JP2801331B2 - Electronic component mounting method - Google Patents
Electronic component mounting methodInfo
- Publication number
- JP2801331B2 JP2801331B2 JP2002022A JP202290A JP2801331B2 JP 2801331 B2 JP2801331 B2 JP 2801331B2 JP 2002022 A JP2002022 A JP 2002022A JP 202290 A JP202290 A JP 202290A JP 2801331 B2 JP2801331 B2 JP 2801331B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- image
- mounting
- image input
- mounting head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、プリント基板上に電子部品を装着する電子
部品装着方法の、電子部品位置計測に関するものであ
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component position measurement method for mounting an electronic component on a printed circuit board.
［従来の技術］ プリント基板上に電子部品を装着する電子部品装着装
置は、たとえば基板上に集積回路（IC）チップや大規模
集積回路（LSI）、あるいはチップ抵抗器などの電子部
品を実装する際に用いられる。[Prior Art] An electronic component mounting apparatus for mounting electronic components on a printed circuit board mounts electronic components such as an integrated circuit (IC) chip, a large-scale integrated circuit (LSI), or a chip resistor on the substrate. Used when
従来の技術を第４図〜第５図に従って説明する。 The prior art will be described with reference to FIGS.
第４図は従来の電子部品装着装置の画像入力時の側面
図である。第４図において、51は電子部品、52は吸着ヘ
ッド、53は画像入力カメラである。そして、電子部品51
を吸着ヘッド52が吸着保持し、画像入力カメラ53上に位
置決めされている。このとき、電子部品51の厚みにかか
わらず吸着ヘッド52の下限位置Ｃが決められている。FIG. 4 is a side view of the conventional electronic component mounting apparatus when an image is input. In FIG. 4, reference numeral 51 denotes an electronic component, 52 denotes a suction head, and 53 denotes an image input camera. And the electronic component 51
Is held by the suction head 52, and is positioned on the image input camera 53. At this time, the lower limit position C of the suction head 52 is determined regardless of the thickness of the electronic component 51.
［発明が解決しようとする課題］ 以上のような構成では、部品の厚みの近いにより電子
部品の被計画面が画像入力カメラの合焦点位置Ａからず
れる。第５図ａは、被写体が合焦点位置にある場合、第
５図ｂは同じく合焦点位置からずれた場合の光路図であ
る。被写体54が合焦点位置Ａにある場合、レンズ55を通
り撮像面Ｂに結像する。被写体54が合焦点位置Ａからず
れＡ′にうつった場合、レンズ55主点位置Ｈは変わらな
いため、結像位置Ｂ′に移動する。撮像面Ｂは変化いな
いため、撮像面Ｂ上での像は先端部がボケるのみでな
く、像の倍率が変化するため、この像を元に位置計測を
行うには正しい位置を割り出すことはできないという課
題を有する。[Problem to be Solved by the Invention] With the above configuration, the planned surface of the electronic component is shifted from the focal point A of the image input camera as the thickness of the component is closer. FIG. 5A is an optical path diagram when the subject is at the in-focus position, and FIG. When the subject 54 is at the in-focus position A, an image is formed on the imaging surface B through the lens 55. When the subject 54 moves to A 'from the focal point A, the principal point H of the lens 55 does not change and moves to the image forming position B'. Since the imaging surface B does not change, the image on the imaging surface B not only blurs at the tip but also changes the magnification of the image. Therefore, to perform position measurement based on this image, it is difficult to determine the correct position. There is a problem that can not be.
前記した従来技術の課題を解決するため、本発明は、
認識装置の電子部品の位置計測のための画像入力に際
し、電子部品の被計測面が画像入力装置の合焦点面に来
るように装着ヘッドを位置決めする手段を設けることに
より、画像のボケ及び倍率変化を生じることを防止する
技術を提供することを目的とする。In order to solve the above-mentioned problems of the prior art, the present invention provides:
When inputting an image for position measurement of the electronic component of the recognition device, by providing a means for positioning the mounting head so that the measured surface of the electronic component is located at the focal plane of the image input device, the image blur and magnification change can be obtained. It is an object of the present invention to provide a technique for preventing the occurrence of the problem.
