JP4459924B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting electronic components on a printed circuit board.

  Generally, an electronic component mounting apparatus for mounting an electronic component on a printed circuit board includes a printed circuit board conveying unit that conveys the printed circuit board, and a head unit that can move over the electronic component supply unit and the installation position of the printed circuit board. Things are known.

In such an electronic component mounting apparatus, the movable head unit is provided with a component mounting head for holding the electronic component, and the head unit is held in a state where the electronic component is held on the component mounting head of the head unit. Is moved from the electronic component supply unit to the installation position of the printed circuit board, and the electronic component is mounted on the printed circuit board.

  In addition, many of recent electronic component mounting apparatuses further have an imaging unit for imaging an electronic component, and the electronic component held by the component mounting head is imaged by the imaging unit to inspect the electronic component. Can be done.

For example, Patent Document 1 discloses an electric component mounting system technology that includes a parts camera and a reflection device on an X-axis slide that moves a head unit in the X-axis direction, and images an electronic component held by a suction nozzle of the head unit. Is disclosed.
JP2002-100955

  However, in the technology of the electrical component mounting system disclosed in the above-mentioned patent document, the electronic component held by the component mounting head is only imaged and inspected by one imaging means, and the electronic component in the supply unit In addition, there is a problem that the posture of the electronic component at the mounting position of the printed board cannot be imaged and inspected.

  That is, according to the technology of the electrical component mounting system disclosed in the above-mentioned patent document, whether or not the state of the electronic component in the supply unit is normal (for example, there is no lead bending of the electronic component), the electronic in the supply unit Whether the position of the component is correct (for example, whether there is a shift in the electronic component supply machine), whether it is being supplied in the correct posture (for example, whether it is turned over or jumped out in the supply machine), It was not possible to confirm whether the supplied parts were correct (for example, whether or not the product types were different).

  For this reason, if a defective electronic component is picked up, it will be noticed after it has been transported to the mounting position or at the inspection stage of the suction component in the middle of transport, and the defective product will be transported from there to a disposal position. It was a useless operation that had to go to pick up the parts.

  In addition, if the electronic component is attracted in a bad supply state, the electronic component holding state in the component mounting head is deteriorated (for example, the corner of the component is held). There was a possibility of misalignment during mounting.

  Furthermore, when the position of the electronic component becomes high in the supply unit, the electronic component and the component mounting head interfere with each other, and not only the electronic component but also the component mounting head and the device itself may be damaged. was there.

  On the other hand, since the electronic component mounting system disclosed in the above-mentioned patent document cannot be inspected by the same imaging means for the electronic component after being mounted on the printed circuit board, the electronic component is misaligned or missing. There was a risk of producing a printed circuit board as it was generated.

  Further, as a countermeasure against such a problem, if the electronic components at the plurality of positions are picked up and inspected by separate image pickup means, the number of image pickup means increases, resulting in an expensive electronic component mounting apparatus. There was a problem that.

  Some conventional electronic component mounting devices have a camera fixed downward on the head unit in order to recognize the fiducial marks on the board. Supplying electronic components using this camera is also possible. The method of inspecting the state and the state after mounting has a problem that it takes time to move the head unit. That is, since this camera is mounted at a position different from the component mounting head, the component mounting head is moved in the XY-axis direction to the suction position after being imaged by the camera, or conversely from the component mounting head to the printed circuit board. After mounting the head unit, it is inevitable that the movement time of these head units becomes tact loss, such as the camera must be moved in the XY axis direction to the mounting position.

  The present invention has been made in view of the above problems, and it is possible to quickly image and inspect the postures of electronic components at a plurality of positions, such as a supply unit, a component mounting head, and a printed circuit board, with a single imaging unit. An object of the present invention is to provide an electronic component mounting apparatus that is efficient, economical, and highly reliable.

