WO2024033961A1

WO2024033961A1 - Foreign matter detection device and foreign matter detection method

Info

Publication number: WO2024033961A1
Application number: PCT/JP2022/030245
Authority: WO
Inventors: 恵市小野; 貴紘小林; 智也藤本; 一也小谷
Original assignee: 株式会社Fuji
Priority date: 2022-08-08
Filing date: 2022-08-08
Publication date: 2024-02-15

Abstract

This foreign matter detection device comprises an acquisition unit and a determination unit. When a substrate work machine performs prescribed work on a substrate, the acquisition unit captures images of an inspection region of at least a portion of the substrate as the work on the substrate progresses, and acquires multiple pieces of image data resulting from capturing of images of the same inspection region. The determination unit determines the presence/absence of foreign matter adhered to the inspection region, on the basis of inspection region characteristic-amount differences, obtained by image processing: reference image data, which is a one piece of image data of said multiple pieces of image data; and inspection image data, which is image data to be inspected and acquired after the reference image data. Furthermore, if the work on the substrate stops after the acquisition of the reference image data but before the acquisition of the inspection image data, the acquisition unit acquires an image of the inspection region at the point in time when the work on the substrate stopped, to obtain image data, which is first image data.

Description

Foreign object detection device and foreign object detection method

This specification discloses a technology related to a foreign object detection device and a foreign object detection method.

The mounting line described in Patent Document 1 includes a first camera means, a second camera means, and an image processing means. The first camera means is a camera means capable of viewing at least a portion of the printed circuit board, and is provided to be able to take an image of the printed circuit board before mounting the electronic components in any of the mounting machines. . The second camera means is a camera means that can cover the same field of view as the first camera means, and is a camera means that can cover the same field of view as the first camera means, and is a camera means that can capture electronic components by one of the mounters or a mounter in a process subsequent to the mounter. It is provided to be able to take an image of the printed circuit board after the mounting work.

The image processing means performs image processing by comparing the image data taken by the second camera means with the image data taken by the first camera means. As a result, the mounting line described in Patent Document 1 attempts to detect abnormalities in solder printing when solder is printed on a printed circuit board or mounting abnormalities in electronic components when electronic components are mounted on a printed circuit board.

Japanese Patent Application Publication No. 2007-335524

If foreign matter is attached to the mounting position of the component, there is a possibility that the component will be installed incorrectly, and it is necessary to determine whether there is any foreign matter attached to the board. In this case, it is assumed that a plurality of image data obtained by capturing images of the same inspection area of at least a portion of the board are compared, and the presence or absence of a foreign object is determined based on the difference in the feature amount of the image data.

However, there is a possibility that the board-facing work by the board-facing work machine will stop between the time when the reference image data is acquired and the time when the image data to be compared with the image data is acquired. If the board work continues to be stopped, the state of the board may change, and there is a desire to obtain the state of the board at the time the board work stopped.

In view of these circumstances, this specification discloses a foreign object detection device and a foreign object detection method that can acquire image data at the time when the work for the substrate is stopped.

This specification discloses a foreign object detection device that includes an acquisition section and a determination section. The acquisition unit images at least a part of the inspection area of the board as the board-to-board work progresses by a board-to-board work machine that performs a predetermined board-to-board work on the board, and images the same inspection area. Acquire multiple image data. The determination unit performs image processing to obtain reference image data that is one image data of the plurality of image data and inspection image data that is image data of an inspection target acquired after the reference image data. The presence or absence of a foreign object adhering to the inspection area is determined based on the difference in the feature amount of the inspection area. Further, when the board-related work is stopped between acquiring the reference image data and acquiring the inspection image data, the acquisition unit is configured to image the inspection area and stop the board-related work. First image data, which is the image data at the time when the

Additionally, this specification discloses a foreign object detection method that includes an acquisition step and a determination step. In the acquisition step, at least a part of the inspection area of the board is imaged as the board-to-board work progresses by a board-to-board work machine that performs a predetermined board-to-board work on the board, and the same inspection area is imaged. Acquire multiple image data. The determination step includes image processing and acquisition of reference image data, which is one image data of the plurality of image data, and inspection image data, which is image data of the inspection target acquired after the reference image data. The presence or absence of foreign matter adhering to the inspection area is determined based on the difference in the feature amount of the inspection area. Further, in the acquisition step, if the board-related work is stopped between obtaining the reference image data and acquiring the inspection image data, the board-related work is stopped by imaging the inspection area. First image data, which is image data at the time when the first image data is obtained, is acquired.

In addition, in this specification, in claim 6 of the claims first attached to the application (hereinafter referred to as original claims), "the foreign object detection device according to claim 1" is defined as "claim 6". A technical concept modified to the foreign object detection device according to any one of claims 1 to 5 is disclosed. In addition, in the present specification, in claim 9 of the original claims, ``the foreign object detection device according to claim 1'' is defined as ``the foreign object detection device according to any one of claims 1 to 8''. The technical idea changed to "device" is disclosed. Furthermore, in the present specification, in claim 11 originally stated in the scope of claims, "the foreign object detection device according to claim 1" is defined as "the foreign object detection device according to any one of claims 1 to 10." The technical idea changed to "device" is disclosed. In addition, in the present specification, in claim 12 originally stated in the scope of claims, ``the foreign object detection device according to claim 1'' is defined as ``the foreign object detection device according to any one of claims 1 to 10''. The technical idea changed to "device" is disclosed. Furthermore, in the present specification, in claim 13 originally stated in the scope of claims, "the foreign object detection device according to claim 1" is defined as "any one of claims 1 to 10 and claim 12." A technical concept modified from the above-mentioned foreign object detection device is disclosed.

According to the above-mentioned foreign object detection device, it is possible to acquire first image data that is image data at the time when the work for the substrate is stopped. What has been described above regarding the foreign object detection device also applies to the foreign object detection method.

