JP4824739B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting an electronic component on a substrate.

  Conventionally, a component is mounted on a substrate by taking out an electronic component from a component supply unit by the head while relatively moving a component mounting head and a substrate (printed wiring board (PWB)). A mounting device is known.

  In this type of component mounting apparatus, it is empirically known that a drive error occurs over time due to aged deterioration of a drive mechanism portion for moving the head and the substrate relative to each other. In order to stably manufacture electronic component mounting boards (PCBs) with high mounting accuracy over a long period of time, such drive (movement) errors are periodically checked for component mounting operation control. It is necessary to reflect this, and an invention in view of this point is disclosed in Patent Document 1.

In this document 1, a reference board on which a plurality of marks are written in a matrix is arranged at a mounting work position, and a component is actually mounted on each mark of the reference board, and each mounted component is image-recognized. A method of calculating an error between each component and a mark, that is, a component mounting error (deviation) due to a head movement error, and correcting a mounting position of the component by the head based on the mounting error data during board production ( A component mounting apparatus) is disclosed.
JP 2006-108457 A

  However, in the method of Patent Document 1, the above-described program, that is, mounting of a component, image recognition of a mounted component, and calculation of a mounting error (referred to as data acquisition operation) are executed in a state where a dedicated reference board is placed at a mounting work position. Since it is necessary, the acquisition of the mounting error data is inevitably an off-line operation, which is difficult to carry out during the production of the substrate.

  Therefore, even if a component mounting failure is found by sampling inspection etc., if a board is being produced, the cause of the defect can be verified by executing a data acquisition operation, or the result can be used for the ongoing board production. It was impossible to reflect it. On the other hand, when it is necessary to urgently obtain the mounting error data, it is necessary to take the apparatus off-line once, which has the disadvantage that productivity is hindered.

  The present invention has been made in view of such circumstances, and detects a component mounting error caused by a drive error such as a head without impairing the productivity of the substrate, and promptly produces the result. This is intended to be reflected in (mounting work).

In order to solve the above-described problems, the present invention provides a transport unit that transports a substrate to be mounted in a specific direction, a component supply unit that supplies components to be mounted on the mount substrate, and a substrate transport by the transport unit. In a component mounting apparatus comprising: a component mounting head having a position in the middle of a path as a mounting work position and taking out a component from the component supply unit and mounting the component on a mounted substrate placed at the mounting work position; A moving means for moving the head relatively in the horizontal direction and the vertical direction with respect to the mounting substrate disposed at the mounting work position, and a component of the mounting substrate disposed outside the transport path A simulation mounting table having a mounting surface on which components can be mounted located at the same height as the mounting surface, an imaging means for imaging a component mounted on the simulation mounting table, and an imaging means And calculating means for determining the mounting errors of components for a given target position based on the image, and correcting means for correcting the mounting coordinate of the component by the head based on the mounting error, and mounting components on the simulated mounting table Control means for controlling the moving means to execute a predetermined mounting error acquisition operation for obtaining the mounting error by imaging the component by the imaging means, and the control means is provided on the mounted substrate. The moving means is controlled to execute a predetermined component mounting operation for mounting a component, and during the component mounting operation, the mounting error acquisition operation is performed using the component taken out from the component supply unit by the head. The parts on the substrate to be mounted according to the mounting coordinates corrected by the correction means based on the mounting error acquired by the mounting error acquisition operation A shall be controlling said moving means so as to mount the.

According to this component mounting apparatus, a component is mounted on a simulation mounting table provided outside the component mounting surface of the substrate to be mounted that is disposed at the mounting work position, and a mounting error is determined based on image recognition of the component. Therefore, it is possible to execute the mounting error acquisition operation without difficulty even when the mounted substrate is arranged at the mounting work position. In particular, since the mounting surface of the mock mounting table is located at the same height as the component mounting surface of the substrate to be mounted, it is possible to reproduce the mounting status of components equivalent to the actual component mounting operation in the mounting error acquisition operation. Yes, which improves the reliability of the required mounting error. In particular, during board production (part mounting operation), the mounting error acquisition operation is executed using the components mounted on the board to be mounted, and the results can be immediately reflected in the production of the board. It becomes. That is, when the mounting error acquisition operation is executed and the mounting error is obtained, the component mounting coordinates are corrected based on the mounting error, and the subsequent component mounting operation is executed. As a result, the mounting error obtained based on the mounting error acquisition operation is reflected in the production of the board.

In the component mounting apparatus further comprising, said correcting means storing means for updating storage of mounting errors obtained by said calculation means, mounting of components by the head based on the mounting error stored in the storage means correcting the coordinates, before Symbol control means, you execute the mounting error acquisition operation by using the components above every predetermined number and a plurality of parts previously determined a component mounted on the mounting substrate may I Monodea.

Also, the component mounting apparatus is provided with a suction holding means for holding the components placed on the simulated mounting table in a state adsorbed on the table.

  According to this device configuration, the components mounted on the simulation mounting table can be stably held, which is advantageous in improving the reliability of the acquired mounting error.

