WO2022180663A1

WO2022180663A1 - Foreign matter detection device and foreign matter detection method

Info

Publication number: WO2022180663A1
Application number: PCT/JP2021/006778
Authority: WO
Inventors: 恵市小野; 一也小谷
Original assignee: 株式会社Fuji
Priority date: 2021-02-24
Filing date: 2021-02-24
Publication date: 2022-09-01
Also published as: DE112021007148T5; JPWO2022180663A1; CN116746292A; JP7473735B2

Abstract

A foreign matter detection device is provided with an acquisition unit, a determination unit, and a setting unit. The acquisition unit captures an inspection region which is at least a part of a substrate a plurality of times during a prescribed allowed time to acquire a plurality of image data in which the same inspection region is captured. The determination unit determines the presence or absence of foreign matter adhering to the inspection region on the basis of differences in feature values of the inspection region acquired by image-processing each of the plurality of image data acquired by the acquisition unit. The setting unit sets the allowed time in advance so that the determination unit does not, due to variations in the feature values of the inspection region caused by changes over time in a bonding member applied to the inspection region and bonding a component to the substrate, mistakenly determine that the bonding member is foreign matter.

Description

Foreign matter detection device and foreign matter detection method

This specification discloses a technology related to a foreign object detection device and a foreign object detection method.

The mounting line described in Patent Document 1 includes first camera means, second camera means, and image processing means. The first camera means is a camera means capable of viewing at least a part of the printed circuit board, and is provided so as to be able to image the printed circuit board before the electronic component mounting operation in any of the mounting machines. . The second camera means is a camera means capable of capturing the same range as the first camera means in its field of view, and is capable of capturing images of electronic components by any mounter or by a mounter in a process subsequent to the mounter. It is provided so that the printed circuit board can be imaged after the mounting work.

The image processing means performs image processing by comparing the image data captured by the second camera means with the image data captured by the first camera means. As a result, the mounting line described in Patent Document 1 attempts to detect abnormal solder printing when solder is printed on a printed circuit board, or abnormal mounting of electronic components when electronic components are mounted on a printed circuit board.

JP 2007-335524 A

If foreign matter adheres to the mounting position of the component, the mounting of the component may be defective, and it is necessary to determine whether there is any foreign matter adhering to the board. When comparing a plurality of image data obtained by imaging the same inspection area of at least a part of a substrate and determining the presence or absence of foreign matter based on the difference in the feature amount of the image data, members other than foreign matter are erroneously determined to be foreign matter. there is a possibility. Specifically, the characteristic amount of the inspection area obtained by image processing the image data varies with time in the bonding material applied to the inspection area of the substrate and used to bond the board and the component. There is a possibility of erroneously judging it as a foreign object.

In view of such circumstances, the present specification provides a foreign matter detection apparatus and a foreign matter detection method capable of suppressing erroneous determination of foreign matter due to aging of a joining member that joins a board and a component coated on an inspection area of the board. Disclose.

This specification discloses a foreign object detection device that includes an acquisition unit, a determination unit, and a setting unit. The acquisition unit acquires a plurality of image data of the same inspection area by imaging at least a part of the inspection area of the substrate a plurality of times during a predetermined allowable time. The determination unit determines whether or not there is a foreign substance adhering to the inspection area based on a difference in feature amounts of the inspection area acquired by image processing each of the plurality of image data acquired by the acquisition unit. . The setting unit detects that the bonding member is mistaken as the foreign matter in the determination unit when the feature amount of the inspection area varies due to a change in the bonding member applied to the inspection area that bonds the substrate and the component over time. The permissible time is set in advance so as not to be judged.

This specification also discloses a foreign matter detection method including an acquisition process, a determination process, and a setting process. In the acquisition step, an inspection area of at least a part of the substrate is imaged a plurality of times during a predetermined allowable time to acquire a plurality of image data of the same inspection area. The determining step determines whether or not there is a foreign substance adhering to the inspection area based on a difference in feature amounts of the inspection area obtained by image processing each of the plurality of image data obtained by the obtaining step. . In the setting step, the bonding member is mistaken as the foreign matter in the determination step due to variation in the feature amount of the inspection region due to a change in the bonding member applied to the inspection region and bonding the component to the substrate over time. The permissible time is set in advance so as not to be judged.

According to the above-described foreign matter detection device, it is possible to suppress erroneous determination of foreign matter due to changes over time in the bonding member that is applied to the inspection area of the substrate and joins the board and the component. What has been described above with respect to the foreign object detection device can be similarly applied to the foreign object detection method.

