WO2024062635A1

WO2024062635A1 - Testing device and testing method

Info

Publication number: WO2024062635A1
Application number: PCT/JP2022/035550
Authority: WO
Inventors: 英俊川合
Original assignee: 株式会社Fuji
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2024-03-28

Abstract

A testing device according to the present invention comprises: an acquisition unit that acquires a plurality of pieces of image data by capturing an image of a test area of at least a portion of a substrate a number of times that corresponds to the progress of prescribed substrate work on the substrate; and a determination unit that determines the state of the test area by comparing reference image data that is image data acquired at a first work machine that applies a joining member to the test area as substrate work with test image data that is image data acquired at a second work machine that mounts a component at the test area as substrate work.

Description

Inspection device and inspection method

This specification relates to an inspection device and an inspection method.

Conventionally, for example, a mounting line disclosed in Patent Document 1 has been known. A conventional mounting line includes a first camera means and a second camera means that can view at least a portion of the board, and an image processing means. The image processing means performs image processing by comparing the image data of the component after the mounting operation photographed by the second camera means with the image data of the component before the mounting operation photographed by the first camera means. As a result, the conventional mounting line detects an abnormality in solder printing when solder is printed on a board, or a mounting failure when a component is mounted on a board.

Japanese Patent Application Publication No. 2007-335524

When mounting components on a board, if foreign matter is attached to the mounting position of the component, there is a possibility that the mounting of the component will be defective. Therefore, as in a conventional mounting line, it is extremely important to judge the state of the inspection area to be inspected on the board on which components are mounted. In this case, for example, when considering measures to prevent foreign matter from adhering to the board, it is necessary to check the condition of the board inspection area throughout the board work line, that is, over multiple board work processes. It is preferable to be able to judge.

An object of the present specification is to provide an inspection device and an inspection method that can determine the state of an inspection area of a substrate over a plurality of substrate-related work processes.

This specification includes an acquisition unit that acquires a plurality of image data by capturing images multiple times in accordance with the progress of a predetermined board-to-board work on at least a part of the board to be inspected; The image data acquired by the first work machine that applies the bonding material to the area is used as the reference image data, and the image data is the image data acquired by the second work machine that mounts the component to the inspection area as the work for the board. An inspection device is disclosed that includes a determination unit that determines the state of an inspection area by comparing the inspection image data with inspection image data.

The present specification also describes an acquisition step of acquiring a plurality of image data by capturing images multiple times in accordance with the progress of a predetermined board-to-board work on at least a portion of the inspection area of the board; The reference image data is the image data acquired by the first working machine that applies the bonding material to the inspection area as the reference image data, and the inspection image is the image data acquired by the second working machine that mounts the component to the inspection area as part of the board-to-board work. An inspection method is disclosed that includes a determination step of determining the state of an inspection area by comparing data with reference image data.

In this specification, in claim 5 originally filed, "the inspection device according to any one of claims 1 to 3" is changed to "the inspection device according to any one of claims 1 to 4". The technical ideas behind this are also disclosed. In addition, in this specification, in claim 8 originally filed, "the inspection device according to any one of claims 1 to 3" is replaced with "the inspection device according to any one of claims 1 to 7." The technical idea that has been changed is also disclosed. In addition, in this specification, in claim 9 originally filed, "the inspection device according to any one of claims 1 to 3" is replaced with "the inspection device according to any one of claims 1 to 8." The technical idea that has been changed is also disclosed. In addition, in this specification, in claim 10 originally filed, "the inspection device according to any one of claims 1 to 3" is replaced with "the inspection device according to any one of claims 1 to 9." The technical idea that has been changed is also disclosed. Furthermore, in this specification, in claim 12 originally filed, "the inspection device according to any one of claims 1 to 3" is replaced with "the inspection device according to any one of claims 1 to 11." The technical idea that has been changed is also disclosed.

According to the inspection device, the state of the inspection area of the board is determined from the process in which the first work machine applies the bonding member to the board to the process in which the second work machine mounts the parts, that is, a plurality of work processes for the board. be able to. The same applies to the inspection method.

FIG. 2 is a configuration diagram showing an example of the configuration of a board-related work line. FIG. 2 is a plan view showing a configuration example of a component mounting machine. It is a block diagram showing an example of a control block of an inspection device. FIG. 3 is a schematic diagram showing an example of reference image data. FIG. 3 is a schematic diagram showing an example of inspection image data. FIG. 7 is a schematic diagram showing an example of the state of the board until the work for the board is stopped according to the first modification. FIG. 7 is a schematic diagram showing an example of the state of the board after the board-related work is restarted according to the second modification.

Hereinafter, the inspection device and inspection method will be explained with reference to the drawings. In this embodiment, a board-to-board work line is exemplified that includes a printing machine that applies a bonding member to a board using a printing machine, and a component mounting machine that performs mounting work to mount components (for example, electronic components, etc.). . Then, as a "predetermined board work", when the printing machine applies a bonding material to the board and the component mounting machine sequentially mounts components onto the board transported from the printing machine, the inspection area set on the board is An example of determining the state will be explained.

1. Board work line WL
In the board-to-board work line WL, the board-to-board work machine WM performs a predetermined board-to-board work on the board K. As shown in FIG. 1, the board work line WL of this embodiment includes a plurality of board work machines WM, including a printing machine WM1, a print inspection machine WM2, a component mounting machine WM3, a reflow oven WM4, and an appearance inspection machine WM5. The substrates K are transported in the above order by the substrate transport device. Note that the type and number of substrate-to-board work machines WM that constitute the substrate-to-board work line WL are not limited.

In this embodiment, the printing machine WM1 is the "first working machine". The printing machine WM1 prints solder as the joining member B at the mounting positions of the plurality of components P on the board K. Here, in the following explanation, a case where the joining member B is solder will be exemplified, but the joining member B may be any member that joins the board K and the component P, and may include an adhesive or the like in addition to solder. Can be done. Therefore, the first working machine may be any working machine that applies the bonding member B to the substrate K, and may include, in addition to the printing machine WM1 that prints solder, a coating device that applies adhesive or the like. . The print inspection machine WM2 inspects the printing state of the solder printed by the printing machine WM1.

