JPH10150298A - Compensation angle correcting method of electronic component and electronic component using the method - Google Patents
Compensation angle correcting method of electronic component and electronic component using the methodInfo
- Publication number
- JPH10150298A JPH10150298A JP8309213A JP30921396A JPH10150298A JP H10150298 A JPH10150298 A JP H10150298A JP 8309213 A JP8309213 A JP 8309213A JP 30921396 A JP30921396 A JP 30921396A JP H10150298 A JPH10150298 A JP H10150298A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- angle
- electronic
- mark
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Structure Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品を基板に
実装する電子部品装着機において、電子部品の極性を用
いて電子部品の方向を補正する電子部品の極性検出方法
と、それを用いた電子部品の実装装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine for mounting an electronic component on a substrate, and a method for detecting the polarity of an electronic component by correcting the direction of the electronic component by using the polarity of the electronic component. The present invention relates to an electronic component mounting apparatus.
【０００２】[0002]
【従来の技術】近年の電子部品実装機における電子部品
の実装過程においては、電子部品の角度補正や欠落検査
のためのさまざまな方法が開発され、とくに、高品質、
高精度な高密度実装基板を実現するためには、電子部品
の角度補正は必要不可欠になってきており、多数の電子
部品においては、電子部品の形状や傾きを正確に判定
し、角度補正を行う手段を設けることにより、高品質で
高精度な実装基板を実現してきた。しかしながら、その
形状が上下左右がほぼ対称であり、その方向を定めるた
めに極性マークを用いた電子部品の認識方法において
は、部品の方向を正す手段は用いられていないので、極
性マークを判別して方向の適合判定を行い角度補正を行
った場合でも、方向が異なる場合は、異なった方向のま
ま基板に装着されるか、電子部品は基板に装着されずに
そのまま廃棄されていた。図６を参照して、従来の極性
マークを有する電子部品の認識方法について説明する。2. Description of the Related Art In the process of mounting electronic components in a recent electronic component mounting machine, various methods have been developed for correcting the angle of the electronic components and inspecting for missing parts.
In order to realize high-precision, high-density mounting boards, angle correction of electronic components has become indispensable.For many electronic components, the shape and inclination of electronic components are accurately determined and angle correction is performed. By providing a means for performing this, a high-quality and high-precision mounting board has been realized. However, the shape is almost symmetrical in the vertical and horizontal directions, and in the method of recognizing electronic components using polar marks to determine the direction, since means for correcting the direction of the component is not used, the polar marks are determined. Even if the direction is determined and the angle is corrected, if the direction is different, the electronic component is mounted on the substrate in the different direction or the electronic component is discarded without being mounted on the substrate. A conventional method for recognizing an electronic component having a polarity mark will be described with reference to FIG.
【０００３】図６は従来例の動作を示すフローチャート
で、＃１７では、初期データとして、電子部品の寸法や
処理モードなど、基板に電子部品を装着するまでに必要
な電子部品の情報をあらかじめ保有しておく。＃１８で
は、供給用トレイから電子部品を専用ノズルで吸着し、
ノズルで吸着された電子部品を、視覚認識を行うための
指定の位置へ搬送する。＃１９では、指定位置にて視覚
認識用のカメラで電子部品を撮像し、その画像を視覚認
識装置の記憶部に取り込む。＃２０では、＃１９で撮像
した画像をもとに、電子部品の形状を判別し、所定の処
理を施すことにより電子部品の補正角度Ｎｈを検出す
る。＃２１では、極性マークの検出を行う場合は次のス
テップの＃２２へ、そうでない場合は＃２４の処理を行
う。＃２２では、極性マークの検出を行う。＃２１で処
理をほどこした際に検出された部品の中心位置や傾き、
極性マークの位置等の情報をもとに、その中心位置から
の極性マークの相対位置を見つけ、極性マークが所定の
位置に存在するかどうかを判断する。＃２３では、＃２
２の処理の結果、極性マークがあった場合は＃２４で、
角度補正を行った電子部品を基板上に装着する。また、
極性マークの認識を行わなかった場合は、電子部品の方
向が正しいか、否かに係わらず電子部品に角度補正を行
い、基板上に装着する。極性マークが無かった場合は、
＃２５へ進み、電子部品を装着せずに廃棄する。FIG. 6 is a flowchart showing the operation of the conventional example. In step # 17, information on electronic components necessary for mounting the electronic components on the board, such as dimensions and processing modes of the electronic components, is held in advance as initial data. Keep it. In # 18, the electronic component is sucked from the supply tray with a dedicated nozzle,
The electronic component sucked by the nozzle is transported to a specified position for performing visual recognition. In step # 19, the electronic component is imaged at a specified position by a camera for visual recognition, and the image is stored in a storage unit of the visual recognition device. In # 20, the shape of the electronic component is determined based on the image captured in # 19, and a predetermined process is performed to detect the correction angle Nh of the electronic component. In step # 21, to detect the polarity mark, the process proceeds to step # 22 of the next step, and otherwise, the process of step # 24 is performed. In step # 22, a polarity mark is detected. The center position and inclination of the component detected when performing the processing in # 21,
Based on information such as the position of the polar mark, the relative position of the polar mark from its center position is found, and it is determined whether the polar mark exists at a predetermined position. In # 23, # 2
If the result of the process 2 is that there is a polarity mark, then in step # 24
The electronic component whose angle has been corrected is mounted on a substrate. Also,
If the polarity mark is not recognized, the electronic component is angle-corrected regardless of whether the direction of the electronic component is correct or not, and the electronic component is mounted on the board. If there is no polarity mark,
Proceed to # 25 and discard the electronic component without mounting it.
