JP2007123503A - Inspection conveyance machine, inspection check method and mounting line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection conveyance machine capable of correctly grasping the state of the inspection machine itself, as well as efficiently carrying out the confirmation work of a substrate state. <P>SOLUTION: The inspection conveyance machine comprises an inspection machine 2 for inspecting a substrate in which electronic components are mounted, a conveyance machine 3 for conveying a substrate inspected by the inspection machine 2, a first display 27 for displaying information about the state of the inspection machine 2, a second display 37 asynchronous to the first display 27 for displaying the information about the defective substrate judged to be defective by the inspection machine 2 provided in the conveyance machine 3, and a working area for confirming the state of a defective substrate referring to the information displayed on the second display 37. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inspection / conveyance device and inspection / confirmation method for a substrate on which electronic components are mounted, and a mounting line in which they are employed.

  Conventionally, in a mounting line in which electronic components are mounted on a substrate, the electronic components mounted on the substrate are passed through a reflow furnace to be soldered. Before passing through the reflow furnace, board inspection by an inspection machine is performed. It is becoming mainstream.

  When inspecting before passing through the reflow furnace, normally, when a defective substrate determined to be defective by the inspection machine is unloaded from the inspection machine, the operator visually checks the state of the defective substrate, and if necessary, Each time, repair and correction work is performed.

  However, when checking the state of a defective board by an operator, it often depends on visual observation, increasing the burden on the operator, and repair work such as defect confirmation work and repair correction work cannot be performed efficiently and accurately. There is room for improvement.

On the other hand, in the inspection confirmation method shown in Patent Document 1, an inspection result display device (monitor) for displaying the inspection result by the inspection machine is provided, and the state of the defective substrate is confirmed on the transport machine downstream of the inspection machine. In doing so, the operator confirms the state of the defective substrate by comparing the inspection result displayed on the monitor with the actual defective substrate.
Japanese Patent No. 3405175 (Claims 1 to 3, FIG. 5)

  However, in the conventional inspection confirmation method disclosed in Patent Document 1, the operator cannot accurately grasp the state of the inspection machine itself, and there is a concern that, for example, the response may be delayed when the inspection machine is abnormal.

  The present invention solves the above-mentioned problems of the prior art, and can efficiently and accurately check the state of the substrate, and also can accurately grasp the state of the inspection machine itself, an inspection and confirmation method, and a mounting line The purpose is to provide.

  In order to achieve the above object, the present invention provides the following means.

[1] An inspection machine for inspecting a board on which electronic components are mounted;
A transporter for transporting a substrate inspected by the inspection machine;
A first display device for displaying information on the state of the inspection machine;
A second display device that is provided in the transporter, displays information about a defective substrate that is determined to be defective by the inspection machine, and is asynchronous with respect to the first display device;
An inspection transport machine comprising: a work area for confirming a state of a defective substrate while referring to information displayed on the second display device.

[2] The transfer machine is provided with a defective substrate retracting mechanism for retracting the defective substrate to a work stage different from the production line.
2. The inspection and transport machine according to item 1, wherein the work stage is configured as the work area.

  [3] The inspection and transport machine according to item 1 or 2, wherein the second display device displays information related to a defective position on a defective substrate and information related to a defective portion arranged at the defective position.

  [4] The inspection / conveyance machine according to item 3 above, wherein the information regarding the defect position is configured by an image of the entire defective substrate in which a defect mark is provided at the defect position.

[5] Confirmation history input means for inputting confirmation history information when the state of the defective substrate is confirmed;
5. The inspection / conveyance machine according to any one of the preceding items 1 to 4, further comprising confirmation history storage means for storing confirmation history information input to the confirmation history input means.

[6] An inspection confirmation method in which a substrate on which electronic components are mounted is inspected by an inspection machine, and the state of a defective substrate determined to be defective by the inspection is confirmed after being unloaded from the inspection machine,
A first display device that is provided in the inspection machine and displays information on the state of the inspection machine;
Displaying information on a defective substrate determined to be defective by the inspection machine, and preparing a second display device that is asynchronous with respect to the first display device,
An inspection confirmation method, wherein the state of a defective substrate is confirmed while referring to information displayed on the second display device.

