JP2007184498A - Component mounting processing method and component mounting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten a cycle time of a surface mounter in manufacturing multiple printing substrates. <P>SOLUTION: A component mounting system includes a screen printer 2 for printing a paste on each of multiple printing substrates, and a surface mounters 3-5 each mounting components on each of the substrates after printing. In this system, the screen printer 2 previously recognizes the image indicating the presence or absence of a bad mark on each of areas included in the multiple printing substrate, and a result (information about defective areas) of the presence or absence is transferred to the surface mounters 3-5, thereby applying component mounting processing to areas other than the defective area having the bad mark formed in the surface mounters 3-5, based on the result data of presence or absence. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for rationally processing a so-called multi-sided board in a component mounting system including a printing apparatus and a surface mounting machine.

  Conventionally, while conveying a substrate (PWB) on which a circuit pattern is formed, first, a paste such as cream solder or conductive paste on the substrate is printed (printed) on a mounting position in a printing apparatus, and then a surface mounter (hereinafter, referred to as a surface mounter). 2. Description of the Related Art A component mounting system is known in which components are sequentially mounted at printing positions by a mounting machine) to produce a board (PCB).

Further, in this type of component mounting system, when producing a so-called multi-sided board including a plurality of areas where the same circuit is formed, for example, an area having a severe defect is marked in advance in the area (bat mark The mounting process for the area is omitted by recognizing the bat mark by the mounting machine (for example, Patent Document 1). The bat mark is recognized by recognizing the presence or absence of a movable camera provided on the mounting machine while sequentially moving the camera to the coordinate position of the bat mark.
Japanese Patent Laid-Open No. 10-098297

  In the component mounting system as described above, in recent years, it is required to mount more components on a single board as the density of the board increases. On the other hand, downsizing of the substrate is also progressing, and it is required to process a multi-sided substrate including a large number of areas. Therefore, for example, in a mounting machine, when trying to mount a component on a multi-sided board including a large number of areas, it is required to mount a large number of components, and this includes a large number of mark coordinates including a bat mark in each area. As a result of requiring that the camera be moved to a position, there is a problem that it is difficult to shorten the tact time.

  In addition, after the printing process is performed on the substrate in the printing apparatus, the printed state is inspected, and when a printing defect occurs, the substrate is removed. Since a single mask sheet is placed on the substrate and the entire process is integrally performed, the print state is always inspected regardless of the type of substrate. For this reason, there is no concept of area for multi-sided boards, and all-point inspection is always performed, and even if there are printing defects in some areas, the entire board is treated as defective, resulting in wasted effective areas. There was a case. Therefore, it is also desired to improve this point.

  The present invention has been made in view of the above circumstances, and a first object thereof is a surface mounting machine for producing a multi-sided board in a component mounting system including a printing apparatus and a surface mounting machine. The tact time is effectively shortened, and the second object is to improve the yield in the production of multi-sided substrates.

  In order to solve the above-described problems, a component mounting processing method according to the present invention uses a component mounting system including at least a surface mounter for mounting components on a board, and includes a plurality of areas in which circuits independent from each other are formed. A method of performing component mounting processing on a multi-sided board having a defective area that does not require mounting processing in each area of the multi-sided board before carrying into the surface mounter, By transferring information on the defective area to the surface mounter, a component mounting process is performed on the area other than the defective area in the surface mounter based on this information (claim 1).

  In this way, if the defective area of the board (multiple-sided board) is specified in advance before being brought into the surface mounter, the trouble (time) of specifying the defective area in the surface mounter can be saved. Thus, it is possible to promptly proceed with the component mounting process.

  In this method, when the component mounting system includes a printing device that prints a paste on a substrate and the component is mounted on the printed substrate by the surface mounter, information on the defective area in the printing device. And this information is preferably transferred from the printing apparatus to the surface mounter (claim 2).

  That is, when a multi-sided substrate is a substrate to be processed, the tact time of the printing apparatus is usually shorter than that of the surface mounting machine. Therefore, by increasing the work load of the printing apparatus as described above, The work burden can be reduced.

  Specifically, for a multi-sided substrate in which a bat mark is formed in advance in a defective area in which no component mounting is required, the area where the bat mark is formed is examined in advance, and the area where the bat mark is formed If the information is transferred to the surface mounter as a defective area (claim 3), the tact time of the surface mounter can be effectively shortened.

  In addition, after the printing process by the printing apparatus, the printing state is inspected, and if a printing defect is detected, an area to which the printing defect belongs is specified among the areas, and the information is determined by using the specific area as a defective area. May be transferred to the surface mounter (claim 4).

  According to this method, it is possible to omit the mounting process only for an area where the printing state is bad (area to which the printing defect belongs) among the areas of the multi-sided board. In other words, it is possible to effectively utilize an area where the printing process has been properly performed.

  On the other hand, the component mounting system according to the present invention uses a multi-sided substrate having a plurality of areas in which independent circuits are formed as a substrate to be processed, a printing apparatus for printing paste on the substrate, and a component on the printed substrate. A component mounting system including at least a surface mounter to be mounted, wherein the printing apparatus is based on image data of a substrate imaged by the camera and a camera for imaging the substrate that can move relative to the substrate. The surface mounting machine includes: a specifying unit that specifies a defective area that does not require mounting processing among the areas; and a transmission unit that transmits information on the defective area specified by the specifying unit to the surface mounting machine. Receiving means for receiving information relating to the defective area transmitted by the transmitting means, and areas other than the defective area based on the received information In which and a control unit for controlling the component mounting operation to apply the mounting process of components for (claim 5).

