JPH0199286A - Screen printing - Google Patents

Screen printing

Info

Publication number
JPH0199286A
JPH0199286A JP25784887A JP25784887A JPH0199286A JP H0199286 A JPH0199286 A JP H0199286A JP 25784887 A JP25784887 A JP 25784887A JP 25784887 A JP25784887 A JP 25784887A JP H0199286 A JPH0199286 A JP H0199286A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
screen printing
screen
screen mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25784887A
Other languages
Japanese (ja)
Inventor
Keiichi Tamura
恵一 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP25784887A priority Critical patent/JPH0199286A/en
Publication of JPH0199286A publication Critical patent/JPH0199286A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Screen Printers (AREA)
  • Printing Methods (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To perform positioning with efficiency and accuracy, and to produce only non-defectives, by providing the method for printing solder member on a printed wiring board through a screen with an automatic misregistration compensation driving mechanism A, a warpage detecting mechanism B and a thickness measuring mechanism C. CONSTITUTION:A printed wiring board 1 is sent from a conveyer 5 to the guide rail 2 of a printer system, and the warpage thereof is then detected by the displacement sensor 3 disposed in an X-Y arm 4. When the printed wiring board 1 is a non-defective, it is then set on a positioning table 6. And, the relative misregistration between the patterns 100 and 200 of the board is measured using both a TV camera 7 and a reflecting mirror 16, and correspondingly the table 6 is driven in order to compensate for the misregistration, thereby the alignment between a screen mask 9 and the printed wiring board 1 is automatically performed. Further, a squeegee 10 is so operated as to print solder in past form on the printed wiring board 1 through a screen. Moreover, the printed wiring board 1, which was sent into the guide rail 2, is thereafter detected with the thickness thereof by the other displacement sensor 12 disposed in the other X-Y arm 18. When the board 1 is still a non defective, it is sent to the following process section through a conveyer 14.

Description

【発明の詳細な説明】 この発明は印刷配線板に電子部品を表面実装組立を行う
工程の−っである印刷配線板にペースト状の半田材を供
給する工程に用いるスクリーン印刷装置に関するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a screen printing device used in the process of supplying a paste-like solder material to a printed wiring board, which is the process of surface-mounting electronic components on the printed wiring board. .

〔従来の技術〕[Conventional technology]

第5図は従来のスクリーン印刷装置を示す外観図で、図
において2aは印刷配線板を印刷部に搬送する搬送コン
ベア、9aはスクリーンマスクを保持するスクリーンマ
スク部、10aはスクリーン印刷を行うスキージ部、l
laはスキージをスクリーンマスク上を直線動作させる
直動アクチュエータ、1.5 aは本装置の本体架台、
17はスクリーンマスクの位置補正用のマイクロメータ
ヘッド、18は本装置の操作盤である。
FIG. 5 is an external view showing a conventional screen printing apparatus, in which 2a is a conveyor that conveys printed wiring boards to a printing section, 9a is a screen mask section that holds a screen mask, and 10a is a squeegee section that performs screen printing. ,l
la is a linear actuator that moves the squeegee linearly on the screen mask, 1.5 a is the main body frame of this device,
17 is a micrometer head for correcting the position of the screen mask, and 18 is an operation panel of the apparatus.

また第6図は第5図に示した従来のスクリーン印刷装置
のスクリーンマスク9と印刷配線板1との位置合わせ機
構を示す図である。
Further, FIG. 6 is a diagram showing a positioning mechanism between the screen mask 9 and the printed wiring board 1 of the conventional screen printing apparatus shown in FIG.

図において1は印刷配線板、101は印刷配線板1に有
する位置決め基準穴、19は印刷配線板1を位置決めす
る位置決めベース、20は位置決め基準穴101に対応
する基準ピン、9はスクリーンマスクである。
In the figure, 1 is a printed wiring board, 101 is a positioning reference hole provided in the printed wiring board 1, 19 is a positioning base for positioning the printed wiring board 1, 20 is a reference pin corresponding to the positioning reference hole 101, and 9 is a screen mask. .

次に動作について説明する。Next, the operation will be explained.

前工程より搬送された来た印刷配線板1ば本装置の搬送
コンベア2aに投入され、本装置の印刷配線板1の位置
決め部(第6図)に送られる。
The printed wiring board 1 transported from the previous process is placed on the transport conveyor 2a of the present device, and sent to the printed wiring board 1 positioning section (FIG. 6) of the present device.

この位置決め部で、印刷配線板1とスクリーンマスク9
との位置合わせを行い、スクリーンマスク9上に事前に
供給されたペースト状の半田材をスキージ部10a1直
動アクチュエータllaを用いてスクリーン印刷方式に
より印刷配線板の所定の位置に供給する。
At this positioning part, printed wiring board 1 and screen mask 9
Then, paste solder material previously supplied onto the screen mask 9 is supplied to a predetermined position on the printed wiring board by a screen printing method using the squeegee portion 10a1 and the linear actuator lla.

その後、印刷配線板1の位置決めを解除し、印刷配線板
上 する。
Thereafter, the positioning of the printed wiring board 1 is released and the printed wiring board 1 is placed on the printed wiring board.

