JP4781945B2 - Substrate processing method and component mounting system - Google Patents

Description

  The present invention relates to a method and a component mounting system for rationally processing a so-called multi-sided board in a component mounting system including a processing device such as a surface mounting machine.

  Conventionally, while transporting a substrate (PWB) on which a circuit pattern is formed, a coating liquid such as a solder or a conductive paste of a substrate is first applied to a mounting position in a coating apparatus, and then a surface mounting machine (hereinafter simply referred to as a mounting machine). Therefore, there is known a component mounting system in which components are sequentially mounted at the application position to produce a substrate (PWB).

  Further, in this type of component mounting system, when producing a so-called multi-sided board including a plurality of areas where the same circuit is formed, for example, an area having a severe defect is marked in advance in the area (bad mark). In other words, the mounting process of the area is omitted by recognizing the bad mark by the mounting machine (for example, Patent Document 1). In Patent Document 1, bad marks are recognized by recognizing the presence or absence of a movable camera provided in a mounting machine while sequentially moving the camera to the coordinate position of the bad mark.

Patent Document 2 discloses a technology in which constituent devices of the system are connected to each other by a communication unit, and information on a defective area specified by an upstream device is transmitted to a downstream device.
Japanese Patent Laid-Open No. 10-098297 Utility model registration No. 2530625

  In the technique as shown in the above-mentioned Patent Document 1, since it is necessary to move the camera to the bad mark coordinate position of each area of the multi-sided board, for example, in a mounting machine, for a multi-sided board including many areas When mounting components, it is required to move the camera to a large number of mark coordinate positions including bad marks in each area. As a result, there is a problem that it is difficult to shorten the tact time.

  Further, the technique disclosed in Patent Document 2 cannot be applied when there is no communication means between the constituent devices of the system.

  The present invention has been made in view of the above circumstances, and even in a component mounting system in which system components are not connected to each other by communication means or the like, the tact time when producing a multi-chip board is effective. The purpose is to shorten.

In order to solve the above problems, a substrate processing method of the present invention, the component mounting system comprising a surface mounting apparatus for mounting components on the substrate on which the coating liquid and the coating apparatus for applying a coating liquid to the substrate is coated Is used to mount a component on a multi-sided board having a plurality of areas in which circuits that are independent of each other are formed, and among the areas of the multi-sided board, defective areas that do not require board processing are removed. wherein together determine the coating device, by the coating device, may be recorded in a state where the information indicating the position of the defective area by using the coating liquid was concentrated in a predetermined area outside the area occupied region of the multi-substrate, the collectively imaging the information recorded in the predetermined area in the surface mounter, the Rukoto be recognized, based on the information, to mount components relative to the area other than the defective area Is obtained by way (claim 1).

Thus defective area of the substrate (gang substrate) as previously specified in advance before loading to the surface mounting machine, trouble of specifying a defective area in the surface mounting machine (time) eliminates, correspondingly Thus, it is possible to promptly proceed with the component mounting process. In addition, since the tact time of the coating apparatus is usually shorter than that of the surface mounter, it is possible to rationally reduce the work load of the surface mounter by increasing the work load of the coating apparatus as described above. . Further, by recording information indicating the position of the defective area on the substrate by applying a coating solution that is normally provided in the coating device to the substrate, there is no need to provide a special recording mechanism in the coating device. It is possible to prevent the device from becoming complicated.

In this method, a predetermined area, sets a marking location and the predetermined reference position in the sequence corresponding to each area of the multi-surface substrate, the marking position and the reference position corresponding to the defective area, by coating solution It is preferable to carry out marking (Claim 2 ). Thereby, the information regarding the defective area can be accurately read in the surface mounter.

On the other hand, the component mounting system according to the present invention includes a coating apparatus that applies a coating solution to a multi-sided substrate, using a multi-sided substrate having a plurality of areas in which circuits that are independent from each other are formed, and the substrate after the application. A component mounting system including at least a surface mounter for mounting components on the substrate, wherein the coating device is movable relative to the multi-sided substrate, and a substrate imaged by the camera Identification means for identifying a defective area that does not require mounting processing among the plurality of areas based on the image data, and information indicating the position of the defective area identified by the identification means is a predetermined area outside the area occupation area of the substrate while and a marking means for recording while aggregated, wherein the surface mounting machine, which is recorded in the multi-substrate by the marking means A camera for board imaging for collectively imaging the distribution, and control means for controlling the component mounting operation to apply the process of mounting components to an area other than the defective area based on the information captured by the camera (Claim 3 ).