  According to this component mounting system, a board (multi-faced board) is imaged by a camera provided in a printing apparatus, and a defective area is specified based on the image data. Then, the information regarding the defective area is transferred to the surface mounter side via the transmitting unit of the printing apparatus and the receiving unit of the surface mounter, and the component mounting operation is controlled by the control unit based on this information. Therefore, the component mounting processing method according to claims 1 and 2 is embodied in the component mounting system.

  In this apparatus, when a multi-sided substrate in which a bat mark is formed in advance in a defective area that does not require component mounting in each area is a substrate to be processed, the camera uses the coordinates of the bat mark on the substrate. The position may be sequentially imaged, and the specifying means may determine the presence or absence of a bat mark based on the image data and specify an area where the bat mark is formed as a defective area.

  In addition, the camera sequentially captures the printing position of the substrate after the printing process, and the specifying unit detects a printing defect based on the image data, and when the printing defect is detected, The area to which the printing defect belongs may be specified as a defective area.

  According to these configurations, the component mounting processing methods of claim 3 and claim 4 are realized in the component mounting system, respectively.

  According to the component mounting processing method according to claims 1 to 4 of the present invention and the component mounting system according to claims 5 to 7, it is possible to save labor (time) for identifying a defective area that is not required to be mounted in the surface mounter. Therefore, the tact time of the surface mounter when producing a multi-sided substrate can be effectively shortened. In particular, according to the component mounting processing method according to claim 4 and the component mounting system according to claim 7, even if a printing failure occurs in a part of each area of the multi-sided board, the other areas (printing) It is possible to make effective use of the area where processing is properly performed, and as a result, it is possible to improve the yield by reducing the number of substrates on which lines are dropped.

  A preferred embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 schematically shows a mounting line which is a component mounting system according to the present invention (a component mounting system to which the component mounting processing method according to the present invention is applied). This line has a configuration in which a loader 1, a screen printing device 2, a first surface mounter 3, a second surface mounter 4, a third surface mounter 5, a reflow furnace 6 and an unloader 7 are arranged in series from the upstream side. It has become. The printed circuit board (hereinafter simply referred to as a board) is sequentially fed out from the loader 1 so that each process of solder paste printing, component mounting (mounting), and paste curing is sequentially performed on the board and taken out to the unloader 7. Yes.

  Each of the devices 1 to 7 is an autonomous device including the control devices 1A to 7A, and each of the devices 1 to 6 is individually controlled by its own control device. Further, the screen printing apparatus 2 and the surface mounters 3 to 5 are connected to the LAN 8, and various information relating to the production of the substrate can be transmitted to each other through the LAN 8. In the figure, reference numeral 9 denotes a server.

  2 and 3 schematically show the screen printing apparatus 2. FIG. 2 is a side view of a main part with the cover removed, and FIG. 3 shows the screen printing apparatus 2 in a front view.

  As shown in these drawings, a printing stage 13 is provided on a base 11 of a screen printing apparatus 2 (hereinafter, abbreviated as a printing apparatus 2), and a printed circuit board P is disposed on both sides of the printing stage 13 with the printing stage 13 in between. An upstream conveyor 12 </ b> A and a downstream conveyor 12 </ b> C for carrying in and out of the printing stage 13 (hereinafter abbreviated as “substrate P”) are arranged along the conveyance line. In the following description, the conveyance direction of the board P by the conveyors 12A and 12C (the same as the conveyance direction of the board P in the component mounting system, that is, the arrangement direction of the devices 1 to 7) is the X-axis direction, and on the horizontal plane. In the following description, the direction orthogonal to the Y-axis direction and the direction orthogonal to both the X-axis and Y-axis directions are defined as the Z-axis direction.

  The printing stage 13 holds the substrate P and positions it from the lower side with respect to the mask sheet 35 to be described later, and is mainly composed of a main conveyor 12B, a lifting table 28, a clamp mechanism 14 and the like which will be described later. .

  The printing stage 13 is supported by a four-axis unit 20 and is moved to the X axis, the Y axis, the Z axis, and the R axis (rotation about the Z axis) by the operation of the unit 20.

  More specifically, a rail 21 is disposed on the base 11 along the Y-axis direction in a horizontal plane, and a Y-axis table 22 is slidably attached to the rail 21. A ball screw mechanism (not shown) provided on the base 11 is connected to the Y-axis table 22, and the Y-axis table 22 is moved in the Y-axis direction with respect to the base 11 by driving the ball screw mechanism. Is configured to move.

  A rail 23 is disposed on the Y-axis table 22 along the X-axis direction, and an X-axis table 24 is slidably attached to the rail 23. A ball screw mechanism (not shown) provided on the Y-axis table 22 is connected to the X-axis table 24, and the X-axis table 24 is driven with respect to the Y-axis table 22 by driving the ball screw mechanism. Configured to move in the direction.

  The X-axis table 24 is provided with an R-axis table 26 so as to be rotatable about an axis in the Z-axis direction. The R-axis table 26 is rotated around the Z-axis with respect to the X-axis table 24 by driving means (not shown). It is designed to rotate.