Here, in this embodiment, at least the printing machine WM1 is provided with a camera device S that images the board K after the bonding member B has been applied, that is, after the solder has been printed. The configuration and operation of the camera device S are the same as those of the board camera 15 of the component mounting machine WM3, which will be described later, so a detailed explanation will be omitted.

As shown in FIG. 2, the component mounting machine WM3 mounts a plurality of components P onto the board K on which solder has been printed by the printing machine WM1. In this embodiment, as shown in FIG. 1, a plurality of (for example, three) component mounting machines WM3 are provided in the board-to-board work line WL. However, the number of component mounting machines WM3 may be one or more than one. Note that when a plurality of component mounting machines WM3 are provided, the plurality of component mounting machines WM3 can share the task of mounting a plurality of components P.

Here, in this embodiment, for convenience of explanation, as shown in FIG. 1, the most upstream component mounting machine WM3 among the plurality of (three) component mounting machines WM3 is referred to as the component mounting machine M1. The component mounting machine M1 mounts the component P in an area other than the inspection area TA (see FIGS. 4 and 5), which will be described later, and which is set on at least a portion of the board K. Further, the next component mounting machine WM3 on the downstream side of the component mounting machine M1 is defined as a component mounting machine M2. The component mounting machine M2 mounts a component P in an inspection area TA and other areas, which will be described later. Furthermore, the next component mounting machine WM3 on the downstream side of the component mounting machine M2 is defined as the component mounting machine M3. The component mounting machine M3 mounts the component P in the inspection area TA.

Then, of the multiple (three) component mounting machines WM3, the component mounting machine M3 located farthest from the printer WM1 (the rightmost (downstream) in FIG. 1) is defined as the "second work machine." In addition, in this embodiment, of the multiple (three) component mounting machines WM3, the component mounting machine M2 is defined as the "substrate-related work machine located between the first and second work machines" (hereinafter referred to as the "other substrate-related work machine").

The "other substrate-related work machines" are not limited to the component mounting machine WM3 (component mounting machine M2) that mounts components P in areas other than the inspection area TA, but may include, for example, substrate-related work machines WM such as a functional inspection machine, a buffer device, a substrate supply device, a substrate inversion device, a shield mounting device, an adhesive application device, and an ultraviolet irradiation device. However, the "substrate-related work machine disposed between the first work machine and the second work machine" must be provided with a camera device S that captures an image of the substrate K, like the printing machine WM1 described above. For this reason, if a camera device S is not provided, one is provided separately.

The reflow furnace WM4 heats the board K on which a plurality of components P are mounted by the component mounting machine WM3, melts the solder, and performs soldering. The appearance inspection machine WM5 inspects the mounting state of the plurality of parts P mounted by the component mounting machine WM3. In this way, the substrate-to-board work line WL can use a plurality of substrate-to-board work machines WM to transport the substrates K in order, perform production processing including inspection processing, and produce board products Kp.

A plurality of board-to-board work machines WM and line management device LC constituting the board-to-board work line WL are communicably connected by a communication unit. Further, the line management device LC and the management device HC are communicably connected by a communication section. The communication unit communicably connects the board-facing work machine WM and the line management device LC, or the line management device LC and the management device HC, by wire or wirelessly. Note that the communication unit can employ various communication methods.

Here, in this embodiment, a local area network (LAN) is configured by a plurality of board-facing work machines WM, line management devices LC, and management devices HC. Thereby, the plurality of board-oriented work machines WM can communicate with each other via the communication section. Further, the plurality of board-oriented work machines WM can communicate with the line management device LC via the communication section. Furthermore, the line management device LC and the management device HC can communicate with each other via the communication section.

The line management device LC is equipped with a computer device having a CPU, ROM, RAM, various interfaces, etc., and a storage device that stores various information. The line management device LC controls the plurality of board-related work machines WM that constitute the board-related work line WL, and monitors the operating status of the board-related work line WL. In the line management device LC, various control data for controlling the plurality of substrate-facing working machines WM are stored in a storage device. The line management device LC transmits control data, including control data output from the management device HC, to each of the plurality of board-facing work machines WM.

Furthermore, each of the plurality of board-facing working machines WM transmits the operating status and production status to the line management device LC. Here, in this embodiment, among the board-facing work machines WM, the printing machine WM1 which is the first work machine, the component mounting machine M3 which is the second work machine, and the component mounting machine which is the other board-facing work machine The machine M2 outputs image data PD imaged of at least a portion of the inspection area TA of the board K to the line management device LC. Regarding the printing machine WM1, the camera device S images the inspection area TA and generates image data PD under the control of a control device (not shown) that is installed in the printing machine WM1 and controls the operation in an integrated manner or a line management device LC. Output.

The management device HC manages at least one line management device LC. For example, the operating status and production status of the board-oriented working machine WM acquired by the line management device LC are transmitted to the management device HC as necessary. The management device HC is provided with a storage device. The storage device can store various types of acquired data acquired by the board-facing work machine WM. For example, various image data captured by the substrate work machine WM is included in the acquired data. Records of operating conditions (log data) etc. acquired by the board-oriented work machine WM are included in the acquired data. Further, the storage device can store various production information regarding the production of the substrate product Kp.

The board-to-board work line WL is equipped with an input/output device 40. A known input/output device can be used as the input/output device 40. The input/output device 40 includes a display section and displays various data in a visible manner. Furthermore, the display section is configured with a touch panel, and also functions as an input device that accepts various operations by the operator.

2. Configuration example of component mounting machine WM3 The component mounting machine WM3 mounts a plurality of components P onto a board K. As shown in FIG. 2, the component mounting machine WM3 includes a board transfer device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, and a control device 16.

The substrate transport device 11 transports the substrate K in the transport direction (X-axis direction), for example, along a transport path formed by a belt conveyor or the like. Here, the substrate K is a circuit board on which, for example, an electronic circuit, an electric circuit, a magnetic circuit, etc. are formed. The board transfer device 11 carries the board K into the component mounting machine WM3 and positions the board K at a predetermined position inside the machine. The board transport device 11 carries the board K out of the component mounting machine WM3 after the mounting process of the plurality of components P by the component mounting machine WM3 is completed.

