JP5144599B2 - Mounting method of electronic parts - Google Patents

Description

  The present invention relates to an electronic component mounting method for mounting a small electronic component and a large electronic component on an electronic component mounting surface of a substrate.

  Conventionally, it is necessary to mount small electronic components such as ICs, resistors and capacitors, and large electronic components such as BGA (Ball Grid Array) and QFP (Quad Flat Package) on a substrate such as a printed circuit board. This is done using a mounting device. Such an electronic component mounting apparatus is provided with an imaging device, and whether or not foreign matter adheres to the electronic component mounting surface of the substrate from the image of the substrate imaged by the imaging device, the suitability of the mounting state of the electronic component, etc. Is determined (see, for example, Patent Document 1).

  This electronic component mounting device (mounting component inspection device) includes an imaging unit that moves in the X-axis direction by driving the X-axis table unit, a light projecting unit, and a conveyor that moves in the Y-axis direction by driving the Y-axis table unit. I have. In addition, the light projecting unit includes a light source and a light shielding unit, and the light source is installed so that light having a predetermined incident angle can be irradiated from all directions to the observation position. For this reason, the substrate on which the electronic component is mounted is supported on the conveyor, transported to the observation position, and in that state, the electronic component is imaged while being irradiated with the light source, so that the electronic component mounted between the leads is mounted between the leads. It can be determined whether or not there is solder scrap.

JP 2000-252700 A

  However, since the conventional electronic component mounting apparatus described above does not inspect the substrate before the electronic component is mounted, when there is an abnormality such as adhesion of foreign matter to the substrate before the electronic component is mounted. In some cases, normal mounting of electronic components is not performed. In particular, when a foreign matter such as solder scraps is hidden on the lower surface of the electronic component, the abnormality cannot be confirmed by an appearance inspection in a later process. That is, the above-described conventional electronic component mounting apparatus is for determining whether or not foreign matter such as solder scraps is attached to the substrate on which the electronic component is mounted, and cannot prevent the generation of a defective substrate. .

  The present invention has been made to cope with such a problem. The purpose of the present invention is to confirm whether the area for mounting the large electronic component on the board is normal before mounting the large electronic component such as BGA or QFP. It is an object of the present invention to provide an electronic component mounting method capable of preventing generation of a defective substrate by inspecting whether or not.

In order to achieve the above-described object, the structural feature of the electronic component mounting method according to the present invention is that an area for mounting a small electronic component and a large electronic component using two electronic component mounting apparatuses equipped with an imaging device are provided. and a region for mounting the, the electronic component mounting surface of the large electronic components group region attached is divided into a plurality of sections of plate, mounting of the electronic component mounting large electronic components after mounting the small-sized electronic part An initial imaging step of imaging with a imaging device a portion where a large electronic component is mounted on an electronic component mounting surface of a substrate before both electronic components are mounted, and a small electronic component on the electronic component mounting surface of the substrate A small electronic component mounting process for mounting a small electronic component on the mounting portion, and a comparative imaging device for capturing an image of a portion on the electronic component mounting surface of the substrate on which the small electronic component is mounted with the imaging device Comparing the image captured in the initial imaging process with the image captured in the comparative imaging process to determine whether or not both images are the same; A large electronic component mounting process in which a large electronic component is mounted on a portion where the large electronic component is mounted on the electronic component mounting surface of the board, which has been determined to be a difference that cannot be recognized by image comparison. The initial image and the comparative image are captured by the imaging device of the component mounting device, the comparative image is captured by the imaging device of the other electronic component mounting device, and the comparative image captured by the imaging device of the one electronic component mounting device is It was used as the initial image for comparison with the comparison image taken by the other electronic component mounting apparatus, further imaging of the portion for mounting the large-size electronic components, mounting the large electronic components It is to be performed by imaging each section in a state of being overlapped with the boundary portion between the compartments adjacent band.

  In the electronic component mounting method according to the present invention, before the small electronic component is mounted on the substrate, that is, after the solder pattern is provided by printing on a predetermined portion of the electronic component mounting surface of the substrate, First, an image of the part mounting part is imaged by an imaging device. Next, after mounting the small electronic component on the portion on the electronic component mounting surface of the substrate on which the small electronic component is mounted, the imaging device again images the portion on which the large electronic component is mounted on the electronic component mounting surface. . Then, the captured image before mounting the small electronic component is compared with the captured image after mounting the small electronic component, and it is determined whether the both captured images are the same, that is, whether there is a defect. Defects in this case include adhesion of foreign matter to a portion where a large electronic component is mounted on the electronic component mounting surface of the substrate, solder pattern failure, and the like.

  For this reason, when a defect has occurred on the substrate after mounting the small electronic component, it is possible to mount the large electronic component after performing a process of removing the defect. As a result, it is possible to prevent the generation of defective substrates. In addition, it takes a long time to image the entire electronic component mounting surface of the substrate and all the electronic components of the small electronic component and the large electronic component with each imaging process and determine the presence or absence of defects. In the present invention, since only the portion on which a large electronic component that is particularly important for inspection is imaged is determined to determine whether there is a defect, the processing time can be shortened and the production efficiency can be improved.

