JP2007081318A - Method and device for outputting inspection result, program for outputting inspection result, and record medium on which program for outputting inspection result is recorded - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for outputting inspection result which can be used for identifying a cause when failure occurs. <P>SOLUTION: In the method for outputting inspection result in a printing step for an electronic component mounting device which keeps a component mounted on a substrate, for example, inspection result information such as an area printed with a land, which is an item to be targeted for inspection in the printing step, is prepared together with its identification number (S11), related information such as dimension of the land in X and Y directions related to the land which is an item to be targeted for inspection result is prepared (S12), and the related information is output together with the inspection result information (S13). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inspection result output method, an inspection result output device, an inspection result output program, and a recording medium on which an inspection result output program is recorded, in an electronic component mounting apparatus for mounting electronic components on a printed circuit board, The present invention relates to an inspection result output method, an inspection result output device, an inspection result output program, and a recording medium on which an inspection result output program is recorded, which can be used for specifying a factor when a defect occurs.

  In a conventional electronic component mounting process, a system that can be used to investigate the cause when a defective substrate occurs is disclosed in, for example, Japanese Patent Laid-Open No. 9-214130 (Patent Document 1). According to this publication, production result information and inspection result information of each process constituting the mounting process are managed for each substrate, and inspection information and production result information can be obtained simultaneously for each substrate.

  Another failure factor analysis method in the mounting process is disclosed in, for example, Japanese Patent Laid-Open No. 6-196900 (Patent Document 2). According to this publication, inspection results in each of the printing process, mounting process, and reflow process that constitute the mounting process are compared with each other for each printed circuit board that is the mounting target, Disclosed is a mounting process defect factor analysis method capable of calculating the degree of influence of each process on a final defect based on a quality defect related rule indicating the possibility of occurrence and automatically predicting the cause of the defect.

Further, a system capable of recording the mounting process result performed in each process constituting the mounting process as image data and visually identifying the cause of the defect after manufacturing is described in Japanese Patent Application Laid-Open No. 2004-361145 (Patent Document 3). Yes.
JP-A-9-214130 (paragraph number 0006, etc.) JP-A-6-196900 (paragraph number 0009, etc.) JP 2004-361145 A (paragraph number 0010 etc.)

  A system useful for failure factor analysis in a conventional electronic component mounting apparatus is configured as described above. According to Patent Document 1, although there is a description that inspection information and production result information can be obtained simultaneously for each substrate, the inspection object is for each substrate, and what information is used to identify defective products. There is no mention of whether to investigate the cause.

  Further, according to Patent Document 2, a defect is predicted based on a quality defect-related rule recorded in advance. However, there is no description on how to obtain the quality defect-related rule. In addition, here, all inspection targets for each process are substrates, but actually, the inspection targets for each process are different. In other words, the actual inspection object is a land in the printing process, a component body in the mounting process, and a lead and a part in the reflow process. Is not easy. In addition, since each inspection machine tries to minimize the amount of data due to the memory capacity of the apparatus itself, in general, the inspection result data includes only data for specifying an inspection object and the inspection result data. There is no idea of adding other data.

  Further, according to Patent Document 3, since the images in the inspection apparatus in each process are displayed in a comparable manner, it is possible to easily determine whether the product is good or bad visually. However, only by comparing the images in each process, a defective product is generated. The cause may not be identified.

  The present invention has been made paying attention to the problems as described above, and can be used for specifying a factor when a defect occurs, an inspection result output method, an inspection result output device, an inspection result output program, and an inspection result An object is to provide a recording medium on which an output program is recorded.

  An inspection result output method for outputting an inspection result in an inspection device for an electronic component mounting apparatus that mounts a component on a substrate through a plurality of steps according to the present invention is an inspection target item in one step among the plurality of steps. Preparing the inspection result information, preparing related information related to the inspection result target item, and outputting the related information together with the inspection result information.

  The inspection result information of the inspection target item in one of the plurality of processes is output together with related information related to the inspection result target item. Therefore, when a defect occurs in the inspection target, the inspection result information The cause can be estimated with reference to related information.

  As a result, it is possible to provide an inspection result output method that can be used for specifying a factor when a defect occurs.

  The related information may be substrate design information or program information of a device that performs work in one process.

