WO2022180663A1 - Foreign matter detection device and foreign matter detection method - Google Patents
Foreign matter detection device and foreign matter detection method Download PDFInfo
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- WO2022180663A1 WO2022180663A1 PCT/JP2021/006778 JP2021006778W WO2022180663A1 WO 2022180663 A1 WO2022180663 A1 WO 2022180663A1 JP 2021006778 W JP2021006778 W JP 2021006778W WO 2022180663 A1 WO2022180663 A1 WO 2022180663A1
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- component
- inspection area
- component mounting
- foreign matter
- mounting machine
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- 238000001514 detection method Methods 0.000 title claims abstract description 55
- 238000007689 inspection Methods 0.000 claims abstract description 121
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 238000012545 processing Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 35
- 230000008569 process Effects 0.000 claims description 31
- 230000032258 transport Effects 0.000 claims description 22
- 238000011144 upstream manufacturing Methods 0.000 claims description 22
- 238000003384 imaging method Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000005304 joining Methods 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 2
- 238000004891 communication Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
Definitions
- This specification discloses a technology related to a foreign object detection device and a foreign object detection method.
- the mounting line described in Patent Document 1 includes first camera means, second camera means, and image processing means.
- the first camera means is a camera means capable of viewing at least a part of the printed circuit board, and is provided so as to be able to image the printed circuit board before the electronic component mounting operation in any of the mounting machines.
- the second camera means is a camera means capable of capturing the same range as the first camera means in its field of view, and is capable of capturing images of electronic components by any mounter or by a mounter in a process subsequent to the mounter. It is provided so that the printed circuit board can be imaged after the mounting work.
- the image processing means performs image processing by comparing the image data captured by the second camera means with the image data captured by the first camera means.
- the mounting line described in Patent Document 1 attempts to detect abnormal solder printing when solder is printed on a printed circuit board, or abnormal mounting of electronic components when electronic components are mounted on a printed circuit board.
- the mounting of the component may be defective, and it is necessary to determine whether there is any foreign matter adhering to the board.
- members other than foreign matter are erroneously determined to be foreign matter.
- the characteristic amount of the inspection area obtained by image processing the image data varies with time in the bonding material applied to the inspection area of the substrate and used to bond the board and the component. There is a possibility of erroneously judging it as a foreign object.
- the present specification provides a foreign matter detection apparatus and a foreign matter detection method capable of suppressing erroneous determination of foreign matter due to aging of a joining member that joins a board and a component coated on an inspection area of the board. Disclose.
- a foreign object detection device that includes an acquisition unit, a determination unit, and a setting unit.
- the acquisition unit acquires a plurality of image data of the same inspection area by imaging at least a part of the inspection area of the substrate a plurality of times during a predetermined allowable time.
- the determination unit determines whether or not there is a foreign substance adhering to the inspection area based on a difference in feature amounts of the inspection area acquired by image processing each of the plurality of image data acquired by the acquisition unit. .
- the setting unit detects that the bonding member is mistaken as the foreign matter in the determination unit when the feature amount of the inspection area varies due to a change in the bonding member applied to the inspection area that bonds the substrate and the component over time.
- the permissible time is set in advance so as not to be judged.
- This specification also discloses a foreign matter detection method including an acquisition process, a determination process, and a setting process.
- the acquisition step an inspection area of at least a part of the substrate is imaged a plurality of times during a predetermined allowable time to acquire a plurality of image data of the same inspection area.
- the determining step determines whether or not there is a foreign substance adhering to the inspection area based on a difference in feature amounts of the inspection area obtained by image processing each of the plurality of image data obtained by the obtaining step. .
- the bonding member is mistaken as the foreign matter in the determination step due to variation in the feature amount of the inspection region due to a change in the bonding member applied to the inspection region and bonding the component to the substrate over time.
- the permissible time is set in advance so as not to be judged.
- the above-described foreign matter detection device it is possible to suppress erroneous determination of foreign matter due to changes over time in the bonding member that is applied to the inspection area of the substrate and joins the board and the component. What has been described above with respect to the foreign object detection device can be similarly applied to the foreign object detection method.
- FIG. 2 is a configuration diagram showing a configuration example of a work line for substrates; It is a top view which shows the structural example of a component mounting machine.
- 3 is a block diagram showing an example of control blocks of the foreign object detection device;
- FIG. 5 is a flow chart showing an example of a control procedure by a foreign object detection device;
- FIG. 4 is a schematic diagram showing an example of reference data; It is a schematic diagram which shows an example of comparison data. It is a schematic diagram which shows an example of the relationship between allowable time, the 1st required time, and the 2nd required time.
- 5 is a flow chart showing an example of a control procedure by a foreign object detection device;
- Embodiment 1-1 Configuration Example of Board-Related Work Line WL0
- predetermined board-related work is performed on the board 90 .
- the type and number of board-oriented work machines WM0 that constitute board-oriented work line WL0 are not limited.
- the board-to-board work line WL0 of the present embodiment includes a plurality of board-to-board work machines WM0 including a printing machine WM1, a print inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and an appearance inspection machine WM5.
- the substrate 90 is transported in this order by the substrate transport device.
- the printing machine WM1 prints solder on the mounting positions of the plurality of components 91 on the board 90 .
- the print inspection machine WM2 inspects the printed state of the solder printed by the printer WM1.
- the component mounter WM3 mounts a plurality of components 91 on a board 90 on which solder has been printed by the printer WM1.
- the number of component mounting machines WM3 may be one or plural. When a plurality of component mounters WM3 are provided, a plurality of components 91 can be mounted by the plurality of component mounters WM3.
- the reflow furnace WM4 heats the substrate 90 on which a plurality of components 91 are mounted by the component mounter WM3, melts the solder, and performs soldering.
- the appearance inspection machine WM5 inspects the mounting state of the plurality of components 91 mounted by the component mounting machine WM3.
- the board-related work line WL0 can use a plurality of board-related work machines WM0 to transport the boards 90 in sequence and perform production processes including inspection processes to produce the board products 900 .