According to this component mounting system, a substrate (multiple substrate) is imaged by a camera provided in the coating apparatus, and a defective area is specified based on the image data. Then, information indicating the position of the defective area is recorded in a state of being collected in a predetermined area outside the area occupation area of the substrate by the marking unit of the coating apparatus. On the other hand, substrate recording information is collectively imaged by a substrate imaging camera of the surface mounter, and the component mounting operation is controlled by the control means based on the imaged recording information. Therefore, in the component mounting system, the substrate processing method according to claims 1 and 2 is embodied.

According to the substrate processing method according to claims 1 and 2 of the present invention and the component mounting system according to claim 3, it is possible to save time (time) for identifying a defective area that does not need to be processed in a processing apparatus such as a surface mounter. Thus, the tact time of the processing apparatus when producing a multi-sided substrate can be effectively shortened.

  A preferred embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 schematically shows a mounting line which is a component mounting system according to the present invention (a component mounting system to which the substrate processing method for components according to the present invention is applied). This line includes a loader 1, a dispenser (coating apparatus, processing apparatus) 2, a first surface mounting machine (processing apparatus) 3, a second surface mounting machine (processing apparatus) 4, a third surface mounting machine (processing) from the upstream side. Apparatus) 5, a reflow furnace 6 and an unloader 7 are arranged in series. Then, while sequentially feeding out a printed board (hereinafter simply referred to as a board) from the loader 1, various coating liquid coating, component mounting (mounting), and coating liquid curing processes are sequentially performed on the board and taken out to the unloader 7. Has been.

  Each of the devices 1 to 7 is an autonomous device provided with the control devices 1A to 7A, and each of the devices 1 to 7 is individually controlled by the control devices 1A to 7A.

  2 and 3 schematically show the dispenser 2, FIG. 2 is a plan view with the cover removed, and FIG. 3 shows the dispenser 2 in the same front view.

  As shown in these drawings, a pair of conveyors 12 are arranged on the base 11 of the dispenser 2, and the substrate P is transported on these conveyors 12 and stopped at a predetermined work position. Positioning is performed by a substrate holding means such as an up pin or a substrate clamping device. In the following description, the conveyance direction of the substrate P by the conveyor 12 is the X axis direction, the direction orthogonal to the X axis on the horizontal plane is the Y axis direction, and the direction orthogonal to the X axis and the Y axis is the Z axis direction. I will proceed.

  The pair of conveyors 12 is connected to an interval adjusting mechanism using a motor as a drive source, and is located on one side of the conveyor 12, specifically on the rear side of the apparatus (upper side in FIG. 2) by the operation of the motor. 12 is in contact with and away from the front conveyor 12, whereby the distance between both conveyors 12 is adjusted according to the size of the substrate P.

  Above the conveyor 12 is equipped with a head unit 14 equipped with a dispense head for applying various coating solutions such as adhesives and cream solder onto the substrate P. The head unit 14 is arranged in the X-axis direction and the Y-axis direction. Is supported so as to be movable.

  That is, a pair of fixed rails 15 extending in the Y-axis direction and a ball screw shaft 16 that is driven to rotate by a Y-axis servomotor 17 are disposed on the base 11, and a head support is provided on the fixed rail 15. A member 18 is disposed, and a nut portion 19 provided on the head support member 18 is screwed onto the ball screw shaft 16. The head support member 18 is provided with a guide member 20 extending in the X-axis direction and a ball screw shaft 21 driven by an X-axis servo motor 22 so that the head unit 14 can move to the guide member 20. The nut portion 23 provided on the head unit 14 is screwed onto the ball screw shaft 21. The ball screw shaft 16 is rotated by the operation of the Y-axis servo motor 17 and the head support member 18 is moved in the Y-axis direction, while the ball screw shaft 21 is rotated by the operation of the X-axis servo motor 22. The head unit 14 moves in the X-axis direction with respect to the head support member 18.

