JP6411028B2 - Management device - Google Patents

Description

  The present invention is configured to perform a predetermined operation on a substrate and generates an error based on a captured image obtained by imaging a work object related to the operation and image processing data created in advance. The present invention relates to a management apparatus that manages a substrate work machine capable of detecting the type of error.

  Conventionally, as this type of management device, when a missing part error is detected in which a component is not mounted on the board, the presence or absence of mounting traces on the board or the component recognition operation on the mounting nozzle is checked. According to the confirmation result, there is a proposal to select one of countermeasures (filter replacement, nozzle cleaning, cassette confirmation) registered in the database in advance and notify the operator of error information and countermeasures (For example, refer to Patent Document 1).

JP 2003-304100 A

  By the way, the types of errors include, for example, image processing errors, component suction errors, component shortages, production plan information (for example, substrate information and component information, suction nozzle information, head information, and substrate reference mark positions). There are various input errors such as component mounting positions), and it is extremely difficult for an operator to appropriately deal with all types of errors. For this reason, there has been a problem that the work load on the worker increases and productivity decreases. Further, depending on the error, the operator needs to confirm the notification of the error information and edit the data (image processing data). Since data editing requires a high level of skill and is a laborious operation, the work efficiency is lowered and productivity is lowered.

  The management device according to the present invention can appropriately cope with errors detected based on a component image obtained by imaging a picked-up component and image processing data created in advance, while reducing the workload on the operator. The main purpose is to do so.

  The present invention adopts the following means in order to achieve the main object described above.

The present invention
The occurrence of an error based on a captured image obtained by imaging a work object related to the work configured to perform a predetermined work on the board and image processing data created in advance, and the type of error that has occurred Is a management device that manages a substrate work machine capable of detecting
Storage means for storing a coping method for coping with the error for each type of error;
Input means for inputting instructions from the operator;
When the occurrence of the error is detected, a handling method corresponding to the type of the detected error is obtained from the storage unit, and permission to deal with the detected error is obtained based on the obtained handling method. Display means for displaying the required error response;
When permission input is made by the input means for the error handling display, reflecting means for reflecting the handling method corresponding to the detected error on the substrate work machine,
It is a summary to provide.

  In the management apparatus according to the present invention, a substrate work machine capable of detecting the occurrence and type of an error based on a captured image obtained by imaging a work object related to work and image processing data created in advance. In the management, memorize the coping method to deal with the error for each error type, and when the occurrence of the error is detected, obtain the coping method corresponding to the detected error type, and the obtained coping method An error handling display requesting permission to deal with an error detected based on the error is displayed, and when a permission input is made for the error handling display, a countermeasure method corresponding to the detected error is given to the on-board work machine. To reflect. As a result, the worker only has to confirm the error handling display and determine whether or not to allow the display handling method, and thus the burden on the worker can be greatly reduced. As a result, it is possible to appropriately deal with errors while reducing the work load on the operator. “Working machine for substrate” is a component mounting machine that mounts components on a board, a printing machine that prints solder on a board, a coating machine that applies a coating agent (adhesive) to fix components, and is mounted on a board. Inspector that inspects the mounting state of the parts.

  In such a management apparatus of the present invention, the substrate work machine is a component mounting machine that picks up a component with a suction nozzle and mounts it on a substrate, and picks up the picked-up component and obtains a component image obtained by the image pickup. A suction error in which the suction position of the suction nozzle with respect to the component recognized on the basis of the image processing data does not match the reference suction position data included in the image processing data can be detected, and the storage unit is configured to cope with the suction error. As a method, at least a low-speed operation mode for reducing the moving speed or moving acceleration of the suction nozzle when sucking a component with the suction nozzle is stored, and the display means detects the occurrence of the suction error, A suction error handling display requesting permission to set the low-speed operation mode is performed, and the reflecting means corresponds to the suction error handling display. When permission input is made by the input means, it can be assumed to operate the mounter in the slow operation mode. When the component mounter is operated in the low-speed operation mode, the suction nozzle stopping accuracy when picking up the component with the suction nozzle is improved. This may eliminate the suction error, and appropriately deal with the suction error. Can do. Of course, the worker only has to check the display contents and determine whether or not to permit the execution of the low-speed operation mode, so the work load can be reduced.

  In the management device of the present invention, the substrate work machine is a component mounter that picks up a component with a suction nozzle and mounts it on the substrate, and picks up the picked-up component and obtains the component by the image pickup A suction error in which the suction position of the suction nozzle with respect to a component recognized based on an image does not match the reference suction position data included in the image processing data can be detected, and the storage unit is configured to cope with the suction error. As a coping method, at least an edit mode for editing the reference suction position data is stored, and when the occurrence of the suction error is detected, the display means changes the reference suction position data in the edit mode. The suction error handling display for requesting permission is performed, and the reflecting means inputs permission to the suction error handling display by the input means. It can also be assumed that the suction position of the component to edit the reference suction position data so as to meet the reference suction position data. In this way, it is possible to eliminate the suction error by editing the reference suction position data, and it is possible to appropriately cope with the suction error. Of course, the operator only has to confirm the content of the error handling display and determine whether or not to permit the execution of the edit mode, so the work load can be reduced.

  Furthermore, in the management device according to the present invention, the substrate work machine is a component mounting machine that picks up a component with a suction nozzle and mounts it on the substrate, and picks up the picked-up component and obtains the component A shape error in which the shape or size of a component recognized based on an image does not match the reference shape data included in the image processing data can be detected, and the storage unit is a coping method for coping with the shape error. , Storing at least an edit mode for editing the reference shape data, and the display means, when the occurrence of the shape error is detected, a shape error for requesting permission to change the reference shape data in the edit mode Corresponding display is performed, and the reflecting means receives the permission input by the input means for the shape error corresponding display, and the shape of the component is It can be assumed to edit the reference shape data to fit the quasi-shape data. By doing this, it is possible to eliminate the shape error by editing the reference shape data, and it is possible to appropriately deal with the shape error. Of course, the operator only has to confirm the content of the error handling display and determine whether or not to permit the execution of the edit mode, so the work load can be reduced.

  In the management device of the present invention, the storage unit stores a plurality of the coping methods for one type of error, and the display unit detects the detected error when the occurrence of the error is detected. One of a plurality of coping methods corresponding to the type of the error is acquired from the storage unit, the error handling display based on the acquired coping method is performed, and the error handling display is not permitted input by the input unit If a response is made, a new response method different from the previously acquired response method among the plurality of response methods corresponding to the detected error type is newly acquired, and the error response display based on the acquired response method Can also be performed. In this way, since the operator can select an optimum handling method for one error, it is possible to deal with the error more appropriately. Further, since the worker only has to determine whether or not to implement the handling method of the error handling display, the work load does not increase.

It is a block diagram which shows the outline of a structure of the component mounting system 1 as one Example of this invention. 2 is a configuration diagram illustrating an outline of a configuration of a component mounter 11. FIG. 3 is a block diagram showing an electrical connection relationship between a control device 70 and a management device 80 of the component mounter 11. FIG. 4 is a flowchart illustrating an example of a component mounting process executed by a control device 70 of the component mounter 11. It is explanatory drawing which shows an example of adsorption | suction operation mode. 6 is a flowchart illustrating an example of an image processing error recovery process executed by the management apparatus 80. It is explanatory drawing which shows an example of a coping method database. It is explanatory drawing which shows an example of a 1st adsorption | suction deviation corresponding | compatible screen. It is explanatory drawing which shows an example of a 2nd adsorption | suction deviation corresponding | compatible screen. It is explanatory drawing which shows an example of a 3rd adsorption | suction deviation corresponding | compatible screen. It is explanatory drawing which shows an example of a 4th adsorption | suction deviation corresponding | compatible screen. It is explanatory drawing which shows an example of a 1st component shape error corresponding | compatible screen. It is explanatory drawing which shows an example of the 2nd component shape error corresponding | compatible screen.

  Next, the form for implementing this invention is demonstrated using an Example.

  FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounting system 1 as an embodiment of the present invention, FIG. 2 is a configuration diagram showing an overview of the configuration of a component mounting machine 11, and FIG. 3 is a component mounting machine. It is a block diagram which shows the electrical connection relation of 11 control apparatuses 70 and the management apparatus 80. In this embodiment, the horizontal direction in FIGS. 1 and 2 is the X-axis direction, the front-rear direction is the Y-axis direction, and the vertical direction is the Z-axis direction.

  As shown in FIG. 1, the component mounting system 1 manages a component mounting line 10 including a plurality of component mounting machines 11 a to 11 d (hereinafter collectively referred to as a component mounting machine 11), and the component mounting line 10. The management apparatus 80 as one Example of this invention is provided.

  As shown in FIG. 2, the component mounter 11 transports a component supply device 20 that supplies an electronic component (hereinafter simply referred to as “component”) and a circuit board (hereinafter simply referred to as “substrate”) 16. Device 30, backup device (not shown) that backs up substrate 16 transported by substrate transport device 30, and component mounting device that mounts components supplied by component supply device 20 onto substrate 16 backed up by backup device 40 and a control device 70 (see FIG. 3) for controlling the entire component mounting machine, and the substrate transfer device 30, the backup device, and the component mounting device 40 are accommodated in a main body frame 14 provided on the base 12. Has been.

  As shown in FIG. 2, the component supply device 20 includes a feeder mounting base 24 installed on the front surface of the main body frame 14 and a tape feeder 22 attached to the feeder mounting base 24. The tape feeder 22 includes a reel 22a around which a tape is wound, and components are accommodated at predetermined intervals in each cavity of the carrier tape. These parts are protected by a film covering the surface of the tape, and when the tape is pulled out from the reel 22a, the film is peeled off and exposed in the feeder portion 22b, and can be sucked. The feeder mounting base 24 is configured to be detachable from the main body frame 14, and by changing the feeder mounting base 24, a plurality of types of feeders such as a tray feeder capable of supplying parts by a tray can be mounted. Is possible.