  Preferably, the method includes a step of outputting together inspection result information of inspection target items in other processes other than one process, and the inspection target items for each of the processes constituting the plurality of processes are different.

  Further, the inspection result information and the related information may be output separately or may be output in an integrated manner.

  In another aspect of the present invention, the inspection result output apparatus is an inspection result output apparatus that outputs an inspection result in the process in each step of the mounting apparatus that mounts a component on a substrate through a plurality of processes. Inspection items for each process are different. The inspection result output device includes an output unit that outputs the inspection result information of the inspection target item in the process and the related information related to the inspection result target item together.

  Because the inspection result information of the inspection target item in the process and the related information related to the inspection result target item are output together, when a defect occurs in the inspection target, the inspection result information is combined with the relevant information of the inspection. The cause can be estimated.

  As a result, it is possible to provide an inspection result output device that can be used for specifying the factor when a defect occurs.

  Preferably, the information processing apparatus further includes input means for inputting information from the board design apparatus having board design information, and the related information is input from the board design apparatus.

  More preferably, the inspection result output devices provided in each process are connected to each other, the input means inputs the inspection result information from the process other than the process and the related information, and the output means does not include the process. The inspection result information of other processes and the related information are output together, and the inspection target items for each process are different.

  The output means may output the inspection result information of the process and the related information separately from the inspection result information other than the process and the related information, or may output the integrated information.

  In another aspect of the present invention, an inspection result output program outputs an inspection result output in each step of a mounting apparatus that mounts a component on a substrate through a plurality of steps. Operate as a device. The inspection result output program causes the computer to function as an output unit that outputs the inspection result information of the inspection target item in the process and the related information related to the inspection result target item.

  In still another aspect of the present invention, a computer-readable recording medium recording an inspection result output program is provided in each step of a mounting apparatus that mounts a component on a substrate through a plurality of steps. An inspection result output program that is operated as an inspection result output device that outputs the inspection results in is recorded. The computer-readable recording medium causes the computer to function as output means for outputting the inspection result information of the inspection target item in the process and the related information related to the inspection result target item.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an overall view showing an electronic component mounting apparatus to which an inspection result output method according to the present invention is applied. Referring to FIG. 1, electronic component mounting apparatus 10 includes a printing process, a mounting process, and a reflow process arranged from the upstream side to the downstream side of the substrate on which the electronic component is mounted. Each process is connected by a conveyor, a robot, and other transfer devices. Each process is provided with an apparatus for performing the process.
In the printing process, a printing machine 11 for printing lands on a substrate and a post-printing inspection machine 12 for performing an inspection after printing are provided. In the mounting process, a mounter 13 for mounting a component on a substrate and a post-mount inspection machine 14 for performing an inspection after mounting are provided. In the reflow process, a reflow furnace 15 for soldering the terminal of the component to the land and an after-reflow inspection machine 16 for performing an inspection after soldering are provided. The post-printing inspection machine 12, the post-mounting inspection machine 14, and the post-reflow inspection machine 16 are connected to a CAD device 18 and a server 30 that have designed a board via a network 17 such as a LAN, respectively. Data can be sent and received. Therefore, the board design information of the CAD device 18 can be input to each inspection machine 12, 14, 16 and the inspection information of each inspection machine 12, 14, 16 is between the inspection machines 12, 14, 16 and the server 30. They can send and receive each other. Each of these inspection machines operates as an inspection result output device.

  FIG. 2 is a block diagram illustrating a configuration of the post-printing inspection machine 12 as an example of the inspection machines 12, 14, and 16. The other inspection machines 14 and 16 basically have the same configuration. Referring to FIG. 2, post-printing inspection machine 12 is basically the same as a personal computer (hereinafter referred to as “PC”), and is connected to CPU 21 for controlling the entire inspection machine and to CPU 21 via interface 22. ROM, RAM (not shown), display device 23, hard disk 24, keyboard 25, mouse 26, communication device 27, and the like. The post-printing inspection machine 12 is connected to the other inspection machines 14 and 16, the CAD device 18, and the server 30 via the communication device 27 so as to be able to transmit and receive. Here, the display device 23 can operate as output means, and the communication device can operate as input means.

