According to the first aspect of the present invention, it is possible to obtain an always focused image and an image with an appropriate recognition field with a simple structure. For example, if you use a conversion lens that changes the focal length, you can focus on a subject at any distance by switching the conversion lens when capturing multiple images with different distances between the camera and the subject (electronic circuit component). Can be matched. Accordingly, it is possible to obtain clear images in focus with one camera (imaging means). If two or more conversion lenses are provided so as to be switchable, three or more distances can be switched. As described above, since the component can be recognized with the always focused image, the recognition accuracy can be improved.

  Further, for example, by using a conversion lens that changes the angle of view, an image with an appropriate recognition field of view can be obtained. In other words, when a wide recognition field is required (when the parts and range to be recognized are large), an image with an appropriate recognition field can be easily obtained by switching the conversion lens so that the angle of view is large. Can do. For example, when recognizing a small part or range, by switching to the telephoto side so that the recognition field of view is small, an appropriate resolution can be obtained with a large image, and the recognition accuracy can be improved.

  Or, when recognizing a state in which a plurality of electronic components are arranged, and when the required resolution is relatively low, switching to the wide-angle side so that the recognition field of view becomes large and imaging a plurality of electronic components at the same time Therefore, the parts can be recognized efficiently.

  By the way, since the conversion lens is a single lens (there may be a plurality of built-in lenses), even if a mechanism for performing the switching is provided, a plurality of imaging means are provided, or a focusing adjustment mechanism and a zoom mechanism are provided on the imaging means. It becomes a much simpler structure than it is equipped with. Therefore, low cost can be realized.

  According to the invention of claim 2 or 3, an article recognition apparatus using the article recognition method of claim 1 is obtained. Therefore, it is possible to embody an article recognition apparatus that can obtain the effects of the method.

  The surface mounter, the component test apparatus, the dispenser, the mounting board inspection apparatus, and the printed board inspection apparatus shown in claims 4 to 8 are different in electronic circuit components that are imaging targets depending on the use of the apparatus. All of them require advanced article recognition technology in order to manufacture a high-quality mounting board efficiently and at low cost. By providing the apparatus for recognizing an article according to claim 2 or 3 in these apparatuses, this can be realized.

  As is apparent from the above, according to the present invention, it is possible to realize a simple structure for capturing images with different distances between the imaging means and the subject, respectively, or capturing images with different angles of view. By this, it is possible to obtain an article recognition method and apparatus capable of reducing costs while obtaining high recognition accuracy, and a surface mounting machine, a component testing apparatus, a dispenser, a mounting board inspection apparatus, and a printed board inspection apparatus using them. it can.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 and FIG. 2 schematically show a surface mounter (surface mounter according to the present invention) on which a component recognition device (article recognition device according to the present invention) is mounted as a first embodiment of the present invention. Yes. As shown in the drawing, a printed circuit board conveying conveyor 2 is arranged on a base 1 of the mounting machine, and the printed circuit board 3 is conveyed on the conveyor 2 and stopped at a predetermined mounting work position. It has become. A fiducial mark F for specifying the position of the printed circuit board 3 with respect to the base 1 is formed on the printed circuit board 3.

  On both sides of the conveyor 2, component supply units 4 are arranged. These component supply units 4 are provided with multiple rows of tape feeders 4a. Each tape feeder 4a is configured such that small pieces of chip parts such as ICs, transistors, capacitors, etc. are stored at predetermined intervals, and the held tape is led out from the reel. Electronic parts are taken out intermittently.

  Above the base 1, a head unit 6 for component mounting is provided. The head unit 6 is movable across the component supply unit 4 and the component mounting unit where the printed circuit board 3 is located, and is in the X-axis direction (the direction of the conveyor 2) and the Y-axis direction (the direction orthogonal to the X-axis on the horizontal plane). ) Can be moved to.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. The nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The Y-axis servo motor 9 and the X-axis servo motor 15 are provided with encoders 9a and 15a, respectively, so that the movement position of the head unit 6 is detected.

  The head unit 6 is provided with a plurality of nozzle units 16 provided with suction nozzles 16a for suctioning components as holding means for holding electronic components. This nozzle unit 16 can be moved up and down (moved in the Z-axis direction) and rotated around the nozzle central axis (R-axis) with respect to the frame of the head unit 6, and is driven up and down such as a Z-axis servo motor (not shown). And it is actuated by a rotational drive means such as an R-axis servo motor. In the present embodiment, a configuration in which six nozzle units 16 are arranged is shown.