FIG. 2 is a configuration diagram showing a configuration example of a work line for substrates; It is a top view which shows the structural example of a component mounting machine. 3 is a block diagram showing an example of control blocks of the foreign object detection device; FIG. 5 is a flow chart showing an example of a control procedure by a foreign object detection device; FIG. 4 is a schematic diagram showing an example of reference data; It is a schematic diagram which shows an example of comparison data. It is a schematic diagram which shows an example of the relationship between allowable time, the 1st required time, and the 2nd required time. 5 is a flow chart showing an example of a control procedure by a foreign object detection device;

1. Embodiment 1-1. Configuration Example of Board-Related Work Line WL0 In the board-relevant work line WL0, predetermined board-related work is performed on the board 90 . The type and number of board-oriented work machines WM0 that constitute board-oriented work line WL0 are not limited. As shown in FIG. 1, the board-to-board work line WL0 of the present embodiment includes a plurality of board-to-board work machines WM0 including a printing machine WM1, a print inspection machine WM2, a component mounting machine WM3, a reflow furnace WM4, and an appearance inspection machine WM5. , and the substrate 90 is transported in this order by the substrate transport device.

The printing machine WM1 prints solder on the mounting positions of the plurality of components 91 on the board 90 . The print inspection machine WM2 inspects the printed state of the solder printed by the printer WM1. As shown in FIG. 2, the component mounter WM3 mounts a plurality of components 91 on a board 90 on which solder has been printed by the printer WM1. The number of component mounting machines WM3 may be one or plural. When a plurality of component mounters WM3 are provided, a plurality of components 91 can be mounted by the plurality of component mounters WM3.

The reflow furnace WM4 heats the substrate 90 on which a plurality of components 91 are mounted by the component mounter WM3, melts the solder, and performs soldering. The appearance inspection machine WM5 inspects the mounting state of the plurality of components 91 mounted by the component mounting machine WM3. In this way, the board-related work line WL0 can use a plurality of board-related work machines WM0 to transport the boards 90 in sequence and perform production processes including inspection processes to produce the board products 900 . The board-to-board work line WL0 includes board-to-board work machines WM0 such as, for example, a function inspection machine, a buffer device, a board supply device, a board reversing device, a shield mounting device, an adhesive coating device, and an ultraviolet irradiation device. You can prepare.

A plurality of board-oriented work machines WM0 and the line management device LC0 that constitute the board-oriented work line WL0 are communicably connected by a communication unit. Also, the line management device LC0 and the management device HC0 are communicably connected by a communication unit. The communication unit can communicably connect them by wire or wirelessly, and various communication methods can be used.

In this embodiment, a local information communication network (LAN: Local Area Network) is configured by a plurality of board-to-board work machines WM0, line management devices LC0, and management devices HC0. Therefore, the plurality of board-oriented work machines WM0 can communicate with each other via the communication unit. Also, the plurality of board-oriented work machines WM0 can communicate with the line management device LC0 via the communication unit. Furthermore, the line management device LC0 and the management device HC0 can communicate with each other via the communication unit.

The line management device LC0 controls the plurality of board-oriented work machines WM0 that constitute the board-oriented work line WL0, and monitors the operation status of the board-oriented work line WL0. The line management device LC0 stores various control data for controlling the plurality of work machines for board WM0. The line management device LC0 transmits control data to each of the plurality of board-oriented work machines WM0. Further, each of the plurality of board-oriented work machines WM0 transmits the operation status and production status to the line management device LC0.

The management device HC0 manages at least one line management device LC0. For example, the operation status and production status of the board-oriented work machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as necessary. The management device HC0 is provided with a storage device. The storage device can store various acquired data acquired by the board-oriented work machine WM0. For example, various image data captured by the board-oriented work machine WM0 are included in the acquired data. A record (log data) of the operation status acquired by the board-oriented work machine WM0 is included in the acquired data. The storage device can also store various production information regarding the production of the board product 900 .

The substrate work line WL0 is equipped with an input/output device 80. A known input/output device can be used as the input/output device 80 . The input/output device 80 includes a display unit, and displays various data in a visible manner. Moreover, the display unit is configured by a touch panel, and functions as an input device for receiving various operations by the operator.

1-2. Configuration Example of Component Mounting Machine WM3 The component mounting machine WM3 mounts a plurality of components 91 on a board 90 . As shown in FIG. 2, the component mounting machine WM3 includes a substrate conveying device 11, a component supply device 12, a component transfer device 13, a component camera 14, a substrate camera 15, and a control device 16.

The substrate transport device 11 is configured by, for example, a belt conveyor, etc., and transports the substrate 90 in the transport direction (X-axis direction). The substrate 90 is a circuit board on which electronic circuits, electric circuits, magnetic circuits, and the like are formed. The board transfer device 11 carries the board 90 into the component mounting machine WM3 and positions the board 90 at a predetermined position inside the machine. After the component mounting machine WM3 finishes mounting the plurality of components 91, the board transfer device 11 carries the board 90 out of the component mounting machine WM3.

The component supply device 12 supplies a plurality of components 91 to be mounted on the board 90 . The component supply device 12 includes a plurality of feeders 12a provided along the transport direction (X-axis direction) of the substrate 90 . Each of the plurality of feeders 12a is equipped with a reel. A carrier tape containing a plurality of components 91 is wound around the reel. The feeder 12a pitch-feeds the carrier tape and supplies the components 91 so as to be picked up at a supply position located on the leading end side of the feeder 12a. In addition, the component supply device 12 can also supply relatively large electronic components (for example, lead components) compared to chip components in a state of being arranged on a tray.

