JPH11168297A - Judging method and correcting method of working position of work machine, and work machine using thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To judge and correct working position on a work machine in a highly precise manner, and to obtain a product of high quality. SOLUTION: A recognition marks 11, with which the prescribed work position where various kinds of works are performed by a work machine, is provided with a prescribed positional relation with an outer circumference of the surface where work is conducted. Images 12a and 12b, on which work is performed by the work machine of a symmetrical substance of work 31, and the recognition mark 11 corresponding to the images 12a and 12b is image-picked up by the same visual field of a recognition camera 1, image treatment is performed, and the image 12a and 12b in the above-mentioned same visual field, on which work is performed, and the position of the recognition mark 11 are image recognized. A deviation is measured from the above-mentioned positional relation between the position of the recognized work- finished images 12a and 12b and the recognition mark 11, the actual work position is judged by the result of the above-mentioned measurement, and the position of work is corrected in accordance with the work position data based on the above-mentioned judgement.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine for mounting an electronic component on a circuit board, an adhesive applying machine for applying an adhesive in a previous process, and a cream solder printing machine for performing a cream solder printing in a first process. The present invention relates to a work position determination method and a correction method for optimizing each work position in a work machine such as a work machine, and a work machine using the same.

[0002]

2. Description of the Related Art In the above-mentioned working machine, a position of a circuit board a as an object to be worked on the working machine as shown in FIG. A predetermined position to be image-recognized and to be operated in accordance with the recognized work program on the circuit board a is set as a coordinate position on the circuit board a, and the cream solder is printed and the adhesive is applied to the set coordinate position. And the operation of mounting electronic components. However, in actual work, misalignment often occurs, and work may not be performed at an appropriate position.

Therefore, conventionally, the position of the circuit board a is recognized by the recognition marks b and c of the circuit board a immediately before operations such as printing of cream solder, mounting of electronic parts, and application of an adhesive. A work is actually performed on a predetermined position of the circuit board a based on the work position, an offset amount of the work position from an appropriate position is determined, and a correction value for correcting the work position by the offset is set according to the determination result. Each time the work is performed, the position correction for the offset is performed based on the correction value. In particular,
In step 11, the circuit board a is carried into the apparatus, and in step 1
In step 2, the substrate is set in the XY table, mark recognition is performed in step 13, and the position of a preset offset is corrected in step 14 to perform a printing operation.
The substrate on which solder printing has been performed is carried out, and the process is repeated up to the final substrate in step S16.

FIG. 7 shows a sample board a for measuring the offset amount, in which a cream solder d printed, an applied adhesive e, and a mounted electronic component f coexist for convenience of explanation. is there. In fact, the work positions where these are located can be image-recognized as an image after the work, such as a solder print pattern, an adhesive application pattern, and a plane putter of a mounted electronic component. An actual work position on the circuit board a can be detected by image recognition, and a recognition camera g for recognizing images of the recognition marks b and c provided on the work machine conventionally in image recognition of each of these work positions. Is shared.

At this time, the distance between the recognition marks b and c at the corners deviating from the printed wiring pattern and the working positions of the cream solder d, the adhesive e and the electronic components f on the printed wiring pattern are mutually different. Since the recognition camera g is so far away that the imaging field of view is small, the recognition camera g takes an image of the recognition mark b or c, and is moved from the imaging position s1 to each of the work positions s2 to s4 by the moving mechanism.

[0006]

By the way, recently,
In order to manufacture electronic circuit boards, each work requires higher positional accuracy due to miniaturization of electronic components, finer wiring patterns, and higher mounting density.

[0007] However, in the above-described conventional position detection method, when a high-precision facility is to be used appropriately while compensating for a positional deviation due to a change in ambient temperature or the like occurring during operation, a recognition camera or the like is required. Since the operation of the mechanism for moving this is accompanied, the error of the mechanical positioning at that time affects, and the error of the working position cannot be measured with high accuracy. Also, the accuracy of the offset amount correction based on this does not similarly increase.

For these reasons, the correction is repeated until a satisfactory work position accuracy is obtained, which requires much labor and a long time. In addition, the recognition camera 1 is recognized by the recognition marks b and c.
There is also a loss of time to move between the and the work position.

On the other hand, it is easy to determine when measurement is performed by an inspection machine, which is another facility. However, a manual offset correction operation is required in which the measurement data is brought back to the work machine and the operator visually performs position adjustment.