ここで、印刷配線板1とスクリーンマスク9の位置合わ
せは次のようにして行われる。
Here, the alignment between the printed wiring board 1 and the screen mask 9 is performed as follows.

印刷配線板1を位置決めベース19上に乗せ、印刷配線
板1の基準穴101に対向して構成した位置決めベース
19上の基準ビン20に上記基準穴101を挿入して位
置決め保持する。
The printed wiring board 1 is placed on a positioning base 19, and the reference hole 101 is inserted into a reference bin 20 on the positioning base 19, which is configured to face the reference hole 101 of the printed wiring board 1, to maintain the position.

ここでの位置決め保持においては印刷配線板1の外形に
対応して位置決めベース19に凹部21を構成し、さら
に印刷配線板l下面を位置決めベース19より真空吸着
する。
In this positioning and holding, a recess 21 is formed in the positioning base 19 corresponding to the outer shape of the printed wiring board 1, and the lower surface of the printed wiring board 1 is vacuum-adsorbed from the positioning base 19.

この場合外形位置決めの方法や吸着保持の方法を取るも
のである。
In this case, a method of external positioning or suction holding is used.

このように位置決め保持した印刷板1に対してスクリー
ンマスク19の側の位置合わせは上方よりスクリーンマ
スクをX−Y方向に構成したマイクロメータヘッドで位
置合わせし固定する。
The screen mask 19 is aligned with the printing plate 1 thus positioned and held from above using a micrometer head arranged in the X-Y direction to align and fix the screen mask.

このように従来のスクリーン印刷装置の位置合わせは印
刷配線板1の基準穴101及び外形を利用した位置決め
とスクリーンマスク9の人手作業による位置補正により
行われる。
As described above, positioning of the conventional screen printing apparatus is performed by positioning using the reference hole 101 and the outer shape of the printed wiring board 1 and manually correcting the position of the screen mask 9.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のスクリーン印刷装置は以上のように構成されてい
るので、印刷対象である印刷配線板にソリなどがあって
適正でないと、位置決めができない問題があった。また
、スクリーン印刷後の印刷膜厚や印刷位置をチエツクす
る機能がないため、印刷不良の印刷配線板を後工程に出
力する問題点があった。さらに印刷配線板とスクリーン
マスクとの位置合わせを印刷配線板の基準穴もしくは外
形基準で行っているため、寸法のバラツキにより、位置
決め精度を悪化させる上、スクリーンマスク側も機種変
更毎、及び位置ズレ発生毎に位置補正を必要とする等の
問題点があった。
Since the conventional screen printing apparatus is configured as described above, there is a problem in that if the printed wiring board to be printed has warpage or the like and is not proper, positioning cannot be performed. Furthermore, since there is no function to check the printed film thickness or printing position after screen printing, there is a problem in that printed wiring boards with printing defects are output to subsequent processes. Furthermore, since the printed wiring board and the screen mask are aligned using the printed wiring board's reference holes or external dimensions, positioning accuracy deteriorates due to dimensional variations, and the screen mask also suffers from positional deviations every time the model is changed. There were problems such as the need for position correction every time an occurrence occurred.

この発明は上記のような問題点を解決するためになされ
たもので、印刷配線板とスクリーンマスクとの間の位置
決めを自動的に行って、高精度かつ能率的に行えるスク
リーン印刷方法を得ることを目的としている。
This invention was made in order to solve the above-mentioned problems, and provides a highly accurate and efficient screen printing method by automatically positioning a printed circuit board and a screen mask. It is an object.

また印刷を行う前に、印刷配線板の形状やソリの状態を
検出して、不良な印刷配線板を排除できるスクリーン印
刷方法を得ることを目的としている。更に、スクリーン
印刷後の印刷状態や印刷膜厚を測定し、スクリーン印刷
の状態を管理するとともにスクリーン印刷の不良をチエ
ツクできるスクリーン印刷方法を得ることを目的として
いる。
Another object of the present invention is to provide a screen printing method that can detect the shape and warpage of a printed wiring board before printing and eliminate defective printed wiring boards. Furthermore, it is an object of the present invention to provide a screen printing method that can measure the printing condition and printed film thickness after screen printing, manage the screen printing condition, and check for screen printing defects.

〔問題点を解決するための手段〕[Means for solving problems]

このためこの発明に係るスクリーン印刷方法は印刷配線
板とスクリーンマスクとの位置ズレを位置検出センサに
よって検出し、この位置検出センサからの信号に従って
上記テーブルを移動し、上記位置ズレを自動的に補正す
る補正駆動機構Aを備えたことを特徴としている。
Therefore, the screen printing method according to the present invention detects the positional deviation between the printed wiring board and the screen mask using a position detection sensor, moves the table according to the signal from the position detection sensor, and automatically corrects the positional deviation. The present invention is characterized in that it is equipped with a correction drive mechanism A that does the following.

また第2の発明はト記構成に加え、印刷配線板のソリ状
態を検出して基準以下の印刷配線板を上記搬送経路から
はずVためのソリ検出機構Bを加えたことを特徴として
いる。
Further, the second invention is characterized in that, in addition to the above configuration, a warpage detection mechanism B is added for detecting the warpage state of the printed wiring board and removing the printed wiring board that is below the standard from the conveyance path.