  Further, as shown in FIG. 3, a component recognition device 20 is mounted on the mounting machine. The component recognition device 20 is attached to the head unit 6 in a state where the reflection unit 17 extending in the X-axis direction on the base 1 inside the component supply unit 4 is aligned in the X-axis direction corresponding to each suction nozzle 16a. Camera 18, conversion lens 23 provided so as to be added to the lens of camera 18, actuator 29 for switching the position of conversion lens 23, and illumination fixed to head unit 6 corresponding to each suction nozzle 16 a. The apparatus 19 includes a reference mark 26 disposed on the head unit 6 for each suction nozzle 16a.

  As shown in FIG. 3, the reflection portion 17 is arranged on a base frame 1 that is fixed on the base 1 and opens upward, and is arranged in parallel with the X-axis and Y-axis operation planes. And a mirror 22 for closing the opening.

  The mirror 22 is a strip-shaped mirror provided over the entire length of the reflecting portion 17. Accordingly, while the head unit 6 moves between the upper part of the component supply unit 4 and the upper part of the printed circuit board 3, each nozzle unit 16 can be located at any position within the movable range on the X axis. Passes through the upper part of the mirror 22. In this way, after the suction nozzle 16a picks up the electronic component C by the component supply unit 4 and moves to the predetermined position of the printed circuit board 3, the head unit 6 takes an image via the mirror 22 regardless of the path taken. Has been made. In the present embodiment, the head unit 6 is set to move along the shortest path from the component suction position to the mounting position.

  The illumination device 19 includes a large number of LEDs 25 arranged, and illuminates the electronic component C by this light emission. That is, the light from the LED 25 (optical axis K1) is reflected by the mirror 22 to illuminate the component lower surface C1 of the electronic component C (optical axis K2). The light is reflected by the component lower surface C1 (optical axis K3) and then reflected again by the mirror 22 to enter the lens of the camera 18 (optical axis K4). That is, the camera 18 takes an image of the illuminated component lower surface C <b> 1 through the mirror 22.

  The camera 18 is an image pickup means including an area sensor, and picks up an image of the component lower surface C1 reflected on the mirror 22 (optical axis K4) when the head unit 6 passes over the reflecting portion 17. ing. Further, in the upper part of the component supply unit 4, the electronic component C to be picked up is imaged, the fiducial mark F provided on the printed circuit board 3 is imaged when mounting on the printed circuit board 3 is started, or the printed circuit board 3 images the electronic component C after mounting. The lens of the camera 18 is a single focal lens, and the focal length and angle of view are fixed. The focus position is also fixed, and the distance between the in-focus subject and the camera 18 is constant.

  The reference mark 26 is a substantially cylindrical rod-like member, and is erected on the lower surface of the head unit 6 that is within the imaging range of the camera 18. Therefore, the lower surface of the reference mark 26 is projected on the image captured by the camera 18 together with the component lower surface C1 brightened by the illumination device 19.

  The conversion lens 23 is a lens added to the camera 18 in order to change the focal length and the angle of view. When the conversion lens 23 shown in FIG. 3 is added to the camera 18, the distance between the in-focus subject and the camera 18 is shortened by shortening the focal length.

  In addition, including the following figures, the conversion lens 23 is schematically represented by a single convex lens and is attached so as to be in contact with the camera 18. However, the number of lenses, type, interval, and distance from the camera 18 are also illustrated. May be appropriately set according to the application of the conversion lens 23.

  The main body of the actuator 29 is fixed to the head unit 6, and a rod 29 a that is extendable on the tip side is fixed to the conversion lens 23. The actuator 29 causes the conversion lens 23 to intervene on the optical path (such as the optical axis K4) between the electronic component C and the camera 18 by operating an internal drive motor or a fluid pressure cylinder to expand and contract the rod 29a. The state and the state to be removed from the optical path are switched. That is, the actuator 29 functions as switching means for switching the conversion lens 23 as described above.

  In FIG. 3, when the suction nozzle 16 a is directly above the mirror 22, the state in which the component lower surface C <b> 1 is imaged is indicated by a solid line, but after the electronic component C is mounted on the printed board 3 on the right side, Is imaged by an alternate long and two short dashes line (optical axis K5). As shown in the figure, when imaging the component lower surface C1, the rod 29a is contracted to capture an image without adding the conversion lens 23 (hereinafter referred to as a conversion lens OFF), and when imaging the electronic component C after mounting, the rod 29a. And a conversion lens 23 is added (hereinafter referred to as “conversion lens ON”).