［課題を解決するための手段］ 前記目的を達成するため本発明は、部品供給部より装
着ヘッドにて電子部品を吸着し、吸着された状態の電子
部品の画像を認識装置にて認識し、プリント基板の所定
位置に装着する電子部品装着方法であって、前記装着ヘ
ッドにて部品供給部より電子部品を吸着する第１工程
と、前記第１工程にて吸着された電子部品の被計測面が
画像入力装置の合焦点面に来るように、予め登録された
前記電子部品の厚みデータに基づき前記装着ヘッドを位
置決めする第２工程と、前記第２工程後、前記画像入力
装置により得られた前記電子部品の画像を前記認識装置
にて認識する第３工程と、前記第３工程にて得られた認
識結果に基づき、前記プリント基板上に前記電子部品を
装着する第４工程とからなることを特徴とする電子部品
装着方法である。[Means for Solving the Problems] In order to achieve the above object, the present invention suctions an electronic component with a mounting head from a component supply unit, recognizes an image of the sucked electronic component with a recognition device, An electronic component mounting method for mounting an electronic component at a predetermined position on a printed circuit board, wherein a first step of picking up an electronic component from a component supply unit by the mounting head, and a surface to be measured of the electronic component sucked in the first step A second step of positioning the mounting head based on the thickness data of the electronic component registered in advance so that is located at the focal plane of the image input apparatus; and a step obtained by the image input apparatus after the second step. A third step of recognizing the image of the electronic component by the recognition device; and a fourth step of mounting the electronic component on the printed circuit board based on the recognition result obtained in the third step. Characterized by This is an electronic component mounting method.
［作用］ 上記した本発明の構成によれば、電子部品の位置計測
のための画像入力に際し、電子部品の被計測面が画像入
力装置の合焦点面に来るように、予め登録された電子部
品の厚みデータに基づき装着ヘッドを位置決めする工程
を設けたので、被計測面が常に合焦点面にあるため、画
像のボケ及び倍率変化を生じることを防止することがで
きる。[Operation] According to the configuration of the present invention described above, when inputting an image for position measurement of an electronic component, the electronic component registered in advance such that the measured surface of the electronic component comes to the focal plane of the image input device. Since the step of positioning the mounting head based on the thickness data is provided, since the surface to be measured is always at the focal plane, it is possible to prevent the image from being blurred and the magnification from being changed.
従って、常に正しい画像を元に位置計測を行うため、
位置計測の精度が確保される。Therefore, to always measure the position based on the correct image,
Accuracy of position measurement is ensured.
［実施例］ 以下、本発明の一実施例について第１図〜第３図を参
照しながら説明する。Embodiment An embodiment of the present invention will be described below with reference to FIGS.
部品装着装置全体を示す第３図において、１は部品供
給部、２は装着ヘッド、３は回路基板移送装置、４は画
像入力カメラである。In FIG. 3 showing the entire component mounting apparatus, 1 is a component supply unit, 2 is a mounting head, 3 is a circuit board transfer device, and 4 is an image input camera.
以上の構成にかかる第３図について、以下その作用を
説明する。The operation of FIG. 3 having the above configuration will be described below.
装着ヘッド２は、部品供給部１と移送装置３上の所定
位置に位置決めされた回路基板と画像入力カメラ４の間
にわたってＸ−Ｙ方向に移動して部品を装着する部品装
着部としての移動体５に取り付けられている。The mounting head 2 moves in the X and Y directions between the component supply unit 1 and a circuit board positioned at a predetermined position on the transfer device 3 and the image input camera 4 to mount a component as a component mounting unit. 5 is attached.
次に、第２図に装着ヘッド２の駆動部の正面図を示
す。装着ヘッドの吸着ノズル部６は、ベルト７を介して
サーボモータ８により駆動される送りネジ部９により、
上下方向の任意の位置に位置決め可能である。Next, FIG. 2 shows a front view of a driving unit of the mounting head 2. FIG. The suction nozzle unit 6 of the mounting head is driven by a feed screw unit 9 driven by a servomotor 8 via a belt 7.
It can be positioned at any position in the vertical direction.
次に、第１図に本発明の装着方法を実施するための装
着装置の画像入力時の側面図を示す。Next, FIG. 1 shows a side view at the time of image input of a mounting device for implementing the mounting method of the present invention.