  A slide column 27 is slidably attached to the R-axis table 26 along the vertical direction (Z-axis direction), and an elevation table 28 is attached to the upper portion of the slide column 27. A ball screw mechanism 29 is provided between the elevating table 28 and the R-axis table 26. The elevating table 28 is guided to the R-axis table 26 while being guided by the slide column 27 by driving the ball screw mechanism 29. It is configured to move in the Z-axis direction (vertical direction).

  Thus, the 4-axis unit 20 moves the printing stage 13 to the X axis, Y axis, Z axis, and R axis (rotation around the Z axis) by individually driving the tables 22, 24, 26, and 28. It is configured to let you.

  On the lifting table 28, a pair of main conveyors 12B are provided along the X-axis direction, and a clamp mechanism 14 and a mounting table 30 are provided. As described above, the printing stage 13 for holding the substrate P is constituted by the lifting table 28, the main conveyor 12B, and the like.

  The main conveyor 12B moves integrally with the lifting / lowering table 28, and the lifting / lowering table 28 is at a predetermined home position (a lower end position and predetermined in the X-axis, Y-axis, and R-axis directions). In the state set at the origin position), the upstream conveyor 12A and the downstream conveyor 12C are arranged in the X-axis direction. Then, when the elevating table 28 is set to the home position in this way, the substrate P is transferred from the upstream conveyor 12A to the printing stage 13 (main conveyor 12B), and the substrate P is transferred from the printing stage 13 to the downstream conveyor 12C. Is being carried out.

  The clamp mechanism 14 holds the substrate P in a fixed manner during the operation, and has a pair of clamp pieces 14a that can contact and separate in the Y-axis direction. The clamp pieces 14a sandwich the substrate P from both sides in the Y-axis direction. It is comprised so that it may fix.

  The mounting table 30 supports the substrate P by lifting the substrate P on the main conveyor 12B from the lower side thereof. The mounting table 30 is supported by the slide column 31 so as to be able to move up and down on the lifting table 28. Therefore, it is configured to move in the Z-axis direction (vertical direction) with respect to the lifting table 28.

  On the other hand, a mask holding unit 16, a squeegee unit 17, an imaging unit 18 and the like are disposed above the printing stage 13 and the like.

  The mask holding unit 16 detachably holds the printing mask sheet 35, and is configured to hold the mask sheet 35 horizontally stretched above the printing stage 13 by a mask clamp (not shown). Has been.

  The squeegee unit 17 expands while rolling (kneading) paste such as cream solder or conductive paste supplied onto the mask sheet 35 from a nozzle (not shown) on the mask sheet 35. The squeegee unit 17 includes a pair of squeegees 33, 33 and an elevating mechanism that individually raises and lowers the squeegees 33, 33, and is configured to be integrally movable in the Y-axis direction by a drive mechanism (not shown). Yes. During printing, the paste is expanded on the mask sheet 35 by sliding these squeegees 33 and 33 along the surface of the mask sheet 35 alternately while reciprocating in the Y-axis direction. .

  The imaging unit 18 is for imaging the substrate P and the mask sheet 35 and is provided below the mask holding unit 16. The imaging unit 18 includes a camera head 38 integrally provided with a mask recognition camera 36 provided upward for imaging the mask sheet 35 and a substrate recognition camera 37 provided downward for imaging the substrate P, and the camera. And a driving mechanism for moving the head 38. The mask head 35 and the substrate P are imaged by moving the camera head 38 in a plane in the X-axis direction and the Y-axis direction. Each of the cameras 36 and 37 is composed of a CCD camera or the like equipped with an illumination device, and is assembled to the camera head 38 in a vertically symmetrical positional relationship so that the optical axes are arranged coaxially. An object at the same coordinate position on the -Y coordinate plane can be imaged simultaneously in the vertical direction.

  With the above configuration, in the printing apparatus 2, the substrate P carried into the printing stage 13 is loaded from the lower side with respect to the mask sheet 35 by driving the four-axis unit 20, and the squeegee unit 17 is driven in this state. By doing so, printing is performed through the printing opening 35a (see FIG. 7B) of the mask sheet 35 while expanding the paste. After printing, the substrate P is pulled away from the mask sheet 35 by driving the four-axis unit 20, and the printed state is inspected by imaging the substrate P with the substrate recognition camera 37 in this state. It is supposed to be carried out. Detailed printing operations and the like will be described in detail later.

  4 and 5 schematically show the configuration of the first surface mounter 3 in plan views.

  As shown in the figure, a conveyor 52 extending in the X-axis direction is disposed on the base 51 of the first surface mounting machine 3, and the substrate P is transported to the conveyor 52 to receive a predetermined mounting work position (the position shown in the figure). ) Is stopped. Although not shown, a positioning mechanism for the board P is provided at the mounting work position. When the board P is loaded along the conveyor 52, the positioning mechanism is activated to bring the board P to the mounting work position. It is comprised so that positioning may be fixed.

  Component supply units 54 are arranged on both sides of the conveyor 52, and multiple rows of tape feeders 54a capable of supplying small chip components such as ICs, transistors, and capacitors are arranged in these component supply units 54. Yes.

  Above the base 51, a component mounting head unit 56 is provided. The head unit 56 is movable over the component supply unit 54 and the substrate P at the mounting work position, and can move in the X-axis direction and the Y-axis direction.