更に第3の発明は第2の発明の構成に加えて、更にスク
リーン印刷を行った後の印刷配線板上の印刷膜厚を測定
検査する膜厚測定機構Cを備えたことを特徴としている
Furthermore, the third invention is characterized in that, in addition to the configuration of the second invention, it further includes a film thickness measuring mechanism C that measures and inspects the printed film thickness on the printed wiring board after screen printing.

〔作用〕[Effect]

印刷配線板が搬送経路を通ってスクリーン印刷装置上の
テーブルに乗せられると、補正駆動機構Aは印刷配線板
とスクリーンマスクとの位置ズレを位置検出センサによ
って検出する。
When the printed wiring board passes through the conveyance path and is placed on the table on the screen printing apparatus, the correction drive mechanism A detects the positional deviation between the printed wiring board and the screen mask using a position detection sensor.

そしてこの位置検出センサからの信号に従ってテーブル
を動かし、位置ズレを自動的に補正する。
Then, the table is moved according to the signal from this position detection sensor, and the positional deviation is automatically corrected.

またスクリーン印刷装置上のテーブルに印刷配線板が乗
せられる前にソリ検出機構Bは、印刷配線板のソリ状態
を検出して不良なものを搬送経路からはずすだめの処理
を行う。
Also, before the printed wiring board is placed on the table on the screen printing device, the warpage detection mechanism B detects the warpage state of the printed wiring board and performs processing to remove defective boards from the conveyance path.

一方、スクリーン印刷の終わった印刷配線板は膜厚測定
機構Cにより、印刷膜厚が測定検査され、印刷の状態が
良好か否か判定される。
On the other hand, the thickness of the printed wiring board after screen printing is measured and inspected by the film thickness measurement mechanism C, and it is determined whether the printing condition is good or not.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第1図は本発明のスクリーン印刷方法を具体化する装置
の構成図で、図において1は印刷配線板、2は印刷配線
板1を搬送するガイドレール、3は非接触式の変位セン
サ、4は変位センサ3を印刷配線板1上で移動させるX
−Yアーム、5は本スクl)−ン印刷装置の前装置の印
刷配線板1の搬送コンベア、6はx−y−z−θ方向に
動作するとともに印刷配線板1を保持する機能を有する
位置決めテーブル、7は印刷配線板1とスクリーンマス
ク9を同時に画像情報を入力することができる位16検
出センサとしてのITVカメラ、8はIT■カメラ7を
移動動作させるX−Yアーム、9はスクリーンマスク、
10はスクリーンマスク9上を直線動作し2スクリーン
印刷するための直動アク千ユニ〜り11により前後に直
線動作するスキージである。
FIG. 1 is a configuration diagram of an apparatus embodying the screen printing method of the present invention, in which 1 is a printed wiring board, 2 is a guide rail for conveying the printed wiring board 1, 3 is a non-contact displacement sensor, 4 X moves the displacement sensor 3 on the printed wiring board 1
-Y arm, 5 is a conveyor for carrying the printed wiring board 1 of the front unit of the screen printing apparatus; 6 has the function of moving in the x-y-z-θ directions and holding the printed wiring board 1; Positioning table 7, 16 ITV camera as a detection sensor capable of simultaneously inputting image information of the printed wiring board 1 and screen mask 9, 8 an X-Y arm for moving the IT camera 7, 9 a screen mask,
Reference numeral 10 denotes a squeegee that linearly moves back and forth on the screen mask 9 by a direct-acting actuator 11 for performing two-screen printing.

また12はx−yアーム13にセットされ移動する1ノ
−ザ式の非接触形の変位センサ、14はスクリーン印刷
装置の後に位置する装置の印刷配線板1の搬送コンヘア
、15は本スクリーン印刷装置の本体架台である。
Further, 12 is a non-contact type displacement sensor that is set on an x-y arm 13 and moves, 14 is a conveyor for the printed wiring board 1 of the device located after the screen printing device, and 15 is the main screen printing device. This is the main body pedestal of the device.

また第2図は本発明のスクリーン印刷方法の印刷配線板
1とスクリーンマスク9との位置ずれを検出する機構の
図である。
Further, FIG. 2 is a diagram of a mechanism for detecting a positional deviation between the printed wiring board 1 and the screen mask 9 in the screen printing method of the present invention.

図において100はペースト状の半田材を供給する印刷
配線板1上のパターン、900はスクリーンマスク9上
の開口部で、パターン100とサイズ、位置は対応して
設けである。
In the figure, 100 is a pattern on the printed wiring board 1 for supplying a paste-like solder material, and 900 is an opening on the screen mask 9, which is provided in a size and position corresponding to the pattern 100.

7はI T Vで16の反射鏡を介して900のマスク
開口部とパターン100とが同時に画像情報として入力
できる。
7 is an ITV in which 900 mask openings and a pattern 100 can be simultaneously input as image information through 16 reflecting mirrors.

ここで、変位センサ3及びこの変位センサ3を移動させ
るX−Yアーム4はソリ検出機構Bを構成し、ITVカ
メラ7を移動動作させるX−Yアーム8及び位置決めテ
ーブル6は全体として補正駆動機構Aを構成し、変位セ
ンサ12及びこの変13は膜厚測定機構Cを構成してい
る。
Here, the displacement sensor 3 and the X-Y arm 4 that moves the displacement sensor 3 constitute a warp detection mechanism B, and the X-Y arm 8 that moves the ITV camera 7 and the positioning table 6 collectively constitute a correction drive mechanism. The displacement sensor 12 and this displacement sensor 13 constitute a film thickness measuring mechanism C.