The component supply device 12 supplies a plurality of components P to be mounted on the board K. The component supply device 12 includes a plurality of feeders 121 provided along the substrate K conveyance direction (X-axis direction). Each of the plurality of feeders 121 is equipped with a reel. A carrier tape containing a plurality of parts P is wound around the reel. The feeder 121 feeds the carrier tape in pitches and supplies the component P so that it can be collected at a supply position located on the tip side of the feeder 121 . Further, the component supply device 12 can also supply electronic components (for example, lead components, etc.) that are relatively large compared to chip components and the like, arranged on a tray.

The component transfer device 13 includes a head drive device 131 and a moving table 132. The head driving device 131 is configured to be able to move the moving table 132 in the X-axis direction and the Y-axis direction (direction perpendicular to the X-axis direction in the horizontal plane) using a linear motion mechanism. The moving table 132 is provided with the mounting head 20 removably (replaceable) using a clamp member. The mounting head 20 uses at least one holding member 21 to pick up and hold the component P supplied by the component supply device 12, and mounts the component P onto the board K positioned by the substrate transfer device 11. For example, a suction nozzle, a chuck, etc. can be used as the holding member 21.

The component camera 14 is fixed to the base of the component mounting machine WM3 so that its optical axis faces upward in the vertical direction (Z-axis direction perpendicular to the X-axis direction and the Y-axis direction). Therefore, the component camera 14 can image the component P etc. held by the holding member 21 from below in the vertical direction.

The board camera 15 is installed on the moving table 132 of the component transfer device 13 so that its optical axis faces downward in the vertical direction (Z-axis direction). Therefore, the board camera 15 can move in the X-axis direction and the Y-axis direction together with the movable stage 132, and can image the board K and the component P mounted on the board K from above in the vertical direction.

As described above, in this embodiment, the camera device S provided in the printing machine WM1, which is the first work machine, is configured and operates in the same manner as the board camera 15. Therefore, inside the printing machine WM1, the camera device S can move in the X-axis direction and the Y-axis direction by a driving device (not shown) that corresponds to the head driving device 131 and the moving stage 132 of the component mounting machine WM3 described above, and can capture images of the board K and the solder, which is the joining material B printed on the board K, from above in the vertical direction.

The component camera 14 and the board camera 15 perform imaging based on control signals sent from the control device 16. The image data of the captured image captured by the component camera 14 is then transmitted to the control device 16. Further, image data PD of a captured image captured by the board camera 15 is transmitted to the control device 16 and the line management device LC. Note that, as the component camera 14 and the board camera 15 (camera device S), a known digital imaging device having an imaging element such as a CCD or CMOS can be used, so a detailed description of the structure thereof will be omitted.

The control device 16 includes a computer device having a CPU, ROM, RAM, various interfaces, etc., a storage device for storing various information, and the like. The control device 16 receives input of detected values and information output from various sensors provided in each component mounting machine WM3, or various image data (including image data PD) representing captured images. The control device 16 executes a control program and sends control signals to each device according to, for example, predetermined mounting conditions set in advance.

For example, the control device 16 causes the board camera 15 to image the board K positioned by the board transport device 11 in the component mounting machine WM3. Then, the control device 16 processes the image captured by the board camera 15 and recognizes the positioning state of the board K. Further, the control device 16 causes the holding member 21 to collect and hold the component P supplied by the component supply device 12, and causes the component camera 14 to image the component P held by the holding member 21. The control device 16 then performs image processing on the image captured by the component camera 14 and recognizes the posture of the component P.

The control device 16 executes the control program and moves the holding member 21 upward from a preset scheduled mounting position. Further, the control device 16 corrects the scheduled mounting position based on the positioning state of the board K, the attitude of the component P, etc., and sets the mounting position where the component P is actually mounted. Note that the scheduled mounting position and the mounting position include not only the position (X-axis coordinate and Y-axis coordinate) but also the rotation angle.

The control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of the holding member 21 according to the mounting position. Then, the control device 16 lowers the holding member 21 at the corrected rotation angle at the corrected target position, and mounts the component P on the board K. The control device 16 executes the mounting process of mounting a plurality of parts P onto the board K by repeating the pick-and-place cycle as described above.

3. Configuration example of the inspection device 30 For example, the board-to-board work machine WM performs image processing on image data PD acquired by an imaging device (for example, the component camera 14, the board camera 15, etc. in the component mounting machine WM3), and detects defects. In some cases, board-related work may be stopped. Further, the board-related work machine WM may stop the board-related work when a situation occurs in which it is impossible to continue the board-based work (for example, in the component mounting machine WM3, there is a shortage of parts P to be mounted). Furthermore, the operator may operate a stop button to stop the board-facing work by the board-facing work machine WM.

When the work on the board is stopped, as shown in Figure 2, if a foreign object C (e.g., another component P, dust, etc.) is attached to the mounting position of the component P, the mounting of the component P may be incorrect. (For example, there is a possibility that the component P is not mounted, is floating, is tilted, etc.), and it is necessary to determine whether there is a foreign substance C attached to the board K. In this case, a plurality of image data PD obtained by capturing the same inspection area TA of at least a part of the substrate K are compared, and foreign matter It is assumed that the presence or absence of

In this case, each of the board-to-board work machines WM constituting the board-to-board work line WL uses, for example, the image data PD when the board K was carried into the machine and the image data PD captured immediately before the board-to-board work. By comparing, the presence or absence of foreign matter C can be determined. However, when the board K is sequentially conveyed between a plurality of board work machines WM, as in the board work line WL, that is, the board product Kp is finally produced through a plurality of board work processes. There is a request to determine where (in which board-to-board work process using which board-to-board work machine WM) foreign matter C attached to the substrate K has attached to the inspection area TA of the board K.

In addition, when the board-related work is stopped, for example, the cause of the board-related work being stopped can be resolved between obtaining the reference image data PD and obtaining the image data PD to be inspected. It may take time to do so. If the work on the board continues to be stopped, the state of the board K, especially the state of the bonding member B, may change. Therefore, obtain the state of the inspection area TA of the board K at the time the work on the board is stopped. There is a request to do so.

