JP4481192B2 - Inspection condition management system and component mounting system - Google Patents

Description

  The present invention relates to a system and a component mounting system for managing inspection conditions of various inspection apparatuses incorporated in a component mounting line for mounting electronic components on a circuit board.

  Conventionally, a solder printing device (or dispenser), a mounting device, a reflow furnace, etc. are arranged in a line to form a production line (component mounting line), and the circuit board is conveyed by passing through each of these processing devices. Electronic components are mounted on top.

  In this type of production line, if it is determined that there is a processing defect by providing an inspection device on the downstream side of each processing device and inspecting the processing (work) content applied to the circuit board, After notifying the operator and conducting a visual inspection by the operator, if it is determined that there is no problem in production, it is transported to the next process and the rest of the process is continued. On the other hand, it is determined that there is a problem in production. Measures such as line dropping are being carried out for those that were made.

  In the production line as described above, the mounting state (mounting misalignment) of each component is inspected immediately after mounting and after reflowing. At this time, for example, both inspections are performed at a common inspection level (accuracy of inspection). However, inconsistencies may occur in the test results. For example, the inspection immediately after component mounting may fail, and the substrate re-introduced into the production line after the visual inspection by the operator may pass the inspection after reflow without difficulty. One of the causes is that the solder melts during the reflow process, and the so-called self-alignment action that corrects the component mounting misalignment works. In this case, the final inspection ( Since it passed in the inspection after reflow), it was not necessary to reject the board in the inspection after mounting, that is, the inspection condition (inspection level) of the inspection after mounting was too strict.

  Conventionally, when there is a contradiction in the inspection results between processes, the operator analyzes the cause of the contradiction and changes the inspection level setting of the inspection device as necessary. Measures have been taken to avoid the continuous determination of acceptance, but such work is time consuming and not always easy. This leaves room for improvement.

  The present invention has been made in view of the above circumstances, and it is an object of the present invention to quickly resolve a situation in which inconsistent inspection results are produced between processes and to facilitate the production of a substrate more smoothly. To do.

  In order to solve the above-described problems, the present invention provides a plurality of processing devices including at least two of a paste coating device, a component mounting device, and a reflow device, and a substrate based on image recognition after processing by each processing device. A component mounting line inspection condition management system comprising an inspection device for inspection and configured to inspect inspection items common to or related to each other among a plurality of inspection devices, When it is determined by the determination means that there is a contradiction based on the inspection result in the inspection apparatus, the determination means for determining whether there is a contradiction in the inspection result between the inspection apparatuses regarding the common or related inspection items. A condition change that changes the inspection conditions of the inspection items that are common or related in any of the inspection apparatuses that have inconsistencies in the inspection results. In which and means (claim 1).

  According to this configuration, when inconsistent inspection results are obtained between inspection apparatuses for common or related inspection items, the inspection condition of the item of any of the corresponding inspection apparatuses is changed by the condition changing means. The item is automatically changed, and thereafter, the item is inspected according to the changed inspection condition. Therefore, it is possible to eliminate a situation in which inconsistent inspection results continue between inspection apparatuses for common or related inspection items by appropriately determining specific changes by the condition changing means in advance according to the inspection items. It becomes possible. In addition, in the description of claim 1, the “common or related inspection item” means an inspection item or inspection object in which one inspection result and the other inspection result are normally matched because the inspection object is common. Means different inspection items but are related to each other, and usually means an inspection item in which both inspection results match (the same applies to claims 6 and 7).

  In this configuration, the condition changing unit is configured to perform at least a case where the contradiction occurs with respect to the inspection result of a predetermined number of consecutive substrates, or when the contradiction occurs over a predetermined ratio with respect to the inspection result of the predetermined number of substrates. It is preferable that the inspection condition is changed when one of the requirements is satisfied.

  According to this configuration, it is possible to eliminate the case where the contradiction in the inspection result is a temporary result caused by, for example, an error in the measured value. Therefore, it is possible to effectively prevent the inspection conditions from being frequently changed and the inspection reliability from being impaired.

  In the above configuration, when the reflow device is included in a component mounting line, the condition changing unit includes an inspection result after the reflow processing and an inspection result after the processing performed before the reflow processing. When a contradiction occurs, it is preferable to change only the inspection condition in the inspection after the processing performed before the reflow processing.

  In other words, if there is a contradiction in the inspection results, the question is which inspection device to change the inspection conditions. However, in the component mounting line that includes the reflow device, the inspection after the reflow process is the final inspection. The conditions are generally strict and the reliability of the test results is high. For this reason, when there is a contradiction between the inspection result after the reflow process and the inspection result before the reflow process, it is appropriate and reasonable to change the inspection condition of the inspection in the previous process.

  Note that, as a specific configuration in this case, for example, in a case where a component mounting error after component mounting processing and after reflow processing is determined to pass / fail based on a predetermined allowable value, the condition changing unit includes an inspection condition. The allowable value in the inspection after the component mounting process can be increased or decreased by a preset value (claim 4).

  According to this configuration, when inspection results that are contradictory to each other regarding inspection of mounting errors after the component mounting process and after the reflow process are obtained, the allowable value that is the inspection condition for the inspection after the component mounting process is increased or decreased by a predetermined value. .

