JP6261562B2 - Component mounter - Google Patents

Description

  The present invention relates to a component mounting machine having a function of stopping a circuit board conveyed by a conveyor at a predetermined target stop position.

  In general, as described in Patent Document 1 (Japanese Patent Laid-Open No. 2005-72136), a circuit board transported by a conveyor is controlled by a board detection sensor in a predetermined board detection position (of the conveyor). After detecting the passage through the entrance or the like, the conveyor motor is feedforward controlled to stop the circuit board at a target stop position that is a predetermined distance away from the board detection position. In this feedforward control, the motor is controlled with a command value set according to the distance from the substrate detection position to the target stop position.

  However, in the feedforward control, it is difficult to accurately stop the circuit board conveyed by the conveyor at the target stop position, and the stop position of the circuit board is likely to deviate from the target stop position. There are several reasons for this, for example, the circuit board contacts the conveyor guide rail of the conveyor during conveyance, and the frictional force causes the circuit board on the conveyor to be displaced, or the circuit board on the conveyor is positioned due to the vibration of the conveyor. It may shift.

  Therefore, as described in Patent Document 2 (Japanese Patent Application Laid-Open No. 2006-229095), the stop position of the circuit board is measured by a captured image of the board recognition camera, and the deviation between the stop position of the circuit board and the target stop position is measured. The amount of deviation is calculated, the amount of deviation data is stored in the memory, and every time the number of substrates transported reaches a predetermined number, the average value of deviation amounts at the stop position is calculated, and the average value of deviation amounts at the stop position is calculated. There is one in which the motor control value is offset-corrected based on this.

JP 2005-72136 A JP 2006-229095 A

  However, the shift amount of the stop position of the circuit board due to friction or vibration during conveyance is not constant, but varies randomly at each stop, so that the average value of the shift amounts of the stop position is the same as in Patent Document 2 above. Even if the motor control value is offset-corrected based on this, the amount of deviation of the stop position of the circuit board only decreases on average, and the stop position of the circuit board shifts randomly due to friction or vibration during conveyance. It cannot be prevented.

  Therefore, the problem to be solved by the present invention is a component that can stably and accurately stop the circuit board at the target stop position even if the position of the circuit board on the conveyor is shifted due to friction or vibration during conveyance. It is to provide a mounting machine.

In order to solve the above-described problems, the present invention provides a plurality of conveyors that transport a plurality of circuit boards using a plurality of motors as drive sources, and a plurality of circuit boards that are transported by the plurality of conveyors at predetermined target stop positions, respectively. In a component mounter including a conveyance control unit that controls the plurality of motors so as to be stopped, a plurality of imaging devices that respectively image a plurality of circuit boards conveyed by the plurality of conveyors from above, and the plurality of the plurality of circuit boards Image processing means for processing an image picked up by the image pickup device; and board position measuring means for measuring the positions of the plurality of circuit boards based on the image processing result of the image processing means, and the conveyor includes a circuit. A conveyance guide rail for guiding the conveyance direction of the substrate is provided, and a plurality of position marks are arranged in the conveyance direction at a predetermined pitch on the upper surface of the conveyance guide rail. The imaging device captures and captures a circuit board conveyed by the conveyor and the plurality of position marks in a field of view, and the substrate position measuring unit is configured to detect positions of the plurality of position marks recognized by the image processing unit. And measuring the position of the circuit board based on the measurement result, and the transport control means stops the plurality of circuit boards at the target stop position based on the measurement result of the board position measurement means. Are respectively feedback-controlled.

  As in the present invention, the circuit board conveyed by the conveyor is imaged from above by the imaging device, the image is processed to measure the position of the circuit board, and the circuit board is measured at the target stop position based on the measurement result. If the motor is feedback controlled so that it stops, even if the position of the circuit board on the conveyor shifts due to friction or vibration during transport, the position of the circuit board being transported is measured and the circuit board is stabilized at the target stop position. And can be stopped with high accuracy.

In this case, a plurality of position marks are arranged in a transport direction at a predetermined pitch on the upper surface of the transport guide rail of the conveyor, and the imaging device stores the circuit board transported by the conveyor and the plurality of position marks in the field of view. captured, the substrate position measuring means, said the position of the plurality of position marks recognized by the image processing means on the basis of the so that to measure the position of the circuit board, displacement of the mounting position of the imaging device, By measuring the position of the circuit board with reference to the position of a plurality of position marks arranged at a predetermined pitch, even if there is a factor of measurement error due to the displacement of the visual field due to thermal deformation, distortion of the optical system, etc., By canceling the cause of the measurement error, the position of the circuit board being conveyed can be measured with high accuracy.

