JP4156882B2 - Mark recognition apparatus and method - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a component mounting apparatus that mounts an electronic component on a substrate by recognizing a mark on an object such as a substrate conveyed to an electronic component mounting machine, a printing machine, a dispenser, etc. at high speed and with high accuracy. The present invention relates to a mark recognition apparatus and method for improving mounting tact time and mounting accuracy.
[0002]
[Prior art]
In recent years, electronic circuit boards have been screamed every day to mount electronic components accurately, improve mounting quality, and increase the mounting tact time.
FIG. 1 shows a component mounting machine. A suction nozzle 1a of a suction head 1 is driven by an XY drive mechanism (not shown), moves to a position of a feeder 2, and a component 3 supplied from the feeder. Is moved onto the recognition camera 6. Therefore, the component is imaged, the image is processed to correct the component adsorption position shift, and the component is mounted at a predetermined position on the substrate 10 conveyed through the conveyance path 11. Since accurate mounting of components is based on the premise that the substrate 10 is at a reference position, substrate marks 10a, 10b, and 10c are formed at predetermined positions on the substrate 10, and this is an XY drive to which the suction head 1 is attached. Driven by a mechanism (not shown), moves to the position of the substrate marks 10a, 10b, 10c, stops at each position, and then takes a picture with a CCD camera (image reading means) 12 attached to the suction head 1 and recognizes the image. Then, the deviation from the reference position of the board is obtained, and this is corrected to mount components.
[0003]
In such a component mounter, components are mounted according to the flow of FIG. First, the substrate 10 is carried into the mounting position by the transport path 11, and the XY drive mechanism (not shown) moves the CCD camera 12 onto the substrate 10 and stops and measures the substrate marks 10a to 10c on the substrate to be mounted. The substrate position is checked (step S1). Next, component data to be mounted is read (step S2), and the XY drive mechanism (not shown) moves the suction nozzle 1a onto the feeder 2 according to the component data. Therefore, the suction nozzle 1a sucks the electronic component 3 (step S3). Subsequently, the XY drive mechanism (not shown) moves the suction nozzle 1a to a position on the recognition camera 6, and the suction posture of the sucked part is recognized by the recognition camera 6 (step S4). Subsequently, when it is determined in step S5 that the picked-up component is a component such as a chip component, the process proceeds to step S6, the position is corrected only by the substrate marks 10a to 10c, and the substrate mark measurement obtained in step S1 is performed. Based on the position correction data based on the above and the position correction data based on the component recognition obtained in step S4, the correct mounting position data of the component is calculated, and the XY drive mechanism (not shown) is moved to that position to mount the component. (Step S8).
[0004]
On the other hand, when the component picked up in step S5 is a high-precision component, the XY drive mechanism (not shown) moves the CCD camera 12 onto the substrate 10, stops, and then measures the IC marks 10d and 10e. The correct mounting position data of the component is calculated from the position correction data based on the above and the position correction data based on the component recognition (step S7), and the XY drive mechanism (not shown) is moved to that position to mount the component (step S8). ). The above process is repeated until all components to be mounted are completed (step S9).
[0005]
[Problems to be solved by the invention]
In such a conventional component mounting machine, electronic components such as chip components can be mounted by correcting the position of only the board mark, but in the case of high-precision mounting components such as QFP components, as described above, component mounting Since the IC marks 10d and 10e in the vicinity of the position are recognized and the mounting position is obtained and the component is mounted, it is necessary to measure the IC mark for each component. In particular, there is a problem that it takes time to mount electronic components such as a chip component and a QFP component because of the method of temporarily stopping the camera on the mark when recognizing the substrate mark or the IC mark.
[0006]
[Means for Solving the Problems]
In an electronic component mounting method and apparatus for mounting an electronic component on a substrate, when recognizing a substrate mark or IC mark formed on the substrate and obtaining its position data, the image is recognized and the position is recognized without stopping on the mark. The measurement time spent for recognizing various marks can be shortened. In order to ensure accuracy, recognition position data (referred to as dynamic imaging position data) obtained by moving a predetermined mark at a constant speed (fixed speed) and a determined moving direction (0, 90, 180, 270 degrees). And the difference of the recognition position data (called static imaging position data) acquired in the state stopped on the determined mark is stored as method correction data. When recognizing the board mark or IC mark formed on the board when mounted (determined by each device) and obtaining its position data, it is calculated from the position data and method correction data (data taking the movement direction component into account). By processing and data conversion, each mark position data can be obtained with high accuracy without stopping the CCD camera.
Therefore, with this configuration, it is possible to prepare for component mounting without stopping the CCD camera at the time of mark recognition, so that various types of components can be mounted at high speed and with high accuracy.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
The operation of the present invention will be described based on the embodiment.
The component mounter of the present invention is configured by the same mechanism as the conventionally used component mounter shown in FIG. 1 and has a different control method. The substrate 10 is carried into the component mounter via the transport path 11, It is carried out. The component mounter has an XY drive mechanism (not shown) that can be positioned at any position on which the suction head 1 having the CCD camera 12 including the IC nozzle of the substrate 10 and the suction nozzle 1a for recognizing the position of the board mark is mounted. Is provided.