An object of the present invention is to provide a method of determining and correcting a work position in a work machine capable of highly accurately determining and correcting a work position and obtaining a high quality product, and a work machine using the same. It is in.

[0011]

The method of determining a working position in a working machine according to the present invention is described as printing cream solder on a work object to be worked by the working machine, applying an adhesive, and mounting components. A recognition mark for recognizing a predetermined work position where various work is to be performed is provided in a predetermined positional relationship around the work surface to be subjected to the work, and the work actually performed by the work machine on the work object After the image and the corresponding recognition mark, the corresponding image is captured in the same field of view of the recognition camera to perform image processing, image recognition of the position of the work after image and the previous recognition mark in the same field of view, It is characterized in that the deviation of the recognized position of the image after the work from the position of the recognition mark from the predetermined positional relationship is measured, and the actual work position is determined based on the measurement result.

In such a configuration, when a recognition mark for recognizing a predetermined work position on the work object is taken by the recognition camera after the work to that position, the predetermined work position set inside the image of the recognition mark is obtained. The image after work is also captured at the same time, and the position and positional relationship between the recognition mark and the corresponding image after work are captured on the same captured screen using the information on the same captured screen to determine the movement of the recognition camera and the like. Image recognition and measurement can be performed without any influence. By comparing the measured positional relationship with a predetermined positional relationship between the recognition mark and a predetermined working position, the position of the actually performed work can be shifted. Can be determined with high accuracy.
In addition, the recognition camera only needs to have a visual field capable of capturing the recognition mark, and the recognition camera for work for recognizing the position of the work target by the recognition mark can be used.

In this case, it is preferable that the position of the image after the work and the position of the recognition mark are recognized at the respective center positions, since the positional relationship between the two can be clearly grasped with a small amount of position data. The working position correction method in the working machine of the present invention,
3. A work result at a predetermined position on a work object at a predetermined position according to work position data stored in a storage means, wherein the work result after the work is determined by the determination method according to claim 1 or 2. Based on this, the work position is corrected based on the work position data stored in the storage means.

In such a configuration, as necessary, for example, after a dummy work or an actual work at the initial stage of working with a work machine, at a regular time during a continuous work, when a trouble occurs, or when restarting after an interruption of the work. At any point in time, the work position can be determined with high accuracy, and the work position is corrected based on the work position data for performing the work with the work machine according to the result of the determination. Achieved.

The work machine of the present invention positions a work object during loading and unloading, and performs work stored in the storage means based on the position where the work object is imaged by a recognition camera and image recognition is performed. In a working machine that performs work at a predetermined position on the work object in accordance with the position data, an image of the work object after work and a recognition mark provided around the outside of the work position in a predetermined positional relationship with the work image. Means for measuring the amount of deviation of the recognition position of the image after work from the predetermined positional relationship with respect to the recognition position of the recognition mark by image processing at that time, and according to the measurement result. Means for correcting a work position based on work position data stored in the storage means.

With this configuration, the working machine can determine the position and positional relationship between the image after the work and the corresponding recognition mark for the work object after the work at the time of need, when necessary. By performing image recognition and measurement with high accuracy by imaging and image processing, and correcting the work position based on the work position data stored in the storage means in accordance with the measurement result, timely operation of dedicated means can be performed. Work can be always ensured with high positional accuracy, while automatically and reliably achieving the work.

Such a working machine includes an electronic component mounting machine for mounting electronic components for manufacturing an electronic circuit board on a circuit board, an adhesive applicator for applying an adhesive which is a pre-process thereof,
Further, the present invention is suitably applied to a cream solder printing machine for performing cream solder printing in the first step.

Further objects and features of the present invention will become apparent from the following detailed description and drawings.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for determining and correcting a work position in a working machine according to the present invention, and a working machine using the same will be described below with reference to the accompanying drawings together with examples.

This embodiment is an example of a cream solder printing machine that prints cream solder as a working example at a predetermined position on a circuit board as shown in FIG. 1 as a work object.

However, the present invention is not limited to this, and can be similarly applied to various work machines that perform various works in which a work result is captured as a recognizable image at a predetermined position.

