JP2007149817A - Mounting line, its managing method and inspection machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce occurrence of defects in a mounting state in a mounting line comprising a mounting machine and an inspection machine. <P>SOLUTION: When respective components are loaded on respective substrates in the mounting machine, a mounting condition is stored. When abnormality is detected in a mounting state of the respective components loaded on the respective substrates in the inspection machine, the mounting condition is asked for the mounting machine when the component is loaded. The mounting condition supplied from the mounting machine is reported in the inspection machine. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mounting line for mounting an electronic component on a substrate, a management method for the mounting line, and an inspection machine for inspecting the mounting state of the electronic component.

  2. Description of the Related Art Conventionally, in a mounting line for mounting electronic components on a substrate, the mounting state of each electronic component is inspected by an inspection machine arranged in a subsequent process of the mounting machine, and the outflow of defective substrates is prevented.

Further, in Patent Document 1 below, a narrower range of monitoring criteria is provided within the acceptable range for determining a non-defective product, and the working status of the mounting machine is determined based on inspection data outside the range of the monitoring criteria. A method for predicting the occurrence of a defect has been proposed.
JP-A-6-21700 (paragraphs 0013 to 0016)

  However, in the mounting line shown in Patent Document 1, it is difficult to elucidate the cause of the failure even if the occurrence of the failure in the mounting machine can be predicted, and there is room for improvement in reducing the occurrence of the failure. there were.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a mounting line, a mounting line management method, and an inspection machine that can reduce the occurrence of defective mounting states.

  The present invention provides the following means.

[1] A mounting line including a mounting machine and an inspection machine,
The mounting machine is
Component mounting means for mounting components on a substrate;
Mounting condition storage means for storing mounting conditions when each component is mounted on each substrate;
Mounting condition transmitting means for transmitting the mounting condition in response to an inquiry request from the inspection machine,
The inspection machine
Inspection means for inspecting the mounting state of each component mounted on each substrate by the mounting machine;
When an abnormality is detected in the mounting state, an inquiry transmission unit that transmits an inquiry request for a mounting condition when the component is mounted to the mounting machine;
A mounting system comprising: an informing means for informing the mounting condition transmitted from the mounting machine.

  [2] The mounting system according to [1], wherein the notifying unit notifies the contents of the detected mounting state abnormality together with the mounting condition.

  [3] The mounting system according to [1] or [2], wherein the inspection machine includes a state change determination unit that determines an abnormality in accordance with a change in a mounting state of each component over a plurality of substrates.

[4] Including a plurality of mounting machines,
The mounting condition transmission means of each mounting machine is any one of the preceding items 1 to 3 that transmits the mounting condition together with information identifying the mounting machine in response to the inquiry request regarding the component mounted on the mounting machine. The mounting system described in.

  [5] The mounting line according to any one of [1] to [4], wherein the inspection machine includes a stop command transmission unit that transmits a stop command to the mounting machine depending on the type or degree of abnormality in the mounting state.

[6] A method for managing a mounting line including a mounting machine and an inspection machine,
When mounting each component on each board in the mounting machine, remember the mounting conditions,
When an abnormality is detected in the mounting state of each component mounted on each board in the inspection machine, the mounting machine is requested to provide mounting conditions when the component is mounted,
A mounting line management method, wherein a mounting condition provided from the mounting machine is notified.

[7] An inspection machine for inspecting the mounting state of each component mounted on each board by a mounting machine,
When an abnormality is detected in the mounting state, an inquiry transmission unit that transmits an inquiry request for a mounting condition when the component is mounted to the mounting machine;
An inspection machine comprising: an informing means for informing a mounting condition transmitted from the mounting machine in response to the inquiry request.

  According to the above invention [1], since the mounting condition of the component in which the abnormality is detected in the mounting state is notified, it is possible to examine the cause of the abnormality based on the mounting condition and take a countermeasure, and the defective mounting state. Generation can be reduced.

  According to the above invention [2], the cause of the abnormality can be grasped more accurately from the relationship between the contents of the abnormality in the mounting state and the mounting conditions.

  According to the said invention [3], the cause which caused the change of the mounting state can be examined.

  According to the invention [4], it is possible to easily identify the mounting machine that has caused the abnormality.

  According to the invention [5], it is possible to prevent the production of defective substrates from continuing.