Therefore, in this embodiment, the inspection apparatus 30 adopts a configuration that can determine the state of the inspection area TA of the board K over a plurality of board-facing work processes. Specifically, the inspection device 30 includes an acquisition section 31 and a determination section 32. Further, in this embodiment, the inspection device 30 includes a setting section 33. Furthermore, in this embodiment, the inspection device 30 includes a guide section 34. That is, in this embodiment, as shown in FIG. 3, the inspection device 30 includes an acquisition section 31, a determination section 32, a setting section 33, and a guide section 34.

As a result, when the inspection device 30 is applied to the substrate-to-board work line WL, the inspection device 30 uses the image data PD (hereinafter referred to as "standard image data PDb ) and image data PD (hereinafter referred to as "inspection image data PDt") obtained by imaging the inspection area TA of the board K using the component mounting machine M3, which is the second work machine. , reference image data PDb and test image data PDt can be compared. Then, the inspection device 30 can determine the state of the inspection area TA of the substrate K by comparing the reference image data PDb and the inspection image data PDt.

Note that the inspection device 30 can be provided in various control devices. For example, the inspection device 30 can be provided in the control device 16 of the component mounting machine WM3 (M3), the line management device LC, the management device HC, etc. The inspection device 30 can also be formed on the cloud. In this embodiment, the acquisition section 31, determination section 32, setting section 33, and guide section 34 that constitute the inspection device 30 are provided in the line management device LC, as shown in FIG. 3, as an example.

3-1. Acquisition unit 31
The acquisition unit 31 acquires a plurality of image data PD by capturing images of at least a portion of the inspection area TA of the substrate K a plurality of times in accordance with the progress of a predetermined substrate work on the substrate K. Here, the acquisition unit 31 of this embodiment acquires the image data PD, which is an image of the inspection area TA of the board K in the printing machine WM1, as reference image data PDb, and the image data PD of the inspection area TA of the board K in the component mounting machine M3. The obtained image data PD is acquired as inspection image data PDt.

That is, the acquisition unit 31 detects that the camera device S provided in the printing machine WM1 moves to the inspection area TA of the board K immediately after the bonding member B (solder) is applied, which is the board-to-board work in the printing machine WM1. Captured reference image data PDb is acquired. Further, the acquisition unit 31 allows the board camera 15 provided in the component mounting machine M3 to inspect the board K immediately before the mounting of the component P into the inspection area TA, which is the board work in the component mounting machine M3, is carried out. The inspection image data PDt is acquired by moving to the area TA and, specifically, moving to the same position as the imaging position of the camera device S of the printing machine WM1 with respect to the substrate K.

Note that if the size of the inspection area TA exceeds the size of the camera field of view of the camera device S or the board camera 15, the acquisition unit 31 may, for example, move the camera device S or the board camera 15 within the inspection area TA. A plurality of image data PD captured by the image data PD are synthesized. Thereby, the acquisition unit 31 acquires one reference image data PDb and one test image data PDt.

3-2. Judgment section 32
The determination unit 32 determines the state of the inspection area TA by comparing the reference image data PDb acquired from the printing machine WM1 by the acquisition unit 31 with the inspection image data PDt acquired from the component mounting machine M3. The determination unit 32 of this embodiment detects the difference in the feature amount of the inspection area TA by comparing the reference image data PDb and the inspection image data PDt, and determines the state of the inspection area TA by detecting the difference in the feature amount of the inspection area TA. The presence or absence (existence state) of C is determined.

Here, in this embodiment, the luminance of each pixel that can be obtained by image processing of the reference image data PDb and the inspection image data PDt will be explained as an example of the feature amount. Note that the feature amount is not limited as long as it can be obtained by image processing the image data PD. The brightness, saturation, brightness, etc. of each pixel of the two image data PD (reference image data PDb and inspection image data PDt) are included in the feature amount. In addition, the area of the closed region, the length of the perimeter of the closed region, etc. obtained by image processing (for example, binarization processing, etc.) each of the two image data PD (reference image data PDb and inspection image data PDt) is included in the feature amount.

Then, the determination unit 32 determines that a foreign object C exists in the inspection area TA, for example, when the difference in the feature amount of the inspection area TA acquired from each of the reference image data PDb and the inspection image data PDt exceeds a predetermined threshold. It is determined that (there is). On the other hand, the determination unit 32 determines that, for example, when the difference in the feature amount of the inspection area TA acquired from each of the reference image data PDb and the inspection image data PDt is equal to or less than a predetermined threshold, the determination unit 32 determines that the foreign object C does not exist in the inspection area TA. ).

3-3. Setting section 33
The setting unit 33 sets the inspection area TA so as to include the mounting position based on mounting position information Js indicating the mounting position at which a specific component (e.g., a BGA (Ball Grid Array) component P) among the multiple components P mounted on the board K is to be mounted, and component information Jp for identifying the component. The mounting position information Js includes the mounting position specified by the sequence coordinates, the mounting angle when mounting the component P, the mounting order, etc. The component information Jp includes the size of the component P, the shape of the component P, the maximum transport acceleration, etc.

Specifically, the setting unit 33 receives, for example, the mounting position information Js of the component P that has been linked and inputted in advance from the management device HC, and the mounting position information Js of the component P to be mounted at the mounting position represented by the mounting position information Js. Parts information JP is acquired. Then, based on the component information Jp, if the component P to be mounted on the board K is a specific component such as a BGA, the setting unit 33 determines whether the component P to be mounted on the board K is a specific component such as a BGA or the like based on the attached mounting position information Js. The inspection area TA is set to include the mounting position where the specific component is mounted. The inspection area TA set by the setting unit 33 is, for example, based on the mounting position (sequence coordinates), the external shape (size) of the component P, and the margin, according to the shape of the camera field of view of the camera device S or the board camera 15. It is best to set it to a rectangular shape that includes.

Then, the setting unit 33 outputs setting information Ja representing the set inspection area TA to the printing machine WM1 and the component mounting machine M3. Thereby, the printing machine WM1 moves the camera device S to the set inspection area TA according to the setting information Ja, and outputs the captured reference image data PDb to the acquisition unit 31. Further, the component mounting machine M3 moves the board camera 15 to the set inspection area TA according to the setting information Ja, and outputs the captured inspection image data PDt to the acquisition unit 31. Note that the setting information Ja may include mounting position information Js and component information Jp instead of or in addition to the information representing the inspection area TA.