  Further, as another specific configuration, for example, in a case where the pass / fail amount of the paste is determined based on a predetermined allowable value after the paste application process and after the reflow process, the condition changing unit is used as an inspection condition. The allowable value in the inspection after the paste coating process can be increased or decreased by a preset value (Claim 5).

  According to these configurations, when inspection results contradicting each other with respect to the inspection of the paste application amount after the paste application process and after the reflow process are obtained, the allowable value which is the inspection condition for the inspection after the paste application process is increased or decreased by a predetermined value. Be changed.

  On the other hand, another inspection condition management system according to the present invention includes a plurality of processing devices including at least two of a paste coating device, a component mounting device, and a reflow device, and after processing by each processing device, based on image recognition. A component mounting line inspection condition management system comprising: an inspection device for inspecting a substrate, and configured to inspect inspection items that are common to or related to each other among the plurality of inspection devices. A determination means for determining whether or not there is a contradiction in inspection results between the inspection apparatuses with respect to the common or related inspection items, based on display means capable of displaying various types of information and inspection results in each inspection apparatus on a common substrate And the inspection item that is common or related, and each inspection related to the item, At least one of the information of the inspection conditions of the apparatus, in which and a display control means for the screen displayed by the display means together with the information that can specify an inspection apparatus applicable (claim 6).

  According to this configuration, when inconsistent inspection results are obtained between inspection apparatuses for common or related inspection items, at least one of the inspection items and the inspection conditions of each inspection apparatus related to the items, and the corresponding Information that can specify the inspection device to be displayed is displayed by the display means. As a result, the operator can quickly identify the inspection equipment, inspection items, and inspection conditions that have caused inconsistencies in the inspection results, and can take prompt actions such as changing the inspection conditions as necessary. As a result, it is possible to eliminate a situation in which inconsistent inspection results continue between inspection apparatuses for common or related inspection items.

  On the other hand, a component mounting system according to the present invention includes a plurality of processing devices including at least a component mounting device among a paste application device, a component mounting device, and a reflow device, and a substrate based on image recognition after processing by each processing device. In a component mounting system including a plurality of inspection devices to be inspected, whether there is a contradiction in inspection results between inspection devices regarding inspection items that are common or related to each other based on the inspection results of each inspection device on a common board When the determination means determines that there is a contradiction by the determination means, the inspection condition of the inspection item that is common or related in any of the inspection apparatuses in which the inspection result has a contradiction occurs. And a condition changing means for changing (claim 7).

  According to this component mounting system, when inconsistent inspection results are obtained between inspection apparatuses for common or related inspection items, the inspection condition of the corresponding inspection apparatus for any of the inspection apparatuses changes the condition. The item is automatically changed by the means, and thereafter, the item is inspected according to the changed inspection condition. Therefore, it is possible to eliminate a situation in which inconsistent inspection results continue between inspection apparatuses for common or related inspection items by appropriately determining specific changes by the condition changing means in advance according to the inspection items. It becomes possible.

  In this component mounting system, at least one of the plurality of inspection apparatuses may be provided integrally with a processing apparatus that performs a process to be inspected. ). For example, the inspection apparatus may be integrated with the processing apparatus by sharing a part of the configuration of the processing apparatus as a part of the configuration of the inspection apparatus.

  On the other hand, the processing apparatus according to the present invention is a processing apparatus incorporated in the component mounting system as described above, and when the determination unit determines that there is a contradiction, the common or related inspection items, and A display means capable of displaying at least one of the inspection conditions of each inspection apparatus relating to the item together with information capable of specifying the corresponding inspection apparatus is provided (claim 9).

  The inspection apparatus according to the present invention is a processing apparatus incorporated in the component mounting system as described above, and when the determination unit determines that there is a contradiction, the common or related inspection item, and It comprises a display means capable of displaying at least one of the inspection conditions of each inspection apparatus relating to the item together with information capable of specifying the corresponding inspection apparatus (claim 10).

  If these processing devices or inspection devices are incorporated into the component mounting system as described above and used, if there are inconsistent inspection results between inspection devices for common or related inspection items, the inspection items and the relevant items Information on at least one of the inspection conditions of each inspection apparatus and information that can identify the corresponding inspection apparatus is displayed by the display means of the processing apparatus (or inspection apparatus). Therefore, when the operator is monitoring in the vicinity of the processing device (or inspection device), it becomes possible to quickly identify the inspection device, inspection items, and inspection conditions that cause inconsistencies in the inspection results. This makes it possible to take prompt actions such as changing the inspection conditions.

  According to the inspection condition management system according to claims 1 to 5 of the present invention or the component mounting system according to claims 7 and 8, when inconsistent inspection results are obtained between inspection apparatuses for common or related inspection items. The inspection conditions of any of the corresponding inspection devices are automatically changed. Therefore, by appropriately setting specific changes in the inspection conditions according to the inspection items in advance, it is possible to automatically eliminate the situation where inconsistent inspection results occur between processes, and to smoothly produce substrates. You will be able to proceed.

  According to the inspection condition management system according to claim 6 of the present invention, when an inconsistent inspection result is obtained between inspection apparatuses for common or related inspection items, the operator has caused a contradiction based on the display on the display means. Inspection devices, inspection items, and inspection conditions can be quickly identified, and measures such as analysis of the cause of contradiction and change of inspection conditions in the inspection device can be taken promptly. Therefore, it is possible to quickly eliminate the situation in which inconsistent inspection results are produced between the processes, and to smoothly proceed with the production of the substrate.