  According to the above invention [6], the mounting condition of the component in which the abnormality is detected in the mounting state is notified. Therefore, it is possible to examine the cause of the abnormality based on the mounting condition and take a countermeasure, and the defective mounting state. Generation can be reduced.

  According to the above invention [7], since the mounting condition of the component in which the abnormality is detected in the mounting state is notified, it is possible to examine the cause of the abnormality from this mounting condition and take countermeasures, and the defective mounting state. Generation can be reduced.

  FIG. 1 is a front view showing a mounting line according to an embodiment of the present invention. As shown in the figure, this mounting line includes a printing machine 4, a plurality of mounting machines 1,..., An inspection machine 2, a buffer conveyor 3 as a transfer machine, and a reflow furnace 5 from the upstream side to the downstream side of the production line. They are arranged in order.

  In the present embodiment, each facility constituting the mounting line includes a control device (control means) 6 configured by a personal computer or the like, and the driving of each facility on the mounting line is controlled by each control device 6. It is comprised so that. Further, each control device 6 is connected via a communication means, and is configured so that each facility is driven and a controlled operation is performed in the entire mounting line while transmitting and receiving signals between the control devices. Has been. Each facility is provided with a display device 7 for displaying data related to the state of each facility, and an input device 8 such as a keyboard and a mouse for inputting various information.

  The printing machine 4 applies cream solder to a predetermined area of a substrate carried in from a substrate carry-in machine (not shown) by screen printing.

  The mounting machine (mounting machine main body) 1... Mounts (mounts) electronic components at predetermined positions on the board. The control device 6 of each mounting machine 1 has a production program for mounting electronic components on the board, and the mounting process is automatically performed by controlling the driving of the mounting machine 1 according to the production program. It is configured to be done.

  FIG. 2 is a plan view showing an example of the mounting machine 1. As shown in the figure, the mounting machine 1 includes a conveyor 12 that is arranged on a base 11 and conveys a printed circuit board P, component supply units 13 that are arranged on both sides of the conveyor, and an upper side of the base 11. And an electronic component mounting head unit 14 provided.

  The component supply unit 13 is provided on the upstream side and the downstream side of the conveyor 12 on the front side and the rear side, respectively. In this embodiment, a component supply unit 15 to which a plurality of component supply devices such as tape feeders can be mounted side by side is provided on the front side and the rear side upstream portion, and a component supply device such as a pallet is stacked on the rear side downstream portion. A tray-type component supply unit 16 that can be attached is provided. The components supplied from these component supply units 13 can be picked up by the head unit 14.

  The head unit 14 is movable in a region extending between the component supply unit 13 and the mounting position on the substrate P so that components can be picked up from the component supply unit 13 and mounted on the substrate P. Specifically, the head unit 14 is supported by a head unit support member 142 that extends in the X-axis direction (substrate transport direction of the conveyor 12) so as to be movable in the X-axis direction. The guide rails 143 and 143 extending in the Y-axis direction (the direction perpendicular to the X-axis in the horizontal plane) are supported so as to be movable in the Y-axis direction. The head unit 14 is driven in the X-axis direction by the X-axis motor 144 via the ball screw 145, and the head unit support member 42 is driven in the Y-axis direction by the Y-axis motor 146 via the ball screw 147. To be done.

  A plurality of heads 148 are mounted on the head unit 140 side by side in the X-axis direction. Each head 148 is driven in the vertical direction (Z-axis direction) by an elevating mechanism using a Z-axis motor as a drive source, and is driven in the rotation direction (R-axis direction) by a rotary drive mechanism using an R-axis motor as a drive source. It has come to be.

  At the tip of each head 148, a suction nozzle for sucking and mounting the electronic component on the substrate is provided, and each nozzle sucks the electronic component with a suction force by a negative pressure supplied from a negative pressure means (not shown). It can be done.

  In FIG. 2, reference numeral 17 denotes a component camera, which picks up an image of the state of the component sucked by the head unit 14 and detects a positional deviation of the component. Reference numeral 18 denotes a board camera which takes an image of an identification number printed on the board P that has been carried in, a fiducial mark for component positioning, and the like.

  In the present embodiment, the component supply unit 13, the head unit 14, and the like constitute component mounting means for mounting components on the substrate P.

  The inspection machine 2 inspects the mounting state of the board on which the electronic component is mounted by the mounting machine, and determines the quality of the board.