【０００４】図７は、吸着ノズル２６に吸着された電子
部品２８を下方から照明２７の光を照射して、電子部品
の画像をＴＶカメラ２９が撮像する状態を示す。視覚認
識装置３０は、Ａ／Ｄ変換回路３１と、画像メモリ３２
と、ＣＰＵ３３とを有する。FIG. 7 shows a state in which an electronic component 28 sucked by a suction nozzle 26 is irradiated with light from an illumination 27 from below, and an image of the electronic component is picked up by a TV camera 29. The visual recognition device 30 includes an A / D conversion circuit 31 and an image memory 32
And a CPU 33.
【０００５】[0005]
【発明が解決しようとする課題】上記による従来の方法
では、電子部品を実装した場合、角度補正により一見正
しく実装できている場合であっても、電子部品の方向そ
のものが正しくなかった場合は、電子部品の電極の向き
そのものが異なっているため、電気的には基板が正確に
制御できないといった課題があった。また、その形状が
上下左右がほぼ対称であり、その方向を定めるために極
性マークを有する電子部品については、そのほかの特徴
として電極が多いか、または電子部品内部に電極を有し
ている場合が多く、一度実装すると、再度実装し直すこ
とは非常に困難であることから、実装した基板そのもの
が使用できなくなる。一方、電子部品を実装する前に方
向の適合性を判別した場合でも、方向補正手段は用いら
れておらず、その場合の電子部品はほとんどの場合、そ
のまま廃棄される。According to the conventional method described above, when the electronic component is mounted, even if the electronic component is mounted correctly at first glance by angle correction, if the direction of the electronic component itself is not correct, Since the directions of the electrodes of the electronic component are different from each other, there is a problem that the substrate cannot be electrically controlled accurately. In addition, for electronic parts having a shape that is almost symmetrical in the vertical and horizontal directions and has a polar mark to determine the direction, as other features, there are many electrodes, or the electronic parts have electrodes inside. In many cases, once mounted, it is very difficult to mount again, so that the mounted board itself cannot be used. On the other hand, even if the compatibility of the direction is determined before mounting the electronic component, the direction correcting means is not used, and the electronic component in that case is almost always discarded as it is.
【０００６】[0006]
【課題を解決するための手段】上記の課題を解決するた
めに、本発明の極性マークを有する電子部品の補正角度
修正方法は、極性マーク検出手段により検出された極性
マークを有する電子部品の補正角度を、電子部品の辺数
により定まる角度で回転することにより方向補正を行っ
たことを特徴とするものであり、本発明によれば、従来
の角度補正に加えて方向を修正するための回転による補
正を行い、より正確に電子部品の角度補正を行うことに
よって正しい向きで基板に装着できる。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a method for correcting the correction angle of an electronic component having a polar mark according to the present invention comprises the steps of correcting an electronic component having a polar mark detected by a polar mark detecting means. The direction is corrected by rotating the angle at an angle determined by the number of sides of the electronic component. According to the present invention, the rotation for correcting the direction is performed in addition to the conventional angle correction. The electronic component can be mounted on the board in the correct direction by performing the angle correction of the electronic component more accurately.