  According to the processing device according to claim 9 or the inspection device according to claim 10 of the present invention, by using the component mounting system according to claims 7 and 8 as an element thereof, a common or related inspection is performed. When inconsistent inspection results are obtained between inspection apparatuses for items, information such as inspection items can be promptly notified to an operator being monitored in the vicinity of these apparatuses.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 schematically shows a component mounting line (component mounting system according to the present invention) to which the inspection condition management system of the present invention is applied. This production line includes a loader (not shown), a solder printing device 1, a printing inspection device 2, two types of mounting devices 3A and 3B, a mounting inspection device 4, a reflow furnace 5, a soldering inspection device 6, and an unloader (not shown). ) In a row, and these are connected to each other by a conveyor 7. And while conveying a circuit board (henceforth only a board | substrate) with the conveyor 7, while performing each process of solder printing, component mounting, and reflow sequentially, the board | substrate after each process is test | inspected by the inspection apparatus 2,4,6. It is configured as follows.

  Although not shown, each inspection device 2, 4, 6 includes a head on which a CCD camera is mounted, a driving device for moving the head in a plane, and the like. Inspection of each processing based on the data, specifically, inspection of the solder application amount etc. in the printing inspection apparatus 2, inspection of the component mounting deviation etc. in the mounting inspection apparatus 4, solder application amount and component mounting in the reflow furnace 5 Inspections such as deviation are carried out. As for the solder application amount inspection, the print inspection apparatus 2 inspects the application amount by the image recognition of the solder applied on the pattern, and the soldering inspection apparatus 6 inspects the application amount by the image recognition of the solder around the mounted component. It has become.

  Each of the devices 1 to 6 is an autonomous device on which a control device is mounted, and the operation of each device is individually driven and controlled by its own control device. However, this component mounting line is further provided with a central management device 8 connected online to each of the devices 1 to 6, and various information relating to production (processing) in each of the devices 1, 3 A, 3 B, and 5. Is stored in a storage device in the central management device 8 and necessary information can be transmitted and received between the central management device 8 and each of the devices 1 to 6.

  FIG. 2 is a block diagram illustrating an example of the configuration of the central management device 8.

  As shown in the figure, the central management device 8 has a control unit main body 10 for controlling its operation. The control unit main body 10 includes a CPU 12 that executes logical operations, a ROM 13 that stores various programs for controlling the CPU 12 in advance, a RAM 14 that temporarily stores various data during operation of the apparatus, an HDD 15, and an I / O controller. (IOC) 16 and the like, and these CPUs 12 are connected to each other via an internal bus.

  The HDD 15 stores (stores) various application software programs and various types of information related to the production of the devices 1 to 6 such as board data, component data, printing and mounting position data, and reflow temperature data. ing. Further, the HDD 15 also stores data such as post-inspection items to be implemented by the inspection devices 2, 4, and 6 and the inspection conditions of the inspection items.

  The IOC 16 is connected to an input means 18 such as a keyboard and a mouse, and a display means 19 such as a CRT monitor or an LCD monitor, and the devices 1 to 6 are connected. In response to predetermined instruction information input by operation and various operation signals from the devices 1 to 6, the entire management device is controlled.

  The control unit main body 10 is further provided with an external storage device 17 such as a magneto-optical disk. The production history in each of the devices 1, 3A, 3B, 5 and the inspection of each of the inspection devices 2, 4, 6 are provided. Various information such as a history is stored (stored) in the external storage device 17. For example, various inspection information such as inspection results in the inspection devices 2, 4 and 6 for each substrate and image data of the substrate used for each inspection, and errors generated in each processing device (devices 1, 3A, 3B, 5) And information related to maintenance are stored.

  Of the information stored in the external storage device 17, the inspection information is automatically transmitted from each inspection device 2, 4, 6 during operation of the component mounting line, and sequentially stored in the external storage device 17 together with the identification information of each board. The The substrate identification information is written for each substrate, for example, as a bar code or a QR code, and is read at the same time as the image recognition of the substrate in each of the inspection devices 2, 4 and 6, and the central management device together with the inspection result and image data 8 is transmitted. The error-related information, maintenance-related information, and the like are transmitted to the central management device 8 when the operator operates the input means 18 such as a keyboard provided in each of the devices 1 to 6 and inputs the error content and the maintenance content. It is like that.

  FIG. 3 is a block diagram illustrating a functional configuration for managing the inspection conditions of specific inspection items of the inspection devices 2, 4, and 6 among the functional configurations included in the control unit main body 10.

  As shown in this figure, the control unit main body 10 includes a main control unit 21, an inspection information storage unit 22, an inspection condition change control unit 23, and a display control unit 24 as the above functional configuration.

  The main control unit 21 comprehensively controls various processes in managing inspection conditions.