- the board-to-board work line WL0 includes board-to-board work machines WM0 such as, for example, a function inspection machine, a buffer device, a board supply device, a board reversing device, a shield mounting device, an adhesive coating device, and an ultraviolet irradiation device. You can prepare.
- board-to-board work machines WM0 such as, for example, a function inspection machine, a buffer device, a board supply device, a board reversing device, a shield mounting device, an adhesive coating device, and an ultraviolet irradiation device. You can prepare.
- a plurality of board-oriented work machines WM0 and the line management device LC0 that constitute the board-oriented work line WL0 are communicably connected by a communication unit.
- the line management device LC0 and the management device HC0 are communicably connected by a communication unit.
- the communication unit can communicably connect them by wire or wirelessly, and various communication methods can be used.
- a local information communication network (LAN: Local Area Network) is configured by a plurality of board-to-board work machines WM0, line management devices LC0, and management devices HC0. Therefore, the plurality of board-oriented work machines WM0 can communicate with each other via the communication unit. Also, the plurality of board-oriented work machines WM0 can communicate with the line management device LC0 via the communication unit. Furthermore, the line management device LC0 and the management device HC0 can communicate with each other via the communication unit.
- LAN Local Area Network
- the line management device LC0 controls the plurality of board-oriented work machines WM0 that constitute the board-oriented work line WL0, and monitors the operation status of the board-oriented work line WL0.
- the line management device LC0 stores various control data for controlling the plurality of work machines for board WM0.
- the line management device LC0 transmits control data to each of the plurality of board-oriented work machines WM0. Further, each of the plurality of board-oriented work machines WM0 transmits the operation status and production status to the line management device LC0.
- the management device HC0 manages at least one line management device LC0. For example, the operation status and production status of the board-oriented work machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as necessary.
- the management device HC0 is provided with a storage device.
- the storage device can store various acquired data acquired by the board-oriented work machine WM0. For example, various image data captured by the board-oriented work machine WM0 are included in the acquired data. A record (log data) of the operation status acquired by the board-oriented work machine WM0 is included in the acquired data.
- the storage device can also store various production information regarding the production of the board product 900 .
- the substrate work line WL0 is equipped with an input/output device 80.
- a known input/output device can be used as the input/output device 80 .
- the input/output device 80 includes a display unit, and displays various data in a visible manner.
- the display unit is configured by a touch panel, and functions as an input device for receiving various operations by the operator.
- the component mounting machine WM3 mounts a plurality of components 91 on a board 90 .
- the component mounting machine WM3 includes a substrate conveying device 11, a component supply device 12, a component transfer device 13, a component camera 14, a substrate camera 15, and a control device 16.
- the substrate transport device 11 is configured by, for example, a belt conveyor, etc., and transports the substrate 90 in the transport direction (X-axis direction).
- the substrate 90 is a circuit board on which electronic circuits, electric circuits, magnetic circuits, and the like are formed.
- the board transfer device 11 carries the board 90 into the component mounting machine WM3 and positions the board 90 at a predetermined position inside the machine. After the component mounting machine WM3 finishes mounting the plurality of components 91, the board transfer device 11 carries the board 90 out of the component mounting machine WM3.
- the component supply device 12 supplies a plurality of components 91 to be mounted on the board 90 .
- the component supply device 12 includes a plurality of feeders 12a provided along the transport direction (X-axis direction) of the substrate 90 .
- Each of the plurality of feeders 12a is equipped with a reel.
- a carrier tape containing a plurality of components 91 is wound around the reel.
- the feeder 12a pitch-feeds the carrier tape and supplies the components 91 so as to be picked up at a supply position located on the leading end side of the feeder 12a.
- the component supply device 12 can also supply relatively large electronic components (for example, lead components) compared to chip components in a state of being arranged on a tray.
- the component transfer device 13 includes a head driving device 13a and a moving table 13b.
- the head driving device 13a is configured such that a moving table 13b can be moved in the X-axis direction and the Y-axis direction by a linear motion mechanism.
- a mounting head 20 is detachably (exchangeably) provided on the moving table 13b by a clamp member.
- the mounting head 20 uses at least one holding member 30 to pick up and hold the component 91 supplied by the component supply device 12 , and mounts the component 91 on the substrate 90 positioned by the substrate transfer device 11 .
- a suction nozzle, a chuck, or the like can be used as the holding member 30 .
- a known imaging device can be used for the component camera 14 and the substrate camera 15 .
- the component camera 14 is fixed to the base of the component mounter WM3 so that the optical axis faces upward in the vertical direction (Z-axis direction).
- the component camera 14 can image the component 91 held by the holding member 30 from below.
- the board camera 15 is provided on the moving table 13b of the component transfer device 13 so that the optical axis is downward in the vertical direction (Z-axis direction).
- the substrate camera 15 can image the substrate 90 from above.
- the component camera 14 and the substrate camera 15 perform imaging based on control signals sent from the control device 16 . Image data of captured images captured by the component camera 14 and the board camera 15 are transmitted to the control device 16 .
- the control device 16 includes a known arithmetic device and storage device, and constitutes a control circuit. Information, image data, and the like output from various sensors provided in the component mounting machine WM3 are input to the control device 16 .
- the control device 16 sends a control signal to each device based on the control program and predetermined wearing conditions set in advance.
- control device 16 causes the substrate camera 15 to image the substrate 90 positioned by the substrate transport device 11 .
- the control device 16 processes the image captured by the board camera 15 and recognizes the positioning state of the board 90 .
- the control device 16 causes the holding member 30 to collect and hold the component 91 supplied by the component supply device 12 , and causes the component camera 14 to image the component 91 held by the holding member 30 .
- the control device 16 processes the image captured by the component camera 14 and recognizes the holding posture of the component 91 .
- the control device 16 moves the holding member 30 upward from the intended mounting position preset by the control program or the like. Further, the control device 16 corrects the planned mounting position based on the positioning state of the substrate 90, the holding attitude of the component 91, and the like, and sets the mounting position where the component 91 is actually mounted.
- the planned mounting position and mounting position include the position (X-axis coordinate and Y-axis coordinate) as well as the rotation angle.
- the control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of the holding member 30 according to the mounting position.