  This point will be described in more detail with reference to FIG. 4A is an explanatory diagram showing the state of the conversion lens 23 when imaging the component lower surface C1, and FIG. 4B shows the state of the conversion lens 23 when imaging the electronic component C after mounting. It is explanatory drawing. For the sake of explanation, FIG. 4A shows the optical axis K3 bent by the mirror 22 and the optical axis K4 connected in a straight line. Therefore, the camera 18 is shown to image the component lower surface C1 from below. Accordingly, FIG. 4B shows the top and bottom reversed.

  As shown in FIG. 4A, when imaging the component lower surface C1, light from the component lower surface C1 enters the camera 18 through an optical axis K3 (distance d3) and an optical axis K4 (distance d4). That is, the optical path length between the component lower surface C1 and the camera 18 is (d3 + d4). On the other hand, the camera 18 is set to focus on an object whose distance from the tip is (d3 + d4). Therefore, when the conversion lens is OFF, the focus is on the component lower surface C1, and a clear image of the component lower surface C1 can be taken.

  On the other hand, when imaging the mounted electronic component C shown in FIG. 4B, light from the electronic component C enters the camera 18 via the optical axis K5 (distance d). Here, since d5 <(d3 + d4) as shown in FIG. 3, if the conversion lens 23 is turned off and the image is taken, the image is out of focus and unclear. Therefore, in this case, as shown in the figure, the conversion lens is turned on to shorten the focal length so that the object at the distance d5 from the camera 18 is focused. By doing so, a clear image of the electronic component C can be taken.

  FIG. 5 is a schematic block diagram showing the control system of the mounting machine. The mounting machine of this embodiment is composed of a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU in advance, a RAM that temporarily stores various data during operation of the apparatus, and the like. The controller 30 is provided. The controller 30 includes a main control unit 32, an axis control unit 34, an illumination control unit 36, a camera control unit 38, an image processing unit 40, and a lens switching control unit 41 as functional configurations.

  The main control unit 32 controls the operation of the mounting machine in an integrated manner, and controls the drive of the servo motors 9 and 15 and the like via the axis control unit 34 to operate the head unit 6 and the like according to a program stored in advance. At the same time, based on the component image picked up by the camera 18, the presence / absence determination of the component suction by the suction nozzle 16a and the calculation of the component suction displacement (suction error) are performed. That is, in this embodiment, the main control unit 32 functions as a recognition unit of the present invention.

  The axis control unit 34 drives and controls the Y-axis servo motor 9 and the X-axis servo motor 15 while detecting the current position (X, Y) of the head unit 6 based on signals from the encoders 9a and 15a. Move to a predetermined position.

  The illumination control unit 36 and the camera control unit 38 control driving of the illumination device 19 and the camera 18. The image processing unit 40 performs predetermined processing on the image signal output from the camera 18 to generate image data suitable for component recognition, and outputs the image data to the main control unit 32.

  The lens switching control unit 41 outputs an ON / OFF command signal to the actuator 29 that switches ON / OFF of the conversion lens 23. That is, when the main control unit 32 determines to capture an image with the conversion lens ON, the lens switching control unit 41 outputs an ON command to extend the rod 29a to the actuator 29. Conversely, when the main control unit 32 determines to capture an image in the conversion lens OFF state, the lens switching control unit 41 outputs an OFF command for contracting the rod 29 a to the actuator 29.

  As described above, the embodiment in which the conversion lens 23 is switched ON / OFF according to the difference in the optical path length from the camera 18 to the subject has been described. As a modified example, even when the same suction state is imaged (FIG. 4A), the conversion lens 23 may be turned ON / OFF depending on the size of the electronic component C. That is, in the case where the electronic component C has a particularly large size (thickness in the direction of the optical axis K3), the optical path length (d3 + d4) is shortened and is out of focus. At that time, the conversion lens 23 is turned on to focus. Anyway. Alternatively, even if the optical path length is the same, the in-focus position changes depending on the color (light wavelength) of the illuminating device 19, so that the conversion lens 23 may be switched ON / OFF accordingly. Furthermore, as shown in FIG. 3, when the camera 18 images the component lower surface C1 from a slightly oblique direction, a conversion lens 23 that can be formed as a tilting optical system is provided, and this is turned on so that the image is captured. The imaging surface and the component lower surface C1 may have a mutual benefit relationship.