【０００７】さらに、本発明では電子部品を従来以上に
正確に基板に装着できるので、電子部品装着後の基板の
不具合の発生を減少させることができる。また、電子部
品の廃棄率を低くし、さらに、電子部品の実装率を高め
ることができるため、より高品質で高精度な電子部品の
実装を実現することができる。Further, according to the present invention, since the electronic components can be mounted on the board more accurately than before, it is possible to reduce the occurrence of problems with the board after mounting the electronic components. In addition, since the disposal rate of the electronic component can be reduced and the mounting rate of the electronic component can be increased, the mounting of the electronic component with higher quality and higher accuracy can be realized.
【０００８】[0008]
【発明の実施の形態】本発明の請求項１に記載の発明
は、極性マークを有する電子部品の補正角度修正方法で
あって、極性マーク検出手段により検出された極性マー
クを有する電子部品の補正角度を、電子部品の辺数によ
り定まる角度で回転することにより方向補正を行ったこ
とを特徴とするものであり、本発明によれば、従来の角
度補正に加えて方向を修正するための回転による補正を
行い、より正確に電子部品の角度補正を行うことによっ
て正しい向きで基板に装着できる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is a method for correcting a correction angle of an electronic component having a polar mark, and corrects an electronic component having a polar mark detected by a polar mark detecting means. The direction is corrected by rotating the angle at an angle determined by the number of sides of the electronic component. According to the present invention, the rotation for correcting the direction is performed in addition to the conventional angle correction. The electronic component can be mounted on the board in the correct direction by performing the angle correction of the electronic component more accurately.
【０００９】さらに、本発明では電子部品を従来以上に
正確に基板に装着できるので、電子部品装着後の基板の
不具合の発生を減少させることができる。また、電子部
品の廃棄率を低くし、さらに、電子部品の実装率を高め
ることができるため、より高品質で高精度な電子部品の
実装を実現することができる。請求項２に記載の発明
は、電子部品の極性マーク検出手段と、極性マーク検出
手段により検出された極性マークを有する電子部品の補
正角度を電子部品の辺数により定まる角度で回転するこ
とにより方向補正を行う補正角度修正手段を備えたこと
を特徴とする電子部品実装装置であり、本発明によれ
ば、電子部品を従来以上に正確に基板に装着できるの
で、電子部品装着後の基板の不具合の発生を減少させる
ことができる。また、電子部品の廃棄率を低くし、さら
に、電子部品の実装率を高めることができるため、より
高品質で高精度な電子部品の実装を実現することができ
る。Further, according to the present invention, since the electronic components can be mounted on the board more accurately than before, it is possible to reduce the occurrence of problems with the board after mounting the electronic components. In addition, since the disposal rate of the electronic component can be reduced and the mounting rate of the electronic component can be increased, the mounting of the electronic component with higher quality and higher accuracy can be realized. According to a second aspect of the present invention, the direction is obtained by rotating the correction angle of the polarity mark detecting means of the electronic component and the electronic component having the polarity mark detected by the polarity mark detecting means at an angle determined by the number of sides of the electronic component. An electronic component mounting apparatus comprising a correction angle correction unit for performing correction, and according to the present invention, electronic components can be mounted on a board more accurately than before, so that a defect of the board after mounting the electronic component is improved. Can be reduced. In addition, since the disposal rate of the electronic component can be reduced and the mounting rate of the electronic component can be increased, the mounting of the electronic component with higher quality and higher accuracy can be realized.
【００１０】以下、本発明の実施の形態について図１に
基づき説明する。図１は視覚認識装置を用いた電子部品
装着機の動きを示したフローチャートである。ここで
は、電子部品を吸着し、基板に装着するまでの部品の認
識に関する動作を示す。対象となる電子部品は、専用の
供給トレイ等で供給され、その形状は上下、左右がほぼ
対称な形状をしており、その電子部品の方向を定めるた
めに、極性マークを有している電子部品であり、具体例
としてＱＦＰタイプ部品、ＢＧＡタイプ部品、半導体用
チップ部品等があげられる。本実施例では、これら以外
の部品でも適用される場合を想定し説明する。An embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a flowchart showing the operation of the electronic component mounting machine using the visual recognition device. Here, an operation related to component recognition from picking up an electronic component to mounting it on a substrate will be described. The target electronic component is supplied by a dedicated supply tray or the like, and its shape is substantially symmetrical in the vertical and horizontal directions, and has an electronic mark having a polarity mark in order to determine the direction of the electronic component. Specific examples include QFP type components, BGA type components, semiconductor chip components, and the like. In the present embodiment, a description will be given assuming a case where the present invention is applied to other components.