When the electronic component mounting device that mounts small electronic components on the board is different from the electronic component mounting device that mounts large electronic components on the substrate, the small electronic components are mounted for imaging after mounting the small electronic components. You may image with the imaging device with which the electronic component mounting apparatus equipped is equipped, and you may image with the imaging device with which the electronic component mounting device which mounts | wears a large electronic component. Moreover, it is preferable to compare the captured image before mounting the small electronic component and the captured image after mounting the small electronic component as a comparison of the image data image-processed by the image processing apparatus . In addition, according to the present invention, since the portion for mounting the small electronic component and the portion for mounting the large electronic component on the electronic component mounting surface of the substrate are clearly separated, a series of processing can be performed smoothly. Furthermore, according to the present invention, proper imaging can be performed even when the region where the large electronic component is mounted is wider than the field of view of the imaging device. In this case, the size of the overlap between adjacent sections is such that when a defective portion is located at an intermediate position between two adjacent sections, the defective portion is necessarily present in the captured image of both sections or one of the sections. It is set so that the minimum area that can be included can be secured.

In addition, another structural feature of the electronic component mounting method according to the present invention is that after mounting a small electronic component on the electronic component mounting surface of the substrate using two electronic component mounting apparatuses provided with an imaging device. An electronic component mounting method for mounting a large electronic component on the substrate, an initial imaging step of imaging the electronic component mounting surface of the substrate before both electronic components are mounted with an imaging device of one electronic component mounting device, and the substrate A small electronic component mounting process for mounting some of the small electronic components on the electronic component mounting surface of the electronic component mounting surface, and mounting one electronic component on the electronic component mounting surface of the substrate on which the small electronic components are mounted The comparative imaging process for imaging with the imaging device of the apparatus, the part excluding the part where the small electronic component is mounted in the image captured in the initial imaging process, and the small electronic component in the image captured in the comparative imaging process is mounted Part And a determination step for determining whether or not the two images are the same, and in the determination step, it is determined that the two images are the same or a difference that cannot be recognized by comparing the images. After that, an initial imaging step of imaging the electronic component mounting surface of the substrate on which some electronic components are mounted with the imaging device of the other electronic component mounting device; A small electronic component mounting process for mounting the remaining small electronic components, a comparative imaging process for imaging the electronic component mounting surface of the board on which all the small electronic components are mounted, with the imaging device of the other electronic component mounting apparatus, and the other electronic An image captured in the initial imaging process using the imaging device of the component mounting device is captured in the comparative imaging process using the imaging device of the other electronic component mounting device, except for a portion where a small electronic component is mounted. A determination step of determining whether or not both images are the same by comparing a portion excluding a portion where a small electronic component is mounted in the obtained image, and an imaging device of the other electronic component mounting device in the determination step e Bei a large electronic component mounting step of mounting large electronic components on a substrate in which both the images is determined to the same or the difference is closely enough to not be recognized by the comparison of the images captured using the electronic component mounting substrate An area for mounting a small electronic component and an area for mounting a large electronic component are provided on the surface. The small electronic component is mounted on an area for mounting a small electronic component, and the large electronic component mounts a large electronic component. In addition, the area in which the large electronic component is to be mounted is divided into a plurality of sections, and the areas in which the large electronic components are to be mounted are imaged in a state where the boundary between adjacent sections is overlapped. I It lies in the fact that.

In the present invention, in order to determine the presence or absence of defects by imaging not only the part where the large electronic component is mounted on the electronic component mounting surface of the substrate, but also all the remaining parts except the part where the small electronic component is mounted, It is also possible to find a defect that has occurred in a portion other than the portion where both electronic components are mounted on the electronic component mounting surface of the substrate . In addition, according to the present invention, since the portion for mounting the small electronic component and the portion for mounting the large electronic component on the electronic component mounting surface of the substrate are clearly separated, a series of processing can be performed smoothly. Furthermore, according to the present invention, proper imaging can be performed even when the region where the large electronic component is mounted is wider than the field of view of the imaging device. In this case, the size of the overlap between adjacent sections is such that when a defective portion is located at an intermediate position between two adjacent sections, the defective portion is necessarily present in the captured image of both sections or one of the sections. It is set so that the minimum area that can be included can be secured.

In addition, other structural features of the electronic component mounting method according to the present invention include a region for mounting a small electronic component and a region for mounting a large electronic component using two electronic component mounting apparatuses including an imaging device. with the door, on the large electronic component mounting surface of the electronic area for mounting the component is divided into a plurality of compartments board, there in mounting method of the electronic component mounting large electronic components after mounting the small-sized electronic part An initial imaging step of imaging a predetermined portion including at least a portion for mounting a large electronic component on an electronic component mounting surface of the substrate before both electronic components are mounted with an imaging device of one of the electronic component mounting devices; The small electronic component mounting process for mounting some of the small electronic components on the portion where the small electronic components are mounted on the electronic component mounting surface, and mounting of the electronic components on the substrate on which the small electronic components are mounted surface A comparison imaging step of imaging a predetermined portion including at least a portion for mounting a large electronic component with an imaging device of one electronic component mounting device, a portion for mounting the large electronic component in the image captured in the initial imaging step, Compared with the part where the large electronic component is mounted in the image captured in the comparative imaging process, the determination process for determining whether or not both images are the same, and in the determination process, both the images are the same or different. A small electronic component mounting process for mounting the remaining small electronic components among the small electronic components on the electronic component mounting surface of the board after it is determined that the difference is not recognized by comparison, and all the small electronic components are mounted A comparative imaging step of imaging the electronic component mounting surface of the printed circuit board with the imaging device of the other electronic component mounting device, and comparative imaging using the imaging device of the one electronic component mounting device Compare the portion where the large electronic component in the image captured in the process is mounted with the portion where the large electronic component is mounted in the image captured in the comparative imaging step using the imaging device of the other electronic component mounting device, A determination step for determining whether or not both images are the same, and a substrate determined in the determination step that the images captured in both comparative imaging steps are the same or a difference that cannot be recognized by image comparison area e Bei a large electronic component mounting step of mounting the large electronic components in a portion of mounting the large electronic components, furthermore, the imaging of the portion for mounting the large electronic components, mounting the large electronic components in the electronic component mounting surface of the This is to be performed by imaging each section in a state where boundary portions between adjacent sections are overlapped .