The component transfer device 13 includes a head driving device 13a and a moving table 13b. The head driving device 13a is configured such that a moving table 13b can be moved in the X-axis direction and the Y-axis direction by a linear motion mechanism. A mounting head 20 is detachably (exchangeably) provided on the moving table 13b by a clamp member. The mounting head 20 uses at least one holding member 30 to pick up and hold the component 91 supplied by the component supply device 12 , and mounts the component 91 on the substrate 90 positioned by the substrate transfer device 11 . For example, a suction nozzle, a chuck, or the like can be used as the holding member 30 .

A known imaging device can be used for the component camera 14 and the substrate camera 15 . The component camera 14 is fixed to the base of the component mounter WM3 so that the optical axis faces upward in the vertical direction (Z-axis direction). The component camera 14 can image the component 91 held by the holding member 30 from below. The board camera 15 is provided on the moving table 13b of the component transfer device 13 so that the optical axis is downward in the vertical direction (Z-axis direction). The substrate camera 15 can image the substrate 90 from above. The component camera 14 and the substrate camera 15 perform imaging based on control signals sent from the control device 16 . Image data of captured images captured by the component camera 14 and the board camera 15 are transmitted to the control device 16 .

The control device 16 includes a known arithmetic device and storage device, and constitutes a control circuit. Information, image data, and the like output from various sensors provided in the component mounting machine WM3 are input to the control device 16 . The control device 16 sends a control signal to each device based on the control program and predetermined wearing conditions set in advance.

For example, the control device 16 causes the substrate camera 15 to image the substrate 90 positioned by the substrate transport device 11 . The control device 16 processes the image captured by the board camera 15 and recognizes the positioning state of the board 90 . Further, the control device 16 causes the holding member 30 to collect and hold the component 91 supplied by the component supply device 12 , and causes the component camera 14 to image the component 91 held by the holding member 30 . The control device 16 processes the image captured by the component camera 14 and recognizes the holding posture of the component 91 .

The control device 16 moves the holding member 30 upward from the intended mounting position preset by the control program or the like. Further, the control device 16 corrects the planned mounting position based on the positioning state of the substrate 90, the holding attitude of the component 91, and the like, and sets the mounting position where the component 91 is actually mounted. The planned mounting position and mounting position include the position (X-axis coordinate and Y-axis coordinate) as well as the rotation angle.

The control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of the holding member 30 according to the mounting position. The controller 16 lowers the holding member 30 at the corrected rotation angle at the corrected target position to mount the component 91 on the substrate 90 . The control device 16 repeats the pick-and-place cycle described above to perform a mounting process of mounting a plurality of components 91 on the board 90 .

1-3. Configuration Example of Foreign Matter Detector 70 As shown in FIG. It is necessary to determine whether or not there is a foreign substance 92 adhering to the substrate 90 . A plurality of image data PD0 obtained by imaging the same inspection area CA0 of at least a part of the substrate 90 are compared, and the presence or absence of the foreign matter 92 is determined based on the difference in the feature amount (for example, pixel luminance etc.) of the image data PD0. In this case, there is a possibility that a member other than the foreign object 92 is erroneously determined to be the foreign object 92 .

Specifically, the feature amount of the inspection area CA0 acquired by image processing the image data PD0 is used as the bonding member 93 (for example, solder, adhesive, etc.), there is a possibility that the joining member 93 may be erroneously determined to be a foreign object 92 . Therefore, the board-to-board work line WL0 of the present embodiment is provided with a foreign matter detection device 70 capable of suppressing erroneous determination of the foreign matter 92 due to changes in the bonding member 93 over time.

The foreign object detection device 70 is provided with an acquisition unit 71, a determination unit 72, and a setting unit 73 when viewed as control blocks. The foreign object detection device 70 can also include a transport control section 74 . The foreign matter detection device 70 can also include a mounting control section 75 . As shown in FIG. 3 , the foreign matter detection device 70 of this embodiment includes an acquisition section 71 , a determination section 72 , a setting section 73 , a transport control section 74 and a mounting control section 75 .

The foreign matter detection device 70 can be provided in various control devices. For example, the foreign object detection device 70 can be provided in the control device 16 of the component mounting machine WM3, the line management device LC0, the management device HC0, and the like. The foreign object detection device 70 can also be formed on the cloud. As shown in FIG. 3, in the foreign matter detection device 70 of the present embodiment, an acquisition unit 71, a determination unit 72, a transport control unit 74, and a mounting control unit 75 are configured to control a plurality of (three in the example shown in FIG. 1) components. The setting unit 73 is provided in the control device 16 of each mounting machine WM3, and the setting unit 73 is provided in the management device HC0.