  Further, as shown in FIGS. 6 and 7, a conversion lens may be provided to change the angle of view, and its ON / OFF may be switched. FIG. 6 is an explanatory diagram in a case where the angle of view is changed by the conversion lens 23a when imaging the suction state of the electronic component C or C ′ sucked by the suction nozzle 16a. The conversion lens 23a is a modification of the conversion lens 23, and is configured to change the angle of view to the wide angle side by adding it to the camera 18. FIG. 6A shows a case where a relatively small electronic component C is imaged. The conversion lens 23a is turned off. At this time, the angle of view θ1 is relatively small, and the component lower surface C1 is set to be imaged almost completely on the screen.

  On the other hand, FIG. 6B shows a case where a relatively large electronic component C ′ is imaged. The conversion lens 23a is turned on. The angle of view θ2 at this time is relatively large, and is set so that the component lower surface C1 ′ is imaged almost completely on the screen. Further, the distance between the camera 18 and the subject (component lower surface C1 ') is substantially equal to the case of FIG. Therefore, the conversion lens 23a is set to change the angle of view to the wide angle side without changing the in-focus distance (for example, using a compound lens). By switching ON / OFF of the conversion lens 23a, the ratio of the subject image to the imaging screen can be increased as much as possible in a range where the image of the subject does not protrude from the imaging screen. That is, even a small subject can be imaged large, and the resolution can be increased.

  FIG. 7 is an explanatory diagram in the case where the angle of view is changed by the conversion lens 23b when the electronic component C is imaged to recognize the mounting state after the electronic component C is mounted on the printed circuit board 3. The conversion lens 23b is a modification of the conversion lens 23, and is configured to change the angle of view to the wide angle side by adding this to the camera 18. FIG. 7A shows an imaging state when relatively high recognition accuracy is required. The conversion lens 23b is turned off. The angle of view θ3 at this time is relatively small and is set so that the electronic component C is imaged almost completely on the screen.

  On the other hand, FIG. 7B shows an imaging state suitable when the required recognition accuracy is relatively low. The conversion lens 23b is turned on. At this time, the angle of view θ4 is relatively large and is set so that nine (3 × 3) electronic parts C are simultaneously imaged almost completely on the screen. Further, the distance between the camera 18 and the subject (electronic component C) is substantially equal to the case of FIG. Therefore, the conversion lens 23b is set to change the angle of view to the wide angle side without changing the in-focus distance, like the conversion lens 23a. When the image is taken with the conversion lens 23b in the ON state, the proportion of each part on the screen is reduced, so the resolution of the image is slightly reduced, but since nine parts are picked up at a time, the recognition speed is significantly increased. , Productivity can be improved. Thus, by switching ON / OFF of the conversion lens 23b, the number of electronic components C to be imaged at a time can be changed, and imaging according to the required recognition accuracy and recognition speed can be performed.

  Next, an example of the mounting operation of the mounting machine based on the control of the controller 30 will be described. FIG. 8 is a schematic flowchart of the mounting operation, and is common even when the conversion lens 23 is the same as the conversion lenses 23a and 23b of the above modification.

  The mounting machine according to the present embodiment is configured to be able to mount electronic components C on a plurality of types of printed circuit boards 3, and is a collection of electronic component C combinations and mounting positions according to each printed circuit board 3. A set has been prepared. Therefore, a data set corresponding to the printed circuit board 3 to be mounted is first selected and read (step S21). Next, the printed circuit board 3 is transported to the mounting position (position indicated by a two-dot chain line in FIG. 1) by the conveyor 2 and fixed (step S22).

  Next, the head unit 6 is moved, and the fiducial mark F provided on the printed circuit board 3 is imaged by the camera 18, but before that, in step S23, the conversion lens 23 is required to image the fiducial mark F. A determination is made whether or not. This determination is appropriately made for each subject of the camera 18 according to the use of the conversion lens 23 and the imaging conditions. If “YES” is determined in the step S23, the process proceeds to a step S24, and a command signal is issued to the actuator 29 to extend the rod 29a. That is, the conversion lens 23 is turned on. If NO is determined in step S23, the process proceeds to step S25, and a command signal is issued to the actuator 29 so as to contract the rod 29a. That is, the conversion lens 23 is turned off. After step S24 or step S25, the process proceeds to step S26, the fiducial mark F is imaged, the position is recognized, and the fixed position deviation of the printed circuit board 3 is measured. Then, the mounting position of each electronic component C is corrected in advance according to the amount of deviation.