  FIG. 3 is a flowchart showing the operation of the post-printing inspection machine 12 shown in FIG. With reference to FIG. 3, the post-printing inspection machine 12 first checks an inspection target item such as a land ID number for specifying each land to be printed in the printing process, and an actual for each inspection target item. Inspection result information such as the print area is obtained from an inspection device (not shown) (step S11, hereinafter, steps are omitted). Next, related information related to the inspection target item, such as a land, is obtained from the CAD device 18 having design information of the board (S12). Here, the related information refers to, for example, a horizontal (X) direction dimension and a vertical (Y) direction dimension for each land. The post-printing inspection machine 12 prepares and stores such information in a storage device such as the hard disk 24 so that it can be output at any time. Next, in response to a request from the inspector (YES in S13), the inspection result information and the related information related thereto are output to the display device 23 (S14). This output is not limited to display on the display device 23, but may be output to a printer or the like (not shown). Specific output contents will be described in detail below.

Although the post-printing inspection machine 12 has been described as an example here, the other inspection machines are basically the same except that the items to be inspected, the inspection result information, and the related information are different.
(1) 1st Embodiment Below, embodiment of this invention implemented in the inspection machine which has said structure is described in order. Here, the case where only the output example of the inspection result of the inspection machine in one process constituting the electronic component mounting apparatus 10 is used will be described.

  Table 1 shows an example of inspection result output displayed on the display device 23 by the post-printing inspection machine 12. Since data such as inspection results are output in such a table format, description will be made using a table. With reference to Table 1, the output information of the post-printing inspection machine 12 should be printed in the printing process and the land identification number (ID) that identifies the land to be printed, which is the inspection target item in the printing process. Of the area, area information (indicated as “area” in the table) as inspection result information indicating the proportion of the area actually printed, and each land as related information on the land to be inspected Land X size and Land Y size indicating dimensions in the X (horizontal) direction and the Y (vertical) direction. Here, the land X size and land Y size information is board design information, which is held by the CAD device 18, and is input from there through the network 17.

  The inspection result information that the conventional post-printing inspection machine has was only the land ID that specifies the inspection target item and the area information that indicates the inspection result, whereas in the embodiment of the present invention, the land Related information related to the inspection target item such as the X size and the land Y size is added. Since not only the inspection result information but also the X-direction and Y-direction sizes, which are related information of the inspection target item, are output, it is possible to compare by the size of the printed land.

  Next, how to use the output result will be described. Referring to Table 1, the land having a low area of 60% as an inspection result (with land IDs of 0001 and 0003) is related information, and the land size is other than the dimensions in the X and Y directions of the land. It can be seen that it is smaller than the land (5 mm in both X and Y directions). That is, it can be seen that there is no problem in other lands (land IDs 0002 and 0004) having a large printed area other than this land. From this, it becomes possible to analyze the cause of failure that a mask in the printing process is too thick and a land having a small land size is due to the fact that the solder cannot be removed.

  Note that the inspection result output may be displayed not as a table but as a diagram. FIG. 4 is a diagram showing a display example when the land is represented by the position on the substrate 35 using the land position information together with the land size and area information as shown in Table 1. Here, defective lands 37 having a printed area of a certain size or less are displayed in black, and normal lands 36 are displayed in white. Referring to FIG. 4, when the position of the land on the substrate is specifically understood as described above, when a land of a certain size is extracted, the land on the substrate is originally printed under the same conditions. It can be seen that the defective lands 37 are concentrated only in some places. From this information, it can be inferred that the cause of underprinting is that the conditions differ depending on the location, such as the level of the substrate and the squeegee being insufficient (dirt on the lower mold, poor setting of the squeegee).

  Next, another example will be described. Table 2 shows output information of the post-mounting inspection machine 14 in the mounting process. Referring to Table 2, in the mounting process, since the inspection object is a part, unlike the printing process, the part ID for identifying the part, the part position information, and the part shift amount that is the inspection result in this process As the related information, the part type is output. The part type information is input from the CAD device 18. Here, the component displacement amount is represented by (X, Y) indicating the displacement amount in the horizontal and vertical directions in mm.