  As shown in FIG. 2, the substrate transfer device 30 is configured as a dual lane transfer device provided with two substrate transfer paths, and is arranged on a support base 18 provided in the middle portion of the main body frame 14. Has been. Each substrate conveyance path is provided with a belt conveyor device 32, and the substrate 16 is conveyed from left to right (substrate conveyance direction) in FIG.

  As shown in FIG. 2, the component mounting device 40 includes a guide rail 46 provided in the upper stage portion of the main body frame 14 along the Y-axis direction, a Y-axis slider 48 that can move along the guide rail 46, A guide rail 42 provided along the X-axis direction on the lower surface of the Y-axis slider 48, an X-axis slider 44 movable along the guide rail 42, and attached to the X-axis slider 44 to move in the XY-axis direction Possible head 50, suction nozzle 52 that is mounted on head 50 so as to be able to move in the Z-axis direction and rotate around Z-axis and can suck components, and is provided on support base 18 and sucked by suction nozzle 52 Can be mounted on the head 50, a parts camera 54 for photographing the suction component, a mark camera 56 for photographing a substrate positioning reference mark attached to the X-axis slider 44 and provided on the substrate 16. And a nozzle stocker 58 for stocking a plurality of types of the suction nozzle such.

  The parts camera 54 is installed between the component supply device 20 and the belt conveyor device 32 so that the imaging direction is upward. This parts camera 54 images the suction component passing above or the suction component stopped above, and outputs an image obtained by the imaging to the control device 70. The control device 70 determines whether or not the component is normally attracted to the suction nozzle 52 by comparing the input image with an image (image processing data) in a normal suction state stored in advance.

  Specifically, the control device 70 determines the presence / absence of a component, the shape, size, and suction position of the component based on an image captured by the parts camera 54. In the present embodiment, the three-dimensional shape of the component is measured based on the image captured by the parts camera 54, and the lead bending in the lead component or the lack of bumps in the BGA (Ball grid array) based on the measurement result, It is also possible to determine the suction posture (diagonal suction or standing suction) of the component. The three-dimensional shape can be measured using a phase shift method, a spatial encoding method, or the like.

  The mark camera 56 is installed at the lower end of the X-axis slider 44 so that the imaging direction faces the substrate 16. The mark camera 56 photographs the substrate positioning reference mark provided on the substrate 16 and outputs an image obtained by the imaging to the control device 70. The control device 70 determines the position of the substrate 16 by processing the input image and recognizing the position of the mark.

  The control device 70 is configured as a microprocessor centered on the CPU 71. In addition to the CPU 71, a ROM 72 that stores processing programs, an HDD 73 that stores various data, a RAM 74 that is used as a work area, and an input / output interface. 75, which are electrically connected via a bus 76. The control device 70 includes a position signal from the X-axis position sensor 44 a that detects the position of the X-axis slider 44, a position signal from the Y-axis position sensor 48 a that detects the position of the Y-axis slider 48, and a signal from the mark camera 56. An image signal, an image signal from the parts camera 54, and the like are input via the input / output interface 75. On the other hand, from the control device 70, a control signal to the component supply device 20, a control signal to the substrate transport device 30, a drive signal to the X-axis actuator 44 b that moves the X-axis slider 44, and a Y signal that moves the Y-axis slider 48. Drive signal to the axis actuator 48b, drive signal to the Z axis actuator 52a that is built in the head 50 and moves the suction nozzle 52 in the Z-axis direction, drive to the θ axis actuator 52b that is built in the head 50 and rotates the suction nozzle 52 A signal, a drive signal to the electromagnetic valve 59 for performing communication between the vacuum pump (not shown) and the suction nozzle 52 and shutoff, and the like are output via the input / output interface 75. In addition, the control device 70 is connected to the management device 80 so as to be capable of bidirectional communication, and exchanges data and control signals with each other.

  The management device 80 is a general-purpose computer, for example. As shown in FIG. 3, the management device 80 is a microprocessor centered on a CPU 81, and includes a ROM 82 that stores processing programs, an HDD 83 that stores board production plans, a RAM 84 that is used as a work area, and an input / output interface. 85 and the like. These are electrically connected via a bus 86. An input signal is input to the management device 80 from an input device 87 such as a mouse or a keyboard via an input / output interface 85, and an image signal to the display 88 is input from the management device 80 via the input / output interface 85. It is output. Here, the board production plan is a plan that determines which parts are mounted on the board in which order in each component mounting machine 11 and how many boards on which such parts are mounted are produced. Say. For example, information input as a production plan includes production date and time, the number of substrates to be manufactured, component information regarding components mounted on the substrate, head information regarding the head 24 to be used, nozzle information regarding the suction nozzle 52 mounted on the head 24, and the like. There is. Such a production plan is input to the management device 80 by the operator operating the input device 87. The management device 80 that has input the production plan outputs a command signal to each of the component mounting machines 11a to 11d so that the component is mounted on the board according to the production plan.

