JP2007189029A - Mounting system, mounting machine, mounting method of printer and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To acquire high production efficiency, while reducing defective mounting. <P>SOLUTION: The position of an opening S2 of mask S is measured by photoing a mask used when printing paste of cream solder and the like to a substrate W. With a mounting machine, electronic components are mounted to a mounting position set up, based on the position information on the opening S2 of the measured mask S. As a result of this way, defective mounting can be reduced by surely mounting electronic components on the paste printed on the substrate W. Furthermore, it becomes possible to acquire high productive efficiency, without having to measure the position of the paste actually printed on the substrate W for every substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mounting system for mounting electronic components on a substrate, a mounting machine, a printing machine, and a mounting method for electronic components.

  In the production of a substrate on which an electronic component is mounted, generally, cream solder is printed and applied to a substrate on which a circuit pattern is formed by a printing machine, and the electronic component is mounted by a mounting machine. The mounting position of the electronic component in the mounting machine is usually set according to the circuit pattern formed on the substrate.

  However, recently, with the miniaturization of electronic components, extremely high mounting position accuracy has been demanded, and mounting such as poor contact due to misalignment between the circuit pattern on the substrate and the printed solder is required. Defects can be a problem.

Therefore, for example, in Patent Document 1 below, a method is proposed in which the position of solder printed by a printing machine is measured for each substrate, and a mounting machine on the downstream side mounts electronic components according to the measured solder position. ing.
JP 2002-271096 A

  However, in the method shown in Patent Document 1, it takes time to measure the position of the solder printed for each substrate, so there is room for improvement in terms of production efficiency.

  The present invention has been made in view of the above problems, and an object thereof is to provide a mounting system, a mounting machine, a printing machine, and an electronic component mounting method capable of obtaining high production efficiency while reducing mounting defects. To do.

  The present invention provides the following means.

[1] A mounting system for mounting electronic components on a substrate,
A printing machine for printing a paste on a substrate through a mask in which an opening is formed;
An opening position measuring means for photographing the mask and measuring the position of the opening;
Mounting position setting means for setting the mounting position of the electronic component on the substrate based on the position of the measured opening;
A mounting machine for mounting electronic components at a set mounting position;
A mounting system characterized by comprising:

  [2] Opening position storage means for storing information that can identify each mask and positional information of the opening of each mask in association with the mask whose opening position is measured by the opening position measuring means. The mounting system according to the preceding item 1 provided.

[3] The opening position storage means is separately provided for the distance between the plurality of position reference marks formed on each mask, or distance reference data based on the measurement of the position of the opening of each mask. And a first tolerance value that is separately provided,
An inter-mark distance measuring unit that photographs a mask to be used and measures a distance between the plurality of position reference marks, and a distance measured by the inter-mark distance measuring unit is stored in the opening position storage unit. A print propriety judging means for judging that the print is rejected when a change of the distance measured by the inter-mark distance measuring means with respect to the reference data of the distance exceeds a first allowable value in comparison with the distance reference data; 3. The mounting system according to item 2 above.

[4] The opening position storage means is separately provided for the distance between the plurality of position reference marks formed on each mask, or distance reference data based on the measurement of the position of the opening of each mask. And a second tolerance value separately provided,
An inter-mark distance measuring unit that photographs a mask to be used and measures a distance between the plurality of position reference marks, and a distance measured by the inter-mark distance measuring unit is stored in the opening position storage unit. When the change of the distance measured by the inter-mark distance measuring unit with respect to the reference data of the distance exceeds a second allowable value, the mask is imaged again, and the opening position measuring unit And a mounting position resetting means for resetting the mounting position of the electronic component by causing the mounting position setting means to function.

  [5] With use substrate storage means for storing information that can identify each substrate and information that can identify the mask used for printing each substrate for the substrate coated with paste by the printing machine. 5. The mounting system according to any one of items 1 to 4.

[6] A mounting machine for mounting an electronic component on a substrate printed with a paste through a mask in which an opening is formed,
A mounting machine that mounts an electronic component at a mounting position on a substrate set based on position information of an opening measured by photographing the mask.

[7] Printing means for printing a paste on a substrate through a mask in which an opening is formed;
An opening position measuring means for photographing the mask and measuring the position of the opening;
In order to provide the setting of the mounting position of the electronic component, transmitting means for transmitting the position information of the measured opening,
A printing machine comprising:

[8] A mounting method for mounting an electronic component on a substrate,
A printing step of applying a paste on a substrate through a mask in which an opening is formed;
A measurement step of photographing the mask and measuring the position of the opening;
A setting step for setting the mounting position of the electronic component on the substrate based on the position of the measured opening;
A mounting step for mounting an electronic component at a set mounting position;
An electronic component mounting method characterized by comprising:

  According to the invention [1], since the mounting position of the electronic component is set based on the position of the opening measured by photographing the mask, the electronic component is securely mounted on the paste printed on the substrate. Thus, it is possible to reduce mounting defects. Further, high production efficiency can be obtained without measuring the position of the paste actually printed on the substrate for each substrate.

  According to the above invention [2], since the position information of the opening once measured is stored, by using the stored position information of the opening, the mask once measured is measured again. The mounting position can be set without performing this, and higher production efficiency can be obtained.

  According to the invention [3], since elongation occurs in the mask and printing can be stopped when the elongation exceeds the limit, it is possible to prevent wasteful printing and manufacture of defective substrates due to mounting.

  According to the above invention [4], even if the mask is stretched, the mounting position can be corrected in accordance with the stretching, so that there is no deviation between the position of the printed paste and the mounting position. The mounting quality can be secured.

  According to the above invention [5], since the mask used for printing each substrate can be grasped, even when the mask used for printing the same type of substrate is replaced, the printing is actually performed on each substrate. The mounting position can be set based on the position of the paste printed on each substrate.