  The head unit 14 is equipped with two dispense heads 25A and 25B (hereinafter abbreviated as heads 25A and 25B) for applying the coating liquid onto the substrate P, and a substrate recognition camera 28 (see FIG. 6). It is installed.

  The heads 25A and 25B are mounted on the head unit 14 in a state where they are aligned in the X-axis direction. The head unit 14 can be moved in the Z direction (vertical direction) and rotated around the R axis (vertical axis) with respect to the frame of the head unit 14 and driven by the Z axis servo motor 26 and the R axis servo motor 27, respectively. It has become.

  Each of the heads 25A and 25B includes a syringe 34 containing a coating liquid and a nozzle 30 for applying the coating liquid stored in the syringe 34, and the syringe 34 is supplied by an air pressure supply unit (not shown). By supplying the air pressure therein, an amount of coating liquid corresponding to the air pressure is applied onto the substrate P while being pushed out to the tip of the nozzle 30.

  The syringe 34 is, for example, a translucent shaft-like cartridge container, and is inserted into a cylindrical mounting portion 32 (shown in FIG. 3) provided in the heads 25A and 25B. In this state, the syringe 34 is clamped by clamping means not shown. Thus, the heads 25A and 25B are detachably mounted.

  The substrate recognition camera 28 is not shown in detail, but is composed of, for example, a CCD area camera, for identifying (specifying) various marks attached to the substrate P, such as fiducial marks for position recognition and the substrate P. The identification mark or the bad mark for each area is fixed downward with respect to the head unit 14, that is, in a state in which the imaging direction is downward.

  With the above configuration, in the dispenser 2, the substrate P carried on the base 11 is fixed at a predetermined working position, and after applying the coating liquid onto the substrate P by driving the head unit 14 in this state, P is carried out of the apparatus. Detailed application operations will be described later.

  4 and 5 schematically show the first surface mounter 3, wherein FIG. 4 is a plan view with the cover removed, and FIG. 5 shows the first surface mounter 3 in the same front view. ing.

  As shown in the figure, a conveyor 52 extending in the X-axis direction is disposed on the base 51 of the first surface mounting machine 3, and the substrate P is transported to the conveyor 52 to receive a predetermined mounting work position (the position shown in the figure). ) Is stopped. Although not shown, a positioning mechanism for the board P is provided at the mounting work position. When the board P is loaded along the conveyor 52, the positioning mechanism is activated to bring the board P to the mounting work position. It is comprised so that positioning may be fixed.

  Component supply units 54 are arranged on both sides of the conveyor 52, and multiple rows of tape feeders 54a capable of supplying small chip components such as ICs, transistors, and capacitors are arranged in these component supply units 54. Yes.

  Above the base 51, a component mounting head unit 56 is provided. The head unit 56 is movable over the component supply unit 54 and the substrate P at the mounting work position, and can move in the X-axis direction and the Y-axis direction.

  That is, a fixed rail 57 in the Y-axis direction and a ball screw shaft 58 that is rotationally driven by a Y-axis servomotor 59 are disposed on the base 51, and a support member for the head unit 56 is disposed on the fixed rail 57. 61 is disposed, and a nut portion 62 provided on the support member 61 is screwed onto the ball screw shaft 58. The support member 61 is provided with a guide member 63 in the X-axis direction and a ball screw shaft 64 driven by an X-axis servo motor 65, and the head unit 56 is held movably on the guide member 63. A nut portion (not shown) provided on the head unit 56 is screwed onto the ball screw shaft 64. The support member 61 is moved in the Y-axis direction by the operation of the Y-axis servo motor 59, and the head unit 56 is moved in the X-axis direction with respect to the support member 61 by the operation of the X-axis servo motor 65. ing.

  A plurality of mounting heads 66 for component mounting are mounted on the head unit 56, and in this embodiment, six mounting heads 66 are mounted in a line at equal intervals in the X-axis direction. . Each mounting head 66 can move in the Z-axis direction and rotate around the R-axis (nozzle center axis) with respect to the frame of the head unit 56, and is driven by a lift drive mechanism and a rotation drive mechanism (not shown). It is like that. Each mounting head 66 has a nozzle 66a attached to the tip (lower end) of the mounting head 66, and negative pressure is supplied to the tip of the nozzle 66a from a negative pressure supply means (not shown) so as to suck and hold the components. It has become.