  FIG. 3 is a plan view showing an internal structure of an example of the inspection machine 2. As shown in the figure, the inspection machine 2 is provided with a carry-in conveyor 21, an internal conveyor 22, and a carry-out conveyor 23 along the transfer line XL of the substrate P.

  The internal conveyor 22 that supports the substrate P at the time of inspection is slidably attached to a rail 222 disposed along the Y-axis direction (front-rear direction) orthogonal to the transport line XL, and is a ball screwed to the internal conveyor 22 The screw 223 is configured to be moved in the Y-axis direction by being rotationally driven by the motor 224.

  A camera 24 as an imaging device (imaging means) is disposed behind (inner part of) the internal conveyor 22. The support member 241 of the camera 24 is provided with an illuminating device 25 for illuminating the imaging area of the camera 24. The support member 241 of the camera 24 is slidably attached to a rail 242 disposed along the X-axis direction parallel to the transport line XL, and a ball screw 243 screwed to the support member 241 is rotated by a motor 244. It is configured to be moved in the X-axis direction by being driven.

  The internal conveyor 22 and the camera 24 move relative to each other in the XY directions, so that the camera 24 can inspect the mounting state of the mounted components by photographing the entire area of the board P.

  In the present embodiment, the internal conveyor 22 and the camera 24, and the inspection device 6 of the inspection machine 2 that determines the mounting state of each component based on the image data obtained by the camera 24 and predetermined inspection data are used for each component. The inspection means for inspecting the mounting state of is configured.

  The buffer conveyor 3 is configured so that the substrate inspected by the inspection machine 2 is conveyed to the reflow furnace 5 and the operator can visually observe the mounting state of the substrate during the conveyance. The buffer conveyor 3 is configured such that the operator can perform repair work by retracting the transported substrate W to a work stage different from the production line.

  The reflow furnace 5 reflows the cream solder applied to the substrate, and solders and stabilizes the electronic component to the substrate. Further, the substrates W carried out from the reflow furnace 5 are configured to be sequentially accommodated in a substrate unloader (not shown).

  Next, the operation of the mounting line and its management method in this embodiment will be described with reference to the flowchart of FIG.

  When the substrate W is carried into the printing machine 4, cream solder is printed on the substrate W by the printing machine 4. Thereafter, the boards are sequentially inserted into the respective mounting machines 1... And the mounting of electronic components onto the boards is started in the respective mounting machines 1... (Step S1).

  In the component mounting process by the mounting machine 1, first, in order to identify the board that has been carried in, the board number such as an identifier and a barcode provided for each board is read (step S2). The substrate may be specified by, for example, counting the number of produced sheets from the start of manufacture.

  Then, in accordance with a preset production program, a mounting operation for mounting electronic components at each predetermined position on the substrate is performed. Then, the mounting conditions when each component is mounted on each substrate are stored in each mounting machine as history information (step S3).

  This mounting condition is stored for each component mounted on each part of each substrate, that is, in a state where it can be associated with each of a plurality of components even when a plurality of components of the same type are mounted on one substrate. The As the mounting conditions to be stored, for example, information such as the manufacturer name and lot number specifying the mounted component itself, information specifying the feeder that supplied the component, and mounting position information in the component supply unit of the feeder , Information for specifying the suction nozzle that sucked the part, information for attaching the suction nozzle in the head unit, information for specifying the worker in charge, and the like.

  In the present embodiment, the control devices 6 of the mounting machines 1 constitute a mounting condition storage means for storing mounting conditions.

  The board on which the electronic components are mounted in the mounting machines 1... Is carried into the inspection machine 2 and inspection is started (step S4).

  In the inspection by the inspection machine 2, first, in order to identify the substrate to be inspected, a substrate number such as an identifier and a barcode provided for each substrate is read (step S5). The substrate may be specified by, for example, counting the number of produced sheets from the start of manufacture.

  Then, the mounting state of each component mounted on the board is inspected. In this inspection, according to a predetermined inspection program, the mounting state of each component obtained from an image obtained by imaging the board, that is, the position and orientation (angle) of each component, the state of each inspection target part such as a lead, etc. This is done by comparing with a different mounting state.