  According to the invention [6], since the mounting position of the electronic component is set based on the position of the opening measured by photographing the mask, the electronic component is securely mounted on the paste printed on the substrate. Thus, it is possible to reduce mounting defects. Further, high production efficiency can be obtained without measuring the position of the paste actually printed on the substrate for each substrate.

  According to the printing machine according to the invention [7], since the positional information on the opening of the mask used for printing the paste is transmitted, the mounting machine securely mounts the electronic component on the paste printed on the substrate. Thus, it is possible to reduce mounting defects. Further, high production efficiency can be obtained without measuring the position of the paste actually printed on the substrate for each substrate.

  According to the invention [8], since the mounting position of the electronic component is set based on the position of the opening measured by photographing the mask, the electronic component is securely mounted on the paste printed on the substrate. Thus, it is possible to reduce mounting defects. Further, high production efficiency can be obtained without measuring the position of the paste actually printed on the substrate for each substrate.

  FIG. 1 is a configuration explanatory view showing a mounting system according to an embodiment of the present invention. As shown in the figure, this mounting system includes a printing machine 2, a plurality of mounting machines 1,..., An inspection machine 3, and a reflow furnace 4 constituting a production line. Each of these facilities is arranged in this order from the upstream side to the downstream side of substrate conveyance.

  The mounting system includes a mask opening measuring device 5 and a server computer 9 in addition to each facility constituting the production line.

  Each facility constituting these mounting systems includes a control device (control means) 6... Constituted by a personal computer or the like, and is configured such that driving of each facility on the mounting line is controlled by each control device 6. ing. Further, each control device 6 is connected via a network communication means such as a LAN, and while the equipment is driven while transmitting and receiving signals between the control devices, the operation controlled in the entire mounting system is performed. It is configured to be done. Each facility is provided with a display device 7 for displaying data related to the state of each facility, and an input device 8 such as a keyboard and a mouse for inputting various information.

  The server computer 9 is functionally configured with an opening position storage unit 91, a use mask storage unit 92, and the like, which will be described later.

  The printing machine 2 prints and applies paste such as cream solder or adhesive by screen printing on a predetermined area of a substrate carried in from a substrate carry-in machine (not shown).

  FIG. 2 is a perspective view showing an example of a printing machine. As shown in the figure, the printing machine 2 includes a printing stage 21 that holds a substrate W to be printed, a conveyor 22 for carrying the substrate W into and out of the printing stage 21, and an upper side of the printing stage 21. A mask holding unit 23 for holding the mask S, a squeegee unit 24 for expanding paste on the mask S, a camera unit 25 for photographing the substrate W and the mask S, and a cleaner unit 26 for cleaning the mask S are provided. .

  The printing stage 21 includes a main conveyor 211 that transports the substrate W and a clamp unit 212 that clamps and fixes the substrate W to be printed. The main conveyor 211 and the clamp unit 212 are connected to the Y-axis table 213 that can move in the Y-axis direction perpendicular to the X-axis direction (transport direction) in which the substrate is transported to the base 201 and the Y-axis table 213. An X-axis table 214 movable in the X-axis direction, an R-axis table 215 rotatable about a vertical line (Z-axis direction) with respect to the X-axis table 214, and a Z-axis relative to the Y-axis table 215 It is supported by a lifting table 216 that can move up and down in the axial direction, and is movable in each direction of XYZR.

  The mask holding unit 23 includes a mask support base 232 that supports a mask S in which an opening (pattern hole) is formed in a solder application portion, and a mask clamp 233 that fixes the mask S on the mask support base 232. . The mask support base 232 is attached to support frames 202 that are erected on both the left and right sides of the printing stage 21.

  The squeegee unit 24 includes a squeegee 241 that extends the paste on the mask S, and a squeegee holder 242 that supports the squeegee 241 so as to be movable up and down. The squeegee holder 242 is attached to a squeegee support beam 203 that can move in the Y-axis direction on support frames 202, 202 erected on both the left and right sides of the printing stage 21. When the squeegee 241 is lowered and the squeegee support beam 203 moves in the Y-axis direction, the squeegee 241 expands while rolling (kneading) paste such as cream solder on the mask S, and screen printing is performed. It is to be given.

  The camera unit 25 includes a mask photographing camera 251, a board photographing camera 252, and a barcode reader 253. The mask photographing camera 251, the board photographing camera 252 and the barcode reader 253 are attached to the camera head 254. The camera head 254 is attached to a camera support beam 204 supported on the lower surface side of support frames 202, 202 erected on both the left and right sides of the printing stage 21. The height position of the camera support beam 204 is set between the printing stage 21 in the lowered state and the mask S. The camera head 254 is attached so as to be able to run on the camera support beam 204 in the X-axis direction, and the camera support beam 204 is attached to the support frames 202 and 202 so as to be movable in the Y-axis direction. As a result, the camera head 254 can move on the XY plane and take an image of the substrate W and the mask S.

  FIG. 7A is a plan view showing an example of a mask. As shown in the figure, the mask S includes a plurality of position reference marks S1 for alignment with the substrate W to be printed, an opening S2 for applying paste such as cream solder, and each mask S. An identification mark S3 indicating ID information that can be identified and identified is formed. In this embodiment, the identification mark S3 is constituted by a barcode.

  FIG. 7B is a plan view showing an example of the substrate. As shown in the figure, the substrate W has a plurality of position reference marks W1 for alignment with the mask S and the like, and an electrode portion (circuit pattern) exposed on the substrate surface from a circuit built in the substrate W. W2... Is formed with an identification mark W3 indicating ID information which can identify each solid by specifying each substrate W.