【００１１】＃１では、初期データとして、部品種類、
部品寸法、認識モード、極性マークの有無および相対位
置等のデータや、補正角度、部品の辺数、カウンタ等の
処理モードなど、基板に電子部品を装着するまでに必要
な電子部品の情報をあらかじめ保有しておく。＃２で
は、供給用トレイから電子部品を専用ノズルで吸着し、
ノズルに吸着された電子部品を、視覚認識を行うため指
定位置へ搬送する。＃３では、指定位置にて視覚認識用
のカメラで電子部品を撮像し、その画像を視覚認識装置
の記憶部に取り込む。＃４では、＃３で撮像した画像を
もとに、電子部品の形状を判別し、所定の処理を施すこ
とにより電子部品の補正角度Ｎｈを検出する。＃５で
は、極性マークの検出を行う場合は、次のステップ＃６
へ、そうでない場合は、＃１１の処理を行う。＃６で
は、極性マークの検出を行う。＃５で処理をほどこした
際に検出された部品の中心位置や傾き、極性マークの位
置等の情報をもとに、その中心位置からの極性マークの
相対位置を見つけ、極性マークが所定の位置に存在する
かどうかを判断する。繰り返して検出する場合は、検出
する方向を（３６０°／Ｍmax ）変えて検出する。Ｍ
max はカウンタの最大値で部品の辺数である。＃７で
は、＃６の処理の結果、極性マークがあった場合は、＃
１０の補正角度修正処理を行う。極性マークが無かった
場合は、＃８の処理で、カウンタを増やす。このカウン
タの最大値Ｍmax は、部品の辺の数と等しい。＃９で
は、カウンタがＭmax 以下の場合は、＃６の処理に戻
り、それ以外の場合は、極性マークそのものが無い、ま
たは、極性マークの検出に失敗したとして、処理を終了
する。こうして＃６から＃９の処理を繰り返した結果、
極性マークが見つかった場合、＃１０で電子部品の方向
を修正するため、回転による角度補正を行う。In # 1, the component type,
Information such as component dimensions, recognition modes, presence / absence and relative position of polar marks, and processing information such as correction angles, number of sides of components, counters, etc. Keep it. In # 2, electronic components are sucked from the supply tray with a special nozzle,
The electronic component sucked by the nozzle is transported to a designated position for visual recognition. In step # 3, an electronic component is imaged at a specified position by a camera for visual recognition, and the image is stored in a storage unit of the visual recognition device. In # 4, the shape of the electronic component is determined based on the image captured in # 3, and a predetermined process is performed to detect the correction angle Nh of the electronic component. In step # 5, when detecting the polarity mark, the next step # 6
If not, the process of # 11 is performed. In step # 6, a polarity mark is detected. Based on information such as the center position and inclination of the component detected at the time of performing the processing in # 5 and the position of the polar mark, the relative position of the polar mark from the center position is found. To determine if it exists. In the case of repeatedly detecting, the detection direction is changed by (360 ° / M max ). M
max is the maximum value of the counter and is the number of sides of the component. In step # 7, if there is a polarity mark as a result of step # 6,
10 correction angle correction processing is performed. If there is no polarity mark, the process proceeds to step # 8 to increase the counter. Maximum value M max of the counter is equal to the number of parts of the sides. In step # 9, if the counter is equal to or smaller than Mmax , the process returns to step # 6. Otherwise, it is determined that the polar mark does not exist or the detection of the polar mark has failed, and the process is terminated. As a result of repeating steps # 6 to # 9,
If the polarity mark is found, the angle is corrected by rotation in order to correct the direction of the electronic component in # 10.
【００１２】補正された補正角度をＮｈx とし、補正角
度をＮｈ、カウンタをＭとすると、補正された補正角度
Ｎｈx は次式により求められる。 Ｎｈx ＝Ｎｈ＋（３００°／Ｍmax ）×Ｍ ここで、０°≦Ｎｈx ＜３６０°とし、０＜Ｍmax 、０
≦Ｍ≦Ｍmax である。前記の式は電子部品が正多角形の
場合に用いられる算出方法であって、正多角形以外の場
合は、その電子部品の特徴にあわせた算出方法にて求め
る。＃１１では、＃１０で求められた補正角度Ｎｈを用
いて角度補正を行った後、電子部品を基板上に装着す
る。Assuming that the corrected correction angle is Nh x , the correction angle is Nh, and the counter is M, the corrected correction angle Nh x is obtained by the following equation. Nh x = Nh + (300 ° / M max ) × M Here, 0 ° ≦ Nh x <360 °, and 0 <M max , 0
≦ M ≦ M max . The above equation is a calculation method used when the electronic component is a regular polygon. When the electronic component is not a regular polygon, the formula is obtained by a calculation method according to the characteristics of the electronic component. In # 11, after performing angle correction using the correction angle Nh obtained in # 10, the electronic component is mounted on the board.
【００１３】図２は、ＱＦＰ部品１３が極性マーク１２
を有している場合の例である。図３は、ＱＦＰ部品１４
が極性マーク１２を有している状態の斜視図である。図
４は、ＢＧＡタイプの部品１５が極性マークを有してい
る場合の例である。図５は、半導体チップ部品１６が極
性マークを有している場合の例である。FIG. 2 shows that the QFP component 13 has the polarity mark 12
It is an example in the case of having. FIG. 3 shows the QFP component 14.
3 is a perspective view of a state having a polar mark 12. FIG. FIG. 4 shows an example in which the BGA type component 15 has a polarity mark. FIG. 5 shows an example in which the semiconductor chip component 16 has a polarity mark.
【００１４】[0014]
【発明の効果】以上のように本発明によれば、従来の角
度補正に加えて方向を修正するために回転による補正を
行い、より正確に電子部品の角度補正を行うことによっ
て正しい向きで基板に装着できる。さらに、電子部品を
従来以上に正確に基板に装着できるので、電子部品装着
後の基板の品質や精度が向上し、不具合の発生を減少さ
せることができる。また、電子部品の廃棄率を低くし、
さらに、電子部品の実装率を高めることができるため、
より高品質で高精度な電子部品の実装を実現することが
できる。As described above, according to the present invention, in addition to the conventional angle correction, correction by rotation is performed to correct the direction, and the angle correction of the electronic component is performed more accurately, so that the substrate can be correctly oriented. Can be attached to Furthermore, since the electronic components can be mounted on the board more accurately than before, the quality and accuracy of the board after mounting the electronic components can be improved, and the occurrence of defects can be reduced. Also, reduce the disposal rate of electronic components,
Furthermore, since the mounting rate of electronic components can be increased,
Higher quality and more accurate mounting of electronic components can be realized.
【００１５】また、電子部品実装後は、対象となる電子
部品に関する部分において、検査機による基板検査や電
極検査等の工程を省くことができる。Further, after the electronic components are mounted, processes such as a board inspection and an electrode inspection by an inspection machine can be omitted in a portion relating to the target electronic component.
【図１】本発明の実施例の動作を表すフローチャートで
ある。FIG. 1 is a flowchart showing the operation of an embodiment of the present invention.
【図２】極性マークを有する部品の斜視図である。FIG. 2 is a perspective view of a component having a polarity mark.
【図３】極性マークを有する部品の斜視図である。FIG. 3 is a perspective view of a component having a polarity mark.
【図４】極性マークを有する部品の斜視図である。FIG. 4 is a perspective view of a component having a polarity mark.
【図５】極性マークを有する部品の斜視図である。FIG. 5 is a perspective view of a component having a polarity mark.
【図６】従来例の動作を表すフローチャートである。FIG. 6 is a flowchart showing the operation of the conventional example.
【図７】電子部品の画像を処理する視覚認識装置であ
る。FIG. 7 is a visual recognition device that processes an image of an electronic component.
１２ 極性マーク １３ ＱＦＰ部品 １４ ＱＦＰ部品 １５ ＢＧＡ部品 １６ 半導体チップ部品 ２６ 吸着ノズル ２７ 照明 ２８ 電子部品 ２９ ＴＶカメラ ３０ 視覚認識装置 ３１ Ａ／Ｄ変換回路 ３２ 画像メモリ ３３ ＣＰＵ 12 Polarity mark 13 QFP component 14 QFP component 15 BGA component 16 Semiconductor chip component 26 Suction nozzle 27 Lighting 28 Electronic component 29 TV camera 30 Visual recognition device 31 A / D conversion circuit 32 Image memory 33 CPU
Claims (2)
修正方法であって、極性マーク検出手段により検出され
た極性マークを有する電子部品の補正角度を、電子部品
の辺数により定まる角度で回転することにより方向補正
を行ったことを特徴とする電子部品の補正角度修正方
法。1. A method of correcting a correction angle of an electronic component having a polar mark, wherein the correction angle of the electronic component having the polar mark detected by the polar mark detecting means is rotated by an angle determined by the number of sides of the electronic component. A method for correcting a correction angle of an electronic component, wherein the direction is corrected.
マーク検出手段により検出された極性マークを有する電
子部品の補正角度を電子部品の辺数により定まる角度で
回転することにより方向補正を行う補正角度修正手段を
備えた電子部品実装装置。2. A method for correcting a direction by rotating a correction angle of an electronic component having a polarity mark detected by a polarity mark detection unit of an electronic component and an angle determined by the number of sides of the electronic component. An electronic component mounting apparatus provided with an angle correcting unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30921396A JP3681843B2 (en) | 1996-11-20 | 1996-11-20 | Electronic component correction angle correction method and electronic component mounting apparatus using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30921396A JP3681843B2 (en) | 1996-11-20 | 1996-11-20 | Electronic component correction angle correction method and electronic component mounting apparatus using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10150298A true JPH10150298A (en) | 1998-06-02 |
| JP3681843B2 JP3681843B2 (en) | 2005-08-10 |
Family
ID=17990298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30921396A Expired - Fee Related JP3681843B2 (en) | 1996-11-20 | 1996-11-20 | Electronic component correction angle correction method and electronic component mounting apparatus using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3681843B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001053499A (en) * | 1999-08-09 | 2001-02-23 | Tdk Corp | Electronic component inserting machine |
| JP2011158477A (en) * | 2010-02-01 | 2011-08-18 | Koh Young Technology Inc | Three-dimensional shape inspection method |
| JP2011222781A (en) * | 2010-04-09 | 2011-11-04 | Hitachi High-Tech Instruments Co Ltd | Electronic component mounting method and electronic component mounting device |
| WO2013186817A1 (en) * | 2012-06-14 | 2013-12-19 | パナソニック株式会社 | Method for forming alignment mark, method for mounting electronic component, and method for manufacturing electronic component assembly |
| WO2019138469A1 (en) * | 2018-01-10 | 2019-07-18 | 株式会社Ｆｕｊｉ | Work machine and method for determining polarity |
| JP2020537358A (en) * | 2017-10-19 | 2020-12-17 | 上海望友信息科技有限公司 | Component polarity detection methods, systems, computer-readable storage media and devices |
-
1996
- 1996-11-20 JP JP30921396A patent/JP3681843B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001053499A (en) * | 1999-08-09 | 2001-02-23 | Tdk Corp | Electronic component inserting machine |
| JP2011158477A (en) * | 2010-02-01 | 2011-08-18 | Koh Young Technology Inc | Three-dimensional shape inspection method |
| US9062966B2 (en) | 2010-02-01 | 2015-06-23 | Koh Young Technology Inc. | Method of inspecting a three dimensional shape |
| JP2011222781A (en) * | 2010-04-09 | 2011-11-04 | Hitachi High-Tech Instruments Co Ltd | Electronic component mounting method and electronic component mounting device |
| WO2013186817A1 (en) * | 2012-06-14 | 2013-12-19 | パナソニック株式会社 | Method for forming alignment mark, method for mounting electronic component, and method for manufacturing electronic component assembly |
| JP2020537358A (en) * | 2017-10-19 | 2020-12-17 | 上海望友信息科技有限公司 | Component polarity detection methods, systems, computer-readable storage media and devices |
| WO2019138469A1 (en) * | 2018-01-10 | 2019-07-18 | 株式会社Ｆｕｊｉ | Work machine and method for determining polarity |
| JPWO2019138469A1 (en) * | 2018-01-10 | 2020-10-22 | 株式会社Ｆｕｊｉ | Working machine and polarity judgment method |
| US11219150B2 (en) | 2018-01-10 | 2022-01-04 | Fuji Corporation | Work machine and method for determining polarity |
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| Publication number | Publication date |
|---|---|
| JP3681843B2 (en) | 2005-08-10 |
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