  A substrate recognition camera 67 is further mounted on the head unit 56. The substrate recognition camera 67 is composed of a CCD camera or the like equipped with an illumination device, and images various marks on the substrate P positioned at the mounting work position as the head unit 56 moves. .

  A component recognition camera 68 is disposed on the base 51. Similarly to the board recognition camera 67, the component recognition camera 68 is also composed of a CCD camera or the like equipped with an illuminating device, and picks up the parts adsorbed by the mounting heads 66 of the head unit 56 from below. It is supposed to be.

  With the configuration as described above, in the first surface mounter 3, the component unit is supplied by each mounting head 66 while the head unit 56 moves between the component supply unit 54 and the substrate P positioned at the mounting operation position. A component is sucked from the portion 54, and the sucked component is transported and mounted on the substrate P. Detailed mounting operation will be described later.

  The above is the configuration of the first surface mounter 3, but the second surface mounter 4 and the third surface mounter 5 are also configured in substantially the same manner as the first surface mounter 3.

  On the other hand, although illustration is omitted about the reflow furnace 6, for example, it has a conveyer for board transportation, a hot air blower, and the like. It is configured to be cured and to fix the component on the substrate P.

  Next, the control system of the dispenser 2 and the surface mounters 3 to 5 will be described with reference to FIG.

  This figure shows only the functional components related to the present invention among the functional components of the control devices 2A to 5A of the dispenser 2 and the surface mounters 3 to 5 in a block diagram. The functional configurations of the control devices 2A to 5A are basically the same. Therefore, in the following description, both functional configurations will be described with reference to the same drawing in order to avoid redundant description, and particularly distinguished from each other. When it is necessary to do so, the functional configuration of the surface mounters 3 to 5 is distinguished by using a symbol with a dash (').

  Each of the control devices 2A to 5A shown in the figure includes a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU in advance, and a RAM that temporarily stores various data during the coating operation. It comprises an HDD or the like for storing various data and software, and includes a main control means 71, a program storage means 72, various data storage means 73, an image processing means 74, and an actuator control means 75 as its functional configuration. .

  The main control means 71 comprehensively controls the drive of each device so as to proceed with a series of work (coating work or parts mounting work) in accordance with the program stored in the program storage means 72, and various types of work accompanying the work. Performs arithmetic processing.

  The main control means 71 of the dispenser 2 recognizes (specifies) the presence or absence of a bad mark formed on the multi-sided substrate, the area where the mark is formed (defective area), etc. based on the image data of the substrate recognition camera 28. In this embodiment, the main control means 71 functions as the “specifying means” according to the present invention.

  The program storage means 72 stores various programs relating to the application work or the mounting work as described above.

  The various data storage means 73 stores various data necessary for work with the dispenser 2 and the surface mounters 3 to 5. For example, the various data storage means 73 of the dispenser 2 includes substrate-related data (substrate type, coating position coating data, coating area data, coordinate position data of various marks formed on the substrate, shape data, etc.). On the other hand, in the various data storage means 73 ′ of the surface mounters 3 to 5, component related data (component type, shape, dimensions, etc.) and board related data (board type, component mounting position data) Mounting area data, coordinate position data of various marks formed on the substrate, shape data, etc.) are stored.

  The image processing means 74 performs predetermined image processing on the image data output from each camera, and the main control means 71 performs fiducial marks formed on the target substrate based on this image data. Recognition of identification marks, bad marks, etc., and various determinations and calculations based on the recognition are performed.

  The actuator control means 75 drives and controls actuators such as servo motors that drive the conveyor 12, the head unit 14, and the heads 25A and 25B.

  In particular, when the substrate to be processed P is a multi-planar substrate, the actuator control means 75 of the dispenser 2 is based on the result of recognition of the defective area by the main control means 71 (so-called discarding). In this embodiment, the actuator control means 75 controls the “marking” according to the present invention to record (apply) the information obtained by collecting the recognition results in a predetermined area a of the substrate). Functions as a means.

  Here, the outline of the information recording method by the actuator control means 75 will be described together with the configuration of the multi-sided substrate.