  Next, the component mounting process of the component mounter 11 of the present embodiment configured as described above will be described. FIG. 4 is a flowchart illustrating an example of a component mounting process executed by the CPU 71 of the control device 70. This routine is executed when a production start command is received from the management device 80.

  When the component mounting process is executed, the CPU 71 of the control device 70 first controls the substrate transport device 30 to transport the substrate 16 until it is directly above the backup device and holds the substrate 16 (step S100). At this time, the component supply device 20 (tape feeder 22) is in a state where components are supplied by feeding the tape from the reel 22a. Subsequently, the CPU 71 of the control device 70 controls the X-axis actuator 44 b and the Y-axis actuator 48 b so that the suction nozzle 52 comes directly above the component supplied from the component supply device 20, and the suction port of the suction nozzle 52. The Z-axis actuator 52a is controlled so that the suction nozzle 52 is lowered until the nozzle contacts the component. With this control, the suction nozzle 52 sucks the component by applying a negative pressure to the suction port (step S110). Here, a plurality of operation modes are provided as the suction operation when the component is sucked by the suction nozzle 52. FIG. 5 is an explanatory diagram showing the relationship between the speed V of the suction nozzle 52 and the time T in the suction operation. 5A shows the high speed operation mode, and FIG. 5B shows the low speed operation mode. In the high-speed operation mode, as shown in FIG. 5A, the suction nozzle 52 is moved horizontally (XY axis) toward the target position (directly above the part) with the maximum executable (100%) acceleration, and the target This is a mode in which the suction nozzle 52 starts to descend (Z-axis movement) just before a predetermined distance (for example, 1 to 2 mm) in position, and is a mode in which the cycle time is emphasized. On the other hand, in the low speed operation mode, as shown in FIG. 5B, the suction nozzle 52 is horizontally moved toward the target position at a lower acceleration (for example, 50%) than the high speed operation mode, and the suction nozzle 52 is moved in the XY-axis direction. This is a mode in which the suction nozzle 52 starts to descend after the movement of is stopped, and is a mode in which the stop accuracy with respect to the target position (directly above the part) of the suction nozzle 52 is emphasized. In this embodiment, the default setting is the high-speed operation mode, and the low-speed operation mode can be set by changing the setting by the operator. Note that the operation modes are not limited to the above two types, and it is needless to say that three or more types of operation modes having different movement accelerations and movement speeds of the suction nozzle 52 on the XY axes may be provided.

  When the suction nozzle 52 sucks the component, the CPU 71 of the control device 70 controls the X-axis actuator 44b and the Y-axis actuator 48b so that the sucked component crosses right above the parts camera 54, and the sucked component. Is picked up by the parts camera 54 (step S120), and image processing for comparing the picked-up image with pre-stored image processing data is performed (step S130). ), It is determined whether or not an image processing error has occurred (step S140). Specifically, the image processing recognizes the external shape of the component based on the captured image, and determines whether or not the recognized external shape is within a predetermined allowable range with respect to a pre-stored reference external shape. Thus, it is determined whether or not a shape error (for example, a nonstandard product, deformation, chipping, foreign matter adhesion, etc.) has occurred. The shape error can be determined by determining whether the size of the component is within an allowable range with respect to the reference size, or by measuring the lead component three-dimensionally when the mounting target component is a lead component. This includes determining whether the position of the lead is within an allowable range with respect to the reference position and determining whether the number of leads matches the number of standards. Further, the image processing determines the component suction position with respect to the suction nozzle 52 based on the captured image, and determines whether the distance between the determined suction position and the center position of the component is within a predetermined allowable range. By doing so, it is determined whether or not an adsorption deviation has occurred. Furthermore, the image processing determines whether or not a suction error has occurred based on whether or not the component is recognized based on the captured image, and oblique suction or standing suction of the component by three-dimensional measurement. It can also be determined whether or not it has occurred. When determining that the image processing error has occurred, the control device 70 generates error information indicating the type (content) of the determined error.

  If it is determined as a result of the determination in step S140 that no image processing error has occurred, the CPU 71 of the control device 70 causes the X-axis actuator so that the component sucked by the suction nozzle 52 is directly above the mounting position of the substrate 16. 44b and Y-axis actuator 48b are controlled, and the Z-axis actuator 52a and the θ-axis actuator 52b are controlled so that the suction nozzle 52 is lowered until the component is pressed against the mounting position of the board 16, and the suction port of the suction nozzle 52 is controlled. The component is mounted on the substrate 16 by applying a positive pressure to the substrate 16 (step S150), and the component mounting process is terminated.

  On the other hand, as a result of the determination in step S140, if it is determined that an image processing error has occurred, the CPU 71 of the control device 70 transmits error information created in the image processing to the management device 80 (step S160), and the management device. It waits until it receives a production restart command or a production stop command from 80 (steps S170 to S190). When the CPU 71 of the control device 70 receives a production stop command from the management device 80 in the standby state (step S190), the component mounting process is terminated.