To solve the above problems moving, the invention according to claim 1, a plurality of component mounting heads is arranged in a predetermined direction to hold the electronic component over the installation position of the supply unit and a printed circuit board of the electronic component a head unit capable, in the electronic component mounting apparatus that mounts electronic components on a printed board by the head unit, the above head unit, an imaging unit for imaging an electronic component held by the component mounting head is above The imaging unit is provided to move in the fixed direction with respect to the head unit, and the imaging unit includes one imaging unit that images the electronic component and an optical axis changing unit that can change the direction of the optical axis of the imaging unit. By this optical axis changing means, when the head unit is positioned on the supply section, the direction of the optical axis of the imaging means is directed to the supply section side. An electronic component to allow imaging in the feed unit, whereas, is intended to an electronic component held by the component mounting head by directing the direction of the optical axis of the imaging means to the component mounting head and can image, and, When imaging a plurality of electronic components in the supply unit, the imaging unit is moved and arranged in the supply unit after setting the direction of the optical axis of the imaging unit to the supply unit side When imaging a plurality of electronic components and, on the other hand, imaging an electronic component held by the plurality of component mounting heads, the direction of the optical axis of the imaging means is set to face the component mounting head side. after the, the imaging unit is moved to the predetermined direction, is configured to image the electronic component held by the plurality of component mounting head, the optical axis changing means, one actinide It has a pair of mirrors that are provided so as to move forward and backward in the direction perpendicular to the optical axis of the imaging means by the eta, are inclined in different directions, and are arranged in the direction of the forward and backward movement. It is characterized in that the direction of the optical axis of the imaging means is changed by moving and alternately entering on the optical axis of the imaging means.

The invention according to claim 2, a plurality of component mounting head which holds the electronic components are juxtaposed in a predetermined direction, a head unit movable over the installation position of the supply unit and a printed circuit board of the electronic component In the electronic component mounting apparatus in which an electronic component is mounted on a printed circuit board by the head unit, an imaging unit that images the electronic component held by the component mounting head is mounted on the head unit. The imaging unit is provided so as to move in the certain direction, and the imaging unit has one imaging means for imaging the electronic component, and an optical axis changing means capable of changing the direction of the optical axis of the imaging means. When the head unit is positioned on the supply unit by the axis changing unit, the direction of the optical axis of the imaging unit is directed to the supply unit side, so that the electronic unit in the supply unit Multiple and can image, whereas, is intended to an electronic component held by the component mounting head by directing the direction of the optical axis of the imaging means to the component mounting head and can image, and, in the feed section When imaging the electronic component, after setting the optical axis direction of the imaging means to be directed to the supply unit side, the imaging unit moves and images a plurality of electronic components arranged in the supply unit On the other hand, when imaging the electronic component held by the plurality of component mounting heads, the imaging unit is set after the optical axis direction of the imaging unit is set to face the component mounting head side. There are moves to the predetermined direction, is configured to image the electronic component held by the plurality of component mounting head, the optical axis changing means, shooting by one actuator The optical prism has a pair of optical prisms that are provided so as to move forward and backward in a direction perpendicular to the optical axis of the means, are inclined in different directions, and are arranged in the direction of the forward and backward movement, and the optical prisms are simultaneously moved in the same direction. Thus, the direction of the optical axis of the imaging means is changed by alternately entering the optical axis of the imaging means.

  According to the configuration of claim 1 or 2, the optical axis changing unit can direct the direction of the optical axis of the imaging unit to the supply unit side, whereby the electronic component in the supply unit can be imaged, and the imaging unit By directing the direction of the optical axis to the component mounting head, it is possible to image the electronic component held by the component mounting head, so the position of both the supply unit and the component mounting head can be obtained with a single imaging unit. As a result, it is possible to obtain an electronic component mounting apparatus that is efficient, economical, and highly reliable.

  In addition, a simple configuration in which a pair of mirrors or optical prisms directed in different directions alternately enter the optical axis of the imaging unit can change the direction of the optical axis of the imaging unit. An effective optical axis changing means can be realized.

  Further, the imaging means can take an image of an electronic component mounted on the printed circuit board by directing the direction of the optical axis toward the printed circuit board when the head unit is positioned on the printed circuit board by the optical axis changing means. (Claim 3) is preferable.

  In this way, by directing the direction of the optical axis toward the printed board by the optical axis changing means, it is possible to take an image of electronic components mounted on the printed board using the same imaging unit. As a result of imaging an electronic component mounted on a printed circuit board without adding, it is possible to provide an electronic component mounting apparatus that is more efficient, economical, and highly reliable.