  That is, a fixed rail 57 in the Y-axis direction and a ball screw shaft 58 that is rotationally driven by a Y-axis servomotor 59 are disposed on the base 51, and a support member for the head unit 56 is disposed on the fixed rail 57. 61 is disposed, and a nut portion 62 provided on the support member 61 is screwed onto the ball screw shaft 58. The support member 61 is provided with a guide member 63 in the X-axis direction and a ball screw shaft 64 driven by an X-axis servo motor 65, and the head unit 56 is held movably on the guide member 63. A nut portion (not shown) provided on the head unit 56 is screwed onto the ball screw shaft 64. The support member 61 is moved in the Y-axis direction by the operation of the Y-axis servo motor 59, and the head unit 56 is moved in the X-axis direction with respect to the support member 61 by the operation of the X-axis servo motor 65. ing.

  A plurality of mounting heads 66 for component mounting are mounted on the head unit 56, and in this embodiment, six mounting heads 66 are mounted in a line at equal intervals in the X-axis direction. . Each mounting head 66 can move in the Z-axis direction and rotate around the R-axis (nozzle center axis) with respect to the frame of the head unit 56, and is driven by a lift drive mechanism and a rotation drive mechanism (not shown). It is like that. Each mounting head 66 has a nozzle 66a attached to the tip (lower end) of the mounting head 66, and negative pressure is supplied to the tip of the nozzle 66a from a negative pressure supply means (not shown) so as to suck and hold the components. It has become.

  A substrate recognition camera 67 is further mounted on the head unit 56. The substrate recognition camera 67 is composed of a CCD camera or the like equipped with an illumination device, and images various marks on the substrate P positioned at the mounting work position as the head unit 56 moves. .

  A component recognition camera 68 is disposed on the base 51. Similarly to the board recognition camera 67, the component recognition camera 68 is also composed of a CCD camera or the like equipped with an illuminating device, and picks up the parts adsorbed by the mounting heads 66 of the head unit 56 from below. It is supposed to be.

  With the configuration as described above, in the first surface mounter 3, the component unit is supplied by each mounting head 66 while the head unit 56 moves between the component supply unit 54 and the substrate P positioned at the mounting operation position. A component is sucked from the portion, and the sucked component is transported and mounted on the substrate P. Detailed mounting operation will be described later.

  The above is the configuration of the first surface mounter 3, but the second surface mounter 4 and the third surface mounter 5 are also configured in substantially the same manner as the first surface mounter 3.

  On the other hand, although illustration is omitted about the reflow furnace 6, for example, it has a conveyer and a hot air blower for board transportation, and heats the board P after component mounting to cure the solder and the like. The component is configured to be fixed on the substrate P.

  Next, the control system of the printing apparatus 2 and the surface mounters 3 to 5 will be described with reference to FIG.

  This figure shows only the functional components related to the present invention among the functional configurations of the printing device 2 and the control devices 2A to 5A of the surface mounters 3 to 5 in a block diagram. The functional configurations of the control devices 2A to 5A are basically the same. Therefore, in the following description, both functional configurations will be described with reference to the same drawing in order to avoid redundant description, and particularly distinguished from each other. When it is necessary to do so, the functional configuration of the surface mounters 3 to 5 is distinguished by using a symbol with a dash (').

  Each of the control devices 2A to 5A shown in the figure includes a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU in advance, and a RAM that temporarily stores various data during a printing operation. It comprises an HDD or the like for storing various data and software, and includes a main control means 71, a program storage means 72, various data storage means 73, an image processing means 74, and a data communication means 75 as its functional configuration. . The control device 2 </ b> A of the printing device 2 further includes area data creation means 76.

  The main control means 71 comprehensively controls the drive of each device so as to proceed with a series of work (printing work or component mounting work) according to the program stored in the program storage means 72, and various kinds of operations accompanying the work. Performs arithmetic processing.

  As will be described in detail later, the main control means 71 of the printing apparatus 2 determines the presence / absence of a bat mark formed on the multi-sided substrate based on the image data of the substrate recognition camera 37, the area where the mark is formed, and the like. Recognize (specify), and if there is a printing defect, the area to which the defect corresponds is specified. In this embodiment, the main control unit 71 functions as the specifying unit according to the present invention.

  The program storage means 72 stores various programs relating to printing or mounting as described above.

  The various data storage means 73 stores various data necessary for work in the printing apparatus 2 and the surface mounters 3 to 5. For example, various data storage means 73 of the printing apparatus 2 stores mask-related data (coordinate position data of each printing opening 35a of the mask sheet 35, the same shape data, coordinate position data of various marks formed on the mask sheet 35, On the other hand, the various data storage means 73 'of the surface mounters 3 to 5 store component related data (part type, shape, dimensions, etc.) and board related data (board type). , Component mounting position data, mounting area data, coordinate position data of various marks formed on the board, shape data, etc.) are stored.

  The image processing means 74 performs predetermined image processing on the image data output from each camera. The main control means 71 recognizes the object based on the image data, and performs various determinations based on the recognition. Perform calculations and so on.

  The data communication means 75 performs communication control, and when necessary, various information can be transmitted between the server 9, the printing apparatus 2, and the surface mounters 3 to 5 via the data communication means 75. To be done. Specifically, when the substrate P to be processed is a multi-planar substrate described later, the component-related data and the substrate-related data are transferred from the surface mounters 3-5 to the printing apparatus 2 via the data communication means 75, 75 '. Is transmitted, and data relating to a defective area to be described later is transmitted from the printing apparatus 2 to the surface mounters 3 to 5. That is, these data communication means 75 and 75 'correspond to the transmission means and the reception means according to the present invention.