  In addition, the circuit board that is carried into the target stop position by the conveyor and the circuit board that is carried out from the target stop position are captured in the field of view of the imaging device, and the board is loaded by the transport control means based on the measurement result of the board position measuring means. The substrate carry-in operation and the substrate carry-out operation may be performed in parallel so as to ensure a gap (interval) between the circuit board in the middle and the circuit board being carried out so as to avoid a collision between them. Conventionally, since the loading of the next circuit board is started after the unloading of the circuit board is completed, the time interval for loading the circuit board becomes long. On the other hand, as in the present invention, when the circuit board being carried in and the circuit board being carried out are stored in the field of view of the imaging device, the circuit board being carried in and the circuit board being carried out are The board carry-in operation and the board carry-out operation can be performed in parallel while ensuring a gap that can avoid the collision between the two, and the time interval for carrying the circuit board can be shortened. It can be improved. In addition, if the circuit board being carried out becomes clogged for some reason and cannot be carried out, the carry-in of the circuit board is stopped by stopping the conveyor before the circuit board being carried in collides with the circuit board being carried out. Can do.

  Further, since the surface state and component mounting state of the circuit board conveyed by the conveyor are shown in the image captured by the imaging device, the surface state and component mounting state of the circuit board are recognized by image processing of the image processing means. It is possible. Focusing on this point, the present invention may be configured to include an appearance inspection unit that inspects the surface state and component mounting state of the circuit board based on the image processing result of the image processing unit. In this way, using the processing result of the image captured by the imaging device, the surface state of the circuit board (for example, the state of the wiring pattern, the printed state of the solder, the presence or absence of bad marks indicating defective products, etc.) and component mounting The state (for example, presence / absence of mounting parts, mounting position, etc.) can be inspected.

  Moreover, it is good also as a structure provided with the monitoring means which monitors the state inside a component mounting machine based on the image processing result of an image processing means. In this way, when an abnormality occurs inside the component mounter, the abnormality can be automatically detected if the location where the abnormality has occurred is imaged by the imaging device.

  Moreover, it is good also as a structure provided with the display apparatus which displays the image imaged with the said imaging device. In this way, the operator can visually check the internal state of the component mounter by looking at the screen of the display device. When an abnormality occurs inside the component mounter, Can be detected early and appropriate measures can be taken.

  Further, a means for measuring at least one of the width of the conveyor, the component supply position of the component supply device, the position of the backup pin for supporting the circuit board from below, and the number based on the image processing result of the image processing means. It is good also as a structure provided. In this way, using the captured image of the imaging device, in addition to the feedback control of the board transfer operation, the measurement of the width of the conveyor, the measurement of the component supply position of the component supply device, the position and number of backup pins Can also be measured.

FIG. 1 is a perspective view schematically showing each function of a component mounter according to an embodiment of the present invention. FIG. 2 is a side view of the main part of the component mounting machine. FIG. 3 is a perspective view showing the configuration of the conveyor and its peripheral portion. FIG. 4 is a block diagram showing the configuration of the control system of the component mounter. FIG. 5 is a flowchart showing the flow of processing of the transfer operation control program during normal transfer. 6A to 6E are plan views of the conveyors of the two component mounting machines for explaining the circuit board transport operation during normal transport. FIG. 7 is a flowchart showing the flow of processing of the transport operation control program during overlap transport. FIGS. 8A to 8C are plan views of the conveyors of the two component mounters for explaining the circuit board transport operation during the overlap transport.

Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described.
First, the structure of the component mounting machine 11 is demonstrated using FIG. 1 thru | or FIG.

  As shown in FIG. 1, the component mounter 11 is provided with two conveyors 13 for conveying the circuit board 12. Each conveyor 13 is driven by a motor 19 (see FIG. 4). Next to the conveyor 13, a component supply device 14 that supplies components is installed. A mounting head 15 that is moved in the XY direction by an XY moving device 16 (XY robot) is disposed on the upper side of the component mounting machine 11, and a component supply device is provided by a suction nozzle (not shown) held by the mounting head 15. The components supplied from 14 are sucked and mounted on the circuit board 12. The mounting head 15 is provided with a mark camera 17 (see FIG. 4) that captures an image of a reference mark on the upper surface of the circuit board 12 from above. In addition, there is provided a parts camera 18 (see FIG. 4) that captures an image of a component sucked by the suction nozzle.