Also, the foreign object detection device 70 of the present embodiment executes control according to the flowchart shown in FIG. The acquisition unit 71 performs the process shown in step S12. The determination unit 72 performs the process shown in step S13. The setting unit 73 performs the process shown in step S11. Processing by the transport control unit 74 and the mounting control unit 75 will be described later.

1-3-1. Acquisition unit 71
The acquisition unit 71 captures images of at least a part of the inspection area CA0 of the substrate 90 a plurality of times during the predetermined allowable time T0, and acquires a plurality of image data PD0 of the same inspection area CA0 (see FIG. 4). shown step S12).

The acquisition unit 71 may image the entire mounting area of the board 90 as the inspection area CA0, or may image a part of the mounting area of the board 90 . When the acquisition unit 71 captures an image of a part of the mounting area of the substrate 90, for example, a component 91 (for example, a BGA (Ball Grid Array) component) that has a large number of electrodes and is easily affected by a foreign object 92 compared to a chip component. 91) can be imaged. Further, the acquiring unit 71 acquires the mounting area where the component 91 is improperly mounted due to the foreign matter 92, the mounting area where the foreign matter 92 tends to adhere, and the like based on the past mounting results, and inspects these mounting areas. It can also be imaged as area CA0.

The acquisition unit 71 can also set the area specified by the user of the component mounting machine WM3 that mounts the component 91 on the board 90 as the inspection area CA0. The board-to-board work line WL<b>0 of this embodiment includes an input/output device 80 . The user can, for example, use the input/output device 80 to specify an arbitrary area (the entire mounting area of the substrate 90 or a partial mounting area of the substrate 90) as the inspection area CA0. In this case, the obtaining unit 71 can display the mounting area of the component 91 on the substrate 90 schematically on the display unit of the input/output device 80 so that the user can select any mounting area.

The acquisition unit 71 can acquire the image data PD0 using an imaging device capable of imaging the inspection area CA0. The imaging device is not limited as long as it can capture an image of the inspection area CA0. For example, the imaging device includes a substrate camera 15 capable of imaging a partial mounting area of the substrate 90 from above the substrate 90 and a ceiling camera capable of imaging the entire mounting area of the substrate 90 from above the substrate 90 . In this embodiment, the substrate camera 15 is used, and the acquisition unit 71 sets the area designated by the user of the component mounting machine WM3 as the inspection area CA0. Note that the acquisition unit 71 makes the same imaging conditions (for example, exposure time, aperture, illumination time, etc.) that can be set by the imaging device, and causes the same inspection area CA0 to be imaged multiple times. Also, the allowable time T0 is set by the setting unit 73 .

1-3-2. Judgment part 72
The determination unit 72 determines whether or not there is a foreign substance 92 adhering to the inspection area CA0 based on the difference in the feature amount of the inspection area CA0 acquired by image processing each of the plurality of image data PD0 acquired by the acquisition unit 71. (step S13 shown in FIG. 4).

Of the plurality of (two in this embodiment, two) pieces of image data PD0, the first piece of image data PD0 is set as reference data SD0. Also, the other image data PD0 of the plurality (two) of image data PD0 is set as comparison data CD0. At this time, when the difference between the feature amount of the inspection area CA0 obtained from the reference data SD0 and the feature amount of the inspection area CA0 obtained from the comparison data CD0 exceeds a predetermined threshold value, the determination unit 72 It is determined that the foreign matter 92 is attached to the . When the difference between the feature amount of inspection area CA0 obtained from reference data SD0 and the feature amount of inspection area CA0 obtained from comparison data CD0 is equal to or less than a predetermined threshold value, determination unit 72 determines that foreign matter 92 adheres to inspection area CA0. decide not to.

The feature amount is not limited as long as it is obtained by image processing the image data PD0. For example, the luminance, saturation, brightness, etc. of each pixel of the reference data SD0 and the comparison data CD0 are included in the feature amount. In addition, the area of the closed region, the length of the perimeter of the closed region, and the like obtained by performing image processing (for example, binarization processing) on each of the reference data SD0 and the comparison data CD0 are included in the feature amount. In this embodiment, the feature amount is the brightness of each pixel of the reference data SD0 and the comparison data CD0.

In addition, the predetermined threshold value is larger than the feature amount (for example, luminance of a pixel) when the foreign matter 92 is not adhered to the inspection area CA0, and the feature value when the foreign matter 92 is adhered to the inspection area CA0. set to be less than the amount The predetermined threshold value is acquired in advance by, for example, simulation, verification using an actual machine, or the like.

5 and 6 schematically show an example of a plurality (two) of image data PD0 acquired by the acquisition unit 71. FIG. FIG. 5 shows the reference data SD0, and FIG. 6 shows the comparison data CD0. 5 and 6 also show a plurality of pixels arranged in a grid pattern. Also, an area AR0 shown in FIGS. 5 and 6 indicates the same area (set of the same plurality of pixels) in the inspection area CA0.