  Next, a suction process for sucking the electronic component C is performed by each nozzle 16a (step S27). In this suction process, first, the head unit 6 is moved to a position above the tape feeder 4a, and the electronic component C on the tape feeder 4a is imaged prior to the suction of the electronic component C (at this time, whether the conversion lens 23 is necessary again). And may be switched ON / OFF as necessary). Based on this captured image, the displacement of the electronic component C with respect to the tape feeder 4a is detected, and the amount of movement of the head unit 6 is corrected according to the detection result. Next, after the electronic component C on the tape feeder 4a is sucked by the suction nozzle 16a and the suction operation is executed for each nozzle unit 16, the head unit 6 is moved from the tape feeder 4a to the printed circuit board 3 side.

  After executing step S27, the process proceeds to step S30 to determine whether or not the conversion lens 23 is necessary, and performs control to switch ON / OFF as necessary. The control in step S30 corresponds to steps S23 to S25. Then, the electronic component C passes over the reflecting portion 17 in the process of moving the head unit 6 to the mounting position. At this time, the lower surface C1 of the electronic component C is displayed on the mirror 22 and is imaged by each camera 18. (Step S33).

  Next, the suction state of the electronic component C with respect to the nozzle unit 16 is recognized based on the captured image, and the mounting position is further corrected according to the suction position deviation (step S35). In step S35, when an error is detected such that the electronic component C is not picked up, error processing may be performed and the process may be started again from step S27.

  Although not particularly shown, a fiducial mark (component fiducial) may be further provided on the electronic component C, and the mounting position may be corrected by this positional deviation (step S37).

  Then, the electronic component C is mounted at the final mounting position of the printed circuit board 3 reflecting all the above corrections (step S39). After mounting, the printed circuit board 3 is directly imaged to check whether or not a component is mounted at a predetermined mounting position. Also at the time of this imaging, similarly to step S30, it may be determined whether or not the conversion lens 23 is necessary, and control to switch ON / OFF as necessary may be performed. In this case, immediately after the electronic component C is mounted on the printed circuit board 3, it is possible to take an image with little movement of the head unit 6, so that efficient confirmation can be performed.

  The above is the flow from the start of mounting to the first mounting (maximum six electronic components C). When the electronic component C is further mounted, the operations in steps S27 to S39 are repeated. Further, when mounting on another printed circuit board 3 of the same type, the operations in steps S22 to S39 are repeated. Then, when mounting on another printed circuit board 3 of a different type, the operations in steps S21 to S39 are repeated.

  As described above, the mounting machine according to the present embodiment switches the ON / OFF of the conversion lens 23 in accordance with the optical path length from the camera 18 to the subject and the imaging range (recognition visual field). 18, it is possible to obtain clear images in focus, or obtain images according to the size of components and the number of components to be imaged at a time.

  Moreover, since the conversion lens 23 is a single lens (there may be a plurality of built-in lenses), even if the actuator 29 for switching ON / OFF is provided, a plurality of cameras 18 are provided, a focus adjustment mechanism or The structure is much simpler than that provided with a zoom mechanism. Therefore, low cost can be realized.

  Two or more conversion lenses 23 may be provided for one camera 18, and when necessary, the necessary conversion lenses 23 may be selectively used (including simultaneous use) as appropriate.

  Further, in the component recognition device 20 of the present embodiment, only the illumination device 19 is used as the illumination means. However, a separate illumination device for illuminating the upper side is provided in the frame 21 of the reflection unit 17, and the mirror 22 is a half mirror. The electronic component C may be illuminated with the transmitted light.

  Furthermore, in the present embodiment, one camera 18 is disposed corresponding to one nozzle unit 16, but the present invention is not limited to this, and for example, corresponding to two nozzle units 16. One camera 18 may be arranged. In this case, the imaging range of the camera 18 is set so that the electronic components C attracted to the two nozzle units 16 can be simultaneously imaged.

  Furthermore, in this embodiment, the camera 18 composed of an area sensor is adopted, but the present invention is not limited to this. For example, the camera composed of a line sensor can be displaced relative to the head unit 6 by an LM guide or the like. It is also possible to scan the image of the electronic component C projected on the mirror 22 by the camera while moving the camera with respect to the head unit 6 during imaging.

  Next, another type of surface mounter will be described as a second embodiment according to the present invention. FIG. 9 is a schematic plan view of the mounting machine of this embodiment. In the drawings showing the following embodiments, the same parts as those in the first embodiment are denoted by the same reference numerals, and redundant description thereof is omitted. This mounting machine is different from that of the first embodiment in that the camera 18 is not mounted on the head unit 6 and the reflection section 17 is not provided between the component supply section 4 and the mounting position. Instead, the imaging unit 24 is provided in the approximate center in the X-axis direction between the component supply unit 4 and the mounting position.

  FIG. 10 is a cross-sectional view of the vicinity of the imaging unit 24. In the imaging unit 24, a hole penetrating the base 1 is provided, and an illumination device 27 that illuminates the upper side by arranging a large number of LEDs is provided around the hole. Below that, the camera 18 is disposed so as to directly image the upper electronic component C. The conversion lens 23c is provided between the illumination device 27 and the camera 18 in a state where ON / OFF switching is possible. The actuator 29 is fixed to the base 1.

  In mounting components, after the electronic component C is picked up by the component supply unit 4, the head unit 6 is moved to the mounting position of the printed circuit board 3. At this time, the electronic component C passes directly above the imaging unit 24 on the near side. Move to do. When the electronic component C is directly above the imaging unit 24 (shown state), the illumination device 27 illuminates the lower surface of the electronic component C or the like. Then, the brightened component lower surface C1 is imaged by the camera 18 (optical axis K6). The suction state is recognized on the basis of the captured image, and the mounting is performed by correcting the suction shift and the like accordingly.

  The action of the conversion lens 23c that is switched ON / OFF during imaging is the same as that of the first embodiment, and depends on the size of the electronic component C (thickness in the direction of the optical axis K6) and the color of the illumination device 27 (wavelength of light). Thus, the focal length is switched so that the image is always in focus, or the angle of view is switched according to the size of the electronic component C (the width in the direction perpendicular to the optical axis K) to increase the resolution within a range that does not protrude from the screen.

  As mentioned above, although the example which mounted the component recognition apparatus in the mounting machine was shown in 1st and 2nd embodiment, the apparatus to mount is not limited to a mounting machine, For example, as shown below, IC chip etc. You may mount in the component test apparatus 60 which test | inspects the electronic component C. FIG.

  FIG. 11 is a plan view of a component testing apparatus 60 according to the third embodiment of the present invention. The base 61 of the component testing apparatus 60 is provided with a cassette installation portion 63 on which cassettes 62 in which the wafers Wa in which bare chips are diced are stored in multiple stages can be mounted. The cassette 62 mounted on the cassette installation unit 63 is transported to a position below the opening 64 formed in the base 61 by a transport mechanism (not shown), and the bare chip is picked up by the head 65 at this position. The head 65 is configured to convey a bare chip from the opening 64 to the component standby unit 67 along a rail 66 extending in the Y-axis direction on the base 61. The component standby unit 67 is disposed between a pair of rails 68 extending in the X-axis direction on the base 61, and the bare chip transported to the component standby unit 67 is driven along a pair of head units 69. , 70 to the inspection socket 71 on the base 41, and a predetermined inspection is performed by the inspection means. In the head units 69 and 70, two inspection heads 69a and 70a each having a suction nozzle capable of sucking a bare chip are provided side by side.

  In such a component inspection apparatus 60, imaging units 74 and 76 are provided on the base 61 between the component standby unit 67 and the inspection socket 71, and the head unit 69 is mounted on the imaging units 74 and 76. , 70 moves and images and recognizes the bare chip adsorbed to the head units 69, 70.

  The imaging units 74 and 76 detect a defect (for example, bump height defect) of the bare chip conveyed from the component standby unit 67 to the inspection socket 71, and the bare chip detected as a defective product is the head The units 69 and 70 are transported to the defective product tray 79 placed on the defective product collecting section 78 on the base 61. In addition, the imaging units 74 and 76 detect the posture of the bare chip with respect to the head units 69 and 70, and the bare chip detected as being displaced with respect to the head units 69 and 70 here is the head. After the position correction is executed by the units 69 and 70, the unit 69 and 70 are transported to the inspection socket 71.