  In the electronic component mounting method according to the present invention, before mounting a small electronic component on a substrate, that is, after a solder pattern is provided by printing on a predetermined portion of the electronic component mounting surface of the substrate, at least a large size on the electronic component mounting surface is provided. A predetermined part including a part for mounting an electronic component is first imaged by an imaging device, and after mounting the small electronic component on the part for mounting the small electronic component on the electronic component mounting surface of the substrate, the electronic component is again used by the imaging device. A predetermined portion including at least a portion on which a large electronic component is mounted on the mounting surface is imaged. In this case, the predetermined part of the electronic component mounting surface imaged in the initial imaging process and the comparative imaging process may be the same or different.

  For example, the entire electronic component mounting surface may be imaged in the initial imaging process, and only the part where the large electronic component is mounted may be imaged in the comparative imaging process, or only the part where the large electronic component is mounted in the initial imaging process. Then, the entire electronic component mounting surface may be imaged in the comparative imaging process. According to this, the determination performed in the determination step includes a portion where the large electronic component is mounted in the captured image before mounting the small electronic component and a portion where the large electronic component is mounted in the captured image after mounting the small electronic component. In comparison, even if it is determined whether the two captured images are the same, it is possible to check the entire state of the electronic component mounting surface before or after mounting the small electronic component. That is, the predetermined part of the electronic component mounting surface imaged in the initial imaging process and the comparative imaging process in this case is appropriately set within the entire range of the electronic component mounting surface from only the part where the large electronic component is mounted. Can do.

Further, in the mounted how the electronic component according to the present invention, the electronic component mounting face of the substrate, a region for mounting small electronic parts, and equipped with an area for mounting the large electronic components, small electronic components is small electronic is mounted in a region for mounting components, Ru is mounted in a region large electronic components are mounted large electronic components. According to this, since the portion for mounting the small electronic component and the portion for mounting the large electronic component on the electronic component mounting surface of the substrate are clearly separated, a series of processing can be performed smoothly . Further, in the electronic component mounting method according to the present invention, the region where the large electronic component is mounted is divided into a plurality of sections and the boundary between the adjacent sections is overlapped. Each section is imaged. According to this, proper imaging can be performed even when the region where the large electronic component is mounted is wider than the field of view of the imaging device. In this case, the size of the overlap between adjacent sections is such that when a defective portion is located at an intermediate position between two adjacent sections, the defective portion is necessarily present in the captured image of both sections or one of the sections. It is set so that the minimum area that can be included can be secured.

  In addition, another structural feature of the electronic component mounting method according to the present invention is that the area for mounting the large electronic component includes a predetermined mounting position of the large electronic component and a large size stored in advance by the storage means. It is to be specified by the calculation means calculating based on the shape data of the electronic component. According to this, it becomes possible to automatically specify a region where a large electronic component is to be mounted, and appropriately obtain an imaging region even when the mounting position of the large electronic component on the substrate or the size of the large electronic component is changed. be able to.

Further, another structural feature of the electronic component mounting method according to the present invention is that the substrate is provided with a fiducial mark serving as a reference point, and the reference position of the substrate is the fiducial mark by the imaging device. It is to be recognized based on the imaging. In general, in an electronic component mounting apparatus, an imaging device for recognizing a substrate position is held in a head unit. According to the present invention, imaging of a fiducial mark and imaging of an electronic component mounting surface are performed with this imaging device. And can be done. For this reason, it is not necessary to newly provide an imaging device, and the electronic component mounting method according to the present invention can be executed using an inexpensive and compact electronic component mounting apparatus . Furthermore, in the present invention, it is preferable that the two electronic component mounting apparatuses can communicate with each other via a network.

It is the top view which showed the electronic component mounting apparatus used in 1st Embodiment of this invention. It is the block diagram which showed the electronic component mounting apparatus. It is the flowchart which showed the execution program. It is explanatory drawing which showed each division when imaging the area | region which mounts a large sized electronic component. It is explanatory drawing which showed the state which expanded each division of the imaged area | region. It is explanatory drawing which showed each division when taking the comparative image of the area | region which mounts a large sized electronic component. It is explanatory drawing which showed the method of calculating | requiring the difference of an initial image and a comparison image. It is explanatory drawing which showed the electronic component mounting apparatus used in 2nd Embodiment of this invention. It is explanatory drawing which showed the electronic component mounting apparatus used in 3rd Embodiment of this invention.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. 1 and 2 show an electronic component mounting apparatus 10 used in the embodiment. The electronic component mounting apparatus 10 includes a plurality of small electronic components B (see FIGS. 8 and 9) made of an IC, resistors, capacitors, etc. on a substrate A, and one large electronic component made of BGA, QFP, or the like. It is an apparatus for mounting C (see FIGS. 8 and 9). The electronic component mounting apparatus 10 includes a pair of conveyors 12 for moving the board A in the X direction (left and right direction in FIG. 1) above the base 11 and installing the board A in a preset installation unit. And a small electronic component supply unit 14a, 14b composed of a plurality of tape feeders for supplying the small electronic component B. And a large electronic component supply unit 15 for supplying the large electronic component C.