  FIG. 7 schematically shows an example of a so-called multi-sided substrate P.

  The multi-sided board P includes, for example, a plurality of areas (12 areas E1 to E12 in the illustrated example) in which the same circuit is formed, and the coating liquid coating process and the component mounting process are performed as a single board. After the application, each of the areas E1 to E12 is separated and used individually. A pair of fiducial marks M1 (referred to as FID marks M1) for recognizing the position is formed on the substrate P, and the areas E1 to E12 are formed by the dispenser 2 and the surface mounters 3 to 5. Fiducial marks M2 (referred to as FID marks M2) for increasing the mounting accuracy are individually formed. Further, for a defective area having a serious defect that cannot be mounted, such as a circuit being damaged, a bad mark M3 for identifying the defective area and omitting the mounting process in each of the surface mounters 3 to 5 is provided. It is formed at a specific position in the area. The bad mark M3 is formed only in defective areas having defects in the areas E1 to E12. In the figure, the bad marks M3 are formed in the areas E6, E8, and E9 as an example. Show.

  In the dispenser 2, as will be described in detail later, the image picked up by the board recognition camera 28 is processed by the image processing means 74, and the main control means 71 recognizes (identifies) the area where the bad mark M3 is formed. . Then, the recognition result information of the area (defective area) recognized by the main controller 71 is recorded in a predetermined area a outside the area occupation area of the substrate P.

  FIG. 8 is an enlarged view of the area a in FIG.

  That is, in this embodiment, marking positions are set in a predetermined region a in a matrix arrangement corresponding to the areas E1 to E12 of the multi-sided substrate P in a substantially similar shape, and markings corresponding to the defective areas E6, E8, and E9. The recognition result information of the defective areas E6, E8, and E9 is collectively recorded on the substrate P by applying the mark M11 with the coating liquid to the position. Further, in the predetermined area a, a reference mark M12 for enhancing the recognition (confirmation) accuracy of the mark M11 by the dispenser 2 and the surface mounters 3 to 5 is also formed by applying the coating liquid. The area a in which such defective area recognition result information is recorded is large enough to be recognized by the board recognition cameras of the surface mounters 3 to 5 collectively.

  Next, application | coating operation | movement control of the dispenser 2 by 2A of control apparatuses, and mounting operation control of the surface mounting machines 3-5 by 3 A-5A of control apparatuses are demonstrated using a flowchart. In the following description, the multi-planar substrate P is described as being processed.

  FIG. 9 is a flowchart showing the application operation control of the dispenser 2 by the control device 2A. When production is started in the dispenser 2, first, a program corresponding to the substrate to be processed P (substrate P to be coated) is selected from the production program stored in the program storage means 72 and the substrate related data. The preparation of the coating process, that is, the setup is started with reference to FIG. For example, on the basis of the size data of the substrate P, a motor for adjusting the interval of the conveyor 12 is operated, thereby adjusting the interval of the conveyor 12. Thereafter, the conveyor 12 is driven to carry the substrate P from the loader 1 onto the base 11 and to be fixed at a predetermined work position (step S1).

  Next, the head unit 14 is moved above the substrate P from a predetermined home position outside the application work area, and the coordinate positions of the marks M1 and M3 on the substrate P are sequentially imaged by the substrate recognition camera 28 and imaged by the image processing means 74. By performing the processing, the main control means 71 recognizes the FID mark M1 and the bad mark M3 (step S2).

  Based on the recognition result of the bad mark M3 by the main control means 71, specifically, the recognition result of the presence or absence of the bad mark M3 in each of the areas E1 to E12, the actuator control means 75 drives and controls the actuator of each motor. The recognition result information is recorded on the predetermined area a on P, that is, the mark M11 and the reference mark M12 are applied by the application liquid (step S3). In this embodiment, the areas E6, E8, E9 having the bad mark M3 correspond to the defective area according to the present invention, and the recognition result information on the presence / absence of the bad mark is information indicating the position of the defective area according to the present invention. Equivalent to.

  Next, the region a on the substrate P is imaged by the substrate recognition camera 28 and image processing is performed by the image processing unit 74, whereby the main control unit 71 determines whether or not there are bad marks for all the areas E1 to E12 in the region a. It recognizes based on information, and confirms that this recognition result and the recognition result of the presence or absence of the bad mark of each area initially acquired by step S2 correspond (step S4).