- the controller 16 lowers the holding member 30 at the corrected rotation angle at the corrected target position to mount the component 91 on the substrate 90 .
- the control device 16 repeats the pick-and-place cycle described above to perform a mounting process of mounting a plurality of components 91 on the board 90 .
- Configuration Example of Foreign Matter Detector 70 As shown in FIG. It is necessary to determine whether or not there is a foreign substance 92 adhering to the substrate 90 . A plurality of image data PD0 obtained by imaging the same inspection area CA0 of at least a part of the substrate 90 are compared, and the presence or absence of the foreign matter 92 is determined based on the difference in the feature amount (for example, pixel luminance etc.) of the image data PD0. In this case, there is a possibility that a member other than the foreign object 92 is erroneously determined to be the foreign object 92 .
- the bonding member 93 for example, solder, adhesive, etc.
- the joining member 93 may be erroneously determined to be a foreign object 92 . Therefore, the board-to-board work line WL0 of the present embodiment is provided with a foreign matter detection device 70 capable of suppressing erroneous determination of the foreign matter 92 due to changes in the bonding member 93 over time.
- the foreign object detection device 70 is provided with an acquisition unit 71, a determination unit 72, and a setting unit 73 when viewed as control blocks.
- the foreign object detection device 70 can also include a transport control section 74 .
- the foreign matter detection device 70 can also include a mounting control section 75 .
- the foreign matter detection device 70 of this embodiment includes an acquisition section 71 , a determination section 72 , a setting section 73 , a transport control section 74 and a mounting control section 75 .
- the foreign matter detection device 70 can be provided in various control devices.
- the foreign object detection device 70 can be provided in the control device 16 of the component mounting machine WM3, the line management device LC0, the management device HC0, and the like.
- the foreign object detection device 70 can also be formed on the cloud.
- an acquisition unit 71, a determination unit 72, a transport control unit 74, and a mounting control unit 75 are configured to control a plurality of (three in the example shown in FIG. 1) components.
- the setting unit 73 is provided in the control device 16 of each mounting machine WM3, and the setting unit 73 is provided in the management device HC0.
- the foreign object detection device 70 of the present embodiment executes control according to the flowchart shown in FIG.
- the acquisition unit 71 performs the process shown in step S12.
- the determination unit 72 performs the process shown in step S13.
- the setting unit 73 performs the process shown in step S11. Processing by the transport control unit 74 and the mounting control unit 75 will be described later.
- the acquisition unit 71 captures images of at least a part of the inspection area CA0 of the substrate 90 a plurality of times during the predetermined allowable time T0, and acquires a plurality of image data PD0 of the same inspection area CA0 (see FIG. 4). shown step S12).
- the acquisition unit 71 may image the entire mounting area of the board 90 as the inspection area CA0, or may image a part of the mounting area of the board 90 .
- a component 91 for example, a BGA (Ball Grid Array) component
- the acquiring unit 71 acquires the mounting area where the component 91 is improperly mounted due to the foreign matter 92, the mounting area where the foreign matter 92 tends to adhere, and the like based on the past mounting results, and inspects these mounting areas. It can also be imaged as area CA0.
- the acquisition unit 71 can also set the area specified by the user of the component mounting machine WM3 that mounts the component 91 on the board 90 as the inspection area CA0.
- the board-to-board work line WL ⁇ b>0 of this embodiment includes an input/output device 80 .
- the user can, for example, use the input/output device 80 to specify an arbitrary area (the entire mounting area of the substrate 90 or a partial mounting area of the substrate 90) as the inspection area CA0.
- the obtaining unit 71 can display the mounting area of the component 91 on the substrate 90 schematically on the display unit of the input/output device 80 so that the user can select any mounting area.
- the acquisition unit 71 can acquire the image data PD0 using an imaging device capable of imaging the inspection area CA0.
- the imaging device is not limited as long as it can capture an image of the inspection area CA0.
- the imaging device includes a substrate camera 15 capable of imaging a partial mounting area of the substrate 90 from above the substrate 90 and a ceiling camera capable of imaging the entire mounting area of the substrate 90 from above the substrate 90 .
- the substrate camera 15 is used, and the acquisition unit 71 sets the area designated by the user of the component mounting machine WM3 as the inspection area CA0.
- the acquisition unit 71 makes the same imaging conditions (for example, exposure time, aperture, illumination time, etc.) that can be set by the imaging device, and causes the same inspection area CA0 to be imaged multiple times.
- the allowable time T0 is set by the setting unit 73 .
- Judgment part 72 The determination unit 72 determines whether or not there is a foreign substance 92 adhering to the inspection area CA0 based on the difference in the feature amount of the inspection area CA0 acquired by image processing each of the plurality of image data PD0 acquired by the acquisition unit 71. (step S13 shown in FIG. 4).
- the first piece of image data PD0 is set as reference data SD0.
- the other image data PD0 of the plurality (two) of image data PD0 is set as comparison data CD0.
- determination unit 72 determines that foreign matter 92 adheres to inspection area CA0. decide not to.
- the feature amount is not limited as long as it is obtained by image processing the image data PD0.
- the luminance, saturation, brightness, etc. of each pixel of the reference data SD0 and the comparison data CD0 are included in the feature amount.
- the area of the closed region, the length of the perimeter of the closed region, and the like obtained by performing image processing (for example, binarization processing) on each of the reference data SD0 and the comparison data CD0 are included in the feature amount.
- the feature amount is the brightness of each pixel of the reference data SD0 and the comparison data CD0.
- the predetermined threshold value is larger than the feature amount (for example, luminance of a pixel) when the foreign matter 92 is not adhered to the inspection area CA0, and the feature value when the foreign matter 92 is adhered to the inspection area CA0. set to be less than the amount
- the predetermined threshold value is acquired in advance by, for example, simulation, verification using an actual machine, or the like.
- FIG. 5 and 6 schematically show an example of a plurality (two) of image data PD0 acquired by the acquisition unit 71.
- FIG. FIG. 5 shows the reference data SD0
- FIG. 6 shows the comparison data CD0.
- 5 and 6 also show a plurality of pixels arranged in a grid pattern.