  Conventionally, there is no information regarding the part type. For example, even if the component deviation amount (0.3, 0.5) (mm) of the part ID 0001 is seen, is this a problem peculiar to this part or It was impossible to determine whether the problem occurred in other parts. However, in this embodiment, by outputting the information of “component model” related to the component deviation amount that is the inspection target item together with the component deviation amount that is the inspection result information, the component deviation amount of the same component type is output. It becomes possible to compare with. In this example, since a defect in the Y direction occurs only in the component ID 0001 and not in the component ID 0003 having the same component model, it is not a problem peculiar to the component model but another factor. I understand that.

As described above, in this embodiment, in one process of the electronic component mounting apparatus 10, information related to the inspection target item is output together with the inspection result of the process. Analysis becomes possible.
(2) Second Embodiment Next, a second embodiment of the present invention will be described. In the above embodiment, the content output as the inspection result is the inspection result information and the related information in only one step of the mounting process of the electronic component mounting apparatus 10, but in this embodiment, the mounting process The inspection result information of a plurality of processes is associated and output simultaneously. As described above, the mounting process includes a printing process, a mounting process, and a reflow process. Since there are a plurality of combinations of a plurality of processes, some examples will be described below.

  In addition, the inspection machine that outputs the inspection results in a plurality of processes as described above basically receives and outputs information from the upstream inspection machine by the downstream inspection machine. May do. Moreover, in this case, each inspection machine 12, 14, 16 transmits the inspection results of a plurality of processes to the server 30 via the network 17, and the server 30 checks the inspection result information and the related information based on the transmitted information. It is also possible to prepare an inspection result associated with the above and download and output it in an inspection machine that requires the output.

  Further, as will be described later, the items to be inspected and the inspection result information in the printing process, the mounting process, and the reflow process are different, and naturally the formats of these information are also different.

(I) When associating the inspection result of the printing process with the mounting process A
Table 3 shows an output example of inspection result information when the inspection results of the printing process and the mounting process are associated with each other.

  Referring to Table 3, here, the land ID, the printing area, which is the inspection target item in the printing process, and the part ID, the part position, the component deviation, which are the inspection target items in the mounting process, and the related information Output including model.

  In this example, it is assumed that the component ID 0101 finally becomes defective. Therefore, the component ID 0103 having the same component type (AH001) as the component ID 0101 is compared including the inspection result information and related information. As a result of this comparison, even in the case of the same part type, in the case of the part ID 0101, since the printing area is as small as 30% (the land ID is 0001), it is possible to estimate the cause of this part shift. It is. Furthermore, since one of the two land areas is normal (printing area 100%) and only one of them is abnormal (printing area 30%), it can be estimated that this is a cause unique to this land. There are various causes for the decrease in the printing area, such as improper setting of the printing pressure, low solder, hardened solder, clogged mask holes, etc. Therefore, it can be estimated that this is a land-specific cause such as “clogging of mask holes”.

  Thus, not only the inspection result information of the mounting process but also the inspection result of the printing process and the component type which is the related information are combined into the inspection result information to estimate what is the cause of the defective part. It becomes possible.

(Ii) When associating the inspection results of the printing process and the mounting process B
Table 4 shows an example of the inspection result output when the inspection results of the printing process and the mounting process are related by another method.

  Referring to Table 4, here, unlike the case of Table 3, the output of the inspection result includes the part outline information, the printing process inspection result includes the printing deviation amount, and the mounting process inspection result “bridge”. Judgment of the presence or absence of. For the sake of simplicity, the determination of component deviation and bridge is indicated by “◯” when there is no problem (good) and by “X” when there is a problem (defective). The display of this determination is the same in the following.

  Here, the bridge means that the solder adheres so as to short-circuit between the electrodes of the component, the component deviation means that the component or the solder is displaced from the land, and the wetting defect is the solder and This means that there is a defect in the bonding between the land or solder and the component electrode. Fillet abnormality means that the amount of solder is too much or too little (the contour line when the solder is viewed from the cross section is not a clean mountain shape), and no parts means that no parts exist. Say.

  Here, the information of the component external shape is expressed by the land size in the printing process in which the dimension in the X direction and the dimension in the Y direction are arranged side by side in units of 0.1 mm. That is, if the dimension of the printed land in the X direction is 1.0 mm and the dimension in the Y direction is 0.5 mm, the component outer shape is 1005.