  Next, the heads 25A and 25B are moved to the application positions on the substrate P while moving the head unit 14, and a predetermined amount of application liquid is applied to the corresponding application positions (step S5). At this time, based on the recognition result of the bad mark M3 in step S2, the coating operation may be performed only on an area where the bad mark M3 is not recognized. This is because there is no need for a coating operation because parts are not mounted in the area where the bad mark M3 is recognized.

  Then, when the application of the application liquid is completed for all application positions on the substrate P, the fixed state of the substrate P on the base 11 is released and the conveyor 12 is driven, whereby the substrate P is unloaded from the dispenser 2. Thus, the coating process for the series of substrates P is completed (step S6).

  In addition, you may perform the following application | coating inspections after the application | coating process of said step S5.

  That is, a coating inspection by image recognition is performed for each coating position on the substrate P. Specifically, the head unit 14 is driven, and each application position is imaged while the substrate recognition camera 28 is sequentially moved to each application position for each of the areas E1 to E12 of the substrate P. At this time, based on the recognition result of the bad mark M3 in step S2, only the application position belonging to the area where the bad mark M3 is not recognized is imaged.

  When imaging of the application position belonging to each area other than the area where the bad mark M3 is recognized in this way, the application state is inspected for each of the areas E1 to E12 by the main control means 71 based on the image data, and the main control means. The inspection result information at 71 is additionally recorded in the area a of the substrate P, that is, the mark M11 is applied by the coating liquid at the marking position corresponding to the area where there is a coating defect. In this case, the defective application area corresponds to the defective area according to the present invention, and the inspection result information corresponds to information indicating the position of the defective area according to the present invention.

  FIG. 10 is a flowchart showing the mounting operation control of the first surface mounter 3 by the control device 3A. When production is started in the first surface mounting machine 3, the conveyor 52 is driven, and the substrate P that has been applied by the dispenser 2 is carried into the apparatus and positioned at the mounting work position. Then, the head unit 56 is driven, and the substrate recognition camera 67 images and recognizes the FID marks M1 and M2 on the substrate P, whereby the positional deviation of the substrate P is obtained and the correction data is obtained from the main control means 71 '. (Steps S21 and S22). At this time, the bad mark M3 is not imaged and recognized.

  When the recognition of the FID marks M1 and M2 is completed, the head unit 56 is driven, and the bad mark recognition result information recorded (applied) on the region a on the substrate P is collectively imaged by the substrate recognition camera 67. Then, the main control means 71 ′ recognizes the presence or absence of the bad mark M3 related to the substrate P (step S23). Based on the recognition result, component mounting processing is executed in accordance with the processing of the following steps S24 to S28. That is, the head unit 56 and the like are driven and controlled by the main control means 71 'so that components are mounted only in the area where the bad mark M3 is not recognized among the areas E1 to E12 of the substrate P (referred to as an effective area).

  First, the head unit 56 is moved to the component supply unit 54, and components are taken out by the mounting heads 66 (step S24). Specifically, the head unit 56 is moved above the component supply unit 54, and a predetermined mounting head 66 on which the component is to be sucked is moved up and down to pick up the component while being picked up from the tape feeder 54a. At this time, if possible, the components are picked up simultaneously by a plurality of mounting heads 66.

  When the suction of the components by all the mounting heads 66 is completed, the head unit 56 is moved above the component recognition camera 68 to image the suction components by the mounting heads 66. The suction state is recognized (step S25).

  Then, after moving the head unit 56 onto the substrate P and disposing it above the first component mounting position, the suction component is mounted on the substrate P by raising and lowering the mounting head 66 (step S26). When the first component is mounted in this way, each suction component is sequentially mounted on the substrate P by moving the head unit 56 to the next mounting position. At this time, the component is accurately mounted at each mounting position by correcting the target movement position of the head unit 56 based on the recognition result in step S25.

  When the mounting of the suction parts by the mounting heads 66 is completed in this way, it is determined whether or not all the parts have been mounted, that is, whether or not all the parts have been mounted in the effective area (step S27). If NO is determined here, the process returns to step S24, the head unit 56 is moved to the component supply unit 54, and component adsorption, component recognition, and component mounting processes are repeatedly executed.

  In contrast, if YES is determined in step S27, the conveyor 52 is driven to carry the substrate P out of the apparatus (step S28), thereby ending a series of mounting processes on the substrate P.

  The above is an example of the mounting operation control of the first surface mounter 3 by the control device 3A, but the mounting operation control of the second surface mounter 4 and the third surface mounter 5 by the control devices 4A and 5A is the same. Done.

  As described above, in this component mounting system, the surface mounter is disposed on the downstream side of the dispenser 2 after first applying the coating process to the substrate P while conveying the multi-sided board P. In this component mounting system, the dispenser 2 recognizes the presence or absence of the bad mark M3 on the substrate P in advance, and as a result, the information on the result is determined on the substrate P. By collecting and recording in the area a, the surface mounters 3 to 5 do not capture and recognize the presence or absence of the bad mark M3 by the board recognition camera 67 for all the areas E1 to E12, but in the predetermined area a on the board P. In the surface mounters 3 to 5, since the information collected and recorded can be collectively read by the substrate recognition camera 67, the mounting work can be advanced. You can shorten the recognition processing Ddomaku M3, which makes it possible to shorten the tact time of each surface mounter 3-5.

  Hereinafter, the above effect will be described more specifically. FIG. 11 is a comparison diagram of the tact time of the component mounting system according to the present invention and the tact time of the conventional component mounting system. That is, as shown in FIG. 11, in this component mounting system (example), after the dispenser 2 recognizes the presence or absence of the bad mark M3 on the board P, the recognition result information is collected and recorded on the board P. In addition, since the recorded information is experimentally recognized to confirm the validity of the recorded information, the working time T1 of the dispenser 2 is equal to the working time T2 of the dispenser in the conventional component mounting system (comparative example). In the component mounting system according to the embodiment, the mounting operation is performed by collectively reading the information recorded on the substrate P in the surface mounting machines 3 to 5 in each of the surface mounting machines. The work time T3 of 3 to 5 is significantly shorter than the work time T4 of each surface mounter in the component mounting system of the comparative example. Therefore, the total time required for a series of operations of the component mounting system can be shortened.

  In particular, compared to the tact time of the surface mounters 3 to 5 that mount a large number of components on the substrate P while reciprocating between the component supply unit 54 and the substrate P many times, the coating liquid is applied to the substrate P. Since the tact time of the dispenser 2 that performs the application is normally shortened, each surface can be rationally reduced by causing the dispenser 2 to perform the image recognition processing of the bad mark M3 and reducing the work load of the surface mounters 3 to 5 as described above. The tact time of the mounting machines 3 to 5 can be shortened. As a result, the tact times of the devices 2 to 6 can be well balanced, and the throughput of the component mounting system can be improved.

  Further, since the information indicating the position of the defective area is recorded on the substrate P by applying the coating liquid that is always provided in the dispenser 2 to the substrate P, it is not necessary to provide the dispenser 2 with a special recording mechanism. Can be prevented from becoming complicated.

  The component mounting system described above is an example of a preferred embodiment of the component mounting system according to the present invention (the component mounting system to which the substrate processing method according to the present invention is applied), and its specific configuration, for example, Specific configurations and the like of each dispenser 2 and surface mounters 3 to 5 can be appropriately changed without departing from the gist of the present invention.

  For example, in the above-described embodiment, the “processing device” included in the component mounting system of the present invention has been shown as applied to the surface mounters 3 to 5 installed on the downstream side of the dispenser 2, but not limited thereto, In a component mounting system in which an inspection device is provided between the dispenser 2 and the surface mounter 3, the “processing device” can be applied to the inspection device. Further, when the component mounting system is additionally provided with a marking device that records the position information of the defective area on the substrate, the “processing device” can also be applied to the dispenser 2.