When the foreign matter 92 adheres to the area AR0, the difference between the brightness of the pixels included in the area AR0 shown in FIG. 5 and the brightness of the pixels included in the area AR0 shown in FIG. 6 exceeds a predetermined threshold. Conversely, when the foreign matter 92 does not adhere to the area AR0, the difference between the luminance of the pixels included in the area AR0 shown in FIG. 5 and the luminance of the pixels included in the area AR0 shown in FIG. 6 is equal to or less than the predetermined threshold. .

Therefore, when the difference between the luminance of the pixels included in the area AR0 shown in FIG. 5 and the luminance of the pixels included in the area AR0 shown in FIG. It is determined that foreign matter 92 is attached. When the difference between the luminance of the pixels included in the area AR0 shown in FIG. 5 and the luminance of the pixels included in the area AR0 shown in FIG. decide not to. The brightness comparison is performed for each corresponding pixel.

The determining unit 72 can similarly determine when the number of image data PD0 acquired by the acquiring unit 71 is three or more. Specifically, the determination unit 72 calculates the difference between the feature amount of the inspection area CA0 acquired from the reference data SD0 and the feature amount of the inspection area CA0 acquired from each of the plurality of comparison data CD0, and calculates It is possible to determine whether or not the difference between the calculated feature amounts exceeds a predetermined threshold.

1-3-3. Setting unit 73
If the feature amount of the inspection area CA0 acquired by image processing the image data PD0 changes due to the change over time of the joining member 93 that joins the board 90 and the component 91 applied to the inspection area CA0 of the board 90, the determination unit 72 may erroneously determine that the joining member 93 is the foreign object 92 . Therefore, the foreign object detection device 70 of this embodiment includes a setting section 73 .

The setting unit 73 determines that the bonding member 93 is a foreign object 92 in the determination unit 72 when the feature amount of the inspection area CA0 changes due to the change over time of the bonding member 93 that bonds the substrate 90 and the component 91 applied to the inspection area CA0. To prevent erroneous determination, the permissible time T0 is set in advance (step S11 shown in FIG. 4).

The joining member 93 is not limited as long as it is a member that joins the substrate 90 and the component 91 . For example, solder, adhesive, etc. are included in the joining member 93 . In this embodiment, the joining member 93 is solder. The solder turns from silver to gray as the flux it contains dries. Therefore, there is a possibility that the characteristic amount of the inspection area CA0 will fluctuate due to changes in the solder over time, and there is a possibility that the determination unit 72 will erroneously determine that the solder is a foreign object 92 .

The allowable time T0 is obtained in advance by, for example, simulation or verification using an actual machine. In addition, the allowable time T0 may vary depending on the type of the joint member 93, and the setting unit 73 can set the allowable time T0 according to the type of the joint member 93. For example, the setting unit 73 can set the allowable time T0 according to the type of solder. Also, the setting unit 73 can set the allowable time T0 according to the type of adhesive.

　The higher the temperature inside the component mounting machine WM3, the faster the flux contained in the solder tends to dry. Also, the lower the humidity inside the component mounting machine WM3, the faster the flux contained in the solder tends to dry. Therefore, the setting unit 73 can also set the allowable time T0 according to at least one of the temperature and humidity inside the component mounting machine WM3 that mounts the component 91 on the substrate 90 .

1-3-4. Example of application to board-handling work line WL0 In board-handling work line WL0 shown in FIG. Then, a plurality of parts 91 are mounted in order. As shown in FIG. 7, after the substrate 90 is carried into one component mounter WM3 of the plurality (three) of the component mounters WM3, the component mounter WM3 operates normally without stopping due to an error. In this case, a first required time T1 is assumed to be required for the component mounting machine WM3 to mount the component 91 to be mounted and for the board 90 to be unloaded from the component mounting machine WM3.

When the allowable time T0 is equal to or longer than the first required time T1, the acquisition unit 71 can acquire a plurality of pieces of image data PD0 for each component mounting machine WM3. In this case, the determination unit 72 can determine the presence or absence of the foreign matter 92 adhering to the inspection area CA0 inside the component mounting machine WM3. Note that when the allowable time T0 is twice or more the first required time T1, the acquisition unit 71 can also acquire a plurality of pieces of image data PD0 for each of the plurality of component mounters WM3. In this case, the determination unit 72 can determine the presence or absence of the foreign matter 92 for each of the component mounters WM3. Further, when a board transport conveyor is provided between a plurality of component mounting machines WM3 arranged in succession, the first required time T1 for each of the plurality of component mounting machines WM3 and the component mounting If the total of the transfer time by the substrate transfer conveyor between the component mounting machines WM3 and the second required time T2, which will be described later, is within the allowable time, the acquisition unit acquires a plurality of image data PDO for each of the plurality of component mounting machines WM3. can also be obtained. Also in this case, the determination unit 72 can determine the presence or absence of the foreign matter 92 for each of the plurality of component mounters WM3.