  If there is no abnormality in any part in this inspection and the inspection result is acceptable, the acceptable substrate is transferred from the inspection machine 2 to the reflow furnace 5 by the buffer conveyor 3, and the cream on the substrate is reflowed in the reflow furnace 5. After the solder is reflowed and the electronic components are soldered and fixed to the substrate, they are transported to a substrate unloader (not shown) and sequentially accommodated.

  On the other hand, when an abnormality is detected in the mounting state of any component (step S6), as shown in FIG. 5, in order to obtain the mounting conditions when the component in which the abnormality is detected is mounted on the mounting machine. In addition, an inquiry request is transmitted to each of the mounting machines 1 constituting the mounting line (step S7).

  In this embodiment, the control device 6 of the inspection machine 2 constitutes inquiry transmission means for transmitting an inquiry request to each mounting machine 1.

  As the types of abnormalities in the mounting state, there are, for example, a positional shift or a posture (angle) shift of a component, a missing component to be mounted, a partial missing component or the like. The missing part or the partial missing part of the part is all defective (NG), but the quality of the positional deviation or posture deviation of the part is determined according to the degree.

  In the present embodiment, a criterion for determining that the mounting state is abnormal is set inside the acceptable range in which the deviation from the ideal value is allowed, and the control device 6 of the inspection machine 2 responds to each component according to this criterion. If the amount of misalignment is large even if it is an acceptable board, an inquiry request is issued so that the cause can be clarified.

  In this embodiment, when sequentially inspecting a plurality of substrates, a change in the mounting state of each component over the plurality of substrates is monitored, and if a predetermined change is detected, an abnormality is detected in the mounting state. As a result, the cause of the change can be clarified.

  FIG. 6 is an explanatory diagram illustrating an example of a change in mounting state across a plurality of substrates. As shown in the figure, when the amount of deviation shown on the vertical axis changes A and when the degree of deviation changes B, there is a possibility of some change in mounting conditions. For this reason, when such a change in the mounting state is detected, it is determined that the mounting state is abnormal in order to clarify the cause of the change. The change in the amount of deviation detected as an abnormality in the mounting state is not only a change in the direction deviating from the ideal value (a change in which the amount of deviation increases), but conversely, a change in the direction approaching the ideal value (the amount of deviation decreases). Change) may also be included. This is to clarify the relationship between mounting conditions and mounting states.

  In the present embodiment, the control device 6 of the inspection machine 2 constitutes a state change determination unit that determines abnormality according to a change in the mounting state.

  In addition, even if it is a board | substrate with which abnormality was detected in the mounting state, the acceptance board | substrate with the grade of abnormality in the acceptance range is conveyed from the buffer conveyor 3 to the reflow furnace 5 similarly to a normal acceptance board | substrate. On the other hand, a defective board (NG) including a defect in the mounting state of any one of the components is sent, for example, to a retreat stage off the production line provided in the buffer conveyor 3, and is prevented from flowing out downstream and defective. Depending on the type, repair work by an operator or the like is performed.

  Further, in the present embodiment, the inspection machine 2 that has detected the abnormality in the mounting state, depending on the type and degree of the detected abnormality in the mounting state, together with the inquiry request, the mounting machine that has caused the abnormality in the mounting state 1 to send a stop command.

  When a stop command is issued, for example, when an abnormality or defect occurs more than a predetermined number for parts at the same mounting position, when an abnormality or defect occurs continuously, or more than a predetermined number of times for parts of the same type Or the case where a defect generate | occur | produces or the case where abnormality or defect generate | occur | produces continuously can be mentioned.

  As a result, it is possible to prevent the production of defective substrates from continuing.

  In the present embodiment, the control device 6 of the inspection machine 2 constitutes stop command transmission means for transmitting a stop command to the mounting machine.

  The inquiry request to the mounting machines 1... Includes information for specifying the board and the component in which the abnormality is detected. Specifically, the substrate number read from the substrate can be given as information for specifying the substrate. The information for identifying a component is information that can identify which component even if multiple components of the same type are mounted on the board, such as the component number linked to the mounting position on the substrate. Can be mentioned.