  The inspection information storage unit 22 stores inspection information of each of the inspection devices 2, 4, and 6, specifically, inspection items and inspection conditions for each inspection item. FIG. 4 shows the inspection items of each of the inspection devices 2, 4, 6, and these inspection items and the inspection conditions for each inspection item, that is, pass / fail judgment criteria (threshold value, etc.) Is stored in the inspection information storage unit 22. For example, the inspection information of the printing inspection apparatus 2 includes, as shown in the figure, misregistration (solder printing misregistration), shortage (no solder printing), excessive or insufficient solder application amount, and presence / absence of a solder bridge. Inspection items and inspection conditions for each item are stored. Also, the inspection information of the soldering inspection device 6 includes misalignment (component misalignment), missing item (no component), excessive or insufficient amount of solder applied, presence of bridge, polarity discrimination (polarity error), and erroneous component ( Inspection items such as (component mistake) and inspection conditions for each item are stored.

  Of the inspection conditions, those in which the set value can be changed by the operation of an operator or the like, or those in which the set value is changed based on a command signal from the inspection condition change control unit 23 to be described later, together with the initial value of the inspection condition Are stored in the inspection information storage unit 22.

  The inspection condition change control unit 23 determines whether or not there is a contradiction in the inspection results between the soldering inspection apparatus 6 and the other inspection apparatuses 2 and 4 for inspection items that are common or related to each other. When there is a contradiction, a command signal is output to change the inspection condition set for the inspection item of the print inspection apparatus 2 or the mounting inspection apparatus 4, and the print inspection apparatus 2 and the mounting inspection apparatus 4 The inspection conditions are changed and set according to the command signal. Note that “common or related inspection items” are inspection items in which one inspection result and the other inspection result normally match because the inspection objects are common, or inspection objects are different, but the inspection objects are different. This means that the inspection items are generally related to each other and the inspection results of both inspections coincide with each other.

  In the present embodiment, as a related inspection item, “excess / deficiency inspection of solder application amount” is determined based on the inspection results of both the printing inspection apparatus 2 and the soldering inspection apparatus 6, and there is a contradiction. In order to change the inspection conditions set for the inspection item, the inspection condition change control unit 23 outputs a command signal to the print inspection apparatus 2. Specifically, in the printing inspection apparatus 2, “area tolerance (initial value): 50% to 150%” is set as an inspection condition of “excess / insufficient inspection of solder application amount”, and the inspection results are inconsistent. In this case, a command signal is output to the print inspection apparatus 2 so that the tolerance is increased or decreased by a predetermined constant value. In addition, regarding “misalignment of (component)” as a common inspection item, it is determined whether there is a contradiction based on the inspection results of both the mounting inspection apparatus 4 and the soldering inspection apparatus 6, and if there is a contradiction, the inspection A command signal is output to the mounting inspection device 4 in order to change the inspection condition of the item. Specifically, the mounting inspection apparatus 4 defines “positional deviation tolerance (initial value); +0.2 mm to −0.2 mm” as an inspection condition of “(component) positional deviation inspection”. When a contradiction occurs, a command signal is output to increase or decrease this tolerance by a predetermined constant value.

  In the present embodiment, the inspection condition change control unit 23 corresponds to a determination unit and a condition change unit of the present invention.

  The display control unit 24 performs a predetermined screen display on the display unit 19 in accordance with a program stored in advance. For example, when there is a contradiction in the inspection result, the corresponding inspection device 2, 4, 6, Display control is performed to display information such as inspection items and inspection conditions on the display means 19. In this case, display control is performed so that the conditions before and after the change are displayed as the inspection conditions and the initial values of the inspection conditions are displayed together.

  Next, an example of operation control of inspection condition management (change) by the control unit body 10 will be described based on the flowchart of FIG. In the following flowchart, the case of managing (changing) the inspection conditions of the mounting inspection apparatus 4 for “(component) misalignment inspection” among the above inspection items will be described, and then the inspection item “solder application amount” The case of managing the inspection conditions of the print inspection apparatus 2 will be supplemented for “excess / insufficiency inspection”.

  This flowchart starts when an inspection result by the soldering inspection apparatus 6 is transmitted to the central management apparatus 8 in the component mounting line.

  When the inspection is finished in the soldering inspection apparatus 6 and the inspection result of the board is transmitted to the central management apparatus 8, first, in step S1, the inspection results of the inspection apparatuses 2, 4, 6 of the board are inspected. The change control unit 23 reads the data and compares the inspection results of the previous and subsequent processes. That is, the inspection results of the inspection apparatuses 2 and 6 for the inspection item “(component displacement inspection)” are compared, and the inspection condition change control unit 23 determines whether or not there is a contradiction between both inspection results (step). S2). If YES is determined here, this flowchart is terminated.

  On the other hand, if NO is determined in step S2, it is determined whether or not there is a contradiction in the inspection results continuously for a predetermined number of substrates including the substrate (step S3). If NO is determined in step S4, it is determined whether or not the above contradiction has occurred beyond a predetermined ratio (for example, 10% per lot) (step S4). And when it is judged NO here, this flowchart is complete | finished.

  On the other hand, if YES is determined in steps S3 and S4, the process proceeds to step S5, a command signal is output from the inspection condition change control unit 23 to the mounting inspection device 4, and the inspection item ( The inspection condition of “(component misalignment inspection)”) is changed (automatic parameter correction), and the changed inspection condition is stored in the inspection information storage unit 22.