Here, instead of or in addition to automatically setting the inspection area TA based on the mounting position information Js and the component information Jp acquired from the management device HC, the setting unit 33, for example, It is also possible to set an area designated by a worker working on the WL as the inspection area TA. The board-to-board work line WL of this embodiment includes an input/output device 40. The operator can set an arbitrary area (the mounting position of the entire board K or a part of the board K) as the inspection area TA using, for example, the input/output device 40 shown by the broken line in FIG. In this case, the setting unit 33 can, for example, schematically display the mounting position of the component P on the board K on the display unit of the input/output device 40, so that the operator can select an arbitrary mounting position.

3-4. Guide unit 34
The guidance unit 34 informs the operator of the state of the inspection area TA determined by the determination unit 32. For example, when the determination unit 32 determines that a foreign object C is present in the inspection area TA, the guidance unit 34 informs the operator of the state of the inspection area TA determined by the determination unit 32. In this case, the guide unit 34 may take various forms as long as it can notify the operator of the presence of the foreign object C. For example, the guide unit 34 may be This can be used to notify the operator of the presence of the foreign object C (for example, by displaying a message, providing audio guidance, etc.).

Specifically, the guide unit 34 indicates the presence of the substrate K to which the foreign matter C is attached, the position on the substrate K where the foreign matter C is attached, or the position of the second work device WM. If there are a plurality of them, it is possible to guide the substrate-to-board work machine WM where the substrate K is present. Thereby, the operator can check the substrate K to which the foreign matter C is attached, and can take countermeasures (for example, carry out the substrate K, etc.). Note that the guide unit 34 can also similarly guide the worker about the presence of the foreign object C (for example, by display, voice guidance, vibration, etc.) using a mobile terminal owned by the worker.

4. Regarding determination of the state of the inspection area TA by the inspection device 30 In this embodiment, a case will be exemplified in which the inspection device 30 determines the presence or absence of a foreign object C as the state of the inspection area TA.

The acquisition unit 31 images at least a part of the inspection area TA of the board K by imaging a plurality of times according to the progress of the board work by the board work machine WM that performs a predetermined board work on the board K. , a plurality of image data PD obtained by imaging the same inspection area TA are acquired. Specifically, the acquisition unit 31 acquires the image data PD imaged by the printing machine WM1, that is, the reference image data PDb, and acquires the image data PD imaged by the component mounting machine M3, that is, the inspection image data PDt. Here, in this embodiment, the inspection area TA is automatically set by the setting unit 33.

The determining unit 32 acquires the image data PD captured by the printing machine WM1 from the acquiring unit 31 as reference image data PDb. Further, the determining unit 32 acquires the image data PD acquired by the component mounting machine M3 from the acquiring unit 31 as inspection image data PDt. In the present embodiment, the determination unit 32 determines, based on the difference in the feature amount (for example, pixel brightness, etc.) of the inspection area TA obtained by image processing the reference image data PDb and the inspection image data PDt, respectively. The presence or absence of foreign matter C adhering to the inspection area TA is determined.

That is, the determination unit 32 determines that the foreign object C is present in the inspection area TA when the difference in the feature amount of the inspection area TA acquired from each of the reference image data PDb and the inspection image data PDt exceeds a predetermined threshold value. . On the other hand, the determination unit 32 determines that there is no foreign object C in the inspection area TA when the difference in the feature amount of the inspection area TA is less than or equal to a predetermined threshold value.

Note that the predetermined threshold value is set to be larger than the feature amount when no foreign object C is attached to the inspection area TA, and smaller than the feature amount when the foreign object C is attached to the inspection area TA. Ru. The predetermined threshold value is obtained in advance by, for example, simulation or verification using an actual device.

4 and 5 schematically show an example of a plurality of (two) pieces of image data PD acquired by the acquisition unit 31. FIG. 4 shows reference image data PDb of the inspection area TA, which is imaged immediately after the joining member B (solder) is applied in the printing machine WM1 as the first working machine. Further, FIG. 5 shows inspection image data PDt of the inspection area TA, which is imaged immediately before the component P is mounted in the component mounting machine M3, which is the second work machine. Note that in FIGS. 4 and 5, for convenience of explanation, a plurality of pixels arranged in a grid pattern are shown together. Further, the region R shown in FIGS. 4 and 5 indicates the same region (set of the same plurality of pixels) in the inspection area TA.

When there is a foreign object C in the area R, the luminance of the pixel included in the area R of the inspection area TA shown in FIG. 4 for the reference image data PDb and the brightness of the pixel included in the area R of the inspection area TA shown in FIG. The difference between the brightness of the pixel and the brightness of the pixel exceeds a predetermined threshold. Conversely, when there is no foreign object C in the area R, the luminance of the pixels included in the area R of the inspection area TA shown in FIG. 4 for the reference image data PDb, and the area R of the inspection area TA shown in FIG. 5 for the inspection image data PDt. The difference between the luminance of the pixels included in the pixel becomes equal to or less than a predetermined threshold.

Therefore, the determination unit 32 determines the luminance of pixels included in the area R of the inspection area TA shown in FIG. 4 for the reference image data PDb, and the brightness of the pixels included in the area R of the inspection area TA shown in FIG. When the difference from the brightness exceeds a predetermined threshold value, it is determined that there is a foreign object C in the inspection area TA. On the other hand, the determining unit 32 determines the luminance of pixels included in the area R of the inspection area TA shown in FIG. 4 for the reference image data PDb, and the brightness of the pixels included in the area R of the inspection area TA shown in FIG. When the difference from the brightness is less than a predetermined threshold value, it is determined that there is no foreign object C in the inspection area TA. Note that the brightness comparison is performed for each corresponding pixel, for example.