  When each of the mounting machines 1... Receives the inquiry request from the inspection machine 2 (step S8), it is determined whether or not the component specified in the inquiry request is an electronic component mounted on the mounting machine itself. This determination is made based on whether or not there is a record in which the component is mounted on the board specified by the inquiry request in the mounting condition history information stored in each mounting machine 1. Each mounter determines that it has made a mounting error if the component for which an abnormality is detected in the mounting state is included in the history of mounting conditions held by itself, and there is no mounting error otherwise. Judge that

  Then, the mounting machine 1 (for example, a mounting machine that has made a mounting error) in charge of mounting the component in which the mounting state abnormality is detected extracts mounting conditions when the component is mounted on the board from the history information (step S9). ), And the extracted mounting conditions are transmitted to the control device 6 of the inspection machine 2 together with information specifying itself (for example, a mounting machine that has made a mounting error) among the mounting machines 1... (Step S10).

  In the example of FIG. 5, the third mounting machine 1 has made a mounting error, and the other mounting machines (1, 2, and 4th mounting machines) have made no mounting error. In this case, the control device of the inspection machine 2 includes information indicating that it has been in charge of mounting a component for which an abnormal mounting state is detected from the control device 6 of the third mounting machine, and the mounting conditions when the component is mounted. 6 is transmitted. The control devices 6 of the other mounting machines 1... May not return a response to the inquiry request, but may return information indicating that the component is not the part that it is in charge of.

  In this embodiment, the control devices (control means) 6 of each mounting machine 1... Constitute a mounting condition transmitting means for transmitting the mounting condition in response to an inquiry request from the inspection machine 2.

  In addition, when a stop command is transmitted together with the inquiry request, the mounting machine 1 in charge of mounting the component in which the mounting state abnormality is detected (for example, the mounting machine having a mounting error) stops its operation. Specifically, as a response when a stop command is received, stop immediately after completion of the mounting operation on the currently operating board, or stop using the display device 7 such as a monitor and the input device 8 such as a keyboard. What is necessary is just to set beforehand measures, such as requesting the operator to judge whether or not.

  When receiving the mounting conditions from the mounting machine 1 as an answer to the inquiry request (step S11), the inspection machine 2 displays the received mounting conditions on the display device 7 such as a monitor, thereby notifying the operator or the like (step S12). ). This notification is not limited to the display device 7 directly attached to the inspection machine 2 itself, but may be a device capable of performing a notification operation under the control of the inspection device 2, for example, the display device 7 of the buffer conveyor 3 on the downstream side. .

  This mounting condition is notified for each component in which an abnormality has been detected. Specifically, the mounted component itself is information that specifies the mounting machine 1 on which the component is mounted, and the mounting condition transmitted from the mounting machine 1. In addition to information such as the manufacturer name and lot number for identifying the feeder, information for identifying the feeder that supplied the component, information on the mounting position of the feeder in the component supply unit, information for identifying the suction nozzle that sucked the component, and suction This includes information on the mounting position of the nozzle in the head unit, information for identifying the worker in charge, and the like.

  In addition, at this time, the contents of the detected abnormality in the mounting state are also notified together with the mounting conditions. Specifically, abnormalities such as component misalignment, posture (angle) misalignment, missing component to be mounted, partial component defect, or component misalignment or posture misalignment. The degree of is notified.

  In the present embodiment, the control device 6 and the display device 7 of the inspection machine 2 constitute notification means for notifying the details of the detected abnormality of the mounting state and the mounting conditions of the component.

  As described above, according to the mounting line of the present embodiment, if an abnormality is detected in the mounting state of any component in the inspection machine 2, the mounting condition when the component is mounted is displayed on the inspection machine 2. Since the notification is given by the device 7, it is possible to examine the cause of the abnormality from the mounting condition when the abnormality occurs, and to elucidate the mounting condition or the like that easily causes the abnormality of the mounting state. As a result, it is possible to take measures to reduce the occurrence of defects in the mounting state.

  In addition, since the contents of the abnormality such as the type and degree of abnormality are also notified together with the mounting conditions when the abnormality is detected, the relationship between the contents of the abnormality in the mounting state and the mounting conditions can be examined, The cause of the abnormality can be grasped more accurately.

  Further, since the information specifying the mounting machine 1 that has performed the mounting operation of the component in which the abnormality is detected in the mounting state is also notified, the mounting machine 1 that has caused the abnormality can be easily specified. .

  In addition, since the mounting condition when the abnormality occurs is notified from the display device (notification means) 7 of the inspection machine 2, the cause of the abnormality is examined without going to the vicinity of the mounting machine 1 that caused the abnormality. be able to.