  The pair of conveyors 12 extends on the base 11 in the left-right direction with a constant interval in the front-rear direction according to the length in the front-rear direction of the substrate A, and the transport unit is moved by the operation of the transport motor 12a. The plurality of substrates A are sequentially transferred to the installation unit. When the installation of the small electronic component B and the large electronic component C on the board A is completed in the installation section, the board A is transported downstream. In addition, a pair of Y rail units 16 extend in the front-rear direction at a predetermined interval above the pair of conveyors 12 on the left and right sides of the base 11, and an X rail unit 17 is attached to the pair of Y rail units 16. It is stretched in a state where it can move in the front-rear direction. The head unit 13 is attached to the X rail unit 17 so as to be movable in the left-right direction.

  The Y rail unit 16 is provided with a drive device including a Y-axis motor 16a and a ball screw 16b. The X rail unit 17 is moved in the front-rear direction by driving of the drive device of the Y rail unit 16. Further, the X rail unit 17 is provided with a drive device including an X axis motor 17 a and a ball screw 17 b, and the head unit 13 moves in the left-right direction by driving the drive device of the X rail unit 17. The head unit 13 includes a plurality of component suction heads 13a that are movable in the Z direction (up and down direction) and rotatably supported around the Z axis (rotation direction), and the plurality of component suction heads 13a. A component suction nozzle 13b that is provided and sucks the small electronic component B and the large electronic component C is provided.

  Further, the head unit 13 includes a substrate recognition camera 18 that images the upper surface of the substrate A and an illumination device 19. The substrate recognition camera 18 and the illumination device 19 are fixed to the head unit 13 and move together with the head unit 13. The substrate recognition camera 18 is used for confirming the installation position of the substrate A, determining whether the small electronic component B and the large electronic component C mounted on the substrate A are appropriate, and the like. Irradiates the part imaged by the substrate recognition camera 18 so that a clear image can be obtained.

  Further, the head unit 13 includes a Z-axis motor 13c that individually lifts and lowers the plurality of component suction heads 13a, and an R-axis motor 13d that individually rotates the plurality of suction heads 13a in the rotation direction. Therefore, the head unit 13 can move on the base 11 within the movable range of the X rail unit 17 between the pair of Y rail units 16, and each suction head 13a can move in the vertical direction and around the Z axis. Can rotate in the direction. Further, the suction nozzle 13b sucks and picks up the small electronic component B and the large electronic component C with the suction force generated by the operation of the suction device (not shown), and moves above the substrate A by the movement of the head unit 13. Thereafter, the small electronic component B and the large electronic component C are mounted on a predetermined portion of the substrate A by releasing the suction by the suction device.

  Then, the board recognition camera 18 images the board A before the small electronic component B is mounted and the board A after the small electronic component B is mounted. It is used to judge the quality of the substrate A. In this case, a solder pattern is applied by printing on the area where the small electronic component B and the large electronic component C are mounted on the surface of the substrate A before the small electronic component B is mounted, and this solder pattern is printed. By comparing the image of the surface of the substrate A and the image of the substrate A on which the small electronic component B is mounted, foreign matter may adhere to the surface of the substrate A, particularly the region where the large electronic component C is mounted. Then, it is determined whether or not the solder pattern is broken.

  The small electronic component supply units 14 a and 14 b are arranged on both the front and rear sides of the pair of conveyors 12, and the small electronic component supply unit 14 a is arranged over substantially the entire area on the front side between the pair of Y rail units 16. The small electronic component supply unit 14 b is disposed on the right side portion on the rear side between the pair of Y rail units 16. And the large-sized electronic component supply part 15 is arrange | positioned in the left side part in the rear part side between a pair of Y rail units 16. FIG. The small electronic component supply units 14a and 14b and the large electronic component supply unit 15 are arranged with the small electronic component B and the large electronic component C taken out from the conveyor 12 side, respectively. The electronic component C is conveyed from the position away from the conveyor 12 to the conveyor 12 side.

  The electronic component mounting apparatus 10 includes various apparatuses shown in FIG. 2 in addition to the apparatus described above. That is, a CPU board 20 having a CPU having a function as a control unit of the electronic component mounting apparatus 10, a motor controller 21 connected to the CPU board 20, an image input board 22, a lighting controller 23, various I / O 24, a CRT 25, A storage device 26 and an input device 27 are provided. The motor controller 21 also has a function as calculation means according to the present invention. The motor controller 21 is connected to a motor amplifier 21a. The motor amplifier 21a includes the above-described transport motor 12a, Y-axis motor 16a, X-axis motor 17a, Z-axis motor 13c, and R-axis motor 13d. It is connected. The motor controller 21 is operated by the control of the CPU board 20 and controls driving of various motors such as the transport motor 12a via the motor amplifier 21a.