FIG. 2 is a configuration diagram showing an example of the configuration of a board-related work line. FIG. 2 is a plan view showing a configuration example of a component mounting machine. It is a block diagram showing an example of a control block of a foreign object detection device. It is a flow chart which shows an example of a control procedure by a foreign object detection device. FIG. 3 is a schematic diagram showing an example of reference image data. FIG. 3 is a schematic diagram showing an example of inspection image data. FIG. 3 is a schematic diagram showing an example of the state of the board until the work for the board is stopped. FIG. 6 is a schematic diagram showing an example of the state of the board after the work for the board is restarted.

1. Embodiment 1-1. Configuration example of the board-to-board work line WL0 In the board-to-board work line WL0, the board-to-board work machine WM0 performs a predetermined board-to-board work on the board 90. The type and number of the board-to-board work machines WM0 that constitute the board-to-board work line WL0 are not limited. As shown in FIG. 1, the board-to-board work line WL0 of the embodiment includes a plurality of board-to-board work machines WM0, including a printing machine WM1, a print inspection machine WM2, a component mounting machine WM3, a reflow oven WM4, and an appearance inspection machine WM5. Then, the substrate 90 is transported in the above order by the substrate transport device.

The printing machine WM1 prints solder on the mounting positions of the plurality of components 91 on the board 90. The print inspection machine WM2 inspects the printing state of the solder printed by the printing machine WM1. As shown in FIG. 2, the component mounting machine WM3 mounts a plurality of components 91 onto a board 90 on which solder has been printed by the printing machine WM1. The number of component mounting machines WM3 may be one or more. When a plurality of component mounting machines WM3 are provided, the plurality of component mounting machines WM3 can share the task of mounting a plurality of components 91.

The reflow furnace WM4 heats the board 90 on which the plurality of components 91 are mounted by the component mounting machine WM3, melts the solder, and performs soldering. The appearance inspection machine WM5 inspects the mounting state of the plurality of components 91 mounted by the component mounting machine WM3. In this way, the substrate-to-board work line WL0 can use the plurality of substrate-to-board work machines WM0 to transport the substrates 90 in order, perform production processing including inspection processing, and produce the board products 900. Note that the board-related work line WL0 includes board-related work machines WM0 such as a function inspection machine, a buffer device, a substrate supply device, a substrate reversing device, a shield mounting device, an adhesive coating device, and an ultraviolet irradiation device as necessary. You can also prepare.

A plurality of board-to-board work machines WM0 and line management device LC0, which constitute the board-to-board work line WL0, are communicably connected by a communication unit. Further, the line management device LC0 and the management device HC0 are communicably connected by a communication section. The communication unit can communicably connect them by wire or wirelessly, and various communication methods can be used.

In the embodiment, a local area network (LAN) is configured by a plurality of board-related work machines WM0, line management device LC0, and management device HC0. Therefore, the plurality of board-oriented work machines WM0 can communicate with each other via the communication section. Further, the plurality of board-oriented work machines WM0 can communicate with the line management device LC0 via the communication unit. Furthermore, the line management device LC0 and the management device HC0 can communicate with each other via the communication unit.

The line management device LC0 controls the plurality of board-related work machines WM0 that constitute the board-related work line WL0, and monitors the operating status of the board-related work line WL0. The line management device LC0 stores various control data for controlling the plurality of board working machines WM0. The line management device LC0 transmits control data to each of the plurality of board-facing work machines WM0. Further, each of the plurality of board-oriented work machines WM0 transmits the operating status and production status to the line management device LC0.

The management device HC0 manages at least one line management device LC0. For example, the operating status and production status of the board-oriented work machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as necessary. The management device HC0 is provided with a storage device. The storage device can store various types of acquired data acquired by the board-oriented work machine WM0. For example, various image data captured by the substrate-to-board working machine WM0 is included in the acquired data. Records (log data) of operating conditions acquired by the board-oriented work machine WM0 are included in the acquired data. Further, the storage device can store various production information regarding the production of the board product 900.

The board-to-board work line WL0 includes an input/output device 80. A known input/output device can be used as the input/output device 80. The input/output device 80 includes a display section and displays various data in a visible manner. Further, the display unit is configured with a touch panel, and also functions as an input device that receives various operations by the operator.

1-2. Configuration Example of Component Mounting Machine WM3 The component mounting machine WM3 mounts a plurality of components 91 onto the board 90. As shown in FIG. 2, the component mounting machine WM3 includes a board transfer device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, and a control device 16.

The substrate transport device 11 is configured by, for example, a belt conveyor, and transports the substrate 90 in the transport direction (X-axis direction). The substrate 90 is a circuit board on which an electronic circuit, an electric circuit, a magnetic circuit, etc. are formed. The board transport device 11 carries the board 90 into the component mounting machine WM3 and positions the board 90 at a predetermined position inside the machine. The board transport device 11 carries the board 90 out of the component mounting machine WM3 after the mounting process of the plurality of components 91 by the component mounting machine WM3 is completed.

The component supply device 12 supplies a plurality of components 91 to be mounted on the board 90. The component supply device 12 includes a plurality of feeders 12a provided along the conveyance direction (X-axis direction) of the substrate 90. Each of the plurality of feeders 12a is equipped with a reel. A carrier tape containing a plurality of parts 91 is wound around the reel. The feeder 12a feeds the carrier tape in pitches and supplies the component 91 so that it can be collected at a supply position located on the tip side of the feeder 12a. Further, the component supply device 12 can also supply electronic components (for example, lead components) that are relatively large compared to chip components and the like while being arranged on a tray.

The component transfer device 13 includes a head drive device 13a and a moving table 13b. The head drive device 13a is configured to be able to move the movable table 13b in the X-axis direction and the Y-axis direction (direction orthogonal to the X-axis direction in the horizontal plane) using a linear motion mechanism. A mounting head 20 is removably (replaceably) provided on the moving table 13b using a clamp member. The mounting head 20 uses at least one holding member 30 to pick up and hold the component 91 supplied by the component supply device 12, and mounts the component 91 onto the substrate 90 positioned by the substrate transfer device 11. For example, a suction nozzle, a chuck, etc. can be used as the holding member 30.