  Also, the mounting conditions when each component is mounted are stored in each mounting machine 1 that has performed the mounting operation, and transmitted to the inspection machine 2 when an abnormality is detected. Both machines 2 do not overload the transmission and reception of information.

  In addition, as a method for determining abnormalities in the mounting state, changes in the mounting state of components across multiple boards are also considered, so the cause that caused the change in mounting state can be investigated, which allows inspection for each board. It is possible to grasp the relationship between the mounting condition and the mounting state that cannot be determined only by the result.

  Further, since the inspection machine 2 transmits a stop command to the mounting machine 1 depending on the type or degree of abnormality in the mounting state, it is possible to prevent the production of defective substrates from continuing.

  In the above embodiment, the case where four mounting machines 1... Are installed along the production line has been described. However, the number of mounting machines 1... Or five or more may be sufficient.

  Moreover, in the said embodiment, although the line structure which has arrange | positioned the inspection machine 2 before the reflow furnace 4 is employ | adopted, you may make it arrange | position the inspection machine 2 after the reflow furnace 4. FIG.

  In the above-described embodiment, specific configuration examples have been described for the mounting machines 1... And the inspection machine 2, but any type of mechanism for moving the substrate, the head unit, and the camera relative to each other can be adopted.

  Further, in the above embodiment, the control devices 6 are provided in each production facility, and these are connected by communication means, and signals are transmitted and received between the control devices 6 to control the operation of the entire production line. However, the present invention is not limited to this, and in the present invention, a control device such as a personal computer is provided above each control device 6... And the control device 6 is integrated and managed by this control device. Also good.

It is a front view which shows the mounting line concerning one Embodiment of this invention. It is a top view which shows an example of a mounting machine. It is a top view which shows the internal structure of an example of an inspection machine. It is a flowchart for demonstrating operation | movement of the said mounting line. It is a block diagram which shows delivery of the information between the mounting machine and test | inspection machine in the said mounting line. It is explanatory drawing which shows the example of the change of the mounting state over several board | substrates.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mounting machine 13 Component supply part 14 Head unit 2 Inspection machine 22 Internal conveyor (inspection means)
24 Camera (inspection means)
3 Buffer conveyor 4 Printing machine 5 Reflow furnace 6 Control device 7 Display device (notification means)

Claims (7)

A mounting line including a mounting machine and an inspection machine,
The mounting machine is
Component mounting means for mounting components on a substrate;
Mounting condition storage means for storing mounting conditions when each component is mounted on each substrate;
Mounting condition transmitting means for transmitting the mounting condition in response to an inquiry request from the inspection machine,
The inspection machine
Inspection means for inspecting the mounting state of each component mounted on each substrate by the mounting machine;
When an abnormality is detected in the mounting state, an inquiry transmission unit that transmits an inquiry request for a mounting condition when the component is mounted to the mounting machine;
A mounting line comprising: an informing means for informing the mounting condition transmitted from the mounting machine.   The mounting line according to claim 1, wherein the notifying unit notifies the contents of the detected abnormality in the mounting state together with the mounting condition.   The mounting line according to claim 1, wherein the inspection machine includes a state change determination unit that determines an abnormality according to a change in a mounting state of each component over a plurality of substrates. Including multiple mounting machines,
The mounting condition transmitting means of each mounting machine transmits the mounting condition to the inspection machine together with information for specifying the mounting machine in response to the inquiry request regarding the component mounted on the mounting machine. The mounting line described in Crab.   The mounting line according to any one of claims 1 to 4, wherein the inspection machine includes a stop command transmission unit that transmits a stop command to the mounting machine depending on the type or degree of abnormality in the mounting state. A method for managing a mounting line including a mounting machine and an inspection machine,
When mounting each component on each board in the mounting machine, remember the mounting conditions,
When an abnormality is detected in the mounting state of each component mounted on each board in the inspection machine, the mounting machine is requested to provide mounting conditions when the component is mounted,
A mounting line management method, wherein a mounting condition provided from the mounting machine is notified. An inspection machine for inspecting the mounting state of each component mounted on each board by a mounting machine,
When an abnormality is detected in the mounting state, an inquiry transmission unit that transmits an inquiry request for a mounting condition when the component is mounted to the mounting machine;
An inspection machine comprising: an informing means for informing a mounting condition transmitted from the mounting machine in response to the inquiry request.

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