部品供給部１より装着ヘッド２に吸着された電子部品
10は、画像入力カメラ上で位置決めされる。この際、電
子部品10の厚みＴは予め登録されており、画像入力カメ
ラ４、合焦点位置Ａから電子部品10の厚みＴを差し引い
た位置に装着ヘッド２を位置決めすることにより、電子
部品10の被計測面である下面を、合焦点位置Ａに位置決
めする。Electronic components adsorbed to the mounting head 2 from the component supply unit 1
10 is positioned on the image input camera. At this time, the thickness T of the electronic component 10 is registered in advance, and the image input camera 4 positions the mounting head 2 at a position obtained by subtracting the thickness T of the electronic component 10 from the in-focus position A. The lower surface, which is the surface to be measured, is positioned at the focal point position A.
画像入力カメラ４でとらえた電子部品10の像をもと
に、図示されない認識装置により電子部品10の位置が計
測される。異なった厚みの電子部品の位置計測を行う場
合も同様に合焦点位置に被計測面があるため、常に像の
倍率は一定となり、計測時の誤差を生じない。Based on the image of the electronic component 10 captured by the image input camera 4, the position of the electronic component 10 is measured by a recognition device (not shown). Similarly, when measuring the position of electronic components having different thicknesses, since the surface to be measured is located at the focal point, the magnification of the image is always constant, and no error occurs during measurement.
計測された電子部品の位置をもとに、電子部品10は装
着ヘッド２によりプリント基板11上に装着される。The electronic component 10 is mounted on the printed circuit board 11 by the mounting head 2 based on the measured position of the electronic component.
以上説明した本発明の実施例によれば、吸着された電
子部品10の位置を計測する認識装置（画像入力カメラ
４）を用いてプリント基板11上に電子部品10を装着する
際、前記認識装置（画像入力カメラ４）の電子部品の位
置計測のための画像入力を、電子部品10の被計測面が画
像入力装置の合焦点面に来るように、予め登録された電
子部品の厚みデータに基づき装着ヘッドを位置決めする
工程を設けたことにより、異なった厚みの電子部品の位
置計測を行う場合も同様に合焦点位置に被計測面がある
ため、常に像の倍率は一定となり、計測時の誤差を生じ
ないという効果を発揮する。According to the embodiment of the present invention described above, when the electronic component 10 is mounted on the printed circuit board 11 using the recognition device (the image input camera 4) that measures the position of the sucked electronic component 10, the recognition device is used. The image input for the position measurement of the electronic component (the image input camera 4) is performed based on the thickness data of the electronic component registered in advance so that the measured surface of the electronic component 10 comes to the focal plane of the image input device. By providing the step of positioning the mounting head, even when measuring the position of electronic components with different thicknesses, the measured surface is always at the in-focus position, so the image magnification is always constant, and errors in measurement The effect that does not occur is exhibited.
［発明の効果］ 以上説明した通り、本発明の電子部品装着方法では、
認識装置の電子部品の位置計測のための画像入力に際
し、電子部品の被計測面が画像入力装置の合焦点面に来
るように、予め登録された電子部品の厚みデータに基づ
き装着ヘッドを位置決めする工程を設けたので、電子部
品の被計測面が常に画像入力カメラの合焦点位置に位置
決めされるため、倍率変化がなく像のボケもない画像よ
り位置計測が行えるため、計測時の誤差を生じさせない
という特別の効果を達成することができる。[Effect of the Invention] As described above, in the electronic component mounting method of the present invention,
At the time of image input for position measurement of the electronic component of the recognition device, the mounting head is positioned based on the thickness data of the electronic component registered in advance so that the measured surface of the electronic component comes to the focal plane of the image input device. Since the process is provided, the measured surface of the electronic component is always positioned at the focal point of the image input camera, and position measurement can be performed from an image with no change in magnification and no blurring of the image. A special effect of not being able to be achieved can be achieved.
従って、ファイン化する電子部品を精度良くプリント
基板に装着することが可能となる。Therefore, it is possible to accurately mount the electronic component to be finely mounted on the printed circuit board.