In the working machine shown in FIG. 1, the drive unit 23 shown in FIG. 4 is operated under the control of the operation of the control unit 22 to perform a series of operations. Briefly, a circuit board 31 as shown in FIG. 3, which is a work object, is loaded from a board loading section 3a at one end of the transport section 3, and the loaded circuit board 31 is loaded.
Is X that moves in the XY2 directions orthogonal to each other when viewed from the plane
The position is held on the Y table 2 and held, and it is positioned at the imaging position shown in FIGS. 1 and 2 by the board recognition camera 1 and the printing position at the screen printing unit 4, and the imaging and screen printing by the board recognition camera 1 are performed. The printing is performed by the copy unit 4. The printed circuit board 31 is unloaded from the board unloading section 3b at the other end of the transfer section 3.

The board recognition camera 1 operates in a timely manner in accordance with the control unit 22 shown in FIG. 4 performing the work in accordance with a work program stored in a suitable internal or external storage means 24, for example, an NC program. And the circuit board 31
Circuit board 3 each time is loaded and positioned at the imaging position.
A board recognition mark 3 as shown in FIG. 3 provided at one corner where there is no printed wiring pattern, for example, at two locations on a diagonal line.
2 and the like are imaged. The image information at that time is subjected to image processing by the image recognition processing unit 21, and the position of the circuit board 31 on the XY table 2 is image-recognized. After the position recognition, the circuit board 31 is moved to the printing position. At this time, the screen printing unit 4
Is operated, based on the recognized position of the circuit board 31 as a reference, according to the NC program and the work position data set therein, at a predetermined position on the circuit board 31 at the printing position, for example, as shown in FIG. The cream solders 12a and 12b are printed in an appropriate pattern.

However, in recent years, with high-precision equipment corresponding to miniaturization of electronic parts, high-density mounting, and denseness of a printed wiring pattern, a screw shaft for changing ambient temperature during operation or performing various movements is required. There is also a problem with a slight displacement of the working position, that is, the printing position, which is caused by factors such as the processing accuracy.

To correct this, it is first necessary to determine the suitability of the actual work position and the offset amount with high accuracy. Therefore, in the present embodiment, a recognition mark 11 for recognizing a predetermined work position at which a work such as printing is to be performed as shown in FIG. 3 is placed on a circuit board 31 which is an example of a work target. Provided with a predetermined positional relationship around the outer periphery of the work surface, an image of the cream solders 12a and 12b after the work actually printed or the like on the circuit board 31 and the recognition mark 11 corresponding to the image are printed on a board recognition camera. 1. The image is taken in the same visual field 10a or 10b shown in FIG. 3 and subjected to image processing by the image recognition processing section 21, and the images of the cream solders 12a and 12b after the work in the same visual field and corresponding to them. The position with the recognition mark 11 is image-recognized, and the position of the solder creams 12a and 12b of the recognized image after the work is determined by a predetermined position with respect to the position of the recognition mark 11 and a preset work position. The deviation from the relationship measure, determines the propriety or offset amount of the actual working position in the measurement result.

In one embodiment, the recognition mark 11 is a copper foil applied to the circuit board 31 at the same time as the printed wiring pattern, and has a predetermined relationship with the board recognition mark 32. Substrate 3
1 is equivalent to the board recognition mark 32 as a criterion for determining the position of the work to be performed in accordance with the work position data based on the position 1. However, the present invention is not limited to this, and the recognition mark may be applied in any manner. Further, since the copper foil has such a size as to protrude and surround the pattern of the cream solders 12a and 12b applied by the working machine, it is convenient for image recognition of both positions. However, any wiring pattern may be used as long as the work position can be specified, and a continuous contour is not necessarily required.

When such a recognition mark 11 is picked up by the board recognition camera 1 or the like after the work to that position, cream solder, which is an image after work to a predetermined work position set inside the image of the recognition mark 11, is provided. 12a and 12b are also imaged at the same time. For this reason, the position and positional relationship between the recognition mark 11 and the corresponding image of the cream solders 12a and 12b after the work are determined on the same imaged screen or from the image information. Image recognition and measurement can be performed without influence, and by comparing the measured positional relationship with the predetermined positional relationship between the recognition mark and the predetermined working position, the presence / absence and amount of displacement of the position of the actually performed work Can be determined with high accuracy. In addition, it is sufficient for the imaging to have a visual field capable of imaging the recognition mark 11,
The board recognition camera 1 having a small field of view and installed in the work machine can be shared.