- an area AR0 shown in FIGS. 5 and 6 indicates the same area (set of the same plurality of pixels) in the inspection area CA0.
- the difference between the brightness of the pixels included in the area AR0 shown in FIG. 5 and the brightness of the pixels included in the area AR0 shown in FIG. 6 exceeds a predetermined threshold. Conversely, when the foreign matter 92 does not adhere to the area AR0, the difference between the luminance of the pixels included in the area AR0 shown in FIG. 5 and the luminance of the pixels included in the area AR0 shown in FIG. 6 is equal to or less than the predetermined threshold. .
- the determining unit 72 can similarly determine when the number of image data PD0 acquired by the acquiring unit 71 is three or more. Specifically, the determination unit 72 calculates the difference between the feature amount of the inspection area CA0 acquired from the reference data SD0 and the feature amount of the inspection area CA0 acquired from each of the plurality of comparison data CD0, and calculates It is possible to determine whether or not the difference between the calculated feature amounts exceeds a predetermined threshold.
- the foreign object detection device 70 of this embodiment includes a setting section 73 .
- the setting unit 73 determines that the bonding member 93 is a foreign object 92 in the determination unit 72 when the feature amount of the inspection area CA0 changes due to the change over time of the bonding member 93 that bonds the substrate 90 and the component 91 applied to the inspection area CA0. To prevent erroneous determination, the permissible time T0 is set in advance (step S11 shown in FIG. 4).
- the joining member 93 is not limited as long as it is a member that joins the substrate 90 and the component 91 .
- solder, adhesive, etc. are included in the joining member 93 .
- the joining member 93 is solder.
- the solder turns from silver to gray as the flux it contains dries. Therefore, there is a possibility that the characteristic amount of the inspection area CA0 will fluctuate due to changes in the solder over time, and there is a possibility that the determination unit 72 will erroneously determine that the solder is a foreign object 92 .
- the allowable time T0 is obtained in advance by, for example, simulation or verification using an actual machine.
- the allowable time T0 may vary depending on the type of the joint member 93, and the setting unit 73 can set the allowable time T0 according to the type of the joint member 93.
- the setting unit 73 can set the allowable time T0 according to the type of solder.
- the setting unit 73 can set the allowable time T0 according to the type of adhesive.
- the setting unit 73 can also set the allowable time T0 according to at least one of the temperature and humidity inside the component mounting machine WM3 that mounts the component 91 on the substrate 90 .
- the acquisition unit 71 can acquire a plurality of pieces of image data PD0 for each component mounting machine WM3. In this case, the determination unit 72 can determine the presence or absence of the foreign matter 92 adhering to the inspection area CA0 inside the component mounting machine WM3. Note that when the allowable time T0 is twice or more the first required time T1, the acquisition unit 71 can also acquire a plurality of pieces of image data PD0 for each of the plurality of component mounters WM3. In this case, the determination unit 72 can determine the presence or absence of the foreign matter 92 for each of the component mounters WM3.
- the acquisition unit acquires a plurality of image data PDO for each of the plurality of component mounting machines WM3. can also be obtained. Also in this case, the determination unit 72 can determine the presence or absence of the foreign matter 92 for each of the plurality of component mounters WM3.
- the acquisition unit 71 acquires a plurality of image data PD0 for each component mounting machine WM3, The presence or absence of foreign matter 92 adhering to inspection area CA0 is determined. Further, the acquiring unit 71, the determining unit 72, and the setting unit 73 may have any of the forms already described.
- Transport control unit 74 and mounting control unit 75 The foreign object detection device 70 applied to the substrate-oriented work line WL0 can perform control according to the flowchart shown in FIG. 8, for example.
- the component mounter WM3 that mounts the component 91 in the inspection area CA0 is referred to as the target component mounter MT0, and at least one component mounter WM3 provided on the upstream side of the target component mounter MT0 is referred to as the upstream component mounter MU0. do.
- the allowable time T0 is longer than the first required time T1 and longer than the second required time T2.
- the plurality of (three) component mounters WM3 will be referred to as a component mounter M1, a component mounter M2, and a component mounter M3 in order from the upstream side.
- the component mounting machine M3 is assumed to be the target component mounting machine MT0
- the component mounting machine M1 and the component mounting machine M2 are assumed to be the upstream component mounting machine MU0.
- the foreign matter detection device 70 determines whether or not the component mounter WM3 is the upstream component mounter MU0 (the component mounter M1 or the component mounter M2) (step S21 shown in FIG. 8).
- the acquiring unit 71 acquires a plurality of image data PD0 (step S22). Specifically, the acquiring unit 71 acquires the image data PD0 by capturing an image of the inspection area CA0 before starting the mounting process of the component 91 in each of the upstream component mounting machines MU0. After completion, the inspection area CA0 is imaged to obtain image data PD0.
- the judgment unit 72 judges whether or not the foreign matter 92 adheres to the inspection area CA0 in the upstream component mounting machine MU0 (step S23).
- the transport control unit 74 controls the upstream component mounting machine MU0.
- the substrate 90 is carried out to the next component mounting machine WM3 provided downstream of MU0 (step S24).
- the transport control unit 74 stops carrying out the substrate 90. (step S25).
- the operator can take out the substrate 90 and check the presence or absence of the foreign matter 92 . Also, if the removal of the foreign matter 92 is possible, the operator can also remove the foreign matter 92 .
- the foreign object detection device 70 determines whether the component mounting machine WM3 is the target component mounting machine MT0 (the component mounting machine M3). It judges (step S26).
- the acquiring unit 71 acquires a plurality of image data PD0 (step S27). Specifically, the acquiring unit 71 acquires the image data PD0 by imaging the inspection area CA0 before starting the process of placing the component 91 in the target component mounting machine MT0, and acquires the image data PD0 of the component 91 to be mounted in the inspection area CA0. image data PD0 is acquired by imaging the inspection area CA0 before wearing the .
- the determination unit 72 determines whether or not the foreign matter 92 adheres to the inspection area CA0 in the target component mounting machine MT0 (step S28).
- the mounting control unit 75 controls the mounting control unit 75 to perform the mounting operation on the inspection area CA0. Mounting of the component 91 is permitted (step S29). Then, the control by the foreign matter detection device 70 is once terminated.