The invention according to claim 4, a plurality of component mounting head which holds the electronic components are juxtaposed in a predetermined direction, a head unit movable over the installation position of the supply unit and a printed circuit board of the electronic component In the electronic component mounting apparatus in which an electronic component is mounted on a printed circuit board by the head unit, an imaging unit that images the electronic component held by the component mounting head is mounted on the head unit. The imaging unit is provided to move in the predetermined direction, and the imaging unit includes one imaging unit that images the electronic component, and an optical axis changing unit that can change a direction of an optical axis of the imaging unit, and the light The axis changing means is provided so as to advance and retreat in a direction perpendicular to the optical axis of the imaging means by one actuator, inclines in different directions, and moves forward. It has a pair of mirrors or a pair of optical prisms arranged in the direction of movement, and simultaneously moves the mirrors or optical prisms in the same direction to alternately enter the optical axis of the imaging means, thereby The state can be changed between a state in which the direction of the axis is directed to the component mounting head and a state in which the axis is directed in the opposite direction, and the imaging unit images the electronic component held by the plurality of component mounting heads. Sometimes, after setting the direction of the optical axis of the imaging means to be directed to the component mounting head, the imaging unit moves in the fixed direction to image the electronic components held by the plurality of component mounting heads. It is comprised so that it may do.

  According to this configuration, the optical axis changing unit directs the direction of the optical axis of the imaging unit to the component mounting head, whereby the electronic component held by the component mounting head can be imaged, and the imaging unit By directing the direction of the optical axis in the direction opposite to the direction of the component mounting head, it is possible to image the electronic component in the supply unit or the electronic component mounted on the printed board.

The imaging means, the distance have a telecentric lens on the optical axis between the optical axis changing means and the imaging means, from said optical axis changing means on the supply unit to the electronic components of the supply unit, the print It is preferable that the distance from the optical axis changing means on the substrate to the electronic component mounted on the printed circuit board is different (Claim 5).

  In this way, the telecentric lens disposed on the optical axis between the optical axis changing means and the imaging means avoids a magnification error even when focusing is incomplete, and is thus attracted to the head. Even when the optical path length differs between when the electronic component is imaged and when the electronic component of the component supply unit or the electronic component on the printed circuit board is imaged, good imaging is possible.

  In the mounting apparatus according to the present invention, the imaging unit provided in the head unit is provided with an optical axis changing unit having a pair of mirrors or a pair of optical prisms which are movable in and out of the optical axis of the imaging unit and are directed in different directions. Therefore, the postures of electronic components at a plurality of positions such as the supply unit, the component mounting head, and the printed board can be quickly imaged and inspected with a single imaging unit, and the efficiency can be greatly increased.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing a configuration of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is an elevation view showing a configuration of a head unit 5 of the mounting apparatus. 3 is a conceptual diagram showing a reference example of the configuration of the optical axis changing means 9. FIG. 3 (a) shows the optical axis changing means 9 holding the optical axis 8a of the imaging means 8 on the component mounting head 6. FIG. FIG. 2B is a plan view of FIG. 1A, and FIG. 2C is a plan view of the electronic component 1a, 1b, and FIG. FIG. 1) shows a state where the electronic components 1a and 1b mounted on the printed board 2 are directed.

  The electronic component mounting apparatus shown in FIG. 1 mounts electronic components 1a and 1b on a printed circuit board 2 and is movable from the supply parts 3a and 3b of the electronic components 1a and 1b to the installation position of the printed circuit board 2. The head unit 5 includes a component mounting head 6 that holds the electronic components 1a and 1b, and an imaging unit 7. The imaging unit 7 includes an imaging unit 8 and an optical axis changing unit 9. ing.

  The printed circuit board 2 is carried into the mounting apparatus by the board conveying conveyor 11 extending in the left and right directions in FIG. 1, and after the electronic components 1a and 1b are mounted, the printed board 2 is carried out of the mounting apparatus. Hereinafter, the direction of the conveyor 11 is referred to as an X-axis direction, a direction orthogonal to the X-axis on a horizontal plane is referred to as a Y-axis direction, and a vertical direction orthogonal to the X-axis and the Y-axis is referred to as a Z-axis direction.

  The supply units 3a and 3b are disposed on both sides of the conveyor 11 in the Y-axis direction. Some of the supply units 3a are provided with a pallet for supplying a relatively large electronic component 1a, and the electronic component 1a is supplied in a matrix on the pallet 12.

  In addition, the other supply unit 3b is provided with a large number of tape feeders 13 for supplying relatively small electronic components 1b. The tape feeder 13 accommodates a large number of electronic components 1b at predetermined intervals, and sequentially takes out and supplies the electronic components 1b from a reel (not shown) around which the held component tape is wound.