  The mask photographing camera 251 includes, for example, a CCD camera equipped with illumination, and is provided upward to photograph the mask S located on the upper side of the camera unit 25. When a new mask S is set, the mask photographing camera 251 photographs the position reference mark S1 and the opening S2 provided on the mask S and measures the position. In addition, when the mask S is cleaned by the cleaner unit 26, the mask photographing camera 251 also photographs the opening S2 of the mask S and the like in order to confirm the cleaning state.

  The board photographing camera 252 includes, for example, a CCD camera equipped with illumination, and is provided downward to take a picture of the board W positioned below the camera unit 25. The substrate photographing camera 252 photographs the position reference mark W1 provided on the substrate W fixed to the printing stage 21 for alignment with the mask S, and measures the position. The board photographing camera 252 detects an identification mark W3 provided on the board W.

  The barcode reader 253 is composed of, for example, a line sensor camera equipped with infrared light illumination, and is provided upward to read an identification mark (barcode) S3 formed on the mask S.

  The cleaner unit 26 is attached to the same camera support beam 204 as the camera unit 25, and is slidably brought into contact with the lower surface (printing surface) of the mask S for cleaning.

  FIG. 3 is a functional block diagram showing an example of the configuration of the control system of the printing press. As shown in the figure, the control system of the printing press 2 is connected to a control device 6 composed of a personal computer or the like, with an arithmetic processing unit 291, print program storage unit 292, transport system data storage unit 293, motor control unit 294, external input. Each function of the output unit 295, mask opening information storage unit 296, server communication unit 297, image processing unit 298, and the like is configured.

  The arithmetic processing unit 291 comprehensively controls various operations in the printing press 2.

  The print program storage unit 292 stores a production program (print program) for printing / applying paste such as cream solder on the substrate W.

  The transport system data storage unit 293 stores various data related to transport of the substrate W on the production line.

  The motor control unit 294 controls the operation of the drive motor for each axis of XYZR and the drive motor for the squeegee axis (SQ axis) for positioning the substrate carried into the printing stage 21.

  The external input / output unit 295 inputs / outputs various information to / from various sensors provided in the printing machine 2, a barcode reader 253, a driving unit such as a stopper, and the like.

  The mask opening information storage unit 296 stores the position reference mark S1 of the mask S, the position information of the opening S2, and the like measured by the mask photographing camera 251 as opening measurement data.

  The server communication means 297 sends and receives various information to and from the server computer 9 and other equipment of the mounting system.

  The image processing unit 298 performs image processing for extracting necessary information from data captured by the mask photographing camera 251 and the board photographing camera 252.

  The mounting machine (mounting machine main body) 1... Mounts (mounts) electronic components at predetermined positions on the board.

  FIG. 4 is a plan view showing an example of a mounting machine. As shown in the figure, the mounting machine 1 is provided above the base 11, a conveyor 12 that is disposed on the base 11 and conveys the substrate W, component supply units 13 that are disposed on both sides of the conveyor, and the base 11. And a head unit 14 for mounting electronic components.

  The component supply unit 13 is provided on the upstream side and the downstream side of the conveyor 12 on the front side and the rear side, respectively. In this embodiment, a component supply unit 15 to which a plurality of component supply devices such as tape feeders can be mounted side by side is provided on the front side and the rear side upstream portion, and a component supply device such as a pallet is stacked on the rear side downstream portion. A tray-type component supply unit 16 that can be attached is provided. The components supplied from these component supply units 13 can be picked up by the head unit 14.

  Further, between the component supply unit 13 divided into the upstream side and the downstream side, component photographing cameras 17 and 17 are provided on both the front side and the rear side. The component photographing cameras 17 and 17 image the state of the component sucked by the head unit 14 and detect a positional deviation of the component.

  The head unit 14 is movable in a region extending between the component supply unit 13 and the mounting position on the substrate W so that components can be picked up from the component supply unit 13 and mounted on the substrate W. Specifically, the head unit 14 is supported by a head unit support member 142 extending in the X-axis direction (the substrate transport direction of the conveyor 12) so as to be movable in the X-axis direction. The head unit support member 142 is supported by guide rails 143 and 143 extending in the Y-axis direction (a direction orthogonal to the X-axis in the horizontal plane) at both ends thereof so as to be movable in the Y-axis direction. The head unit 14 is driven in the X axis direction by the X axis motor 144 via the ball screw 145, and the head unit support member 142 is driven in the Y axis direction by the Y axis motor 146 via the ball screw 147. To be done.

  A plurality of heads 148 are mounted on the head unit 14 side by side in the X-axis direction. Each head 148 is driven in the vertical direction (Z-axis direction) by an elevating mechanism using a Z-axis motor as a drive source, and is driven in the rotation direction (R-axis direction) by a rotary drive mechanism using an R-axis motor as a drive source. It has come to be.

  At the tip of each head 148, a suction nozzle for sucking and mounting the electronic component on the substrate is provided, and each nozzle sucks the electronic component with a suction force by a negative pressure supplied from a negative pressure means (not shown). It can be done.

  Further, the head unit 14 is provided with a board photographing camera 18 composed of, for example, a CCD camera equipped with illumination. The board photographing camera 18 photographs the position reference mark W1 and the like provided on the board W carried into the mounting machine 1, and measures its position. The board photographing camera 18 detects an ID mark provided on the board W. The ID mark provided on the substrate W represents ID information that can be identified by identifying each substrate W individually.

  FIG. 5 is a functional block diagram showing an example of the configuration of the control system of the mounting machine. As shown in the figure, the control system of the mounting machine 1 is connected to a control device 6 composed of a personal computer or the like, with an arithmetic processing unit 191, mounting program storage unit 192, transport system data storage unit 193, motor control unit 194, external input. Each function of the output unit 195, the image processing unit 196, the server communication unit 197, and the like is configured.

  The arithmetic processing unit 191 comprehensively controls various operations in the mounting machine 1.

  The mounting program storage unit 192 stores a production program (mounting program) for mounting each electronic component on the substrate W. The production program includes mounting position (coordinate) data of each electronic component based on the circuit pattern of the substrate W, shape data for recognizing each electronic component, and position (coordinate) of a feeder to which each electronic component is supplied. Etc. are included.

  The transport system data storage unit 193 stores various data related to transport of the substrate W on the production line.

  The motor control unit 194 controls the operation of the drive motors for the XYZR axes of the head unit 14.

  The external input / output unit 195 inputs and outputs various types of information to and from various sensors and stoppers provided in the mounting machine 1.

  The image processing unit 196 performs image processing for extracting necessary information from the photographing data obtained by the component photographing camera 17 and the board photographing camera 18.

  The server communication means 197 sends and receives various information to and from the server computer 9 and other equipment of the mounting system.

  The inspection machine 3 inspects the mounting state of each electronic component mounted on the board W by the mounting machines 1...

  The reflow furnace 4 reflows the cream solder applied to the substrate W, and stabilizes the electronic component by soldering to the substrate.

  The substrates W that are unloaded from the reflow furnace 4 are configured to be sequentially accommodated in a substrate unloader (not shown).

  The mask opening measuring device 5 measures the position of the opening formed in the mask S offline, not in the production line.

  FIG. 6 is a functional block diagram illustrating an example of the configuration of the mask opening measurement apparatus. As shown in the figure, the mask opening measuring device 5 includes a mask fixing means 51 for fixing the mask S, a mask photographing camera 52 for photographing the mask S, and a mask photographing camera 52 for the fixed mask S. A camera driving unit 53 that moves in the XY directions, a bar code reader 54 that includes a line sensor camera equipped with infrared light illumination that reads a bar code formed on the mask S, and a control device 6 that includes a personal computer or the like. I have.

  The control device 6 of the mask opening measuring device 5 includes an arithmetic processing unit 591, a measurement program storage unit 592, a motor control unit 594, an external input / output unit 595, a mask opening information storage unit 596, a server communication unit 597, an image processing unit. Each function such as 598 is configured.

  The arithmetic processing unit 591 comprehensively controls various operations in the mask opening measuring device 5.

  The measurement program storage unit 592 stores a production program (measurement program) for measuring the position of the opening or the like of the mask S.

  The motor control unit 594 controls the operation of the mask fixing unit 51 and the camera driving unit 53.

  The external input / output unit 595 inputs / outputs various types of information to / from a drive unit such as a barcode reader 54 provided in the mask opening measurement device 5.

  The mask opening information storage unit 596 stores the position reference mark S1 of the mask S, the position information of the opening S2, and the like measured by the mask photographing camera 52 as opening measurement data.

  The server communication means 597 transmits and receives various information to and from the server computer 9 and other equipment of the mounting system.

  The image processing unit 598 performs image processing for extracting necessary information from data captured by the mask imaging camera 52.

  The opening position storage unit 91 of the server computer 9 stores the measured position reference mark S1 of the mask S, position information of the opening S2, and the like as opening measurement data.

  The use mask storage means 92 of the server computer 9 can specify the substrate ID information for identifying each substrate W and the mask S used for printing each substrate W for each substrate W printed by the printing machine 2. And associated mask ID information.

  Next, the procedure of the electronic component mounting method by the mounting system in this embodiment will be described with reference to a flowchart.

  In the mounting system according to the present embodiment, the position of the opening of the mask S used in the printing machine 2 is measured by the mask opening measuring device 5 for the mask S immediately after being manufactured and used for printing. The mask S that may be stretched is measured by the printing machine 2 in a state in which the mask S is mounted on the printing machine 2 for printing, and is mounted on the mounting machine 1 based on the measured position information of the opening. Operation is to be performed.

  Hereinafter, operations in the mask opening measuring device 5, the printing machine 2, and the mounting machine 1 will be described in order.

  FIG. 8 is a flowchart showing an example of a mask measurement operation procedure in the mask opening measurement apparatus.

  In mask measurement in the mask opening measuring device 5, a mask S that does not stretch immediately after the measurement object is manufactured is fixed to the mask fixing means 51 (step S10). The mask S may be carried into the mask fixing means 51 by hand by an operator or automatically using a transfer device or the like.

  When the mask S is fixed, the identification mark (barcode) S3 formed on the mask S is read by the barcode reader 54, and mask ID information is acquired (step S11). As a result, the mask S to be measured is specified and recognized by the mask opening measuring device 5.

  Further, the mask photographing camera 52 photographs a plurality of position reference marks S1 formed on the mask S, and a plurality of position reference marks (not shown) formed on the mask S exclusively for detecting the extension of the mask S. Then, the position is measured by the image processing unit 598 (step S12).

  Then, the opening S2 formed in the mask S is photographed by the mask photographing camera 52, and the position thereof is measured by the image processing unit 598 (step S13). In this embodiment, the mask photographing camera 52 and the image processing unit 598 function as an opening position measuring unit.

  When the position (coordinates) of the opening S2 is thus measured, the image processing unit 598 calculates the center coordinates of the electronic component to be mounted on the paste (cream solder) applied by the opening S2. (Step S14).

  FIG. 11A is an explanatory diagram of the center coordinates of the electronic component calculated based on the position of the opening of the mask. As shown in the figure, the center coordinate C1 of the component C mounted across the paste (cream solder) applied by the two openings S2 and S2 is obtained according to the position of the opening S2 in the mask S. . The center coordinate C1 of the electronic component C calculated here is based on the position of the opening S2, and is hereinafter referred to as “opening center coordinates”. The opening center coordinates are expressed by a coordinate system in the mask S, that is, a coordinate system defined by the position reference mark S1 of the mask S.

  If the opening center coordinates are calculated in this way, the position of the position reference mark S1 formed on the mask S, the opening center coordinates for each part, the coordinates of the plurality of position reference marks S1,..., And the plurality of position reference marks S1. .. Are stored in the mask opening information storage means 596 and transmitted to the server computer 9 by the server communication means 597. And stored in the opening position storage means 91 of the server computer 9 (step S15). In this embodiment, the server communication unit 597 transmits information on the distance between the opening center coordinates obtained by measurement, the coordinates of the plurality of position reference marks S1,..., And the plurality of position reference marks S1,. Functioning as a transmission means.

  The mask S for which measurement has been completed is unfixed by the mask fixing means 51 (step S16), and a series of measurement operations by the mask opening measuring device 5 is completed.

  FIG. 9 is a flowchart illustrating an example of a printing operation procedure in the printing press.

  In the printing operation in the printing machine 2, a production program (printing program) is first selected by an operator or the like according to the type of substrate W to be produced (step S20). This selection may be performed via a network by the server computer 9 or the like that manages the entire mounting system.

  Subsequently, a mask S used for printing is attached and fixed to the mask holding unit 23 of the printing press 2 by an operator or the like (step S21).

  When the printing press is activated (step S22), first, the identification mark (barcode) S3 formed on the mask S is read by the barcode reader 253, and mask ID information is acquired (step S23). Thereby, the mask S to be measured is specified and recognized by the printing press 2.

  Further, a plurality of position reference marks S1,... Formed on the mask S are photographed by the mask photographing camera 251 and the positions thereof are measured by the image processing unit 298 (step S24).

  Subsequently, the calculation processing unit 291 of the printing press 2 determines whether or not the mask S attached to the printing press 2 has already been measured for the position of the opening and the measurement data of the opening is stored. Judgment is made (step S25). For this determination, in addition to the mask opening information storage unit 296 of the printing machine 2 itself, the server communication unit 297 uses the server system 9 via the network of the mounting system to store the opening position storage unit 91 of the server computer 9 and the mask of the mask opening measuring device 5. Reference is made to the opening information storage means 596.

  If there is no opening measurement data (NO in step S25) (the mask S data and the mounting position data obtained by measuring by the mask opening measuring device 5 for the mask S that is not stretched or distorted due to use immediately after being manufactured). When there is no image, the mask photographing camera 251 photographs the openings S2... Formed in the mask S, and the position is measured by the image processing unit 298 (step S23). In this embodiment, the mask photographing camera 251 and the image processing unit 298 function as an opening position measuring unit.

  When the position (coordinates) of the opening S2 is measured, the image processing unit 298 performs center coordinates (opening center coordinates) of the electronic component to be mounted on the paste (cream solder) applied by the opening S2. ) Is calculated (step S27).

  The distance between the plurality of position reference marks S1, etc. formed on the mask S, etc., and the opening center coordinates for each part are stored in the mask opening information storage means 296, and The data is transmitted to the server computer 9 by the server communication unit 297 and stored in the opening position storage unit 91 of the server computer 9 (step S28). In this embodiment, the server communication unit 297 functions as a transmission unit that transmits the position information of the measured opening.

  In step S28, the distance data between the plurality of position reference marks S1,... Is stored in the mask aperture information storage means 296 as distance reference data for determining the extension of the mask S. Yes, after NO is determined in step S30 described below, the distance data between the plurality of position reference marks S1, etc. in step S28 is not stored in the mask aperture information storage unit 296.

  On the other hand, if there is opening measurement data (YES in step S25), the image processing unit 298 calculates the distance between the plurality of position reference marks S1 of the measured mask S (step S29). In this embodiment, the mask photographing camera 251 and the image processing unit 298 function as an inter-mark distance measuring unit that measures the distance between the plurality of position reference marks S1.

  Then, the arithmetic processing unit 291 compares the distance between the position reference marks S1 calculated from the current measurement result with the distance reference data stored in the opening position storage means 91 of the server computer 9 and the like. (Step S30). The distance reference data may be included in the opening measurement data to be stored, or may be calculated based on the position of each position reference mark S1 when compared with the current measurement result. By this comparison, it is possible to determine whether or not the mask S is stretched or the like and there is a difference between the stored measurement data and the current state of the mask S. Note that the opening position storage means 91 and the like of the server computer 9 store the distance between the position reference marks S1 directly or indirectly in a calculable state.

  As a result of the comparison, when the change in the distance between the position reference marks S1 exceeds a predetermined first allowable range (the distance between the position reference marks S1 calculated from the current measurement result and the distance reference data Or the position reference mark S1 calculated from the current measurement result, etc. The ratio of the distance to the reference data of the distance exceeds a first predetermined value in the ratio), that is, the mask S is significantly stretched, and even if the mounting position is changed, a mounting failure occurs. If it is, the arithmetic processing unit 291 stops the transition to the printing process, displays that the mask S1 is unusable on the display unit 7, and associates this unusable information with the ID information of the mask S. Using the server 9 Stored in the storage means. In this embodiment, the arithmetic processing unit 291 functions as a print availability determination unit that compares the measured distance with distance reference data and determines whether printing is possible according to the change.

  On the other hand, as a result of the comparison, a change in the distance of the position reference mark S1 does not exceed the first allowable range, but exceeds a predetermined second allowable range smaller than the first allowable range. (The second difference in the difference between the distance between the position reference marks S1 and the like calculated from the current measurement result and the distance reference data is set to be larger as the length is longer corresponding to the length of each distance. If the predetermined value (smaller than the first predetermined value in the difference) is exceeded, or the ratio of the distance between the position reference marks S1 calculated from the current measurement result to the reference data of the distance is When the second predetermined value in (exceeds the first predetermined value in the ratio) is exceeded, that is, when the mask S has a large elongation (NO in step S30), the arithmetic processing unit 291 for past measurements Over data is determined to not be used, the process proceeds to the position measurement of the opening portion S2 of the mask (step S26). In this embodiment, the arithmetic processing unit 291 functions as a mounting position resetting unit that determines whether or not a mounting position to be described later can be set based on the stored opening measurement data and resets the mounting position as described later. To do.