On the other hand, according to the component mounting method of the present invention, the substrate to be mounted that is transported in a specific direction by the transport unit is disposed at a mounting work position that is determined in the middle of the substrate transport path by the transport unit , and is mounted on the substrate to be mounted. in parts component mounting method for mounting the component on the object to be mounted on a substrate Remove the device by the head of the mounting components from supplying component supply section for the part taken out from the component supply unit by said head, said a simulated mounting step of mounting tower on simulated mounting table comprising a mounting surface capable component mounting which is arranged outside and located at the same height as the component mounting surface of the object mounting substrate transport path, said at this step An error calculation step for obtaining a component mounting error with respect to a predetermined target position by imaging and recognizing the component mounted on the simulation mounting table by an imaging means, and in this step A substrate manufacturing step of mounting a component to be mounted on a substrate by the head based on the meta mounting error in terms of correcting the mounting coordinates of the components, is intended to include.

  According to this component mounting method, it is possible to quickly reflect the result in the production of the substrate while detecting the component mounting error due to the movement error of the head or the like.

  As described above, according to the present invention, a mounting error acquisition operation for obtaining a mounting error of a component due to a movement error of a head or the like is easily performed in an inline state in which a mounted substrate is arranged at a mounting work position. It becomes possible to do. Therefore, the mounting error can be detected without impairing the productivity of the board, and the result can be promptly reflected in the production (mounting work) of the board.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings.

  1 and 2 show a schematic configuration of a component mounting apparatus according to the present invention. FIG. 1 is a plan view and FIG. 2 is a front view showing the component mounting apparatus. In these drawings, XYZ rectangular coordinate axes are shown in order to clarify the directional relationship between the drawings.

This component mounting apparatus includes a substrate transfer mechanism 2 (corresponding to the transfer means of the present invention) on a base 1. The substrate transport mechanism 2 includes a pair of conveyors 2a and 2b, and a printed wiring board (PWB) is referred to as a substrate P by the conveyors 2a and 2b.
Is conveyed in a predetermined conveyance direction (in the example of FIG. 1, from the right side to the left side). Then, the middle of the transport path constituted by the conveyors 2a and 2b is set as a mounting work position (the position of the substrate P shown in FIG. 1), and the conveyors 2a and 2b carry the substrate P into the mounting work position from the right side of the apparatus. After the mounting work is completed, the substrate P is transferred from the mounting work position to the left side of the apparatus.

  A support device (not shown) is provided below the mounting work position in the transport path. This support device includes a support member having a plurality of support pins so that it can be moved up and down, and the substrate P is positioned and fixed in a state where the substrate P is lifted from the conveyors 2a and 2b.

  Of the conveyors 2a and 2b, the conveyor 2a positioned on the front side of the apparatus (lower side in FIG. 1) is fixed on the base 1 (referred to as a fixed conveyor 2a as appropriate), and the conveyor 2b positioned on the rear side of the apparatus. Is provided so as to be displaceable in the Y-axis direction with respect to the fixed conveyor 2a (appropriately referred to as a movable conveyor 2b), and is driven by a screw feed mechanism using a motor as a drive source. That is, the board | substrate conveyance mechanism 2 becomes a structure which can change the space | interval of both the conveyors 2a and 2b according to the size of the board | substrate P on the basis of the fixed conveyor 2a.

  On both front and rear sides of the substrate transport mechanism 2, component supply units 3 and 4 that supply electronic components to be mounted on the substrate P are provided.

  Among these component supply units 3 and 4, the component supply unit 3 located on the front side (lower side in FIG. 1) of the substrate transport mechanism 2 includes small pieces of integrated circuits (ICs), transistors, resistors, capacitors, and the like. A plurality of tape feeders 3a for supplying chip electronic components are arranged in parallel. Each tape feeder 3a holds a reel (not shown) on which a tape containing electronic components is wound, and each tape feeder 3a takes out the component in the vicinity of the fixed conveyor 2a while feeding the tape from the reel. Supply electronic components to the position.

  On the other hand, a pair of tray feeders 4a for supplying large electronic components such as SOP (Small Outline Package) and QFP (Quad Flatpack Package) are arranged in parallel in the component supply unit 4 located on the rear side of the substrate transport mechanism 2. It is installed. Each tray feeder 4a includes a tray storage unit 5 including a plurality of pallets 5a for holding a tray T on which electronic components are placed, a tray pulling mechanism 6 for pulling out the tray T in the tray storage unit 5, and the like. A desired tray T is arranged at a predetermined height position while moving the tray storage unit 5 up and down, and the tray T is pulled out to the front of the tray storage unit 5 together with the pallet 5a by the tray pulling mechanism. 2b is arranged at a predetermined part take-out position in the vicinity of 2b (the position of the tray T shown by a solid line).

  Above the base 1, a head unit 7 is disposed for transporting and mounting (mounting) electronic components supplied by the feeders 3 a and 4 a onto the substrate P.

  A plurality of shaft-like heads 8 for component mounting are mounted on the head unit 7. In this embodiment, the six heads 8 are mounted in a line at equal intervals in the X-axis direction. Has been. At the tip (lower end) of each head 8, a component suction nozzle 8a is mounted. Each of these nozzles 8a can communicate with a negative pressure generating device via a switching valve (not shown). By receiving a negative pressure from the negative pressure generating device, the electronic components are adsorbed at the tip of the nozzle 8a.

  Each head 8 can be moved up and down (moved in the Z-axis direction) with respect to the head unit 7 via a head lift drive mechanism (not shown) using a Z-axis servomotor 16 (shown in FIG. 4) as a drive source, and R The head unit 7 is supported so as to be rotatable (displaceable in the R-axis direction) with respect to the head unit 7 via a head rotation drive mechanism (not shown) using the shaft servomotor 17 as a drive source (shown in FIG. 4).

  Among these drive mechanisms, the head lifting drive mechanism lifts and lowers the nozzle 8a between a lowered position when sucking or mounting electronic components and a raised position when transporting electronic components or performing image recognition. is there. On the other hand, the head rotation driving mechanism displaces the electronic component to a predetermined position in the R-axis direction by rotating the nozzle 8a as necessary. In this embodiment, each drive mechanism of the head 8 including the motors 12, 14, 16, and 17 corresponds to the moving means according to the present invention.

  The head unit 7 is further equipped with a substrate recognition camera 9 for recognizing the image of the substrate P. The board recognition camera 9 is composed of a CCD camera or a CMOS camera provided with illumination such as an LED, and is fixed downward with respect to the head unit 7 in order to take an image of the board P arranged at the mounting work position. As will be described later, the board recognition camera 9 is also used for image recognition of a simulation mounting table 20 and a jig component 25 mounted thereon. Therefore, in this embodiment, the board recognition camera 9 is used. The camera 9 corresponds to the imaging means of the present invention.

  The head unit 7 picks up electronic components by the nozzles 8a and transports and mounts them from the component supply units 3 and 4 onto the substrate P at the mounting work position. It is provided to be movable in the X-axis direction and the Y-axis direction within the region indicated by the chain line. That is, the head unit 7 is supported so as to be movable along the X-axis direction with respect to the head support member 10 extending in the X-axis direction. The head support member 10 is fixed on the base 1. A fixed rail 11 extending in the direction is movably supported. The head unit 7 is driven in the X-axis direction via the ball screw 15 by the X-axis servo motor 14, while the head support member 10 is driven in the Y-axis direction via the ball screw 13 by the Y-axis servo motor 12. It has become so.

  A component recognition camera 18 for recognizing an image of the suction state of the electronic component by each nozzle 8a is disposed on the base 1. The component recognition camera 18 is composed of a CCD camera or a CMOS camera provided with illumination such as an LED, and is disposed between the tray feeders 4a of the component supply unit 4, specifically between the component pick-up positions, and sucked by the nozzles 8a. It is fixed upward on the base 1 in order to image the parts.

  Further, a component mounting table 20 is provided in the vicinity of the component recognition camera 18. This simulated mounting table 20 (hereinafter abbreviated as “table 20”) is used for mounting the jig component 25 described later in a calibration process (corresponding to a mounting error acquisition operation according to the present invention) described later. It is fixed to the rear side surface (the upper side surface in FIG. 1) of 2b, and is provided so as to be displaceable integrally with this movable conveyor 2b. As shown in FIG. 3A, the table 20 has a flat component mounting surface 20a in plan view for mounting components, and the height position of the mounting surface 20a is the mounting position. It is set at the same height as the component mounting surface of the substrate P fixed at the work position. On the mounting surface 20a, fiducial marks 24 for recognizing the image of the position of the table 20 are written on a pair of opposite corners on the diagonal line, and further on the mounting surface 20a. A suction hole 22 is provided at the center position of the line segment connecting both fiducial marks 24. The suction hole 22 can communicate with a negative pressure generator via a pipe and a switching valve (not shown), and the table 20 is supplied with negative pressure from the negative pressure generator to the suction hole 22. The electronic component is sucked and held on the mounting surface 20a. In the present embodiment, the suction hole 22, the switching valve, the negative pressure generator, and the like correspond to the suction means of the present invention.

  A jig component 25 is placed on the table 20, and in the calibration process, the jig component 25 is sucked and held by the nozzle 8 a, and the sucked state is image-recognized using the component recognition camera 18. Then, it is mounted on the mounting surface 20a. As shown in FIG. 3B, the jig component 25 has a square shape in plan view and a flat shape in the thickness direction, and is entirely made of glass or the like. On the upper surface of the jig component 25, component recognition marks 25a are written at diagonal positions on the four corners.

  FIG. 4 schematically shows a control system of this component mounting apparatus in functional blocks.

  As shown in the figure, the component mounting apparatus includes a control device 30 for comprehensively controlling the operation thereof. The control device 30 includes an arithmetic processing unit 301, a program storage unit 302, a data storage unit 303, a motor control unit 304, an external input / output unit 305, an image processing unit 306, and the like as functional configurations.

  The arithmetic processing unit 301 includes a well-known CPU that executes logical operations, a ROM that stores various programs, a RAM that temporarily stores various data during operation of the apparatus, and the like. In addition, by performing drive control of each servo motor 12, 14, 16, 17, etc. via the motor control unit 304 based on various data in the data storage unit 303, a component mounting operation is performed and a calibration process described later is performed. To do. The arithmetic processing unit 301 performs various arithmetic processes necessary for the mounting operation and the calibration process.

  The program storage unit 302 stores a production program (mounting program) for mounting electronic components on the board P, a calibration program for executing calibration processing, and the like.

  The data storage unit 303 stores various data necessary for mounting electronic components on the board P and performing calibration processing. For example, substrate data including mounting coordinate data of electronic components on the substrate P, component data including data such as the shape and size of the electronic components, and the like are stored in the data storage unit 303. Further, post-installation error data obtained by the arithmetic processing unit 301 as a result of the calibration process is also stored in the data storage unit 303.

  The motor control unit 304 controls driving of the servo motors 12, 14, 16, 17, etc. of the head unit 7.

  The external input / output unit 305 controls input / output of signals to / from driving units such as various sensors and valves provided in the component mounting apparatus.

  The image processing unit 306 makes it possible to extract necessary information by performing predetermined image processing on image data output from the board recognition camera 9 and the component recognition camera 18.

  The control device 30 (arithmetic processing unit 301) includes an input unit 32 such as a keyboard and a mouse for inputting various data and giving execution instructions for various operations, the operation status of the mounting operation and the calibration process, and these operations. Is connected to a display unit 34 such as a liquid crystal display for displaying various types of information, and the operator operates the input unit 32 as necessary to input various types of information based on the contents displayed on the display unit 34. Do.

  In this embodiment, the arithmetic processing unit 301 functions as the arithmetic unit and the correction unit of the present invention, the arithmetic processing unit 301 and the motor control unit 304 function as the control unit of the present invention, and the input unit 32 of the present invention. This corresponds to the instruction means.

  Next, an example of component mounting operation control by the control device 30 (arithmetic processing unit 301) will be described based on the flowchart of FIG.

  When the mounting operation is started, the arithmetic processing unit 301 first loads the substrate P into the mounting work position and positions and fixes it (step S1), and further moves the head unit 7 onto the substrate P to detect the substrate recognition camera 9. Thus, the fiducial mark on the substrate P is imaged, and the position of the substrate P is recognized based on the image data (step S3).

  Next, the arithmetic processing unit 301 moves the head unit 7 to the component supply units 3 and 4 and sucks the electronic component by each head 8 (nozzle 8a) (step S5). More specifically, after the head unit 7 is disposed above the component take-out position of the tape feeder 3a or the tray feeder 4a, the head 8 is moved up and down to adsorb the electronic components in the tape or the tray T by the nozzles 8a. At this time, if possible, a plurality of components are sucked simultaneously by the plurality of heads 8.

  Next, the arithmetic processing unit 301 moves the head unit 7 onto the component recognition camera 18 to image the suction component of each nozzle 8a, and the component suction state (suction error) with respect to each nozzle 8a based on the image data. (Step S7).

  When the component recognition is completed, the arithmetic processing unit 301 moves the head unit 7 onto the substrate P at the mounting work position and moves the head 8 up and down to mount the first electronic component on the substrate P. Then, while the head unit 7 is moved intermittently to the mounting point, the remaining electronic components attracted by the heads 8 are sequentially mounted on the substrate P (step S9). At this time, the arithmetic processing unit 301 recognizes the suction component recognition result in step S7 and the mounting error data (ΔX, ΔY, ΔR) stored in the data storage unit 303, that is, the driving error of the head unit 7 and the head 8, etc. The component mounting coordinate data by the head 8 is corrected based on the mounting error caused by the above-described data obtained by the calibration process described later, and the head unit 7 and the like are driven and controlled according to the corrected mounting coordinate data. .

  When the mounting of the components by each head 8 is completed, the arithmetic processing unit 301 determines whether or not all the components are mounted on the substrate P (step S11). In step S5, the next electronic component suction operation is performed. On the other hand, if YES is determined in step S11, the arithmetic processing unit 301 releases the fixation of the substrate P by driving and controlling the substrate transport mechanism 2 and the support device, and unloads the substrate P from the mounting work position ( Step S13). This completes a series of mounting operations.

  If such a mounting operation is repeated, a drive error may occur in the head unit 7 or the head 8 (nozzle 8a) due to deterioration over time such as wear. In this component mounting apparatus, it is possible to perform a calibration process in which such a drive error is detected and the result is updated and stored as electronic component mounting coordinate correction data. Hereinafter, the operation control of the calibration process by the control device 30 (arithmetic processing unit 301) will be described in detail based on the flowcharts of FIGS.

  This calibration process is started when the operator operates the input unit 32 to give an execution instruction to the control device 30 (arithmetic processing unit 301).

  When the calibration process is started, as shown in FIG. 6, the arithmetic processing unit 301 first sets the initial value “1” in the head counter H and the initial value “0 °” in the angle counter R in order, The process proceeds to mounting error acquisition processing (steps S21 to S25).

  FIG. 7 is a flowchart (subroutine) showing the mounting error acquisition processing in step 25. When this processing is started, the arithmetic processing unit 301 resets the mounting number counter N and controls the head unit 7 so that the jig component 25 placed on the table 20 for simulated mounting is removed. Adsorption is performed by the nozzle 8a (steps S41 and S43). At this time, the arithmetic processing unit 301 uses the head 8 specified by the suction condition based on the counter value, that is, the value of the head counter H set in step S21 in FIG. The jig component 25 is sucked in a state of being set at the position (rotation angle) in the R-axis direction specified by the value of the angle counter R set in step S23. For example, when the initial values are “H = 1” and “R = 0 °”, the arithmetic processing unit 301 sets the first rotation angle (for example, the leftmost head 8 in FIG. 2) as the reference angle (= 0 °). In this state, the jig component 25 is sucked by the head 8.

  When the suction of the jig component 25 is completed, the arithmetic processing unit 301 moves the head unit 7 onto the component recognition camera 18 to image the jig component 25, and the jig component 25 by the nozzle 8a based on the image data. The adsorption state (adsorption error) is checked, and the result is stored (step S45).

  Next, the arithmetic processing unit 301 determines whether or not the value of the mounting number counter N is “0” (step S47). If YES is determined here, the head unit 7 is moved and the table 20 The substrate recognition camera 9 is disposed above to image the fiducial mark 24, the position of the table 20 is recognized based on the image data, and the result is stored in the data storage unit 303 in an update manner (step S49). If YES is determined in the step S47, the process in the step S49 is skipped.

  When the recognition of the table 20 is completed, the arithmetic processing unit 301 mounts the jig component 25 on the mounting surface 20a by controlling the head unit 7 (step S51). At this time, the arithmetic processing unit 301 corrects the target coordinates (X, Y, R) set in advance based on the position data of the table 20 stored in step S49 and the recognition result of the jig component 25 in step S45. The head unit 7 is driven and controlled so that the component part 25 is mounted.

  Next, the arithmetic processing unit 301 moves the head unit 7 to dispose the substrate recognition camera 9 above the table 20 and images the mark 25a of the jig component 25, thereby obtaining a jig based on the image data. The position of the component 25 is recognized (step S53). Then, a mounting error with respect to the target position (X, Y, R) is calculated and temporarily stored as mounting error data (δx, δy, δr) (steps S55 and S57). That is, when the jig component 25 is mounted on the table 20 in consideration of the results of steps S45 and S49, the jig component 25 can be moved to the target coordinates (X, Y, R) if there is no drive error in the head unit 7 or the head 8. However, if there is a drive error in the head unit 7 or the head 8, a mounting error equal to that will occur.

  Next, the arithmetic processing unit 301 increments the mounting number counter N (step S59), and determines whether or not the value of the mounting number counter N has reached a preset number (step S61). If it is determined NO, the arithmetic processing unit 301 returns to step S43. That is, by repeatedly mounting the jig component 25 on the table 20 for the set number of times under the same suction condition (the suction condition based on the counter values in steps S21 and S23 in FIG. 5), the mounting error data for the set number of times ( (δx, δy, δr) are acquired.

  If NO is determined in step S61, the arithmetic processing unit 301 reads out the mounting error data (δx, δt, δr) for the set number of times temporarily stored in step S57, and each element of the mounting error data is read out. An average value (ΔX, ΔY, ΔR) is calculated and it is determined whether or not this value is outside a preset accuracy standard value, and the result is displayed on the display unit 34 together with the average value (ΔX, ΔY, ΔR). It is displayed (step S63). If NO is determined here, the mounting error acquisition process is terminated.

  On the other hand, when it is determined YES in step S63, the arithmetic processing unit 301 further determines whether or not correction execution setting is set (step S65). That is, it is determined whether or not the calibration result is reflected in the mounting operation. If YES is determined here, the calculation result in step S63 is used as the final mounting error data (ΔX, ΔY in the suction condition). , ΔR) in the data storage unit 303 in an update manner (step S67), the mounting error acquisition process is terminated. For example, the data storage unit 303 stores table data as shown in FIG. 8, that is, table data indicating the relationship between each head 8 and the rotation angle (0 °, 90 °, 180 °, 270 °) of the R axis and the mounting error. (Initial values are all 0) are stored in advance, and in the process of step S67, the mounting error data (ΔX, ΔY, ΔR) is overwritten and saved in the field corresponding to the suction condition.

  The correction execution setting in step S65 is also performed when the operator gives an instruction to execute calibration processing to the control device 30 based on the operation of the input unit 32, for example.

  When the mounting error acquisition process is completed, the process proceeds to step S27 in FIG. 6, and the arithmetic processing unit 301 determines whether or not the angle counter R is “270 °” (step S27). After the angle counter R is incremented (R = R + 90 °), the process returns to step S25. In contrast, if YES is determined in step S27, the arithmetic processing unit 301 further determines whether the head counter H is the number of heads, that is, whether it is “6” in the present embodiment (step S29). If it is determined NO, the head counter H is incremented (H = H + 1), and the process returns to step S25. By repeating the processes of steps S25 to S33 as described above, the mounting error data (ΔX, ΔY, ΔR) is overwritten and saved in all the fields of the table data of FIG.

  Then, when it is finally determined YES in step S29, the arithmetic processing unit 301 ends the calibration process.

  When the calibration processing is executed in this way, the arithmetic processing unit 301 refers to the table data (see FIG. 8) in the subsequent mounting operation control (the processing in step S9 in FIG. 5), and mounts error data and electronic data. The electronic component mounting coordinate data is corrected based on the component suction error data. Specifically, the mounting error data (ΔX, ΔY, ΔR) corresponding to each head 8 (nozzle 8a) is read from the table data, and the mounting error data and the suction error obtained in step S7 in FIG. The mounting coordinate data (x, y, r) of the electronic component is corrected based on the data, and the head unit 7 is driven and controlled based on the corrected mounting coordinate data. As a result, driving errors of the head unit 7 and the head 8 are reflected in the subsequent mounting operation control.

  Although not mentioned in the above description, the arithmetic processing unit 301 turns on / off the supply of negative pressure to the table 20 (suction hole 22) by controlling the switching valve. Specifically, the negative pressure supply is turned off from the time when the jig component 25 is attracted by the head 8 to the time when it is mounted on the mounting surface 20a (steps S43 to S51), and the negative pressure supply is turned on otherwise. To do. That is, by turning on and off the negative pressure supply in this way, the jig component 25 is sucked onto the table 20 by negative pressure to prevent the jig component 25 from being unintentionally displaced and falling off the table 20. The jig component 25 can be adsorbed by the head 8 without difficulty if necessary.

  Further, as described above, the calibration process is started when the operator gives an execution instruction to the arithmetic processing unit 301 based on the operation of the input unit 32. The operation (execution) is performed during the mounting operation of the electronic component on the board P. When an instruction is input), the arithmetic processing unit 301 interrupts the mounting operation and preferentially executes the calibration process.

  For example, if there is an execution instruction during the mounting (mounting) operation of the electronic component, the arithmetic processing unit 301 advances the mounting program until the mounting of the suction component by the head 8 is completed, and then performs the calibration process. Run the program. As a result, the calibration process is executed while the board P being mounted is kept waiting at the mounting work position. At this time, the jig component 25 is sucked and mounted on the table 20 by each head 8. As described above, the table 20 is provided outside the conveyors 2 a and 2 b, that is, outside the conveyance path where the mounting work position is located. Therefore, the calibration process can be executed without difficulty in a state where the substrate P during the mounting operation is kept waiting at the mounting operation position. After the calibration process, the arithmetic processing unit 301 corrects the mounting coordinate data of the remaining electronic components based on the updated table data, and then restarts the suspended mounting program. As a result, the result of the calibration process is immediately reflected in the production of the substrate P during the mounting operation.

  As described above, in the component mounting apparatus of the above-described embodiment, the mounting error data (ΔX is obtained by mounting the jig component 25 on the simulation mounting table 20 and executing the calibration process for recognizing the image of the jig component 25. , ΔY, ΔR), and this mounting error data can be reflected in the subsequent mounting work as necessary. Therefore, the driving error of the head unit 7 and the head 8 caused by the deterioration with time or the like is eliminated. It is possible to stably produce a component mounting board with high mounting accuracy in the long term while reflecting it in the mounting work.

  In addition, in this apparatus, the simulation mounting table 20 is arranged outside the mounting work position, specifically, outside the conveyors 2a and 2b as described above, and in the calibration process, the table 20 is cured on the table 20. The component part 25 is mounted and the image is recognized, and the calibration process can be performed even when the substrate P is arranged at the mounting work position. Therefore, even in the online state, the calibration process can be executed without difficulty if the mounting operation is temporarily interrupted. Therefore, when a component mounting failure is found by sampling inspection, etc., the calibration process is immediately executed to verify the cause of the failure, and the result can be immediately reflected in subsequent production. There is an advantage. In particular, when there is an instruction to execute calibration processing during the mounting operation of the substrate P, the apparatus according to the embodiment interrupts the mounting operation of the substrate P, executes the calibration processing, and resumes the result. Since the configuration immediately reflects the P mounting work, there is an advantage that the result of the calibration process can be reflected in the mounting work as quickly as possible.

  Further, in the apparatus of the embodiment, the mounting surface 20a of the table 20 and the component mounting surface of the substrate P fixed to the mounting work position are set to the same height, and further the calibration process using the jig component 25 is performed. Therefore, there is an advantage that the required mounting error data (ΔX, ΔY, ΔR) is highly reliable. That is, since the mounting surface 20a of the table 20 and the component mounting surface of the substrate P are at the same height, a mounting error caused by a shaft shake or the like accompanying the elevation of the head 8 can be accurately reproduced in the calibration process. In addition, by using the jig component 25, the shape and size of the component are unified, and it is difficult for the components to be recognized. As a result, the reliability of the mounting error data (ΔX, ΔY, ΔR) is improved. Can do. However, the present invention does not deny the use of product parts in the calibration process. For example, a part such as QFP is adsorbed from the tray feeder 4 a instead of the jig part 25 and mounted on the table 20. It doesn't matter. In this case, by identifying the type of product part used for the calibration process in advance, it becomes possible to stabilize the part recognition accuracy as in the case of using the jig part 25.

  In the apparatus according to the embodiment, the table 20 is fixed to the substrate transport mechanism 2. Thus, since the table 20 is installed at a position close to the component mounting surface of the substrate P, mounting errors can be acquired with higher accuracy. Moreover, when the table 20 is fixed to the movable conveyer 2b which is the substrate transport mechanism 2 and the table 20 is provided so as to be displaceable integrally with the movable conveyer 2b as in the apparatus of the embodiment, the table 20 becomes the substrate P. There is also an advantage that it does not interfere with the movement of the movable conveyor 2b accompanying the size change.

  In the component mounting apparatus of the above embodiment, a calibration processing program is provided separately from the mounting program, and the calibration processing is performed separately from the mounting operation, so that a common mounting error used for the mounting operation of all components can be performed. The data (ΔX, ΔY, ΔR) is obtained. For example, a program corresponding to the calibration processing program is incorporated in the mounting program in advance so that the substantial calibration processing is executed for each component. You may comprise so that mounting operation may be advanced.

  Hereinafter, an example of the configuration and operation control of the component mounting apparatus in that case will be described.

  The configuration of the component mounting apparatus in this case is also basically the same as that of the embodiment, but as described above, the dedicated calibration processing program is not stored in the program storage unit 302 and is not stored on the table 20. The jig part 25 is not placed. In this respect, the configuration is different.

  FIG. 9 is a flowchart illustrating an example of mounting operation control by the control device 30 (arithmetic processing unit 301).

  When the mounting operation is started, the arithmetic processing unit 301 first loads the substrate P into the mounting work position and positions and fixes it. When the substrate P is further fixed, the arithmetic unit 301 moves the head unit 7 onto the substrate P to fix the substrate. A fiducial mark on the substrate P is imaged by the recognition camera 9, and the position of the substrate P is recognized based on the image data (step S71).

  Next, the arithmetic processing unit 301 moves the head unit 7 to the component supply units 3 and 4 and sucks the electronic components by the heads 8 (nozzles 8a) (step S73). When the component suction is completed, the head unit 7 is further moved. The suction part of each nozzle 8a is imaged by moving it onto the part recognition camera 18, and the suction state (suction error) of the part with respect to each nozzle 8a is examined based on the image data (step S75).

  When the component recognition is completed, the arithmetic processing unit 301 moves the head unit 7 to capture the fiducial mark 24 on the table 20 with the board recognition camera 9, and recognizes the position of the table 20 based on the image data. Thereafter, the suction component is mounted on the table 20 (steps S77 and S79). At this time, the arithmetic processing unit 301 sets the head unit 7 or the like so that the electronic component is mounted at a preset target position (X, Y, R) on the mounting surface 20a based on the recognition results of steps S75 and 77. Drive control.

  Next, the arithmetic processing unit 301 moves the head unit 7 and places the board recognition camera 9 above the table 20 to image a predetermined recognition part of the electronic component, and based on the image data, The position is recognized and the mounting error with respect to the target position (X, Y, R) is calculated (δx, δy, δr), and then the electronic component is sucked by the original head 8 (steps S81 to S89). In the case of a package component with leads, for example, the tip portion of a specific lead (or all leads) is set as a recognition location, and in the case of a package component without leads, the corner portion is set as a recognition location. Then, the recognition part is imaged, and the position of the electronic component is recognized based on the image data.

  Then, it is determined whether or not mounting errors have been obtained for all the heads 8 that are attracting electronic components (step S91). If NO is determined here, the process proceeds to step S79, and the same is true for the remaining heads 8. Execute the process. On the other hand, if YES is determined in step S91, the arithmetic processing unit 301 moves the head unit 7 onto the component recognition camera 18 to capture the suction component of each nozzle 8a, and based on the image data. Then, the suction state (suction error) of the component with respect to each nozzle 8a is obtained (step S93).

  Next, the arithmetic processing unit 301 moves the head unit 7 onto the substrate P at the mounting work position and moves the head 8 up and down to mount the first electronic component on the substrate P. Thereafter, the head unit 7 is intermittently moved. While moving to the mounting point, the remaining electronic components sucked by the heads 8 are sequentially mounted on the substrate P (step S95).

  When the mounting of the components by each head 8 is completed, the arithmetic processing unit 301 determines whether or not all components are mounted on the board P (step S97). If NO is determined here, the processing proceeds to step S73. Then, the next electronic component is picked up. On the other hand, if YES is determined in step S97, the arithmetic processing section 301 releases the fixation of the substrate P by driving and controlling the substrate transport mechanism 2 and the support device, and unloads the substrate P from the mounting work position ( Step S99), a series of mounting operations is terminated.

  According to such a component mounting apparatus, a mounting operation is performed while a substantial calibration process (the processes in steps S77 to S87) is performed for each component. Therefore, it is possible to reflect the drive error of the head unit 7 and the like in the mounting operation in real time, and as a result, it is possible to produce a component mounting board with higher accuracy.

  Here, as shown in the example of FIG. 9, the example in which the mounting operation is performed while executing the calibration process in units of components has been described. However, in addition to this, for example, calibration is performed in units of a predetermined number (a plurality) of components. The mounting operation may be advanced while executing the processing. In this case, the mounting error data of each head 8 obtained in the process of step S87 is stored in the data storage unit 303, and after mounting a predetermined number (plural) of electronic components based on the mounting error data ( That is, the processing of steps S77 to S93 is skipped), and the calibration processing of steps S77 to S93 may be executed to update the mounting error data in the data storage unit 303.

  By the way, the component mounting apparatus described above is an example of a preferred embodiment of the component mounting apparatus according to the present invention, and a specific configuration thereof can be appropriately made without departing from the gist of the present invention.

  For example, in the operation control shown in FIGS. 5 to 7, the calibration process is executed based on the operation of the input unit 32 by the operator. For example, when the production type is changed, the set time has elapsed, the power is turned on. For example, the calibration process may be automatically executed at a preset timing. In this case, the subsequent mounting operation may be automatically controlled according to the mounting error data (table data) after the calibration process.

  In the embodiment, the table 20 is fixed to the outside of the fixed conveyor 2a, specifically, to the rear side of the movable conveyor 2b, so that the component mounting surface of the substrate P and the mounting surface 20a of the table 20 have the same height. However, it may be arranged inside the two fixed conveyors 2a which is in a range where interference with the board P can be avoided and which is outside the component mounting surface of the board P. In other words, the heights of the component mounting surface of the substrate P and the mounting surface 20a of the table 20 are set equal to each other so that mounting errors caused by shaft runout or the like accompanying the elevation of the head 8 can be accurately reproduced in the calibration process. This is to increase the reliability of the mounting error data. Accordingly, the mounting surface 20a of the table 20 can be provided slightly lower than the component mounting surface of the substrate P as long as the reliability is not significantly impaired. In this case, the table 20 is mounted on the two conveyors 2a. , 2b may be arranged.

  In the embodiment, the suction hole 22 is formed in the mounting surface 20 a of the table 20, and the jig component 25 is sucked and held on the table 20 by sucking the jig component 25 through the suction hole 22. However, the jig component 25 may be sucked and held on the table 20 by the adhesive force of the sheet member by providing an adhesive sheet member or the like instead of the suction hole 22 on the mounting surface 20a. .

1 is a schematic plan view showing a component mounting apparatus according to the present invention. 1 is a schematic front view showing a component mounting apparatus. (A) is a top view which shows the structure of the table for simulation mounting, (b) is a top view which shows the jig components placed on the table. It is a functional block diagram which shows the control system of a component mounting apparatus. It is a flowchart which shows an example of the mounting operation control of the components by a control system. It is a flowchart which shows an example of operation control of the calibration process by a control system (main routine). It is a flowchart which shows an example of operation control of the calibration process by a control system (subroutine; mounting error acquisition process). It is a figure which shows an example of table data (mounting error data). It is a flowchart which shows the modification (example which performs a calibration process during mounting operation | movement) of the mounting operation control of the components by a control system.

2 Substrate transport mechanism 2a, 2b Conveyor 3, 4 Component supply unit 3a Tape feeder 4a Tray feeder 7 Head unit 8 Head 8a Nozzle 20 Simulation mounting table 25 Jig component 30 Control device 301 Arithmetic processing unit 302 Program storage unit 303 Data storage Unit 304 motor control unit 305 external input / output unit 306 image processing unit P substrate

Claims (4)

A transport unit that transports the substrate to be mounted in a specific direction, a component supply unit that supplies components to be mounted on the substrate to be mounted , and a position in the middle of the substrate transport path by the transport unit as a mounting work position , In a component mounting apparatus comprising a component mounting head that is mounted on a mounted substrate that is taken out of a component supply unit and placed on the mounting work position,
Moving means for relatively moving the head in the horizontal direction and the vertical direction with respect to the mounting substrate disposed at the mounting work position;
A simulation mounting table provided with a mounting surface that is disposed outside the transport path and can be mounted with a component that is positioned at the same height as the component mounting surface of the mounted substrate;
Imaging means for imaging components mounted on the simulation mounting table;
Calculation means for obtaining a mounting error of a component with respect to a predetermined target position based on an image acquired by the imaging means;
Correction means for correcting the mounting coordinates of the component by the head based on the mounting error;
Control means for controlling the moving means to perform a predetermined mounting error acquisition operation for mounting the part on the simulated mounting table and imaging the part by the imaging means to obtain the mounting error. ,
The control unit controls the moving unit to execute a predetermined component mounting operation for mounting a component on the mounted substrate, and a component taken out from the component supply unit by the head during the component mounting operation. The mounting error acquiring operation is executed using the mounting error, and the moving means is controlled to mount the component on the mounted substrate according to the mounting coordinates corrected by the correcting means based on the mounting error acquired by the mounting error acquiring operation. component mounting apparatus according to claim to Rukoto. The component mounting apparatus according to claim 1 ,
Further comprising a storage means for updating storage of mounting error is determined by pre-Symbol calculating means,
Wherein the correction means corrects the mounting coordinate of the component by the head based on the mounting error stored in the storage means,
Before SL control means is characterized execution to Rukoto the mounting error acquisition operation by using the components above every predetermined number and a plurality of parts previously determined a component mounted on the mounting substrate Component mounting equipment. In the component mounting apparatus according to claim 1 or 2,
Component mounting apparatus characterized that you have provided a suction holding means for holding the components placed on the simulated mounting table in a state adsorbed on the table. From a component supply unit that places a substrate to be mounted, which is transported in a specific direction by a transport unit, at a mounting operation position determined in the course of a substrate transport path by the transport unit, and supplies components to be mounted on the substrate to be mounted In a component mounting method of taking out a component with a component mounting head and mounting the component on the mounted substrate,
A simulated mounting table including a mounting surface on which a component taken out from the component supply unit by the head can be mounted on the outside of the transport path and positioned at the same height as the component mounting surface of the mounted substrate A mock mounting process mounted on top,
In this step, an error calculation step for obtaining a component mounting error with respect to a predetermined target position by imaging and recognizing the component mounted on the simulated mounting table by an imaging unit;
A component mounting method comprising: a substrate production step of mounting a component on a substrate to be mounted after correcting the mounting coordinates of the component by the head based on the mounting error obtained in this step .

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