Then, when the determining unit 32 determines that there is a foreign object C in the inspection area TA, the guide unit 34 guides the operator to the presence of the foreign object C. For example, the guide unit 34 uses the input/output device 40 to guide the operator to the presence of the foreign object C (for example, by display, voice guidance, etc.). Alternatively, the guide unit 34 similarly informs the worker of the presence of the foreign object C using a mobile terminal owned by the worker.

5. Inspection Method The above description of the inspection device 30 also applies to the inspection method. Specifically, the inspection method includes an acquisition step and a determination step. The acquisition process corresponds to control performed by the acquisition unit 31. The determination process corresponds to control performed by the determination unit 32. Further, the inspection method can include a setting step. The setting process corresponds to control performed by the setting section 33. Furthermore, the inspection method can also include a guiding step. The guiding process corresponds to the control performed by the guiding section 34.

As can be understood from the above explanation, according to the inspection device 30, the printing machine WM1, which is the first working machine, starts from the work process of applying solder, which is the joining member B, to the board K, and the second working machine, which is the component mounting machine. The state of the inspection area TA of the board K can be determined over a work process in which the machine M3 mounts the component P, that is, a plurality of board-facing work processes. What has been described above regarding the inspection device 30 also applies to the inspection method.

6. First Modification In the embodiment described above, the case where the determination unit 32 of the inspection device 30 determines the presence or absence of the foreign object C as the state of the inspection area TA has been exemplified. However, in the inspection device 30, the determination unit 32 can also determine the state of the bonding member B (solder) applied to the inspection area TA of the substrate K as the state of the inspection area TA. This first modification will be explained below.

Also in the first modification, the determining unit 32 determines whether the inspection area TA determine the state of Specifically, in the first modification, the determination unit 32 detects a change over time in the bonding member B (solder) applied to the inspection area TA by comparing the reference image data PDb and the inspection image data PDt. , the state of the bonding member B (solder) applied to the test area TA is determined as the state of the test area TA.

FIG. 6 shows an example of the state of the board K until the work for the board is stopped. In FIG. 6, for example, the state of the board K until the board work is stopped in the component mounting machine M2 is schematically shown using image data PD. Also in this case, the acquisition unit 31 acquires the image data PD captured by the printing machine WM1 as the reference image data PDb.

Then, it is assumed that the board K is transported to the component mounting machine M2, which is "another board working machine" downstream of the component mounting machine M1, and the board work is stopped in the component mounting machine M2. The acquisition unit 31 acquires first image data PD1 by capturing an image of the inspection area TA at the timing when the board-related work has stopped in the component mounting machine M2 where the board-related work has stopped.

In the first modification, the component mounting machine M2 is used as "another board-facing working machine", but for example, when the load of the mounting work on the component mounting machine M2 is high and the work time is long (so-called bottleneck In case of planned stoppage due to maintenance, etc., the component mounting machine M1 or other board-to-board work machine WM that performs board-to-board work should be arbitrarily set to "other board-to-board work machine". is also possible. That is, in this case, the first image data PD1 can be acquired by imaging the inspection area TA at the timing when the work on the board is stopped by the component mounting machine M1 or the work machine WM on the board.

The reference image data PDb and the first image data PD1 shown in FIG. 6 have a small difference in the feature amount of the inspection area TA (the difference in the feature amount is equal to or less than a predetermined threshold value), and the judgment unit 32 judges that there is no foreign matter C in the inspection area TA. Note that in FIG. 6, the target board K has not yet been transported to the component mounting machine M3, which is the second work machine downstream of the component mounting machine M2, and the image data PD is shown as blank.

In this way, when the acquisition unit 31 acquires the first image data PD1 from the component mounting machine M2, which is “another board-facing working machine”, the determination unit 32 determines whether a foreign object is detected as in the above embodiment. The presence or absence of C can be determined. As a result, the determining unit 32 determines that the image data attached to the inspection area TA is determined by the time when the reference image data PDb is acquired by the acquiring unit 31 and before the component mounting machine M2, which is “another board-facing work machine”, stops the work on the board. The presence or absence of foreign matter C can be determined.

In addition, as shown below, when a predetermined condition is satisfied, the determination unit 32 determines whether the bonding member B that joins the board K and the component P applied to the inspection area TA, that is, the solder printed on the inspection area TA. It is also possible to judge changes over time. For example, if the work on the board continues to be stopped, the feature amount of the inspection area TA obtained by image processing the image data PD may change due to changes in the bonding member B (solder) over time. Specifically, when the bonding member B is solder, the color changes from silver to gray as the flux it contains dries. Therefore, the feature amount of the inspection area TA may change due to changes in the solder over time, and in this case, the determining unit 32 may erroneously determine that the solder that has changed over time is a foreign object C.

Here, as shown in FIG. 6, the time from when the board work is stopped until it is restarted is defined as the stop time Q. In addition, the allowable time T is the stopping time Q during which the bonding member B (solder) applied to the inspection area TA is not mistakenly determined to be a foreign substance C even if the characteristic amount of the inspection area TA changes due to changes over time in the bonding member B (solder) applied to the inspection area TA. . As the stop time Q becomes shorter than the allowable time T, the component mounting machine M3 becomes less susceptible to changes over time in the bonding member B when determining the presence or absence of a foreign object C, and the component mounting machine M2 stops working on the board. The necessity of determining the presence or absence of foreign matter C is reduced.

Conversely, if the stop time Q becomes longer than the allowable time T, as explained in the above embodiment, when determining the presence or absence of foreign matter C in the component mounting machine M3, which is the second work machine, This becomes susceptible to changes over time, and the determining unit 32 tends to mistakenly determine that the joining member B is a foreign substance C. Therefore, in the first modification, when the stop time Q becomes longer than the allowable time T, the determining unit 32 determines whether or not there is a foreign object C in the component mounting machine M2 where the board work has stopped. Note that the determination of the state of the inspection area TA by the determination unit 32 in the first modification is performed as described above except for acquiring and using the first image data PD1 captured by the component placement machine M2 as the inspection image data PDt. Since it is similar to the form, its explanation will be omitted.

As for the stop time Q, it goes without saying that the actually measured actual time is used, but it is also possible to use an estimated time based on, for example, the cause of the stoppage of the board-related work and the details of the recovery work. Further, the allowable time T can be obtained in advance by, for example, simulation or verification using an actual machine.