  The head unit 5 includes a plurality of component mounting heads 6 in the present embodiment, and the component mounting heads 6 adsorb the electronic components 1a and 1b from the pallet 12 or the tape feeder 13, and the electronic components 1a and 1b are sucked. The electronic components 1a and 1b are mounted on the installation position of the printed circuit board 2 while being held by the component mounting head 6.

  The head unit 5 is movable in the X-axis direction and the Y-axis direction over a predetermined range of the electronic component mounting apparatus. That is, the head unit support member 14 extending in the X-axis direction is supported by the Y-axis guide rail 15 extending in the Y-axis direction, and the head unit support member 14 is movable along the Y-axis guide rail 15. The head unit 5 is supported by the head unit support member 14 so as to be movable along the X axis.

  Then, the X-axis servomotor 16 drives the head unit 5 in the X-axis direction via the ball screw 17, and the Y-axis servomotor 18 drives the head unit support member 14 in the Y-axis direction via the ball screw 19. Driving is performed.

  As shown in FIG. 2, the component mounting head 6 includes a nozzle 6a for adsorbing components. Although not shown, a head unit is provided with Z-axis driving means for moving the head 6 up and down in the Z-axis direction and rotation driving means for rotating the head 6, and negative pressure for component suction can be supplied to the nozzle 6 a. It has become.

  As shown in FIGS. 1 and 2, the imaging unit 7 is supported by an imaging unit guide rail 7a provided in the head unit 5, and along the imaging unit guide rail 7a, an imaging unit servo motor 7b and a ball screw 7c. , So as to move in the X-axis direction so as to be able to advance and retreat with respect to the component mounting head 6.

  As shown in FIG. 3, the imaging unit 7 also has illumination means 7d for illuminating the electronic components 1a and 1b adsorbed to the component mounting head 6, and the imaging unit 7 is connected to the imaging unit guide rail 7a. The illumination means 7d is turned on and images of the electronic components 1a and 1b are obtained by the imaging means 8 when passing through the component mounting head 6. The imaging means 8 is composed of, for example, a CCD camera (or a CMOS sensor). The image data from the image pickup means 8 is input to a control device (not shown) of the mounting apparatus, and the control device recognizes the images of the electronic components 1a and 1b obtained by the image pickup means 8 to perform the electronic component 1a, The position shift 1b is inspected.

  In the reference example shown in FIG. 3, the optical axis changing means 9 has a rotatable mirror 9a on the optical axis 8a of the imaging means 8, and the mirror 9a is rotated by a motor 9b. It is configured so that the direction of the optical axis 8a of the imaging means 8 can be changed. When the head unit 5 is positioned on the supply units 3a and 3b, the imaging unit 8 is in the supply units 3a and 3b by directing the optical axis 8a downward (FIG. 3C). The electronic components 1a and 1b can be imaged. Further, by directing the direction of the optical axis 8a toward the component mounting head 6 (FIG. 3A), the imaging means 8 can image the electronic components 1a and 1b held by the component mounting head 6. It is like that.

  Further, the optical axis changing means 9 is configured such that when the head unit 5 is positioned on the printed board 2, the direction of the optical axis 8a is directed downward (FIG. 3C), so that the imaging means 8 is The electronic components 1a and 1b mounted on the camera 2 can be imaged.

  The optical axis changing means 9 is configured to change the direction of the optical axis 8a of the imaging means 8 by providing an optical prism instead of the mirror 9a and rotating the optical prism in different directions. Is also possible.

  As shown in FIG. 4, it is preferable to place a telecentric lens 8b on the optical axis 8a between the imaging means 8 and the optical axis changing means 9. This telecentric lens 8b prevents magnification errors even when focusing is incomplete, and by providing this, the electrons adsorbed on the head 6 as shown in FIG. Even when the optical path length is different between when imaging the component and when imaging the electronic component of the component supply units 3a and 3b or the electronic component on the printed circuit board 2 as shown in FIG. It becomes possible.

  Next, the operation of the electronic component mounting apparatus will be described with reference to FIGS. FIG. 5 is a side view showing the operation of the component mounting head 6 and the image pickup unit 7 provided in the head unit 5 of the electronic component mounting apparatus. FIG. (B) shows the electronic parts 1a and 1b held by the component mounting head 6, and (c) shows the state where the imaging unit 8 prints the electronic parts 1a and 1b in 1). The states of imaging the electronic components 1a and 1b mounted on the substrate 2 are shown. 6 to 8 are flowcharts showing the operation procedure of the mounting apparatus.