Further, when the allowable time T0 is less than the first required time T1, in one component mounting machine WM3, acquisition of a plurality of image data PD0 by the acquisition unit 71 and determination of the presence or absence of foreign matter 92 by the determination unit 72 are performed multiple times. ,Repeated. Based on the results of simulations of changes in the bonding members 93 used in the substrate product 900 over time and verification results using actual machines, it has been found that it is preferable for the acquisition unit 71 to acquire a plurality of pieces of image data PD0 for each component mounting machine WM3. Therefore, in the following description of the transport control unit 74 and the mounting control unit 75, the acquisition unit 71 acquires a plurality of image data PD0 for each component mounting machine WM3, The presence or absence of foreign matter 92 adhering to inspection area CA0 is determined. Further, the acquiring unit 71, the determining unit 72, and the setting unit 73 may have any of the forms already described.

1-3-5. Transport control unit 74 and mounting control unit 75
The foreign object detection device 70 applied to the substrate-oriented work line WL0 can perform control according to the flowchart shown in FIG. 8, for example. The component mounter WM3 that mounts the component 91 in the inspection area CA0 is referred to as the target component mounter MT0, and at least one component mounter WM3 provided on the upstream side of the target component mounter MT0 is referred to as the upstream component mounter MU0. do. In this embodiment, the allowable time T0 is longer than the first required time T1 and longer than the second required time T2.

Also, for convenience of explanation, as shown in FIGS. 1 and 7, the plurality of (three) component mounters WM3 will be referred to as a component mounter M1, a component mounter M2, and a component mounter M3 in order from the upstream side. Further, the component mounting machine M3 is assumed to be the target component mounting machine MT0, and the component mounting machine M1 and the component mounting machine M2 are assumed to be the upstream component mounting machine MU0.

The foreign matter detection device 70 determines whether or not the component mounter WM3 is the upstream component mounter MU0 (the component mounter M1 or the component mounter M2) (step S21 shown in FIG. 8). When the component mounting machine WM3 is the upstream component mounting machine MU0 (Yes in step S21), the acquiring unit 71 acquires a plurality of image data PD0 (step S22). Specifically, the acquiring unit 71 acquires the image data PD0 by capturing an image of the inspection area CA0 before starting the mounting process of the component 91 in each of the upstream component mounting machines MU0. After completion, the inspection area CA0 is imaged to obtain image data PD0.

Next, the judgment unit 72 judges whether or not the foreign matter 92 adheres to the inspection area CA0 in the upstream component mounting machine MU0 (step S23). When the determination unit 72 determines that the foreign matter 92 is not adhered to the inspection area CA0 in the upstream component mounting machine MU0 (No in step S23), the transport control unit 74 controls the upstream component mounting machine MU0. The substrate 90 is carried out to the next component mounting machine WM3 provided downstream of MU0 (step S24).

When the determination unit 72 determines that the foreign matter 92 is attached to the inspection area CA0 in the upstream component mounting machine MU0 (Yes in step S23), the transport control unit 74 stops carrying out the substrate 90. (step S25). In this case, for example, the operator can take out the substrate 90 and check the presence or absence of the foreign matter 92 . Also, if the removal of the foreign matter 92 is possible, the operator can also remove the foreign matter 92 .

When the component mounting machine WM3 is not the upstream component mounting machine MU0 (No in step S21), the foreign object detection device 70 determines whether the component mounting machine WM3 is the target component mounting machine MT0 (the component mounting machine M3). It judges (step S26). When the component mounting machine WM3 is the target component mounting machine MT0 (Yes in step S26), the acquiring unit 71 acquires a plurality of image data PD0 (step S27). Specifically, the acquiring unit 71 acquires the image data PD0 by imaging the inspection area CA0 before starting the process of placing the component 91 in the target component mounting machine MT0, and acquires the image data PD0 of the component 91 to be mounted in the inspection area CA0. image data PD0 is acquired by imaging the inspection area CA0 before wearing the .

Next, the determination unit 72 determines whether or not the foreign matter 92 adheres to the inspection area CA0 in the target component mounting machine MT0 (step S28). When the determination unit 72 determines that the foreign matter 92 is not adhered to the inspection area CA0 in the target component mounting machine MT0 (No in step S28), the mounting control unit 75 controls the mounting control unit 75 to perform the mounting operation on the inspection area CA0. Mounting of the component 91 is permitted (step S29). Then, the control by the foreign matter detection device 70 is once terminated.

When the determining unit 72 determines that the foreign matter 92 is attached to the inspection area CA0 in the target component mounting machine MT0 (Yes in step S28), the mounting control unit 75 controls the mounting control unit 75 to perform the mounting operation on the inspection area CA0. The mounting of the component 91 is restricted (step S30). In this case, for example, the operator can take out the substrate 90 and check the presence or absence of the foreign matter 92 . Also, if the removal of the foreign matter 92 is possible, the operator can also remove the foreign matter 92 .

If the component mounter WM3 is not the target component mounter MT0 (No in step S26), the component mounter WM3 is provided downstream of the target component mounter MT0, and the inspection area CA0 has a component 91 is already installed. Therefore, in this case, the control by the foreign object detection device 70 is once terminated.

In this way, the acquisition unit 71 acquires the image data PD0 by imaging the inspection area CA0 before starting the mounting process of the component 91 in the upstream component mounting machine MU0 and after finishing the mounting process. Then, when the determining unit 72 determines that the foreign matter 92 is not attached to the inspection area CA0 in the upstream component mounting machine MU0, the transport control unit 74 is provided downstream of the upstream component mounting machine MU0. The substrate 90 is carried out to the next component mounting machine WM3. By sequentially executing the above processes in the upstream component mounting machine MU0, the substrate 90 with no foreign matter 92 adhering to the inspection area CA0 is transported to the target component mounting machine MT0.

In addition, the acquiring unit 71 images the inspection area CA0 and obtains the image data PD0 before starting the mounting process of the component 91 in the target component mounting machine MT0 and before mounting the component 91 to be mounted in the inspection area CA0. to get Then, when the determining unit 72 determines that the foreign matter 92 is not attached to the inspection area CA0 in the target component mounting machine MT0, the mounting control unit 75 permits mounting of the component 91 to be mounted in the inspection area CA0. do. By executing the above processing in the target component mounting machine MT0, the target component mounting machine MT0 can mount the component 91 to be mounted in the inspection area CA0 where the foreign matter 92 is not adhered.

1-3-6. Conveyance of Board 90 Between Component Mounters WM3 If adhesion of foreign matter 92 during conveyance of the board 90 between component mounters WM3 becomes a problem, the foreign matter detector 70 can perform the following control. Also in this embodiment, the substrate 90 is sequentially conveyed to a plurality of (three in the example shown in FIG. 1) component mounting machines WM3 that mount components 91 on the substrate 90, and the plurality of components 91 are mounted in sequence. Further, the acquiring unit 71, the determining unit 72, and the setting unit 73 may have any of the forms already described. Further, as shown in FIG. 7, after the board 90 is unloaded from the first component mounting machine MF0, which is one component mounting machine WM3 of the plurality (three) of the component mounting machines WM3, the first component mounting machine When the component mounting machine WM3 provided downstream from MF0 operates normally without stopping due to an error, the second component mounting machine MS0 which is the next component mounting machine WM3 provided downstream from the first component mounting machine MF0. The time expected to be required until the substrate 90 is carried in is assumed to be a second required time T2.

When the allowable time T0 is equal to or longer than the second required time T2, the acquisition unit 71 images the inspection area CA0 after the mounting process of the component 91 in the first component mounting machine MF0 is completed and before the board 90 is unloaded. to acquire the image data PD0. In addition, the acquisition unit 71 captures the inspection area CA0 and acquires image data after the board 90 is carried into the second component mounting machine MS0 and before starting the mounting process of the component 91 in the second component mounting machine MS0. Get PD0. In this case, the determination unit 72 can determine the presence or absence of foreign matter 92 adhering to the inspection area CA0 when the substrate 90 is transported between the first component mounting machine MF0 and the second component mounting machine MS0.

2. Foreign Matter Detection Method What has already been described about the foreign matter detection device 70 can also be said for the foreign matter detection method. Specifically, the foreign matter detection method includes an acquisition process, a determination process, and a setting process. The acquisition step corresponds to control performed by the acquisition unit 71 . The determination process corresponds to control performed by the determination unit 72 . The setting process corresponds to control performed by the setting unit 73 . Also, the foreign matter detection method can include a transport control step. The transport control process corresponds to control performed by the transport control unit 74 . The foreign object detection method can also include a mounting control step. The mounting control process corresponds to control performed by the mounting control unit 75 .

3. Example of Effect of Embodiment According to the foreign matter detection device 70, it is possible to suppress erroneous determination of the foreign matter 92 due to aging of the joining member 93 that joins the substrate 90 and the component 91, which is applied to the inspection area CA0 of the substrate 90. can. What has been described above with respect to the foreign object detection device 70 can be similarly applied to the foreign object detection method.

70: foreign object detection device, 71: acquisition unit, 72: determination unit, 73: setting unit,
74: Conveyance control unit, 75: Mounting control unit, 90: Substrate, 91: Component,
92: foreign matter, 93: joining member, CA0: inspection area, PD0: image data,
SD0: reference data, CD0: comparison data, WM3: component mounting machine,
MT0: target component mounting machine, MU0: upstream component mounting machine,
MF0: first component mounting machine, MS0: second component mounting machine,
T0: allowable time, T1: first required time, T2: second required time.