  When the production restart command is received from the management device 80 (step S180), the CPU 71 of the control device 70 determines whether or not the image processing data has been edited. (Step S200). If it is determined that the image processing data has been edited, the CPU 71 of the control device 70 updates the image processing data (step S210) and returns to step S130 to perform image processing again based on the updated image processing data. If the control device 70 determines that an image processing error has not occurred as a result of the image processing based on the updated image processing data, the control device 70 performs a process of step S150 for mounting the sucked component on the substrate 16. On the other hand, if it is determined that the image processing data has not been edited, the process returns to step S110 to discard the picked-up component and redo the pick-up of the component by the pick-up nozzle 52 to perform the processing from step S120.

  FIG. 6 is a flowchart illustrating an example of an image processing error recovery process executed by the CPU 81 of the management apparatus 80. When the image processing error recovery process is executed, the CPU 81 of the management apparatus 80 first determines whether or not error information transmitted from the component mounter 11 has been received (step S300), and has received the error information. If it is determined that there is no image processing, the image processing error recovery processing is finished. On the other hand, if the CPU 81 of the management device 80 determines that the error information has been received, a coping method database stored in advance in the HDD 83 indicates a coping method for eliminating the error based on the content of the error specified based on the error information. (Step S310). FIG. 7 is an example of a countermeasure database. As shown in the figure, the coping method database stores the error contents and coping methods in association with each other. Specifically, the countermeasures against the suction displacement are the low-speed suction that changes the operation mode when sucking the component with the suction nozzle 52 to the low-speed operation mode, and the target of the XY axes of the suction nozzle 52 when sucking the component. A suction position change that brings the stop position closer to the center position of the component, an image processing data edit that changes the permissible range of the suction position with respect to the center position of the component, a suction nozzle 52, a head 50, a component supply device 20 (tape feeder), etc. There are nozzles, heads, and feeders to be replaced. In addition, there are two methods for dealing with shape errors: image processing data editing for changing the reference outer shape and allowable range, and component replacement for replacing components supplied by the component supply device 20 with those within the standard. As countermeasures against suction mistakes, there are low-speed suction, suction position change, and nozzle / head / feeder replacement.

  When the coping method corresponding to the content of the error is retrieved in this way, the CPU 81 of the management device 80 selects any one of the coping methods hit by the retrieval (step S320). In the present embodiment, each of the plurality of coping methods stored in the coping method database has a priority order. In the process of step S320, when a plurality of coping methods corresponding to the error content are hit, the one with the highest priority among the plurality of coping methods is selected. When the coping method is selected in this way, the CPU 81 of the management device 80 calls an operator by notifying an error by turning on an unillustrated warning lamp or outputting a buzzer sound (step S330), and image processing error by the selected coping method. An error handling screen is displayed on the display 88 for requesting permission from the operator to deal with (Step S340). The operator can select whether or not to permit handling with the presented handling method by operating the input device 87 on the error handling screen. Details of the error handling screen will be described later.

  If it is determined that the operator has permitted to deal with the selected coping method (“YES” in step S350), the CPU 81 of the management device 80 transmits a control command and data regarding the permitted coping method to the control device 70. As a result, the coping method is reflected on the component mounter 11 (step S360), a production resumption command is transmitted to the control device 70 (step S370), and the image processing error recovery processing is terminated. As a result, the control device 70 that has received the production resumption command releases the standby state and resumes the mounting of the components.

  On the other hand, when it is determined that the worker does not permit to cope with the selected coping method (“NO” in step S350), the CPU 81 of the management device 80 firstly selects the coping method searched in the process of step S310. It is determined whether there is another coping method different from the presented coping method (step S380). If it is determined that there is another coping method, the coping method is newly selected (step S390), and the process proceeds to step S340. Go back and display the error handling screen according to the newly selected countermeasure. If it is determined that there is no other coping method, the CPU 81 of the management device 80 transmits a production stop command to the control device 70 (step S400), and ends the image processing error recovery processing. Accordingly, the control device 70 that has received the production stop command cancels the standby state and stops the mounting of the components.

  8 to 13 are examples of error handling screens. The error handling screen shown in FIG. 8 is a first suction deviation requesting the operator permission to change the suction operation when sucking a component with the suction nozzle 52 to the low speed operation mode as a countermeasure for eliminating the suction deviation. It is a corresponding screen. The low-speed operation is defined as a countermeasure with the highest priority for the adsorption deviation. When the adsorption deviation occurs, first, the first adsorption deviation correspondence screen of FIG. 8 is displayed. The operator can select whether to permit the change to the low-speed operation mode by operating the input device 87 and selecting “Yes” or “No”.

  The error handling screen in FIG. 9 permits permission to bring the target stop position on the XY axes of the suction nozzle 52 close to the center position of the component when offsetting the component as a countermeasure for eliminating the suction deviation. It is a 2nd adsorption | suction deviation corresponding | compatible screen calculated | required of an operator. In this second pick-up offset correspondence screen, the mark ○ indicates the pick-up position, the mark x indicates the center position of the component, the rectangular area including the mark x indicates the allowable range, and the arrow indicates the state in which the pick-up position is offset. Yes. For the suction position change, the second priority is given to the suction displacement, and when the operator does not permit the low speed operation described above, the second suction displacement correspondence screen of FIG. 9 is displayed. The Rukoto. The operator can select whether to permit changing the target stop position by operating the input device 87 and selecting “Yes” or “No”.