[0008]
Substrate marks 10a, 10b, and 10c are formed at predetermined positions on the substrate 10, and are driven by an XY drive mechanism (not shown) to which the suction head 1 is attached to move over the positions of the substrate marks 10a, 10b, and 10c. Then, the position data of each mark obtained by image recognition by photographing with a CCD camera (image reading means) 12 attached to the suction head 1 without stopping at each position, and each component mounting machine specific acquired in advance. The correction data (method correction data) is processed to obtain a deviation from the reference position of the substrate.
[0009]
Next, the suction head 1 is moved to the feeder 2 by this XY drive mechanism (not shown), and the component 3 supplied therefrom is sucked by the suction nozzle 1a. In addition, the component mounting machine is provided with a recognition camera 6 for imaging and measuring the suction posture of the component 3 sucked by the suction nozzle 1a. Therefore, the component 3 is moved onto the recognition camera 6 by the XY drive mechanism (not shown) and picked up, and the image is processed to determine the displacement position of the component 3, and the approximate position from the reference position of the board is obtained. The correction data of the XY drive mechanism (not shown) is obtained from the deviation data and the suction position deviation data, and the parts are mounted.
The method correction data acquisition performed at the time of parameter acquisition by each component mounter will be described in detail.
[0010]
As shown in FIG. 3, a method of acquiring method correction data (see FIG. 4) using the parameter acquisition board 1 9 in the component mounter shown in FIG. It is carried and fixed to the mounting position of the component mounting machine by the transport path 1 1 (step s 1 1). An XY drive mechanism (not shown) moves a suction head (not shown) holding the C CD camera 1 2 onto the parameter acquisition substrate 1 9. Parameter acquisition board 1 as shown in FIG. 9 A plurality of substrate marks T formed thereon M n ( n = 1 2 3 ) Above , the suction head (not shown) having the CCD camera 1 2 stops at each predetermined position of the substrate marks T M1 to T M3, picks up an image of the substrate mark, and transfers it to the image processing device 2 0. The position is measured and the static imaging position data of the three board marks is stored in the memory 2 0 g of the image processing device 2 0 (step s 1 2).
[0011]
Subsequently, a suction head (not shown) having a CCD camera 12 monitors the substrate marks TM1 to TM3 with an encoder (not shown) such as a motor while moving the substrate marks TM1 to TM3 on each predetermined position at a set constant speed. When the position data is equivalent to the target imaging position data, the board mark is imaged, the position is measured by the image processing apparatus 20, and the dynamic imaging position data of the three board marks is stored in the memory 20g of the image processing apparatus 20. (Step S13). In the dynamic imaging position data measurement, data of four-direction movement (0, 90, 180, 270 degrees) is measured once with at least three marks and stored in the memory 20g, or four-direction movement data is measured for each mark. The result of arithmetic averaging is stored in the memory 20g of the image processing apparatus 20.
[0012]
From the results of the roughly determined steps s12 and 13, the difference between the dynamic imaging position data and the static imaging position data in each moving direction is stored as technique correction data in the memory 20g of the image processing apparatus 20 (step s14) as a format. Is a method correction data conversion table shown in FIG.
Next, the component mounter is the component mounter shown in FIGS. 3 and 5, and description of the component mounting operation is started according to the mounting substrate 18 of FIG. 7 and the flowchart of FIG. 8 instead of the parameter acquisition substrate 19.
[0013]
The mounting board 18 is carried into the mounting position of the component mounting machine by the transport path 11 (step s20). An XY drive mechanism (not shown) moves the suction head 1 holding the CCD camera 12 onto the mounting substrate 18 in order to recognize the substrate mark. As shown in FIG. 7, a plurality of substrate marks PMn (n = 1, 2, 3) are formed on the mounting substrate 18, and the suction head 1 having the CCD camera 12 is connected to the substrate mark PM1. ~ PM3 substrate mark position data “PM1” obtained by imaging while moving in a direction determined at a constant speed on PM3 (for example, PM1: from right, PM2: from below, PM3: from left) and measuring the position thereof (X1 + Δx1, y1 + Δy1), PM2 (x2 + Δx2, y2 + Δy2), PM3 (x3 + Δx3, y3 + Δy3) ”(step s21) and the previously obtained technique correction data are calculated, and the three-point substrate mark position data“ PM1 (x1 + Δx1-0. 4, y1 + Δy1) Substrate mark position data when moving from the right, PM2 (x2 + Δx2, y2 + Δy2-0.3) Substrate mark position when moving from below Data, PM3 (x3 + Δx3 + 0.5, y3 + Δy3) Get the substrate mark position data "at the time of moving from the left to obtain the substrate mark position correction data (step s22).