次に動作に9j、>て説明する。Next, the operation will be explained with reference to 9j.

前装置より搬送されて来た印刷配′bA仮1は搬送コン
ベア5より本装置のガイドレール2に送り込まれる。
The printing layout bA provisional 1 conveyed from the previous device is sent from the conveyor 5 to the guide rail 2 of this device.

この印刷配線板1はガイドレール2上で位置決めされた
後にその上方より変位センサ3によりその形状をチエツ
クする。
After the printed wiring board 1 is positioned on the guide rail 2, its shape is checked by a displacement sensor 3 from above.

ここで、変位センサ3で印刷配線板lとの距離を数ケ所
測定し、そのソリ状態をチエツクし所定の値以上ソリが
発生していればアラームを出し、オフラインに取り出す
ようにしている。
Here, the displacement sensor 3 measures the distance to the printed wiring board 1 at several locations, and checks the warping condition. If the warpage exceeds a predetermined value, an alarm is issued and the printed wiring board 1 is taken offline.

ここで適正な印刷配線板のみを印刷部に送りこみ、印刷
部に送り込まれた印刷配線板1を6の位置決めテーブル
上にセットする。
Here, only proper printed wiring boards are fed into the printing section, and the printed wiring board 1 fed into the printing section is set on a positioning table 6.

そこで第2図に示すようなスクリーンマスク9との位置
合わせを行う。
Therefore, alignment with the screen mask 9 as shown in FIG. 2 is performed.

ここでは反射鏡16とITVカメラ7との一対の構成を
印刷配線板1とスクリーンマスク9との間に2方向より
構成する。
Here, a pair of reflecting mirror 16 and ITV camera 7 are arranged between printed wiring board 1 and screen mask 9 from two directions.

所定のペースト状半田を供給するパターン100とスク
リーンマスク9上の開口部900との両方同時に画像情
報を入力し、上下対向する位置が一致するように位置決
めテーブル6をX、Y、θ方向に所定のアルゴリズムに
て移動し、平面方向の位置合わせを行う。これらの動作
は自動的に行われる。
Image information is simultaneously input to both the pattern 100 for supplying a predetermined paste-like solder and the opening 900 on the screen mask 9, and the positioning table 6 is predetermined in the X, Y, and θ directions so that the vertically opposing positions coincide. Alignment in the plane direction is performed using the following algorithm. These operations are performed automatically.

この位置合わせの動作を更に第3図を用いて詳細に説明
する。
This positioning operation will be further explained in detail with reference to FIG.

まず、一つのITVカメラ7でパターン100aと13
n口部900aの相対位置ズレを求める。同時に一方の
ITVカメラ7でパターン100bと開口部900bの
相対位置ズレを求める。ここで求めた位置ズレ足と、事
前に設計時に与えられたパターン間長さ7! (100
a、100b)と開口部間長さI!(900a、  9
00 b)から角度誤差θを演算し求める。
First, with one ITV camera 7, patterns 100a and 13
The relative positional deviation of the n-mouth portion 900a is determined. At the same time, one ITV camera 7 is used to find the relative positional deviation between the pattern 100b and the opening 900b. The positional deviation foot found here and the inter-pattern length given in advance at the time of design are 7! (100
a, 100b) and the length between the openings I! (900a, 9
00 b) to calculate and find the angle error θ.

ここで求めたθを補正データとして、位置決めテーブル
6によるθ補正を行えば第3図011の状態から第3図
(blの状態になる。
If the θ obtained here is used as correction data and the θ correction is performed using the positioning table 6, the state shown in FIG. 3 011 changes to the state shown in FIG. 3 (bl).

すなわち印刷配線板1とスクリーンマスク9は平行に角
度誤差が存在しない状態に位置される。
That is, the printed wiring board 1 and the screen mask 9 are positioned in parallel with no angular error.

次に再びITVカメラ7でパターン100a、100b
、開口部900a、900bを同時に画像処理し、パタ
ーン100aと開口部900a、パターン100bと開
口部900bの相対ズレを求める。
Next, patterns 100a and 100b are used again with the ITV camera 7.
, the openings 900a and 900b are image-processed simultaneously, and relative deviations between the pattern 100a and the opening 900a, and between the pattern 100b and the opening 900b are determined.

ここではθ方向の補正を完了した後であるので、相対位
置ズレ盪は各々同一値を示す。
Here, since the correction in the θ direction has been completed, the relative positional deviations each show the same value.

この値を基に位置決めテーブル6によりX、Y方向の補
正を行い、印刷配線板1とスクリーンマスク9の位置合
わせが完了する。
Based on this value, corrections are made in the X and Y directions using the positioning table 6, and the alignment between the printed wiring board 1 and the screen mask 9 is completed.

この状態を第3図fc)に示す。This state is shown in FIG. 3 fc).

なお、上述動作を中心に位置決めフローチャートを第4
図に示した。
In addition, the positioning flowchart focusing on the above-mentioned operation is shown in the fourth section.
Shown in the figure.