  The image input board 22 is connected to the board recognition camera 18, performs image processing on the captured image of the board recognition camera 18, and displays the image on the CRT 25 under the control of the CPU board 20. The illumination controller 23 is connected to the illumination device 19 and controls the irradiation amount of the illumination device 19 under the control of the CPU board 20. The various I / Os 24 are connected to a suction device for operating the suction nozzle 13b and various sensors. The suction device is operated by the control of the CPU board 20 and sucks the small electronic component B and the large electronic component C to the suction nozzle 13b. A predetermined sensor among the various sensors detects the pressure of the suction nozzle 13b when the suction nozzle 13b sucks the small electronic component B or the large electronic component C by the operation of the suction device.

  Thereby, it is possible to determine whether the suction state of the small electronic component B or the large electronic component C by the suction nozzle 13b is good. The storage device 26 stores various types of data such as various types of programs including an execution program, which will be described later, and shape data of the small electronic component B and the large electronic component C. The input device 27 includes a keyboard or the like, and inputs for selecting a program stored in the storage device 26, various data, and the like are input. Part of the data input to the input device 27 is stored in the storage device 26. The CPU board 20 operates the motor controller 21 and the like based on the execution program stored in the storage device 26, various data, and the input data of the input device 27. Although not shown, the pair of conveyors 12 is provided with a clamp device for fixing the substrate A to the installation portion, and an alarm that emits a warning sound in a predetermined part of the electronic component mounting device 10 is provided. Is installed.

  The processing when the small electronic component B and the large electronic component C are mounted on the surface of the substrate A using the electronic component mounting apparatus 10 configured as described above is performed by the CPU board 20 using the program shown in FIG. Done by running. This program is stored in the storage device 26 together with other programs. The operator inputs an instruction to select the program corresponding to the board A to be used from each program to the input device 27, and turns on the start switch. It is executed afterwards.

  That is, after the board A is installed at the upstream end of the pair of conveyors 12, when power is supplied to the electronic component mounting apparatus 10 and the start switch is turned on, the small electronic component B and the large electronic component are supplied to the board A. A program for wearing C is started in step 100. In step 102, the substrate A is conveyed to the installation unit by driving the pair of conveyors 12, and when the substrate A reaches the installation unit, the substrate A is fixed to the installation unit by the clamp device. Next, the program proceeds to step 104 where the fiducial mark provided on the substrate A is imaged by the substrate recognition camera 18.

  This fiducial mark is, for example, a mark provided at one of the four corners of the surface of the substrate A, and indicates the reference point of the substrate A. Thereby, the installation position of the board | substrate A is confirmed. If the position of the fiducial mark deviates from the reference point of the installation part, the fiducial mark and the reference point of the installation part are corrected so as to match. Next, the program proceeds to step 106, and an initial image of the substrate A is captured as an initial imaging process of the present invention. Here, an image of a region where the large electronic component C is mounted on the surface of the substrate A is taken. In this case, BGA is used as the large electronic component C.

  As shown in FIGS. 1 and 2, the surface of the substrate A is provided with a region A1 for mounting the small electronic component B and a region A2 for mounting the large electronic component C. In addition, dot-like solder patterns are respectively formed on the portion where the small electronic component B is mounted in the region A1 and the portion corresponding to the electrode of the large electronic component C in the region A2. As shown in FIG. 4, the imaging of the area A2 is performed for each section by setting the nine sections by dividing the area A2 into three columns on the left and right and front and rear. In this case, imaging is performed in the order from the left partition to the right partition in the upper row in the area A2 shown in FIG. 4, and then the imaging is performed in the order from the left partition to the right partition in the center row. Assume that imaging is performed in order from the left section to the right section in the lower row. Then, each section is referred to as section 1 to section 9 in the order of the sections where imaging is performed.

  The position of the area A2 in which the large electronic component C is mounted, the number of the divided sections 1 to 9, the processing order, and the like are automatically determined based on programs and data stored in the storage device 26 in advance. The program is based on the operator selection described above. Further, in the imaging of the sections 1 to 9, the sections 1 to 9 are sequentially imaged so that the adjacent sections are overlapped with each other, and the captured images are subjected to image processing by the image input board 22 and image data. Is stored in the storage device. In step 106, first, the head unit 13 moves so that the board recognition camera 18 is positioned above the section 1 in the area A2, and the board recognition camera 18 images the section 1.

  Next, the program proceeds to step 108, and it is determined whether or not the initial image acquisition has reached a specified number of times (the number of inspection parts × the number of sections of the area A2). In this case, since one large electronic component C is mounted in the area A2 and the number of sections is 9, the specified number of times is 9. Here, since only the initial image acquisition of section 1 has been performed yet, it is determined as “No” in step 108, and the process proceeds to step 106. In step 106, the head unit 13 moves so that the board recognition camera 18 is positioned above the section 2 in the area A2, and the board recognition camera 18 images the section 2. Then, again, the program proceeds to step 108, and it is determined whether or not the initial image acquisition has reached the specified number of times.

  In this way, the processes of steps 106 and 108 are repeated until the image capturing of the sections 1 to 9 is completed. During this time, each process of moving the substrate recognition camera 18, capturing, converting the captured image, and storing the image data is performed. Is repeated. When the imaging of all the initial images in the sections 1 to 9 is completed, “Yes” is determined in step 108, and the program proceeds to step 110. In addition, when it expands so that each imaged divisions 1-9 may not overlap, it will be in the state shown in FIG. In step 110, a process of mounting the small electronic component B on the area A1 of the substrate A is performed.