  The area data creation means 76 is a unique functional configuration provided only in the control device 2A of the printing apparatus 2 as described above. The area data creation means 76 includes mask-related data stored in various data storage means 73 and components transmitted from the surface mounters 3 to 5 through the LAN 8 when the substrate to be processed P is a multi-sided board. Based on the substrate-related data, data (referred to as area data) for associating each printing opening 35a of the mask sheet 35 with each area of the substrate P is created.

  Here, the outline of the area data creation method by the area data creation means 76 will be described together with the configuration of the multi-sided substrate and the configuration of the mask sheet 35 corresponding thereto.

  FIG. 7A schematically shows an example of a so-called multi-planar substrate P, and FIG. 7B schematically shows a mask sheet 35 corresponding to the substrate P.

  The multi-sided board P includes, for example, a plurality of areas (six areas E1 to E6 in the illustrated example) where the same circuit is formed, and paste printing and component mounting processing are performed as a single board. Thereafter, each of the areas E1 to E6 is separated and used individually. A pair of fiducial marks M1 (referred to as FID marks M1) for recognizing the position is formed on the substrate P, and each area E1 to E6 has a mounting accuracy by the surface mounters 3 to 5. Fiducial marks M2 (referred to as FID marks M2) for increasing are individually formed. Further, for areas E1 to E6 that have severe defects that cannot be mounted due to circuit damage or the like, the surface mounters 3 to 5 have a bat mark M3 for determining the area and omitting the mounting process. It is formed at a specific position in each of the areas E1 to E6. The bat mark M3 is formed only in the areas E1 to E6 having a defect. However, for convenience of explanation, the bat mark M3 is shown in which all the areas E1 to E6 are formed.

  On the other hand, the mask sheet 35 has printing openings 35a corresponding to the pattern of the multi-planar substrate P, that is, the printing positions (the white portions of the areas E1 to E6 shown in FIG. 7A), as shown in FIG. Is formed. A fiducial mark Ma (FID mark Ma) for position recognition is formed at the corner of the lower surface of the mask sheet 35 (the surface facing the substrate P fixed to the printing stage 13).

  The area data creation means 76 creates the area data based on the mask related data stored in the various data storage means 73 as described above and the parts and board related data transmitted from the surface mounters 3 to 5. To do. Specifically, each printing is performed as shown in FIG. 8 based on the coordinate position data and shape (dimension) data of the printing opening 35a of the mask sheet 35 and the component mounting position data and component (shape, dimension) data. The overlapping state of the printing opening 35a and the part C is virtually determined to check for overlapping each other, and based on the result, the coordinate position of the printing opening 35a and the mounting position of the part are associated (linked). That is, since the coordinate position of the printing opening 35a and the mounting position on the substrate P correspond to each other, the relationship between the printing opening 35a and the component mounting position is specified by examining the overlapping state as described above. Can do. After this association, based on the mounting area data included in the board-related data, that is, data defining which area E1 to E6 the component mounting position belongs to, the coordinate position of each printing opening 35a and the area E1 To E6, and this data (area data) is stored.

  That is, in the printing apparatus 2, as will be described in detail later, each printing position is imaged by the substrate recognition camera 37, the printing state is inspected, and the inspection results for each of the areas E1 to E6 are displayed on the surface mounters 3 to 5. However, since the printing apparatus 2 has only the coordinate position data of each printing opening of the mask sheet 35, the printing position on the substrate P is obtained from the coordinate position data of each printing opening 35a of the mask sheet 35. Although it is possible, it cannot be determined which area E1 to E6 each print position on the substrate P is included because it does not have data on the areas E1 to E6. Therefore, by transmitting the substrate-related data from the surface mounters 3 to 5 as described above, based on this data and the mask-related data of the printing apparatus 2, each printing opening 35a and the area E1 of the mask sheet 35 are provided. The area data is created by checking the correspondence with .about.E6.

  Next, the printing operation control of the printing device 2 by the control device 2A and the mounting operation control of the surface mounters 3 to 5 by the control devices 3A to 5A will be described using flowcharts. In the following description, the multi-planar substrate P is described as being processed.

  FIG. 9 is a flowchart showing the printing operation control of the printing apparatus 2 by the control apparatus 2A. When production is started in the printing apparatus 2, first, the upstream conveyor 12A is driven, and the substrate P is carried from the loader 1 onto the printing stage 13 and fixed (step S1). At this time, the printing stage 13 is previously set at the home position (in the four-axis unit 20, the printing stage 13 is at the lower end position and is set at predetermined origin positions in the X-axis, Y-axis, and R-axis directions). It is assumed that it is set to. The substrate P is fixed on the printing stage 13 by first lifting the mounting table 30 to lift the substrate P carried into the main conveyor 12 </ b> B, and positioning the substrate P by the positioning mechanism 15 while clamping the substrate P by the clamping mechanism 14. This is done by sandwiching P.

  Next, the camera head 38 is moved from a predetermined home position outside the printing work area to above the printing stage 13, and the coordinate positions of the marks M1 and M3 on the substrate P are sequentially imaged by the substrate recognition camera 37, whereby the FID mark M1. The bat mark M3 is recognized and the FID mark Ma on the mask sheet 35 is imaged and recognized by the mask recognition camera 36 (step S2). Note that the FID mark Ma of the mask sheet 35 may be recognized only immediately after replacement of the mask sheet 35 due to, for example, a change in the type of the substrate P.