[7] A mounting machine for mounting electronic components on a substrate;
An inspection machine for inspecting a substrate on which electronic components are mounted by the mounting machine;
A transporter for transporting a substrate inspected by the inspection machine;
A first display device for displaying information on the state of the inspection machine;
A second display device that is provided in the transporter, displays information about a defective substrate that is determined to be defective by the inspection machine, and is asynchronous with respect to the first display device;
A mounting line comprising: a work area for confirming a state of a defective substrate while referring to information displayed on the second display device.

  According to the inspection and transport machine according to the invention [1], the defective substrate can be confirmed accurately by referring to the second display device, and the state of the inspection machine can be accurately confirmed by the display device using the first display device. Can grasp.

  According to the inspection / conveyance machine according to the invention [2], it is possible to efficiently perform the defect confirmation work of the defective substrate on the work stage as the work area.

  According to the inspection / conveyance machine according to the invention [3], the operator can accurately check the defect position and the defect state on the defective substrate based on the display information by the second display device.

  According to the inspection / conveyance machine according to the above invention [4], it is possible to more accurately identify a defective position on a defective substrate.

  According to the inspection transport machine according to the invention [5], it is possible to appropriately modify and change the inspection standard of the inspection machine based on the stored confirmation history information.

  According to the inspection confirmation method according to the invention [6], the state of the defective substrate can be confirmed accurately, and the state of the inspection machine can be accurately grasped by the first display device.

  According to the mounting line according to the invention [7], it is possible to accurately check the defective substrate and to accurately grasp the state of the inspection machine as described above.

  FIG. 1 is a front view showing a mounting line according to an embodiment of the present invention. As shown in the figure, this mounting line has a printing machine 54, a plurality of mounting machines 51, an inspection machine 2, a buffer conveyor 3, and a reflow furnace 55 arranged in this order from the upstream side to the downstream side of the production line. Has been placed. In the present embodiment, the inspection transport machine 1 is configured by the inspection machine 2 and the buffer conveyor 3.

  In the present embodiment, each facility constituting the mounting line includes a control device 4, 56... Configured by a personal computer or the like, and the driving of each facility on the mounting line is controlled by each control device 4, 56. It is comprised so that. Further, the control devices 4, 56... Are connected via communication means, and each equipment is driven while a signal is transmitted / received between the control devices, and a controlled operation is performed on the entire mounting line. It is configured as follows.

  The printer 54 applies cream solder to a predetermined area of a substrate carried in from a substrate carry-in machine (not shown). The printing machine 54 is provided with a monitor 57 as a display device. The monitor 57 has information on the state of the printing machine 54, for example, when the printing machine 54 is in operation, at the start of operation, when a production program change is corrected, or at maintenance inspection. Information about these is displayed. Further, an input device 58 such as a keyboard and a mouse is provided in front of the monitor 57 so that various information can be input via the input device 58.

  The mounting machine 51 mounts (mounts) an electronic component at a predetermined position on the board. Each mounting machine 51 is provided with a monitor 57 as a display device, and information regarding the state of the mounting machine 51 is displayed on the monitor 57 in the same manner as described above. Further, an input device 58 such as a keyboard and a mouse for inputting various kinds of information is provided in front of the monitor 57.

  The inspection machine 2 inspects the mounting state of the electronic component mounted on the electronic substrate W, and inspects mounting defects such as misalignment, missing parts, and defects of the electronic component, for example.

  As shown in FIG. 2, the inspection machine 2 is provided with an internal conveyor 22 along a substrate transfer line (production line), and the internal conveyor 22 inspects the substrate W carried from the mounting machine 51 side. In addition to being transported to the position, it is transported from the inspection position to the buffer conveyor 3 side.

  The internal conveyor 22 is configured to be movable along a Y-axis direction orthogonal to the production line direction (X-axis direction) in a horizontal plane by a Y-axis direction moving unit (not shown).

  Further, a camera 23 for board inspection photography is provided on the internal conveyor 22 in the inspection machine 2. The camera 23 is configured to be movable along the X-axis direction by an X-axis direction moving unit (not shown). Then, by moving the camera 23 in the X-axis direction and moving the internal conveyor 22 in the Y-axis direction, the camera 23 can be arranged at all positions on the substrate W arranged on the internal conveyor 22. The desired position can be photographed.