  In this process, while the head unit 13 moves between any part of the small electronic component supply units 14a and 14b and the installation unit, the adsorption head 13a adsorbs the small electronic component B or the small electronic component between them. This is performed by repeatedly releasing the adsorption of the component B. By this processing, the small electronic components B are respectively mounted on the upper surface of the solder pattern formed in the region A1. When the small electronic component B is mounted in the area A1, the program proceeds to step 112, and a comparative image of the substrate A is captured as a comparative imaging process of the present invention. Here, the same processing as the imaging performed in the processing of step 106 described above is performed.

  As shown in FIG. 4, the imaging in step 112 is also performed in the order of the left partition in the upper row and the right partition in the area A2, as shown in FIG. 4, and then the left partition in the center row. The imaging is performed in the order from the right partition to the right partition, and finally, the imaging is performed in the order from the left partition to the right partition in the lower row. That is, when the small electronic component B is mounted after the initial image has been captured, foreign objects or the like may adhere to the region A2 or the solder pattern may be damaged. This is performed to determine whether or not there is. In step 112, the head unit 13 moves so that the board recognition camera 18 is positioned above the section 1 in the area A2, and the board recognition camera 18 images the section 1.

  Next, in step 114, a process for comparing the initial image of section 1 and the comparative image is performed. In this case, the data of the initial image of the section 1 stored in the storage device 26 is read, and the data of the initial image and the comparison image captured in step 112 are compared. Then, in step 116, it is determined whether or not the compared inspection result is normal, that is, whether or not the difference is within the same or allowable range. Here, it is assumed that the allowable range difference is a small difference that cannot be recognized by comparing the images. If the inspection result is normal, “Yes” is determined in step 116, and the program proceeds to step 118.

  In step 118, it is determined whether or not the comparison image acquisition has reached a specified number of times (the number of inspection parts × the number of sections of the area A2). Here, since only the comparison image acquisition of the section 1 has been performed yet, it is determined as “No” in Step 118 and the process proceeds to Step 112. In step 112, the head unit 13 moves so that the board recognition camera 18 is positioned above the section 2 in the area A2, and the board recognition camera 18 images the section 2. Then, again, the program proceeds to step 114, and it is determined whether or not the comparison image acquisition has reached the specified number of times.

  In this way, the processing of steps 112 to 118 is repeated until the comparison images of the sections 1 to 9 are completed. During that time, whether the movement, imaging, comparison inspection, and inspection results of the substrate recognition camera 18 are normal. Each of the determination processes is repeated. If all the comparison images in the sections 1 to 9 are normal and it is determined “Yes” in step 118, the program proceeds to step 120. In step 120, a process of mounting the large electronic component C on the area A2 of the substrate A is performed.

  In this process, after the head unit 13 moves to the large electronic component supply unit 15 side, the suction head 13a sucks the large electronic component C, and the head unit 13 further moves above the substrate A, the suction head 13a. Is performed by releasing the suction of the large electronic component C and mounting the large electronic component C in the region A2 of the substrate A. When the large electronic component C is mounted in the area A2, the program proceeds to step 122, where the process of releasing (unclamping) the substrate A by the clamping device is performed, and the substrate A is downstream of the pair of conveyors 12. Conveyed to the side. Then, the process proceeds to step 124 and the program ends. Thus, the mounting of the small electronic component B and the large electronic component C on the substrate A is completed.

  Further, if the entire comparison image includes foreign matters in the sections 1 and 8, for example, as shown in FIG. 6, a comparison image including foreign matters is acquired in the process of the first step 112. It is determined as “No”. In this case, as shown in the uppermost stage of FIG. 7, the difference between the initial image of section 1 and the comparative image of section 1 is calculated, and the difference is obtained as a foreign object. That is, since there is no foreign object in the initial image of section 1 and there is a foreign object in the comparison image of section 1, it is determined that there is an abnormality (foreign object found), and the program proceeds to step 126.

  In step 126, the alarm generates an operator call (warning sound) for warning the abnormality, and each device of the electronic component mounting device 10 temporarily stops its operation. Then, while each device of the electronic component mounting device 10 is not operating, a determination is made as to whether correction is possible or not by the operator (step 128). In this case, if the foreign matter can be removed by manual work or the like, a correction work for removing the foreign matter is performed (step 130), and if the correction cannot be made, the substrate A is rejected (excluded) (step 132). When the correction work for the substrate A is performed, a predetermined restart switch is turned on after the correction work to resume the execution of the program.

  This causes the program to proceed to step 118. In step 118, it is determined whether the comparison image acquisition has reached a specified number of times. Here, since only the comparison image acquisition of the section 1 has been performed yet, it is determined as “No” in Step 118 and the process proceeds to Step 112. Next, the processing of steps 112 to 118 is performed for the sections 2 to 9. In the processing from section 2 to section 7, since the initial image and the comparison image are the same, all are determined to be normal. In the processing of section 8, since there is no foreign object in the initial image and there is a foreign object in the comparison image, it is determined that there is an abnormality (foreign object found) in step 116, and the process proceeds to step 126.

  In steps 126 to 132, when the above-described processing is performed and foreign matter can be removed by manual work or the like, correction work for removing the foreign matter is performed (step 130). Reject (exclude) (step 132). When the correction work for the substrate A is performed, the restart switch is turned on to resume the execution of the program. As a result, the program proceeds to step 118 and then proceeds to step 112 to perform processing for capturing a comparison image of the section 9. In section 9, since the initial image and the comparison image are the same, it is determined as normal (OK). Then, after determining “Yes” in step 118, in step 120, a process of mounting the large electronic component C on the area A 2 of the substrate A is performed.

  When the large electronic component C is mounted in the area A2, the program proceeds to step 122, where the process of releasing the fixation of the substrate A by the clamping device is performed, and the substrate A is conveyed downstream of the pair of conveyors 12. The Then, the process proceeds to step 124 and the program ends. The substrate A on which the small electronic component B and the large electronic component C are mounted is transferred to a reflow furnace for performing the next step and heated in the reflow furnace, whereby the small electronic component B and the large electronic component C are heated. Is fixed to the substrate A through a solder pattern. Further, when the next substrate A is installed in the installation section, the above-described processing is repeated again, and the small electronic component B and the large electronic component C are sequentially mounted on the plurality of substrates A in this way.

  In the above description, the area A2 is divided into the section 1 to the section 9, and the image is taken. However, the number of the sections is appropriately changed depending on the size of the area A2 (large electronic component C) and the field of view of the board recognition camera 18. . For example, if the field of view FOV of the substrate recognition camera 18 is 5 mm, the size of the area A2 is 54 mm in both length and width, and the overlap between adjacent sections is 1 mm, the number of sections is 14 × 14 and 196. Also, if the field of view FOV of the substrate recognition camera 18 is 5 mm, the size of the area A2 is 40 mm in both length and width, and the overlap between adjacent sections is 1 mm, the number of sections is 10 × 10 and 100.

  As described above, in the electronic component mounting method using the electronic component mounting apparatus 10 according to the present embodiment, the area A2 before the small electronic component B is mounted on the board A is first imaged by the board recognition camera 18, and then the board is mounted. After the small electronic component B is mounted in the area A1 of A, the area A2 is imaged again by the substrate recognition camera 18. The initial image before mounting the small electronic component B and the comparison image after mounting the small electronic component B are compared to determine the presence or absence of foreign matter. For this reason, when a foreign object adheres to the area A2 of the substrate A after the small electronic component B is mounted, the large electronic component C can be mounted after removing the foreign object.

  As a result, it is possible to prevent a defective substrate from occurring after the large electronic component C is mounted. In this case, since the imaging by the board recognition camera 18 is performed only on the area A2 where the large electronic component C is mounted, the processing time can be shortened and the production efficiency can be improved. Further, the area A2 for mounting the large electronic component C is specified from the mounting position of the large electronic component C programmed in advance and the shape data of the large electronic component C stored in the storage device 26 in advance. For this reason, by selecting a program corresponding to the board A used by the operator and inputting it to the input device 27, the area A2 on which the large electronic component C is to be mounted can be automatically specified. Even when the mounting position of the large electronic component C and the size of the large electronic component C are changed, the area A2 can be obtained as appropriate.

  Further, since the area A2 is divided into a plurality of sections and the vicinity of the boundary between adjacent sections is overlapped, each section of the area A2 is imaged. Even when the field of view of the board recognition camera 18 is wider, proper imaging can be performed. Further, a fiducial mark is provided on the substrate A, and the reference position of the substrate A is recognized based on the imaging of the fiducial mark by the substrate recognition camera 18. For this reason, it is not necessary to provide another imaging device by performing the imaging of the fiducial mark and the imaging of the area A2 with the substrate recognition camera 18. Thereby, the electronic component mounting apparatus 10 can be made inexpensive and compact. In addition, since the board | substrate A is test | inspected with a printing apparatus after formation of a solder pattern and a defective product is removed, all the board | substrates A before the process sent to the electronic component mounting apparatus 10 are non-defective products.

(Second Embodiment)
FIG. 8 shows an electronic component mounting apparatus 30 used in the second embodiment according to the present invention. The electronic component mounting apparatus 30 includes a device 1 for mounting the small electronic component B and a device 2 for mounting the small electronic component B and the large electronic component C. Further, both the device 1 and the device 2 have substantially the same configuration as the electronic component mounting device 10 described above, but as an electronic component supply unit, the device 1 includes only a small electronic component supply unit. Has both a small electronic component supply unit and a large electronic component supply unit. Further, in FIG. 8, a total of three substrates A are shown on the upstream side, center, and downstream side of the apparatus 1, but these are shown side by side for convenience of explanation, and all the substrates A are clamp devices. Is fixed at the same position on the installation part. Similarly, the four substrates A illustrated in the apparatus 2 are also fixed at the same position of the installation part.

  In the electronic component mounting method using the electronic component mounting apparatus 30, first, in a printing apparatus (not shown) installed on the upstream side of the electronic component mounting apparatus 30, the areas A 1 and A 2 on the electronic component mounting surface are The board A on which the solder pattern is printed is conveyed to the installation part of the apparatus 1 by the pair of conveyors 32 and fixed by the clamping apparatus. Next, an initial image is captured on the electronic component mounting surface of the substrate A. In this case, the initial image is captured by dividing the entire surface of the electronic component mounting surface into a plurality of sections and capturing images in all the sections. Next, after the small electronic component B is mounted on a part of the area A1 (the right side of the area A1 in FIG. 8), a comparative image is taken for all sections of the electronic component mounting surface of the substrate A.