As the component camera 14 and the board camera 15, known imaging devices can be used. The component camera 14 is fixed to the base of the component mounting machine WM3 so that its optical axis faces upward in the vertical direction (Z-axis direction perpendicular to the X-axis direction and the Y-axis direction). The component camera 14 can image the component 91 held by the holding member 30 from below. The board camera 15 is provided on the movable table 13b of the component transfer device 13 so that its optical axis points downward in the vertical direction (Z-axis direction). The board camera 15 can image the board 90 from above. The component camera 14 and the board camera 15 perform imaging based on control signals sent from the control device 16. Image data of captured images captured by the component camera 14 and the board camera 15 is transmitted to the control device 16.

The control device 16 includes a known arithmetic unit and a storage device, and constitutes a control circuit. Information, image data, etc. output from various sensors provided in the component mounting machine WM3 are input to the control device 16. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions set in advance.

For example, the control device 16 causes the substrate camera 15 to image the substrate 90 positioned by the substrate transport device 11. The control device 16 processes the image captured by the board camera 15 and recognizes the positioning state of the board 90. Further, the control device 16 causes the holding member 30 to collect and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to take an image of the component 91 held by the holding member 30. The control device 16 processes the image captured by the component camera 14 and recognizes the holding posture of the component 91.

The control device 16 moves the holding member 30 upward from a scheduled mounting position that is preset by a control program or the like. Further, the control device 16 corrects the scheduled mounting position based on the positioning state of the board 90, the holding posture of the component 91, etc., and sets the mounting position where the component 91 is actually mounted. The scheduled mounting position and the mounting position include the rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate).

The control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of the holding member 30 according to the mounting position. The control device 16 lowers the holding member 30 at the corrected rotation angle at the corrected target position, and mounts the component 91 on the board 90. The control device 16 executes a mounting process for mounting a plurality of components 91 on the board 90 by repeating the above pick-and-place cycle.

1-3. Configuration Example of Foreign Object Detection Device 70 As shown in FIG. 91 (not attached, floating, tilted, etc.), it is necessary to determine whether there is a foreign substance 92 attached to the substrate 90. In this case, a plurality of image data PD0 obtained by capturing the same inspection area CA0 of at least a part of the substrate 90 are compared, and the foreign object 90 is detected based on the difference in the feature amount (for example, the brightness of a pixel) of the image data PD0. It is assumed that the presence or absence of

However, there is a possibility that the board-facing work by the board-facing work machine WM0 will be stopped between the time when the reference image data PD0 is acquired and the time when the image data PD0 to be compared with the image data PD0 is acquired. If the board-related work continues to be stopped, the state of the board 90 may change, and there is a desire to obtain the state of the board 90 at the time the board-related work stopped. Therefore, the substrate-related work line WL0 of the embodiment is provided with a foreign object detection device 70 that can acquire image data at the time when the substrate-related work is stopped.

When viewed as a control block, the foreign object detection device 70 includes an acquisition section 71 and a determination section 72. The foreign object detection device 70 can also include an estimation section 73. The foreign object detection device 70 can also include a guide section 74. As shown in FIG. 3, the foreign object detection device 70 of the embodiment includes an acquisition section 71, a determination section 72, an estimation section 73, and a guide section 74.

The foreign object detection device 70 can be provided in various control devices. For example, the foreign object detection device 70 can be provided in the control device 16 of the component mounting machine WM3, the line management device LC0, the management device HC0, etc. The foreign object detection device 70 can also be formed on the cloud. As shown in FIG. 3, in the foreign object detection device 70 of the embodiment, the acquisition section 71, the determination section 72, the estimation section 73, and the guide section 74 are provided in the control device 16 of the component mounting machine WM3.

Further, the foreign object detection device 70 of the embodiment executes control according to the flowchart shown in FIG. 4. The acquisition unit 71 performs the processes shown in step S11, step S12, step S16, and step S17. The determining unit 72 performs the processing shown in part of step S13 and step S18. The estimation unit 73 performs part of the processing in step S13. The guide unit 74 performs the processes shown in step S14, step S15, step S19, and step S20.

1-3-1. Example of control when board-related work is normally performed The inspection area CA0 is imaged to obtain a plurality of image data PD0 obtained by capturing the same inspection area CA0.

The acquisition unit 71 may image the entire mounting area of the board 90 as the inspection area CA0, or may image a part of the mounting area of the board 90. When capturing an image of a part of the mounting area of the board 90, the acquisition unit 71 uses, for example, a component 91 (for example, a BGA (Ball Grid Array) component) that has a larger number of electrodes and is more susceptible to the influence of foreign matter 92 than a chip component. 91 etc.) can be imaged. Furthermore, the acquisition unit 71 learns the mounting areas where the component 91 has failed to be mounted due to the foreign object 92, the mounting area where the foreign object 92 is likely to adhere, etc., based on past mounting results, and inspects these mounting areas. It is also possible to image the area CA0.

The acquisition unit 71 can also set the area specified by the operator of the component mounting machine WM3 that mounts the component 91 on the board 90 as the inspection area CA0. The board-to-board work line WL0 of the embodiment includes an input/output device 80. For example, the operator can use the input/output device 80 to specify an arbitrary area (the entire mounting area of the board 90 or a part of the mounting area of the board 90) as the inspection area CA0. In this case, the acquisition unit 71 can schematically display the mounting area of the component 91 on the board 90 on the display unit of the input/output device 80, so that the operator can select any mounting area.