  As shown in FIG. 3, a backup plate 23 is disposed below each conveyor 13 so as to be movable up and down by a lifting device 24, and a plurality of backup pins 25 that support the circuit board 12 from below are provided on the backup plate 23. It is placed so that it can be replaced.

  One conveyance guide rail 27 of each conveyor 13 is a reference rail whose position is fixed, and the other conveyance guide rail 28 is a movable rail that moves in the width direction according to the width of the circuit board 12. . A plurality of position marks 29 are arranged on the upper surface of each of the transport guide rails 27 and 28 in the transport direction (X direction) at a predetermined pitch.

  As shown in FIGS. 1 and 2, two image pickup devices 31 (for board position measurement) for picking up an image of the circuit board 12 conveyed by two conveyors 13 from above are provided on the ceiling of the component mounting machine 11. Camera). Each imaging device 31 is set so that the circuit board 12 transported by each conveyor 13 and the plurality of position marks 29 of the transport guide rails 27 and 28 are captured in one visual field. In addition, a display device 32 (see FIG. 4) that displays an image captured by the imaging device 31 is provided.

  As shown in FIG. 4, the control device 33 of the component mounter 11 includes an input device 34 such as a keyboard, a mouse, and a touch panel, and a storage device that stores a transfer operation control program and data shown in FIGS. 5 and 7 described later. 35 etc. are connected. The control device 33 functions as image processing means for processing the image picked up by the image pickup device 31 in addition to controlling the component suction operation and the component mounting operation of the mounting head 15, and on the conveyor 13 based on the image processing result. It also functions as a board position measuring means for measuring the position of the circuit board 12.

  Further, the control device 33 executes the transfer operation control program shown in FIGS. 5 and 7 to measure the position of the circuit board 12 transferred by the conveyor 13 from the picked-up image of the image pickup device 31 and based on the measurement result. It also functions as a conveyance control unit that feedback-controls the motor 19 of the conveyor 13 so that the circuit board 12 is stopped at a predetermined target stop position (component mounting position). During production (during operation of the component mounting machine 11), the circuit board 12 transported by the conveyor 13 and the plurality of position marks 29 of the transport guide rails 27 and 28 are captured in the field of view of the imaging device 31, and the image is captured. The process of recognizing the circuit board 12 and the plurality of position marks 29 and measuring the position of the circuit board 29 on the basis of the positions of the plurality of position marks 29 is repeatedly executed at a predetermined cycle.

  In this embodiment, there are two types of transfer modes of the circuit board 12, “normal transfer mode” and “overlap transfer mode”. In the normal transfer mode, FIG. 6 (only one conveyor 13 is shown). As shown in FIG. 4, until the circuit board 12 is unloaded from the conveyor 13 of the component mounting machine 11, the circuit board 12 is kept waiting at the outlet of the conveyor 13 of the upstream component mounting machine 11, and the circuit board 12 is After unloading is completed, loading of the circuit board 12 is started from the conveyor 13 of the component mounter 11 on the upstream side.

  On the other hand, in the overlap conveyance mode, as shown in FIG. 8 (only one conveyor 13 is shown), before the circuit board 12 is completely unloaded from the conveyor 13 of the component mounter 11, the upstream component mounter 11 The loading of the circuit board 12 from the conveyor 13 is started, the circuit board 12 being carried on the conveyor 13 and the circuit board 12 being carried out are captured in the field of view of the imaging device 31, and the image is processed and carried in. The positions of the circuit board 12 and the circuit board 12 being carried out are measured so that a gap (interval) between the circuit board 12 being carried in and the circuit board 12 being carried out can be avoided. It is executed in parallel (overlap) with the substrate carry-in operation and the substrate carry-out operation.

  The switching between the overlap conveyance mode and the normal conveyance mode may be performed manually by the operator, or the conveyance mode is automatically switched according to the type, production quantity, etc. of the component mounting board to be produced. You may do it.

  By the way, since the surface state and component mounting state of the circuit board 12 conveyed by the conveyor 13 are reflected in the image picked up by the imaging device 31, the surface state and component mounting state of the circuit board 12 are recognized by the image processing. Is possible.