  On the other hand, when the change in the distance between the position reference marks S1 is within a predetermined allowable range, that is, when there is no significant elongation or the like in the mask S (YES in step S30), the past opening measurement data is obtained. Since it can be used, each step of measuring the position of the opening S2 of the mask (steps S26 to S28) is skipped.

  When the positional information of the opening of the mask S used for printing is thus saved, the process proceeds to a printing / application step of paste such as cream solder on the substrate W.

  Specifically, first, the substrate W is carried into the printing press 2 by a substrate carry-in machine (not shown) and positioned (step S31).

  Then, the substrate photographing camera 252 reads the identification mark W3 formed on the substrate W, and acquires substrate ID information (step S32). Thereby, the substrate W to be printed is specified and recognized by the printing machine 2.

  Further, a plurality of position reference marks W1,... Formed on the substrate W are photographed by the substrate photographing camera 252, and their positions are measured by the image processing unit 298 (step S33).

  When the position of the position reference mark W1 of the substrate W is thus measured, the position of the substrate W with respect to the fixed mask S is calculated by the arithmetic processing unit 291 in accordance with the position reference mark S1 of the mask S that has already been measured. Matching is performed (step S34). This alignment is performed so that the coordinate system of the mask S defined by the position reference mark S1 of the mask S matches the coordinate system of the substrate W defined by the position reference mark W1 of the substrate W. Thereby, the opening center coordinates stored in the opening position storage means 91 and the like of the server computer 9 are expressed in the coordinate system defined by the position reference mark S1 of the mask S as described above. By making the coordinate system of the mask S and the coordinate system of the substrate W coincide with each other, the opening center coordinates are also expressed in the coordinate system defined by the position reference mark W1 of the substrate W.

  In addition, a manufacturing error, elongation, or the like occurs in one or both of the mask S and the substrate W, and the coordinate systems of the mask S and the substrate W may not be able to coincide with each other. In such a case, even if the positioning of the mask S and the substrate W is adjusted with priority given to, for example, a mounting area of a fine component that is sensitive to the printing position shift of the paste (cream solder) with respect to the circuit pattern on the substrate W. Good. Such adjustment can be automatically performed by the arithmetic processing unit 291 in accordance with the measured positions and distances (elongation amounts) of the position reference marks S1 and W1 of the mask S and the substrate W. Alternatively, the operator or the like may visually determine the adjustment amount and input it to the printing press 2 to adjust the alignment. In particular, when production of a new type of substrate W is started, an offset with respect to the alignment based on the position reference marks S1 and W1 of the mask S and the substrate W in order to cope with a minute manufacturing error of the mask S and the substrate W. An adjustment amount may be set.

  When the alignment of the substrate W with respect to the mask S is performed in this manner, the substrate W is brought into close contact with the mask S (step S35), and the squeegee 241 is operated to execute paste (cream solder) printing (step S36). . When printing is completed, the substrate W is separated from the mask S (step S37).

  Then, the server communication unit 297 associates the substrate ID information that can specify the printed substrate W with the mask ID information that can specify the mask S used for printing, and transmits it to the server computer 9 to use the mask. The data is stored in the storage unit 92 (step S38). At this time, in addition to the alignment according to the positions of the position reference marks S1 and W1 of the mask S and the substrate W as described above, when the alignment is adjusted, the adjustment amount is also determined by the substrate ID information and the mask. The information is stored in association with the ID information.

  If the information associating the mask S and the substrate W is thus saved, the printed substrate is carried out (step S39), and the printing step is completed. When printing on the next substrate W is continued using the same mask S, the process may be repeated from step S31.

  FIG. 10 is a flowchart illustrating an example of a mounting operation procedure in the mounting machine.

  In the mounting operation in the mounting machine 1, a production program (mounting program) is first selected by an operator or the like according to the type of substrate W to be produced (step S40). This selection may be performed via a network by the server computer 9 or the like that manages the entire mounting system.

  When the mounting machine 1 is activated (step S41), the program counter is cleared (step S42). Then, the substrate W on which the paste (cream solder) is printed is loaded from the printing machine 2 or a mounting machine on the upstream side, and positioned at a predetermined mounting work position (step S43).

  When the substrate W is positioned, the substrate imaging camera 18 reads the identification mark W3 formed on the substrate W, and acquires substrate ID information (step S44). Thereby, the board | substrate W of mounting object is specified, and the mounting machine 1 recognizes.

  Subsequently, according to the production program (mounting program), the electronic component is sucked from the component supply unit 13 by the head unit 14 (step S45). The sucked component is photographed by the component photographing camera 17, and the type and the sucking state (sucking position) of the component are recognized by the image processing unit 196 (step S46).

  Then, by the arithmetic processing unit 191, the opening center coordinate of the mask S used in the printing process in the printing machine 2 for the sucked part is transferred from the opening position storage unit 91 of the server computer 9 to the server communication unit 197. (Step S47). Specifically, mask ID information for identifying the mask S used for printing the substrate W is detected from the used mask storage unit 92 of the server computer 9, and the opening center coordinates in the mask S are the opening position storage unit. It is drawn from 91. Here, in the printing of the substrate W, in addition to the alignment according to the positions of the mask S and the position reference marks S1 and W1 of the substrate W, the alignment is adjusted, and the adjustment amount is stored in the used mask storage unit 92. If saved, the adjustment amount is also acquired.

  Subsequently, the mounting position (mounting coordinates) of the sucked component on the substrate W is set by the arithmetic processing unit 191 (step S48). The mounting position is set by correcting the mounting coordinates corresponding to the circuit pattern of the substrate W set in advance in the production program (mounting program) with the component center coordinates calculated based on the position of the opening S2 of the mask S. Is done by doing. In this embodiment, the arithmetic processing unit 191 functions as a mounting position setting unit that sets the mounting position of the electronic component on the substrate W based on the position of the opening S2 of the mask S. Here, in the printing of the substrate W, in addition to the alignment according to the positions of the mask S and the position reference marks S1 and W1 of the substrate W, the adjustment amount is also taken into account. The mounting position is set.

  FIG. 11B is an explanatory diagram of the mounting position of the electronic component based on the position of the paste printed / applied on the substrate W and the mounting position of the electronic component based on the circuit pattern formed on the substrate W.

  The paste (cream solder) applied to the substrate W is at the same position as the opening S2 of the mask S. The position of the paste P ideally matches the circuit pattern (electrode part) W2 of the substrate W. However, the current situation is that the position of the paste P and the circuit pattern W2 do not completely match at all the component mounting positions due to deformation such as a manufacturing error or elongation of the mask S or the substrate W.

  Therefore, in this embodiment, as shown in the figure, the mounting coordinates C2 in the production program set based on the position of the circuit pattern W2 is corrected based on the opening center coordinates C1 indicating the position of the paste P. To set the mounting position. In the printing of the substrate W, in addition to the alignment according to the positions of the mask S and the position reference marks S1, W1 of the substrate W, if the alignment is not adjusted, the mounting position is set to the opening center coordinate C1. Will be.

  If the coordinates (mounting position) on the substrate W on which the sucked component is to be mounted are set, the suction nozzle that sucks the component is moved toward the mounting position (step S49). At this time, by further taking into account the suction state (suction position) of the component based on the imaging result of the component imaging camera 17, the center of the component suctioned by the suction nozzle reaches the set mounting coordinate (mounting position). Thus, the amount of movement of the suction nozzle is controlled.

  When the sucked component is transferred to the set mounting position, the suction nozzle is lowered, the component is mounted on the substrate W (step S50), and the program counter is incremented because the mounting operation for the component is completed (step S50). Step S51).

  The above component mounting operation (steps S45 to S51) is repeated until the mounting of all the components is completed (NO in step S52). When the mounting of all the components is completed (YES in step S52), the mounting of the components is completed. The board W thus carried out is carried out (step S53), and a series of component mounting operations in the mounting machine 1 is completed.

  As described above, according to the mounting system of the present embodiment, the mounting position of the electronic component is set based on the position of the opening S <b> 2 measured by photographing the mask S, and is thus printed on the substrate W. An electronic component can be reliably mounted on the paste P such as cream solder to reduce mounting defects. In addition, high production efficiency can be obtained without measuring the position of the paste P actually printed on the substrate W for each substrate W.

  Further, when detecting cream solder printed on the substrate W, it is easily influenced by the material and color of the substrate W as a background or a circuit pattern formed on the substrate W, and it is difficult to obtain high measurement accuracy. In this respect, in the above-described embodiment, since the mask S is photographed instead of the paste actually printed on the substrate W, the position of the opening S2 is measured more accurately, and reliable electrons on the paste P are measured. This can contribute to the mounting of parts. Further, there is no need for expensive illumination or optical equipment such as a camera for more accurately measuring cream solder or the like printed on the substrate W.

  Further, since the position information of the opening once measured is stored in the opening position storage means 91 and the like, the mask S once measured is again used by using the stored position information of the opening. The mounting position can be set without performing the above measurement, and higher production efficiency can be obtained.

  Further, when the mask S is used in the printing machine 2, the distance between the position reference marks S1 is compared with the distance measured in the past, and if the change exceeds the first allowable range, printing on the printing machine 2 is performed. If the change does not exceed the first allowable range but exceeds the second allowable range smaller than the first allowable range, the position of the opening S2 is re-measured in the printing press 2. For this reason, even when elongation occurs in the mask S, it is possible to prevent the mounting position from being set based on the position information of the opening S2 different from the current state. The distance reference data in this comparison can be obtained by photographing the mask S in a state where the number of times of printing use is small and the elongation is small. Furthermore, you may acquire based on Gerber data (mask manufacturing action data).

  In addition, since the mask S used for printing for each substrate W is stored in the use mask storage unit 92, even when the mask S used for printing the same type of substrate W is exchanged, etc. Thus, the mounting position can be set based on the position of the paste printed on each substrate W.

  In the above embodiment, the mounting system includes the mask opening measuring device 5 that does not constitute a production line and measures the position of the opening S2 of the mask S offline, but the position of the opening S2 of the mask S is not included. The measurement may be performed only by the printing press 2. Conversely, the position measurement of the opening S2 of the mask S may be performed only by the off-line mask opening measuring device 5.

  Note that the mask used for determining the elongation is photographed, and the distance between the plurality of position reference marks is measured in accordance with the opportunity to measure the position of the opening S2 of the mask S. Not only with the machine 2, but with the mask opening measuring device 5. Furthermore, in the above-described embodiment, the mounting position is set again according to the elongation, and the printing is stopped. However, only one of them may be performed.

  In the above embodiment, the positional information of the measured opening S2 of the mask S is stored in the measured mask opening measuring device 5 or the printing machine 2 and the server computer 9. You may make it memorize | store only in a location. Alternatively, the mounting machine 1 may be provided with an opening position storage unit, and the position information of the opening S2 measured by the printing machine 2 or the like may be transmitted to the mounting machine 1 and stored in the mounting machine 1.

  In the above embodiment, the mounting position of the electronic component is set in the mounting machine 1 based on the measured position of the opening S2. For example, the server computer 9 is provided with mounting position setting means, and the server computer 9 For example, the mounting position may be calculated and set, and the mounting machine 1 may perform the electronic component mounting operation based on the setting result.

  In the above embodiment, the server computer 9 stores the substrate ID information that can specify the substrate for each substrate W on which the paste is printed and the mask ID information that can specify the mask S used for the printing. Alternatively, the use mask storage means may be provided in other equipment such as the printing machine 2 or the mounting machine 1 to store the mask S used in the printing machine 2 or the mounting machine 1 or the like.

  The opening position information stored in the opening position storage means may be in any form that can be used for setting the mounting position of the electronic component, and is applied by each opening S2 as in the above embodiment. The center coordinates of the electronic component mounted on the cream solder (paste) or the coordinates and shape data of each opening S2 itself may be used.

  Further, the opening S2 measured by the opening position measuring means may be only a part of the opening S2 formed in the mask S. For example, only the opening S2 for the paste on which a fine component requiring extremely high accuracy is required at the mounting position may be used.

  The mask S may be photographed before the mounting operation, and may be before or after the paste is printed on the substrate W.

  In the above-described embodiments, specific configuration examples have been described for the mounting machine 1... And the printing machine 2. However, in both cases, a mechanism for moving the substrate and the camera, the mask, the head unit, or the like relative to each other may adopt any type. it can.

It is a configuration explanatory view showing a mounting system according to an embodiment of the present invention. It is a perspective view which shows an example of a printing machine. It is a functional block diagram which shows an example of a structure of the control system of a printing machine. It is a top view which shows an example of a mounting machine. It is a functional block diagram which shows an example of a structure of the control system of a mounting machine. It is a functional block diagram which shows an example of a structure of a mask opening part measuring apparatus. (A) is a top view which shows an example of a mask. (B) is a top view which shows an example of a board | substrate. It is a flowchart which shows an example of the mask measurement operation | movement procedure in a mask opening part measuring apparatus. It is a flowchart which shows an example of the printing operation procedure in a printing machine. It is a flowchart which shows an example of the mounting operation | movement procedure in a mounting machine. (A) is explanatory drawing of the center coordinate of the electronic component calculated based on the position of the opening part of a mask. (B) is explanatory drawing of the mounting position of the electronic component based on the position of the paste printed and apply | coated to the board | substrate, and the mounting position of the electronic component based on the circuit pattern formed in the board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mounting machine 18 Board | substrate photography camera 2 Printing machine 251 Mask photography camera 252 Board photography camera 296 Mask opening information storage means 5 Mask opening part measuring device 52 Mask photography camera 596 Mask opening information storage means 9 Server computer 91 Opening part position storage means 92 Used mask storage means W Substrate W1 Position reference mark W2 Circuit pattern (electrode part)
S mask (screen)
S1 Position reference mark S2 Opening P Paste (cream solder)

Claims (8)

A mounting system for mounting electronic components on a board,
A printing machine for printing a paste on a substrate through a mask in which an opening is formed;
An opening position measuring means for photographing the mask and measuring the position of the opening;
Mounting position setting means for setting the mounting position of the electronic component on the substrate based on the position of the measured opening;
A mounting machine for mounting electronic components at a set mounting position;
A mounting system characterized by comprising:   An opening position storage means for storing information that can specify each mask and position information of the opening of each mask in association with each other for the mask whose opening position is measured by the opening position measuring means. Item 4. The mounting system according to Item 1. The opening position storage means is separately provided for the distance between a plurality of position reference marks formed on each mask, or separately with distance reference data based on the measurement of the position of the opening of each mask. Configured to store a first tolerance value to be granted,
An inter-mark distance measuring unit that photographs a mask to be used and measures a distance between the plurality of position reference marks, and a distance measured by the inter-mark distance measuring unit is stored in the opening position storage unit. A print propriety judging means for judging that the print is rejected when a change of the distance measured by the inter-mark distance measuring means with respect to the reference data of the distance exceeds a first allowable value in comparison with the distance reference data; The mounting system according to claim 2 provided. The opening position storage means is separately provided for the distance between a plurality of position reference marks formed on each mask, or separately with distance reference data based on the measurement of the position of the opening of each mask. Configured to store a second tolerance value to be granted,
An inter-mark distance measuring unit that photographs a mask to be used and measures a distance between the plurality of position reference marks, and a distance measured by the inter-mark distance measuring unit is stored in the opening position storage unit. When the change of the distance measured by the inter-mark distance measuring unit with respect to the reference data of the distance exceeds a second allowable value, the mask is imaged again, and the opening position measuring unit The mounting system according to claim 2, further comprising: a mounting position resetting unit that causes the mounting position setting unit to function and resets the mounting position of the electronic component.   2. A use mask storage unit that stores information that can identify each substrate and information that can identify a mask used to print each substrate in association with the substrate coated with paste by the printing machine. The mounting system in any one of -4. A mounting machine for mounting electronic components on a substrate printed with a paste through a mask in which an opening is formed,
A mounting machine that mounts an electronic component at a mounting position on a substrate set based on position information of an opening measured by photographing the mask. Printing means for printing a paste on a substrate through a mask in which an opening is formed;
An opening position measuring means for photographing the mask and measuring the position of the opening;
In order to provide the setting of the mounting position of the electronic component, transmitting means for transmitting the position information of the measured opening,
A printing machine comprising: A mounting method for mounting electronic components on a substrate,
A printing step of applying a paste on a substrate through a mask in which an opening is formed;
A measurement step of photographing the mask and measuring the position of the opening;
A setting step for setting the mounting position of the electronic component on the substrate based on the position of the measured opening;
A mounting step for mounting an electronic component at a set mounting position;
An electronic component mounting method characterized by comprising: