JP7473735B2 - Foreign object detection device and foreign object detection method - Google Patents

Description

This specification discloses technology relating to a foreign object detection device and a foreign object detection method.

The mounting line described in Patent Document 1 includes a first camera means, a second camera means, and an image processing means. The first camera means is a camera means capable of capturing at least a portion of the printed circuit board within its field of view, and is provided so as to be able to capture an image of the printed circuit board before electronic component mounting work is performed by any of the mounting machines. The second camera means is a camera means capable of capturing a similar range to that of the first camera means within its field of view, and is provided so as to be able to capture an image of the printed circuit board after electronic component mounting work is performed by any of the mounting machines or a mounting machine downstream of the mounting machine.

The image processing means performs image processing by comparing the image data captured by the second camera means with the image data captured by the first camera means. In this way, the mounting line described in Patent Document 1 is intended to detect abnormalities in the printing of solder when solder is printed on a printed circuit board, or abnormalities in the mounting of electronic components when electronic components are mounted on a printed circuit board.

JP 2007-335524 A

If a foreign object is found at the mounting position of a component, it may result in poor mounting of the component, and it is necessary to determine whether or not there is a foreign object on the board. When comparing multiple image data images of at least a portion of the same inspection area of the board and determining whether or not there is a foreign object based on differences in the feature amounts of the image data, there is a possibility that a material other than a foreign object may be mistakenly determined to be a foreign object. Specifically, the feature amounts of the inspection area obtained by image processing of the image data may fluctuate due to changes over time in the bonding material that is applied to the inspection area of the board to bond the board and the component, and this may result in the bonding material being mistakenly determined to be a foreign object.

In light of these circumstances, this specification discloses a foreign object detection device and a foreign object detection method that can suppress erroneous determination of foreign objects due to changes over time in the bonding material that is applied to the inspection area of the substrate and bonds the substrate to the component.

This specification discloses a foreign object detection device including an acquisition unit, a judgment unit, and a setting unit. The acquisition unit images at least a portion of an inspection area of a board multiple times within a predetermined allowable time to acquire multiple image data of the same inspection area. The judgment unit judges the presence or absence of a foreign object adhering to the inspection area based on a difference in a feature amount of the inspection area acquired by image processing each of the multiple image data acquired by the acquisition unit. The setting unit sets the allowable time in advance so that the judgment unit does not erroneously judge the joining material to be the foreign object due to a change over time in the feature amount of the inspection area caused by a change in the joining material applied to the inspection area to join the board and the component.

This specification also discloses a foreign object detection method including an acquisition step, a judgment step, and a setting step. The acquisition step images at least a portion of an inspection area of a substrate multiple times within a predetermined allowable time to acquire multiple image data images of the same inspection area. The judgment step judges the presence or absence of a foreign object adhering to the inspection area based on a difference in a feature amount of the inspection area acquired by image processing each of the multiple image data acquired by the acquisition step. The setting step pre-sets the allowable time so that the joining material that joins the substrate and the component, which is applied to the inspection area, does not erroneously judge the joining material to be the foreign object in the judgment step due to a change over time in the feature amount of the inspection area.

The above-mentioned foreign object detection device can suppress erroneous determination of foreign objects due to changes over time in the bonding material that is applied to the inspection area of the substrate and that bonds the substrate and the component. What has been described above about the foreign object detection device can also be said about the foreign object detection method.

FIG. 2 is a diagram showing a configuration example of a substrate-related work line; FIG. 2 is a plan view showing a configuration example of a component mounting machine. 2 is a block diagram showing an example of a control block of the foreign object detection device; 5 is a flowchart showing an example of a control procedure performed by the foreign object detection device. FIG. 4 is a schematic diagram showing an example of reference data. FIG. 13 is a schematic diagram showing an example of comparison data. FIG. 11 is a schematic diagram showing an example of a relationship between an allowable time, a first required time, and a second required time. 5 is a flowchart showing an example of a control procedure performed by the foreign object detection device.

1. Embodiment 1-1. Configuration Example of Substrate-related Work Line WL0 In the substrate-related work line WL0, a predetermined substrate-related work is performed on a substrate 90. The type and number of substrate-related work machines WM0 that make up the substrate-related work line WL0 are not limited. As shown in Fig. 1, the substrate-related work line WL0 of this embodiment is equipped with a plurality of substrate-related work machines WM0, including a printer WM1, a print inspection machine WM2, a component mounting machine WM3, a reflow oven WM4, and a visual inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

The printer WM1 prints solder at the mounting positions of multiple components 91 on the board 90. The print inspection machine WM2 inspects the printing condition of the solder printed by the printer WM1. As shown in Figure 2, the component mounting machine WM3 mounts multiple components 91 on the board 90 on which the solder has been printed by the printer WM1. There may be one component mounting machine WM3 or multiple component mounting machines WM3. When multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the task of mounting multiple components 91.

The reflow furnace WM4 heats the board 90 on which multiple components 91 have been mounted by the component mounting machine WM3, melting the solder and performing soldering. The appearance inspection machine WM5 inspects the mounting state of the multiple components 91 mounted by the component mounting machine WM3. In this way, the board-to-board work line WL0 can use multiple board-to-board operation machines WM0 to transport the boards 90 in sequence and perform production processes including inspection processes to produce board products 900. The board-to-board work line WL0 can also be equipped with board-to-board operation machines WM0 such as function inspection machines, buffer devices, board supply devices, board reversing devices, shield mounting devices, adhesive application devices, and ultraviolet ray irradiation devices as necessary.

The multiple substrate-related work machines WM0 and line management device LC0 that make up the substrate-related work line WL0 are communicatively connected by a communication unit. The line management device LC0 and management device HC0 are communicatively connected by a communication unit. The communication unit can communicatively connect them by wire or wirelessly, and various communication methods can be used.

In this embodiment, a local area network (LAN) is formed by the multiple substrate-related work machines WM0, the line management device LC0, and the management device HC0. Thus, the multiple substrate-related work machines WM0 can communicate with each other via the communication unit. The multiple substrate-related work machines WM0 can also communicate with the line management device LC0 via the communication unit. Furthermore, the line management device LC0 and the management device HC0 can also communicate with each other via the communication unit.

The line management device LC0 controls the multiple substrate-related work machines WM0 that make up the substrate-related work line WL0, and monitors the operating status of the substrate-related work line WL0. The line management device LC0 stores various control data for controlling the multiple substrate-related work machines WM0. The line management device LC0 transmits control data to each of the multiple substrate-related work machines WM0. In addition, each of the multiple substrate-related work machines WM0 transmits its operating status and production status to the line management device LC0.

The management device HC0 manages at least one line management device LC0. For example, the operating status and production status of the substrate-related work machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as necessary. The management device HC0 is provided with a storage device. The storage device can store various acquired data acquired by the substrate-related work machine WM0. For example, various image data captured by the substrate-related work machine WM0 is included in the acquired data. Records (log data) of the operating status acquired by the substrate-related work machine WM0 are included in the acquired data. The storage device can also store various production information related to the production of the substrate product 900.

The substrate-related work line WL0 is equipped with an input/output device 80. A known input/output device may be used as the input/output device 80. The input/output device 80 has a display unit and displays various data in a visually recognizable manner. The display unit is also configured with a touch panel and also functions as an input device that accepts various operations by the worker.

1-2. Example of configuration of component mounting machine WM3 The component mounting machine WM3 mounts a plurality of components 91 on a board 90. As shown in Fig. 2, the component mounting machine WM3 includes a board transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, and a control device 16.

The board transport device 11 is, for example, configured with a belt conveyor, and transports the board 90 in a transport direction (X-axis direction). The board 90 is a circuit board on which electronic circuits, electric circuits, magnetic circuits, etc. are formed. The board transport device 11 transports the board 90 into the component mounting machine WM3 and positions the board 90 at a predetermined position within the machine. After the mounting process of multiple components 91 by the component mounting machine WM3 is completed, the board transport device 11 transports the board 90 out of the component mounting machine WM3.

The component supply device 12 supplies a plurality of components 91 to be mounted on the board 90. The component supply device 12 has a plurality of feeders 12a arranged along the transport direction (X-axis direction) of the board 90. Each of the plurality of feeders 12a is equipped with a reel. A carrier tape containing a plurality of components 91 is wound around the reel. The feeder 12a feeds the carrier tape at a pitch to supply the components 91 so that they can be picked up at a supply position located at the tip side of the feeder 12a. The component supply device 12 can also supply electronic components (e.g., lead components, etc.) that are relatively large compared to chip components, etc., while they are arranged on a tray.

The component transfer device 13 is equipped with a head drive device 13a and a movable table 13b. The head drive device 13a is configured to be able to move the movable table 13b in the X-axis direction and the Y-axis direction by a linear motion mechanism. A mounting head 20 is detachably (replaceably) attached to the movable table 13b by a clamp member. The mounting head 20 uses at least one holding member 30 to pick up and hold a component 91 supplied by the component supply device 12, and mounts the component 91 on a board 90 positioned by the board transport device 11. The holding member 30 can be, for example, a suction nozzle, a chuck, or the like.

The component camera 14 and the board camera 15 may use a known imaging device. The component camera 14 is fixed to the base of the component mounting machine WM3 so that the optical axis faces upward in the vertical direction (Z-axis direction). The component camera 14 can image the component 91 held by the holding member 30 from below. The board camera 15 is provided on the moving table 13b of the component transfer device 13 so that the optical axis faces downward in the vertical direction (Z-axis direction). The board camera 15 can image the board 90 from above. The component camera 14 and the board camera 15 capture images based on control signals sent from the control device 16. Image data of the captured images captured by the component camera 14 and the board camera 15 are transmitted to the control device 16.

The control device 16 is equipped with a known arithmetic device and storage device, and constitutes a control circuit. Information and image data output from various sensors provided in the component mounting machine WM3 are input to the control device 16. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions that have been set in advance.

For example, the control device 16 causes the board camera 15 to capture an image of the board 90 positioned by the board transport device 11. The control device 16 processes the image captured by the board camera 15 to recognize the positioning state of the board 90. The control device 16 also causes the holding member 30 to pick up and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to capture an image of the component 91 held by the holding member 30. The control device 16 processes the image captured by the component camera 14 to recognize the holding posture of the component 91.

The control device 16 moves the holding member 30 above the intended mounting position that is set in advance by a control program or the like. The control device 16 also corrects the intended mounting position based on the positioning state of the board 90, the holding posture of the component 91, and the like, and sets the mounting position where the component 91 will actually be mounted. The intended mounting position and the mounting position include a rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).

The control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of the holding member 30 to match the mounting position. The control device 16 lowers the holding member 30 at the corrected rotation angle in the corrected target position to mount the component 91 on the board 90. The control device 16 repeats the above pick-and-place cycle to perform the mounting process of mounting multiple components 91 on the board 90.

2, if a foreign object 92 (e.g., another component 91, dust, etc.) is attached to the mounting position of the component 91, the mounting of the component 91 may be defective (e.g., the component 91 may not be mounted, may float, may be tilted, etc.), and it is necessary to determine whether or not a foreign object 92 is attached to the board 90. When multiple image data PD0 obtained by capturing images of at least a portion of the same inspection area CA0 of the board 90 are compared to determine whether or not the foreign object 92 is present based on differences in the feature amounts (e.g., pixel brightness, etc.) of the image data PD0, there is a possibility that a member other than the foreign object 92 may be erroneously determined to be the foreign object 92.

Specifically, the feature amount of the inspection area CA0 acquired by image processing of the image data PD0 varies due to changes over time in the bonding material 93 (e.g., solder, adhesive, etc.) that is applied to the inspection area CA0 of the board 90 and bonds the board 90 to the component 91, and this may result in the bonding material 93 being erroneously determined to be a foreign object 92. Therefore, the substrate work line WL0 of this embodiment is provided with a foreign object detector 70 that can suppress erroneous determination of a foreign object 92 due to changes over time in the bonding material 93.

When considered as a control block, the foreign object detection device 70 includes an acquisition unit 71, a judgment unit 72, and a setting unit 73. The foreign object detection device 70 can also include a transport control unit 74. The foreign object detection device 70 can also include a mounting control unit 75. As shown in FIG. 3, the foreign object detection device 70 of this embodiment includes an acquisition unit 71, a judgment unit 72, a setting unit 73, a transport control unit 74, and a mounting control unit 75.

The foreign object detection device 70 can be provided in various control devices. For example, the foreign object detection device 70 can be provided in the control device 16 of the component mounting machine WM3, the line management device LC0, the management device HC0, etc. The foreign object detection device 70 can also be formed on the cloud. As shown in FIG. 3, in the foreign object detection device 70 of this embodiment, the acquisition unit 71, the judgment unit 72, the transport control unit 74, and the mounting control unit 75 are provided in each control device 16 of multiple (three in the example shown in FIG. 1) component mounting machines WM3, and the setting unit 73 is provided in the management device HC0.

Furthermore, the foreign object detection device 70 of this embodiment executes control in accordance with the flowchart shown in Figure 4. The acquisition unit 71 performs the process shown in step S12. The judgment unit 72 performs the process shown in step S13. The setting unit 73 performs the process shown in step S11. Note that the processes performed by the transport control unit 74 and the mounting control unit 75 are described below.

1-3-1. Acquisition unit 71
The acquisition unit 71 captures an image of at least a part of the inspection area CA0 of the substrate 90 a plurality of times within a predetermined allowable time T0, and acquires a plurality of image data PD0 capturing the image of the same inspection area CA0 (see FIG. 4). (Step S12 shown).

The acquisition unit 71 may image the entire mounting area of the board 90 as the inspection area CA0, or may image a portion of the mounting area of the board 90. When the acquisition unit 71 images a portion of the mounting area of the board 90, it can image the mounting area of a component 91 (such as a BGA (Ball Grid Array) component 91) that has a larger number of electrodes than a chip component and is more susceptible to the influence of foreign matter 92. The acquisition unit 71 can also learn mounting areas where foreign matter 92 has caused mounting defects of the component 91, mounting areas where foreign matter 92 is likely to adhere, and the like, based on past mounting records, and image these mounting areas as the inspection area CA0.

The acquisition unit 71 can also set an area specified by a user of the component mounting machine WM3 that mounts components 91 on the board 90 as the inspection area CA0. The substrate-to-substrate work line WL0 of this embodiment is equipped with an input/output device 80. For example, the user can use the input/output device 80 to specify an arbitrary area (the entire mounting area of the board 90 or a portion of the mounting area of the board 90) as the inspection area CA0. In this case, the acquisition unit 71 can cause the display unit of the input/output device 80 to display a schematic representation of the mounting area of the components 91 on the board 90, allowing the user to select the arbitrary mounting area.

The acquisition unit 71 can acquire image data PD0 using an imaging device capable of imaging the inspection area CA0. The imaging device is not limited as long as it can image the inspection area CA0. For example, the imaging device includes a board camera 15 capable of imaging a part of the mounting area of the board 90 from above the board 90, and a ceiling camera capable of imaging the entire mounting area of the board 90 from above the board 90. In this embodiment, the board camera 15 is used, and the acquisition unit 71 sets the area specified by the user of the component mounting machine WM3 as the inspection area CA0. The acquisition unit 71 images the same inspection area CA0 multiple times with the same imaging conditions (e.g., exposure time, aperture, illumination time, etc.) that can be set by the imaging device. The allowable time T0 is set by the setting unit 73.

1-3-2. Determination unit 72
The determination unit 72 determines the presence or absence of a foreign substance 92 adhering to the inspection area CA0 based on the difference in the feature amount of the inspection area CA0 acquired by performing image processing on each of the multiple image data PD0 acquired by the acquisition unit 71. (step S13 shown in FIG. 4).

The first image data PD0 acquired from the multiple (two in this embodiment) image data PD0 is set as the reference data SD0. The other image data PD0 from the multiple (two) image data PD0 is set as the comparison data CD0. At this time, the judgment unit 72 judges that a foreign substance 92 is attached to the inspection area CA0 when the difference between the feature amount of the inspection area CA0 acquired from the reference data SD0 and the feature amount of the inspection area CA0 acquired from the comparison data CD0 exceeds a predetermined threshold. The judgment unit 72 judges that a foreign substance 92 is not attached to the inspection area CA0 when the difference between the feature amount of the inspection area CA0 acquired from the reference data SD0 and the feature amount of the inspection area CA0 acquired from the comparison data CD0 is equal to or less than a predetermined threshold.

The feature amount is not limited to any particular one, as long as it is obtained by performing image processing on the image data PD0. For example, the brightness, saturation, brightness, etc. of each pixel of the reference data SD0 and the comparison data CD0 are included in the feature amount. In addition, the area of the closed region, the length of the perimeter of the closed region, etc. obtained by performing image processing (e.g., binarization processing, etc.) on each of the reference data SD0 and the comparison data CD0 are included in the feature amount. In this embodiment, the feature amount is the brightness of each pixel of the reference data SD0 and the comparison data CD0.

The above-mentioned predetermined threshold value is set to be larger than the characteristic amount (e.g., pixel brightness) when no foreign matter 92 is attached to the inspection area CA0 and smaller than the characteristic amount when the foreign matter 92 is attached to the inspection area CA0. The predetermined threshold value is obtained in advance, for example, by simulation or verification using an actual device.

Figures 5 and 6 show schematic examples of multiple (two) image data PD0 acquired by acquisition unit 71. Figure 5 shows reference data SD0, and Figure 6 shows comparison data CD0. Note that Figures 5 and 6 also show multiple pixels arranged in a grid pattern. Also, area AR0 shown in Figures 5 and 6 shows the same area (a collection of the same multiple pixels) of inspection area CA0.

When a foreign substance 92 is attached to the area AR0, the difference between the luminance of the pixel included in the area AR0 shown in Figure 5 and the luminance of the pixel included in the area AR0 shown in Figure 6 exceeds a predetermined threshold value. Conversely, when a foreign substance 92 is not attached to the area AR0, the difference between the luminance of the pixel included in the area AR0 shown in Figure 5 and the luminance of the pixel included in the area AR0 shown in Figure 6 is equal to or less than a predetermined threshold value.

Therefore, the judgment unit 72 judges that a foreign substance 92 is attached to the inspection area CA0 when the difference between the luminance of the pixel included in the area AR0 shown in Fig. 5 and the luminance of the pixel included in the area AR0 shown in Fig. 6 exceeds a predetermined threshold. The judgment unit 72 judges that a foreign substance 92 is not attached to the inspection area CA0 when the difference between the luminance of the pixel included in the area AR0 shown in Fig. 5 and the luminance of the pixel included in the area AR0 shown in Fig. 6 is equal to or less than a predetermined threshold. The comparison of luminance is performed for each corresponding pixel.

The determination unit 72 can also make a similar determination when the number of image data PD0 acquired by the acquisition unit 71 is three or more. Specifically, the determination unit 72 can calculate the difference between the feature amount of the inspection area CA0 acquired from the reference data SD0 and the feature amount of the inspection area CA0 acquired from each of the multiple comparison data CD0, and determine whether or not the calculated feature amount difference exceeds a predetermined threshold value.

Setting section 73
If the feature amount of inspection area CA0 acquired by image processing of image data PD0 varies due to changes over time in bonding material 93 that is applied to inspection area CA0 of substrate 90 and bonds substrate 90 to component 91, determination unit 72 may erroneously determine that bonding material 93 is a foreign object 92. Therefore, foreign object detection device 70 of the present embodiment is provided with a setting unit 73.

The setting unit 73 pre-sets the allowable time T0 so that the judgment unit 72 does not erroneously judge the joining material 93 to be a foreign matter 92 due to fluctuations in the characteristic values of the inspection area CA0 caused by changes over time in the joining material 93 that joins the substrate 90 and the component 91 applied to the inspection area CA0 (step S11 shown in Figure 4).

The joining member 93 is not limited to any particular material as long as it is a material that joins the substrate 90 and the component 91. For example, solder, adhesive, etc. are included in the joining member 93. In this embodiment, the joining member 93 is solder. Solder changes color from silver to gray as the flux contained in the solder dries. Therefore, the characteristic amount of the inspection area CA0 may vary due to changes in the solder over time, and the judgment unit 72 may erroneously judge the solder to be a foreign object 92.

The allowable time T0 is obtained in advance, for example, by simulation, verification using an actual device, or the like. Furthermore, the allowable time T0 may differ depending on the type of joining material 93, and the setting unit 73 can also set the allowable time T0 according to the type of joining material 93. For example, the setting unit 73 can set the allowable time T0 according to the type of solder. Furthermore, the setting unit 73 can set the allowable time T0 according to the type of adhesive.

The higher the temperature inside the component mounting machine WM3, the faster the flux contained in the solder dries. Also, the lower the humidity inside the component mounting machine WM3, the faster the flux contained in the solder dries. Therefore, the setting unit 73 can also set the allowable time T0 according to at least one of the temperature and humidity inside the component mounting machine WM3 that mounts the components 91 on the board 90.

1, in the substrate-related work line WL0, the substrate 90 is conveyed in sequence to a plurality of (three in the figure) component mounting machines WM3 that mount components 91 on the substrate 90, and the plurality of components 91 are mounted in sequence. As shown in Fig. 7, a first required time T1 is defined as a time that is expected to be required from when the substrate 90 is carried into one of the plurality (three) component mounting machines WM3 until the component mounting machine WM3 mounts the components 91 to be mounted therein and carries the substrate 90 out of the component mounting machine WM3, if the component mounting machine WM3 operates normally without stopping due to an error.

When the allowable time T0 is equal to or greater than the first required time T1, the acquisition unit 71 can acquire multiple image data PD0 for each component mounting machine WM3. In this case, the judgment unit 72 can judge the presence or absence of a foreign substance 92 adhering to the inspection area CA0 inside the component mounting machine WM3. When the allowable time T0 is equal to or greater than twice the first required time T1, the acquisition unit 71 can also acquire multiple image data PD0 for each of the component mounting machines WM3. In this case, the judgment unit 72 can judge the presence or absence of a foreign substance 92 for each of the component mounting machines WM3. In addition, when a board transport conveyor is provided between multiple component mounting machines WM3 arranged in succession, if the sum of the first required time T1 in each of the multiple component mounting machines WM3 and the second required time T2, which corresponds to the transport time by the board transport conveyor between the multiple component mounting machines WM3 and will be described later, is within the allowable time, the acquisition unit can also acquire multiple image data PDO for each of the multiple component mounting machines WM3. In this case as well, the determination unit 72 can determine the presence or absence of the foreign matter 92 for each of the multiple component mounting machines WM3.