  The error handling screen shown in FIG. 10 is a third suction shift that asks the operator for permission to change the allowable position of the suction position with respect to the center position of the component (image processing data editing) as a countermeasure for eliminating the suction shift. It is a corresponding screen. This third suction displacement handling screen shows a state in which the rectangular area indicating the permissible range is enlarged so as to include the circle mark indicating the suction position. In the image processing data editing, when the priority is set to the third coping method with respect to the suction displacement, and the operator does not permit the above-described suction position change, the third suction displacement correspondence screen of FIG. Will be displayed. The operator can select whether or not to allow image processing data editing by operating the input device 87 and selecting “Yes” or “No”.

  The error handling screen in FIG. 11 is a fourth suction deviation handling screen that prompts the operator to replace the suction nozzle 52, the head 50, or the component supply device 20 (feeder) as a countermeasure for eliminating the suction shift. is there. The replacement of the suction nozzle 52 and the like is set in the fourth countermeasure method with respect to the suction shift, and when the operator does not permit the above-described image processing data editing, the fourth suction shift in FIG. A corresponding screen will be displayed. The operator can select whether or not to permit replacement of the suction nozzle 52 and the like by operating the input device 87 and selecting “Yes” or “No”. When “Yes” is selected, the CPU 81 of the management apparatus 80 waits until it is confirmed in step S360 of the image processing error recovery process that the suction nozzle 52 and the like have been replaced, and the replacement work is completed. Is confirmed, a production resumption command is transmitted to the control device 70 in step S370. Note that the confirmation of the replacement work is performed, for example, by receiving an operation of the input device 87 indicating completion of the replacement work from an operator, or based on a signal from a sensor that detects attachment / detachment of the suction nozzle 52 or the like. Can do.

  The error handling screen in FIG. 12 permits permission to change the reference outline and allowable range for the shape of the component recognized based on the captured image (image processing data editing) as a countermeasure for solving the shape error of the component. It is a 1st part shape error corresponding | compatible screen calculated | required of an operator. In the first part shape error handling screen, the alternate long and short dash line indicates the reference outline, and the rectangular annular region including the alternate long and short dash line indicates the allowable range. Image processing data editing is defined as a countermeasure with the highest priority for shape errors. When a shape error occurs, the first shape error handling screen shown in FIG. 12 is displayed first. The operator can select whether or not to allow image processing data editing by operating the input device 87 and selecting “Yes” or “No”.

  The error handling screen shown in FIG. 13 is a second part shape error handling screen that prompts the operator to replace a part to be used as a countermeasure for solving the part shape error. Image processing data editing is defined as the second countermeasure method for shape errors, and when the operator does not permit the above-described image processing data editing, the second part shape error handling in FIG. A screen will be displayed. The operator can select whether to permit replacement of parts by operating the input device 87 and selecting “Yes” or “No”. In this case, the CPU 81 of the management apparatus 80 waits until it is confirmed in step S360 of the image processing error recovery process that the parts replacement work is completed, and when the completion of the replacement work is confirmed, the production resumes in step S370. The command is transmitted to the control device 70. Note that the confirmation of the replacement work is performed, for example, by receiving an operation of the input device 87 indicating completion of the replacement work from an operator, or based on a signal from a sensor that detects attachment / detachment of the component supply device 20. Can do.

  The management device 80 of the present embodiment described above stores in advance the contents of the image processing error and the coping method for solving the error in association with each other, and resolves the generated error when an image processing error occurs. To display the error handling screen as an error handling screen and ask the worker for permission to deal with the displayed handling method. Then, when the management device 80 permits the operator to cope with the displayed countermeasure, the management apparatus 80 reflects the countermeasure on the operation of the component mounter. As a result, the operator can deal with the image processing error only by selecting whether or not to allow the handling by the presented handling method by operating the input device 87 on the error handling screen. Therefore, the work burden on the operator can be greatly reduced, and the production efficiency can be improved.

  In particular, the management device 80 according to the present embodiment, when a component suction deviation occurs as an image processing error, causes the suction nozzle 52 to suck a component when the component mounter 11 is operated in the low speed operation mode. Since the stopping accuracy is improved, the suction error may be solved by this, and the suction shift can be appropriately dealt with. Of course, the operator can deal with the error only by confirming the display content and determining whether or not to permit the execution of the low-speed operation mode, so the work load can be reduced.

  In addition, when a component suction deviation occurs as an image processing error, the management device 80 according to the present embodiment widens the allowable range of the suction position recognized based on the captured image with respect to the center position of the component (image processing data is reduced). Edit) may eliminate the error in the adsorption deviation, and can appropriately deal with the adsorption deviation. Of course, since the operator can deal with the error only by checking the display contents and determining whether or not to permit editing of the image processing data, the work load can be reduced.

  Furthermore, the management device 80 according to the present embodiment changes the reference shape and the allowable range for the shape of the component recognized based on the captured image when a component shape error occurs as an image processing error (image processing data editing). Then, the shape error may be solved, and the shape error can be appropriately dealt with. Of course, since the operator can deal with the error only by checking the display contents and determining whether or not to permit editing of the image processing data, the work load can be reduced.

  Further, the management device 80 according to the present embodiment stores a plurality of coping methods for one type of error in advance, and when an image processing error occurs, searches for a coping method corresponding to the content of the error, One of the plurality of retrieved countermeasures is selected, and an error handling screen for requesting permission from the worker to deal with the selected countermeasure is displayed. Then, when the selected countermeasure method is not permitted by the operator, the management device 80 newly selects another countermeasure method different from the previously selected countermeasure method, and selects the newly selected countermeasure method. Display error handling screen based on As a result, the management apparatus 80 can select an optimum handling method for one error, and can deal with the error more appropriately. Further, since the worker only needs to determine whether or not to implement the handling method of the error handling screen, the work load does not increase.

  Although the management device 80 of the present embodiment has exemplified low speed suction, suction position change, image processing data editing, and nozzle / head / feeder replacement as methods for dealing with suction displacement, it is not limited to these. For example, the first imaging mode in which the part sucked by the suction nozzle 52 is temporarily stopped above the parts camera 54 and then the parts are picked up by the parts camera 54, and the part sucked by the suction nozzle 52 is placed above the parts camera 54. The component mounter of the type including the second imaging mode in which the parts are captured by the parts camera 54 at a timing when the parts are positioned above the parts camera 54 is used in the second imaging mode. If an image processing error occurs based on the image captured in step 1, the operator may be asked for permission to change to the first imaging mode as a method for dealing with the error.

  The management device 80 according to the present embodiment has been one that urges the operator to replace the suction nozzle 52, replace the head 50, or replace the component supply device 20 (feeder) as one of the countermeasures against suction displacement or suction mistake. However, only one or two of them may be obtained, or replacement of the feeder mounting base 24 may be obtained.

  Although the management apparatus 80 of the present embodiment determines the presence or absence of an image processing error by comparing an image captured by the parts camera 54 with a reference image stored in advance, the present invention is not limited to this. Alternatively, the presence or absence of an image processing error may be determined by determining whether or not a mark recognized based on an image captured by the mark camera 56 is within an allowable range with respect to a reference shape stored in advance. Good. In this case, when an image processing error occurs, the management device 80 displays, for example, an error handling screen for requesting permission from the operator to change the reference shape or allowable range of the mark (editing of image processing data), When the permission input is made by the operator, the editing result of the image processing data can be reflected on the component mounter 11.

  Although the management apparatus 80 of the present embodiment is exemplified for managing the component mounting machine 11, it is not limited to this, and is not limited to this. It can be used for the management of any other substrate working machine such as a coating machine for applying (adhesive), an inspection machine for inspecting the mounting state of components mounted on a board. When managing the printing press, for example, the management device images the solder printed on the board, and takes a captured image obtained by imaging and a reference image (image processing data) of a normal print state created in advance. In comparison, it is possible to detect a printing error by determining whether or not the printed solder shape is within an allowable range with respect to the reference shape. When the management device detects a printing error, for example, the management device displays an error handling screen that asks the operator to change the reference shape or allowable range (edit the image processing data). When the permission input is made by, the editing result of the image processing data is reflected on the printing press. Further, when managing the coating machine, for example, the management device images the coating agent applied to the substrate, the captured image obtained by imaging, and a reference image (image processing data) of a normal application state created in advance. And the application error can be detected by determining whether or not the shape of the applied coating agent is within an allowable range with respect to the reference shape. When the management apparatus detects an application error, for example, the management apparatus displays an error handling screen that asks the operator to change the reference shape or allowable range (edit the image processing data). When the permission input is made, the editing result of the image processing data is reflected on the coating machine. Furthermore, when managing the inspection machine, for example, the management device images a component mounted on a board, a captured image obtained by imaging, and a reference image (image processing data) of a normal mounting state created in advance. By comparing these, it is possible to detect a mounting error by determining whether or not the position of the mounted component with respect to the substrate is within an allowable range with respect to the reference position. When the management apparatus detects a mounting error, for example, the management apparatus displays an error handling screen requesting the worker to change the reference position and the allowable range (edit the image processing data) to the worker, When the permission input is made, the edited result of the image processing data is reflected on the inspection machine.

  The correspondence between the main elements of the embodiment and the main elements of the invention described in the column of means for solving the problem is the same as that of the embodiment described in the column of means for solving the problem. Therefore, the elements of the invention described in the column of means for solving the problems are not limited. In other words, the interpretation of the invention described in the column of means for solving the problems should be made based on the description of the column, and the examples are those of the invention described in the column of means for solving the problems. It is only a specific example.

  The embodiments of the present invention have been described using the embodiments. However, the present invention is not limited to these embodiments, and can be implemented in various forms without departing from the gist of the present invention. Of course you get.

  The present invention can be used in the manufacturing industry of a substrate working machine.

  DESCRIPTION OF SYMBOLS 1 Component mounting system, 10 Component mounting line, 11, 11a-11d Component mounting machine, 12 base, 14 body frame, 16 circuit board, 18 support stand, 20 component supply apparatus, 22 tape feeder, 22a reel, 22b feeder part, 24 Feeder mounting base, 30 Substrate transport device, 32 Belt conveyor device, 40 Component mounting device, 42 Guide rail, 44 X axis slider, 44a X axis position sensor, 44b X axis actuator, 46 guide rail, 48 Y axis slider, 48a Y-axis position sensor, 48b Y-axis actuator, 50 heads, 52 suction nozzle, 54 parts camera, 56 mark camera, 58 nozzle stocker, 59 solenoid valve, 70 controller, 71 CPU, 72 ROM, 73 HDD, 74 RAM, 75 Input / output interface , 76 bus, 80 management unit, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input-output interface, 86 bus, 87 input device, 88 display.

Claims (5)

The occurrence of an error based on a captured image obtained by imaging a work object related to the work configured to perform a predetermined work on the board and image processing data created in advance, and the type of error that has occurred Is a management device that manages a substrate work machine capable of detecting
Storage means for storing a coping method for coping with the error for each type of error;
Input means for inputting instructions from the operator;
When the occurrence of the error is detected, a coping method corresponding to the type of the detected error is acquired from the storage unit, and based on the acquired coping method, a reference outer shape or an allowable range for the shape of the work object Display means for displaying an image showing at least one of the changes and an error handling display for requesting permission to deal with the detected error;
When a permission input is made by the input means for the error handling display, a handling method corresponding to the detected error including a change in at least one of a reference external shape or an allowable range with respect to the shape of the work object is selected . Reflection means to reflect on the substrate work machine,
A management apparatus comprising: The management device according to claim 1,
The storage means stores a plurality of the coping methods for a plurality of types of errors,
When the occurrence of the error is detected, the display means acquires any one of a plurality of coping methods corresponding to the detected error type from the storage means based on the priority order. When the error handling display based on the handling method is performed and a non-permission input is made to the error handling display by the input unit, the error handling display is acquired first among the plurality of handling methods corresponding to the type of the detected error. A management apparatus characterized in that a new handling method different from the handling method is acquired based on the priority order, and the error handling display is performed based on the acquired handling method . The management device according to claim 1 or 2, wherein
The substrate working machine is a component mounting machine that picks up a component with a suction nozzle and mounts it on a substrate, and picks up the picked-up component and recognizes the component recognized based on the component image obtained by the image pickup. It is possible to detect a suction error in which the suction position of the suction nozzle does not match the reference suction position data included in the image processing data,
The storage means, as a coping method for coping with the adsorption error, is an operation in the high-speed operation mode in which the adsorption nozzle starts to descend at least a predetermined distance before the target position in the direction along the substrate surface. Decreasing the suction nozzle after the movement speed or acceleration of the suction nozzle when sucking a part is reduced as compared with the high-speed operation mode and the movement of the suction nozzle in the direction along the substrate surface is stopped. Memorize the low speed operation mode to change to start,
When the occurrence of the suction error is detected, the display means performs a suction error correspondence display requesting permission to set the low speed operation mode,
The management device according to claim 1, wherein the reflection unit operates the component mounter in the low-speed operation mode when a permission input is made by the input unit with respect to the suction error handling display . The management device according to any one of claims 1 to 3,
The substrate working machine is a component mounting machine that picks up a component with a suction nozzle and mounts it on a substrate, and picks up the picked-up component and recognizes the component recognized based on the component image obtained by the image pickup. It is possible to detect a suction error in which the suction position of the suction nozzle does not match the reference suction position data included in the image processing data,
The storage means stores at least an edit mode for editing the reference suction position data as a handling method for handling the suction error;
When the occurrence of the suction error is detected, the display means performs a suction error correspondence display for requesting permission to change the reference suction position data in the edit mode,
The reflecting means edits the reference suction position data so that the suction position of the component matches the reference suction position data when permission is given by the input means to the suction error correspondence display. Management device. The management device according to any one of claims 1 to 4,
The substrate working machine is a component mounting machine that picks up a component with a suction nozzle and mounts it on a substrate, and picks up the picked-up component and recognizes the shape of the component based on the component image obtained by the image pickup Alternatively, it is possible to detect a shape error whose size does not conform to the reference shape data included in the image processing data,
The storage means stores at least an edit mode for editing the reference shape data as a handling method for dealing with the shape error,
When the occurrence of the shape error is detected, the display means performs a shape error corresponding display for requesting permission to change the reference shape data in the edit mode,
The reflecting means edits the reference shape data so that the shape of the part matches the reference shape data when permission input is made by the input means for the display corresponding to the shape error. apparatus.