  Focusing on this point, in the present embodiment, the control device 33 processes the image picked up by the image pickup device 31, recognizes the surface state and component mounting state of the circuit board 12, and based on the recognition result, the circuit. It also functions as an appearance inspection means for inspecting the surface state and component mounting state of the substrate 12. In this way, using the processing result of the image captured by the imaging device 31, the surface state of the circuit board 12 (for example, the state of the wiring pattern, the printed state of the solder, the presence / absence of a bad mark indicating a defective product, etc.) The component mounting state (for example, presence / absence of mounting component, mounting position, etc.) can be inspected. Thereby, a defective board can be discovered at an early stage, and it is possible to prevent the defective board from flowing to the component mounting machine 11 on the downstream side, and it is possible to avoid waste of mounting components on the defective board.

  In the present embodiment, an image captured by the imaging device 31 is displayed on the display device 32. In this way, the operator can visually check the internal state of the component mounter 11 by looking at the screen of the display device 32. When an abnormality occurs inside the component mounter 11, the abnormality is detected. Can be found early and appropriate measures can be taken. In addition, if an image captured by the imaging device 31 is displayed on a portable terminal (display device) carried by the worker, the worker who is away from the component mounter 11 sees the screen of the portable terminal to see the component. The state inside the mounting machine 11 can be confirmed.

  Furthermore, in the present embodiment, the control device 33 also functions as a monitoring unit that monitors the internal state of the component mounter 11 based on the processing result of the image captured by the imaging device 31. For example, when an abnormality occurs in the board transfer operation, the transfer state of the circuit board 12 on the conveyor 13, the presence / absence of the circuit board 12, the position of the circuit board 12 and the like are confirmed, and the content and cause of the abnormality in the board transfer operation May be specified and displayed on the display device 32 or the portable terminal. Further, it may be determined whether or not production can be automatically resumed from the state or position of the circuit board 12, and when it is judged that production can be resumed automatically, production may be automatically resumed. In addition, when it is determined that the circuit board 12 is clogged on the conveyor 13 during the conveyance, the clogging may be resolved by automatically rotating the conveyor 13 in the reverse direction.

  Also, images for a predetermined time taken by the image pickup device 31 are recorded in the storage device 35, and when an abnormality occurs in the component mounter 11, from a predetermined time before the occurrence of the abnormality to the time of the occurrence of the abnormality. An image obtained by photographing the inside of the component mounter 11 may be reproduced so that the operator can check it. By providing such a recording function, it can be used as an analysis tool when an abnormality occurs, and the cause of the abnormality that has occurred inside the component mounter 11 can be easily analyzed.

  Further, the control device 33 is based on the processing result of the image picked up by the image pickup device 31, among the width of the conveyor 13, the component supply position of the component supply device 14, the position and number of the backup pins 25 on the backup plate 23. You may make it measure at least one. For example, when the measured value of the width of the conveyor 13 does not match the width of the circuit board 12 to be loaded, the width of the conveyor 13 is automatically corrected so that the width of the conveyor 13 matches the width of the circuit board 12. May be. If the component supply position of the component supply device 14 can be measured, the component sent to the component supply position can be stably adsorbed by the adsorption nozzle of the mounting head 15. Further, when the function of measuring the position and number of the backup pins 25 on the backup plate 23 is provided, the number of backup pins 25 necessary for supporting the backup of the circuit board 12 on the conveyor 13 is backed up based on the measurement result. It is determined whether or not the required position on the plate 23 is set, and when an error in the position or number of the backup pins 25 is detected, the operator is warned of the error by display or sound on the display device 32. Production may be automatically stopped. In the case of the conventional machine, the position and the number of the backup pins 25 are confirmed one by one with a mark camera, and when there is an abnormality, it can only be determined that the cause of the abnormality is a detection abnormality. The time can be reduced and the situation can be confirmed by taking an image.

  Next, processing contents of the transfer operation control program executed by the control device 33 in normal transfer / overlap transfer in FIGS. 5 and 7 will be described. 5 and 7 are executed independently for each conveyor 13, and the transfer operation of the circuit board 12 is controlled independently for each conveyor 13.