[0014]
Next, the component data in the component data table of FIG. 9 is read in accordance with the mounting order, the movement of the XY drive mechanism (not shown) to the feeder 2 is started by the component data, and the target component 3 is sucked by the suction nozzle 1a (s23). ). After moving to the XY drive mechanism (not shown) of the post recognition camera 6 after picking up the parts, the suction nozzle 1 a lowers the part 3 to the focus surface of the recognition camera 6. At this time, the positional deviation data (Δx21, Δy21, ΔΘ21) of the component 3 imaged by the recognition camera 6 is obtained (s24). After obtaining the positional deviation data of the component 3 to be mounted, a component (such as a Chip component) that does not require much mounting accuracy is corrected based on the obtained substrate mark position data of the three points of the substrate 10. The component mounting position data (xn, yn) is obtained from the data (Δx10, Δy10, ΔΘ10) and the positional deviation data (Δx2n, Δy2n, ΔΘ2n) of the component 3 sucked by the suction nozzle 1a (s25), and the XY drive mechanism. (Not shown) is controlled to mount a component at a predetermined position (s26).
[0015]
For QFP components that require extremely high mounting accuracy, the suction mark 1 is moved onto the substrate 10 by an XY drive mechanism (not shown) by referring to the substrate mark position correction data by the substrate mark, and the CCD camera 12 is driven at a constant speed. The IC marks 10a and 10b are measured while moving in a certain direction, and the obtained IC mark position data is calculated by adding the method correction data to the IC mark position data in the same manner as the acquisition of the substrate mark position data. The component mounting position data (xn, yn) is obtained from the IC mark position correction data (Δx11, Δy11, ΔΘ11) and the positional deviation data (Δx2, Δy2, ΔΘ2) of the component 3 (s27), and the XY drive mechanism (not shown). The device is controlled to move to a predetermined position on the substrate 10 to mount a component (s26).
[0016]
After component mounting, it is confirmed whether it is final component data (s28). If it is the final component data, the mounting is completed, and the substrate 10 is transferred to the discharge position by the transfer path 11.
If the component mounting is not completed, the XY drive mechanism (not shown) starts moving to the feeder 2 based on the read component data (s23) and sucks the component from the corresponding feeder. This process is repeated until the part data is completed. As described above, the technology other than the substrate mark recognition method and means and the IC mark recognition method and means is a conventional technique.
[0017]
【The invention's effect】
As described above, according to the present invention, since the mark imaging can be performed without waiting for the CCD camera to stop as before, the total time for mark recognition can be shortened. Therefore, it can contribute to the improvement of the tact time, and since the recognition accuracy has correction data based on the imaging method from the static imaging position data and the dynamic imaging position data, the accuracy equivalent to the result of mark recognition by the conventional technique can be guaranteed.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing a schematic configuration of a conventional component mounter.
FIG. 2 is a flowchart showing a component mounting flow of a conventional component mounter.
FIG. 3 is a schematic perspective view showing a configuration at the time of parameter acquisition according to the present invention.
FIG. 4 is a flowchart showing a flow at the time of parameter acquisition according to the present invention.
FIG. 5 is a configuration diagram showing a schematic configuration of a component mounter of the present invention.
FIG. 6 is a table showing a method correction data conversion table of the present invention.
FIG. 7 is a mounting board diagram used for explaining the present invention.
FIG. 8 is a flowchart showing a component mounting flow of the component mounter of the present invention.
FIG. 9 is a table showing a component data table used for explaining the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Adsorption head 1a Adsorption nozzle 2 Feeder 3 Component 6 Recognition camera 10 Substrate 10a, 10b, 10c Substrate mark 10d, 10 IC mark 11 Conveyance path 12 CCD camera 18 Mounting substrate 18a, 18b, 18c Mounting substrate mark 19 For parameter acquisition Substrate 19a, 19b, 19c Parameter acquisition substrate mark 20 Image processing device 21 Monitor 22 Controller

Claims (2)

In a mark position recognition method for recognizing a mark on an object such as a substrate conveyed to an electronic component mounting machine, a printing machine, a dispenser, etc.
On the mark formed on the parameter acquisition substrate in advance, obtain the method correction data by the imaging method from the static imaging position data acquired by stopping the camera and the dynamic imaging position data acquired while moving the camera,
In the mark position data obtained by the dynamic imaging means that reads the image while moving the camera over the object when mounting the part,
Read out the method correction data obtained in advance and perform calculation processing with the mark position data,
A method for recognizing a mark position, comprising: obtaining position correction data of a substrate. In a mark position recognition device for recognizing marks on an object such as a substrate conveyed to an electronic component mounting machine, a printing machine, a dispenser, etc.
Means for obtaining technique correction data by an imaging method from static imaging position data acquired by stopping the camera and dynamic imaging position data acquired while moving the camera on a mark formed on the parameter acquisition substrate in advance; ,
Means for obtaining mark position data of an object obtained by a dynamic imaging means for reading an image while moving the camera on the object at the time of component mounting;
And an arithmetic means for performing arithmetic processing and the mark position data by reading the previously obtained technique correction data,
Mark position recognizing device characterized by obtaining position correction data of substrate

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