  Then, the recognition result of the bat mark M3, specifically, the presence / absence result data of the bat mark M3 in each of the areas E1 to E6 is transferred to the surface mounters 3 to 5 through the LAN 8 (steps S2 and S3). In this embodiment, the areas E1 to E6 having the bat mark M3 correspond to the defective area according to the present invention, and the presence / absence result data corresponds to the data related to the defective area according to the present invention.

  Next, the camera head 38 is reset to the home position, and the 4-axis unit 20 is operated to raise the substrate P integrally with the printing stage 13, so that the substrate P is loaded on the mask sheet 35 from below. (Step S4). At this time, the main control means 71 obtains a relative positional relationship between the mask sheet 35 and the substrate P based on the recognition result of the marks Ma and M1 in step S2, and drives and controls the 4-axis unit 20 and the like based on this positional relationship. By doing so, the substrate P is positioned with respect to the mask sheet 35.

  In addition, the squeegees 33 and 33 of the squeegee unit 17 are moved to a predetermined printing start position almost simultaneously with the heavy loading operation, and one squeegee 33 is lowered and brought into contact with the surface of the mask sheet 35 to complete the operation. Then, after supplying the solder paste onto the mask sheet 35 by a supply device (not shown), the paste is expanded by moving the squeegee 33 in the Y-axis direction (step S5). As a result, the paste is printed (applied) at a predetermined position of the substrate P through the printing opening 35a of the mask sheet 35.

  When the printing operation on the substrate P is completed, the substrate P is detached from the mask sheet 35 by lowering the printing stage 13 by a small amount, and is quickly reset to the home position (step S6).

  Next, a print inspection by image recognition is performed for each print position on the substrate P (steps S7 and S8). Specifically, the camera head 38 is driven, and each printing position is imaged while the board recognition camera 37 is sequentially moved to each printing position for each of the areas E1 to E6 of the board P. At this time, based on the recognition result of the bat mark M3 in step S2, only the printing positions belonging to the areas E1 to E6 where the bat mark M3 is not recognized are imaged. This is because parts are not mounted in the areas E1 to E6 where the bat mark M3 is recognized, so there is no need for a print inspection.

  Note that, regarding the imaging of the printing position by the substrate recognition camera 37 as described above, the main control means 71 uses the coordinate position data of each printing opening 35a of the mask sheet 35 and the area data created by the area data creating means 76. Based on the above, the camera head 38 is driven and controlled. As described above, the driving position of the camera head 38 is mainly controlled using the data of the mask sheet 35 as described above. The printing position on the substrate P corresponds to the position of each printing opening 35 a of the mask sheet 35. Therefore, it is possible to use the coordinate position data of the printing opening 35a as it is, and it is rational because the data can be shared.

  When the imaging of the print positions belonging to the areas E1 to E6 other than the area where the bat mark M3 is recognized is completed (YES in step S8), the main control means 71 prints the areas E1 to E6 for each area based on the image data. When the pass / fail judgment of the state is performed (step S9), it is determined whether or not all the inspection results are rejected, that is, whether or not there is a printing defect in all the captured areas E1 to E6. Transfers the inspection result data to the surface mounters 3 to 5 through the LAN 8 (step S10). In this embodiment, areas E1 to E6 with printing defects correspond to the defective areas according to the present invention, and the inspection result data corresponds to data related to the defective areas according to the present invention.

  And the fixed state of the board | substrate P of the printing stage 13 is cancelled | released, and conveyor 12B, 12C is driven, and the printing process with respect to a series of board | substrate P is complete | finished by carrying out the board | substrate P from the printing apparatus 2 by this.

  On the other hand, if YES is determined in step S9, that is, if a printing failure is found in all of the imaged areas E1 to E6, the printing apparatus 2 is stopped and the notifying means (not shown) is operated to operate the operator. In response to this, the operator removes the substrate P by manual operation (step S12), and the series of printing processes is completed.

  If some or all of the rejected areas E1 to E6 can be accepted by visual confirmation by the operator, for example, the inspection result is corrected by the operator's manual operation, and then the processing of the substrate P is continued. You may make it do. In this case, the corrected inspection result data may be transferred to the surface mounters 3-5.

  FIG. 10 is a flowchart showing the mounting operation control of the first surface mounter 3 by the control device 3A. When production is started in the first surface mounting machine 3, the conveyor 52 is driven, and the board P subjected to the printing process by the printing apparatus 2 is carried into the apparatus and positioned at the mounting work position. Then, the head unit 56 is driven, and the substrate recognition camera 67 images and recognizes the FID marks M1 and M2 on the substrate P, whereby the positional deviation of the substrate P is obtained and the correction data is obtained from the main control means 71 '. (Steps S21 and S22). At this time, imaging and recognition of the bat mark M3 are not performed.

  When the recognition of the FID marks M1 and M2 is completed, the presence / absence result data of the bat mark M3 and the inspection result data relating to the board P transferred from the printing apparatus 2 through the LAN 8 are read into the main control means 71 ′. The component mounting process is executed according to the processes in steps S23 to S27. That is, components should be mounted only in the areas E1 to E6 where the bat mark M3 is not recognized among the areas E1 to E6 of the substrate P and which have passed the printing inspection (referred to as effective areas). The head unit 56 and the like are driven and controlled by the main control means 71 '.

  First, the head unit 56 is moved to the component supply unit 54, and components are taken out by the mounting heads 66 (step S23). Specifically, the head unit 56 is moved above the component supply unit 54, and a predetermined mounting head 66 on which the component is to be sucked is moved up and down to pick up the component while being picked up from the tape feeder 54a. At this time, if possible, the components are picked up simultaneously by a plurality of mounting heads 66.

  When the suction of the components by all the mounting heads 66 is completed, the head unit 56 is moved above the component recognition camera 68 to image the suction components by the mounting heads 66. The suction state is recognized (step S24).

  Then, after moving the head unit 56 onto the substrate P and disposing it above the first component mounting position, the suction component is mounted on the substrate P by moving the mounting head 66 up and down (step S25). When the first component is mounted in this way, each suction component is sequentially mounted on the substrate P by moving the head unit 56 to the next mounting position. At this time, the component is accurately mounted at each mounting position by correcting the target movement position of the head unit 56 based on the recognition result in step S24.

  When the mounting of the suction parts by the respective mounting heads 66 is completed in this way, it is determined whether or not all the parts have been mounted, that is, whether or not all the parts have been mounted in the effective areas E1 to E6 (step S26). If NO is determined here, the process returns to step S23, the head unit 56 is moved to the component supply unit 54, and the respective processes of component suction, component recognition, and component mounting are repeatedly executed.

  On the other hand, if YES is determined in step S26, the conveyor 52 is driven to carry the substrate P out of the apparatus (step S27), thereby completing a series of mounting processes on the substrate P.

  The above is an example of the mounting operation control of the first surface mounter 3 by the control device 3A, but the mounting operation control of the second surface mounter 4 and the third surface mounter 5 by the control devices 4A and 5A is the same. Done.

  As described above, in this component mounting system, the surface mounter is arranged on the downstream side after first performing a printing process for printing paste on the board P in the printing apparatus 2 while conveying the multi-sided board P. 3 to 5, as described above, in this component mounting system, the printing device 2 recognizes in advance the presence or absence of the bat mark M3 on the board P, and the result data is used as a surface mounter. By transferring to 3 to 5, the surface mounting machines 3 to 5 can proceed with the mounting operation without recognizing the bat mark M3. Therefore, the surface mounting machines 3 to 5 perform the bat mark M3 recognition process. The tact time of each of the surface mounters 3 to 5 can be shortened accordingly.

  In particular, compared to the tact time of the surface mounters 3 to 5 that mount a large number of components on the substrate P while reciprocating between the component supply unit 54 and the substrate P many times, the printing process is performed on the entire substrate P at a time. Since the tact time of the printing apparatus 2 that performs the printing is normally shortened, it is possible to rationally reduce the work load of the surface mounters 3 to 5 by placing the image recognition processing of the bat mark M3 on the printing apparatus 2 as described above. The tact time of each surface mounter 3-5 can be shortened. As a result, the tact times of the devices 2 to 6 can be well balanced, and the throughput of the component mounting system can be improved.

  In addition, in this component mounting system, regarding the print inspection of the multi-sided board P in the printing apparatus 2, the pass / fail judgment of the printing state is performed for each of the areas E1 to E6, except when all the areas E1 to E6 are rejected. The board P is treated as an effective one and the inspection result data is transferred to the surface mounters 3 to 5. On the other hand, in the surface mounters 3 to 5, the areas E1 to E1 that have passed the print inspection based on the inspection result data. Since components are mounted on E6, even when printing defects occur in some areas E1 to E6 of the multi-sided board P, the other areas E1 to E6 can be effectively utilized. Therefore, even when a printing failure is found in a part of the area, there is an advantage that the yield can be improved as compared with the conventional system of this type in which the entire substrate is uniformly dropped.

  Further, for the print inspection of the multi-sided board P in the printing apparatus 2, the print inspection is performed only for the printing positions belonging to the areas E1 to E6 where the bat mark M3 is not recognized by using the result of the presence / absence of the bat mark M3. As a result, the minimum print inspection is sufficient and there is no waste. Therefore, there is an advantage that the tact time of the printing apparatus 2 can be effectively shortened.

  The component mounting system described above is an example of a preferred embodiment of the component mounting system according to the present invention (the component mounting system to which the component mounting processing method according to the present invention is applied), and its specific configuration. For example, specific configurations of the printing apparatuses 2 and the surface mounters 3 to 5 can be appropriately changed without departing from the gist of the present invention.

  For example, in the printing apparatus 2 of the embodiment, in the printing operation control, the substrate P is carried into the printing stage 13 and fixed, and then the bat mark M3 is recognized and transferred immediately (step S2 in FIG. 9). , S3), these operations may be performed immediately after the printing process is completed. Specifically, as shown in FIG. 11, printing operation control in which the processing of steps S2 to S6 in the flowchart of FIG. 9 is replaced with steps S2 ′ to S7 ′ may be employed. That is, after carrying in and fixing the substrate P, only the FID marks M1 and Ma are recognized, and then the printing operation is executed (steps S1, S2 'to S5'). Transfer is performed (steps S6'S7 '). In the same figure, the processing order of steps S6'S7 'and steps S7 to S12 may be changed so that the bat mark M3 is recognized before the substrate P is unloaded after the print inspection is completed. . In short, the bat mark M3 may be recognized at an advantageous timing in terms of tact time in relation to the specific configuration of the printing apparatus 2 and the printing operation. However, when the bat mark M3 is recognized after the printing inspection as described above, the recognition result cannot be used in the printing inspection, that is, the printing inspection may be omitted based on the presence or absence of the bat mark M3. Therefore, in order to improve the efficiency of the print inspection, it is preferable to recognize the bat mark M3 before the print inspection.

  In the printing apparatus 2 of the embodiment, this data is transferred by transferring board-related data (coordinate position data of the bat mark M3, component mounting area data, etc.) from the surface mounters 3 to 5 to the printing apparatus 2 via the LAN 8. The bat mark M3 is recognized and the print inspection associated with the areas E1 to E6 is performed based on the above. Of course, the substrate related data is stored in advance in the various data storage means 73 of the printing apparatus 2. It may be.

  In the embodiment, as described above, the area data in which each printing opening 35a of the mask sheet 35 is associated with the areas E1 to E6 is created, and the print inspection is performed based on the area data. Of course, the function of the area data creation means 76 may be omitted by creating in advance data relating the printing positions on the substrate P and the areas E1 to E6 and storing them in the various data storage means 73. Good.

  In the embodiment, the printing apparatus 2 integrally has a print inspection function for inspecting the printing state of the substrate P. In other words, the printing inspection apparatus is integrated in the printing apparatus 2. For example, a dedicated print inspection apparatus having a movable camera may be interposed between the printing apparatus 2 and the first surface mounter 3. In this case, image recognition of the bat mark M3 is performed in the printing inspection apparatus, and the presence / absence result data of the bat mark M3 and the inspection result data of the printing inspection are transferred to the surface mounters 3 to 5 together. Good.

1 is a schematic front view showing an example of a component mounting system according to the present invention (a component mounting system to which a component mounting processing method according to the present invention is applied). It is a side view which shows the screen printing apparatus which comprises a component mounting system. It is a front view which shows a screen printing apparatus. It is a top view which shows the 1st surface mounting machine which comprises a component mounting system. It is a front view which shows a 1st surface mounting machine. It is a block diagram which shows the control system of a screen printing apparatus and a 1st surface mounting machine. (A) is a top view which shows an example of a structure of a multi-sided board | substrate, (b) is a top view which shows the mask sheet corresponding to the multi-sided board | substrate shown to (a). It is a conceptual diagram for demonstrating the creation method of the area data by an area data creation means. It is a flowchart figure which shows an example of the printing operation control in a screen printing apparatus. It is a flowchart figure which shows an example of the mounting operation control in a 1st surface mounting machine. It is a flowchart figure which shows the modification of the printing operation control in a screen printing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Loader 2 Screen printing device 3 1st surface mounting machine 4 2nd surface mounting machine 5 3rd surface mounting machine 6 Reflow furnace 7 Unloader

Claims (7)

Using a component mounting system having at least a surface mounter for mounting components on a board, a method for mounting components on a multi-sided board having a plurality of areas in which independent circuits are formed,
Based on this information, a defective area that does not require a mounting process in each area of the multi-sided board is checked in advance before being brought into the surface mounter, and information on the defective area is transferred to the surface mounter. A component mounting processing method comprising: performing a component mounting process on an area other than a defective area in a surface mounter. In the component mounting processing method according to claim 1,
For the component mounting system that includes a printing device that prints a paste on a substrate and mounts the component on the printed substrate by the surface mounter, the printing device acquires information about the defective area, and this information The component mounting processing method is characterized in that the printer is transferred from the printing apparatus to the surface mounter. In the component mounting processing method according to claim 1 or 2,
For a multi-sided substrate in which a bat mark is formed in advance in a defective area that does not require component mounting in the area, the area in which the bat mark is formed is examined in advance, and the area in which the bat mark is formed is defined as a defective area. A component mounting processing method characterized by transferring information to a surface mounter. In the component mounting processing method according to claim 2,
After the printing process by the printing apparatus, the printing state is inspected, and if a printing defect is detected, an area to which the printing defect belongs is specified among the areas, and the information is displayed on the surface using the specific area as a defective area. A component mounting processing method characterized by transferring to a mounting machine. Component mounting including at least a printing apparatus that prints paste on a multi-sided substrate having a plurality of areas in which circuits that are independent of each other are formed as a substrate to be processed, and a surface mounter that mounts components on the printed substrate A system,
The printing apparatus identifies a defective area that does not require mounting processing among the areas based on a substrate imaging camera that can move relative to the substrate and image data of the substrate captured by the camera. Means and a transmission means for transmitting information on the defective area specified by the specifying means to the surface mounter,
The surface mounter includes a receiving unit that receives information about a defective area transmitted by the transmitting unit, and a component mounting operation for performing a component mounting process on an area other than the defective area based on the received information. A component mounting system comprising a control means for controlling. In the component mounting system according to claim 5,
The multi-sided board is one in which a bat mark is formed in advance in a defective area in which no component is mounted, and the camera sequentially images the coordinate position of the bat mark on the board, and The means determines the presence or absence of a bat mark based on the image data and identifies the area where the bat mark is formed as a defective area. In the component mounting system according to claim 5,
The camera sequentially captures the printing position of the substrate after the printing process, and the specifying unit detects a printing defect based on the image data, and when the printing defect is detected, the printing of the areas is performed. A component mounting system characterized by identifying an area to which a defect belongs as a defective area.

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