  As a procedure for imaging the electronic components 1a and 1b in the supply units 3a and 3b, as shown in FIG. 6, first, in step S1, the head unit 5 moves onto the supply units 3a and 3b of the electronic components 1a and 1b. To do.

  Next, in step S2, the optical axis changing means 9 turns the optical axis 8a of the imaging means 8 downward.

  In step S3, the imaging unit 7 of the head unit 5 advances from the retracted state to a predetermined imaging position.

  In step S4, the imaging unit 8 images the electronic components 1a and 1b in the supply units 3a and 3b (see FIG. 5A), and in step S5, based on the captured images, the electronic components 1a and 1b. Inspect.

  Here, in step S6, it is determined whether or not the inspection result is normal. If NO, that is, if it is determined that it is not supplied correctly, the next new electronic components 1a and 1b are supplied in step S7. On the other hand, if YES, that is, if it is determined that the toner is correctly supplied, the imaging unit 7 of the head unit 5 is retracted to the retracted state in step S8.

  Next, the procedure for imaging the electronic components 1a and 1b held by the component mounting head 6 is as shown in FIG. That is, in step S9, the component mounting head 6 is moved in the Z-axis, and the electronic components 1a and 1b in the supply units 3a and 3b are sucked and held by the component mounting head 6.

  In step S 10, the optical axis changing unit 9 directs the direction of the optical axis 8 a of the imaging unit 8 toward the component mounting head 6.

  In step S11, the imaging unit 7 of the head unit 5 advances from the retracted state relative to the component mounting head 6.

  In this state, in step S12, the imaging unit 8 images the electronic components 1a and 1b held by the component mounting head 6 (see FIG. 5B). In step S13, the imaging unit 7 of the head unit 5 is captured. Retracts to the retracted state.

  In step S14, the electronic components 1a and 1b are inspected based on the captured images, and the correction amount of the installation position on the printed circuit board 2 is calculated.

  Here, in step S15, it is determined whether or not the state or holding state of the electronic components 1a, 1b is normal. 1b is returned to the supply units 3a and 3b or discarded at the disposal position.

  In the case of YES, that is, when it is determined that it is held correctly, in step S17, it is moved to the corrected mounting position on the printed circuit board 2, and in step S18, the component mounting head 6 is moved in the Z axis. Electronic components 1 a and 1 b are mounted on the printed circuit board 2.

  Furthermore, the procedure for imaging the electronic components 1a and 1b mounted on the printed circuit board 2 is as shown in FIG. That is, in step S19, the optical axis changing unit 9 directs the direction of the optical axis 8a of the imaging unit 8 to the printed circuit board 2 side.

In step S20, the imaging unit 7 of the head unit 5 advances from the retracted state to a predetermined imaging position .

  In step S21, the imaging unit 8 images the electronic components 1a and 1b mounted on the printed circuit board 2. In step S22, the electronic components 1a and 1b are inspected based on the captured images.

  Here, in step S23, it is determined whether or not the inspection result is normal. If NO, that is, if it is determined that the inspection is not correctly implemented, an alarm is sounded and an operator call is made in step S24.

  In the case of YES, that is, when it is determined that the mounting is correctly performed, in step S25, the imaging unit 7 is retracted to the retracted state. Then, one mounting process is completed.

  As described above, according to the electronic component mounting apparatus, since the imaging unit 7 includes the optical axis changing unit 9, the direction of the optical axis 8a of the imaging unit 8 is directed to the component mounting head 6. Not only can the electronic components 1a and 1b held by the component mounting head 6 be imaged, but also by directing the optical axis 8a downward when the head unit 5 is on the component supply units 3a and 3b. The electronic components 1a and 1b in the supply units 3a and 3b can be imaged. As described above, it is possible to image the electronic components 1a and 1b located at both the positions of the supply units 3a and 3b and the component mounting head 6 with a single imaging unit 8. As a result, the imaging device 8 is efficient, economical and reliable. A highly electronic component mounting apparatus can be obtained.

  Furthermore, when the head unit 5 is on the printed circuit board 2, the direction of the optical axis 8 a is directed downward so that the electronic components 1 a and 1 b mounted on the printed circuit board 2 are also imaged using the same imaging unit 7. As a result, the electronic components 1a and 1b mounted on the printed circuit board 2 can be imaged without adding the image pickup means 8, and as a result, the electronic components can be mounted more efficiently, economically and with high reliability. It can be a device.