  In this example, it is assumed that the above inspection result is obtained. In this example, good / bad is compared for each part outline, that is, for each land size, instead of the part type. As a result, in the case where the part external shape is represented by 1005, a defect in the bridge occurs when the part type is TT001, and no defect occurs in TT002. Furthermore, when looking at the printing area, only the part model with TT001 has a stable value (158% and 80%, 154% and 57%), so the part model has some cause for printing with TT001. Can be considered.

  Possible causes of overprinting include improper setting of the printing pressure, contamination of the dust between the mask and the substrate, insufficient solder viscosity, defective mask design, and damage to the mask, as in this embodiment. By providing the relevant information of the part outline in the output of the inspection result, it can be determined by comparison with that of the same part outline. That is, in this example, no problem occurs in the part type TT002 even with the same part outline, and therefore, the mask design defect or damage is compensated by complementing the information that the same problem has occurred in other lots. If it is a defect peculiar to this lot, it can be easily assumed that it is caused by contamination of dust.

  In addition, for parts having an external shape of 0603 (X-direction dimension = 0.6 mm, Y-direction dimension = 0.3 mm), there is no bridging defect in the part type TM001 and no defect in the part type TM002. Thus, it can be seen that there is some problem with the part model TM001. In the case of this example, the printing deviation amount is equal to the part type TM001 and normal, and the part deviation amount (part mounting position) is also normal. Looking at the printing area, there is no difference between good and bad despite the occurrence of a bridge. The cause is that the component is pushed too much by the mounter 13 due to adhesion of dust on the nozzle, etc. (in the vertical direction) It is possible to think that the solder is crushed due to the force applied.

  This cause can be investigated by obtaining information on the nozzles of the mounter 13.

(Iii) Case where inspection results of printing process and reflow process are associated FIG. 5 is a diagram showing the shape of a part 41 and lands 42a to 42h printed for terminals of the part 41 in this case. As shown in FIG. 5, there are 8 printed portions of the component 41, and the shape thereof is either vertically long (42c, 42d, 42g, 42h) or horizontally long (42a, 42b, 42e, 42f) depending on the terminal direction. It is.

  Table 5 shows an example of inspection result output when the inspection results of the printing process and the reflow process are associated as one data with respect to the component 41 shown in FIG.

  Referring to Table 5, here, the component ID, the component model, the print area and print deviation information for each land as post-print inspection result information, and the inspection result information after reflow are as follows. Output together with land sizes in X and Y directions. As post-reflow inspection result information, there are items of bridge, poor wetting, fillet abnormality and no parts, and the display of the determination is the same as in the previous embodiment.

  In the case of this example (part type is TT011), in the post-reflow inspection results, the wetting is poor in the case of the land in the horizontal direction with X = 0.5 mm and Y = 0.1 mm, but with other shapes. It can be seen that there are more compared to the land.

In this case, if the printing direction is the operation direction of the squeegee and this is the left and right (X) direction, the above information indicates that the cause of this failure is a gap between the substrate and the mask, such as insufficient printing pressure by the squeegee. It can be estimated that it is not. Note that this determination assumes that there is knowledge that a land that is susceptible to an influence when there is a gap is a land that is long in the direction of movement of the squeegee.
(3) Third Embodiment Next, a third embodiment of the present invention will be described. In this embodiment, the inspection results of all three steps of the electronic component mounting apparatus 10 are associated and output simultaneously.
(I) When associating inspection results of all processes A
Table 6 shows an example of an inspection result output when the three inspection results of the printing process, the mounting process, and the reflow process are associated with each other.

  Referring to Table 6, here, the component type and the component direction indicating the direction in which the component is attached to the board are input from the CAD device 18 as related information, and are output together with the inspection results in each process. As the inspection results, printing area and printing misalignment are output in the printing process, component misalignment and bridge are output in the mounting process, bridge, wetting failure, fillet abnormality and no parts are judged in the reflow process, and the result is output Is done. In this case as well, ◯ represents good and x represents bad.

In this example, from the inspection result after reflow, the occurrence of the fillet abnormality occurs only in the part type TT012 whose part direction is 0 °. Here, it can be seen from the post-printing inspection result information that there is no problem in the printing process and that the component displacement amount is large (0.3 mm or more) in the mounting process. From this, it can be estimated that the component suction nozzle of the mounter 13 in the mounting process has a weak suction force in a specific direction, and that such a component shift has occurred.
(Ii) When associating inspection results of all processes B
Table 7 shows an example of an inspection result output when the three inspection results of the printing process, the mounting process, and the reflow process are associated in another manner.

  Referring to Table 7, here, the part type is input from the CAD device as the related information is the same as in Table 6, but the rotation angle of the component at the time of mounting is also the related information. The difference is that the relative position from the center of the component is output as the output point and the inspection result after printing.

  The relative position information from the component center will be described. FIG. 6 is a plan view visually showing land position information used in the printing process. Here, eight lands 52 a to 52 h are provided in the component 51. The component center coordinates of the component 51 are T (ta, tb), and the center coordinates of the land 52a are (Aa, Ab). In this case, the relative position information of the land 52a from the component center T is represented by (Aa-ta, Ab-tb). The (x, y) coordinates are output as relative position information of the land position in Table 7. The same applies to the other lands 52b to 52h. In the land position information, the reference numerals of the lands shown in FIG. 6 are also displayed. Here, too, ◯ represents good and x represents bad.

  By using the relative position information, it can be seen that when the component ID is 001, bridges frequently occur in the upper right area (land numbers 52a and 52h). On the other hand, in the case of the component ID 002 rotated by 90 °, a bridge is generated in the lower right region (52b, 52c), but the amount of displacement of the mount is small and there is no problem. The cause of the failure can be assumed as if the solder is crushed because the parts are sucked diagonally at the time of suction.

  Here, as shown in Table 8 below, if the corresponding print area information is provided for each land in addition to the information in Table 7, a defect appears even though “print area is normal”. Therefore, the cause can be more strongly estimated that it is due to the fact that the solder is crushed because the parts are sucked diagonally at the time of picking up the parts suction nozzle, and more detailed cause estimation is possible. It becomes possible.

(4) Fourth Embodiment In the above embodiment, when the inspection results in a plurality of processes are output, the information output to each inspection machine 12, 14, 16 is integrated from the plurality of processes. And output all in one. However, for this output, the inspection results in the respective steps may be individually called up as necessary and output separately. An example of this case will be described below.

  Table 9 shows an example in which the inspection results in the printing process and the reflow process are individually output, and corresponds to Table 3 in the case where the inspection results are output integrally as described in the second embodiment. Table 9 (A) represents the inspection results in the printing process, and Table 9 (B) represents the inspection results in the mounting process.

  Referring to Table 9 (A), the post-printing inspection machine 12 has a land ID that identifies a land, a component ID, a component model, a component position, and a printing area that can be output. Further, referring to Table 9 (B), the post-mounting inspection machine 14 has a component ID for identifying a component, a component model, a component position, and component displacement information.

For example, in the post-mounting inspection machine 14, the information shown in Table 9B is displayed to recognize the component deviation of the component ID 0101 and to identify the cause, the table 9 of the post-printing inspection device 12 has. There is a case where it is desired to see information shown in (A). At this time, this information is input via the network 17, and both are displayed together on the display device 23 of the inspection machine 14 after mounting. Here, by collating the part type information that both the inspection machines 12 and 14 have in common, it is possible to estimate the cause of the defect of the parts as described in Table 3 above.
(5) Fifth Embodiment In the above embodiment, the case has been described in which the inspection result information of the inspection machine in each step and the design information of the substrate from the CAD device are output in association with each other. You may output including the program information of the apparatus which performs the operation | work in each process like the printing machine 11, the mounter 13, and the reflow furnace 15. FIG. Here, this case will be described.

  Table 10 shows an example in the case where the post-mounting inspection result information and the related information from the program information of the mounter 13 are associated and output individually in the mounting process.

  Referring to Table 10 (A), the inspection result information in the mounting process includes a component ID, a component model, a component position, and a component shift. On the other hand, referring to Table 10 (B), the related information includes a component ID, a component model, component position information input from the CAD device 18, and a mount device used by the mounter 13 when mounting the component. Each piece of identification information (here, the number of each apparatus) for individually identifying the feeder or nozzle actually used from among the feeders and nozzles is included. Information on these mounting devices is included in the program information of the mounter 13 and is input from there.

  In this example, it can be seen from Table 10A that a large component shift (0.3 mm in the X direction) occurs in the component ID 0101. Since the component model is AH001 with reference to the component model of this component, it is compared with the component ID 0103 which is the same component model as this component. At this time, Table 10 (B) is also referred to. The component ID 0101 and the component ID 0103 are conveyed by the same feeder (feeder number 30), but the nozzles used are different between A1 and A3. In the component ID 0103, since there is no component deviation, it can be estimated that there is a problem with the nozzle A1 that has conveyed the component ID 0101, not the feeder problem but the nozzle problem.

  Here, the case where the inspection result information in the mounting process and the information input from the CAD device and the mounter are individually output has been described. However, the present invention is not limited to this, and as shown in the second and third embodiments. These may be integrated and output.

  Moreover, although the example in the mount process was demonstrated, you may apply in arbitrary processes.

  In the above embodiment, an example has been described in which information related to the inspection result in each process of the electronic component mounting apparatus is obtained from the CAD apparatus and output together. In addition, it may be possible to output the “lot number” of the mounted component. By doing so, it is possible to see changes in the degree of occurrence of defects on a lot basis. As a result, it is possible to detect a lot defect of parts.

  In this case, output information includes, for example, the part type AH001, the defect occurrence rate of lot number 20050810 = 0.01 (when the total number is 10,000 and the number of defect occurrences is 100), the part type AH001, and the lot number. Defect occurrence rate of 20050820 = 0.1 (when the total number is 10,000 and the number of defect occurrences is 1000) or the like.

  Further, in the above-described embodiment, the part type may not be a part type that is actually used, which is called a standard type. In such a case, if this inspection result output method is linked with a part management computer in a factory, it can be used to identify the cause of a defect when converted to a part type to be originally used. Here, the standard model is a relatively simple and general-purpose part such as a resistor or capacitor, and the parts manufactured by multiple manufacturers are not the specific part model for each manufacturer. This is the type when only is specified.

  This example will be described below. For example, the parts ID0101 and ID0103 are both resistors (specification: resistance value 1.5 KΩ, rating: power 10 W, size 5 mm × 1 mm, etc.), and the resistance of this specification is the type AA01 of company A and the type B of company B Suppose that there is -999. At the time of design, a virtual model, for example, X-15K is used as a standard model. That is, X-15K is used as CAD data. Which part of AA01 or B-999 is used at the time of mounting is determined by judgment of a factory (for example, a purchasing department). At this time, a specific part type of the manufacturer used at the time of mounting is stored in the factory part management computer.

  In the mounting process, AA01 has been used until now, but it may be changed to B-999 at some point. This is due to reasons such as changing to parts of a company that is more advantageous in terms of delivery date, cost, reliability, etc., or digesting factory stock parts. In the transition period of this change, AA01 and B-999 are mixed. That is, there are cases where the component ID 0101 is AA01, the component ID 0103 is B-999, or the first half of the lot is AA01, but the second half is B-999.

  In this case, even if the cause of failure is unknown when the inspection result is displayed in the standard model X-15K, AA01 and B-999, which are actually used, are used as separate parts, and specific parts of each manufacturer If the model is displayed, the cause may be known. For example, if a defect occurs only in B-999, it can be determined that this component is the cause.

  Further, in this case, there is an advantage that it is sufficient to describe the standard model instead of the model of the part actually used for inputting to the CAD apparatus.

  Note that the CAD apparatus design information used here is not limited to information on one board type. It is also possible to compare the quality using the same information for a plurality of board types (types) having the same design information. For example, the problem of a board | substrate can be pinpointed by calculating | requiring the defect rate and comparing it with the same components. Moreover, although the board | substrate is the same and the printing area is the same, it is producing with the different line, and the problem of a line can be specified by adding the information which specifies the line, and comparing. As a result, when the same design information is applied in various cases, it is possible to specify in advance how much the defect rate will be in each process. In this case, even if there is no connection between the processes, it is possible if bidirectional cooperation with the information of the CAD device can be achieved.

  In the above embodiment, when the inspection result information and related information are displayed together on the inspection machine of each process, the inspection result information of other processes is input to the inspection machine via the network. However, the present invention is not limited to this, and the inspection machine in each process may output the inspection result of only that process as before, and a personal computer or the like may be provided in the vicinity of the inspection machine. In this case, the personal computer holds the inspection result information from the inspection machine in the process and the information from the CAD apparatus, and may display desired information in combination as necessary. In this way, necessary information can be displayed locally at all times, and no problem occurs even if the network fails.

  In the above-described embodiment, the case where the inspection machine in each process is a dedicated device has been described. However, the present invention is not limited to this, and the inspection machine is a general-purpose personal computer, and all the above operations are programmed, It may be operated as the program and used as an inspection machine. In this case, the program may be provided on a recording medium such as an optical disk or a hard disk, or may be downloaded from a server on the network via a network.

  As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to the thing of embodiment shown in figure. Various modifications and variations can be made to the illustrated embodiment within the same range or equivalent range as the present invention.

It is a block diagram which shows the whole structure of an electronic component mounting apparatus. It is a block diagram which shows the structure of the inspection machine in each process. It is a flowchart which shows the operation | movement which the inspection machine performs in each process. It is a figure which shows the example which displayed the information of the land as a layout drawing of a land in a printing process. It is a figure which shows the relationship between the components and land in the printing process of one embodiment. It is a figure which shows the relationship between the components and land in the printing process of other embodiment.

Explanation of symbols

10 electronic component mounting apparatus, 11 printing machine, 12 post-printing inspection machine, 13 mounter, 14 post-mounting inspection machine, 15 reflow furnace, 16 post-reflow inspection machine, 17 network, 18 CAD device, 21 CPU, 22 interface, 23 display Device, 24 hard disk, 25 keyboard, 26 mouse, 27 communication device, 30 server.

Claims (13)

In an inspection device for an electronic component mounting apparatus that mounts a component on a substrate through a plurality of steps, an inspection result output method for outputting an inspection result,
Preparing inspection result information of an inspection target item in one of the plurality of steps;
Preparing related information related to the inspection result target item;
Outputting the related information together with the inspection result information. The inspection result output method according to claim 1, wherein the related information is design information of the substrate. The inspection result output method according to claim 1, wherein the related information is program information of an apparatus that performs work in the one step. Including the step of outputting together the inspection result information of the inspection target item in other processes other than the one process,
The inspection result output method according to claim 1, wherein items to be inspected for each step constituting the plurality of steps are different. The inspection result output method according to claim 1, wherein the inspection result information and the related information are output separately. The inspection result output method according to claim 1, wherein the inspection result information and the related information are output in an integrated manner. In each step of the mounting apparatus that mounts components on the substrate through a plurality of steps, an inspection result output device that outputs the inspection result in the step,
An inspection result output device including an output unit that outputs the inspection result information of the inspection target item in the process and the related information related to the inspection result target item. Further comprising input means for inputting information from the board design apparatus having the design information of the board;
The inspection result output apparatus according to claim 7, wherein the related information is input from the board design apparatus. The inspection result output devices provided in the respective steps are connected to each other,
The input means inputs inspection result information and related information from a process other than the process,
The output means outputs the inspection result information of other processes other than the process and the related information together,
The inspection result output device according to claim 7, wherein items to be inspected for each process are different. 8. The inspection result output device according to claim 7, wherein the output means outputs the inspection result information of the process and the related information separately from the inspection result information other than the process and the related information. 8. The inspection result output device according to claim 7, wherein the output means outputs the inspection result information of the process and the related information in an integrated manner with the inspection result information other than the process and the related information. An inspection result output program for operating a computer as an inspection result output device for outputting an inspection result in a process in each step of a mounting apparatus for mounting components on a substrate through a plurality of processes,
An inspection result output program that causes the computer to function as output means for outputting inspection result information of an inspection target item in the process and related information related to the inspection result target item. Computer-readable recording of inspection result output program that operates a computer as an inspection result output device for outputting inspection results in each step of a mounting apparatus that mounts components on a substrate through a plurality of steps Recording medium,
A computer-readable recording program for outputting an inspection result, which causes the computer to function as output means for outputting the inspection result information of the inspection target item in the process and the related information related to the inspection result target item. Recording medium.

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