  Further, the inspection machine 2 is provided with a first monitor 27 as a first display device. The first monitor 27 includes information on the state of the inspection machine 2, for example, the operation of the inspection machine 2, as will be described in detail later. Information about these is displayed at the end of the operation, at the end of the operation, at the time of modification of the production program, and at the time of maintenance and inspection. Further, an input device 28 such as a keyboard or a mouse is provided in front of the monitor 27, and various information can be input via the input device 28.

  In the inspection machine 2, when the inspection is performed on the substrate W carried to the predetermined position by the internal conveyor 22, the internal conveyor 22 and the camera 23 are appropriately moved horizontally so that the entire predetermined region of the substrate W is moved a plurality of times. A part data image related to the inspection target part (inspection target part) is acquired from the divided images obtained by the shooting and the composite image obtained by joining the divided images. Then, the component data image is compared and collated with reference component data set in advance, and the quality of the mounted component state is determined.

  As shown in FIG. 1, the buffer conveyor 3 as a transporter is configured so that the substrate inspected by the inspection machine 2 is transported to the reflow furnace 55 and the mounting state of the substrate W can be visually observed by the operator during the transport. ing.

  The buffer conveyor 3 is configured such that the substrate W to be transported can be retracted to a work stage (work area A) different from the production line and stocked. That is, as shown in FIG. 3, the buffer conveyor 3 is provided with a carry-in conveyor 32, an intermediate conveyor 33, and a carry-out conveyor 34 on the base 31 along the production line. When these conveyors 32 to 34 are rotationally driven, the substrate W is transported from the inspection machine 2 to the reflow furnace 55 by the conveyors 32 to 34. Further, the buffer conveyor 3 is provided with an auxiliary conveyor 35 corresponding to the lower side of the intermediate conveyor 33. The intermediate conveyor 33 and the auxiliary conveyor 35 are provided so as to be movable up and down in synchronization with the base 31, and are configured to be moved up and down with respect to the carry-in conveyor 32 and the carry-out conveyor 34 by a conveyor lift drive means (not shown).

  In the buffer conveyor 3, when the intermediate conveyor 33 is lifted as shown by the imaginary line in the state where the substrate W is disposed on the intermediate conveyor 33, the substrate W is retreated upward and the auxiliary conveyor 35 is moved upward. Are arranged at positions corresponding to the carry-in conveyor 32 and the carry-out conveyor 34.

  In this intermediate conveyor rising state, the buffer conveyor 3 can carry the substrate W from the inspection machine 2 to the reflow furnace 55 without stopping the substrate W by the carry-in conveyor 32, the auxiliary conveyor 35, and the carry-out conveyor 34 (without stopping the production line). It is configured as follows. Here, in this embodiment, the region on the intermediate conveyor 33 in the raised state is configured as the work stage A.

  When the intermediate conveyer 33 is lowered, the intermediate conveyer 33 is disposed at a position corresponding to the carry-in and carry-out conveyers 32 and 34, and the auxiliary conveyer 35 is disposed below these conveyers 32-34. The substrate W on the intermediate conveyor 33 can be transported to the reflow furnace 55 by the intermediate conveyor 33 and the carry-out conveyor 34. Further, as described above, in a state where the intermediate conveyor 33 is lowered, the substrate W can be transported from the inspection machine 2 to the reflow furnace 55 by the conveyors 32 to 34.

  The buffer conveyor 3 is provided with a second monitor 37 as a second display device. The second monitor 37 relates to a defective substrate W determined to be defective by the inspection machine 2 as will be described in detail later. Information is displayed. The second monitor 37 is asynchronous with respect to the first monitor 27. That is, the first and second monitors 27 and 37 are configured to be able to display information independently of each other. For example, the first and second monitors 27 and 37 can display different information and can update display information at different timings regardless of display information. Has been.

  Further, an input device 38 such as a keyboard or a mouse is provided in front of the monitor 37, and various information can be input via the input device 38.

  The reflow furnace 55 reflows the cream solder applied to the substrate W to stabilize the electronic component on the substrate W. The reflow furnace 55 is provided with a monitor 57 for displaying information on the apparatus state, and an input device 58 such as a keyboard and a mouse for inputting predetermined information.

  The substrates W carried out from the reflow furnace 55 are sequentially accommodated in a substrate unloader (not shown).