[Transfer operation control program during normal transport]
The conveyance operation control program during normal conveyance in FIG. 5 is repeatedly executed during production. When this program is started, first, in step 101, it is determined whether or not the transfer mode of the circuit board 12 is the normal transfer mode. If it is determined that the circuit board 12 is not the normal transfer mode, the subsequent processing is not performed. This program is terminated as it is.

  On the other hand, if it is determined in step 101 that the normal conveyance mode is selected, the process proceeds to step 102 to determine whether or not the component mounting on the circuit board 12 on the conveyor 13 is completed. If not, it waits until the component mounting is completed.

  Thereafter, when the component mounting on the circuit board 12 is completed, the process proceeds to step 103, where the motor 19 of the conveyor 13 is started and the carry-out of the circuit board 12 is started. In the next step 104, it is determined whether or not the circuit board 12 has been unloaded based on the detection signal of the board detection sensor 22 at the exit of the conveyor 13, and it is determined that the circuit board 12 has not yet been unloaded. Then, it waits until the unloading of the circuit board 12 is completed. At this time, as shown in FIGS. 6B and 6C, the circuit board 12 is made to stand by at the outlet of the conveyor 13 of the upstream component mounter 11 until the circuit board 12 is unloaded.

  Thereafter, when the circuit board 12 is completely unloaded, the process proceeds to step 105, where the circuit board 12 is started to be loaded from the conveyor 13 of the component mounter 11 on the upstream side. Thereafter, the process proceeds to step 106, where the image captured by the imaging device 31 is processed to measure the current position of the circuit board 12 on the conveyor 13. Then, in the next step 107, it is determined whether or not the distance from the current position of the circuit board 12 to the target stop position (component mounting position) is within a deceleration zone within a predetermined value, and the distance to the target stop position If it is not within the deceleration zone within the predetermined value, the process returns to step 105 to continue the circuit board 12 carry-in operation, and in the next step 106, the process of measuring the position of the circuit board 12 being carried in is performed at a predetermined cycle. Run repeatedly.

  Thereafter, if it is determined in step 107 that the distance to the target stop position is within the deceleration zone within the predetermined value, the process proceeds to step 108, where the rotational speed of the motor 19 of the conveyor 13 is decreased to reduce the circuit board 12 The carry-in speed is reduced, and in the next step 109, the image picked up by the image pickup device 31 is processed to measure the current position of the circuit board 12 on the conveyor 13.

  Thereafter, the process proceeds to step 110, where it is determined whether or not the current position of the circuit board 12 has reached the target stop position. If it has not yet reached the target stop position, the process returns to step 108 to carry in the circuit board 12. In the next step 109, the speed is reduced, and the process of measuring the current position of the circuit board 12 on the conveyor 13 is repeatedly executed at a predetermined cycle. Thereby, in the deceleration zone where the distance to the target stop position is within a predetermined value, the conveyance speed of the circuit board 12 is gradually reduced so that the circuit board 12 can be stopped at the target stop position.

  Thereafter, if it is determined in step 110 that the current position of the circuit board 12 has reached the target stop position, the process proceeds to step 111, where the motor 19 of the conveyor 13 is stopped and the loading of the circuit board 12 is stopped. Then, the circuit board 12 is stopped at the target stop position, and this program is terminated.

[Transfer operation control program for overlap transport]
7 is repeatedly executed during production. When this program is started, first, in step 201, it is determined whether or not the transport mode of the circuit board 12 is the overlap transport mode. If it is determined that the circuit board 12 is not the overlap transport mode, the subsequent processing is performed. Without ending this program.

  On the other hand, if it is determined in the above step 201 that it is the overlap conveyance mode, the process proceeds to step 202, where it is determined whether or not the component mounting on the circuit board 12 on the conveyor 13 is completed, and the component mounting is still completed. If not, it waits until the component mounting is completed.

  Thereafter, when the component mounting on the circuit board 12 is completed, the process proceeds to step 203, where the motor 19 of the conveyor 13 is started to start unloading the circuit board 12. In the next step 204, the image picked up by the image pickup device 31 is processed to measure the position of the circuit board 12 being carried out.

  Thereafter, the process proceeds to step 205, and whether or not a clearance is secured between the circuit board 12 waiting at the outlet of the conveyor 13 of the upstream component mounter 11 and the circuit board 12 being carried out so as to avoid collision between the two. If it is determined that a gap capable of avoiding the collision is not secured, the process returns to step 203, and only the circuit board 12 is unloaded, and in the next step 106, the circuit board 12 being unloaded is removed. The process of measuring the position is repeatedly executed at a predetermined cycle.

  After that, in step 205, it is determined that a gap is secured between the circuit board 12 waiting at the exit of the conveyor 13 of the upstream component mounter 11 and the circuit board 12 being carried out so as to avoid collision between the two. If this is the case, the process proceeds to step 206, and in parallel with the carry-out operation of the circuit board 12, the carry-in of the circuit board 12 is started from the conveyor 13 of the upstream component mounter 11.

  In the next step 207, the circuit board 12 being carried in on the conveyor 13 and the circuit board 12 being carried out are captured in the field of view of the image pickup device 31, and the image is processed to carry out the circuit board 12 being carried in and carried out. The position of the circuit board 12 is measured. Thereafter, the process proceeds to step 208, where it is determined whether or not a gap that can avoid the collision between the circuit board 12 being carried in and the circuit board 12 being carried out is secured, and a gap that can avoid the collision is secured. If it is determined that the operation has not been performed, the process proceeds to step 209, where the motor 19 of the conveyor 13 is stopped, the conveyance of the circuit board 12 is stopped, and this program is terminated.

  On the other hand, if it is determined in step 208 that there is a gap between the circuit board 12 being carried in on the conveyor 13 and the circuit board 12 being carried out so that a collision between them can be avoided, step 210 is performed. To determine whether the distance from the position of the circuit board 12 being carried in to the target stop position (component mounting position) is within a deceleration zone within a predetermined value, and the distance to the target stop position is within a predetermined value If it is not within the deceleration zone, the above-described steps 206 to 210 are repeatedly executed at a predetermined cycle. Thereby, the loading operation and the unloading operation of the circuit board 12 are executed in parallel while ensuring a gap between the circuit board 12 being carried in and the circuit board 12 being carried out so as to avoid a collision between them.

  Thereafter, if it is determined in step 210 that the distance from the position of the circuit board 12 being carried in to the target stop position is within a deceleration zone within a predetermined value, the process proceeds to step 211 and the motor 19 of the conveyor 13 is rotated. The speed of the circuit board 12 is reduced by reducing the speed, and in the next step 212, the image taken by the imaging device 31 is processed to measure the position of the circuit board 12 being carried in.

  Thereafter, the process proceeds to step 213, where it is determined whether or not the position of the circuit board 12 being carried in has reached the target stop position. If it has not yet reached the target stop position, the process returns to step 211 and the motor of the conveyor 13 is reached. 19 is decelerated to reduce the loading speed of the circuit board 12, and in the next step 212, the process of measuring the position of the circuit board 12 being loaded is repeatedly executed at a predetermined cycle. Thereby, in the deceleration zone where the distance to the target stop position is within a predetermined value, the conveyance speed of the circuit board 12 is gradually reduced so that the circuit board 12 being carried in can be stopped at the target stop position.

  Thereafter, if it is determined in step 213 that the position of the circuit board 12 being carried in has reached the target stop position, the process proceeds to step 214 where the motor 19 of the conveyor 13 is stopped and the carry-in of the circuit board 12 is stopped. Then, the circuit board 12 is stopped at the target stop position, and this program is terminated.

  According to the present embodiment described above, the circuit board 12 conveyed by the conveyor 13 is imaged from above by the imaging device 31, the image is processed to measure the position of the circuit board 12, and based on the measurement result. Since the motor 19 of the conveyor 13 is feedback controlled so as to stop the circuit board 12 at the target stop position, even if the position of the circuit board 12 on the conveyor 13 is shifted due to friction or vibration during the conveyance, By measuring the position of the circuit board 12 inside, the circuit board 12 can be stably and accurately stopped at the target stop position.

  In addition, in this embodiment, a plurality of position marks 29 are arranged on the upper surface of the conveyance guide rails 27 and 28 of the conveyor 13 in the conveyance direction at a predetermined pitch, and the circuit board 12 and the plurality of position marks 29 conveyed by the conveyor 13 Since the position of the circuit board 12 is measured with reference to the positions of the plurality of position marks 29 recognized by processing the image, the mounting position of the imaging device 31 is measured. The position of the circuit board 12 is determined based on the positions of the plurality of position marks 29 arranged at a predetermined pitch even if there are causes of measurement errors due to misalignment, visual field misalignment due to thermal deformation, distortion of the optical system, etc. By measuring, the cause of the measurement error can be canceled and the position of the circuit board 12 being conveyed can be measured with high accuracy.

  Further, in the present embodiment, the overlap transport mode can be selected as the transport mode of the circuit board 12, and in the overlap transport mode, the upstream side before the circuit board 12 is unloaded from the conveyor 13 of the component mounting machine 11. The circuit board 12 is started to be carried in from the conveyor 13 of the component mounting machine 11, the circuit board 12 being carried on the conveyor 13 and the circuit board 12 being carried out are captured in the field of view of the imaging device 31, and the image is taken. Is processed to measure the position of the circuit board 12 being carried in and the circuit board 12 being carried out, and a gap is secured between the circuit board 12 being carried in and the circuit board 12 being carried out so that a collision between both can be avoided. As described above, since the board carrying-in operation and the board carrying-out operation are performed in parallel, the carrying-in operation of the next circuit board 12 is started after the carrying-out of the circuit board 12 is completed. , It is possible to shorten the time interval for carrying the circuit board 12, the productivity can be improved. When the circuit board 12 being carried out is clogged for some reason and cannot be carried out, the conveyor 13 is stopped before the circuit board 12 being carried in collides with the circuit board 12 being carried out. Carrying in can be stopped.

The present invention is not limited to the above-described embodiment, and departs from the gist such that each conveyor may be imaged by a plurality of imaging devices (cameras) to measure the position of the circuit board on the conveyor. Needless to say, various modifications can be made without departing from the scope.

DESCRIPTION OF SYMBOLS 11 ... Component mounting machine, 12 ... Circuit board, 13 ... Conveyor, 14 ... Component supply apparatus, 15 ... Mounting head, 16 ... XY moving device, 23 ... Backup plate, 25 ... Backup pin, 27, 28 ... Conveyance guide rail, 29 ... Position mark, 31 ... Imaging device, 32 ... Display device, 33 ... Control device (conveyance control means, image processing means, substrate position measuring means), 35 ... Storage device

Claims (6)

A plurality of conveyors that convey a plurality of circuit boards using a plurality of motors as driving sources, and a conveyance that controls the plurality of motors so that the plurality of circuit boards conveyed by the plurality of conveyors are stopped at a predetermined target stop position, respectively. In a component mounter comprising a control means,
A plurality of imaging devices that respectively image a plurality of circuit boards conveyed by the plurality of conveyors;
Image processing means for processing images picked up by the plurality of image pickup devices;
Board position measuring means for measuring the positions of the plurality of circuit boards based on the image processing results of the image processing means,
The conveyor is provided with a conveyance guide rail for guiding the conveyance direction of the circuit board,
On the upper surface of the conveyance guide rail, a plurality of position marks are arranged in the conveyance direction at a predetermined pitch,
The imaging device captures and images the circuit board and the plurality of position marks conveyed by the conveyor in a visual field,
The substrate position measuring means measures the position of the circuit board based on the positions of the plurality of position marks recognized by the image processing means;
The transport control unit performs feedback control of the plurality of motors so that the plurality of circuit boards are stopped at the target stop positions based on the measurement result of the substrate position measuring unit, respectively. . The imaging device captures an image of a circuit board carried into the target stop position by the conveyor and a circuit board carried out from the target stop position in a visual field,
The transport control means is configured to perform a board carry-in operation and a board carry-out so as to ensure a gap between the circuit board being carried in and the circuit board being carried out so as to avoid a collision between the circuit board and the circuit board being carried out based on the measurement result of the board position measuring means. The component mounter according to claim 1, wherein the component mounter is executed in parallel with the operation. Component mounting apparatus according to claim 1 or 2, characterized in that it comprises a visual inspection means for visual inspection of the surface state and / or the component mounting state of the circuit board based on the image processing result of the image processing unit . Component mounting apparatus according to any one of claims 1 to 3, characterized in that it comprises a monitoring means for monitoring the state of the internal component mounter based on the image processing result of the image processing unit. Component mounting apparatus according to any one of claims 1 to 4, characterized in that it comprises a display device for displaying an image taken by the image pickup device. Means for measuring at least one of the width of the conveyor, the component supply position of the component supply device, the position of the backup pin for supporting the circuit board from below, and the number based on the image processing result of the image processing means The component mounter according to any one of claims 1 to 5 , further comprising:

Images