  In addition, a mirror 9a or an optical prism that can be rotated in different directions is provided on the optical axis 8a of the image pickup means 8, and the mirror 9a or the optical prism is rotated so that the optical axis 8a of the image pickup means 8 can be rotated. Since the direction can be changed, the optical axis changing means 9 which is effective at low cost can be realized.

  Further, if a telecentric lens 8b is arranged on the optical axis 8a between the optical axis changing means 9 and the imaging means 8, when the electronic component sucked by the head 6 is imaged, the component supply units 3a, 3b Even when the optical path length is different from that of the electronic component or the electronic component on the printed circuit board 2, good imaging can be performed. There is an advantage that restrictions on the arrangement of the head 6 and the like are reduced, and the degree of freedom in designing the electronic component mounting apparatus is increased.

  FIG. 9 is a conceptual diagram showing an example of the optical axis changing means 29 of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 9A shows an imaging means by the mirror 29a of the optical axis changing means 29 according to the modification. 8 is a side view showing a state in which the direction of the optical axis 8a is directed toward the upper component mounting head 6. FIG. (B) is a plan view of (a). (C) is a state in which the mirror 29b of the optical axis changing means 29 is made to enter the optical axis 8a of the imaging means 8, and the direction of the optical axis 8a is directed to the lower supply parts 3a, 3b or the printed circuit board 2 side. Is shown.

  As shown in these drawings, in the present embodiment, the optical axis changing unit 29 has a pair of mirrors 29a and 29b which are provided so as to be able to advance and retract on the optical axis 8a of the imaging unit 8 and are directed in different directions. The mirrors 29a and 29b are driven by an actuator 29c to alternately enter the optical axis 8a of the image pickup means 8 so that the direction of the optical axis 8a of the image pickup means 8 is changed.

  That is, the pair of mirrors 29a and 29b is movable in a direction orthogonal to the optical axis 8a (a direction orthogonal to the paper surface in FIG. 9A), and is moved side by side in the movement direction. Accordingly, it is possible to change between a state in which one mirror 29a is positioned on the optical axis 8a and a state in which the other mirror 29b is positioned on the optical axis 8a. When one mirror 29a is positioned on the optical axis 8a, the optical axis 8a is directed toward the component mounting head 6 (upward), and when the other mirror 29b is positioned on the optical axis 8a, the optical axis. The mirrors 29a and 29b are inclined in different directions so that 8a is directed in the opposite direction (downward) from the component mounting head 6.

  As the optical axis changing means 29, an optical prism is provided in place of the mirrors 29a and 29b, and the optical prisms are alternately entered on the optical axis 8a of the imaging means 8 so that the optical axis 8a of the imaging means 8 is obtained. It is also possible to configure to change the direction.

  Also in the mounting apparatus including the imaging unit having the optical axis changing unit 29 of the present embodiment, a pair of mirrors 29a is used instead of the rotation of the mirror 9a (or the optical prism) in the optical axis changing unit 9 of the above-described reference example. , 29b (or a pair of optical prisms), except for the point of moving back and forth, as in the reference example, the operation shown in the flowcharts of FIGS. The picked-up electronic component can be imaged, the electronic component mounted on the printed circuit board can be picked up, and the like.

  Then, according to the optical axis changing unit 29 of the present embodiment, a pair of mirrors 29a, 29b or a pair of optical prisms directed in different directions are made to enter the optical axis 8a of the imaging unit 8 alternately. According to the configuration, the direction of the optical axis 8a of the imaging unit 8 can be changed, so that there is an advantage that an effective optical axis changing unit 29 can be realized at low cost.

  The above-described embodiment is merely a preferred specific example of the present invention, and the present invention is not limited to the above-described embodiment.

  For example, the electronic component mounting apparatus is not necessarily limited to one that handles a large electronic component 1a and a small electronic component 1b as shown in the drawing, and various feeders can be adopted.

Note that when the electronic components 1a on the pallet 12 are successively attracted to the plurality of component mounting heads 6, the imaging of the plurality of electronic components 1a on the pallet 12 is stopped at a predetermined XY position. In this state, the imaging unit 7 is moved while moving in the X direction, or while the imaging unit 7 is stopped with respect to the head unit 5, the head unit 5 is moved while moving in a predetermined direction. 5 is performed while moving the imaging unit 7 in a predetermined direction and the imaging unit 7 in the X direction with respect to the head unit 5, and imaging of a plurality of components can be completed in a short time. Thereafter, the electronic component 1a at a predetermined position is picked up by each head 6, and then the imaging unit 7 is moved to the head unit 5 while moving the head unit 5 in the direction of the printed circuit board 2. The picked-up part is imaged. Imaging of these while being moved, when constituting the imaging unit 7 by the CCD camera is relatively stops the electronic components 1a instantaneous imaging unit 7 of the image under side of the electronic components 1a, the imaging unit In the case where 7 is configured by a line sensor, imaging is performed without stopping.

  Still further, during imaging of the electronic component 1a on the pallet 12 by the imaging unit 7, another electronic component 1a may be adsorbed by the head 6 at a position where it does not interfere with the imaging unit 7 by moving up and down. Thereby, mounting efficiency can be improved.

  Similarly, when the plurality of electronic components 1b of the tape feeder 13 are sucked by the plurality of heads 6, the imaging unit 7 is moved in the X direction while the head unit 5 is stopped at a predetermined XY position. It is carried out while moving the head unit 5 in the X direction while the imaging unit 7 is stopped with respect to the head unit 5, or the head unit 5 is moved in the X direction and the imaging unit 7 is moved in the X direction with respect to the head unit 5. Thereafter, the electronic component 1b at a predetermined position is sucked by each head 6, and then the imaging unit 7 is moved to the head unit 5 while the head unit 5 is moving in the direction of the printed circuit board 2. On the other hand, imaging of the component adsorbed by each head 6 is performed while moving. Alternatively, during imaging of the electronic component 1b of the tape feeder 13 by the imaging unit 7, another electronic component 1b is attracted by the head 6 at a position where it does not interfere with the imaging unit 7 by moving up and down.

It is a top view which shows the structure of the electronic component mounting apparatus which concerns on embodiment of this invention. It is an elevational view showing the configuration of the head unit of the electronic component mounting apparatus according to the embodiment of the present invention. It is a conceptual diagram showing the configuration of the optical axis changing means according to the reference example, (a) is a state in which the optical axis changing means is directed to the electronic component held by the component mounting head, the optical axis of the imaging means, (B) is a plan view of (a), and (c) is a state in which the optical axis changing means directs the optical axis of the imaging means to the supply unit or the electronic component mounted on the printed circuit board. Yes. It is a conceptual diagram which shows the example which has arrange | positioned a telecentric lens on an optical axis, (a) is an electronic component with which the imaging means was hold | maintained at the component mounting head, (b) is an imaging means by a supply part or a print A state of imaging an electronic component mounted on a substrate is shown. It is a side view which shows the effect | action of the electronic component mounting apparatus head unit which concerns on a reference example, (a) is in the state which an imaging means images the electronic component in a supply part, (b) is an imaging means for component mounting. (C) shows a state where the image pickup unit picks up an electronic component mounted on the printed circuit board. It is a flowchart which shows the procedure which images the electronic component in a supply part. It is a flowchart which shows the procedure which images the electronic component hold | maintained at the component mounting head. It is a flowchart which shows the procedure which images the electronic component mounted in the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS It is a conceptual diagram which shows an example of the optical axis change means of the electronic component mounting apparatus which concerns on embodiment of this invention, (a) is the component mounting to which the direction of the optical axis of an imaging means is upper by the mirror of an optical axis change means It is a side view which shows the state which turned to the head. (B) is a plan view of (a). And (c) has shown the state which made the mirror of an optical axis change means approach the optical axis of an imaging means, and orient | assigned the direction of the optical axis to the downward supply part or the printed circuit board side.

Explanation of symbols

1a, 1b Electronic component 2 Printed circuit board 3a, 3b Supply unit
5 head unit 6 component mounting head 7 imaging unit 8 imaging means 8a optical axis 8b telecentric lens 29 optical axis changing means 29a, 29b mirror

Claims (5)