  Specifically, when the inspection result of the soldering inspection apparatus 6 is “pass” determination and the inspection result of the mounting inspection apparatus 4 is “fail” determination, the result of the mounting inspection apparatus 4 is as a result. The inspection conditions are considered to be too strict. In this case, the upper and lower limit values of the positional deviation tolerance are enlarged by a predetermined value (for example, 0.05 mm), and thereby the positional deviation tolerance is “+0.25 mm to −0.25 mm”. And the tolerance is updated and stored in the inspection information storage unit 22 as the current inspection condition.

  On the other hand, when the inspection result of the soldering inspection apparatus 6 is “fail” and the inspection result of the mounting inspection apparatus 4 is “pass”, the inspection conditions of the mounting inspection apparatus 4 are loose as a result. In this case, the upper and lower limit values of the positional deviation tolerance are reduced by 0.05 mm, the positional deviation tolerance is changed to “+0.15 mm to −0.15 mm”, and the tolerance is checked with the current inspection. The condition is stored in the inspection information storage unit 22 as a condition.

  Thus, after the change of the inspection condition is completed in step S5, this flowchart is ended.

  Note that the above is the control for managing (changing) the inspection conditions of the mounting inspection apparatus 4 for the “(position) displacement inspection”, but this also applies to the “solder application amount excess / deficiency inspection”. The inspection conditions of the printing inspection apparatus 2 are managed (changed) by performing the same processing in parallel.

  In this case, the specific process of step S5 is as follows. First, when the inspection result of the soldering inspection apparatus 6 is “pass” and the inspection result of the print inspection apparatus 2 is “fail”, the inspection condition of the print inspection apparatus 2 is as a result. In this case, the upper and lower limits of the misalignment tolerance depend on whether the inspection result of the soldering inspection device 6 is a failure determination due to “insufficient solder” or a failure determination due to “excess solder”. Are increased or decreased by a predetermined value (for example, 2%). Specifically, when the judgment of the printing inspection device 2 is a failure judgment due to “insufficient solder”, the lower limit value of the area tolerance is lowered by 2% and the area tolerance of the solder printing is changed to “48% to 150%”. In the case of failure determination due to “excessive solder”, the upper limit value of the area tolerance is increased by 2% and the area tolerance of the solder printing is changed to “50% to 152%”.

  Conversely, when the inspection result of the soldering inspection apparatus 6 is “fail” and the inspection result of the print inspection apparatus 2 is “pass”, the inspection condition of the print inspection apparatus 2 is as a result. In this case, the upper and lower limits of the area tolerance are increased or decreased by 2%. Specifically, when the determination of the soldering inspection apparatus 6 is a failure determination due to “insufficient solder”, the lower limit value of the area tolerance is increased by 2%, and the area tolerance of the solder printing is set to “52% to 150%”. In the case of a failure determination due to “excess solder”, the upper limit value of the area tolerance is lowered by 2% and the area tolerance of the solder printing is changed to “50% to 148%”. Then, the tolerance of the change is updated and stored in the inspection information storage unit 22 as the current inspection condition.

  According to the control by the control unit main body 10 as described above, for example, when an inconsistent inspection result is obtained between the mounting inspection apparatus 4 and the soldering inspection apparatus 6 for the “(component displacement) inspection”, step S5 is performed. The positional deviation tolerance is changed by the above processing, and thereafter, “(position) positional deviation inspection” is performed in the mounting inspection apparatus 4 based on the changed positional deviation tolerance. If inconsistent inspection results still appear after this processing, the positional deviation tolerance is changed again by satisfying the conditions of steps S3 and S4 (YES in steps S3 and S4). Until the contradiction is resolved, the positional deviation tolerance is repeatedly changed by a predetermined value. The same applies to the case where an inconsistent inspection result is generated between the printing inspection apparatus 2 and the soldering inspection apparatus 6 with respect to the “inspection for excess / deficiency of solder application”.

  According to the component mounting line described above, the print inspection apparatus 2 or the mounting inspection apparatus 4 and the soldering inspection apparatus 6 have common features such as “excess / deficiency inspection of solder application amount” and “(position) displacement inspection”. When inspection results that are contradictory or related inspection items occur frequently or more than a certain level, the inspection conditions for the inspection items of the print inspection device 2 and the mounting inspection device 4 are increased or decreased by a certain value. As a result, a situation in which inconsistent inspection results occur continuously can be automatically resolved.

  Therefore, when inconsistent inspection results are generated between inspection devices for common or related inspection items as in this type of component mounting line, the inspection devices, inspection items, and inspection conditions that caused the inconsistencies The troublesome work of changing the inspection condition of the inspection item by the manual operation while the operator is specifying is unnecessary, and it is possible to eliminate the unnecessary rejection judgment at an early stage. As a result, the production of the substrate can be proceeded more smoothly.

  In addition, the change in the inspection conditions as described above satisfies at least one of the requirements when a contradiction occurs in the inspection results of a predetermined number of consecutive boards or when the inspection results are inconsistent over a predetermined ratio. (If YES in steps S3 and S4 in FIG. 5), for example, a contradiction in the inspection result is a temporary one caused by an error in image recognition or the like. Regardless of the case, it is possible to avoid a situation in which the inspection conditions are unnecessarily changed, and thus the reliability of the inspection can be kept good.