  As a result of the inspection in the inspection socket 71, the bare chip determined to be defective is conveyed to the defective product tray 79 by the head units 69 and 70, while the bare chip determined to be non-defective is Each of the head units 69 and 70 is transported to a component storage unit 80 on the base 61 and is stored in a base tape 81 for a tape feeder in the component storage unit 80. The tape will be attached.

  Note that when the defective product tray 79 of the defective product collection unit 78 becomes full, the tray 79 is transferred to the tray discharge unit 82 by a tray moving mechanism (not shown), and the tray standby adjacent to the defective product collection unit 78 is performed. The tray 84 in the section 83 is transferred to the defective product collection section 78 by the head units 69 and 70, and the empty tray is transferred from the empty tray mounting section 85 to the tray standby section 83 by a tray moving mechanism (not shown). It has become.

  The imaging units 74 and 76 have the same structure as that of the imaging unit 24 in the second embodiment, and the conversion lens is switched ON / OFF depending on the size of the bare chip (electronic circuit component article) to be imaged. The image is picked up at an angle of view.

  Next, a dispenser equipped with the article recognition apparatus according to the present invention will be described as a fourth embodiment of the present invention. Although not particularly shown, the dispenser is a device that applies an application agent (solder paste, adhesive, etc.) for fixing electronic components to a predetermined application position on a substrate (electronic circuit component). The dispenser includes a dispenser head that discharges the coating agent at a coating position, and a driving unit that moves the dispenser head on the substrate, so that the article recognition apparatus recognizes the coating position on the substrate or the coating state of the coating agent. It is configured. When recognizing the article, the substrate is imaged by switching ON / OFF of the conversion lens as necessary.

  Next, as a fifth embodiment of the present invention, a mounting board inspection apparatus equipped with the article recognition apparatus according to the present invention will be described. Although this mounting board inspection device is not particularly illustrated, it is an apparatus for inspecting the mounting state of the mounted substrate (electronic circuit component article). This mounting board inspection device switches the conversion lens ON / OFF as necessary to image the mounted board, recognizes the mounting state based on the image, and there is no missing part or mounting position deviation by the inspection means. Whether or not the inspection is acceptable is checked.

  Next, as a sixth embodiment of the present invention, a printed circuit board inspection apparatus equipped with the article recognition apparatus according to the present invention will be described. Although this printing substrate inspection apparatus is not particularly illustrated, it is an apparatus for inspecting the coating agent printed state of the substrate (electronic circuit component article) after the coating agent printing. This printed circuit board inspection device switches the conversion lens ON / OFF as necessary to image the substrate after printing the coating agent, recognizes the coating state of the coating agent based on the image, and prints and prints with the inspection means. It is checked whether there is any deviation and whether or not the inspection is acceptable.

  In any of the above fourth to sixth embodiments, the appropriate focal length and angle of view can be switched with one camera in accordance with the distance between the camera and the substrate, the imaging range, etc., so that the cost is low. Can perform highly accurate article recognition.

  Although the first to sixth embodiments have been described above, the present invention is not limited to these embodiments, and various modifications may be made within the scope of the claims. For example, in each of the above embodiments, the actuator 29 for switching ON / OFF of the conversion lens 23 and the like is fixed to the head unit 6 and the base 1, but may be fixed to the camera 18.

  Further, the camera 18 is not necessarily limited to a single focal point and a fixed focus. A zoom mechanism and a focus adjustment mechanism to some extent may be provided and used together with a switching mechanism such as the conversion lens 23.

  In the above embodiment, when the conversion lens 23 or the like is turned on, the focal length is shortened or the angle of view is switched to the wide angle side. When is turned on, the focal length may be increased or the angle of view may be switched to the telephoto side, and ON / OFF switching control corresponding to the focal length may be performed.

It is a top view which shows roughly the surface mounter by which the component recognition apparatus which concerns on 1st Embodiment of this invention was mounted. It is a front view which abbreviate | omits and shows a part of surface mounting machine of FIG. FIG. 2 is a partial side sectional view mainly showing a component recognition apparatus in the surface mounter of FIG. 1. It is explanatory drawing which shows the imaging state in the components recognition apparatus of FIG. 3, and the use condition of a conversion lens, (a) does not use a conversion lens, (b) shows the case where a conversion lens is used. It is a schematic control block diagram of the surface mounting machine of FIG. It is a modification of the surface mounting machine of FIG. 1, and is explanatory drawing which shows the switching of a field angle by a conversion lens, (a) shows the case where a conversion lens is not used, (b) shows the case where a conversion lens is used. . It is a modification of the surface mounting machine of FIG. 1, and is explanatory drawing which shows the switching of a field angle by a conversion lens, (a) shows the case where a conversion lens is not used, (b) shows the case where a conversion lens is used. . It is a flowchart which shows mounting operation | movement of the surface mounting machine of FIG. It is a top view which shows roughly the mounting machine with which the component recognition apparatus of another embodiment was mounted. FIG. 10 is a side sectional view of a component recognition device mounted on the mounting machine of FIG. 9. 1 is a plan view schematically showing a component testing apparatus equipped with an article recognition apparatus according to an embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 3 Printed circuit board 4 Component supply part 6 Head unit 9 Y-axis servomotor (drive means)
15 X-axis servo motor (drive means)
16 Nozzle unit (holding means)
16a Suction nozzle 18 Camera (imaging means)
20 Component recognition device (article recognition device)
23, 23a, 23b, 23c Conversion lens 24 Imaging unit 29 Actuator (switching means)
32 Main control unit (recognition means)
60 parts testing equipment C, C 'electronic parts (electronic circuit components)

Claims (8)

An article recognition method for imaging an electronic circuit component article by an imaging means and recognizing the state of the article based on the image,
In addition to the imaging means, a conversion lens for changing the focal length or angle of view is prepared.
The electronic circuit configuration is switched between a state where the conversion lens is interposed on the optical path between the electronic circuit component and the imaging means and a state where the conversion lens is removed from the optical path so that an appropriate focal length or angle of view is obtained. Image the article,
An article recognition method, comprising: recognizing a state of the electronic circuit component article based on a captured image. An article recognition apparatus that captures an electronic circuit component article with an imaging unit and recognizes the state of the article based on the image,
In addition to the imaging means, the focal length or the angle of view provided to be switchable between a state of being interposed on the optical path between the electronic circuit component article and the imaging means and a state of being removed from the optical path are changed. A conversion lens,
Switching means for performing the switching of the conversion lens;
Recognizing means for recognizing the state of the electronic circuit component article based on the captured image of the electronic circuit component article,
The article recognizing apparatus characterized in that the switching means performs the switching of the conversion lens so that an appropriate focal length or angle of view is obtained at the time of imaging an electronic circuit component article. An article recognition apparatus for recognizing a state in which a plurality of electronic components that are electronic circuit components are arranged at predetermined positions,
3. The article recognition apparatus according to claim 2, wherein the imaging means images a plurality of electronic components simultaneously when the conversion lens is switched to at least a large angle of view side. A surface mounter that transfers and mounts an electronic component that is an electronic circuit component article from a component supply unit to a predetermined position on a substrate,
The article recognition apparatus according to claim 2 or 3,
Holding means for taking out and holding the electronic component from the component supply unit;
Driving means for moving the holding means to a predetermined position on the substrate in the electronic component holding state;
A surface mounter configured to recognize a holding state of the electronic component by the article recognition device at least during movement of the holding means. A component testing apparatus for performing various inspections by transferring an electronic component that is an electronic circuit component article from a component supply unit to a predetermined position of an inspection means,
The article recognition apparatus according to claim 2 or 3,
Holding means for taking out and holding the electronic component from the component supply unit;
Driving means for moving the holding means to a predetermined position of the inspection means in the electronic component holding state;
A component testing apparatus configured to recognize a holding state of the electronic component by the article recognition device at least during movement of the holding means. A dispenser for applying an application agent for fixing an electronic component to a predetermined application position on a substrate that is an electronic circuit component,
The article recognition apparatus according to claim 2;
A dispenser head for discharging the coating agent at the application position;
Driving means for moving the dispenser head on the substrate,
A dispenser characterized by causing the article recognition apparatus to recognize a coating position on the substrate or a coating state of the coating agent. A mounting board inspection apparatus for inspecting a mounting state of a substrate after mounting as an electronic circuit component,
The article recognition apparatus according to claim 2 or 3,
A mounting board inspection apparatus comprising: inspection means for determining pass / fail of inspection based on a mounting state of the mounted board recognized by the article recognition apparatus. A printed circuit board inspection apparatus for performing an inspection of a printed state of a coating material on a printed circuit board, which is an electronic circuit component article,
The article recognition apparatus according to claim 2 or 3,
A printed circuit board inspection apparatus comprising: an inspection unit that determines pass / fail of inspection based on a printed state of the printed circuit board printed by the article recognition apparatus.