  Further, in the dispenser 2 of the embodiment, marking positions are set in a matrix arrangement corresponding to the areas E1 to E12 of the multi-sided substrate P in a substantially similar shape within the predetermined area a to correspond to the defective areas E6, E8, and E9. The recognition result information of the defective areas E6, E8, E9 is collected and recorded on the substrate P by applying the mark M11 with the coating liquid to the marking positions to be performed, but the present invention is not limited to this. As shown, a marking position that can uniquely identify the area numbers (1 to 12) of the areas E1 to E12 of the substrate P is set, and the mark M11 by the coating liquid is applied to the marking position corresponding to the defective area. It may be. That is, as shown in FIG. 12, the area number of each defective area may be represented in, for example, a 5 × 5 matrix with the upper left being “1”, or as shown in FIG. May be represented by binary numbers, and each may be listed in the vertical direction (or in the horizontal direction).

  Further, in the dispenser 2 of the embodiment, after the substrate P is carried on the base 11 and fixed in the application operation control, the bad mark M3 is recognized immediately and the recognition result information is recorded on the substrate P. However (steps S2 and S3 in FIG. 9), these operations may be performed immediately after the application process to the areas E1 to E12 of the substrate P is completed. Specifically, after carrying in and fixing the substrate P, only the FID mark M1 is image-recognized, and then the coating operation is performed. After the coating is completed, the bad mark M3 is recognized and the recognition result information is recorded. To do. In short, the bad mark M3 may be recognized at an advantageous timing in terms of tact time in relation to the specific configuration of the dispenser 2 and the application operation.

1 is a schematic front view showing an example of a component mounting system according to the present invention (a component mounting system to which a substrate processing method according to the present invention is applied). 2 is a schematic plan view showing a dispenser. It is a front schematic diagram showing a dispenser. It is a top view which shows the 1st surface mounting machine which comprises a component mounting system. It is a front view which shows a 1st surface mounting machine. It is a block diagram which shows the control system of a dispenser and a surface mounting machine. It is a top view which shows an example of a structure of a multi-sided board | substrate. It is the elements on larger scale which show the area | region a of FIG. It is a flowchart figure which shows an example of application | coating operation control in a dispenser. It is a flowchart figure which shows an example of the mounting operation control in a 1st surface mounting machine. It is a comparison figure of the tact time of the component mounting system which concerns on this invention, and the tact time of the conventional component mounting system. It is the elements on larger scale which showed the modification of the recognition result information of the defective area formed in the area | region a of FIG. It is the elements on larger scale which showed the modification of the recognition result information of the defective area formed in the area | region a of FIG.

Explanation of symbols

1 Loader 2 Dispenser (coating device, processing device)
3 First surface mounter (processing equipment)
4 Second surface mounter (processing equipment)
5 Third surface mounter (processing equipment)
6 Reflow furnace 7 Unloader

Claims (3)

Using component mounting system comprising a surface mounter which the coating liquid and the coating apparatus for applying a coating liquid to the substrate for mounting components on the substrate that has been coated, a plurality of areas which a circuit is formed which independently of one another A method of mounting a component on a multi-sided board having
Together examine in the coating apparatus a substrate processing unnecessary defective area among the areas of the multi-substrate, by the application device, information indicating a position of the defective area by using the coating liquid of the multi-substrate area record in a state of aggregated into a predetermined area outside the occupied area, the surface mounter collectively imaging the information recorded in the predetermined area in, by Rukoto be recognized, based on the information, the defective area A substrate processing method comprising mounting a component in an area other than the above. In the predetermined area, said setting the marking position and a predetermined reference position in the sequence corresponding to each area of the multi-faced substrate, in said reference position and the marking position corresponding to the defective area, the marking by coating solution The substrate processing method according to claim 1, wherein the substrate processing method is performed. At least a coating apparatus that applies a coating solution to a multi-sided substrate having a plurality of areas in which circuits independent from each other are formed as a substrate to be processed, and a surface mounter that mounts components on the substrate after the coating is provided. Component mounting system,
The coating apparatus includes a substrate imaging camera that is movable relative to the multi-sided substrate, and a defective area that does not require a mounting process among the plurality of areas based on image data of the substrate imaged by the camera. A marking means for recording the information indicating the position of the defective area identified by the identification means in a state of being collected in a predetermined area outside the area occupation area of the substrate,
The surface mounting apparatus includes a camera for board imaging for collectively imaging the information recorded on the multi-substrate by the marking means, to areas other than the defective area based on the information captured by the camera And a control means for controlling a component mounting operation so as to perform component mounting processing.

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