  FIG. 4 is a block diagram showing a control system of the control device 4 in the inspection / conveyance machine 1 including the inspection machine 2 and the buffer conveyor 3. As shown in the figure, in the control device 4, the drive of each drive unit and the like is controlled by the CPU 40, and operations detailed later will be automatically executed. The CPU 40 is configured to acquire various types of information via the input devices 28 and 38 as described above, and to acquire predetermined information from the storage device 49 that stores various types of data necessary for inspection. Further, the CPU 40 is configured to display predetermined information described later on the first and second monitors 27 and 37.

  The image frame memory 41 acquires an image taken by the camera 23 of the inspection machine 2, for example, entire board image data (wide area image data) and electronic component data (inspection component data) to be inspected via the image input port 42. And memorize it. The memory 43 temporarily stores various data necessary for inspection in the inspection machine 2. Furthermore, the illumination controller 44 controls the driving of the illumination device equipped in the camera 23 when photographing with the camera 23. The motor controller 45 and the motor amplifier 46 are the X-axis moving means of the camera 23 and the internal conveyor 22. By controlling the driving of the Y-axis moving means, the camera 23 is moved relative to the substrate W in the XY-axis direction.

  Further, the CPU 40 controls the driving of each of the driving means such as the rotation driving means of the conveyors 32 to 35 in the buffer conveyor 3, the raising / lowering driving means of the intermediate conveyor 33 and the auxiliary conveyor 35, and the operation of the buffer conveyor 3. Is configured to control.

  Further, the CPU 40 is configured to transmit / receive data to / from peripheral devices such as other facilities via various I / O ports 48.

  Next, the operation of the mounting line in the present embodiment will be described focusing on the operation of the inspection and transport machine 1.

  When the substrate W is carried into the printer 54, cream solder is printed on the substrate W by the printer 54, and then electronic components are sequentially mounted on the substrate W by the mounting machines 51.

  Subsequently, the substrate W on which the electronic component is mounted is carried into the inspection machine 2 (step S1 in FIG. 5), and the inspection of the mounting state is started (step S2).

  During this inspection, information relating to the inspection status of the inspection machine 2 is displayed on the first monitor 27 of the inspection machine 2. Specifically, a screen as shown in FIG. 7 is displayed on the first monitor 27 during the inspection of the inspection machine 2. In the figure, the inspection execution tab T11 at the upper left of the screen is selected, and the inspection status is displayed on the screen. Furthermore, in the upper left area of the screen, the production management tab T12 is selected, and the number of substrates and the rod number. In the lower area, the substrate data tab T13 is selected and information about the substrate such as the substrate size is displayed. Further, in the area on the left side from the center of the screen, the determination result tab T14 is selected, and an image of the whole board that has been determined to pass or fail is displayed, and information such as the inspection level is displayed below it.

  Thus, during the inspection of the inspection machine 2, information on the inspection status is displayed on the first monitor 27. Therefore, the operator can accurately grasp the inspection status of the inspection machine 2 by referring to the display screen, and can quickly cope with an abnormality in the inspection machine.

  The first monitor 27 not only displays the operation status during the inspection, but also displays information related to the production program change correction of the inspection machine 2 and maintenance inspection. For example, when the production program is changed, the screen shown in FIG. 8 is displayed. In the figure, the program selection tab T21 at the upper left of the screen is selected, and a program selection screen is displayed. Further, in the upper left area of the screen, the production management tab T22 is selected, and selectable program types (names) are displayed. Further, on the lower side, the board data tab T23 is selected and information on the board is displayed in the same manner as described above, and the determination result tab T24 is selected in the left area from the center of the screen and used in the selection program. A substrate image to be displayed is displayed.

  As described above, the first monitor 27 displays information relating to the production program when the production program is changed and modified, and similarly, data relating thereto is displayed during the maintenance check. Therefore, the operator can quickly and accurately grasp various data by referring to the display screen, and can perform program change correction work and maintenance check work efficiently and smoothly.

  On the other hand, when the substrate inspection by the inspection machine 2 is completed, the inspection result is judged (step S3 in FIG. 5). Then, the determination result is displayed on the first monitor 27 (step S4).

  If the inspection result is unacceptable (defective, NG), the screen of the second monitor 37 is updated to display information on the defective substrate W described later (step S5), and the substrate W is carried out to the buffer conveyor 3. (Step S6).