- the mounting control unit 75 controls the mounting control unit 75 to perform the mounting operation on the inspection area CA0.
- the mounting of the component 91 is restricted (step S30). In this case, for example, the operator can take out the substrate 90 and check the presence or absence of the foreign matter 92 . Also, if the removal of the foreign matter 92 is possible, the operator can also remove the foreign matter 92 .
- the component mounter WM3 is not the target component mounter MT0 (No in step S26), the component mounter WM3 is provided downstream of the target component mounter MT0, and the inspection area CA0 has a component 91 is already installed. Therefore, in this case, the control by the foreign object detection device 70 is once terminated.
- the acquisition unit 71 acquires the image data PD0 by imaging the inspection area CA0 before starting the mounting process of the component 91 in the upstream component mounting machine MU0 and after finishing the mounting process. Then, when the determining unit 72 determines that the foreign matter 92 is not attached to the inspection area CA0 in the upstream component mounting machine MU0, the transport control unit 74 is provided downstream of the upstream component mounting machine MU0. The substrate 90 is carried out to the next component mounting machine WM3. By sequentially executing the above processes in the upstream component mounting machine MU0, the substrate 90 with no foreign matter 92 adhering to the inspection area CA0 is transported to the target component mounting machine MT0.
- the acquiring unit 71 images the inspection area CA0 and obtains the image data PD0 before starting the mounting process of the component 91 in the target component mounting machine MT0 and before mounting the component 91 to be mounted in the inspection area CA0. to get Then, when the determining unit 72 determines that the foreign matter 92 is not attached to the inspection area CA0 in the target component mounting machine MT0, the mounting control unit 75 permits mounting of the component 91 to be mounted in the inspection area CA0. do. By executing the above processing in the target component mounting machine MT0, the target component mounting machine MT0 can mount the component 91 to be mounted in the inspection area CA0 where the foreign matter 92 is not adhered.
- the foreign matter detector 70 can perform the following control. Also in this embodiment, the substrate 90 is sequentially conveyed to a plurality of (three in the example shown in FIG. 1) component mounting machines WM3 that mount components 91 on the substrate 90, and the plurality of components 91 are mounted in sequence. Further, the acquiring unit 71, the determining unit 72, and the setting unit 73 may have any of the forms already described. Further, as shown in FIG.
- the first component mounting machine MF0 which is one component mounting machine WM3 of the plurality (three) of the component mounting machines WM3
- the first component mounting machine MF0 When the component mounting machine WM3 provided downstream from MF0 operates normally without stopping due to an error, the second component mounting machine MS0 which is the next component mounting machine WM3 provided downstream from the first component mounting machine MF0.
- the time expected to be required until the substrate 90 is carried in is assumed to be a second required time T2.
- the acquisition unit 71 images the inspection area CA0 after the mounting process of the component 91 in the first component mounting machine MF0 is completed and before the board 90 is unloaded. to acquire the image data PD0.
- the acquisition unit 71 captures the inspection area CA0 and acquires image data after the board 90 is carried into the second component mounting machine MS0 and before starting the mounting process of the component 91 in the second component mounting machine MS0. Get PD0.
- the determination unit 72 can determine the presence or absence of foreign matter 92 adhering to the inspection area CA0 when the substrate 90 is transported between the first component mounting machine MF0 and the second component mounting machine MS0.
- the foreign matter detection method includes an acquisition process, a determination process, and a setting process.
- the acquisition step corresponds to control performed by the acquisition unit 71 .
- the determination process corresponds to control performed by the determination unit 72 .
- the setting process corresponds to control performed by the setting unit 73 .
- the foreign matter detection method can include a transport control step.
- the transport control process corresponds to control performed by the transport control unit 74 .
- the foreign object detection method can also include a mounting control step.
- the mounting control process corresponds to control performed by the mounting control unit 75 .
- Example of Effect of Embodiment According to the foreign matter detection device 70, it is possible to suppress erroneous determination of the foreign matter 92 due to aging of the joining member 93 that joins the substrate 90 and the component 91, which is applied to the inspection area CA0 of the substrate 90. can. What has been described above with respect to the foreign object detection device 70 can be similarly applied to the foreign object detection method.
- 70 foreign object detection device
- 71 acquisition unit
- 72 determination unit
- 73 setting unit
- 74 Conveyance control unit
- 75 Mounting control unit
- 90 Substrate
- 91 Component
- 92 foreign matter
- 93 joining member
- CA0 inspection area
- PD0 image data
- SD0 reference data
- CD0 comparison data
- WM3 component mounting machine
- MT0 target component mounting machine
- MU0 upstream component mounting machine
- MF0 first component mounting machine
- MS0 second component mounting machine
- T0 allowable time
- T1 first required time
- T2 second required time.
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Abstract
Description
1-1.対基板作業ラインWL0の構成例
対基板作業ラインWL0では、基板90に所定の対基板作業を行う。対基板作業ラインWL0を構成する対基板作業機WM0の種類および数は、限定されない。図1に示すように、本実施形態の対基板作業ラインWL0は、印刷機WM1、印刷検査機WM2、部品装着機WM3、リフロー炉WM4および外観検査機WM5の複数の対基板作業機WM0を備えており、基板90は、基板搬送装置によって、この順に搬送される。 1. Embodiment 1-1. Configuration Example of Board-Related Work Line WL0 In the board-relevant work line WL0, predetermined board-related work is performed on the
部品装着機WM3は、基板90に複数の部品91を装着する。図2に示すように、部品装着機WM3は、基板搬送装置11、部品供給装置12、部品移載装置13、部品カメラ14、基板カメラ15および制御装置16を備えている。 1-2. Configuration Example of Component Mounting Machine WM3 The component mounting machine WM3 mounts a plurality of
図2に示すように、部品91の装着位置に異物92(例えば、他の部品91、ごみなど)が付着していると、部品91の装着が不良(例えば、部品91の不装着、浮き、傾きなど)になる可能性があり、基板90に付着する異物92の有無を判断する必要がある。基板90の少なくとも一部の同一の検査領域CA0を撮像した複数の画像データPD0を比較して、画像データPD0の特徴量(例えば、画素の輝度など)の差異に基づいて異物92の有無を判断する場合、異物92以外の部材を異物92と誤判断する可能性がある。 1-3. Configuration Example of
取得部71は、基板90の少なくとも一部の検査領域CA0を所定の許容時間T0の間に複数回撮像して、同一の検査領域CA0を撮像した複数の画像データPD0を取得する(図4に示すステップS12)。 1-3-1.
