JP4520324B2 - Inspection result notification device and mounting system - Google Patents

Description

  The present invention relates to an apparatus for informing a test result in a board inspection apparatus for inspecting a board in a component mounting line for mounting an electronic component on a circuit board.

  Conventionally, a soldering device (or dispenser), a mounting device, a reflow furnace, etc. are arranged in a line to form a production line (component mounting line), and the circuit board is transported through each of these devices and then on the substrate. Electronic components are mounted on the board.

In this type of production line, an inspection device for inspecting the processing operation (contents) by, for example, recognizing the image of the substrate on the downstream side of each of the above devices is provided. The substrate is dropped and the inspection result is fed back and reflected in the processing of the next substrate. In this case, the display of a CRT or the like displays the defective portion and the defective content on the substrate in an identifiable manner, thereby assisting the operator to quickly take countermeasures (for example, Patent Document 1).
Japanese Patent No. 3216033 (Japanese Patent Laid-Open No. 8-292018)

  However, in the case of Patent Document 1, although the operator can quickly identify and confirm the defective part and the defect content on the substrate, there are many cases where the cause of the defect cannot be identified quickly. For example, a component is mounted using a mounting apparatus that includes a head unit having a plurality of nozzles for sucking components, and that is configured to take out components from multiple rows of feeders and mount them on a substrate. In this case, the operator searches the mounting program for nozzles and feeders involved in mounting the relevant part (component) using the defective part displayed on the display as a clue, and further relates the relationship between these nozzles and feeder based on the contents of the defect. It is necessary to identify the cause of the defect. For this reason, even if it is possible to quickly confirm the defective part and the content of the defect, it takes a lot of time and labor to actually identify the cause of the defect.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to enable quick and accurate identification of the cause of a defect in a component mounting line or the like.

In order to solve the above problems, the inspection result notification device of the present invention, the paste coating device, Ru Risho management by the processing unit including at least paste coating apparatus and component mounting apparatus of the component mounting apparatus and reflow device is subjected An apparatus for imaging the board on which the component is mounted and informing the inspection result of the inspection apparatus for inspecting the board based on the image, an output means for recognizing and outputting various information, and the inspection apparatus the processing-related information relating to various processes in the processing device for the substrate according to the test-related information and test results including the test results of the substrate and an output control means for outputting by the output section, the component mounting apparatus, parts Components are taken out from a plurality of feeders of a component supply unit by a plurality of mounting heads equipped with suction nozzles and mounted on a substrate. The output control unit outputs a component mounting failure part and a defect content as the inspection related information, and processing information related to paste application to the mounting defective part by the paste application device and the component mounting apparatus as the processing related information. to output the processing information relating to components mounted to the mounting failure portion is shall (claim 1).

In this apparatus, the inspection of the substrate is carried out by the inspection apparatus, inspection-related information in addition to (part mounting defects sites and defect content of) the mounting defect site by processing relevant information (paste coater relating to the processing of the substrate Processing information relating to paste application and processing information relating to component mounting on a mounting failure site by the component mounting apparatus) are output by the output means. Therefore, when a component mounting failure occurs, the operator can analyze the cause of the failure based on the processing related information after confirming the inspection result (inspection related information). Specifically, it is possible to promptly guide the operator to a location related to the cause of the failure based on the processing information related to paste application to the mounting failure site and the processing information related to mounting the component on the mounting failure site. . Incidentally, in the case the inspection-related information, in addition to the above information, the inspection image (image used in the inspection), the reference value of the inspection, there is information about the examination of the measurement value or the like, whereas, the processing-related information is a, in addition to the above information, various setting conditions of the processing unit (parameter) used parts used in processing of the substrate (substrate according to test results), the processing when there is a replacement part information about the kinds of consumables (material) there Ru.
More specifically, for example, when the paste application device is a printing device including a mask and a squeegee that applies solder to the substrate while expanding the solder on the mask by sliding along the mask at a predetermined speed. The processing information related to the paste application is a squeegee speed when the squeegee is slid along the mask (claim 2).

Also, processing information regarding the implementation of the component, the nozzle involved in mounting the parts, Ru information Hodea for at least one of the mounting heads and feeder (claim 3).

As described above, according to the configuration in which the nozzle, the mounting head, or the feeder that is involved in the mounting process of the mounting failure portion is output, the operator can easily access the cause of the mounting failure when the mounting failure occurs. Can be done. That is, many of the causes of mounting defects occurring in the component mounting apparatus having the above-described configuration are in the nozzle, mounting head, and feeder. According to the above-described configuration, the operator is responsible for mounting the defective portion and mounting. It becomes possible to immediately specify the head or the feeder, and it is possible to quickly access the cause of the defect because there is no need to check the mounting program or the like to specify the nozzle.

  In each of the above devices, the output unit is preferably a display device, and the output control unit preferably displays examination-related information and processing-related information on the same display screen of the display device. ).

  According to this configuration, both pieces of information are displayed in the same display screen of the display device by the output control means. Therefore, the operator can analyze the cause of the defect while checking the inspection result (inspection-related information) and the processing-related information in the inspection apparatus on the same display screen, and the defect cause analysis work can be efficiently advanced. It becomes possible.

  The output means comprises a display device and a printer device, and the output control means displays inspection related information on the display device and records at least the processing related information on a recording medium of the printer device. (Claim 5).

  According to this configuration, the inspection-related information is displayed on the display device, and the recording medium on which the processing-related information is recorded is output by the printer device. Therefore, even when the display device and the processing device are separated from each other, after confirming the display on the display device, the operator carries the recording medium on which the processing-related information is output and checks the recording medium while working toward the processing device. Can be performed.

  The apparatus includes an output operation unit for outputting the processing related information, and the output control unit outputs the processing related information to the output unit only when an operation is performed by the output operation unit. It may be configured (claim 6).

  According to this configuration, the processing related information is displayed only when the output operation means is operated. Therefore, it is possible to eliminate the complexity that the processing related information is output even when no defect occurs or when the cause of the defect can be sufficiently identified from only the inspection related information.

On the other hand, the mounting system according to the present invention includes a processing device including at least a paste coating device and a component mounting device among paste coating devices, component mounting devices, and reflow devices, and components mounted by being processed by these processing devices. A mounting system comprising: an inspection apparatus that images a captured board and inspects the board based on the image; and the inspection result notification apparatus according to claim 1, wherein the inspection result notification apparatus Ru der those of the output means being eclipsed set to at least one of the test devices or processing apparatus (claim 7).

According to such a mounting system, it is possible to efficiently carry out the work of identifying the cause of failure. For example, in the case where a management device is provided in a place separated from the component mounting device and the inspection device and each device is controlled from the history, the output device may be provided in the management device. According to the structure providing the output means to the inspection apparatus or processing apparatus as it is possible to proceed with the specific task of failure cause for that can reference inspection-related information and process related information aide implementation system efficiently.
In this case, when the output means of the inspection result notification device is a display device, the output control means displays the inspection-related information and processing-related information on the display device and displays the background of the display at that time. A predetermined warning color may be used (claim 8).

Furthermore, mounting system according to the present invention, the paste coating apparatus, the component mounting apparatus and a processing apparatus including at least paste coating apparatus and component mounting apparatus, parts by Rukoto processing is performed by the processor implementation of the reflow device by imaging the substrate which is an inspection apparatus for inspecting the substrate based on the image, the a mounting system that includes a test result notification device (according to any one of claims 1 to 6), wherein inspection result by the inspection device is one that has a control unit for controlling the processing unit in order to stop the processing that due to the processing device when was predetermined failure state (claim 9).

  In this mounting system, the substrate processing is stopped when a defect state is detected in the inspection apparatus. For this reason, it is possible to effectively prevent a defective substrate having a similar defective state from being continuously produced.

According to the inspection result notification device according to claims 1 to 6 of the present invention, in addition to the inspection related information (part mounting failure part and defect content) including the result, processing related information (by the paste applying device ) regarding the processing of the substrate The processing means regarding the paste application to the mounting defective part and the processing information regarding the mounting of the component to the mounting defective part by the component mounting apparatus) are output by the output means. It becomes possible to analyze the cause of the failure using the information as a clue. Therefore, compared with the implementation of only this type of conventional I can confirm Oite simply defective portion or the defect content in the line system, the failure cause more quickly, and it is possible to accurately identify.

Further, according to the mounting system according to claims 7 and 8 of the present invention, the inspection-related information and the processing-related information can be output in the inspection apparatus and the processing apparatus itself. Therefore, in aide implementation system can obtain the information, as a result, it is possible to quickly advance the specific work of failure cause.

Further, according to the mounting system of the ninth aspect of the present invention, it is possible to effectively prevent the defective substrate from being continuously produced.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 schematically shows a component mounting line (mounting system) to which the present invention is applied. This production line includes a loader (not shown), a solder printing device (or dispenser) 1, a printing inspection device 2, two types of mounting devices 3A and 3B, a mounting inspection device 4, a reflow furnace 5, a soldering inspection device 6, and an unloader. A loader (not shown) is provided in a row, and these are connected to each other by a conveyor 7. And while conveying a circuit board (henceforth only a board | substrate) with the conveyor 7, while performing each process of solder printing, component mounting, and reflow sequentially, the board | substrate after each process is test | inspected by the inspection apparatus 2,4,6. It is configured as follows.

  Each of the devices 1 to 6 is an autonomous device on which a control device is mounted, and the operation of each device is individually driven and controlled by its own control device. However, this component mounting line is further provided with a central management device 8 connected online to each of the devices 1 to 6, and various information relating to production (processing) in each of the devices 1, 3 A, 3 B, and 5. For example, various information such as board data, component data, printing and mounting position data, and reflow temperature data is stored in a storage device in the central management device 8, and the central management device 8 and the devices 1 to 6 Necessary information can be transmitted and received between the two.

  In this production line, the inspection result notification device of the present invention is applied to the mounting inspection device 4, and the configuration of the mounting inspection device 4 will be described in detail below.

  2 and 3 schematically show the configuration of the mounting inspection apparatus 4. FIG. 2 shows the apparatus 4 in a plan view, and FIG. 3 shows the apparatus 4 in a front view. This mounting inspection device 4 is for image recognition of the mounting state of components by picking up the mounting points of the board after the mounting processing is performed in the mounting devices 3A and 3B and determining the quality.

  The mounting inspection apparatus 4 has a base 10 that is formed in a substantially rectangular parallelepiped shape having a hollow inside. A substrate transport unit 12 is provided on the base 10, and a substrate P as an inspection target is transported along a post conveyer of the substrate transport unit 12. In the present embodiment, the transport direction (left and right direction in FIG. 2) of the substrate P by the conveyor is referred to as the X-axis direction, and the direction orthogonal to the X axis on the horizontal plane (up and down direction in FIG. 2) is referred to as the Y-axis direction.

  The board P is carried into the mounting inspection apparatus 4 from the right side of the apparatus along the conveyor of the board conveying means 2 and is subjected to the inspection process in the inspection work area provided at the approximate center of the base 10, and then the next process is started from the left side of the apparatus. (In the direction of the white arrow in the figure).

  The substrate transfer means 12 is composed of three components arranged in the X-axis direction, each having a pair of belt conveyors. Specifically, the belt conveyors 20A, 21A and 20C are provided in predetermined ranges on both sides of the substrate transfer direction. , 21C having carry-in / carry-out parts 12A, 12C, and a movable part 12B having belt conveyors 20B, 21B on a table 30 described later.

  In the carry-in / carry-out sections 12A and 12C, the front conveyors 20A and 20C are fixedly provided on the base 10, while the rear conveyors 21A and 21C are movable in the Y-axis direction, and a motor (not shown) The conveyors 21A and 21C on the rear side are driven by the movement of the conveyor P, so that the conveyor interval according to the size of the substrate P can be adjusted.

  In the movable portion 12B, a pair of conveyors 20B and 21B are provided on a postscript table 30 that can move in the Y-axis direction, of which the front conveyor 20B is fixed to the table 30 and the rear conveyor 21B is a table. 30 is supported so as to be movable in the Y-axis direction. Then, when the rear conveyor 21B is driven by a motor (not shown), the interval between the conveyors 20B and 21B is changed, so that the size change of the substrate P can be accommodated.

  The table 30 is movable along a Y-axis direction guide rail 31 fixed on the base 10, and is supported on a Y-axis direction ball screw shaft 32 rotatably supported on the base 10. A nut portion (not shown) to be screwed is provided, and the ball screw shaft 32 is rotationally driven by a motor 33 so that the table 30 moves along the guide rail 31 in the Y-axis direction. .

  A gate-shaped support base 35 is erected on the base surface of the base 10. The support base 35 is provided at a position slightly rearward with respect to the central portion of the base 10 in the front-rear direction (vertical direction in FIG. 2), and the support base 35 is a leg that stands up from both ends in the left-right direction. It consists of a column portion 36 and a beam portion 37 that bridges the upper end portions of the leg column portion 36.

  The beam portion 37 of the support base 35 is provided with an image pickup device 40 for picking up an image of the substrate P, and a drive device 42 for moving the image pickup device 40 along the support stand 35. The drive device 42 includes a motor 44 installed on the beam portion 37 of the support base 35, a ball screw shaft 46 connected to the output shaft of the motor 44 and extending in the left-right direction, and in parallel with the ball screw shaft 46. A pair of guide rails 48 installed on the beam portion 37.

  On the other hand, the imaging device 40 is supported by a support frame 50 that is screwed onto the ball screw shaft 46. Therefore, the imaging device 40 moves in the X-axis direction along the guide rail 48 integrally with the support frame 50 by driving the motor 44.

  The imaging device 40 includes a camera 52 for imaging the substrate P as a subject and an illumination device 53 for illuminating the substrate P. The camera 52 is a CCD camera, and has a lens portion with a built-in objective lens at the tip of a camera body with a built-in solid-state imaging device, and is fixed to the support frame 50 in a downward posture. Yes.

  In the above configuration, in the inspection work, the substrate P is first transported from the carry-in portion 12A to the movable portion 12B by the operation of the substrate transport means 12, and the substrate P is positioned and fixed at a predetermined position of the movable portion 2B. At this time, the table 30 of the substrate transport means 12 is at a home position, that is, a position where the conveyors 20B and 21B of the movable part 2B and the conveyors 20A and 21A of the carry-in part 2A and the carry-out part 2C are arranged side by side (shown in FIG. 2). In this way, the substrate P can be carried into the movable portion 12B.

  In a state where the substrate P is positioned and fixed to the table 30, the motors 33, 44 and the like are driven and controlled by the control device 60, so that the table 30 to which the substrate P is fixed moves in the Y-axis direction, and The imaging device 40 moves in the X axis direction. Thereby, the mounting point on the substrate P is imaged, and the substrate P is inspected based on the imaging result. When the inspection is completed, the table 30 is reset to the home position, and the substrate P is unloaded to the next process (reflow furnace 5) via the unloading unit 12C.

  FIG. 4 shows a control system of the mounting inspection apparatus 4 in a block diagram.

  As shown in this figure, the mounting inspection device 4 has a control device 60 that controls the driving of the substrate transport means 12 and the imaging device 40. The control device 60 includes a control unit main body 61, a keyboard (including a mouse) 68, an LCD monitor 69 (display device), a motor control circuit 71, an illumination control circuit 72, an image processing means 73, and an external storage device 67 such as a magneto-optical disk. It has.

  The control unit main body 61 includes a well-known CPU 62 for executing logical operations, a ROM 63 for storing various programs for controlling the CPU 62 in advance, a RAM 64 for temporarily storing various data during operation of the apparatus, various programs and OSs. Further, an HDD 65 and an I / O controller (IOC) 66 that store various data necessary for inspection such as various parameters described later are provided, and these CPUs 62 are connected to each other via an internal bus.

  The IOC 66 is connected to the keyboard 68 and the LCD monitor 69, and the motors 33 and 34, the control circuits 71 and 72 of the illumination device 53, the image processing means 73, the display (warning lamp) 74, and the external storage device. 67 etc. are connected. The IOC 66 controls the input of various control signals and various data between the control circuits 71 and 72 and the control unit main body 61 in accordance with a command from the CPU 62 based on predetermined instruction information input from the keyboard 68. As a result, the operations of the substrate transfer means 12 and the display 74, the display on the LCD monitor 69, and the like are controlled by the control unit main body 61. Note that the image processing unit 73 performs predetermined image processing on the image signal output from the camera 52 and outputs the image data to the control unit main body 61.

  Although not shown, the control unit main body 61 is further connected to the central management device 8, thereby enabling the various information stored in the central management device 8 to be transmitted to the control unit main body 61. Via the central management device 8, various information can be transmitted from the solder printing device 1 and the mounting devices 3A, 3B to the control unit main body 61. The solder printing device 1 and the mounting devices 3A and 3B and the control unit main body 61 may be capable of transmitting various types of information by directly connecting them.

  FIG. 5 schematically shows a functional configuration included in the control unit main body 61 in a block diagram.

  As shown in this figure, the control unit main body 61 includes a main control unit 611, a determination unit 612, a display control unit 613, and the like.

  The main control unit 21 comprehensively controls the motor 33 and the like via the control circuits 71 and 72 so as to execute a predetermined inspection process in accordance with a program stored in advance. The display 74 or the like is operated.

  The determination unit 612 calculates a component mounting error based on the image data output from the image processing unit 73, and determines whether the mounting process is acceptable based on whether the error is within the inspection reference value (allowable value). It is.

  The display control unit 613 displays a predetermined screen on the LCD monitor 69 in accordance with a program stored in advance. In particular, when the determination unit 612 makes a failure determination (determination is made that a mounting error has occurred). The predetermined inspection related information including the result is displayed, and the processing related information of the substrate is displayed on the same display screen of the LCD monitor 69 in response to an instruction input by the operation of the keyboard 68 (output operation means) of the operator. Display control is performed so that the information is displayed in the inside (that is, in the same display screen as the examination-related information).

  FIG. 6 shows an example of a display screen (display screen when a mounting error occurs) of the LCD monitor 69 based on the control of the display control unit 613. As shown in the figure, the display screen 80 includes, as inspection related information, an inspection image 82 (image used for inspection), an inspection reference value 84, substrate identification information 86, an inspection result 88, and an inspection result detail 89. Is displayed.

  Among these examination related information, the examination image 82 is displayed on the upper left of the display screen 80, and the examination reference value 84 is displayed on the lower side thereof. As the inspection image 82, a certain range including a point (defective part) where a mounting defect has occurred is displayed, and a mark 83 for specifying the defective part is also displayed in this image. In the illustrated example, a broken line mark 83 surrounding the defective part is displayed. The display for specifying the defective part may be a mark 83 such as an arrow in addition to the broken line mark, or may be another display method such as applying a specific color to the defective point.

  The board identification information 86 and the inspection result 88 are displayed side by side on the right side of the inspection image 82 at the upper end of the display screen 80, and the details 89 of the inspection result are displayed below it. In the example shown in the figure, the board number (No. 245) is displayed as the identification information 86, and “position misalignment error” is displayed as the inspection result 88. As the details 89 of the inspection result, the details of the defect contents are displayed together with the display of the defective part or the mounted component name. In the illustrated example, the mounted component name (C1) and the calculation result by the determination unit 612 ( (Displacement amount) is displayed.

  Below the details 89 of the inspection result, according to the operator's instruction input, processing related information, that is, various information regarding the mounting process of the defective part (mounting information 90) and various information regarding the solder printing process of the same part ( Print information 92) is displayed.

  For example, the mounting apparatuses 3A and 3B have a plurality of mounting heads, both of which are not shown in the drawings, each having a component suction nozzle, and a plurality of feeders arranged in parallel to the component supply unit by these mounting heads. Therefore, the mounting information 90 includes mounting device (mounter), nozzle, head and feeder identification information, etc. involved in the mounting process of the defective part. Is displayed. In the example of FIG. 6, information such as production line, mounter, feeder, head identification numbers and nozzle type is displayed.

  Further, each of the mounting apparatuses 3A and 3B recognizes an image of a mark (fiducial mark) marked on the substrate and corrects the driving amount of the mounting head or the like according to the displacement of the recognized position (fiducial). Mark correction), and after taking out the component by the nozzle (mounting head), the component is picked up from the nozzle based on the image recognition of the component, and the drive amount of the mounting head is corrected (component correction). Therefore, these correction results are also displayed as the mounting information 90.

  On the other hand, the solder printing apparatus 1 is configured to apply the solder to the substrate while expanding the solder on the mask by sliding the squeegee along the mask at a constant speed, and to clean the squeegee and the mask in a constant cycle. Accordingly, as the print information 92, information such as printing device, mask and squeegee identification information, squeegee speed, and print timing is displayed. In the example of FIG. 6, the production line identification number, squeegee speed, processing timing, and the like are displayed.

  The mounting information 90 and the printing information 92 are transmitted from the solder printing apparatus 1 and the mounting apparatuses 3A and 3B, respectively, in response to a request from the control unit main body 61. That is, identification information for identifying the substrate is written as a barcode or QR code on each substrate, and the identification information is read by the imaging device 40, and the determination unit 612 has a failure determination. When a display instruction for processing related information is input by the operator's operation of the keyboard 68, the request signal such as the mounting information 90 and the like together with the identification information of the board and information for specifying the defective part is sent from the control unit main body 61 to the mounting device 3A. 3B etc. And according to this signal output, in the solder printing device 1 and the mounting devices 3A and 3B, related information is read from the program and history data and transmitted to the mounting inspection device 4 (control unit main body 61). It has become.

  Next, an example of display operation control of the LCD monitor 69 by the control unit main body 61 will be described based on the flowchart of FIG.

  When this flowchart is started, first, the substrate transfer means 12 is driven in step S1, and the substrate unloaded from the mounting devices 3A and 3B is loaded into the mounting inspection device 4.

  And after imaging and recognizing the board identification information (the board number) by the imaging device 40, the board is inspected. Specifically, by driving the imaging device 40 and the table 30, the imaging device 40 (camera 52) is sequentially moved to the mounting points on the substrate to capture the points, and the determination unit 612 performs the imaging based on the images. A mounting error at each mounting point is obtained, and whether or not the mounting process is acceptable is determined based on whether the error is within a reference value (steps S2 to S4).

  If YES is determined in step S4, it is determined whether or not the inspection processing operation of the mounting inspection apparatus 4 is to be ended after unloading the board to the next process (reflow furnace 5) (steps S5 and S6). If NO is determined here, the process proceeds to step S1 to carry in the next substrate, and if YES is determined, this flowchart is ended.

  On the other hand, when NO is determined in step S4, that is, when a mounting error occurs, the mounting inspection apparatus 4 is stopped by operating the display 74 and an alarm outside the drawing, as illustrated in FIG. An error screen (only inspection related information) is displayed on the LCD monitor 69 (step S7). On the other hand, the operator confirms the screen of the LCD monitor 69 (inspection image 82 and inspection result details 89), or visually confirms the substrate and makes a pass / fail judgment for the substrate again, and the result is obtained by operating the keyboard 68. When input, it is determined whether or not the determination is a pass determination (steps S8 and S9). If YES is determined here, the process proceeds to step S5, and the substrate is carried out to the next process.

  On the other hand, if NO is determined in step S9, a selection screen (for example, “display required” OR “display unnecessary”) for displaying processing-related information on the LCD monitor 69 is displayed. Then, it is determined whether or not the operator has selected “display required” (steps S10 and S11). If YES is determined, processing-related information (mounting information 90, print information 92) is additionally displayed on the LCD monitor 69 (step S14).

  Next, a measure result input screen is displayed (for example, additional display) on the LCD monitor 69, and the process proceeds to step S6 after waiting for the operator to input the result (steps S12 and S13). As the measure result input screen, for example, menu screens such as “marking”, “line out”, and “others” are displayed, and the operator selects the corresponding item according to the measure content. If “marking” or “others” is selected, the board is transferred to the next process, and then the process proceeds to step S6.

  If NO is determined in step S11, that is, if the operator determines that “display is not required” is selected, the process proceeds to step S12.

  According to the mounting inspection apparatus 4 as described above, when a mounting error occurs, inspection-related information such as the board identification information 86, the inspection result 88, and the inspection image 82 is displayed on the LCD monitor 69 and requested by the operator. In this case (in the case of YES in step S11 of FIG. 7), in addition to the inspection related information, processing related information such as mounting information 90 and print information 92 is also displayed in the same display screen. Therefore, even when a mounting failure occurs, the operator can quickly and accurately analyze the cause of the failure using the processing related information. In other words, based on the processing related information, it is possible to promptly guide the operator to a location related to the cause of the failure. Specifically, for example, in the display example of FIG. 6, since the identification information such as the nozzle, the mounting head, and the feeder involved in the mounting process of the defective part is displayed as the mounting information 90, the operator immediately The cause of the failure can be analyzed by chucking the mounting state of the nozzle or the like. Therefore, after confirming the defective part, it is possible to save the operator from having to specify the nozzle used for the mounting process while referring to the mounting program and history data, etc. As a result, the cause of the failure can be analyzed promptly and accurately.

  In particular, as the processing related information, in addition to the mounting information 90, print information 92, which is information of the previous process, is also displayed, so that the operator can process not only the processing in the mounting apparatuses 3A and 3B but also the processing of the solder printing apparatus 1. It is possible to analyze the cause of the failure in a multifaceted manner.

  Therefore, the cause of mounting failure can be identified more quickly and accurately compared to a conventional device of this type that can simply check the defective part and the content of the defect, resulting in the occurrence of mounting failure. The line stop period can be reduced to increase the productivity of the component mounting line.

  The mounting inspection apparatus 4 described above is an example of the mounting inspection apparatus 4 to which the inspection result notification apparatus according to the present invention is applied, and the specific configuration thereof is appropriately changed without departing from the gist of the present invention. Is possible. For example, the following may be used.

  (1) In the embodiment, the inspection related information is displayed on the LCD monitor 69, and the processing related information is displayed in response to the operator's request (in the case of YES in step S11 in FIG. 7). Both the inspection related information and the processing related information may be displayed from the beginning. Further, the processing related information is not necessarily displayed on the same display screen as the inspection related information. For example, the processing related information may be switched to the inspection related information (that is, the display of the inspection related information is turned off and displayed instead). . However, when analyzing the cause of failure, the operator often checks the nozzle and the feeder while checking the inspection image 82 and the details 89 of the inspection result. Therefore, considering work efficiency, the processing related information is the same as the inspection related information. It is preferable to display in the display screen.

  (2) In the embodiment, the LCD monitor 69 is used as an output means for processing related information, and the processing related information is displayed on the LCD monitor 69. However, for example, a printer is used as the output means and the processing related information is recorded on a recording sheet (recording). It may be recorded on a medium and output. According to such a configuration, for example, when the LCD monitor 69 is separated from the solder printing apparatus 1 and the mounting apparatuses 3A and 3B, the operator carries and confirms the recording paper on which the processing related information is recorded. However, since work for analyzing the cause of defects can be performed toward the solder printing device 1 and the mounting devices 3A and 3B, workability is improved. In this case, the inspection related information as well as the processing related information may be recorded on the recording paper and output.

  (3) In the embodiment, the inspection result information and the processing related information are displayed on the LCD monitor 69 of the mounting inspection device 4. For example, the information is displayed on the monitor of the central management device 8 to implement the mounting. When a defect occurs, the inspection result information and the processing related information may be confirmed remotely. In this case, when a failure determination is made in the mounting inspection apparatus 4, the inspection result information on the board is transmitted from the mounting inspection apparatus 4 to the central management apparatus 8, and the solder printing apparatus 1 and the mounting apparatus 3A, Processing related information may be transmitted from 3B to the central management device 8.

  (4) In the embodiment, the example in which the present invention is applied to the mounting inspection apparatus 4 has been described. Of course, the present invention is also applicable to the printing inspection apparatus 2 and the soldering inspection apparatus 6. In this case, the print inspection apparatus 2 and the soldering inspection apparatus 6 may be provided with LCD monitors as output means, respectively, so that inspection-related information and processing-related information are displayed in the same manner.

  As processing-related information, at least the processing device immediately before the inspection devices 2, 4, 6, that is, the solder printing device 1 in the case of the printing inspection device 2, the mounting devices 3 A, 3 B in the case of the mounting inspection device 4, In the case of the soldering inspection apparatus 6, it is only necessary to display (output) the processing information of the reflow furnace 5, but if the processing related information of the previous process is further displayed as in the embodiment, the cause of the failure is displayed. There is a merit that it becomes possible to analyze more variously. Therefore, for example, when the present invention is applied to the soldering inspection apparatus 6, processing related information for all of the solder printing apparatus 1, the mounting apparatuses 3 </ b> A and 3 </ b> B, and the reflow furnace 5 may be displayed.

  (5) An LCD monitor may be provided in the solder printing device (or dispenser) 1, the mounting devices 3A and 3B, and the reflow furnace 5 to display the inspection related information and the processing related information.

  For example, in the embodiment described above, inspection-related information and the like may be displayed on the LCD monitor of the solder printing apparatus 1 and the mounting apparatuses 3A and 3B corresponding to the previous process of the mounting inspection apparatus 4. In this way, it is possible to identify the cause of the failure while referring to the processing related information in the vicinity of the processing device that caused the failure, so it is possible to identify the cause of the failure efficiently and efficiently. It becomes. In this case, for example, when a mounting failure occurs at an important mounting point of the substrate P, or when the content of the generated mounting failure is of a level that is not acceptable in terms of substrate performance, When the inspection result is a predetermined failure state, the back screen of the screen is set to a warning color (for example, red) on the LCD monitor of the solder printing apparatus 1 or the mounting apparatus 3A or 3B that has caused the failure, and the center of the screen Processing-related information and inspection-related information may be displayed on the part. Further, while the LCD monitor screens of the solder printing apparatus 1, the mounting apparatuses 3A and 3B and the reflow furnace 5 are blinked, the back inspection screen is used as a warning color in the mounting inspection apparatus 4, and processing-related information and inspection-related information are displayed at the center of the screen. Information may be displayed. In this case, an LCD monitor may be provided on the printing inspection apparatus 2 or the soldering inspection apparatus 6 to blink the screen.

  Further, when it is detected that the inspection result of the substrate P is in a predetermined defective state (a state that is unacceptable in terms of performance) in any of the inspection devices 2, 4 and 6, the solder printing device 1 and the mounting device You may make it stop the process of the board | substrate P in the apparatus which concerns on the defect among 3A, 3B and the reflow furnace 5, or all the apparatuses 1, 3A, 3B, 5. In this case, for example, a stop command is directly transmitted from the control device (control means) of the inspection devices 2, 4 and 6 in which a predetermined defective state is detected to the target devices 1, 3A, 3B and 5. Alternatively, a stop command may be transmitted from the control device of the inspection devices 2, 4, 6 to the devices 1, 3 A, 3 B, 5 via the central management device 8. When the operation of the devices 1, 3A, 3B, 5 is resumed, the remaining processing is continued for the substrate P for which processing is interrupted in the device devices 1, 3A, 3B, 5 unrelated to the processing failure. What should I do?

It is a schematic diagram which shows the component mounting line to which this invention is applied. 1 is a schematic plan view showing a mounting inspection apparatus. It is a front schematic diagram showing a mounting inspection device. It is a block diagram which shows the control system of a mounting inspection apparatus. It is a block diagram which shows the function structure of a control part main body. It is a figure which shows an example of the display control of the LCD monitor by a display control part. It is a flowchart which shows an example of the display operation control of the LCD monitor by a control part main body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cream solder printing apparatus 2 Printing inspection apparatus 3A, 3B Mounting apparatus 4 Mounting inspection apparatus 5 Reflow furnace 6 Soldering inspection apparatus 8 Central management apparatus 60 Control apparatus 61 Control part main body 68 Keyboard 69 LCD monitor 611 Main control part 612 Determination part 613 Display control unit

Claims (9)

Paste coater, by imaging a substrate which components are mounted by Rukoto by Risho management is performed on the processing unit including at least paste coating apparatus and component mounting apparatus of the component mounting apparatus and reflow apparatus the basis of the image An apparatus for informing the inspection result of an inspection apparatus for inspecting a substrate,
Output means for recognizing and outputting various information;
An output control unit that causes the output unit to output inspection related information including the inspection result of the substrate of the inspection apparatus and processing related information related to various types of processing in the processing apparatus of the substrate related to the inspection result ;
The component mounting apparatus is configured to take out components from a plurality of feeders of a component supply unit by a plurality of mounting heads equipped with nozzles for component suction and mount them on a substrate.
The output control unit outputs a component mounting failure part and a defect content as the inspection related information, and processing information related to paste application to the mounting defective part by the paste application device and the component mounting apparatus as the processing related information. inspection result notification device according to claim Rukoto to output the processing information about the component mounting to the mounting failure site by. In the inspection result notification device according to claim 1,
The paste coating apparatus is a printing apparatus comprising a mask and a squeegee that slides along the mask at a predetermined speed to apply solder to the substrate while expanding the solder on the mask.
Processing information relating to the paste coating, inspection result notification device, wherein the squeegee speed der Rukoto when sliding along the squeegee on the mask. In the inspection result notification device according to claim 1 or 2 ,
Processing information on the implementation of the component, the nozzle involved in the implementation of parts, inspection results notification apparatus according to claim information der Rukoto regarding at least one of the mounting heads and feeder. In the inspection result notification device according to any one of claims 1 to 3,
It said output means comprises a display device, said output control means check result notification device, characterized in that to display the inspection-related information and process related information on the same display screen of the display apparatus. In the inspection result notification device according to any one of claims 1 to 3,
The output unit includes a display device and a printer device, and the output control unit displays inspection related information on the display device, and records at least the processing related information on a recording medium of the printer device. Inspection result notification device. In the inspection result notification device according to any one of claims 1 to 5,
An output operation means for outputting the processing related information;
The output control means, the inspection result notification device, characterized in that to output the processing-related information only when there is operation by the output operation means to said output means. A processing device including at least the paste coating device and the component mounting device among the paste coating device, the component mounting device, and the reflow device, and a substrate on which the component is mounted by performing processing by the processing device, and imaging the image A mounting system comprising: an inspection apparatus that inspects the board based on the inspection result notification apparatus according to any one of claims 1 to 6 ;
Implementation system, characterized in that said output means of said inspection result notification device is kicked set to at least one of the test devices or processing units. The mounting system according to claim 7,
The output means of the inspection result notification device is a display device, and the output control means displays the inspection-related information and processing-related information on the display device, and displays a warning background with a predetermined background. mounting system and said to Rukoto. Paste coater, a processing unit including at least paste coating apparatus and component mounting apparatus of the component mounting apparatus and reflow device, a substrate which components are mounted by Rukoto processing is performed by the processing apparatus to the image by imaging an inspection apparatus for inspecting the substrate based, a mounting system that includes a test result notification device according to any one of claims 1 to 6,
A mounting system comprising: control means for controlling the processing device to stop processing by the processing device when an inspection result by the inspection device is in a predetermined defective state .

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