  If the inspection result is acceptable (good product, OK), the screen of the second monitor 37 is not updated, and the substrate W is carried out to the buffer conveyor 3 while maintaining the previous screen. (Step S6).

  Of the substrates W transferred to the buffer conveyor 3, the substrates W determined to be non-defective are continuously transferred by the conveyors 32 to 34 of the buffer conveyor 3 and sent to the reflow furnace 55.

  The defective substrate W determined to be defective is transported to the position of the intermediate conveyor 33, and then the intermediate conveyor 33 and the auxiliary conveyor 35 are raised as shown by the imaginary line in FIG. In addition, the defective substrates W on the intermediate conveyor 33 are retreated (stocked) upward from the production line, and the operator repairs the defective substrates W there. Step S7). Here, in the present embodiment, even if only the check work of the state of the board or component is performed, it is included in the repair work, and the repair work also includes correction and repair work in addition to the check work It is.

  The defective substrate W is identified by the buffer conveyor 3 based on, for example, an identifier provided for each substrate or based on the number of substrates passing through the intermediate conveyor position from the time when the inspection machine 2 determines that the substrate is defective. can do. The acquisition of the identifier information and the number of board passages can be acquired via output information from various detection means (sensors) provided around the intermediate conveyor.

  With respect to the defective substrate W placed on the work stage A, the operator performs a defective component confirmation and correction operation (repair operation) while referring to information on the defective substrate W displayed on the second monitor 37. Yes (step S71 in FIG. 6).

  Here, as described above, the second monitor 37 displays information on the defective substrate W, for example, information indicating the position of the defective component on the substrate and detailed information on the defective component. Specifically, in the present embodiment, the screen shown in FIG. 9 is displayed on the second monitor 37. In the figure, in the upper left area R1 of the screen, an image representing the entire defective board W including defective parts is displayed, and a defective mark M is written at the position of the defective part in the board image. In the present embodiment, the color scheme of the defective mark M may be set to a color scheme different from the color scheme of other areas so that the defective mark M can be easily recognized. For example, when the color of the monitor screen is set to black and white monochrome, by setting the defect mark M to yellow or red, the defect mark M can be easily recognized visually and defective parts can be identified. It can be found quickly and accurately, and repair work can be performed efficiently.

  Further, an enlarged detailed image of the defective part is displayed in the upper right area R2 of the screen. Therefore, the operator can quickly and accurately find the position of the defective part from the entire board image on the left side of the screen, and further, from the enlarged detail image of the defective part on the right side of the screen, the defective state of the part, for example, missing, missing, or misaligned Etc. can be grasped quickly and accurately, and the repair work can be performed efficiently.

  In the present embodiment, the second monitor 37 may be configured to be able to individually switch and display the entire board image and the component enlarged detail image by a mouse click operation or the like.

  When the repair work of the defective part is completed (step S71 in FIG. 6), the repair history (confirmation history) of the part is input (step S72) as will be described later.

  Subsequently, when there is another defective part on the defective board W, that is, when repair work for all the defective parts on the board is not completed (NO in step S73), the enlarged details of the next defective part are displayed on the right side of the screen. The image is displayed (step S74), and the repair work of the defective part corresponding to the defective part image is performed (step S71).

  When the repair work for all defective parts on the defective board is completed in this way (YES in step S73), the repair work for the defective board W is completed. In this embodiment, when the repair work for the substrate W is completed, a means for inputting the completion history may be provided.

  After the substrate repair work is completed, the intermediate conveyor 33 is lowered at a predetermined timing, and the repaired substrate is returned to the production line. Thereafter, the sheet is conveyed to the reflow furnace 55 by the intermediate conveyor 33 and the carry-out conveyor 34.

  On the other hand, in the production line apart from the repair work, when the substrate W is unloaded (step S6), the screen of the first monitor 27 in the inspection machine 2 is updated in preparation for the next substrate inspection (step of FIG. 5). S8) The next substrate is carried into the inspection machine 2 (step S1).

  The above operations are repeated, and the inspection and conveyance of the substrate W are sequentially performed.

  In the present embodiment, the next defective substrate is transferred from the inspection machine 2 to the buffer conveyor in a state where the repair operation is not completed, that is, in a state where the previous defective substrate W is placed on the intermediate conveyor 33 in the raised state. In such a case, the substrate transportation may be stopped until the repair work of the previous defective substrate W is completed. However, as will be described later, in the case where a configuration in which a large number of defective substrates can be stocked at a position different from the production line such as the work stage A, even if the repair operation of the previous defective substrate is not completed. Since the next defective substrate can be stocked, it is not necessary to stop transporting the next defective substrate, and production can be continued without stopping the line.

  Here, on the second monitor screen of FIG. 9 at the time of repair work, repair history input means related to step S72 of FIG. 6 is provided below the defective component enlarged image. This repair history input means includes a “confirmation” button B1, a “correction” button B2, and a “misinformation” button B3. Further, on both sides of the confirmation button, a “<(carrying down)” button B4 and a “> (carrying up)” button B5 are provided.

  The confirmation button B1 is within the allowable range (range of non-defective product) when the operator visually confirms a part determined to be defective by the inspection machine 2, and is pressed when the product is visually determined to be non-defective (using a mouse). Click operation), and no repair work is performed.

  The carry-down button B4 is pressed when switching the currently displayed defective part image and displaying the previous defective part image. The carry button B5 is pressed when the currently displayed defective component image is switched to display the next defective component image.

  The correction button B2 is a button that is pressed when a repair operation is completed after a predetermined correction is made on the displayed defective part, and confirmation (history) information that the correction has been performed by the operator is input. To do.

  The misinformation button B3 is a button that is pressed when the inspection machine 2 is determined to be defective but is actually a non-defective product, and inputs information that the determination by the inspection machine 2 is false.

  The repair history information input through the repair history input means B1 to B3 is stored and accumulated in, for example, the storage device 49 (see FIG. 4) of the control device 4 as the repair history storage means.

  In addition to the “ERROR CLEAR” button B6 and the “START” button B7, a “unconfirmed part” display field B8, a “change only NG” display field B9, and the like are provided below the entire board image.

  The “ERROR CLEAR” button B6 is used to stop a buzzer that is generated when the inspection machine 2 determines that the substrate is defective. When the operator confirms that a defective substrate has occurred, the “ERROR CLEAR” button B6 is pressed. (Click operation with the mouse).

  The “START” button B7 is pressed when restarting operation when the inspection machine 2 is stopped.

  In the display part B8 of “Unconfirmed parts”, the number of defective parts and the number of remaining defective parts for which repair history is not input by the operation of the buttons B1 to B3 by the operator are displayed.

  In the display column B9 of “Change only NG”, when a check mark is given to the display column, only information related to the defective substrate is displayed on the second monitor 37 each time as in this embodiment. Is. When the check mark is not given, as will be described later, information on the substrate to be processed is displayed on the second monitor 37 every time regardless of the defective substrate and the non-defective substrate.

  In the lower area R3 of the second monitor 37, detailed information of the inspection result by the inspection machine 2, for example, information such as the amount of component position deviation is displayed as characters and numerical data.

  On the other hand, as shown in FIG. 1, the substrate W transferred to the reflow furnace 55 by the buffer conveyor 3 is reflowed with the cream solder applied to the substrate W in the reflow furnace 55, and the electronic components are soldered to the substrate W. To be fixed. The substrates W to which the electronic components are fixed in this way are transported from the reflow furnace 55 to a substrate unloader (not shown) and sequentially accommodated.

  As described above, according to the inspection transport machine 1 in the mounting line of the present embodiment, when the repair work is performed on the buffer conveyor 3 for the defective substrate W determined to be defective by the inspection machine 2, the second monitor 37 Since the information about the defective substrate W is displayed, the operator can accurately grasp the defective state by referring to the display screen, can efficiently perform the repair work, and improve the production efficiency. be able to.

  In particular, in the present embodiment, the second monitor 37 displays an image of the entire defective substrate with the mark M added to the defective component position and an enlarged detailed image of the defective component. It is possible to quickly find out, to accurately grasp the defective state of defective parts, and to further improve the work efficiency.

  Furthermore, in this embodiment, since the defective substrate is moved to the work stage A different from the production line and the repair work is performed, the production line is not stopped regardless of the presence or absence of the repair work. Production can be continued and production efficiency can be further improved.

  Further, in the present embodiment, since the repair history is input and accumulated after the repair work is completed, for example, the inspection standard of the inspection machine 2 can be appropriately changed based on the accumulated repair history information, and the inspection accuracy can be changed. Can be improved. The inspection standard may be changed manually by an operator or automatically according to a preset program.

  In the present embodiment, the substrate W determined to be defective by the inspection machine 2 (repair required) is automatically retracted from the production line by the buffer conveyor 3, but in the present invention, However, it is not always necessary to provide a defective substrate automatic retraction mechanism in a transfer machine such as the buffer conveyor 3. For example, the state of the defective substrate may be inspected while being transported by the transport machine, and the defective substrate being transported is manually taken out by the operator, repaired, and then manually performed. Then, it may be returned to the production line (conveyor, etc.). In these cases, an area on the transfer machine and an area where the substrate is taken out and the repair work is performed are configured as a work area A.

  Further, in the present embodiment, information on the operation status is displayed on the first monitor 27 of the inspection machine 2 during the inspection, for example, so that the operator can check the inspection status of the inspection machine 2 by referring to the information. Can detect the occurrence of abnormalities at an early stage, can quickly and appropriately deal with equipment abnormalities, can effectively prevent equipment troubles in advance, and can further improve convenience and productivity. it can.

  In addition to the operating status during inspection, the first monitor 27 displays data related to these during production program change correction and maintenance inspection. The operator can check the data by referring to the display screen. Work can be performed quickly and accurately, and program change correction work and maintenance inspection work can be performed efficiently and smoothly.

  In the inspection and transport machine 1 of the above embodiment, only the information on the defective substrate W is displayed on the second monitor 37 of the buffer conveyor 3 (step S5 in FIG. 5), but the inspection and transport machine of the present invention. In this case, information on the substrate to be processed may be displayed each time. That is, as shown in FIG. 10, the substrate is carried into the inspection machine 2 (step S11), and the inspection is started (step S12). Then, the determination result information (step S13) is displayed on the first monitor 27 (step S14), and the inspection result information is further displayed on the second monitor 37 (step S15).

  Subsequently, the substrate W is unloaded (step S16), and the first monitor 27 is updated in preparation for the next substrate inspection (step S18).

  Here, since the second monitor 37 holds the previous inspection result, for example, when the result is defective, the second monitor 37 has information on the defective substrate W similar to FIG. It is displayed until the next test result is given. Therefore, based on the defective board information of the second monitor 37, the repair work is performed in the same manner as described above (step S17, steps S71 to S74 in FIG. 6) and returned to the production line.

  Note that the switching operation between the operation mode of this modified example (FIG. 10) and the operation mode of the above-described embodiment (FIG. 5) is performed by placing a check mark in the “change only NG” display field B9 on the screen of the second monitor 37. This is done depending on whether or not to grant. That is, when the check mark is given to the display field B9, the inspection conveyance is performed in the operation mode of the embodiment shown in FIG. 5, and when the check mark is removed, the operation mode of the modified example shown in FIG. Inspection conveyance is performed.

  On the other hand, in the above-described embodiment, when the substrate W determined to be defective by the inspection machine 2 is retracted by the buffer conveyor 3, only one defective substrate W is retracted. In the present invention, the present invention is not limited, and a plurality of defective substrates W can be configured to be retracted.

  In this case, a plurality of repair operations for defective substrates can be performed collectively. When performing repair work collectively, for example, as shown in FIG. 11, information on the first defective substrate W is displayed on the second monitor 37 (step S101). In other words, the whole image of the defective board and the detailed image of the defective component are displayed, and repair work such as confirmation and correction is performed while referring to the display image (step S102). The repair history may be input in the same manner as in the above embodiment.

  Next, when there is another defective part on the first board W, that is, when repair work for all defective parts on the board is not completed (NO in step S103), an image of the next defective part is displayed. (Step S101), repair work is performed in the same manner as described above (Step S102).

  Thereafter, when the repair work for all defective components on the first substrate W is completed (YES in step S103), if the next defective substrate W remains (NO in step S104), the next defective substrate W is displayed. (Step S105) and display defective parts of the substrate W (Step S101). Then, the repair work is performed on the second substrate W in the same manner as described above (steps S101 to S103).

  When the repair work for all the defective substrates W thus stocked is completed (YES in step S104), the repair work for a plurality of sheets is completed.

  In this repair work, each time the repair work is completed, the substrate W may be returned to the production line, or after all the repair work is completed, the substrates W may be returned to the production line collectively. It is also possible to divide a plurality of sheets and return them to the production line.

  In the above embodiment, the drive of the buffer conveyor 3 is controlled by the control device 4 of the inspection machine 2, but the present invention is not limited to this. In the present invention, the buffer conveyor 3 is controlled to drive the drive. A control device such as a personal computer may be provided separately. In this case, the control device for the inspection machine and the control device for the buffer conveyor may be managed by a host control device.

  Further, in the present invention, a third monitor synchronized with the second monitor of the buffer conveyor is disposed at a remote position, for example, away from the buffer conveyor, and the operator does not need manual work via the third monitor at the remote position. An input operation such as false alarm confirmation may be performed.

It is a front view which shows the mounting line concerning one Embodiment of this invention. It is side surface sectional drawing which shows the inspection machine applied to the said embodiment. It is a front view which shows the buffer conveyor applied to the said embodiment. It is a block diagram which shows the control system of the inspection conveyance machine applied to the said mounting line. It is a flowchart for demonstrating operation | movement of the test | inspection conveyance machine applied to the said mounting line. It is a flowchart for demonstrating the defective board repair operation | movement in the said embodiment. It is a front view which shows the display screen of the 1st monitor during the test | inspection of the said inspection machine. It is a front view which shows the display screen of the 1st monitor during the production program change of the said inspection machine. It is a front view which shows the display screen of the 2nd monitor of the said buffer conveyor. It is a flowchart for demonstrating operation | movement of the test | inspection conveyance machine concerning the modification of this invention. It is a flowchart for demonstrating the repair operation | movement concerning the other modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inspection conveyance machine 2 Inspection machine 27 1st monitor (1st display apparatus)
3 Buffer conveyor (conveyor)
33 Intermediate conveyor (defective substrate retracting mechanism)
37 Second monitor (second display device)
A Work area (work stage)
M Defect mark

Claims (7)

An inspection machine for inspecting a board on which electronic components are mounted;
A transporter for transporting a substrate inspected by the inspection machine;
A first display device for displaying information on the state of the inspection machine;
A second display device that is provided in the transporter, displays information about a defective substrate that is determined to be defective by the inspection machine, and is asynchronous with respect to the first display device;
An inspection transport machine comprising: a work area for confirming a state of a defective substrate while referring to information displayed on the second display device. The carrier is provided with a defective substrate retracting mechanism for retracting the defective substrate to a work stage different from the production line,
The inspection and transport machine according to claim 1, wherein the work stage is configured as the work area.   3. The inspection / conveyance machine according to claim 1, wherein the second display device displays information related to a defective position on a defective substrate and information related to a defective portion arranged at the defective position.   4. The inspection / conveyance machine according to claim 3, wherein the information on the defective position is constituted by an image of the entire defective substrate in which a defective mark is provided at the defective position. Confirmation history input means for inputting confirmation history information when confirming the state of the defective substrate,
The inspection transport machine according to any one of claims 1 to 4, further comprising confirmation history storage means for storing confirmation history information input to the confirmation history input means. Inspecting a substrate on which electronic components are mounted by an inspection machine, and an inspection confirmation method for confirming the state of a defective substrate determined to be defective by the inspection after having been unloaded from the inspection machine,
A first display device that is provided in the inspection machine and displays information on the state of the inspection machine;
Displaying information on a defective substrate determined to be defective by the inspection machine, and preparing a second display device that is asynchronous with respect to the first display device,
An inspection confirmation method, wherein the state of a defective substrate is confirmed while referring to information displayed on the second display device. A mounting machine for mounting electronic components on a substrate;
An inspection machine for inspecting a substrate on which electronic components are mounted by the mounting machine;
A transporter for transporting a substrate inspected by the inspection machine;
A first display device for displaying information on the state of the inspection machine;
A second display device that is provided in the transporter, displays information about a defective substrate that is determined to be defective by the inspection machine, and is asynchronous with respect to the first display device;
A mounting line comprising: a work area for confirming a state of a defective substrate while referring to information displayed on the second display device.