The acquisition unit 71 can acquire the image data PD0 using an imaging device that can image the inspection area CA0. The imaging device is not limited as long as it can image the inspection area CA0. For example, the imaging device includes a board camera 15 that can image a part of the mounting area of the board 90 from above the board 90, a ceiling camera that can image the entire mounting area of the board 90 from above the board 90, and the like. In the embodiment, the board camera 15 is used, and the acquisition unit 71 sets the area designated by the operator of the component mounting machine WM3 as the inspection area CA0. Note that the acquisition unit 71 images the same inspection area CA0 multiple times with the same imaging conditions (for example, exposure time, aperture, illumination time, etc.) that can be set by the imaging device, and acquires a plurality of image data PD0. do.

The determination unit 72 determines whether there is a foreign object 92 attached to the inspection area CA0 based on the difference in the feature amount of the inspection area CA0 obtained by image processing the reference image data SD0 and the inspection image data CD0. The reference image data SD0 refers to one image data PD0 among the plurality of image data PD0 acquired by the acquisition unit 71. The inspection image data CD0 refers to the image data PD0 of the inspection target acquired by the acquisition unit 71 after the reference image data SD0.

The determining unit 72 may take various forms as long as it can determine the presence or absence of foreign matter 92 adhering to the inspection area CA0 based on the difference in the feature amount of the inspection area CA0. For example, when the difference between the feature amounts of the inspection area CA0 acquired from the two image data PD0 (in this case, the reference image data SD0 and the inspection image data CD0) exceeds a predetermined threshold, the determination unit 72 determines that the inspection area CA0 It is determined that there is a foreign object 92 in the area. The determining unit 72 determines that there is no foreign object 92 in the inspection area CA0 when the difference between the feature amounts is less than or equal to a predetermined threshold.

The feature amount is not limited as long as it can be obtained by image processing the image data PD0. The brightness, saturation, brightness, etc. of each pixel of the two image data PD0 (reference image data SD0 and inspection image data CD0) are included in the feature amount. In addition, the area of the closed region, the length of the perimeter of the closed region, etc. obtained by image processing (for example, binarization processing, etc.) each of the two image data PD0 (reference image data SD0 and inspection image data CD0), etc. is included in the feature amount. In the embodiment, the feature amount is the brightness of each pixel of the two image data PD0 (reference image data SD0 and inspection image data CD0).

Note that the above-mentioned predetermined threshold value is larger than the feature amount (for example, the brightness of a pixel) when the foreign matter 92 is not attached to the inspection area CA0, and is larger than the feature amount (for example, the brightness of a pixel) when the foreign matter 92 is attached to the inspection area CA0. is set to be smaller than the amount. The predetermined threshold value is obtained in advance by, for example, simulation or verification using an actual device.

5 and 6 schematically show an example of a plurality of (two) pieces of image data PD0 acquired by the acquisition unit 71. FIG. 5 shows the reference image data SD0, and FIG. 6 shows the inspection image data CD0. Note that in FIGS. 5 and 6, for convenience of explanation, a plurality of pixels arranged in a lattice pattern are shown together. Further, the area AR0 shown in FIGS. 5 and 6 indicates the same area (set of the same plurality of pixels) in the inspection area CA0.

If there is a foreign object 92 in the area AR0, the difference between the brightness of the pixels included in the area AR0 shown in FIG. 5 and the brightness of the pixels included in the area AR0 shown in FIG. 6 exceeds a predetermined threshold. Conversely, when there is no foreign object 92 in the area AR0, the difference between the brightness of the pixels included in the area AR0 shown in FIG. 5 and the brightness of the pixels included in the area AR0 shown in FIG. 6 becomes equal to or less than the predetermined threshold value.

Therefore, when the difference between the brightness of the pixels included in the area AR0 shown in FIG. 5 and the brightness of the pixels included in the area AR0 shown in FIG. It is determined that a foreign object 92 is present. The determination unit 72 determines that there is no foreign object 92 in the inspection area CA0 when the difference between the brightness of the pixels included in the area AR0 shown in FIG. 5 and the brightness of the pixels included in the area AR0 shown in FIG. I judge that. Note that the brightness comparison is performed for each corresponding pixel.

The acquisition unit 71 can acquire the reference image data SD0 and the inspection image data CD0 at a predetermined timing. As shown in FIG. 1, the board 90 is sequentially conveyed to a plurality of (three in the figure) component mounting machines WM3, which are the board-to-board working machine WM0, and a plurality of components 91 are mounted thereon. For convenience of explanation, the most upstream component mounting machine WM3 among the plurality of (three) component mounting machines WM3 will be referred to as the component mounting machine M1. Further, the next component mounting machine WM3 on the downstream side of the component mounting machine M1 is defined as a component mounting machine M2. Further, the next component mounting machine WM3 on the downstream side of the component mounting machine M2 is defined as the component mounting machine M3.

In the above-mentioned board work line WL0, for example, the acquisition unit 71 acquires the reference image data SD0 in the most upstream component mounting machine WM3 (component mounting machine M1) among the plurality of (three) component mounting machines WM3. do. More specifically, the acquisition unit 71 images the inspection area CA0 and acquires the reference image data SD0 before starting the mounting process of the component 91 in the component mounting machine M1.

Furthermore, the acquisition unit 71 acquires the inspection image data CD0 in the component mounting machine WM3 (for example, the component mounting machine M3) that mounts the component 91 in the inspection area CA0. More specifically, the acquisition unit 71 images the inspection area CA0 and acquires the inspection image data CD0 before mounting the component 91 to be mounted on the inspection area CA0 in the component mounting machine M3. In this case, the determining unit 72 can determine the presence or absence of foreign matter 92 that adheres to the inspection area CA0 while the board 90 is being transported across the plurality of (three) component mounting machines WM3. In this specification, the above form is referred to as the first form.

The acquisition unit 71 can also acquire the reference image data SD0 and the inspection image data CD0 in each of the plurality of (three) component mounting machines WM3. The acquisition unit 71 includes at least one component mounting machine WM3 (component mounting machine M1 and component mounting machine M2) provided upstream of a component mounting machine WM3 (for example, component mounting machine M3) that mounts the component 91 in the inspection area CA0. ), the inspection area CA0 is imaged to obtain reference image data SD0 before starting the mounting process of the component 91. The acquisition unit 71 images the inspection area CA0 and acquires inspection image data CD0 after the mounting process of the component 91 is completed in each of the component mounting machines WM3 (component mounting machines M1 and M2) described above.

In addition, in the component mounting machine WM3 (for example, component mounting machine M3) that mounts the component 91 in the inspection area CA0, the acquisition unit 71 images the inspection area CA0 before starting the mounting process of the component 91, and generates reference image data. Get SD0. In the component mounting machine WM3 (component mounting machine M3) described above, the acquisition unit 71 images the inspection area CA0 and acquires inspection image data CD0 before mounting the component 91 to be mounted on the inspection area CA0. In these cases, the determining unit 72 can determine the presence or absence of foreign matter 92 adhering to the inspection area CA0 in each of the plurality of (three) component mounting machines WM3. In this specification, the above form is referred to as the second form.

The acquisition unit 71 can also acquire the reference image data SD0 and the inspection image data CD0 between adjacent component mounting machines WM3. The acquisition unit 71 acquires the reference image data SD0 in one of the plurality of (three) component mounting machines WM3. More specifically, the acquisition unit 71 images the inspection area CA0 and acquires the reference image data SD0 after the mounting process of the component 91 in the component mounting machine WM3 is completed and before the board 90 is carried out. .

Furthermore, the acquisition unit 71 acquires the inspection image data CD0 in the next component mounting machine WM3 on the downstream side of the component mounting machine WM3. More specifically, the acquisition unit 71 images the inspection area CA0 and performs the inspection after the board 90 is carried into the component mounting machine WM3 and before starting the mounting process of the component 91 in the component mounting machine WM3. Obtain image data CD0. In these cases, the determining unit 72 can determine the presence or absence of foreign matter 92 that adheres to the inspection area CA0 when the board 90 is transported between adjacent component mounting machines WM3. In this specification, the above form is referred to as the third form.

1-3-2. Control example when board work is stopped For example, board work machine WM0 performs image processing on image data PD0 acquired by an imaging device (for example, component camera 14, board camera 15, etc. in component mounting machine WM3). If the results are bad, the board work may be stopped. Further, the board-related work machine WM0 may stop the board-related work when a situation occurs in which the board-related work cannot be continued (for example, in the component mounting machine WM3, there is a shortage of components 91 to be mounted). Further, the operator may operate the stop button to stop the board-facing work by the board-facing work machine WM0.

The acquisition unit 71 images the inspection area CA0 and acquires the first image data PD1 when the board work is stopped between the acquisition of the reference image data SD0 and the acquisition of the inspection image data CD0 ( In the case of Yes in step S11 and step S12 shown in FIG. 4). The first image data PD1 refers to the image data PD0 at the time when the work for the board stopped. The acquisition unit 71 can image the inspection area CA0 and acquire the first image data PD1 at the timing when the board-related work is stopped, in the same manner as when the board-related work is being performed normally. Thereby, the foreign object detection device 70 can acquire the image data PD0 at the time when the work on the board stopped, and can grasp the state of the board 90 at the time when the work on the board stopped.

Further, the determining unit 72 can determine the presence or absence of the foreign object 92 based on the difference in the feature amount of the inspection area CA0 obtained by image processing the reference image data SD0 and the first image data PD1 (FIG. Step S13) shown in FIG. The determining unit 72 can determine the presence or absence of the foreign object 92 in the same manner as when the board work is normally performed.

Specifically, the determination unit 72 determines if the difference in the feature amount of the inspection area CA0 obtained from the two image data PD0 (in this case, the reference image data SD0 and the first image data PD1) exceeds a predetermined threshold value. , it is determined that there is a foreign object 92 in the inspection area CA0. The determining unit 72 determines that there is no foreign object 92 in the inspection area CA0 when the difference between the feature amounts is less than or equal to a predetermined threshold. Note that, as described above, the feature amount is not limited. The feature amount in the embodiment is the brightness of each pixel of the two image data PD0 (standard image data SD0 and first image data PD1).

FIG. 7 shows an example of the state of the board 90 until the board work is stopped. In the figure, taking the first embodiment as an example, the state of the board 90 until the board work is stopped in the component mounting machine M2 is schematically shown using image data PD0. Specifically, in the most upstream component mounting machine M1 of the plurality of (three) component mounting machines WM3, the acquisition unit 71 acquires the reference image data SD0.

Then, it is assumed that the board 90 is transferred to the next component mounting machine M2 on the downstream side of the component mounting machine M1, and the board work in the component mounting machine M2 is stopped. The acquisition unit 71 images the inspection area CA0 and acquires first image data PD1 at the timing when the board-related work has stopped in the component mounting machine M2 where the board-related work has stopped. The reference image data SD0 and the first image data PD1 shown in the figure have a small difference in feature amount in the inspection area CA0 (the difference in the feature amount is less than a predetermined threshold value), and the determination unit 72 determines that there is no foreign object 92 in the inspection area CA0. It is determined that there is no In the same figure, the target board 90 has not yet been transferred to the next component mounting machine M3 on the downstream side of the component mounting machine M2, and the image data PD0 is shown blank.

In this way, the determining unit 72 can unconditionally determine the presence or absence of the foreign object 92 when the first image data PD1 is acquired by the acquiring unit 71. Thereby, the determining unit 72 can determine the presence or absence of foreign matter 92 adhering to the inspection area CA0 from the time the reference image data SD0 is acquired by the acquisition unit 71 until the board work is stopped. Further, as described below, the determining unit 72 can also determine the presence or absence of the foreign object 92 when a predetermined condition is satisfied. For example, the feature amount of the inspection area CA0 obtained by image processing the image data PD0 may change due to changes over time in the bonding member 93 for bonding the substrate 90 and the component 91, which is applied to the inspection area CA0 of the substrate 90. There is.

The joining member 93 is not limited as long as it is a member that joins the substrate 90 and the component 91. For example, solder, adhesive, etc. are included in the joining member 93. In the embodiment, bonding member 93 is solder. Solder changes color from silver to gray as the flux it contains dries. Therefore, the characteristic amount of the inspection area CA0 may change due to changes in the solder over time, and the determining unit 72 may erroneously determine that the solder is the foreign object 92.

Here, the time from when the board work is stopped until it is restarted is defined as the stop time Q0. In addition, a stop time Q0 is determined in which the bonding member 93 is not mistakenly determined to be a foreign object 92 even if the feature amount of the inspection area CA0 changes due to changes over time in the bonding member 93 that joins the substrate 90 and the component 91 applied to the inspection area CA0. Let the allowable time be T0. The shorter the stop time Q0 is than the allowable time T0, the less the component mounting machine M3 will be affected by changes over time in the bonding member 93 when determining the presence or absence of a foreign object 92, and the component mounting machine M2 will stop working on the board. The necessity of determining the presence or absence of foreign matter 92 is reduced.

On the other hand, if the stop time Q0 is longer than the allowable time T0, when determining the presence or absence of the foreign object 92 in the component mounting machine M3, it becomes more susceptible to changes over time in the joining member 93, and the determining unit 72 93 is likely to be mistakenly determined to be a foreign object 92. Therefore, it becomes increasingly necessary to determine the presence or absence of the foreign object 92 in the component mounting machine M2 where the work on the board has stopped. Therefore, the estimation unit 73 estimates the stop time Q0 from when the board work is stopped until it is restarted (step S13 shown in FIG. 4).

The estimation unit 73 only needs to be able to estimate the stop time Q0, and can take various forms. For example, the estimating unit 73 can estimate the stop time Q0 based on the reason why the board work was stopped (for example, the result of image processing of the image data PD0 is defective, etc.). In this case, the estimation unit 73 associates the cause of the stoppage of the board-related work with the stop time Q0 from when the board-related work is stopped until it is restarted each time the board product 900 is produced in advance. Remember. The stop time Q0 can be expressed by, for example, an average value, a median value, etc.

When the board work is stopped in the current production of the board product 900, the estimation unit 73 calculates the stop time Q0 (for example, average value or median value) stored in association with the cause of the stop of the board work. is output to the determination unit 72. The determining unit 72 can determine the presence or absence of the foreign object 92 when the estimating unit 73 estimates a stop time Q0 that is longer than the allowable time T0 (step S13 shown in FIG. 4).

Furthermore, for example, when a worker takes action when board work is stopped, the actual stop time Q0 may be longer than the stop time Q0 estimated by the estimation unit 73. Therefore, the determining unit 72 can also determine the presence or absence of the foreign object 92 when a stopping time Q0 longer than the allowable time T0 is expected after the estimating unit 73 estimates the stopping time Q0 within the allowable time T0. .

Note that the allowable time T0 can be obtained in advance by, for example, simulation or verification using an actual machine. Further, the allowable time T0 may vary depending on the type of the joining member 93, and the determining unit 72 can also use the allowable time T0 depending on the type of the joining member 93. For example, the determining unit 72 can use the allowable time T0 depending on the type of solder. Further, the determination unit 72 can use the allowable time T0 depending on the type of adhesive.

Furthermore, the higher the temperature inside the component mounting machine WM3, the faster the flux contained in the solder dries. Furthermore, the lower the humidity inside the component mounting machine WM3, the faster the flux contained in the solder dries. Therefore, the determining unit 72 can also use the allowable time T0 depending on at least one of the temperature and humidity inside the component mounting machine WM3 that mounts the component 91 on the board 90.

The guide unit 74 guides the operator to the presence of the foreign object 92 when the determining unit 72 determines that the foreign object 92 is present in the inspection area CA0 (if Yes in step S14 and step S15 shown in FIG. 4). The guide section 74 may take various forms as long as it can guide the operator to the presence of the foreign object 92. For example, the board-related work line WL0 of the embodiment includes an input/output device 80. The guide unit 74 can use the input/output device 80 to guide the operator to the presence of the foreign object 92 (for example, by display, voice guidance, etc.).

Specifically, the guide unit 74 guides the presence of the substrate 90 to which the foreign object 92 is attached, the position on the substrate 90 where the foreign object 92 is attached, the substrate-to-substrate working machine WM0 where the substrate 90 is present, etc. can do. Thereby, the operator can check the substrate 90 to which the foreign matter 92 is attached, and can take countermeasures (for example, carry out the substrate 90). Note that the guide unit 74 can also similarly guide the worker about the presence of the foreign object 92 (for example, by display, voice guidance, vibration, etc.) using a mobile terminal owned by the worker.

When the board work is restarted, the acquisition unit 71 images the inspection area CA0 to acquire the second image data PD2, and updates the reference image data SD0 with the second image data PD2 (steps shown in FIG. 4). If Yes in S16 and step S17). The second image data PD2 refers to the image data PD0 at the time when the board-related work is restarted. The acquisition unit 71 can image the inspection area CA0 and acquire the second image data PD2 at the timing when the board-related work is restarted, in the same way as when the board-related work is being performed normally. Thereby, the foreign object detection device 70 can acquire the image data PD0 at the time when the work for the substrate is restarted.

As described above, if the stop time Q0 from when the board work is stopped until it is restarted is longer than the allowable time T0, when determining the presence or absence of foreign matter 92 in the component mounting machine M3, the bonding member 93 becomes susceptible to changes over time, and the determining unit 72 tends to erroneously determine that the joining member 93 is a foreign object 92. Therefore, the acquisition unit 71 can update the reference image data SD0 with the second image data PD2 when the stop time Q0 is longer than the allowable time T0.

Furthermore, even if the stop time Q0 from when the board work is stopped until it is restarted is within the allowable time T0, the bonding member 93 has changed over time. Therefore, regardless of the stop time Q0, when the board work is restarted, the acquisition unit 71 images the inspection area CA0 to acquire the second image data PD2, and uses the second image data PD2 to image the reference image. Data SD0 can also be updated.

The determining unit 72 determines the presence or absence of a foreign object 92 based on the difference in the feature amount of the inspection area CA0 obtained by image processing the updated reference image data SD0 and inspection image data CD0, respectively (steps shown in FIG. 4). S18). The determining unit 72 can determine the presence or absence of the foreign object 92 in the same manner as when the board work is normally performed.

Specifically, the determination unit 72 determines that the difference between the feature amounts of the inspection area CA0 obtained from the two image data PD0 (in this case, the updated reference image data SD0 and the inspection image data CD0) exceeds a predetermined threshold. In this case, it is determined that there is a foreign object 92 in the inspection area CA0. The determining unit 72 determines that there is no foreign object 92 in the inspection area CA0 when the difference between the feature amounts is less than or equal to a predetermined threshold. Note that, as described above, the feature amount is not limited. The feature amount in the embodiment is the brightness of each pixel of the two image data PD0 (updated reference image data SD0 and inspection image data CD0).

FIG. 8 shows an example of the state of the board 90 after the board-related work is resumed. In the figure, using the first embodiment as an example, the state of the board 90 after the board work is restarted in the component mounting machine M2 is schematically shown using image data PD0. Specifically, in the component mounting machine M2 where the board-related work has been restarted, the acquisition unit 71 images the inspection area CA0 to obtain the second image data PD2 at the timing when the board-related work has been restarted. The reference image data SD0 is updated with the second image data PD2.

In the figure, the bonding member 93 is shown in black for convenience of illustration, and it schematically shows that the bonding member 93 has changed over time while the work for the substrate is stopped. Then, the board 90 is transported to the next component mounting machine M3 on the downstream side of the component mounting machine M2, and in the component mounting machine M3, the acquisition unit 71 acquires the inspection image data CD0. If the reference image data SD0 is not updated by the second image data PD2, the determination unit 72 updates the inspection area CA0 obtained by image processing the reference image data SD0 shown in FIG. 7 and the inspection image data CD0 shown in FIG. 8, respectively. The presence or absence of the foreign object 92 is determined based on the difference in the feature amounts.

In this case, the feature amount of the inspection area CA0 (the joining member 93 is white) obtained by image processing the reference image data SD0 shown in FIG. 7, and the inspection obtained by image processing the inspection image data CD0 shown in FIG. The feature amount of area CA0 (joining member 93 is black) has a large difference, and the difference in feature amount exceeds a predetermined threshold value. Therefore, the determining unit 72 incorrectly determines that the foreign object 92 is present in the inspection area CA0. On the other hand, when the reference image data SD0 is updated by the second image data PD2, the determination unit 72 updates the inspection area CA0 obtained by image processing the reference image data SD0 and the inspection image data CD0 shown in FIG. The presence or absence of the foreign object 92 is determined based on the difference in the feature amounts.

In this case, the feature amount of the inspection area CA0 (the joining member 93 is black) obtained by image processing the reference image data SD0 shown in FIG. 8, and the inspection obtained by image processing the inspection image data CD0 shown in FIG. There is little difference in the feature amounts of area CA0 (the joining member 93 is black), and the difference in feature amounts is less than or equal to a predetermined threshold value. Therefore, the determining unit 72 determines that there is no foreign object 92 in the inspection area CA0. In other words, erroneous determination of foreign matter 92 due to changes in bonding member 93 over time is suppressed. Note that FIG. 8 shows the state of the board 90 after the board work is resumed, and the image data PD0 of the component mounting machine M1 on the upstream side of the component mounting machine M2 is shown as blank.

The guide unit 74 guides the operator to the presence of the foreign object 92 when the determining unit 72 determines that the foreign object 92 is present in the inspection area CA0 (in the case of Yes in step S19 and step S20 shown in FIG. 4). The guide section 74 can inform the operator of the presence of the foreign object 92 in the same manner as when informing the operator of the presence of the foreign object 92 immediately after the board work is stopped. The control by the foreign object detection device 70 then ends once.

Note that in the case of No in step S11 and step S19 shown in FIG. 4, the control by the foreign object detection device 70 ends once. Moreover, in the case of No in step S14, the control by the foreign object detection device 70 proceeds to the control shown in step S16. Further, in the case of No in step S16, the control by the foreign object detection device 70 returns to the control shown in step S16, and waits until the work for the substrate is restarted.

Additionally, the items described in this specification can be combined and selected as appropriate. For example, in this specification, the first form is explained as an example, but the matters described in this specification can also be applied to the second form or the third form. Moreover, the matters described in this specification can also be applied to a form that combines the second form and the third form. In addition, in the third embodiment, since the board work is stopped when the board 90 is transported between the adjacent component mounting machines WM3, the first image data PD1 and the second image data are transferred between the adjacent component mounting machines WM3. An imaging device capable of acquiring image data PD2 is provided. Furthermore, in the first, second, and third embodiments, when the board-related work is normally performed without stopping, the inspection image data CD0 is acquired after the reference image data SD0 is acquired by the acquisition unit 71. It is possible to select a configuration in which the time required to complete the process is shorter than the previously described allowable time T0.

2. Foreign Matter Detection Method What has already been described about the foreign matter detection device 70 is also applicable to the foreign matter detection method. Specifically, the foreign object detection method includes an acquisition step and a determination step. The acquisition process corresponds to control performed by the acquisition unit 71. The determination process corresponds to control performed by the determination unit 72. Further, the foreign object detection method can include an estimation step. The estimation process corresponds to control performed by the estimation unit 73. The foreign object detection method can also include a guiding step. The guiding process corresponds to the control performed by the guiding section 74.

3. Example of Effects of Embodiment According to the foreign object detection device 70, it is possible to acquire first image data PD1, which is image data PD0 at the time when the work for the substrate is stopped. What has been described above regarding the foreign object detection device 70 also applies to the foreign object detection method.

70: Foreign object detection device, 71: Acquisition unit, 72: Judgment unit, 73: Estimation unit,
74: Guide part, 90: Board, 91: Components, 92: Foreign matter, 93: Joining member,
CA0: inspection area, PD0: image data, SD0: reference image data,
CD0: inspection image data, PD1: first image data,
PD2: second image data, Q0: stop time, T0: allowable time,
WM0: Board work machine, WM3: Component mounting machine.

Claims

A plurality of image data obtained by imaging at least a part of the inspection area of the board as the board-to-board work progresses by a board-to-board work machine that performs a predetermined board-to-board work on the board, and the same inspection area is imaged. an acquisition unit that acquires;
of the inspection area obtained by image processing the reference image data that is one image data of the plurality of image data and the inspection image data that is the image data of the inspection target acquired after the reference image data. a determination unit that determines the presence or absence of foreign matter adhering to the inspection area based on the difference in feature amounts;
Equipped with
When the board-facing work is stopped between acquiring the reference image data and acquiring the inspection image data, the acquisition unit is configured to image the inspection area and detect the point at which the board-facing work stops. A foreign object detection device that acquires first image data that is image data of.
The foreign object according to claim 1, wherein the determination unit determines the presence or absence of the foreign object based on the difference in the feature amount of the inspection area obtained by image processing the reference image data and the first image data, respectively. Detection device.
The foreign object detection device includes an estimation unit that estimates a stop time from when the board-related work is stopped until it is restarted,
The determination unit determines an allowable time period in which the bonding member is not mistakenly determined to be the foreign object even if the characteristic amount of the inspection area changes due to changes over time in the bonding member that is applied to the inspection area and that bonds the substrate and the component. The foreign object detection device according to claim 2, wherein the presence or absence of the foreign object is determined when the stop time is estimated to be longer than .
The foreign object detection device includes an estimation unit that estimates a stop time from when the board-related work is stopped until it is restarted,
The determination unit determines an allowable time period in which the bonding member is not mistakenly determined to be the foreign object even if the characteristic amount of the inspection area changes due to changes over time in the bonding member that is applied to the inspection area and that bonds the substrate and the component. 3. The foreign object detection device according to claim 2, wherein the presence or absence of the foreign object is determined when the stop time is estimated to be longer than the allowable time after the stop time is estimated.
The foreign object detection device includes a guide section that guides an operator to the presence of the foreign object when the judgment section determines that the foreign object is present in the inspection area. The foreign object detection device described in Section 1.
When the board-facing work is restarted, the acquisition unit captures an image of the inspection area to obtain second image data that is image data at the time when the board-facing work is restarted, The foreign object detection device according to claim 1, wherein the reference image data is updated by:.
The acquisition unit is configured to determine an allowable time period in which the bonding member is not erroneously determined to be the foreign object even if the characteristic amount of the inspection area changes due to a change over time of the bonding member that is applied to the inspection area and that bonds the substrate and the component. 7. The foreign object detection device according to claim 6, wherein the reference image data is updated by the second image data when the stop time from when the board work is stopped until it is restarted is longer than the above.
The determination unit determines the presence or absence of the foreign object based on the difference in the feature amount of the inspection area obtained by image processing the updated reference image data and the inspection image data, respectively. The foreign object detection device according to item 7.
The determination unit determines that the foreign object is present in the inspection area when the difference between the feature quantities of the inspection area obtained from two image data exceeds a predetermined threshold, and the determination unit determines that the foreign object is present in the inspection area, and the difference between the feature quantities The foreign object detection device according to claim 1, wherein the foreign object detection device determines that the foreign object is not present in the inspection area if the amount is equal to or less than a predetermined threshold value.
The foreign object detection device according to claim 9, wherein the feature amount is the luminance of each pixel of two image data.
The board is sequentially conveyed to a plurality of component mounting machines, which are the board-to-board working machines, and a plurality of components are mounted thereon,
The acquisition unit acquires the reference image data in the most upstream component mounting machine of the plurality of component mounting machines, and acquires the inspection image data in a component mounting machine that mounts the component in the inspection area. ,
The foreign object detection device according to claim 1, wherein the determination unit determines whether or not the foreign object adheres to the inspection area while the board is being transported through the plurality of component mounting machines.
The board is sequentially conveyed to a plurality of component mounting machines, which are the board-to-board working machines, and a plurality of components are mounted thereon,
The acquisition unit acquires the reference image data and the inspection image data in each of the plurality of component mounting machines,
The foreign object detection device according to claim 1, wherein the determination unit determines whether or not the foreign object is attached to the inspection area in each of the plurality of component mounting machines.
The board is sequentially conveyed to a plurality of component mounting machines, which are the board-to-board working machines, and a plurality of components are mounted thereon,
The acquisition unit acquires the reference image data in one of the plurality of component placement machines, and acquires the inspection image data in a next component placement machine downstream of the component placement machine. ,
2. The foreign object detection device according to claim 1, wherein the determination unit determines whether or not the foreign object adheres to the inspection area when the board is transferred between adjacent component mounting machines.
A plurality of image data obtained by imaging at least a part of the inspection area of the board as the board-to-board work progresses with the progress of the board-to-board work by a board-to-board work machine that performs a predetermined board-to-board work on the board. an acquisition process to acquire;
of the inspection area obtained by image processing the reference image data that is one image data of the plurality of image data and the inspection image data that is the image data of the inspection target acquired after the reference image data, respectively. a determination step of determining the presence or absence of foreign matter adhering to the inspection area based on the difference in feature amounts;
Equipped with
In the acquisition step, if the board-facing work is stopped between acquiring the reference image data and acquiring the inspection image data, the point at which the board-facing work is stopped after imaging the inspection area is performed. A method for detecting a foreign object that obtains first image data that is image data.