The
判断部72は、取得部71によって取得された複数の画像データPD0の各々を画像処理して取得した検査領域CA0の特徴量の差異に基づいて、検査領域CA0に付着する異物92の有無を判断する(図4に示すステップS13)。 1-3-2.
The
画像データPD0を画像処理して取得した検査領域CA0の特徴量が、基板90の検査領域CA0に塗布されている基板90と部品91を接合する接合部材93の経時変化によって変動すると、判断部72は、接合部材93を異物92と誤判断する可能性がある。そこで、本実施形態の異物検出装置70は、設定部73を備えている。 1-3-3. Setting
If the feature amount of the inspection area CA0 acquired by image processing the image data PD0 changes due to the change over time of the joining
図1に示す対基板作業ラインWL0では、基板90は、基板90に部品91を装着する複数(同図では、3つ)の部品装着機WM3に順に搬送されて、複数の部品91が順に装着される。図7に示すように、複数(3つ)の部品装着機WM3のうちの一の部品装着機WM3に基板90が搬入されてから、当該部品装着機WM3がエラーで停止することなく正常に作動した場合に当該部品装着機WM3において装着予定の部品91が装着されて当該部品装着機WM3より基板90が搬出されるまでに要すると予想される時間を第一所要時間T1とする。 1-3-4. Example of application to board-handling work line WL0 In board-handling work line WL0 shown in FIG. Then, a plurality of
対基板作業ラインWL0に適用される異物検出装置70は、例えば、図8に示すフローチャートに従って、制御を実行することができる。なお、検査領域CA0に部品91を装着する部品装着機WM3を対象部品装着機MT0とし、対象部品装着機MT0よりも上流側に設けられる少なくとも一つの部品装着機WM3を上流側部品装着機MU0とする。本実施形態において、許容時間T0は、第一所要時間T1以上の長さであり、且つ、第二所要時間T2以上の長さであるものとする。 1-3-5.
The foreign
部品装着機WM3の間の基板90の搬送中における異物92の付着が問題となる場合、異物検出装置70は、以下に示す制御を行うことができる。この形態においても、基板90は、基板90に部品91を装着する複数(図1に示す例では、3つ)の部品装着機WM3に順に搬送されて、複数の部品91が順に装着される。また、取得部71、判断部72および設定部73は、既述したいずれの形態であっても良い。さらに、図7に示すように、複数(3つ)の部品装着機WM3のうちの一の部品装着機WM3である第一部品装着機MF0より基板90が搬出されてから、第一部品装着機MF0よりも下流に設けられる部品装着機WM3がエラーで停止することなく正常に作動した場合に第一部品装着機MF0よりも下流に設けられる次の部品装着機WM3である第二部品装着機MS0に基板90が搬入されるまでに要すると予想される時間を第二所要時間T2とする。 1-3-6. Conveyance of
異物検出装置70について既述されていることは、異物検出方法についても同様に言える。具体的には、異物検出方法は、取得工程と、判断工程と、設定工程とを備えている。取得工程は、取得部71が行う制御に相当する。判断工程は、判断部72が行う制御に相当する。設定工程は、設定部73が行う制御に相当する。また、異物検出方法は、搬送制御工程を備えることができる。搬送制御工程は、搬送制御部74が行う制御に相当する。異物検出方法は、装着制御工程を備えることもできる。装着制御工程は、装着制御部75が行う制御に相当する。 2. Foreign Matter Detection Method What has already been described about the foreign
異物検出装置70によれば、基板90の検査領域CA0に塗布されている基板90と部品91を接合する接合部材93の経時変化による異物92の誤判断を抑制することができる。異物検出装置70について上述されていることは、異物検出方法についても同様に言える。 3. Example of Effect of Embodiment According to the foreign
74:搬送制御部、75:装着制御部、90:基板、91:部品、
92:異物、93:接合部材、CA0:検査領域、PD0:画像データ、
SD0:基準データ、CD0:比較データ、WM3:部品装着機、
MT0:対象部品装着機、MU0:上流側部品装着機、
MF0:第一部品装着機、MS0:第二部品装着機、
T0:許容時間、T1:第一所要時間、T2:第二所要時間。 70: foreign object detection device, 71: acquisition unit, 72: determination unit, 73: setting unit,
74: Conveyance control unit, 75: Mounting control unit, 90: Substrate, 91: Component,
92: foreign matter, 93: joining member, CA0: inspection area, PD0: image data,
SD0: reference data, CD0: comparison data, WM3: component mounting machine,
MT0: target component mounting machine, MU0: upstream component mounting machine,
MF0: first component mounting machine, MS0: second component mounting machine,
T0: allowable time, T1: first required time, T2: second required time.
Claims (14)
- 基板の少なくとも一部の検査領域を所定の許容時間の間に複数回撮像して、同一の前記検査領域を撮像した複数の画像データを取得する取得部と、
前記取得部によって取得された前記複数の画像データの各々を画像処理して取得した前記検査領域の特徴量の差異に基づいて、前記検査領域に付着する異物の有無を判断する判断部と、
前記検査領域に塗布されている前記基板と部品を接合する接合部材の経時変化によって前記検査領域の前記特徴量が変動することにより前記判断部において前記接合部材が前記異物と誤判断されないように、前記許容時間を予め設定する設定部と、
を備える異物検出装置。 an acquisition unit that captures images of at least a part of an inspection area of a substrate a plurality of times within a predetermined allowable time to acquire a plurality of image data of the same inspection area;
a judgment unit that judges the presence or absence of a foreign substance adhering to the inspection area based on the difference in the feature amount of the inspection area acquired by image processing each of the plurality of image data acquired by the acquisition unit;
In order to prevent the determination unit from erroneously determining that the bonding member is the foreign matter due to fluctuations in the characteristic amount of the inspection region due to changes over time in the bonding member applied to the inspection region and bonding the substrate and the component, a setting unit that presets the allowable time;
A foreign object detection device comprising: - 前記取得部は、前記基板に前記部品を装着する部品装着機の使用者によって指定された領域を前記検査領域とする請求項1に記載の異物検出装置。 2. The foreign matter detection device according to claim 1, wherein the acquisition unit uses, as the inspection area, an area specified by a user of a component mounting machine that mounts the component on the board.
- 前記判断部は、前記複数の画像データのうちの最初に取得された一の前記画像データである基準データから取得した前記検査領域の前記特徴量と、前記複数の画像データのうちの他の一の前記画像データである比較データから取得した前記検査領域の前記特徴量との差分が所定閾値を超えているときに、前記検査領域に前記異物が付着していると判断し、前記特徴量の前記差分が所定閾値以下のときに、前記検査領域に前記異物が付着していないと判断する請求項1または請求項2に記載の異物検出装置。 The determination unit determines the feature amount of the inspection region obtained from reference data, which is one of the image data obtained first among the plurality of image data, and the other one of the plurality of image data. When the difference between the feature amount of the inspection area obtained from the comparison data, which is the image data of the above, exceeds a predetermined threshold value, it is determined that the foreign matter is adhered to the inspection area, and the feature amount of 3. A foreign matter detection apparatus according to claim 1, wherein when said difference is equal to or less than a predetermined threshold value, it is determined that said foreign matter does not adhere to said inspection area.
- 前記特徴量は、前記基準データおよび前記比較データの画素ごとの輝度である請求項3に記載の異物検出装置。 The foreign matter detection device according to claim 3, wherein the feature amount is the brightness of each pixel of the reference data and the comparison data.
- 前記設定部は、前記接合部材の種類に応じた前記許容時間を設定する請求項1~請求項4のいずれか一項に記載の異物検出装置。 The foreign matter detection device according to any one of claims 1 to 4, wherein the setting unit sets the allowable time according to the type of the joining member.
- 前記設定部は、前記基板に前記部品を装着する部品装着機の機内の温度および湿度のうちの少なくとも一方に応じた前記許容時間を設定する請求項1~請求項5のいずれか一項に記載の異物検出装置。 6. The setting unit according to any one of claims 1 to 5, wherein the setting unit sets the allowable time according to at least one of temperature and humidity inside a component mounting machine that mounts the component on the substrate. foreign object detection device.
- 前記接合部材は、はんだである請求項1~請求項6のいずれか一項に記載の異物検出装置。 The foreign matter detection device according to any one of claims 1 to 6, wherein the joining member is solder.
- 前記基板は、前記基板に前記部品を装着する複数の部品装着機に順に搬送されて、複数の前記部品が順に装着され、
前記許容時間は、前記複数の部品装着機のうちの一の前記部品装着機に前記基板が搬入されてから、当該部品装着機がエラーで停止することなく正常に作動した場合に当該部品装着機において装着予定の前記部品が装着されて当該部品装着機より前記基板が搬出されるまでに要すると予想される時間である第一所要時間以上であり、
前記取得部は、前記部品装着機ごとに前記複数の画像データを取得し、
前記判断部は、前記部品装着機の機内において前記検査領域に付着する前記異物の有無を判断する請求項1~請求項7のいずれか一項に記載の異物検出装置。 The substrate is sequentially conveyed to a plurality of component mounting machines that mount the components on the substrate, and the plurality of components are mounted in sequence,
The allowable time is the time required for the component mounting machine to operate normally without stopping due to an error after the board is carried into the component mounting machine, which is one of the plurality of component mounting machines. is equal to or longer than the first required time, which is the time expected to be required until the board is unloaded from the component mounting machine after the component to be mounted is mounted in
The acquisition unit acquires the plurality of image data for each component mounting machine,
The foreign matter detection apparatus according to any one of claims 1 to 7, wherein the judgment section judges the presence or absence of the foreign matter adhering to the inspection area inside the component mounting machine. - 前記取得部は、前記検査領域に前記部品を装着する前記部品装着機である対象部品装着機よりも上流側に設けられる少なくとも一つの前記部品装着機である上流側部品装着機の各々において、前記部品の装着処理を開始する前に前記検査領域を撮像して前記画像データを取得し、前記部品の装着処理が終了した後に前記検査領域を撮像して前記画像データを取得する請求項8に記載の異物検出装置。 In each of the upstream component mounters, which are at least one of the component mounters provided upstream of the target component mounter which is the component mounter that mounts the component in the inspection area, the acquisition unit performs the 9. The method according to claim 8, wherein the inspection area is imaged to obtain the image data before the component mounting process is started, and the inspection area is imaged to obtain the image data after the component mounting process is completed. foreign object detection device.
- 前記上流側部品装着機において前記検査領域に前記異物が付着していないことが前記判断部において判断されたときに、当該上流側部品装着機よりも下流に設けられる次の前記部品装着機に前記基板を搬出させ、前記上流側部品装着機において前記検査領域に前記異物が付着していることが前記判断部において判断されたときに、前記基板の搬出を停止させる搬送制御部を備える請求項9に記載の異物検出装置。 When the determining unit determines that the foreign matter is not attached to the inspection area in the upstream component mounting machine, the next component mounting machine provided downstream from the upstream component mounting machine performs the 10. A transport control unit that transports a substrate and stops transporting the substrate when the determination unit determines that the foreign matter is adhered to the inspection area in the upstream component mounting machine. The foreign object detection device according to 1.
- 前記取得部は、前記検査領域に前記部品を装着する前記部品装着機である対象部品装着機において、前記部品の装着処理を開始する前に前記検査領域を撮像して前記画像データを取得し、前記検査領域に装着予定の前記部品を装着する前に前記検査領域を撮像して前記画像データを取得する請求項8~請求項10のいずれか一項に記載の異物検出装置。 The acquisition unit acquires the image data by imaging the inspection area before starting the component mounting process in the target component mounting machine, which is the component mounting machine that mounts the component in the inspection area, 11. The foreign matter detection apparatus according to any one of claims 8 to 10, wherein the inspection area is imaged to acquire the image data before mounting the component to be mounted in the inspection area.