Furthermore, the allowable time T may vary depending on the type of the joining member B, and the determination unit 32 can also use the allowable time T depending on the type of the joining member B. For example, the determination unit 32 can use the allowable time T depending on the type of solder. Further, the determination unit 32 can use the allowable time T depending on the type of adhesive.

Alternatively, the determination unit 32 can refer to data showing the relationship between the type of joining member B and the allowable time T to determine the allowable time T according to the type of joining member B. The data showing the relationship between the type of joining member B and the allowable time T may be stored in the inspection device 30, or may be stored in another device that can communicate with the inspection device 30 and acquired through communication.

Furthermore, the higher the temperature inside the component mounting machine WM3, the faster the flux contained in the solder, which is the joining material B, dries. Also, the lower the humidity inside the component mounting machine WM3, the faster the flux contained in the solder, which is the joining material B, dries. Therefore, the judgment unit 32 can use the allowable time T according to at least one of the temperature and humidity inside the component mounting machine WM3.

In this case, the determination unit 32, for example, refers to data indicating the relationship between at least one of the temperature and humidity inside the component mounting machine WM3 and the allowable time T, and determines the temperature and humidity inside the component mounting machine WM3. The allowable time T can be determined according to at least one of the above. Note that the data indicating the relationship between at least one of the temperature and humidity inside the component mounting machine WM3 and the allowable time T may be stored in the inspection device 30, or may be stored in another device that can communicate with the inspection device 30. The information may be stored in the device and acquired through communication.

Therefore, in the first modification, the determination unit 32 determines whether the "other board-to-board work" is a board-to-board work machine between the printing machine WM1, which is the first work machine, and the component mounting machine M3, which is the second work machine. The second image data PD2 acquired by the acquisition unit 31 in the component mounting machine M2 as a component mounting machine can be used as the inspection image data PDt. In the first modified example, the determination unit 32 uses the reference image data PDb captured (acquired) by the printing machine WM1 and the second image data PD2 acquired by the acquisition unit 31 in the component mounting machine M2. The state of the inspection area TA can be determined by comparing it with the inspection image data PDt. Thereby, the same effects as in the above-described embodiment can be obtained also in the first modification.

7. Second Modification When the work is stopped as described in the first modification, there is a possibility that the state of the reference inspection area TA represented by the reference image data PDb captured by the printer WM1 has changed over time. In particular, in the case of the first modification, when the substrate-related work is resumed, there is a high possibility that the state of the reference inspection area TA has changed. Here, the reference image data PDb acquired (captured) by the printer WM1, which is the first work machine, can be updated by the image data PD acquired by the acquisition unit 31 in the component mounting machine M2, which is a substrate-related work machine between the printer WM1 and the component mounting machine M3, which is the second work machine, i.e., the "other substrate-related work machine."

In the first modified example, for example, if substrate-related work has been stopped for a long time, the reference image data PDb captured by the printer WM1 is updated using image data PD captured by the component mounting machine M2, which is "another substrate-related work machine." The second modified example will be explained below, but to facilitate understanding, a situation in which substrate-related work has been resumed in the first modified example described above will be used as an example.

In the second modification, the component mounting machine M2 is set as "another board-facing working machine", but for example, when the load of the mounting work on the component mounting machine M2 is high and the work time is long (so-called bottleneck In case of planned stoppage due to maintenance, etc., the component mounting machine M1 or other board-to-board work machine WM that performs board-to-board work should be arbitrarily set to "other board-to-board work machine". is also possible. That is, in this case, the reference image data PDb can be updated with the image data PD captured by the component mounting machine M1 and the board-facing work machine WM.

FIG. 7 shows an example of the state of the board K after the board-related work is resumed. In FIG. 7, the state of the board K after the board work is restarted in the component mounting machine M2 is schematically shown using image data PD. In addition, in FIG. 7, the bonding member B is shown in black for convenience of illustration, and it is schematically shown that the bonding member B has changed over time while the work for the substrate is stopped.

The acquisition unit 31 images the inspection area TA and acquires second image data PD2 when the board-related work is restarted. Specifically, the acquisition unit 31 acquires the image data PD captured by the board camera 15 as the second image data PD2 in the component mounting machine M2, which is "another board-related work machine" and in which the board-related work is restarted. get. Therefore, the second image data PD2 is the image data PD at the time when the board-related work is restarted.

The judgment unit 32 acquires the second image data PD2 from the acquisition unit 31. The judgment unit 32 then updates the reference image data PDb captured (acquired) by the printing machine WM1 with the second image data PD2, thereby making the second image data PD2 new reference image data PDb. The judgment unit 32 then judges the state of the inspection area TA using the updated new reference image data PDb and the inspection image data PDt captured (acquired) by the component mounting machine M3 after the work on the board is resumed.

Here, the feature amount of the inspection area TA (the joining member B is white) obtained by image processing the reference image data PDb shown in FIG. 6, and the inspection obtained by image processing the inspection image data PDt shown in FIG. The difference in the feature amounts of the area TA (the joining member B is black) is large, and the difference in the feature amounts exceeds a predetermined threshold value. Therefore, the determining unit 32 mistakenly determines that there is a foreign object C in the inspection area TA. On the other hand, when the reference image data PDb is updated by the second image data PD2, the determination unit 32 selects the inspection area TA obtained by image processing the reference image data PDb and the inspection image data PDt shown in FIG. The presence or absence of the foreign object C is determined based on the difference in the feature amounts.

In this case, the feature amount of the inspection area TA (joint member B is black) obtained by image processing the reference image data PDb shown in FIG. 7, and the inspection obtained by image processing the inspection image data PDt shown in FIG. There is little difference in the feature amounts of the area TA (the joining member B is black), and the difference in the feature amounts (for example, the brightness of pixels, etc.) is less than or equal to a predetermined threshold. Therefore, the determining unit 32 determines that there is no foreign object C in the inspection area TA. In other words, erroneous determination of foreign matter C due to changes in bonding member B over time is suppressed. Note that FIG. 7 shows the state of the board K after the board work has been resumed, and the image data PD of the printing machine WM1 and the component mounting machine M1 on the upstream side of the component mounting machine M2 are shown as blank. has been done.