  The above-described component mounting line is an embodiment of a component mounting line to which the inspection condition management system according to the present invention is applied, and the specific configuration thereof is appropriately changed without departing from the gist of the present invention. Is possible. For example, the following may be used.

  (1) In the embodiment, among the inspection items carried out in each of the inspection devices 2, 4 and 6 of the component mounting line, “(component) misalignment inspection” and “solder application amount excess / deficiency inspection” The case where the inspection conditions of the printing inspection apparatus 2 and the mounting inspection apparatus 4 are managed for the inspection items has been described. Of course, when the inspection conditions of the inspection apparatuses 2, 4, 6 are managed for other inspection items. The present invention is also applicable. For example, as for the inspection items shown in FIG. 4, items other than “(component misalignment inspection)” and “solder application amount excess / deficiency inspection” also include a plurality of inspection devices 2, 4, 6 as shown in FIG. Therefore, the inspection conditions of the print inspection apparatus 2 and the mounting inspection apparatus 4 may be managed for any of these inspection items.

  (2) In the embodiment, when inconsistent inspection results are obtained, the inspection condition (tolerance) set in the print inspection apparatus 2 or the mounting inspection apparatus 4 is increased or decreased by a predetermined constant value. The set inspection conditions are automatically changed. For example, the inspection conditions are not changed, and information such as inspection devices 2 and 4 in which a contradiction has occurred, inspection items, inspection results, and inspection conditions are displayed. Instead of displaying on the means 19, the operator may change the inspection conditions (setting tolerances) of the inspection apparatuses 2 and 4 by manual operation based on the information display.

  In this way, the inspection condition changing operation is performed manually, but the operator can quickly specify the inspection device, inspection item, inspection condition, etc. in which a contradiction has occurred based on the display on the display means 19. Therefore, compared with the conventional apparatus of this type (that is, such identification can be performed quickly), it is possible to quickly take measures when there is a contradiction in the test results. Moreover, in this configuration, the operator can change the inspection condition (tolerance) to an arbitrary value by referring to the inspection result or the like. For example, the setting inspection of the print inspection apparatus 2 or the mounting inspection apparatus 4 due to an input error of the inspection condition. There is a merit that prompt treatment is possible when conditions need to be reexamined drastically.

  (3) Note that if there is a contradiction in the inspection results, the set inspection conditions may not always be inappropriate. Therefore, assuming such a case, step S5 in the flowchart of FIG. Instead of the above process, the processes of steps S10 to S13 shown in FIG. 6 may be performed.

  That is, if YES is determined in steps S3 and S4, the process proceeds to step S10, where it is determined whether or not the change of the inspection condition is appropriate (step S10). If YES is determined here, the process proceeds to step S13 to change the inspection condition. The processing content of step S13 is the same processing content as the processing of step S5 in FIG.

  On the other hand, if NO is determined in step S10, information such as a possible inspection item, that is, an inspection device, an inspection item, an inspection condition, etc. in which a contradiction has occurred is displayed on the display means 19 (step S11). Then, for example, after the operator has taken necessary measures for this display, it is determined whether or not the work has been completed, specifically, whether or not there is an input operation by the input means 18 (step S12), and the process has been completed. If it is determined that, this flowchart is terminated.

  According to such control, when a shield field occurs in the inspection result, it is possible to intervene the operator's intention in order to eliminate this. For example, when the cause of the contradiction in the inspection result is uncertain. Preferred.

  More specifically, in the “solder bridge inspection” (see FIG. 4), which is an inspection item common to the printing inspection apparatus 2 and the soldering inspection apparatus 6, the inspection result of the printing inspection apparatus 2 is a pass determination. In some cases, the inspection result of the soldering inspection apparatus 6 may be a failure determination. In this case, in addition to the case where the inspection conditions of the printing inspection apparatus 2 are inappropriate, there is a high possibility that the pressing force of the component at the time of component mounting is inappropriate. In step S11, the display means 19 displays information on possible items, that is, "solder bridge inspection", and information such as inspection results and inspection conditions.

  In this way, the operator can change the inspection conditions of the print inspection apparatus 2 if there is no abnormality after checking whether or not the component pressing force is appropriate in the mounting apparatuses 3A and 3B. It becomes. Therefore, it is possible to effectively avoid a situation in which the inspection conditions of the printing inspection apparatus 2 are changed in spite of improper component pressing forces in the mounting apparatuses 3A and 3B, and reasonably contradictory causes. Can be eliminated.

  Here, the case of “solder bridge inspection” has been described as an example of inspection items, but other inspection items may have other causes of inconsistency in inspection results (other than inappropriate setting of inspection conditions). Items may be set in advance so that a NO determination is made in step S10, and a room where the operator's intention can be intervened may be provided.

  (4) In the embodiment, when there is a contradiction in the inspection result between the printing inspection apparatus 2 or the mounting inspection apparatus 4 and the soldering inspection apparatus 6, the inspection result of the soldering inspection apparatus 6 is respected (standard) The inspection conditions of the printing inspection apparatus 2 or the like, which is the inspection of the previous process, are changed. This is because the inspection after the reflow process is the final stage inspection, and the condition is generally the printing inspection apparatus. This is because it is stricter than 2 mag and presupposes that the reliability of the inspection result is high. Therefore, when there is no difference in inspection level (degree of precision of inspection) between the printing inspection apparatus 2 and the like and the soldering inspection apparatus 6, the inspection conditions of the soldering inspection apparatus 6 may be changed. Which inspection result is used as a reference may be appropriately determined according to a specific inspection item or the like.

  Further, in the embodiment, the case has been described in which there is a contradiction in the inspection results for the inspection items that are common or related to the print inspection apparatus 2 or the mounting inspection apparatus 4 and the soldering inspection apparatus 6, but of course the print inspection apparatus Similarly, the present invention can be applied to the case where the inspection result is inconsistent between the mounting inspection apparatus 4 and the mounting inspection apparatus 4. In this case as well, which inspection result is used as a reference depends on a specific inspection item or the like. It may be determined appropriately according to the situation.

  (5) In the embodiment, the central management device 8 is provided in the component mounting line, and the inspection information storage unit 22, the inspection condition change control unit 23, the display control unit 24, and the like are provided in the control unit main body 10. For example, a functional configuration may be provided in the control device of the soldering inspection apparatus 6 so that the soldering inspection apparatus 6 performs processing such as determination of contradiction of inspection results and a change command for inspection conditions.

  (6) In the embodiment, the solder printing device 1 is disposed as the paste coating device and the printing inspection device 2 is disposed as the processing inspection device upstream of the mounting devices 3A and 3B. A dispenser may be provided as an apparatus, and a coating inspection apparatus may be provided as an inspection apparatus for the processing.

  (7) Each inspection device 2, 4, 6 may have the following configuration.

1. Print Inspection Device In the embodiment, the print inspection device 2 is provided independently between the solder printing device 1 and the mounting device 3A, but is integrated with the solder printing device 1 (for example, the solder printing device 1). Or integrated into the mounting device 3A on the upper process side (for example, integrated into the substrate carrying-in portion of the mounting device 3A). Good. In this case, it goes without saying that the same applies to the coating inspection apparatus when the configuration (6) is adopted.

2. Mounting Inspection Device In the embodiment, the mounting inspection device 4 common to both mounting devices 3A and 3B is independently provided between the lower process side mounting device 3B and the reflow furnace 5, but the mounting device 3A, A dedicated mounting inspection device may be provided for each 3B.

  That is, the substrate after the processing of the first mounting device 3A is placed between the upper mounting device 3A (referred to as the first mounting device 3A for convenience) and the lower mounting device 3B (referred to as the second mounting device 3B for convenience). A mounting inspection apparatus to be inspected (referred to as a first mounting inspection apparatus 4A for convenience) is arranged independently, and the substrate after processing of the second mounting apparatus 3B is inspected between the second mounting apparatus 3B and the reflow furnace 5. A mounting inspection device (referred to as a second mounting inspection device 4B for convenience) may be arranged independently. Further, when the mounting inspection apparatus is provided for each of the mounting apparatuses 3A and 3B as described above, the first mounting inspection apparatus 4A is integrated with the first mounting apparatus 3A (for example, a board carry-out portion of the first mounting apparatus 3A). May be integrated into the second mounting apparatus 3B (for example, integrated into the board loading portion of the second mounting apparatus 3B). Similarly, the second mounting inspection apparatus 4B is integrated with the second mounting apparatus 3B (for example, integrated with the board unloading portion of the second mounting apparatus 3B) or integrated with the reflow furnace 5. (For example, one integrated into the substrate loading portion of the reflow furnace 5).

3. Soldering inspection device 6
In the embodiment, the soldering inspection apparatus 6 is provided independently on the downstream side of the reflow furnace 5, but is integrated with the reflow furnace 5 (for example, integrally with the board carry-out portion of the solder reflow furnace 5. May be incorporated).

  As an aspect in which the inspection apparatus and the processing apparatus are integrated, a part of the configuration of the processing apparatus is shared as a part of the configuration of the inspection apparatus so that the inspection apparatus is integrated into the processing apparatus. It is also possible to use such an embodiment. For example, in the case where the mounting apparatus 3B has a movable head unit including a component suction head, and the component is mounted while moving the head unit relative to the substrate, A configuration in which a camera for board imaging is mounted on this head unit, and after mounting processing, the mounting point is imaged and inspected with the movement of the head unit, that is, the head unit (and its driving means) is shared The mounting inspection device 4 may be integrated into the mounting device 3B.

  (8) Display on a processing device (solder printing device 1, mounting devices 3A and 3B, reflow furnace 5) and inspection device (printing inspection device 2, mounting inspection device 4, soldering inspection device 6) such as a CRT monitor or LCD monitor Means may be provided to display information such as the inspection apparatus, inspection items, and inspection conditions in which a contradiction has occurred.

  For example, as described in (2) above, when information on an inspected inspection apparatus or the like is displayed and the operator is allowed to change the inspection conditions manually, or as described in (3) above, When the information on the inspection device or the like in which the error occurred is displayed once (the process in step S11 in FIG. 6), the display unit of one or a plurality of related devices among the processing devices and the inspection devices, or the display means of all the devices described above. Information may be displayed. According to such a configuration, when the operator is monitoring in the vicinity of the component mounting line, the operator confirms the display contents, so that the inspection device, the inspection item, and the inspection condition in which the inspection result is inconsistent can be obtained. There is an advantage that it is possible to promptly take measures such as quickly specifying and changing the inspection conditions of the target inspection device.

  As described in (7) above, when the inspection apparatus is integrated into the processing apparatus, a common display means is provided for the integrated apparatus, and the display means has a contradiction. What is necessary is just to make it display the information of the produced | generated inspection apparatus.

It is a schematic diagram which shows the component mounting line to which the information management system which concerns on this invention is applied. It is a block diagram which shows the control system of a central management apparatus. It is shown with the block diagram which shows the functional structure for managing the inspection conditions of the specific test | inspection item of a printing inspection apparatus and a mounting inspection apparatus among the functional structures contained in a control part main body. It is a figure which shows the relationship between each inspection apparatus and an inspection item. It is a flowchart which shows an example of the management (change) operation control of the inspection conditions by a control part main body. It is a flowchart which shows another example of management (change) operation control of inspection conditions.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder printing apparatus 2 Print inspection apparatus 3A, 3B Mounting apparatus 4 Mounting inspection apparatus 5 Reflow furnace 6 Soldering inspection apparatus 8 Central management apparatus 10 Control part main body 18 Input means 19 Display means 21 Main control part 22 Inspection information storage part 23 Inspection Condition change control unit 24 Display control unit

Claims (10)

A plurality of processing apparatuses including at least two of a paste coating apparatus, a component mounting apparatus, and a reflow apparatus; and an inspection apparatus that inspects the substrate based on image recognition after processing by each processing apparatus, and a plurality of inspections An inspection condition management system for a component mounting line configured to inspect inspection items common to or related to each other between devices,
A determination means for determining whether or not there is a contradiction in the inspection result between the inspection apparatuses with respect to the common or related inspection items, based on the inspection result in each inspection apparatus of the common substrate;
Condition changing means for changing the inspection conditions of the common or related inspection items in any of the inspection apparatuses out of which the inspection results have inconsistencies when the determination means determines that there is a contradiction; Inspection condition management system characterized by having. In the inspection condition management system according to claim 1,
The condition changing means has at least one requirement when the contradiction occurs for the inspection results of a predetermined number of consecutive substrates or when the contradiction occurs for a predetermined number of substrate inspection results exceeding a predetermined ratio. An inspection condition management system characterized by changing the inspection conditions when satisfied. In the inspection condition management system according to claim 1 or 2,
The component mounting line includes the reflow device,
The condition changing means is configured to execute a process executed before the reflow process when there is a contradiction between an inspection result after the reflow process and an inspection result after the process performed before the reflow process. An inspection condition management system, wherein only the inspection condition in the inspection after the processing is changed. In the inspection condition management system according to claim 3,
After component mounting processing and after reflow processing, the component mounting error is determined to pass or fail based on a predetermined allowable value,
The condition changing unit is configured to increase / decrease the allowable value in the inspection after the component mounting process by a preset value as the inspection condition. In the inspection condition management system according to claim 3,
After the paste application process and after the reflow process, the paste application amount is determined to pass or fail based on a predetermined allowable value,
The condition changing unit is configured to change the allowable value in the inspection after the paste coating process as an inspection condition by increasing or decreasing by a preset value. A plurality of processing apparatuses including at least two of a paste coating apparatus, a component mounting apparatus, and a reflow apparatus; and an inspection apparatus that inspects the substrate based on image recognition after processing by each processing apparatus, and a plurality of inspections An inspection condition management system for a component mounting line configured to inspect inspection items common to or related to each other between devices,
Display means capable of displaying various types of information related to board production;
A determination means for determining whether or not there is a contradiction in the inspection result between the inspection apparatuses with respect to the common or related inspection items, based on the inspection result in each inspection apparatus of the common substrate;
Information that can identify a corresponding inspection device by using at least one of the common or related inspection item and the inspection condition of each inspection device related to the item when it is determined that there is a contradiction by this determination means And a display control means for displaying the screen by the display means. A component including a plurality of processing devices including at least a component mounting device among a paste application device, a component mounting device, and a reflow device, and a plurality of inspection devices that inspect the substrate based on image recognition after processing by each processing device. In the mounting system,
A determination means for determining whether or not there is a contradiction in the inspection results between the inspection apparatuses with respect to inspection items that are common or related to each other, based on the inspection results in each inspection apparatus of the common substrate;
Condition changing means for changing the inspection conditions of the common or related inspection items in any of the inspection apparatuses out of which the inspection results have inconsistencies when the determination means determines that there is a contradiction; A component mounting system characterized by comprising. In the component mounting system according to claim 7,
At least one inspection device among the plurality of inspection devices is provided integrally with a processing device that performs processing to be inspected. A processing device incorporated in the component mounting system according to claim 7 or 8,
Information that can identify a corresponding inspection device with at least one of the common or related inspection item and the inspection condition of each inspection device related to the item when the determination unit determines that there is a contradiction And a display device capable of displaying a screen together. An inspection apparatus incorporated in the component mounting system according to claim 7 or 8,
Information that can identify a corresponding inspection device with at least one of the common or related inspection item and the inspection condition of each inspection device related to the item when the determination unit determines that there is a contradiction An inspection apparatus comprising display means capable of displaying a screen together.

Images