第１図は、本発明の電子部品装着方法を実施するための
装着装置の画像入力時の側面図、第２図は同じくその装
着ヘッドの駆動部の正面図、第３図は本発明の部品装着
方法を実施するための装着装置の全体図、第４図は従来
の電子部品装着装置の画像入力時の側面図、第５図は光
路図である。 １……部品供給部、２……装着ヘッド、４……画像入力
カメラ、６……吸着ノズル、10……電子部品、54……被
写体、56……結像。FIG. 1 is a side view at the time of image input of a mounting apparatus for carrying out the electronic component mounting method of the present invention, FIG. 2 is a front view of a driving unit of the mounting head, and FIG. 3 is a component of the present invention. FIG. 4 is an overall view of a mounting device for performing the mounting method, FIG. 4 is a side view of the conventional electronic component mounting device when an image is input, and FIG. 5 is an optical path diagram. Reference numeral 1 denotes a component supply unit, 2 denotes a mounting head, 4 denotes an image input camera, 6 denotes a suction nozzle, 10 denotes an electronic component, 54 denotes an object, and 56 denotes an image.
フロントページの続き (56)参考文献 特開 昭63−129697（ＪＰ，Ａ) 特開 昭63−282577（ＪＰ，Ａ) 特開 平１−219959（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 13/04Continuation of front page (56) References JP-A-63-129697 (JP, A) JP-A-63-282577 (JP, A) JP-A-1-219959 (JP, A) (58) Fields investigated (Int) .Cl. 6 , DB name) H05K 13/04
Claims (1)
吸着し、吸着された状態の電子部品の画像を認識装置に
て認識し、プリント基板の所定位置に装着する電子部品
装着方法であって、 前記装着ヘッドにて部品供給部より電子部品を吸着する
第１工程と、 前記第１工程にて吸着された電子部品の被計測面が画像
入力装置の合焦点面に来るように、予め登録された前記
電子部品の厚みデータに基づき前記装着ヘッドを位置決
めする第２工程と、 前記第２工程後、前記画像入力装置により得られた前記
電子部品の画像を前記認識装置にて認識する第３工程
と、 前記第３工程にて得られた認識結果に基づき、前記プリ
ント基板上に前記電子部品を装着する第４工程とからな
ることを特徴とする電子部品装着方法。An electronic component mounting method in which an electronic component is sucked by a mounting head from a component supply unit, an image of the sucked electronic component is recognized by a recognition device, and the electronic component is mounted at a predetermined position on a printed circuit board. A first step of picking up an electronic component from a component supply unit with the mounting head; and a step of preliminarily setting the measured surface of the electronic component picked up in the first step to a focal plane of an image input device. A second step of positioning the mounting head based on the registered thickness data of the electronic component; and a step of recognizing the image of the electronic component obtained by the image input device with the recognition device after the second step. An electronic component mounting method, comprising: three steps; and a fourth step of mounting the electronic component on the printed circuit board based on the recognition result obtained in the third step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002022A JP2801331B2 (en) | 1990-01-08 | 1990-01-08 | Electronic component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002022A JP2801331B2 (en) | 1990-01-08 | 1990-01-08 | Electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03206699A JPH03206699A (en) | 1991-09-10 |
| JP2801331B2 true JP2801331B2 (en) | 1998-09-21 |
Family
ID=11517706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002022A Expired - Lifetime JP2801331B2 (en) | 1990-01-08 | 1990-01-08 | Electronic component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2801331B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1913769B (en) * | 2005-08-10 | 2010-07-28 | 重机公司 | Method and device for obtaining image for electronic component |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5878484A (en) * | 1992-10-08 | 1999-03-09 | Tdk Corporation | Chip-type circuit element mounting apparatus |
| US6435808B1 (en) | 1993-10-06 | 2002-08-20 | Tdk Corporation | Chip-type circuit element mounting apparatus |
| KR0152879B1 (en) * | 1995-10-10 | 1998-12-15 | 이희종 | Chip recognition method and apparatus for surface mounting device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63129697A (en) * | 1986-11-20 | 1988-06-02 | 松下電器産業株式会社 | Component attracting nozzle |
| JPS63282577A (en) * | 1987-05-14 | 1988-11-18 | Mitsubishi Electric Corp | Component packaging system |
| JP2752078B2 (en) * | 1988-02-29 | 1998-05-18 | 株式会社東芝 | Visual recognition stage |
-
1990
- 1990-01-08 JP JP2002022A patent/JP2801331B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1913769B (en) * | 2005-08-10 | 2010-07-28 | 重机公司 | Method and device for obtaining image for electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03206699A (en) | 1991-09-10 |
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