この結果、機種変更に対しても位置合わせするパターン
100と開口部900の位置をプログラムの変更のみで
対応可能で作業者が対応する必要がない。その後、画像
処理機構部はX−Yアーム8により移動し、位置決めテ
ーブル6を平面方向に上昇し、スクリーンマスク9と印
刷配線板1を密着状態に近い状態で位置決めする。
As a result, even if the model is changed, the position of the pattern 100 to be aligned and the position of the opening 900 can be adjusted only by changing the program, and there is no need for the operator to do so. Thereafter, the image processing mechanism section is moved by the X-Y arm 8, raises the positioning table 6 in the plane direction, and positions the screen mask 9 and the printed wiring board 1 so that they are in close contact with each other.

その後スクリーンマスク9上に事前に供給されたペース
ト状の半田材をスキージ10を動作させることによりス
クリーンマスク9の開口部900をペースト状の半田材
がぬけて、印刷配線板1の所定のパターン100上に、
ペースト状半田材が印刷供給させるスクリーン印刷が行
われる。
Thereafter, by operating the squeegee 10, the paste solder material supplied in advance onto the screen mask 9 passes through the openings 900 of the screen mask 9, forming a predetermined pattern 100 on the printed wiring board 1. above,
Screen printing is performed in which paste solder material is printed and supplied.

その後、位置決めテーブルがZ軸方向に下降し、位置決
めテーブルの移動動作により、膜厚検査部の搬送コンベ
ア2に送り込まれる。
Thereafter, the positioning table moves down in the Z-axis direction, and the movement of the positioning table transports the film to the conveyor 2 of the film thickness inspection section.

ここでは、印刷配線板1を搬送コンベア2上で位置決め
した後、レーザ式変位センサ12をセットしたX−Yア
ーム13を動作させ、所定のパターン100上に印刷さ
れたペースト状の半田材の供給量、具体的には印刷膜厚
を測定し、適正な量が供給されたかどうかチエツクを行
う。
Here, after positioning the printed wiring board 1 on the conveyor 2, the X-Y arm 13 equipped with the laser displacement sensor 12 is operated to supply paste-like solder material printed on a predetermined pattern 100. The amount, specifically the printed film thickness, is measured to check whether the appropriate amount has been supplied.

ここで不良のものはオフラインに取り出し、良品は後工
程の搬送コンベア14に送り込まれる。
Here, defective products are taken out offline, and non-defective products are sent to the conveyor 14 in the subsequent process.

ここでチエツクした印刷膜厚検査は、良否の判定を行う
とともに印刷部に対して、その情報をフィードバックを
かけ印刷条件、例えばスキージ10の直線動作スピード
、スキージのスクリーンマスクに対する押付力、スクリ
ーンマスクと印刷配線板の印刷時の隙間等に対して条件
を変更し、印刷膜厚精度をさらに向上させる情報とに利
用することも可能である。
The printing film thickness inspection checked here not only determines pass/fail, but also feeds back the information to the printing section to determine printing conditions, such as the linear movement speed of the squeegee 10, the pressing force of the squeegee against the screen mask, and the screen mask. It is also possible to change the conditions for gaps etc. during printing on a printed wiring board and use this information as information to further improve the accuracy of the printed film thickness.

このようにして高精度なスクリーン印刷が可能となる。In this way, highly accurate screen printing becomes possible.

なお、本スクリーン印刷方法に適用する装置は前段に印
刷配線板の形状検査部、後段に膜厚検査装置を構成した
装置であるが、前工程において印刷配線板の形状検査を
行う工程があればあえてスクリーン印刷装置として一体
化した構成でなくても同一の効果を奏する。
The device applied to this screen printing method has a shape inspection section for printed wiring boards in the first stage and a film thickness inspection device in the second stage, but if there is a step to inspect the shape of printed wiring boards in the front stage, The same effect can be achieved even if the screen printing device is not integrated.

また、スクリーンマスクと印刷配線板との位置合わせ部
の認識が可能なセンサであればあえて画像を用いなくて
もよい。
Furthermore, if the sensor is capable of recognizing the alignment portion between the screen mask and the printed wiring board, it is not necessary to use an image.

例えば、精度的には考慮する必要はあるが光センサにて
位置合わせを必要とする対向物同志を同時に認識できる
ように工夫しても同一の効果を奏する。
For example, although it is necessary to take into account accuracy, the same effect can be achieved by devising a way to simultaneously recognize opposing objects that require alignment using an optical sensor.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、この発明は印刷配線板とスクリー
ンマスクとの位置ズレを位置検出センサによって検出し
、この位置検出センサからの信号に従って上記テーブル
移動し、位置スレを自動的に補正するようにしたので位
置合わせに人手を要さず、また外形基準による機械的な
位置決めを用いないため、きわめて効率的にかつ高精度
に行える効果がある。
As explained above, the present invention detects the positional deviation between the printed wiring board and the screen mask using a position detection sensor, moves the table according to the signal from the position detection sensor, and automatically corrects the position deviation. As a result, positioning does not require manpower and mechanical positioning based on external dimensions is not used, resulting in extremely efficient and highly accurate positioning.

また第2の発明によれば、印刷配線板のソリ状態を検出
して基準以下の印刷配線板につき警報を出力するように
したので、この印刷配線板を上記搬送経路からはずすこ
とができ、良品の印刷配線板のみテーブル上に供給でき
る効果がある。更に、第3の発明よれば上記構成に加え
て、スクリーン印刷を行った後の印刷配線板上の印刷膜
厚を測定検査する膜厚測定機構を備えたので、スクリー
ン印刷の状態を知ってスクリーン印刷の参考に付するこ
とかできるとともに、良品のもののみ後工程に確実に供
給することが可能となる。
Further, according to the second invention, since the warped state of the printed wiring board is detected and a warning is output for printed wiring boards that are below the standard, this printed wiring board can be removed from the above-mentioned conveyance path, and good products can be removed. This has the advantage of being able to supply only printed wiring boards on the table. Furthermore, according to the third invention, in addition to the above configuration, a film thickness measuring mechanism is provided for measuring and inspecting the printed film thickness on the printed wiring board after screen printing, so that the screen can be inspected knowing the state of screen printing. It can be used as a reference for printing, and it is also possible to reliably supply only good quality products to subsequent processes.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例を説明するためのスクリー
ン印刷装置を示す外観図、第2図はこの発明のスクリー
ン印刷方法におけるスクリーンマスクと印刷配線板との
位置合わせ機構を示す図、第3図(al、 (b)、 
(c)は位置合わせの動作状態を示す図、第4図は位置
合わせの動作手順を示すフローチャート、第5図は従来
のスクリーン印刷装置を示す外観図、第6図は従来のス
クリーンマスク印刷配線板との位置合わせ機構を示す図
である。 1・・・印刷配線板、2・・・ガイドレール、3・・・
変位センサ、4・・・X−Yアーム、5・・・搬送コン
ベア、6・・・位置決めテーブル、7・・・ITVカメ
ラ、8・・・X−Yアーム、9・・・スクリーンマスク
、10・・・スキージ、11・・・直動アクチュエータ
、12・・・変位センサ、13・・・X−Yアーム、1
4・・・搬送コンベア、15・・・本体架台、16・・
・反射鏡、100・・・パターン、900・・・開口部
、2a・・・搬送コンベア、10a・・・スキージ部、
lla・・・直動アクチュエータ、9a・・・スクリー
ンマスク、15a・・・本体架台、17・・・マイクロ
メータヘッド、18・・・操作盤、19・・・位置決め
ベース、20・・・基準ピン、21・・・凹部、101
・・・基準穴、A・・・補正駆動機構、B・・・ソリ検
出機構、C・・・膜厚測定機構。 代理人  大  岩  増  m(ばか2名)第4図 第5図 躬60
FIG. 1 is an external view showing a screen printing apparatus for explaining an embodiment of the present invention, FIG. Figure 3 (al, (b),
(c) is a diagram showing the operating state of alignment, Fig. 4 is a flowchart showing the operating procedure of alignment, Fig. 5 is an external view showing a conventional screen printing device, and Fig. 6 is a conventional screen mask printed wiring. It is a figure which shows the alignment mechanism with a board. 1...Printed wiring board, 2...Guide rail, 3...
Displacement sensor, 4...X-Y arm, 5...Transfer conveyor, 6...Positioning table, 7...ITV camera, 8...X-Y arm, 9...Screen mask, 10 ... Squeegee, 11 ... Direct-acting actuator, 12 ... Displacement sensor, 13 ... X-Y arm, 1
4...Conveyor conveyor, 15...Main frame, 16...
・Reflector, 100... Pattern, 900... Opening, 2a... Conveyor, 10a... Squeegee part,
lla...Linear actuator, 9a...Screen mask, 15a...Main frame, 17...Micrometer head, 18...Operation panel, 19...Positioning base, 20...Reference pin , 21... recess, 101
...Reference hole, A...Correction drive mechanism, B...Warpage detection mechanism, C...Film thickness measurement mechanism. Agent Masu Oiwa (2 idiots) Figure 4 Figure 5 60

Claims (4)

【特許請求の範囲】[Claims] (1)搬送されて来た印刷配線板を所定のテーブル上に
乗せ、印刷配線板とスクリーンマスクとの位置合わせを
行って印刷配線板上にペースト状の半田材を供給するス
クリーン印刷方法において、印刷配線板とスクリーンマ
スクとの位置ズレを位置検出センサによって検出し、こ
の位置検出センサからの信号に従って上記テーブルを移
動し、上記位置ズレを自動的に補正する補正駆動機構を
備えたことを特徴とするスクリーン印刷方法。
(1) In a screen printing method, the printed wiring board that has been transported is placed on a predetermined table, the printed wiring board and the screen mask are aligned, and a paste-like solder material is supplied onto the printed wiring board, A correction drive mechanism that detects a positional deviation between the printed wiring board and the screen mask using a position detection sensor, moves the table according to a signal from the position detection sensor, and automatically corrects the positional deviation. Screen printing method.
(2)上記位置検出センサは印刷配線板上の画像とスク
リーンマスク上の画像とを捉えて比較する画像センサで
構成されていることを特徴とする特許請求の範囲第1項
記載のスクリーン印刷方法。
(2) The screen printing method according to claim 1, wherein the position detection sensor is an image sensor that captures and compares the image on the printed wiring board and the image on the screen mask. .
(3)搬送経路を通して送られてきた印刷配線板を所定
のテーブル上に乗せ、印刷配線板とスクリーンマスクと
の位置合わせを行って、印刷配線板上にペースト状の半
田材を供給するスクリーン印刷方法において、 印刷配線板のソリ状態を検出して警報を出力するソリ検
出機構と上記ソリ検出機構を通過して上記テーブルに乗
せられた印刷配線板とスクリーンマスクとの位置ズレを
位置検出センサによって検出し、この位置検出センサか
らの信号に従って上記テーブルを移動し、上記位置ズレ
を自動的に補正する補正駆動機構とを備えたことを特徴
とするスクリーン印刷方法。
(3) Screen printing where the printed wiring board sent through the conveyance path is placed on a predetermined table, the printed wiring board and screen mask are aligned, and a paste-like solder material is supplied onto the printed wiring board. The method includes a warpage detection mechanism that detects warpage of the printed wiring board and outputs an alarm; and a position detection sensor that detects a positional deviation between the printed wiring board and the screen mask that have passed through the warp detection mechanism and are placed on the table. A screen printing method comprising: a correction drive mechanism that detects the positional deviation, moves the table according to a signal from the position detection sensor, and automatically corrects the positional deviation.
(4)搬送経路を通して送られてきた印刷配線板を所定
のテーブル上に乗せ、印刷配線板とスクリーンマスクと
の位置合わせを行って、印刷配線板上にペースト状の半
田材を供給するスクリーン印刷方法において、 印刷配線板のソリ状態を検出して、警報を出力するソリ
検出機構と、上記ソリ検出機構を通過して上記テーブル
に乗せられた印刷配線板とスクリーンマスクとの位置ズ
レを位置検出センサによって検出し、この位置検出セン
サからの信号に従って上記テーブルを移動し、上記位置
ズレを自動的に補正する補正駆動機構と、スクリーン印
刷を行った後の印刷配線板上の印刷膜厚を測定検査して
検査結果を出力する膜厚測定機構を備えたことを特徴と
するスクリーン印刷方法。
(4) Screen printing where the printed wiring board sent through the conveyance path is placed on a predetermined table, the printed wiring board and screen mask are aligned, and a paste-like solder material is supplied onto the printed wiring board. The method includes: a warpage detection mechanism that detects a warpage state of the printed wiring board and outputs an alarm; and a position detection mechanism that detects a positional deviation between the printed wiring board and the screen mask that have passed through the warp detection mechanism and are placed on the table. A correction drive mechanism that automatically corrects the positional deviation by moving the table according to the signal from the position detection sensor and measuring the printed film thickness on the printed wiring board after screen printing. A screen printing method characterized by being equipped with a film thickness measuring mechanism that inspects and outputs the inspection results.
JP25784887A 1987-10-13 1987-10-13 Screen printing Pending JPH0199286A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25784887A JPH0199286A (en) 1987-10-13 1987-10-13 Screen printing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25784887A JPH0199286A (en) 1987-10-13 1987-10-13 Screen printing

Publications (1)

Publication Number Publication Date
JPH0199286A true JPH0199286A (en) 1989-04-18

Family

ID=17311991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25784887A Pending JPH0199286A (en) 1987-10-13 1987-10-13 Screen printing

Country Status (1)

Country Link
JP (1) JPH0199286A (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02301438A (en) * 1989-04-28 1990-12-13 Mpm Corp Device for adjusting object of video probe and method therefor
JPH03109800A (en) * 1989-09-25 1991-05-09 Matsushita Electric Ind Co Ltd Pattern matching of screen mask
US5134665A (en) * 1990-03-08 1992-07-28 Mitsubishi Denki Kabushiki Kaisha Apparatus and method of inspecting solder printing
JPH04347637A (en) * 1991-05-27 1992-12-02 Hitachi Techno Eng Co Ltd Screen printing machine
JPH06155707A (en) * 1993-06-29 1994-06-03 Hitachi Techno Eng Co Ltd Screen printer
JPH06155706A (en) * 1993-06-29 1994-06-03 Hitachi Techno Eng Co Ltd Screen printer
WO1995014575A1 (en) * 1993-11-22 1995-06-01 Dek Printing Machines Limited Alignment systems
US5906158A (en) * 1996-10-31 1999-05-25 Sakurai Graphic Systems Corporation Screen printing apparatus and method
EP0918641A1 (en) * 1996-06-04 1999-06-02 Preco Industries, Inc. Screen printing press having longitudinal, lateral and angular screen frame registration system and method
KR20010001737A (en) * 1999-06-08 2001-01-05 김선수 screen printer capture apparatus and method thereof
JP2001315298A (en) * 2000-05-09 2001-11-13 Matsushita Electric Ind Co Ltd Screen printing apparatus and screen printing process
GB2367034A (en) * 2000-07-18 2002-03-27 Matsushita Electric Ind Co Ltd Screen printing apparatus
JP2008198730A (en) * 2007-02-09 2008-08-28 Yamaha Motor Co Ltd Surface mounter, screen printer and mounting line
CN102371751A (en) * 2010-08-20 2012-03-14 富葵精密组件(深圳)有限公司 Screen printing machine
CN103391848A (en) * 2011-06-29 2013-11-13 松下电器产业株式会社 Screen printing device and image recognition method for screen printing device
CN109648990A (en) * 2018-10-29 2019-04-19 温州西通文具有限公司 A kind of printing equipment for screen printer
CN112223891A (en) * 2020-10-14 2021-01-15 深圳市启蒙智慧医疗科技有限公司 Screen printing machine with automatic calibration function and automatic calibration method

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Publication number Priority date Publication date Assignee Title
JPS5477151A (en) * 1977-12-01 1979-06-20 Fujitsu Ltd Optical step meter
JPS61205142A (en) * 1984-10-10 1986-09-11 スベシア シルクスクリ−ン マスキネル アクテイエ ボラ−グ Device for positioning second pattern obtained from first pattern arranged on stencil to aimed position on material printed by silk screen printer
JPS61229386A (en) * 1985-04-03 1986-10-13 株式会社日立製作所 Printer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5477151A (en) * 1977-12-01 1979-06-20 Fujitsu Ltd Optical step meter
JPS61205142A (en) * 1984-10-10 1986-09-11 スベシア シルクスクリ−ン マスキネル アクテイエ ボラ−グ Device for positioning second pattern obtained from first pattern arranged on stencil to aimed position on material printed by silk screen printer
JPS61229386A (en) * 1985-04-03 1986-10-13 株式会社日立製作所 Printer

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02301438A (en) * 1989-04-28 1990-12-13 Mpm Corp Device for adjusting object of video probe and method therefor
JPH03109800A (en) * 1989-09-25 1991-05-09 Matsushita Electric Ind Co Ltd Pattern matching of screen mask
US5134665A (en) * 1990-03-08 1992-07-28 Mitsubishi Denki Kabushiki Kaisha Apparatus and method of inspecting solder printing
JPH04347637A (en) * 1991-05-27 1992-12-02 Hitachi Techno Eng Co Ltd Screen printing machine
JPH06155707A (en) * 1993-06-29 1994-06-03 Hitachi Techno Eng Co Ltd Screen printer
JPH06155706A (en) * 1993-06-29 1994-06-03 Hitachi Techno Eng Co Ltd Screen printer
JP2614974B2 (en) * 1993-06-29 1997-05-28 日立テクノエンジニアリング株式会社 Screen printing machine
JP2614973B2 (en) * 1993-06-29 1997-05-28 日立テクノエンジニアリング株式会社 Screen printing machine
WO1995014575A1 (en) * 1993-11-22 1995-06-01 Dek Printing Machines Limited Alignment systems
US5752446A (en) * 1993-11-22 1998-05-19 Dek Printing Machines Limited Alignment systems
EP0918641A4 (en) * 1996-06-04 1999-09-29 Preco Ind Inc Screen printing press having longitudinal, lateral and angular screen frame registration system and method
EP0918641A1 (en) * 1996-06-04 1999-06-02 Preco Industries, Inc. Screen printing press having longitudinal, lateral and angular screen frame registration system and method
US5906158A (en) * 1996-10-31 1999-05-25 Sakurai Graphic Systems Corporation Screen printing apparatus and method
KR20010001737A (en) * 1999-06-08 2001-01-05 김선수 screen printer capture apparatus and method thereof
JP2001315298A (en) * 2000-05-09 2001-11-13 Matsushita Electric Ind Co Ltd Screen printing apparatus and screen printing process
US6907824B2 (en) 2000-07-18 2005-06-21 Matsushita Electric Industrial Co., Ltd. Screen printing apparatus and method of the same
US6609458B2 (en) 2000-07-18 2003-08-26 Matsushita Electric Industrial Co., Ltd. Screen printing apparatus and method of the same
SG99920A1 (en) * 2000-07-18 2003-11-27 Matsushita Electric Ind Co Ltd Screen printing apparatus and method of the same
GB2367034B (en) * 2000-07-18 2004-06-09 Matsushita Electric Ind Co Ltd Screen printing apparatus and method of the same
GB2367034A (en) * 2000-07-18 2002-03-27 Matsushita Electric Ind Co Ltd Screen printing apparatus
JP2008198730A (en) * 2007-02-09 2008-08-28 Yamaha Motor Co Ltd Surface mounter, screen printer and mounting line
CN102371751A (en) * 2010-08-20 2012-03-14 富葵精密组件(深圳)有限公司 Screen printing machine
CN103391848A (en) * 2011-06-29 2013-11-13 松下电器产业株式会社 Screen printing device and image recognition method for screen printing device
US9027478B2 (en) 2011-06-29 2015-05-12 Panasonic Intellectual Property Management Co., Ltd. Screen printing device and an image recognizing method in the screen printing device
CN103391848B (en) * 2011-06-29 2015-06-10 松下电器产业株式会社 Screen printing device and image recognition method for screen printing device
CN109648990A (en) * 2018-10-29 2019-04-19 温州西通文具有限公司 A kind of printing equipment for screen printer
CN112223891A (en) * 2020-10-14 2021-01-15 深圳市启蒙智慧医疗科技有限公司 Screen printing machine with automatic calibration function and automatic calibration method

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