As shown in FIG. 3, in order to recognize the positions of the images of the cream solders 12a and 12b after the operation and the positions of the recognition marks 11, the centers 13a and
13b and the center position 14a of the cream solders 10a and 10b are recognized by comparison with each other, so that the positional relationship between the two can be clearly grasped with a small amount of position data, which is preferable. Center position 13 in imaging field of view 10a on the left side of FIG.
Although a and 14a are displaced in the XY2 direction, the center positions 13b and 14a in the right imaging field of view 10a match. Therefore, the work position based on the work position data of the NC program that defines the work position for the left recognition mark 11 is corrected by the actually generated offset so that the center positions 13a and 14a match in the subsequent work.

In order to actually proceed with the work using the work machine, it is necessary to perform a dummy work or an actual work at an early stage of the work, a periodic time during continuous work, a trouble occurrence, or a restart after the work is interrupted. The work position can be determined with high accuracy at any point in time according to the above, and by correcting the work position on the working machine according to the result of the determination, the work can be achieved with high position accuracy.

The working machine according to the present embodiment employs a circuit board 31 as a work object after work and a cream solder as an image after the work so that such determination and correction are automatically achieved in the work. 12a and 12b and a recognition mark 11 provided around the outer periphery of the work position in a predetermined positional relationship are imaged by the board recognition camera 1, and image processing by the image recognition processing unit 21 at that time is performed. Determination control means 41 for measuring the amount of deviation of the recognized positions of the images of the cream solders 12a and 12b from the predetermined positional relationship with respect to the recognized position of the recognition mark 11, and stored in the storage means 24 according to the measurement result. And a correction control unit 42 for correcting the work position based on the NC program work position data provided as an internal function of the control unit 22.

The control unit 22 performs interrupt control at an appropriate timing for the operation of the NC program by an artificial input or by setting a judgment / correction mode which is automatically issued at the time of the various needs described above. If the work to be corrected has been completed, the determination control means 41 and the correction control means 42 are preferentially operated after finishing the work if not completed, and the determination and correction are performed. What is necessary is just to return to the normal work, and thereby the necessary work position judgment and correction can be automatically and reliably achieved by the timely operation of the dedicated means, respectively.
It is always possible to guarantee high-precision work.

In such a control of the correction mode, the circuit board 3 which is the work object after the work to be corrected is completed.
Reference numeral 1 denotes a board recognition camera 1 using an XY table 2 or the like.
It is preferable that the operation control to automatically return the XY table 2 and the substrate unloading unit 3b after the image is returned to the imaging position by the determination control unit 41 is performed.

One specific example of such control will be described with reference to the flowchart shown in FIG.

In step 1, the production work (printing) of the first printed circuit board is normally performed as a dummy, and it is moved to a position where an image can be taken by the board recognition camera in step 2. An image of the printed cream solder pattern is taken using the board recognition camera 1. Then, the image recognition processing unit 21 calculates a correction amount by image recognition of a deviation of the center of the positions. At this time, the measured value is multiplied by a factor of 1 to 0.1 to obtain a correction value, thereby preventing the divergence of the correction value when the correction is repeated.

In step 4, the printed circuit board after the production has been subjected to the measurement is carried out, and in step 5, the work position data in the NC data is corrected by the offset amount (for this, the storage means is used). 24 is used.), The printed circuit board is loaded in preparation for the next production in Step 6, the board mark of the loaded printed circuit board is recognized in Step 7, and the drive is performed by a command from the control unit 22 in Step 8. The part 23 is moved. Then, a printing operation is performed in step 9, and this operation is repeated in step 10 up to the final circuit board.

FIG. 6 exemplifies a case where an adhesive is applied and a case where an electronic component is mounted in addition to the case where the above-described determination of the work position is performed at the time of printing the cream solder. . In any case, the recognition mark 11 is also a copper foil mark, but is provided at a corner of the printed circuit board 51 where there is no printed wiring pattern, and the dummy cream solders 52a, 52
The printing is performed, the dummy adhesives 53a and 53b are applied, and the dummy chip components 54a and 54b are mounted, and the determination is performed. Thereby, there is an advantage that a small pattern advantageous for image recognition can be set and a simple determination can be made. If a pair of diagonal lines are provided as shown in FIG. It is preferable.

[0037]

According to the method of determining a work position in a work machine according to the present invention, the same image pickup by the recognition camera is performed so that the image after the actual work falls inside the recognition mark corresponding to the position to be worked. It is possible to take an image on the screen, measure the positions and positional relationships with high accuracy without moving the recognition camera, and therefore without the influence of the movement, and determine the working position with high accuracy. According to the correction method for correcting the work position data to be performed by the work machine, the work after the correction is achieved with high positional accuracy, miniaturization of electronic components in manufacturing an electronic circuit board, printed wiring pattern It can respond to the demand for higher precision by increasing the density of components and increasing the density of component mounting. In addition, since the field of view of the recognition camera is small and no special device is required, the one normally used in the working machine can be shared, and it can be put into practical use easily without increasing the cost without moving to another dedicated machine.

According to the working machine of the present invention, the above-mentioned judgment and correction are automatically and surely and promptly achieved at each time as required, and a highly accurate position is always obtained even when there is a change in room temperature. Since the work can be performed with accuracy, the quality of the product to be worked is improved.

[Brief description of the drawings]

FIG. 1 is an overall perspective view showing a cream solder printing machine as a working machine according to an embodiment employing a method for determining and correcting a working device of the present invention.

FIG. 2 is a perspective view showing a board recognition camera and an XY table of the work machine of FIG. 1;

FIG. 3 is an explanatory diagram showing a relationship between a recognition mark on a circuit board for determining a work position in the work machine of FIG. 1 and an image after work.

FIG. 4 is a block diagram of a control device of the work machine shown in FIG. 1;

FIG. 5 is a flowchart of an embodiment showing a printed circuit board production (printing) process involving determination and correction of a work position of the work machine of FIG. 1;

FIG. 6 is an explanatory diagram showing an example of use of a printed circuit board used for a dummy operation for determining an operation position in the process of FIG. 5;

FIG. 7 is a diagram showing a positional relationship between a recognition mark on a printed circuit board and an image after work in a conventional correction method based on image recognition of a work position.

FIG. 8 is a flowchart showing a process of manufacturing a printed circuit board with position correction in a conventional working machine.

[Explanation of symbols]

 Reference Signs List 1 board recognition camera 2 XY table 3a board carry-in section 3b board carry-out section 4 screen printing section 10a, 10b imaging field of view of board recognition camera 11 recognition mark 12a, 12b printed cream solder 13a, 13b center position of recognition mark 14a, 14b Center position of cream solder 21 Image recognition processing unit 22 Control unit 23 Drive unit 52a, 52b Mark used in cream solder printing machine 54a, 54b Mark used in electronic component mounting machine 53a, 53b Mark used in adhesive applicator 31 , 51 circuit board 32 board recognition mark

Claims (7)

[Claims] 1. A recognition mark for recognizing a predetermined work position at which various operations such as printing of cream solder, application of an adhesive, and mounting of components on a work object to be worked by a work machine are performed. Provided with a predetermined positional relationship around the outer surface of the work surface to be subjected to the work, the image after the work actually performed by the work machine on the work object and the corresponding recognition mark are identified by the same recognition camera. Image in the field of view, perform image processing, image-recognize the image after work and the position of the pre-recognition mark in the same field of view, and position the recognized image after work with respect to the position of the recognition mark. A method for determining a work position in a work machine, wherein a deviation from a predetermined positional relationship is measured, and an actual work position is determined based on the measurement result. 2. The method according to claim 1, wherein the position of the image and the position of the recognition mark after the operation recognize respective center positions. 3. The determination according to claim 1, wherein the work is performed on the work object after the work to perform the work at the predetermined position on the work object at the predetermined position in accordance with the work position data stored in the storage means. A work position correction method for a work machine, wherein the work position is corrected based on work position data stored in a storage unit based on a determination result by the method. 4. A work object is positioned during loading and unloading, and the work object is imaged by a recognition camera and image recognition is performed, and the work is performed according to work position data stored in storage means. In a working machine for performing a work at a predetermined position on an object, the recognition camera is provided with an image of the work after the work and a recognition mark provided in a predetermined positional relationship around the work around the work position. Image with
By the image processing at that time, the recognition position of the image after work,
Means for measuring a deviation amount of the recognition mark from the predetermined positional relationship with respect to the recognition position, and means for correcting a work position based on work position data stored in the storage means according to the measurement result. A working machine characterized by that: 5. The work machine according to claim 4, wherein the work machine is a cream solder printing machine for printing cream solder on a circuit board. 6. The work machine according to claim 4, wherein the work machine is an electronic component mounter for mounting an electronic component on a circuit board. 7. The working machine according to claim 4, wherein the working machine is an adhesive applicator for applying an adhesive to a circuit board.