Therefore, in the second modification, the inspection area TA can be imaged and the second image data PD2 can be acquired at the timing when the board work is restarted. Thereby, the inspection device 30 can use the second image data PD2 at the time when the board work is resumed as new reference image data PDb, and for example, the bonding member B for determining the state of the inspection area TA. The effects of changes over time can be suppressed. As a result, in the second modification, the same effects as the embodiment and the first modification described above can be obtained, and the accuracy of determining the state of the inspection area TA when the board work is stopped and restarted is improved. can be done.

8. Other Modifications In the component mounting machine WM3 of the embodiment and each modification described above, the board transport device 11 transports one board K along one transport path formed by one conveyor belt or the like. I made it. Instead of this, the component mounting machine is equipped with a board transport device that can independently transport the two boards K along two transport paths each formed by two conveyor belts, etc. It may be a machine.

In addition, the component mounting machine WM3 of the above-described embodiment and each modification includes only one set of the head drive device 131 and the moving table 132 of the component transfer device 13, and the moving table 132 is equipped with one mounting head 20. I made it. Instead of this, the component transfer device is equipped with two sets of head drive devices and moving tables arranged to face each other, and each moving table is equipped with a mounting head. It may also be a type parts mounting machine.

Furthermore, in the embodiment and each modification described above, the inspection device 30 is provided with the setting section 33. However, for example, if the inspection area TA on the substrate K is set in advance and the setting of the inspection area TA is unnecessary, the setting unit 33 may be omitted. Further, in the embodiment and each modification described above, the inspection device 30 is provided with the guide section 34. However, for example, if there is no need to guide the worker, the guide section 34 may be omitted.

Furthermore, in the embodiment and each modification described above, the case where the acquisition unit 31 acquires the image data PD from the board camera 15 provided in the component mounting machine WM3 has been described as an example. However, the acquisition unit 31 is not limited to acquiring the image data PD from the board camera 15, and may acquire the image data PD from a separately provided imaging device (such as a camera).

15... Board camera, 30... Inspection device, 31... Acquisition unit, 32... Judgment unit, 33... Setting unit, 34... Guide unit, K... Board, Kp... Board product, P... Part, C... Foreign object, B... Joining Member, TA...Inspection area, PD...Image data, PD1...First image data, PD2...Second image data, PDb...Reference image data, PDt...Inspection image data, WM...Board-to-board working machine, WM1...Printing machine ( WM3 (M3)...Component mounting machine (second working machine), WM3 (M2)...Component mounting machine (other board work machine), S...Camera device, LC...Line management device, HC ...Management device, Js...installation position information, Jp...parts information

Claims

an acquisition unit that acquires a plurality of image data by capturing images a plurality of times in accordance with the progress of a predetermined board-facing work on the board, targeting at least a part of the inspection area of the board;
The image data acquired by the first work machine that applies a bonding member to the inspection area as the board-to-board work is used as reference image data, and the reference image data and the first work machine that applies the bonding member to the inspection area as the board-to-board work are used as reference image data. a determination unit that determines the state of the inspection area by comparing inspection image data that is the image data acquired by the second work machine;
Inspection equipment equipped with
The judgment unit is
A difference in feature amount of the inspection area is detected by comparing the reference image data and the inspection image data, and the presence state of a foreign object adhering to the inspection area is determined as the status of the inspection area. 1. The inspection device according to 1.
The judgment unit is
By comparing the reference image data and the inspection image data, the change over time of the bonding member applied to the inspection area is detected, and the condition of the bonding member applied to the inspection area is determined as the state of the inspection area. The inspection device according to claim 1, which determines a state.
The mounting position is included based on mounting position information representing a mounting position where a specific component of the plurality of components mounted on the board is mounted and component information for identifying the component. The inspection apparatus according to any one of claims 1 to 3, further comprising a setting section that sets the inspection area.
The inspection device according to any one of claims 1 to 3, further comprising a guide section that guides the state of the inspection area determined by the determination section.
The determination unit determines that the foreign object is present in the inspection area when a difference in the feature amount of the inspection area obtained from each of the reference image data and the inspection image data exceeds a predetermined threshold; The inspection device according to claim 2, wherein it is determined that the foreign object does not exist in the inspection area when the difference between the feature amounts is less than or equal to a predetermined threshold value.
The inspection device according to claim 6, wherein the feature amount is a luminance of each pixel that can be obtained by image processing of the reference image data and the inspection image data.
Any one of claims 1 to 3, wherein the acquisition unit acquires the image data by imaging with a board camera that is provided in the first work machine and the second work machine and can take an image of a part of the board. Inspection equipment described in Section.
The inspection device according to any one of claims 1 to 3, wherein the determination unit determines the state of the inspection area by comparing the inspection image data acquired by the acquisition unit at the substrate-related operation machine between the first operation machine and the second operation machine with the reference image data.
The reference image data acquired by the first work machine can be updated by the image data acquired by the acquisition unit in a board-to-board work machine between the first work machine and the second work machine,
The determination unit uses the reference image data that has been updated by the reference image data acquired by the acquisition unit in the first work machine or the image data acquired by the acquisition unit in the board-facing work machine. The inspection device according to any one of claims 1 to 3, wherein the inspection device determines the state of the inspection area.
The inspection device according to claim 9, wherein the acquisition unit acquires the image data by imaging with a camera that is provided in the substrate-facing work machine and can image a part of the substrate.
The inspection device according to claim 10, wherein the acquisition unit acquires the image data by imaging with a camera that is provided in the substrate-facing work machine and can image a part of the substrate.
The joining member is solder,
The inspection device according to any one of claims 1 to 3, wherein the first working machine is a printing machine.
an acquisition step of acquiring a plurality of image data by capturing images a plurality of times in accordance with the progress of a predetermined board-facing work on the board, targeting at least a part of the inspection area of the board;
The image data acquired by a first working machine that applies a bonding member to the inspection area as the board-facing work is used as reference image data, and is acquired by a second working machine that mounts a component on the inspection area as the board-facing work. a determination step of determining the state of the inspection area by comparing the inspection image data, which is the image data, with the reference image data;
An inspection method with