In addition, when the allowable time T0 is less than the first required time T1, the acquisition of multiple image data PD0 by the acquisition unit 71 and the judgment of the presence or absence of foreign matter 92 by the judgment unit 72 are repeated multiple times in one component mounting machine WM3. From the simulation of the change over time of the bonding material 93 used in the board product 900 and the verification results using the actual machine, it was found that it is preferable for the acquisition unit 71 to acquire multiple image data PD0 for each component mounting machine WM3. Therefore, in the following description of the conveyance control unit 74 and the mounting control unit 75, the acquisition unit 71 acquires multiple image data PD0 for each component mounting machine WM3, and the judgment unit 72 judges the presence or absence of foreign matter 92 adhering to the inspection area CA0 inside the component mounting machine WM3. In addition, the acquisition unit 71, the judgment unit 72, and the setting unit 73 may be in any of the forms already described.

1-3-5. Transport control unit 74 and mounting control unit 75
The foreign object detection device 70 applied to the substrate-related work line WL0 can execute control, for example, according to the flowchart shown in Fig. 8. The component mounting machine WM3 that mounts the component 91 in the inspection area CA0 is the target component mounting machine MT0, and at least one component mounting machine WM3 provided upstream of the target component mounting machine MT0 is the upstream component mounting machine MU0. In this embodiment, the allowable time T0 is equal to or longer than the first required time T1 and equal to or longer than the second required time T2.

1 and 7, the multiple (three) component mounting machines WM3 are designated as component mounting machine M1, component mounting machine M2, and component mounting machine M3, starting from the upstream side. Furthermore, the component mounting machine M3 is designated as the target component mounting machine MT0, and the component mounting machine M1 and the component mounting machine M2 are designated as the upstream component mounting machines MU0.

The foreign object detection device 70 judges whether the component mounting machine WM3 is an upstream component mounting machine MU0 (component mounting machine M1 or component mounting machine M2) (step S21 shown in FIG. 8). If the component mounting machine WM3 is an upstream component mounting machine MU0 (Yes in step S21), the acquisition unit 71 acquires multiple image data PD0 (step S22). Specifically, the acquisition unit 71 acquires image data PD0 by imaging the inspection area CA0 before starting the mounting process of the component 91 in each upstream component mounting machine MU0, and acquires image data PD0 by imaging the inspection area CA0 after the mounting process of the component 91 is completed.

Next, the determination unit 72 determines whether or not a foreign object 92 is attached to the inspection area CA0 of the upstream component mounting machine MU0 (step S23). When the determination unit 72 determines that a foreign object 92 is not attached to the inspection area CA0 of the upstream component mounting machine MU0 (No in step S23), the transport control unit 74 transports the board 90 to the next component mounting machine WM3 located downstream of the upstream component mounting machine MU0 (step S24).

When the determination unit 72 determines that foreign matter 92 is attached to the inspection area CA0 in the upstream component mounting machine MU0 (Yes in step S23), the transport control unit 74 stops the transport of the board 90 (step S25). In this case, for example, the worker can remove the board 90 and check for the presence or absence of the foreign matter 92. Furthermore, if the foreign matter 92 can be removed, the worker can also remove the foreign matter 92.

If the component mounting machine WM3 is not the upstream component mounting machine MU0 (No in step S21), the foreign object detection device 70 judges whether the component mounting machine WM3 is the target component mounting machine MT0 (component mounting machine M3) (step S26). If the component mounting machine WM3 is the target component mounting machine MT0 (Yes in step S26), the acquisition unit 71 acquires multiple image data PD0 (step S27). Specifically, the acquisition unit 71 acquires image data PD0 by imaging the inspection area CA0 before starting the mounting process of the component 91 in the target component mounting machine MT0, and acquires image data PD0 by imaging the inspection area CA0 before mounting the component 91 to be mounted in the inspection area CA0.

Next, the determination unit 72 determines whether or not a foreign object 92 is attached to the inspection area CA0 of the target component mounting machine MT0 (step S28). When the determination unit 72 determines that a foreign object 92 is not attached to the inspection area CA0 of the target component mounting machine MT0 (No in step S28), the mounting control unit 75 permits mounting of the component 91 to be mounted in the inspection area CA0 (step S29). Then, control by the foreign object detection device 70 is temporarily terminated.

When the determination unit 72 determines that a foreign object 92 is attached to the inspection area CA0 in the target component mounting machine MT0 (Yes in step S28), the mounting control unit 75 restricts the mounting of the component 91 to be mounted in the inspection area CA0 (step S30). In this case, for example, the worker can remove the board 90 and check for the presence or absence of the foreign object 92. Furthermore, if the foreign object 92 can be removed, the worker can also remove the foreign object 92.

If the component mounting machine WM3 is not the target component mounting machine MT0 (No in step S26), the component mounting machine WM3 is located downstream of the target component mounting machine MT0, and a component 91 has already been mounted in the inspection area CA0. Therefore, in this case, control by the foreign object detection device 70 is temporarily terminated.

In this way, the acquisition unit 71 captures the inspection area CA0 to acquire image data PD0 before the upstream component mounting machine MU0 starts mounting the component 91 and after the mounting process is completed. Then, when the determination unit 72 determines that no foreign matter 92 is attached to the inspection area CA0 in the upstream component mounting machine MU0, the transport control unit 74 transports the board 90 to the next component mounting machine WM3 located downstream of the upstream component mounting machine MU0. By sequentially executing the above processes in the upstream component mounting machine MU0, the board 90 that does not have any foreign matter 92 attached to the inspection area CA0 is transported to the target component mounting machine MT0.

In addition, the acquisition unit 71 captures an image of the inspection area CA0 to acquire image data PD0 before starting the mounting process of the component 91 in the target component mounting machine MT0 and before mounting the component 91 to be mounted in the inspection area CA0. Then, when the determination unit 72 determines that no foreign matter 92 is attached to the inspection area CA0 in the target component mounting machine MT0, the mounting control unit 75 permits mounting of the component 91 to be mounted in the inspection area CA0. By executing the above process in the target component mounting machine MT0, the target component mounting machine MT0 can mount the component 91 to be mounted in the inspection area CA0 where no foreign matter 92 is attached.

1-3-6. Transportation of the board 90 between component mounting machines WM3 When adhesion of foreign matter 92 to the board 90 during transportation between component mounting machines WM3 becomes a problem, the foreign matter detection device 70 can perform the control shown below. Even in this embodiment, the board 90 is transported in sequence to multiple (three in the example shown in FIG. 1) component mounting machines WM3 that mount components 91 on the board 90, and the multiple components 91 are mounted in sequence. Also, the acquisition unit 71, the determination unit 72, and the setting unit 73 may be in any of the forms already described. Furthermore, as shown in FIG. 7 , a second required time T2 is the time predicted to take from when a board 90 is transported out of a first component mounting machine MF0, which is one of the multiple (three) component mounting machines WM3, until the board 90 is transported into a second component mounting machine MS0, which is the next component mounting machine WM3 located downstream of the first component mounting machine MF0, if the component mounting machine WM3 located downstream of the first component mounting machine MF0 operates normally without stopping due to an error.

If the allowable time T0 is equal to or longer than the second required time T2, the acquisition unit 71 images the inspection area CA0 after the mounting process of the components 91 in the first component mounting machine MF0 is completed and before the board 90 is transported out, and acquires image data PD0. The acquisition unit 71 also images the inspection area CA0 after the board 90 is transported into the second component mounting machine MS0 and before the mounting process of the components 91 in the second component mounting machine MS0 is started, and acquires image data PD0. In this case, the judgment unit 72 can judge the presence or absence of foreign matter 92 adhering to the inspection area CA0 when the board 90 is transported between the first component mounting machine MF0 and the second component mounting machine MS0.

2. Foreign object detection method What has already been described about the foreign object detection device 70 can also be said about the foreign object detection method. Specifically, the foreign object detection method includes an acquisition step, a determination step, and a setting step. The acquisition step corresponds to the control performed by the acquisition unit 71. The determination step corresponds to the control performed by the determination unit 72. The setting step corresponds to the control performed by the setting unit 73. The foreign object detection method can also include a transport control step. The transport control step corresponds to the control performed by the transport control unit 74. The foreign object detection method can also include a mounting control step. The mounting control step corresponds to the control performed by the mounting control unit 75.

3. Example of Effects of the Embodiment The foreign object detection device 70 can suppress erroneous determination of foreign object 92 caused by changes over time in the bonding material 93 that bonds the substrate 90 and the component 91 and is applied to the inspection area CA0 of the substrate 90. What has been described above about the foreign object detection device 70 also applies to the foreign object detection method.

70: foreign object detection device, 71: acquisition unit, 72: determination unit, 73: setting unit,
74: transport control unit, 75: mounting control unit, 90: board, 91: component,
92: foreign matter, 93: joining member, CA0: inspection area, PD0: image data,
SD0: Reference data, CD0: Comparison data, WM3: Component mounting machine,
MT0: Target component mounting machine, MU0: Upstream component mounting machine,
MF0: first component mounting machine, MS0: second component mounting machine,
T0: allowable time, T1: first required time, T2: second required time.

Claims (14)

an acquisition unit that images at least a part of an inspection area of a substrate a plurality of times within a predetermined allowable time period to acquire a plurality of image data obtained by imaging the same inspection area;
a determination unit that determines the presence or absence of a foreign matter adhering to the inspection area based on a difference in a feature amount of the inspection area acquired by performing image processing on each of the plurality of image data acquired by the acquisition unit;
a setting unit that sets the permissible time in advance so that the determining unit does not erroneously determine that the bonding material is the foreign matter due to a change over time in the characteristic amount of the inspection area caused by a change in the bonding material that bonds the board and the component and is applied to the inspection area;
A foreign object detection device comprising: The foreign object detection device of claim 1, wherein the acquisition unit determines, as the inspection area, an area specified by a user of a component mounting machine that mounts the components on the board. The foreign object detection device according to claim 1 or claim 2, wherein the judgment unit judges that the foreign object is attached to the inspection area when the difference between the feature amount of the inspection area obtained from reference data, which is one of the image data sets acquired first among the plurality of image data, and the feature amount of the inspection area obtained from comparison data, which is another of the image data sets, exceeds a predetermined threshold, and judges that the foreign object is not attached to the inspection area when the difference in the feature amount is equal to or less than a predetermined threshold. A foreign object detection device as described in claim 3, wherein the feature is the brightness for each pixel of the reference data and the comparison data. A foreign object detection device as described in any one of claims 1 to 4, wherein the setting unit sets the allowable time according to the type of the joining material. A foreign object detection device as described in any one of claims 1 to 5, wherein the setting unit sets the allowable time according to at least one of the temperature and humidity inside a component mounting machine that mounts the components on the board. A foreign object detection device as described in any one of claims 1 to 6, wherein the joining member is solder. The board is transported to a plurality of component mounting machines that mount the components on the board, and the components are mounted on the board in order;
the allowable time is equal to or longer than a first required time, which is a time expected to be required from when the board is carried into one of the component mounting machines, to when the component mounting machine mounts the components to be mounted therein and carries out the board from the component mounting machine, if the component mounting machine operates normally without stopping due to an error,
the acquiring unit acquires the plurality of image data for each of the component mounting machines,
8. The foreign matter detection device according to claim 1, wherein the determination unit determines whether or not the foreign matter is present in the inspection area inside the component mounting machine. The foreign object detection device of claim 8, wherein the acquisition unit images the inspection area to acquire the image data before starting the component mounting process in each of at least one upstream component mounting machine that is located upstream of a target component mounting machine that is the component mounting machine that mounts the component in the inspection area, and images the inspection area to acquire the image data after the component mounting process is completed. The foreign object detection device according to claim 9, further comprising a transport control unit that, when the determination unit determines that the foreign object is not attached to the inspection area in the upstream component mounting machine, transports the board to a next component mounting machine located downstream of the upstream component mounting machine, and, when the determination unit determines that the foreign object is attached to the inspection area in the upstream component mounting machine, stops the transport of the board. A foreign object detection device as described in any one of claims 8 to 10, wherein the acquisition unit images the inspection area and acquires the image data before starting the component mounting process in a target component mounting machine, which is the component mounting machine that mounts the component in the inspection area, and images the inspection area and acquires the image data before mounting the component to be mounted in the inspection area. The foreign object detection device according to claim 11, further comprising a mounting control unit that permits mounting of the component to be mounted in the inspection area when the judgment unit judges that the foreign object is not attached to the inspection area in the target component mounting machine, and restricts mounting of the component to be mounted in the inspection area when the judgment unit judges that the foreign object is attached to the inspection area in the target component mounting machine. The board is transported to a plurality of component mounting machines that mount the components on the board, and the components are mounted on the board in order;
the allowable time is equal to or longer than a second required time, which is a time expected to be required from when the board is discharged from a first component mounting machine, which is one of the plurality of component mounting machines, until when the board is discharged into a second component mounting machine, which is the next component mounting machine, which is provided downstream of the first component mounting machine, if the component mounting machine provided downstream of the first component mounting machine operates normally without stopping due to an error,
the acquisition unit acquires the image data by imaging the inspection area after the component mounting process in the first component mounting machine is completed and before the board is carried out, and acquires the image data by imaging the inspection area after the board is carried into the second component mounting machine and before the component mounting process in the second component mounting machine is started;
A foreign object detection device according to any one of claims 1 to 12, wherein the judgment unit judges the presence or absence of the foreign object adhering to the inspection area when the board is transported between the first component mounting machine and the second component mounting machine. an acquiring step of acquiring a plurality of image data of the same inspection area by capturing an image of at least a part of the substrate a plurality of times within a predetermined allowable time;
a determination step of determining the presence or absence of a foreign matter adhering to the inspection area based on a difference in a feature amount of the inspection area acquired by image processing each of the plurality of image data acquired in the acquisition step;
a setting step of setting the permissible time in advance so that the bonding material applied to the inspection area for bonding the board and the component is not erroneously determined as the foreign matter in the determination step due to a change in the feature amount of the inspection area caused by a change over time of the bonding material;
A foreign object detection method comprising:

Images