Claims

an acquisition unit that captures images of at least a part of an inspection area of a substrate a plurality of times within a predetermined allowable time to acquire a plurality of image data of the same inspection area;
a judgment unit that judges the presence or absence of a foreign substance adhering to the inspection area based on the difference in the feature amount of the inspection area acquired by image processing each of the plurality of image data acquired by the acquisition unit;
In order to prevent the determination unit from erroneously determining that the bonding member is the foreign matter due to fluctuations in the characteristic amount of the inspection region due to changes over time in the bonding member applied to the inspection region and bonding the substrate and the component, a setting unit that presets the allowable time;
A foreign object detection device comprising:
2. The foreign matter detection device according to claim 1, wherein the acquisition unit uses, as the inspection area, an area specified by a user of a component mounting machine that mounts the component on the board.
The determination unit determines the feature amount of the inspection region obtained from reference data, which is one of the image data obtained first among the plurality of image data, and the other one of the plurality of image data. When the difference between the feature amount of the inspection area obtained from the comparison data, which is the image data of the above, exceeds a predetermined threshold value, it is determined that the foreign matter is adhered to the inspection area, and the feature amount of 3. A foreign matter detection apparatus according to claim 1, wherein when said difference is equal to or less than a predetermined threshold value, it is determined that said foreign matter does not adhere to said inspection area.
The foreign matter detection device according to claim 3, wherein the feature amount is the brightness of each pixel of the reference data and the comparison data.
The foreign matter detection device according to any one of claims 1 to 4, wherein the setting unit sets the allowable time according to the type of the joining member.
6. The setting unit according to any one of claims 1 to 5, wherein the setting unit sets the allowable time according to at least one of temperature and humidity inside a component mounting machine that mounts the component on the substrate. foreign object detection device.
The foreign matter detection device according to any one of claims 1 to 6, wherein the joining member is solder.
The substrate is sequentially conveyed to a plurality of component mounting machines that mount the components on the substrate, and the plurality of components are mounted in sequence,
The allowable time is the time required for the component mounting machine to operate normally without stopping due to an error after the board is carried into the component mounting machine, which is one of the plurality of component mounting machines. is equal to or longer than the first required time, which is the time expected to be required until the board is unloaded from the component mounting machine after the component to be mounted is mounted in
The acquisition unit acquires the plurality of image data for each component mounting machine,
The foreign matter detection apparatus according to any one of claims 1 to 7, wherein the judgment section judges the presence or absence of the foreign matter adhering to the inspection area inside the component mounting machine.
In each of the upstream component mounters, which are at least one of the component mounters provided upstream of the target component mounter which is the component mounter that mounts the component in the inspection area, the acquisition unit performs the 9. The method according to claim 8, wherein the inspection area is imaged to obtain the image data before the component mounting process is started, and the inspection area is imaged to obtain the image data after the component mounting process is completed. foreign object detection device.
When the determining unit determines that the foreign matter is not attached to the inspection area in the upstream component mounting machine, the next component mounting machine provided downstream from the upstream component mounting machine performs the 10. A transport control unit that transports a substrate and stops transporting the substrate when the determination unit determines that the foreign matter is adhered to the inspection area in the upstream component mounting machine. The foreign object detection device according to 1.
The acquisition unit acquires the image data by imaging the inspection area before starting the component mounting process in the target component mounting machine, which is the component mounting machine that mounts the component in the inspection area, 11. The foreign matter detection apparatus according to any one of claims 8 to 10, wherein the inspection area is imaged to acquire the image data before mounting the component to be mounted in the inspection area.
When the determining unit determines that the foreign matter is not attached to the inspection area in the target component mounting machine, the component to be mounted in the inspection area is permitted to be mounted, and the target component mounting machine 12. The foreign matter detection according to claim 11, further comprising a mounting control section that restricts mounting of the component to be mounted in the inspection area when the determination section determines that the foreign material is attached to the inspection area. Device.
The substrate is sequentially conveyed to a plurality of component mounting machines that mount the components on the substrate, and the plurality of components are mounted in sequence,
The permissible time is the time after the substrate is unloaded from the first component mounting machine, which is one of the component mounting machines among the plurality of component mounting machines, and the component is provided downstream from the first component mounting machine. When the mounter operates normally without stopping due to an error, the time required until the substrate is carried into the second component mounter, which is the next component mounter provided downstream from the first component mounter. is greater than or equal to the second required time, which is the time expected to be
The acquisition unit acquires the image data by imaging the inspection area after the component mounting process in the first component mounting machine is completed and before the board is carried out, and the second component acquiring the image data by capturing an image of the inspection area after the board is carried into the mounting machine and before starting the mounting process of the component in the second component mounting machine;
Claims 1 to 12, wherein the judging section judges the presence or absence of the foreign matter adhering to the inspection area when the board is transported between the first component mounting machine and the second component mounting machine. The foreign object detection device according to any one of 1.
an acquisition step of capturing images of at least a part of the inspection area of the substrate a plurality of times within a predetermined allowable time to acquire a plurality of image data of the same inspection area;
a judgment step of judging the presence or absence of a foreign substance adhering to the inspection region based on the difference in the feature amount of the inspection region acquired by image processing each of the plurality of image data acquired in the acquisition step;
In order to prevent the bonding member from being erroneously determined as the foreign matter in the determination step due to fluctuations in the feature amount of the inspection region due to changes over time in the bonding member applied to the inspection region for bonding the substrate and the component, a setting step of presetting the allowable time;
A foreign object detection method comprising: