JP4896655B2 - Mounting fault cause identification method and mounting board manufacturing apparatus - Google Patents

Description

  The present invention relates to a method for identifying the cause of a mounting failure that occurs in a mounting board manufacturing apparatus and a mounting board manufacturing apparatus.

  Conventionally, while transporting a printed circuit board (PWB), various pastes such as cream solder and conductive paste are first printed by a screen printer, and then components are sequentially mounted at the printing position by a mounting machine. A mounting line (mounting board manufacturing apparatus) for producing (PCB) is generally known.

  In this type of mounting line, when the printed circuit board produced is inspected and a defect such as a component mounting error or non-mounting is detected, the process in which the defect has occurred is identified and countermeasures are taken. Striking is important in manufacturing a printed wiring board with stable quality.

In view of this point, Patent Document 1 provides measurement means after each process, accumulates measurement data obtained by these measurement means, and reads and displays measurement data obtained by each measurement means when a failure occurs. By doing so, a mounting line (method) has been proposed that supports the identification of defective processes. For example, in this mounting line, after the solder printing process, the outer dimensions and the like of the printed solder are measured and the data is accumulated, and after the mounting process, the outer dimensions and the like of the mounted parts are measured and Accumulate data. Thus, when a problem occurs, these data can be displayed in a comparable state so that the cause can be investigated.
JP 2004-235314 A

  However, in the mounting line (method) disclosed in Patent Document 1, the work results of all the processes are measured for each printed circuit board, that is, after the printing process, all locations where solder printing is performed are measured. In addition, after the mounting process, the outer dimensions and the like of all the mounted components are measured without fail, so that much time is spent on the measurement. Therefore, there is a problem that smooth production of the printed wiring board is hindered. In addition, while acquiring enormous measurement data at the expense of printed circuit board productivity, most of the data is not used in consideration of the frequency of occurrence of actual defects, which is wasteful and reasonable. I can't say that.

  The present invention has been made in view of the above circumstances. When a mounting failure occurs in a mounting line (mounting board manufacturing apparatus), the cause can be efficiently solved without losing the productivity of the board as much as possible. The purpose is to enable identification.

In order to solve the above-described problems, the present invention inspects a plurality of working machines that perform work for mounting components on a board in order from the upstream side along the board transfer line, and a mounted board. A method for identifying the cause of a mounting failure in a mounting board manufacturing apparatus that is aligned with an inspection machine, the mounting point on the substrate where the mounting failure is detected by the inspection machine as a target point, and among the plurality of working machines, A working machine that performs work on the target point is a target machine, and after the mounting failure is detected, the target point of the subsequent board carried into the target machine is set to at least one of before and after the work on the target point. captured in time, when it is compared with the master data and corresponding the image data there is a difference between these data, the original work by the target machine of the mounting defect It is obtained so as to identify as (claim 1).

  In this method, the cause of the mounting failure is identified based on the image of the target point on the board where the mounting failure has occurred, but the acquisition of the image is performed only when the mounting failure actually occurs as described above. The work machine that performed the work on the point, that is, the work machine (target machine) that has a high possibility of causing the defect is performed. For this reason, it is possible to efficiently acquire an image that is likely to lead to the identification of the cause of the defect and to identify the cause of the defect without acquiring many images unnecessarily. In the description of the claims, the “point” means a position (place) on the substrate.

In this way, together with the specified as the target area a predetermined region on the substrate including the target point is designated as the target point implementation places other than the target point of the mounting portion included in the target region, said plurality of a working machine for performing work on the focus point of the working machine and attention machine, after the detection of the mounting failure, the target point of the subsequent substrate to be carried into the focused machine, before working with respect to the point of interest and If the captured at least one time after the work, there is a difference between these data is compared with the master data and corresponding the image data, identify the operation by the noted motor as the cause of the mounting failure It is preferable to do this (claim 2).

  That is, when work is performed on a point in the vicinity of the target point (a target point), the work performed on the target point often causes a mounting failure at the target point. For this reason, as described above, acquiring the image of the target point imaged at least one time before and after the work on the target point is effective in identifying the cause of the defect.

Further, only the image of the target point for also conceivable if the cause of a particular difficult, in the above methods, previously to obtain the value of function Waru various parameters on the work with respect to the point (target point or point of interest), the In order to identify the work that causes the mounting failure, it is preferable to check the acquired parameter value in addition to the comparison between the image data and the corresponding master data .

According to this method, the cause of failure can be specified based on a plurality of judgment materials such as the image of the target point and various parameter values, so that the cause of failure can be specified more efficiently and in detail. Note that "the value of the function Waru various parameters in the work" in the description of claims, the pressure at which the working machine is performing work for the target point and focus point (positive pressure, negative pressure), speed, acceleration, angle Or a component size, a component push-in amount, a push-in speed, a component suction pressure, coordinates of the actually mounted component (X-axis, Y-axis, Z-axis, R-axis coordinate), and the like.

  In addition, since there may be a case where there is no reproducibility such as a sudden mounting failure, in the above method, after the mounting failure is detected by the inspection machine, the target points of a predetermined number of subsequent boards are mounted continuously. When no defect is detected, it is preferable to stop the imaging of the target point on the subsequent substrate.

  According to this method, when a mounting defect without reproducibility occurs, it is possible to avoid useless work such as continuously capturing images of subsequent substrates (target points).

As a specific method, for example, when a working machine includes a mounting apparatus for mounting components on a substrate, the target point of the subsequent substrate to be carried into the mounting machine as the target machine, parts for the target point At least one of the captured in time, if it is compared with the master data and corresponding the image data there is a difference between these data, the implementation of the mounting apparatus of the mounting operations before Oyo after beauty identify the work as the cause of the mounting failure (claim 5), also in the case of including a printer for printing various pastes using a mask screen substrate as the working machine, the printing machine as the target machine the target point of the subsequent substrate to be carried, and imaging at least one time after beauty Oyo previous printing operation of the paste with respect to the target point, the image data If the by comparing the master data corresponding thereto there is a difference between these data and the printing operation by the printing machine to identify the cause of the mounting failure (claim 6).

  That is, in the former method, when there is a cause of failure in the component mounting operation, in the latter method, if there is a cause of failure in the paste printing operation, the cause can be specified.

On the other hand, in the mounting board manufacturing apparatus of the present invention, a plurality of working machines for performing work for mounting components on a board and an inspection machine for inspecting mounted boards are arranged in order from the upstream side along the board transfer line. in mounting substrate manufacturing apparatus, wherein mounted on each working machine, imaging means for transmitting the image data by imaging a substrate, means for storing the image data transmitted from the imaging unit, mounted in the inspection machine When a defect is detected, the mounting means based on image data stored in the storage means, command means for giving an imaging command for imaging the point with the defective portion on the substrate as a target point anda cause specifying means for specifying the cause of the working machine that performs work on the subject point of each working machine, after the transmission of the imaging command from the command means, said pair Working before and at least one time after work on point, imaged the target point on the substrate by the imaging means, the cause identifying unit compares the master data and the corresponding image data of the target point , if there is a difference between these data, also the in which that identifies the work of the working machine as the cause of the mounting failure with respect to the target point (claim 7).

According to this apparatus, when a mounting failure is detected in the inspection machine, an imaging command is transmitted from the command means to the work machine in order to capture the target point on the subsequent substrate. When the imaging command is transmitted, the imaging operation of the target point on the subsequent board is performed (added) in the target machine that performs the work of the target point among the respective working machines, and the image data of the target point is compared with the master data on which is, if there is a difference between the data, the work of the target machine Ru is identified as the cause of poor implementation. Na us, imaging command may be transmitted to all of the working machine from the command means, also, it may be transmitted only to the working machine to perform the work of the target point. In this case, in the former case, each work machine determines whether or not the work of the target point is performed in its own process, and the work machine that bears the work of the target point may take an image of the point. .

In this apparatus, when the mounting defect is detected in the inspection machine, further comprising area designation means for supplying the working machine information related to the area as the target area a predetermined region on the substrate including the target point, the The command means gives an imaging command for imaging a point of interest that is a location other than the target point among the mounting locations included in the region of interest, and works on the point of interest among the work devices. working machine to perform after the transmission of the imaging command from the command means, the work front and the at least one time after work on the interest point, imaging the target point on the substrate by the imaging unit, the attribution The means compares the image data of the point of interest with the corresponding master data, and if there is a difference between these data, It is preferred that that identifies the cause of the mounting failure of the work of the working machine for point of interest (Claim 8).

  According to this apparatus, when a mounting failure is detected in the inspection machine, imaging of the target point on the subsequent board is started (added) in the work machine that further performs the work of the point of interest. In other words, when work is performed on a point in the vicinity of the target point (target point), the work performed on the target point often causes mounting failure at the target point, as described above. In addition, the cause of the defect can be identified more easily by acquiring images of the target point before and after the operation of the point of interest within a certain area with respect to the target point.

  Here, in each of the above devices, the imaging command (information on the point of interest) may be transmitted from the command means to all work machines, or the work machine that performs the work of the target point (point of interest). It is also possible to transmit only to this. In this case, in the former case, each work machine determines whether or not the work of the target point (target point) is performed in its own process, and the work machine that performs the work of the target point (target point) captures the target point. Should be done.

Note that the device smell Te, the cause identifying unit, it is preferable to determine the cause of the mounting failure as the master data image data when working properly is performed on the point (claim 9).

Further, in order in the apparatus, further comprising means for acquiring a value of about Waru various parameters to work for the points in each working machine, the cause identifying unit, identifying the tasks that cause the mounting failure, in addition to the comparison of the master data and corresponding said image data, it is preferred that the Ru der performs confirmation of the acquired parameter value (claim 10).

  According to this configuration, it becomes possible to specify the cause of mounting failure in a multifaceted manner based on the image of the target point and various parameter values. Therefore, the cause of the failure can be specified in detail, and the cause of the specified failure cause can be specified. Reliability is also improved.

  Further, in the above-described apparatus, the command unit may issue an imaging stop command when a mounting failure is not detected continuously for the target points of a predetermined number of subsequent boards after the mounting failure is detected by the inspection machine. It is preferable that each work machine is configured to stop imaging of the target point based on transmission of the imaging stop command.

  According to this apparatus, it is possible to avoid that the imaging operation of the subsequent substrate (target point) is continued in vain when a mounting failure without reproducibility occurs.

In the above device, said each working machine and the test machine separately, it is preferred to have a mounting failure analysis apparatus provided with the storage means and the attribution hand stage (claim 12).

  According to this apparatus, it is possible to comprehensively manage image data from each working machine, various programs for identifying the cause of failure, and the like.

  According to the mounting failure cause identification method and the mounting board manufacturing apparatus according to the present invention, a working machine (target machine) that has worked on the point only when a mounting failure actually occurs, that is, the cause of the failure. Since the image of the succeeding board is acquired with a work machine that is likely to become, and the cause of the defect is specified based on the image, it is possible to efficiently acquire an image that is likely to lead to the determination of the cause of the defect. The cause of the defect can be identified. Therefore, the cause of the defect can be efficiently identified without losing the productivity of the substrate as much as possible.

  A preferred embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic front view of a mounting line (mounting line to which the cause of mounting failure according to the present invention is applied) which is a mounting board manufacturing apparatus according to the present invention. As shown in the figure, this mounting line includes a loader 1, a screen printing machine 2, a first mounting machine 3, a second mounting machine 4, a third mounting machine 5, an inspection machine 6, and a reflow furnace in this order from the upstream side. 7 and the unloader 8 are arranged side by side, and each process of paste printing, component mounting (mounting), and paste curing is sequentially performed while a printed board (hereinafter simply referred to as a board) fed out from the loader 1 is sequentially conveyed. It is configured to be applied to the substrate and carried out to the unloader 8. In this mounting line, the screen printing machine 2 and the mounting machines 3 to 5 correspond to the working machine according to the present invention.

  Each of the devices 1 to 8 constituting the mounting line is an autonomous device provided with control devices 1A to 8A each constituted by a personal computer or the like, and each of the devices 1 to 8 is driven by its own control device 1A. It is controlled individually by ~ 8A. Further, the control devices 1A to 8A are connected to each other through communication means, and by performing transmission and reception of various signals between the control devices 1A to 8A, the operation described in detail later as the entire mounting line is performed. Configured to be done.

  In the figure, reference numeral 9 denotes an overall control device that is connected to the respective control devices 1A to 8A via communication means and comprehensively monitors the operation of the entire mounting line, and is constituted by a personal computer or the like. . Reference numerals 2B to 6B and 9B denote monitors mounted on the screen printing machine 2, the mounting machines 3 to 5, the inspection machine 6, and the overall control device 9, respectively, so that the operation status and various settings are displayed. It has become.

  2 and 3 schematically show a screen printing machine 2 (hereinafter abbreviated as a printing machine 2) applied to this mounting line. FIG. 2 is a side view of the main part with the cover removed, and FIG. 3 shows the printing machine 2 in a front view.

  As shown in these drawings, a printing stage 13 is provided on the base 11 of the printing machine 2. An upstream conveyor 12A and a downstream side for loading and unloading a printed board P (hereinafter abbreviated as board P) onto the printing stage 13 on both sides of the printing stage 13 (left and right sides in FIG. 3) along the mounting line. A side conveyor 12C is arranged. In the following description, the conveyance direction of the substrate P by the conveyors 12A and 12C (that is, the same as the arrangement direction of the devices 1 to 8) is the X-axis direction, and the direction perpendicular to the horizontal plane is the Y-axis direction, X The description will proceed with the direction orthogonal to both the axis and the Y-axis direction as the Z-axis direction.

  The printing stage 13 holds the substrate P and positions it from the lower side with respect to the mask sheet 35 to be described later, and is mainly composed of a main conveyor 12B, a lifting table 28, a clamp mechanism 14 and the like which will be described later. .

  The printing stage 13 is supported by a four-axis unit 20 and is moved to the X axis, the Y axis, the Z axis, and the R axis (rotation about the Z axis) by the operation of the unit 20.

  More specifically, a rail 21 is disposed on the base 11 along the Y-axis direction in a horizontal plane, and a Y-axis table 22 is slidably attached to the rail 21. A ball screw mechanism (not shown) provided on the base 11 is connected to the Y-axis table 22, and the Y-axis table 22 is moved in the Y-axis direction with respect to the base 11 by driving the ball screw mechanism. Is configured to move.

  A rail 23 is disposed on the Y-axis table 22 along the X-axis direction, and an X-axis table 24 is slidably attached to the rail 23. A ball screw mechanism (not shown) provided on the Y-axis table 22 is connected to the X-axis table 24, and the X-axis table 24 is driven with respect to the Y-axis table 22 by driving the ball screw mechanism. Configured to move in the direction.

  The X-axis table 24 is provided with an R-axis table 26 so as to be rotatable about an axis in the Z-axis direction. The R-axis table 26 is rotated around the Z-axis with respect to the X-axis table 24 by driving means (not shown). It is designed to rotate.

  A slide column 27 is slidably attached to the R-axis table 26 along the vertical direction (Z-axis direction), and an elevation table 28 is attached to the upper portion of the slide column 27. A ball screw mechanism 29 is provided between the elevating table 28 and the R-axis table 26. The elevating table 28 is guided to the R-axis table 26 while being guided by the slide column 27 by driving the ball screw mechanism 29. It is configured to move in the Z-axis direction (vertical direction).

  Thus, the 4-axis unit 20 moves the printing stage 13 to the X axis, Y axis, Z axis, and R axis (rotation around the Z axis) by individually driving the tables 22, 24, 26, and 28. It is configured to let you.

  On the lifting table 28, a pair of main conveyors 12B are provided along the X-axis direction, and a clamp mechanism 14 and a mounting table 30 are provided. As described above, the printing stage 13 for holding the substrate P is constituted by the lifting table 28, the main conveyor 12B, and the like.

  The main conveyor 12B moves integrally with the lifting / lowering table 28, and the lifting / lowering table 28 is a predetermined home position (a predetermined position in the X-axis, Y-axis, and R-axis directions). In the state set to the upstream conveyor 12A and the downstream conveyor 12C, they are arranged in the X-axis direction. Then, when the elevating table 28 is set to the home position in this way, the substrate P is transferred from the upstream conveyor 12A to the printing stage 13 (main conveyor 12B), and the substrate P is transferred from the printing stage 13 to the downstream conveyor 12C. Is being carried out.

  The clamp mechanism 14 holds the substrate P in a fixed manner during the operation, and has a pair of clamp pieces 14a that can contact and separate in the Y-axis direction. The clamp pieces 14a sandwich the substrate P from both sides in the Y-axis direction. It is comprised so that it may fix.

  The mounting table 30 supports the substrate P by lifting the substrate P on the main conveyor 12B from the lower side thereof. The mounting table 30 is supported by the slide column 31 so as to be able to move up and down on the lifting table 28. Therefore, it is configured to move in the Z-axis direction (vertical direction) with respect to the lifting table 28.

  On the other hand, a mask holding unit 16, a squeegee unit 17, an imaging unit 18 and the like are disposed above the printing stage 13 and the like.

  The mask holding unit 16 holds the printing mask sheet 35 in a detachable manner. The mask holding unit 16 is configured to hold the mask sheet 35 horizontally stretched above the printing stage 13 by a mask clamp (not shown).

  The squeegee unit 17 expands various pastes such as cream solder and conductive paste supplied on the mask sheet 35 while rolling (kneading) them on the mask sheet 35. The squeegee unit 17 includes a pair of squeegees 33, 33 and an elevating mechanism that individually raises and lowers the squeegees 33, 33, and is configured to be integrally movable in the Y-axis direction by a drive mechanism (not shown). Yes. During printing, the paste is expanded on the mask sheet 35 by sliding these squeegees 33 and 33 along the surface of the mask sheet 35 alternately while reciprocating in the Y-axis direction. .

  The imaging unit 18 is for imaging the substrate P and the mask sheet 35 and is provided below the mask holding unit 16. This imaging unit 18 is integrated with a mask recognition camera 36 provided upward to image the mask sheet 35 and a substrate recognition camera 37 (corresponding to the imaging means according to the present invention) provided downward to image the substrate P. And a driving mechanism for moving the camera head 38. The mask head 35 and the substrate are moved by moving the camera head 38 in a plane in the X-axis direction and the Y-axis direction. It is configured to image P.

  With the above configuration, the printing machine 2 proceeds with the paste printing operation in the following manner in accordance with the program stored in advance based on the control by the control device 2A.

  First, in a state where the printing stage 13 is set in the home position in advance, the substrate P is loaded onto the stage 13 and positioned by the clamp mechanism 14. When this positioning is completed, the camera head 38 is driven to enter between the mask sheet 35 and the substrate P, the mark not shown in the figure of the mask sheet 35 is imaged by the mask recognition camera 36, and the substrate P is captured by the substrate recognition camera 37. The mark outside the upper figure is imaged. That is, the positional relationship between the mask sheet 35 and the substrate P is examined. Then, the 4-axis unit 20 is driven and controlled based on this positional relationship, so that the substrate P is mounted on the mask sheet 35 from below.

  When the loading of the substrate P onto the mask sheet 35 is completed, the squeegee unit 17 is driven, and the paste supplied onto the mask sheet 35 is expanded by the squeegee 33. As a result, the paste is printed on the substrate P through a printing opening (not shown).

  After printing, the printing stage 13 is reset to the home position by the operation of the 4-axis unit 20, and the substrate P is separated from the mask sheet 35 with this resetting operation (referred to as a release operation). Then, after the positioning by the clamp mechanism 14 is released, the conveyors 12B and 12C are driven, whereby the substrate P is carried out to the first mounting machine 3.

  4 and 5 schematically show the first mounting machine 3 applied to the mounting line. FIG. 4 is a plan view with the cover removed, and FIG. 5 is a front view showing the first mounting machine 3.

  As shown in the figure, a conveyor 52 extending in the X-axis direction is arranged on the base 51 of the first mounting machine 3, and the substrate P is transferred to the conveyor 52 to be a predetermined mounting work position (the position shown in the figure). And is positioned by a positioning mechanism (not shown).

  Component supply units 54 are arranged on both sides of the conveyor 52, and multiple rows of tape feeders 54a capable of supplying small chip components such as ICs, transistors, and capacitors are arranged in these component supply units 54. Yes.

  Above the base 51, a component mounting head unit 56 is provided. The head unit 56 is movable over the component supply unit 54 and the substrate P at the mounting work position, and can move in the X-axis direction and the Y-axis direction.

  Specifically, a fixed rail 57 in the Y-axis direction and a ball screw shaft 58 that is rotationally driven by a Y-axis servomotor 59 are disposed on the base 51. A support member 61 of the head unit 56 is disposed on the fixed rail 57, and the ball screw shaft 58 is screwed into a nut portion 62 provided on the support member 61. The support member 61 is provided with a guide member 63 in the X-axis direction and a ball screw shaft 64 driven by an X-axis servomotor 65. The head unit 56 is movably held by the guide member 63, and the ball screw shaft 64 is screwed into a nut portion (not shown) provided in the head unit 56. That is, when the Y-axis servo motor 59 is operated, the support member 61 is moved in the Y-axis direction, and when the X-axis servo motor 65 is operated, the head unit 56 is moved with respect to the support member 61 in the X-axis direction. Yes.

  A plurality of mounting heads 66 for mounting components are mounted on the head unit 56, and in the illustrated example, six mounting heads 66 are mounted in a line at equal intervals in the X-axis direction. Yes. Each mounting head 66 can move in the Z-axis direction and rotate around the R-axis (nozzle center axis) with respect to the frame of the head unit 56, and is driven by a lift drive mechanism and a rotation drive mechanism (not shown). It is like that. Each mounting head 66 has a nozzle 66a attached to the tip (lower end) of the mounting head 66, and negative pressure is supplied to the tip of the nozzle 66a from a negative pressure supply means (not shown) so as to suck and hold the components. It has become.

  The head unit 56 is further equipped with a substrate recognition camera 67 (imaging means according to the present invention). The substrate recognition camera 67 is composed of a CCD camera or the like equipped with an illumination device, and images various marks on the substrate P positioned at the mounting work position as the head unit 56 is moved. Thus, a predetermined mounting location (point) on the substrate P is imaged.

  A component recognition camera 68 is disposed on the base 51. Similarly to the board recognition camera 67, the component recognition camera 68 is also composed of a CCD camera or the like equipped with an illuminating device, and picks up the parts adsorbed by the mounting heads 66 of the head unit 56 from below. It is supposed to be.

  With the above configuration, in the first mounting machine 3, the component mounting operation proceeds as follows in accordance with a program stored in advance based on the control by the control device 3A.

  First, by driving the conveyor 52, the board P is carried into the mounting work position and positioned. When this positioning is completed, the head unit 56 is placed on the substrate P, and a mark (not shown) on the substrate P is imaged by the substrate recognition camera 67. That is, the positional relationship between the head unit 56 (each mounting head 66) and the substrate P is examined.

  Next, the components are picked up (sucked) by the head unit 56. Specifically, the head unit 56 is arranged above the component supply unit 54, and a predetermined mounting head 66 that is to suck the component is driven up and down, whereby the component is taken out from the tape feeder 54a. When the suction of the components by all the mounting heads 66 is completed, the head unit 56 is arranged above the component recognition camera 68 to perform image recognition of the suction components, and then the head unit 56 is placed on the substrate P. Each component is arranged and mounted on the substrate P. Specifically, the components are mounted on the substrate P by moving the mounting head 66 up and down while sequentially placing the head units 56 at the mounting positions.

  Thus, when a predetermined number of components are mounted on the substrate P while the head unit 56 moves back and forth between the component supply unit 54 and the substrate P, the positioning of the substrate P is released and then the conveyor 52 is driven. The board P is carried out to the second mounting machine 4.

  In addition, although description is abbreviate | omitted about the structure of the 2nd mounting machine 4 and the 3rd mounting machine 5, and mounting operation | movement of these mounting machines 4 and 5 based on control of control apparatus 4A and 5A, The configuration and mounting operation are also basically the same as the configuration and mounting operation of the first mounting machine 3.

  Although the detailed view is not shown about the inspection machine 6 and the reflow furnace 7, it is comprised as follows, for example.

  First, the inspection machine 6 has a configuration similar to the mounting machines 3 to 5. That is, the apparatus includes a conveyor for transporting the substrate P and positioning it at a predetermined inspection work position, a movable head disposed above the conveyor, and a substrate recognition camera mounted on the head. 3 A mounting position (mounting point) of each component of the substrate P conveyed from the mounting machine 5 is imaged by a substrate recognition camera, and based on the image, whether or not the mounting state is good, for example, the presence or absence of components, component mounting deviation, Inspect for damage, etc.

  On the other hand, the reflow furnace 7 has, for example, a conveyor for conveying the board, a hot air blower, and the like, and heats the substrate P after mounting the components to cure the solder and the like so that the components are placed on the substrate P. It is configured to be fixed.

  In the mounting line as described above, after the paste is printed by the printing machine 2 on the substrate P fed out from the loader 1, the components are mounted by the first to third mounting machines 3-5 ( After that, the mounting state of the component is inspected by the inspection machine 6. If a mounting failure of the component is detected in this inspection, the upstream machine, that is, the printing machine 2 and each of the mounting machines 3 to 3 are detected. 5, data for specifying the cause of failure is obtained, and the cause of failure is specified in the overall control device 9 based on the data.

  FIG. 6 is a flowchart showing the flow of processing for identifying the cause of failure in this mounting line. As shown in the figure, during the operation of the mounting line, the presence or absence of mounting defects (NG parts) is checked based on the inspection result of the inspection machine 6 (step S1). The data acquisition command signal is transmitted from the control device 6A) to the printing press 2 and the mounting machines 3 to 5 (each control device 2A to 5A) (step S3).

  The data acquisition command signal is a signal for imaging the board P and transmitting the image data to the overall control device 9 (that is, corresponding to the imaging command according to the present invention). Among the mounting points, information specifying a point where mounting failure has occurred (hereinafter referred to as a target point) and a certain area centered on the target point (hereinafter referred to as a target area) is included. That is, in this mounting line, the inspection machine 6 (the control device 6A) corresponds to the command means according to the present invention. In this embodiment, the region of interest is a circular region having a preset radius and is set with the target point as the center (see symbol E in FIG. 9B). In addition to the circular region, a region such as a rectangle or an ellipse may be used.

  When the data acquisition command signal is transmitted, the necessary program is changed in the printing machine 2 and the mounting machines 3 to 5 (step S5), and the image of the board P for specifying the cause of the defect is determined by this program change. The operation is executed, and the image data is transmitted to and stored in the overall control device 9. The specific contents of this program change will be described in detail later.

Based on the image data acquired in this way, the overall control device 9, for example, for each image data, the data and master data, that is, image data in a state where the paste is properly applied by the printing machine 2, or the mounting machines 3 to 5. the component compares the image data in a state of being properly implemented to detect the differences identifying the cause of failure based on the difference (step S7). That is, in this mounting line, the overall control device 9 corresponds to an analysis device provided with storage means and cause identification means according to the present invention.

  When the cause of failure is specified by the overall control device 9 (YES in step S9), the cause of failure is displayed on the monitor 9B and notified to the operator, and the printing press 2 causing the failure from the overall control device 9 is displayed. Alternatively, an error stop signal is transmitted to the mounting machines 3 to 5, thereby stopping the device in error (step S11).

  If NO is determined in step S9, it is checked whether the mounting failure generated in step S1 is reproducible for the subsequent substrate P of the same product type, that is, whether the mounting failure is continuously generated for the target point. Specifically, it is determined whether or not a mounting defect has not occurred for a predetermined number or more of the preset number of boards P. If YES is determined here, the inspection machine 6 to the printing machine 2 and the mounting machines 3 to 5 are determined. A data acquisition stop command signal (corresponding to the image pickup stop command according to the present invention) is transmitted to.

  When the data acquisition stop command signal is transmitted, the program is returned to the original in the printing machine 2 and the mounting machines 3 to 5 (step S15), and the operation of acquiring the image data for specifying the cause of the failure is stopped. That is, since there is a mounting failure that occurs suddenly, the image data acquisition operation is stopped when the same mounting failure does not occur for the specified number of substrates P or more.

  FIGS. 7 and 8 are subroutines of the flowchart shown in FIG. 6. FIG. 7 shows the process of step S5 of the printing machine 2, and FIG. 8 shows the process of step S5 of the mounting machines 3-5.

  When a data acquisition command signal is transmitted from the inspection machine 6 to the printing machine 2, as shown in FIG. 7, the printing machine 2 (the control device 2A) immediately before and immediately after the printing operation, the target point on the substrate P. The program is changed to add an operation for imaging (step S21). Specifically, the printing machine 2 drives the camera head 38 immediately before the substrate P is overlaid on the mask sheet 35 and immediately after the printing operation (immediately after the substrate P is released from the mask sheet 35) to drive the substrate. The program is changed so that the target point on P is imaged by the board recognition camera 37.

  On the other hand, when the data acquisition command signal is transmitted from the inspection machine 6 to each of the mounting machines 3 to 5 (the control devices 3A to 5A), as shown in FIG. It is determined whether or not (NG component) has been mounted in the upstream machine (upper process) based on the program of the own machine (own process) (step S31). Immediately thereafter, the program is changed to add an operation for imaging the target point (step S37). Specifically, immediately after positioning the board P to the mounting work position, the mounting machines 3 to 5 drive the head unit 56 to place the board recognition camera 67 above the target point of the board P. The program is changed so that the image is captured. Since the first mounting machine 3 is the most upstream mounting machine, the determination here is always NO.

  If NO is determined in step S31 or after passing through step S37, each of the mounting machines 3 to 5 further determines whether or not to mount the target point component in its own machine (own process) (step S33). If it is determined that the device is to be mounted, the program is changed to add an operation for imaging the target point before and after mounting of the component at the target point (step S39). That is, the mounting machines 3 to 5 change the program so that the head unit 56 is driven and the target point is picked up by the board recognition camera 67 immediately before and immediately after mounting on the target point.

  When NO is determined in step S33 or after passing through step S39, each mounting machine 3-5 further mounts a component in the target area in its own machine (own process) after mounting the component at the target point. (Step S35). When it is determined that the mounting is performed in the target area, the target point is imaged before and after mounting on the mounting point (hereinafter referred to as the target point). The program is changed to add an operation (step S41). That is, the mounting machines 3 to 5 change the program so that the head unit 56 is driven and the target point is picked up by the board recognition camera 67 immediately before and immediately after mounting at the point of interest.

  If it is determined NO in all of steps S31, 33, and 35, the mounting machines 3 to 5 end the subroutine processing without changing the program.

  Here, the program change of each mounting machine 3-5 based on the flowchart of FIG. 8 will be specifically described with reference to FIG.

  FIG. 9A shows an example of a substrate P (finished product) manufactured by this mounting line. On the board P shown in the figure, five parts indicated by reference numerals 1 to 1, 3, 2, 1, 2, 2, 3, 1 are mounted. For the reference numerals of the components, the first half number indicates the mounting machine (first to third) on which the component is mounted, and the second half number indicates the mounting order of the components. That is, for the illustrated substrate P, the components 1, 1 to 1, 3 are in the first mounting machine 3, the components 2, 1, 2, 2 are in the second mounting machine 4, and the components 3, 1 are implemented in that order.

  On the premise of such a board P, for example, assuming that a mounting failure (mounting misalignment) has occurred in the components 2 and 1 as shown in FIG. To do. In addition, the code | symbol E in the figure has shown the said attention area | region.

<First mounting machine 3>
Since the components 2 and 1 are components mounted on the second mounting machine 4 disposed on the downstream side of the first mounting machine 3 as described above, the first mounting machine 3 (the control device 3A thereof) performs step S31. , 33 and 35 are all determined to be NO. That is, the first mounting machine 3 continues the mounting operation without changing the program.

<Second mounting machine 4>
Since the second mounting machine 4 (the control device 4A) mounts the components 2 and 1 in its own machine (own process), it determines NO in step S31 and YES in step S33. As a result, the second mounting machine 4 changes the program so that the mounting point (that is, the target point) of the component 2 or 1 on the board P is imaged by the board recognition camera 67 immediately before and immediately after the mounting of the component 2 or 1. Is performed (step S39).

  In the second mounting machine, the parts 2 and 2 are mounted after the parts 2 and 1. Since the parts 2 and 2 belong to the region of interest E, the second mounting machine 4 determines YES in step S35. to decide. Thereby, the second mounting machine 4 changes the program so that the target point is imaged by the board recognition camera 67 immediately after the mounting of the components 2 and 2 (step S41). According to the original processing in step S41, the program is changed so that the target point is imaged immediately before and immediately after the mounting of the components 2 and 2, but the components 2 and 1 and the components 2 and 2 are continuous as described above. Since the image of the target point immediately after the mounting of the components 2 and 1 and the image of the target point immediately before the mounting of the components 2 and 2 are the same image, the second mounting machine 4 In order to avoid the acquisition of duplicate images, in step S41, the program is changed so that the target point immediately after the mounting of the components 2 and 2 is imaged.

<Third mounting machine 5>
Since the components 2 and 1 are components mounted on the second mounting machine 4 arranged on the upstream side of the third mounting machine 5 as described above, the third mounting machine 5 (the control device 5A thereof) performs step S31. It is judged as YES. As a result, the third mounting machine 5 changes the program so that the board recognition camera 67 images the target point immediately after positioning the board P at the mounting work position (step S37). Note that NO is determined in step S33.

  Further, the third mounting machine 5 mounts the component 3. 1. Since the component 3. 1 belongs to the region of interest E as shown in FIG. 9B, the third mounting machine 5 It is determined YES in S35. Thereby, the second mounting machine 4 changes the program so that the target point is picked up by the board recognition camera 67 immediately after the mounting of the components 3 and 1 (step S41). If the original processing in step S41 is followed, the program is changed so that the target point is imaged immediately before and immediately after the mounting of the component 3 • 1, but in this case as well, the component 2 • 2 in the second mounting machine 4 is changed. For the same reason as the program change accompanying the mounting, the program is changed so that the target point is imaged immediately after the mounting of the component 3.

  Next, the specific operation of the cause of mounting failure in the mounting line (overall control device 9) will be described with reference to FIGS. 10 and 11 by taking the substrate P shown in FIGS. 9A and 9B as an example.

  When the inspection machine 6 detects a mounting defect as shown in FIG. 9B, the program is changed in the printing machine 2 and the mounting machines 3 to 5 by transmitting the data acquisition command signal. The specific change contents of the program of each device are as described above. As a result, the target point is imaged immediately before and immediately after the printing operation in the printing machine 2, and the image data is transmitted to the overall control device 9, In each of the mounting machines 4 and 5, the target point is imaged at the timing described above, and the image data is transmitted to the overall control device 9.

  The overall control device 9 compares the image data transmitted from, for example, the printing machine 2 and the mounting machines 3 to 5 with the master data in the order of processes (in order from the image of the upper process), and causes the mounting failure based on the difference. Is identified.

  First, the overall control device 9 checks the presence or absence of foreign matter in the image immediately before printing, and if there is a foreign matter or the like, displays that fact. Next, the image data immediately after printing is compared with its master data. For example, the overall control device 9 has data as shown in FIG. 10A as master data immediately after the printing of the substrate P. Therefore, the actually captured image immediately after printing is shown in FIG. 10B. If this is the case, that is, if no paste is applied to the target point (position indicated by reference numeral (2 · 1); position surrounded by a broken line), the printing operation is performed based on detection of this difference. Is identified as a cause of failure, and that fact is displayed on the monitor 9B.

Note that the images acquired by the printing machine 2 and the mounting machines 3 to 5 are only target point portions, but for convenience, FIG. 10 shows the entire board (the same applies to FIG. 11 described later). Further, in FIG. 10 shows a sign in mounting position denoted by the brackets of each part, also shows the printing positions of the paste in the shaded.

  Next, the overall control device 9 compares the image data acquired by the mounting machines 4 and 5 with its master data.

FIG. 11 shows images of target points acquired by the second mounting machine 4 and the third mounting machine 5. Specifically, (a) is an image immediately before the components 2 and 1 are mounted on the second mounting machine 4,
(B) and (b ′) are images immediately after the components 2 and 1 are mounted on the second mounting machine 4, and (c) and (c ′) are the parts 2 and 2 mounted on the mounting machine 4. The images immediately after, (d) and (d ′) are images immediately after the substrate P is carried into the third mounting machine 5 and positioned at the mounting work position, and (e) is the part 3 on the mounting machine 5. -Each shows an image immediately after 1 is mounted.

  When the image immediately after mounting the parts 2 and 1 is the same figure (b), it means that a mounting deviation occurs when the parts 2 and 2 are mounted. For this reason, the overall control device 9 identifies that there is a cause of failure in the mounting process of the component 2 or 1, that is, from the suction of the component 2 or 1, and displays that fact on the monitor 9 B. In this case, the overall control device 9 checks the presence or absence of foreign matter in the image immediately before the mounting of the components 2 and 1 ((a) in the figure), and if there is a foreign matter or the like, displays that fact.

  On the other hand, when the image immediately after the mounting of the components 2 and 1 is the same figure (b '), since the components 2 and 1 are properly mounted, the overall control device 9 The image data immediately after mounting the parts 2 and 2 is compared with the master data. Here, when the image immediately after the mounting of the components 2 and 2 is shown in FIG. 2C, the components 2 and 1 are misaligned when the components 2 and 2 are mounted. Therefore, the overall control device 9 specifies that there is a cause of failure in the mounting operation of the parts 2 and 2 and displays that fact on the monitor 9B. For example, interference between the components 2 and 2 at the time of mounting or the nozzle 66a that sucks the components 2 and 1 and the components 2 and 1 is considered as one of the causes of defects.

  If the image immediately after the mounting of the parts 2 and 2 is the same figure (c '), since the mounting operation of the parts 2 and 2 is irrelevant to the mounting failure of the parts 2 and 1, the overall control device 9 Next, the image data immediately after the positioning of the board P on the third mounting machine 5 is compared with the master data. Here, when the image immediately after the positioning of the board P is the same figure (d), it means that the component 2 · 1 has shifted when the board P is carried into the third mounting machine 5. Therefore, the overall control device 9 specifies that there is a cause of the defect in the carry-in operation and displays that fact on the monitor 9B. For example, vibration during substrate transfer from the second mounting machine 4 to the third mounting machine 5 or vibration or impact during positioning of the substrate P by the positioning mechanism is considered as one of the causes of defects.

  On the other hand, when the image immediately after the positioning of the board P to the third mounting machine 5 is the same figure (d ′), the operation of loading the board P into the third mounting machine 5 is performed by the components 2 and 1. Since it is unrelated to the mounting failure, the overall control device 9 next compares the image data immediately after mounting the components 3 and 1 with the master data. If the image immediately after the mounting of the components 3 and 1 is shown in FIG. 5E, the components 2 and 1 are misaligned when the components 3 and 1 are mounted. For this reason, the overall control device 9 specifies that there is a cause of failure in the mounting operation of the component 3.1, and displays that fact on the monitor 9B. For example, interference between the component 3. 1 at the time of mounting or the nozzle 66 a that sucks it and the component 2.

  If there is no difference between the image immediately after mounting the components 3 and 1 and the master data, for example, a message indicating that the cause cannot be specified is displayed on the monitor 9B.

  According to the above mounting line, when a mounting failure occurs, the overall control device 9 compares the image of the substrate P and its master data to identify the cause of the failure. As described above, in this mounting line, When the inspection device 6 actually detects a mounting defect, the image is acquired thereafter. In addition, for the mounting machines 3 to 5, those that are likely to cause the mounting failure are selected according to the flowchart shown in FIG. 8, and the point where the mounting failure occurs among the mounting points of the board P (target point) Since all the printed parts and mounting parts are measured in all processes for all the boards, the data is accumulated, and when the mounting defect occurs, the cause of the defect is used. Compared to this type of conventional mounting line that identifies the cause of failure, the time required to acquire the data (image) for identifying the cause of the defect can be greatly reduced, thereby making it possible to identify the cause of the defect (image). ) Can be acquired efficiently. Therefore, according to this mounting line, it is possible to efficiently identify the cause of the defect while ensuring high productivity.

  In particular, in this mounting line, a fixed area centered on the target point on the substrate P where a mounting failure has occurred is defined as a focused area E (see FIG. 9B), and after mounting the component on the target point, When a component is mounted on the device, the target point is imaged before and after the component is mounted (step S41 in FIG. 8), so that the subsequent component mounted in the region of interest E or the component is picked up. The cause of failure such as interference between the nozzle 66a and the target component (the component in which mounting failure has occurred) can be quickly identified.

  In addition, when a mounting failure occurs, as described above, the program of the printing machine 2 and the mounting machines 3 to 5 is changed to add an imaging operation of the board P (target point). If the same mounting failure is not detected in the machine 6 for a predetermined number of boards, the program of the printing machine 2 and the like is restored to stop the imaging operation, so that reproducibility such as a sudden mounting failure is achieved. When a poor defect occurs, there is also an advantage that it is possible to effectively avoid the inconvenience that the imaging operation by the printing machine 2 or the like or the processing for specifying the cause by the overall control device 9 is continued wastefully for a long period of time.

  The mounting line described above is an example of a mounting board manufacturing apparatus according to the present invention (a mounting board manufacturing apparatus in which the mounting failure cause identifying method according to the present invention is used), and its specific configuration or cause The identification method can be appropriately changed without departing from the gist of the present invention. For example, the following configuration or method may be employed.

  (1) When a mounting failure occurs, various parameter values during the mounting operation may be acquired in addition to the target point image acquisition operation. Specifically, for example, the program change processing of the mounting machines 3 to 5 is performed according to the subroutine of FIG. In this flowchart, steps for adding parameter value acquisition processing at the time of component mounting are provided after steps S39 and S41 in FIG. As specific parameter values, in the case of the mounting machines 3 to 5, for example, the negative pressure value (component adsorption force) / positive pressure value (blow pressure when the component is detached) of the nozzle 66a during component mounting, the nozzle 66a (Mounting head 66) moving up and down, turning speed, acceleration, component size, pushing amount of component by nozzle 66a (mounting head 66), pushing speed, coordinates of actually mounted component (X axis, Y axis, It is conceivable to acquire (Z-axis, R-axis coordinates) and the like. Further, in the case of the printing press 2, it is conceivable to acquire the pressing force value of the squeegee 33 against the mask sheet 35.

  In this way, the overall control device 9 can identify the cause of failure based on a plurality of judgment materials such as the image data of the target point and various parameter values, so that the cause of failure can be specified in more detail. There is an advantage that becomes possible.

  (2) You may make it give the function of the cause specific process by the integrated control apparatus 9 to the printing machine 2 (the control apparatus 2A) and the mounting machines 3-5 (the control apparatuses 3A to 5A). That is, the cause of the defect may be specified in the device by comparing the image captured by the printing machine 2 or the mounting machines 3 to 5 with the master data by the device that acquired the image. Specifically, when a target point is imaged by the first mounting machine 3, immediately after imaging, the first mounting machine 3 compares it with the master data, and when the cause of the defect can be identified, the contents are monitored. You may make it display on 3B. According to this configuration, the cause of the defect can be identified more quickly than in the case of the above-described embodiment in which image data is once transmitted and stored in the overall control device 9.

  In this case, the image data of the substrate P imaged by the inspection machine 6 may be stored as master data and transmitted to the printing machine 2 and the like together with the transmission of the data acquisition command signal. The master data may be transmitted to the printing press 2 or the like and stored in advance.

  (3) Instead of automatically specifying the cause of failure in the overall control device 9 and displaying it on the monitor as in the embodiment, the image data transmitted to the overall control device 9 from the printing machine 2 and the mounting machines 3 to 5 is displayed. Based on this, the operator may specify the cause of the failure by manual work. Specifically, the cause of the defect may be specified while viewing the image while the operator manually displays the image data on the monitor 9B. According to this configuration, there may be a case where a trivial failure cause that is difficult to determine by image processing or the like can be detected relatively easily, and it takes a little time and effort, but reliability is improved in identifying the failure cause.

  (4) In the mounting line of the embodiment, the data acquisition command signal is transmitted from the inspection machine 6 to all the upstream machines (printing machine 2 and mounting machines 3 to 5), and whether or not the program needs to be changed in the printing machine 2 or the like. However, the inspection machine 6 identifies the upstream machine that needs to be changed (that is, the one that needs to add the imaging operation of the board P), and only the upstream machine is identified. A data acquisition command signal may be transmitted.

  (5) The mounting line of the embodiment includes the screen printing machine 2 and the mounting machines 3 to 5 as the working machine of the present invention, but instead of the printing machine 2 or in addition to the printing machine 2, an adhesive or the like is used as a substrate. It may include a coating device (dispenser) for coating on P.

1 is a schematic front view showing an example of a mounting line (a mounting substrate manufacturing apparatus to which a mounting failure cause detection commission method according to the present invention is applied) that is a mounting substrate manufacturing apparatus according to the present invention; It is a side view which shows the screen printing machine integrated in a mounting line. It is a front view which shows a screen printer. It is a top view which shows the mounting machine integrated in a mounting line. It is a front view which shows a mounting machine. It is a flowchart which shows the flow of the process for defect cause identification. It is a subroutine (program change process of a screen printing machine) of the flowchart shown in FIG. It is a subroutine (program change process of a mounting machine) of the flowchart shown in FIG. It is a top view which shows a board | substrate ((a) shows the board | substrate with which components were mounted appropriately, (b) shows the state which the mounting defect generate | occur | produced in the board | substrate shown to (a), respectively). It is a figure which shows the image of the board | substrate immediately after printing by a screen printer ((a) shows the image when printing is mounted appropriately, (b) shows the image when printing defect generate | occur | produces, respectively). It is a figure explaining the specific process of the mounting defect cause in an integrated control apparatus, (a)-(e) is a figure which shows the image of the board | substrate imaged with the mounting machine, respectively. It is a modification of the subroutine (program change process of a mounting machine) of the flowchart shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Loader 1A-9A Control apparatus 1B-9B Monitor 2 Screen printing machine 3 1st mounting machine 4 2nd mounting machine 5 3rd mounting machine 6 Inspection machine 7 Reflow furnace 8 Unloader 9 Overall control apparatus

Claims (12)

Identifying the cause of mounting failure in a mounting board manufacturing system, where multiple working machines that perform work to mount components on the board and inspection machines that inspect mounted boards are arranged in order from the upstream side along the board transfer line A method,
The mounting point on the substrate where a mounting failure is detected in the inspection machine is a target point, and a working machine that performs work on the target point among the plurality of working machines is a target machine, and the mounting failure is detected. after, the target point of the subsequent substrate to be carried into the target machine, and imaging at least one of timing before and after the work operation for the target point, is compared with the master data and corresponding the image data thereof If there is a difference between the data, the work by the target machine is specified as the cause of the mounting failure. In the method for identifying the cause of mounting failure according to claim 1,
A certain area on the substrate including the target point is designated as a target area, and a mounting location other than the target point is specified as a target point among the mounting locations included in the target area, and among the plurality of working machines A working machine that performs work on the target point is the target machine, and after the mounting failure is detected, at least one of the target point of the subsequent board carried into the target machine is before and after the work on the target point. It captured the time of, and characterized in that when by comparing the master data and corresponding the image data there is a difference between these data, identifying the work by the noted motor as the cause of the mounting failure How to identify the cause of mounting failure. In the mounting failure cause identification method according to claim 1 or 2,
Leave obtain the value of function Waru various parameters to work for the points, to identify the tasks that cause the mounting failure, in addition to the comparison of the image data and the master data corresponding thereto, the parameters obtained A method for identifying the cause of mounting failure, characterized by checking the value . In the method for identifying the cause of mounting failure according to any one of claims 1 to 3,
After the mounting failure is detected in the inspection machine, if mounting failure is not detected continuously for the target points of a predetermined number of subsequent boards, imaging of the target points on the subsequent boards is stopped. How to identify the cause of mounting failure. In the mounting failure cause identifying method according to any one of claims 1 to 4,
Wherein those containing a mounter for mounting components on a substrate as a working machine, the target point of the subsequent substrate to be carried into the mounting machine as the target machine, Oyo before mounting work of components with respect to the target point beauty imaging at least one time after, by comparing the master data and corresponding the image data if there is a difference between these data, the mounting operation by the mounting machine as a cause of the mounting failure A method for identifying the cause of mounting failure, characterized by identifying. In the mounting failure cause identifying method according to any one of claims 1 to 4,
Using said mask screen to the substrate as a working machine is intended to include a printing press for printing various pastes, the target point of the subsequent substrate to be carried into the printing press, as the target machine, the printing of the paste with respect to the target point If the captured at least one time prior Oyo after beauty work, there is a difference between these data is compared with the master data and corresponding the image data, the printing operation by the printing press A method for identifying the cause of mounting failure, characterized in that the cause is specified as the cause of the mounting failure. In the mounting board manufacturing apparatus in which a plurality of working machines performing work for mounting components on the board and an inspection machine for inspecting the mounted board are arranged in order from the upstream side along the board transfer line,
An imaging means mounted on each of the work machines, for imaging the substrate and transmitting the image data ;
Storage means for storing image data transmitted from the imaging means;
When a mounting failure is detected in the inspection machine, command means for giving an imaging command to the work machine for imaging the point with the defective portion on the substrate as a target point ;
A cause specifying means for specifying the cause of the mounting failure based on the image data stored in the storage means ,
Working machine to perform the operation on the target point of each working machine, after the transmission of the imaging command from the command means, the work front and the at least one time after the work with respect to the target point, by the image pickup means Image the target point on the board ,
The cause identifying means compares the image data of the target point with the corresponding master data, and if there is a difference between these data, the work of the work machine for the target point is caused by the mounting failure. A mounting board manufacturing apparatus characterized by specifying as follows. The mounting board manufacturing apparatus according to claim 7,
When a mounting failure is detected in the inspection machine, the apparatus further includes an area designating unit that gives a work machine information about the area as a target area of a certain area on the substrate including the target point,
The command means gives a work machine an imaging command for imaging a point of interest that is a location other than the target point among mounting locations included in the region of interest ,
Working machine that performs work on the interest points of the respective working machine, after the transmission of the imaging command from the command means, the work front and the at least one time after work on the interest point, by the image pickup means Image the target point on the substrate ,
The cause identifying means compares the image data of the point of interest with the corresponding master data, and if there is a difference between the data, the cause of the mounting failure A mounting board manufacturing apparatus characterized by specifying as follows. In the mounting substrate manufacturing apparatus according to claim 7 or 8,
The cause identifying unit, mounting substrate manufacturing apparatus according to claim and Turkey to identify the cause of the mounting failure as the master data image data when working properly to the point were made. The mounting board manufacturing apparatus according to claim 9,
Further comprising means for acquiring a value of about Waru various parameters to work for the points in each of the working machines,
The cause identifying means checks the acquired parameter value in addition to comparing the image data with the corresponding master data in order to identify the work causing the mounting failure. Board manufacturing equipment. The mounting board manufacturing apparatus according to any one of claims 7 to 10,
The command means gives an imaging stop command to each work machine when a mounting failure is not detected continuously for the target points of a predetermined number of subsequent boards after the mounting failure is detected in the inspection machine,
Each said working machine stops imaging of the said target point based on transmission of the said imaging stop command, The mounting board manufacturing apparatus characterized by the above-mentioned. The mounting board manufacturing apparatus according to any one of claims 7 to 11 ,
The separately from each working machine and the test machine, the mounting substrate manufacturing apparatus characterized by having a mounting failure analysis apparatus provided with the storage means and the attribution hand stage.

Images