A plurality of component mounting heads is arranged in a predetermined direction for holding the electronic component, comprising a head unit movable over the installation position of the supply and the printed circuit board of the electronic components and printed electronic components by the head unit In an electronic component mounting apparatus designed to be mounted on a board,
In the head unit, an imaging unit for imaging an electronic component held by the component mounting head is provided so as to move in the fixed direction with respect to the head unit ,
The imaging unit includes one imaging unit that images an electronic component, and an optical axis changing unit that can change the direction of the optical axis of the imaging unit. The optical unit changes the head unit from the supply unit. By directing the direction of the optical axis of the image pickup means toward the supply section when positioned above, it is possible to image the electronic component in the supply section, while the direction of the optical axis of the image pickup means is directed to the component mounting head The electronic component held by the component mounting head can be imaged, and when imaging a plurality of electronic components in the supply unit, the direction of the optical axis of the imaging unit is directed to the supply unit side. When the imaging unit moves and images a plurality of electronic components arranged in the supply unit, while the electronic components held by the plurality of component mounting heads are imaged. After setting the direction of the optical axis of the imaging means to face the component mounting head, the imaging unit moves in the fixed direction, and the electronic components held by the plurality of component mounting heads are Configured to image,
The optical axis changing means is provided so as to move forward and backward in a direction orthogonal to the optical axis of the imaging means by one actuator, and has a pair of mirrors that are inclined in different directions and arranged in the forward and backward movement directions. The electronic component mounting apparatus is characterized in that the direction of the optical axis of the imaging means is changed by simultaneously moving the mirror in the same direction and alternately entering the optical axis of the imaging means. A plurality of component mounting heads is arranged in a predetermined direction for holding the electronic component, comprising a head unit movable over the installation position of the supply and the printed circuit board of the electronic components and printed electronic components by the head unit In an electronic component mounting apparatus designed to be mounted on a board,
The head unit is provided with an imaging unit that images the electronic component held by the component mounting head so as to move in the predetermined direction with respect to the head unit ,
The imaging unit includes one imaging unit that images an electronic component, and an optical axis changing unit that can change the direction of the optical axis of the imaging unit. The optical unit changes the head unit from the supply unit. By directing the direction of the optical axis of the image pickup means toward the supply section when positioned above, it is possible to image the electronic component in the supply section, while the direction of the optical axis of the image pickup means is directed to the component mounting head The electronic component held by the component mounting head can be imaged, and when imaging a plurality of electronic components in the supply unit, the direction of the optical axis of the imaging unit is directed to the supply unit side. When the imaging unit moves and images a plurality of electronic components arranged in the supply unit, while the electronic components held by the plurality of component mounting heads are imaged. After setting the direction of the optical axis of the imaging means to face the component mounting head, the imaging unit moves in the fixed direction, and the electronic components held by the plurality of component mounting heads are Configured to image,
The optical axis changing means is provided so as to move forward and backward in a direction orthogonal to the optical axis of the imaging means by one actuator, and includes a pair of optical prisms inclined in different directions and arranged in the forward and backward movement directions. An electronic component mounting apparatus characterized by changing the direction of the optical axis of the image pickup means by simultaneously moving the optical prism in the same direction and alternately entering the optical axis of the image pickup means .   The imaging means enables imaging of an electronic component mounted on the printed circuit board by directing the direction of the optical axis toward the printed circuit board when the head unit is positioned on the printed circuit board by the optical axis changing means. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is an electronic component mounting apparatus. A plurality of component mounting heads is arranged in a predetermined direction for holding the electronic component, comprising a head unit movable over the installation position of the supply and the printed circuit board of the electronic components and printed electronic components by the head unit In an electronic component mounting apparatus designed to be mounted on a board,
In the head unit, an imaging unit for imaging an electronic component held by the component mounting head is provided so as to move in the fixed direction with respect to the head unit ,
The imaging unit has one imaging means for imaging an electronic component, and an optical axis changing means capable of changing the direction of the optical axis of the imaging means,
The optical axis changing means is provided so as to move forward and backward in a direction perpendicular to the optical axis of the imaging means by one actuator, tilted in different directions, and arranged in a direction of the forward and backward movement or a pair of mirrors or a pair A state in which the direction of the optical axis of the imaging unit is directed toward the component mounting head by simultaneously moving the mirror or the optical prism in the same direction and alternately entering the optical axis of the imaging unit. It can be changed to the opposite direction ,
When the imaging unit captures an electronic component held by the plurality of component mounting heads, the imaging unit is set to the constant after the optical axis direction of the imaging unit is set to be directed to the component mounting head. An electronic component mounting apparatus configured to move in a direction and image an electronic component held by the plurality of component mounting heads .   The imaging unit includes a telecentric lens on the optical axis between the optical axis changing unit and the imaging unit, and the distance from the optical axis changing unit on the supply unit to the electronic component of the supply unit, 5. The electronic component mounting according to claim 1, wherein a distance from the optical axis changing unit on the printed circuit board to the electronic component mounted on the printed circuit board is different. apparatus.

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