- 前記対象部品装着機において前記検査領域に前記異物が付着していないことが前記判断部において判断されたときに、前記検査領域に装着予定の前記部品の装着を許可し、前記対象部品装着機において前記検査領域に前記異物が付着していることが前記判断部において判断されたときに、前記検査領域に装着予定の前記部品の装着を規制する装着制御部を備える請求項11に記載の異物検出装置。 When the determining unit determines that the foreign matter is not attached to the inspection area in the target component mounting machine, the component to be mounted in the inspection area is permitted to be mounted, and the target component mounting machine 12. The foreign matter detection according to claim 11, further comprising a mounting control section that restricts mounting of the component to be mounted in the inspection area when the determination section determines that the foreign material is attached to the inspection area. Device.
- 前記基板は、前記基板に前記部品を装着する複数の部品装着機に順に搬送されて、複数の前記部品が順に装着され、
前記許容時間は、前記複数の部品装着機のうちの一の前記部品装着機である第一部品装着機より前記基板が搬出されてから、前記第一部品装着機よりも下流に設けられる前記部品装着機がエラーで停止することなく正常に作動した場合に前記第一部品装着機よりも下流に設けられる次の前記部品装着機である第二部品装着機に前記基板が搬入されるまでに要すると予想される時間である第二所要時間以上であり、
前記取得部は、前記第一部品装着機における前記部品の装着処理が終了した後であって前記基板が搬出される前に前記検査領域を撮像して前記画像データを取得し、前記第二部品装着機に前記基板が搬入された後であって前記第二部品装着機における前記部品の装着処理を開始する前に前記検査領域を撮像して前記画像データを取得し、
前記判断部は、前記第一部品装着機と前記第二部品装着機との間において前記基板が搬送されるときに前記検査領域に付着する前記異物の有無を判断する請求項1~請求項12のいずれか一項に記載の異物検出装置。 The substrate is sequentially conveyed to a plurality of component mounting machines that mount the components on the substrate, and the plurality of components are mounted in sequence,
The permissible time is the time after the substrate is unloaded from the first component mounting machine, which is one of the component mounting machines among the plurality of component mounting machines, and the component is provided downstream from the first component mounting machine. When the mounter operates normally without stopping due to an error, the time required until the substrate is carried into the second component mounter, which is the next component mounter provided downstream from the first component mounter. is greater than or equal to the second required time, which is the time expected to be
The acquisition unit acquires the image data by imaging the inspection area after the component mounting process in the first component mounting machine is completed and before the board is carried out, and the second component acquiring the image data by capturing an image of the inspection area after the board is carried into the mounting machine and before starting the mounting process of the component in the second component mounting machine;
Claims 1 to 12, wherein the judging section judges the presence or absence of the foreign matter adhering to the inspection area when the board is transported between the first component mounting machine and the second component mounting machine. The foreign object detection device according to any one of 1. - 基板の少なくとも一部の検査領域を所定の許容時間の間に複数回撮像して、同一の前記検査領域を撮像した複数の画像データを取得する取得工程と、
前記取得工程によって取得された前記複数の画像データの各々を画像処理して取得した前記検査領域の特徴量の差異に基づいて、前記検査領域に付着する異物の有無を判断する判断工程と、
前記検査領域に塗布されている前記基板と部品を接合する接合部材の経時変化によって前記検査領域の前記特徴量が変動することにより前記判断工程において前記接合部材が前記異物と誤判断されないように、前記許容時間を予め設定する設定工程と、
を備える異物検出方法。 an acquisition step of capturing images of at least a part of the inspection area of the substrate a plurality of times within a predetermined allowable time to acquire a plurality of image data of the same inspection area;
a judgment step of judging the presence or absence of a foreign substance adhering to the inspection region based on the difference in the feature amount of the inspection region acquired by image processing each of the plurality of image data acquired in the acquisition step;
In order to prevent the bonding member from being erroneously determined as the foreign matter in the determination step due to fluctuations in the feature amount of the inspection region due to changes over time in the bonding member applied to the inspection region for bonding the substrate and the component, a setting step of presetting the allowable time;
A foreign object detection method comprising:
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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DE112021007148.3T DE112021007148T5 (en) | 2021-02-24 | 2021-02-24 | Foreign body detection device and foreign body detection method |
CN202180091856.2A CN116746292A (en) | 2021-02-24 | 2021-02-24 | Foreign matter detection device and foreign matter detection method |
JP2023501697A JP7473735B2 (en) | 2021-02-24 | 2021-02-24 | Foreign object detection device and foreign object detection method |
PCT/JP2021/006778 WO2022180663A1 (en) | 2021-02-24 | 2021-02-24 | Foreign matter detection device and foreign matter detection method |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2007335524A (en) * | 2006-06-13 | 2007-12-27 | Fuji Mach Mfg Co Ltd | Mounting line |
JP2009128345A (en) * | 2007-11-28 | 2009-06-11 | Omron Corp | Object recognition method and visual inspection apparatus of substrate using the method |
WO2014002283A1 (en) * | 2012-06-30 | 2014-01-03 | 千住金属工業株式会社 | Lead-free solder ball |
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- 2021-02-24 WO PCT/JP2021/006778 patent/WO2022180663A1/en active Application Filing
- 2021-02-24 CN CN202180091856.2A patent/CN116746292A/en active Pending
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007335524A (en) * | 2006-06-13 | 2007-12-27 | Fuji Mach Mfg Co Ltd | Mounting line |
JP2009128345A (en) * | 2007-11-28 | 2009-06-11 | Omron Corp | Object recognition method and visual inspection apparatus of substrate using the method |
WO2014002283A1 (en) * | 2012-06-30 | 2014-01-03 | 千住金属工業株式会社 | Lead-free solder ball |
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CN116746292A (en) | 2023-09-12 |
JPWO2022180663A1 (en) | 2022-09-01 |
DE112021007148T5 (en) | 2023-12-07 |
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