  Next, the image obtained by removing the area A1 from the initial image and the image obtained by removing the area A1 from the comparison image are compared, and the defective substrate is corrected. Is done. Then, the normal substrate A or the corrected substrate A is released from the fixing by the clamping device, is transported to the installation part of the device 2 by the pair of conveyors 32, and is fixed by the clamping device. In the apparatus 2, the initial image is captured again for all sections of the electronic component mounting surface of the substrate A on which the small electronic component B is mounted in a part of the area A1. Next, after the small electronic component B is mounted on the remaining portion of the area A1 (the left portion of the area A1 in FIG. 8), a comparative image is taken for all sections of the electronic component mounting surface of the substrate A. . Here again, the image obtained by removing the area A1 from the initial image and the image obtained by removing the area A1 from the comparison image are compared, and the defective substrate is corrected. Disposition is done.

  Then, the large electronic component C is mounted on the normal substrate A or the region A2 of the corrected substrate A. Thus, the mounting of the small electronic component B and the large electronic component C on the substrate A is completed. The substrate A on which the small electronic component B and the large electronic component C are mounted is released from being fixed by the clamp device, and then conveyed to the next process device by the pair of conveyors 32. As described above, according to the electronic component mounting method according to the present embodiment, first, all the sections of the electronic component mounting surface of the substrate A are formed before and after a part of the plurality of small electronic components B is mounted in the region A1. An image is taken and the images obtained by removing the area A1 from each image are compared, and the presence / absence of a defect is determined to eliminate or correct the defective substrate.

  After that, before and after the remaining small electronic component B is mounted on the normal or normal area A1 of the substrate A, all the sections of the mounting surface of the substrate A electronic component are imaged to check for defects. Judgment is made to eliminate or correct defective substrates. After all the small electronic components B are mounted, the large electronic component C is mounted on the normal substrate A or the region A2 of the normal substrate A. For this reason, by using a plurality of apparatuses, even when the number of processes increases and the possibility of foreign matters adhering to the substrate A increases, the generation of a defective substrate can be reliably prevented. Other functions and effects of the electronic component mounting method using the electronic component mounting apparatus 30 are the same as those of the first embodiment described above.

(Third embodiment)
FIG. 9 shows an electronic component mounting apparatus 40 used in the third embodiment according to the present invention. The electronic component mounting apparatus 40 includes a device 1A for mounting the small electronic component B and a device 2A for mounting the small electronic component B and the large electronic component C. The apparatus 1A has substantially the same configuration as the apparatus 1 of the electronic component mounting apparatus 30 described above, and the apparatus 2A has substantially the same configuration as the apparatus 2 of the electronic component mounting apparatus 30 described above. The electronic component mounting device 40 is different from the electronic component mounting device 30 in that the control unit provided and the control unit provided in the device 2A are connected via the network 41 and can communicate with each other.

  Also, if there is a difference in size (scale) distortion, brightness, etc. between the board recognition camera provided in the apparatus 1A and the board recognition camera provided in the apparatus 2A, these differences are corrected in advance and the board recognition cameras of both board recognition cameras are corrected. The captured images can be compared under the same conditions. The rest of the configuration of the electronic component mounting apparatus 40 is the same as that of the electronic component mounting apparatus 30. Also, in FIG. 9, a total of three substrates A are shown on the upstream side, center, and downstream side of the apparatus 1A, but these are shown side by side for convenience of explanation, and all are installed by the clamping device. Are fixed at the same position. Similarly, the three substrates A shown in the apparatus 2A are also fixed at the same position of the installation part.

  In the electronic component mounting method using the electronic component mounting apparatus 40, first, the substrate A on which the solder pattern is printed in the areas A1 and A2 is conveyed to the installation portion of the apparatus 1A by the pair of conveyors 42, and clamped. Fixed by the device. Next, an initial image is taken for each section of the area A2. Next, after mounting the small electronic component B on a part of the area A1 (the right side of the area A1 in FIG. 9), a comparative image is taken on the electronic component mounting surface of the substrate A. In this case, the comparison image is captured by dividing the entire surface of the electronic component mounting surface into a plurality of sections and capturing images in all the sections. Next, the initial image is compared with the area A2 in the comparison image, the defective substrate is corrected, and the defective substrate that cannot be corrected is disposed of such as a disposal process.

  Then, the normal substrate A or the corrected substrate A is released from the fixing by the clamping device, is transported to the installation part of the device 2A by the pair of conveyors 42, and is fixed by the clamping device. In this case, if a defect has occurred in the comparison image of the section that has been comparatively inspected immediately before being unloaded from the apparatus 1A and the section has been corrected, the section of the area A2 is imaged again and the defect is detected. Save no image as data. In the apparatus 2A, after the small electronic component B is mounted on the remaining portion of the region A1 (the left portion of the region A1 in FIG. 9), a comparative image is taken for all sections of the electronic component mounting surface.

  The comparative image captured here is used as an image to be compared with the initial image, which is a comparative image of comparative imaging performed in the apparatus 1A. That is, the area A2 of the substrate A when the apparatus 1A is unloaded, and the area A2 in all sections of the electronic component mounting surface of the board A after the small electronic component B is mounted in the area A1 in the apparatus 2A. Whether or not there is a defect is determined based on whether or not there is a difference. Here too, the defective substrate is corrected, and disposal such as a disposal process is performed on the defective substrate that cannot be corrected. Then, the large electronic component C is mounted on the normal substrate A or the region A2 of the corrected substrate A.

  Thus, the mounting of the small electronic component B and the large electronic component C on the substrate A is completed. The substrate A on which the small electronic component B and the large electronic component C are mounted is released from being fixed by the clamp device, and then conveyed to the next process device by the pair of conveyors 42. Thus, according to the electronic component mounting method according to the present embodiment, first, in the apparatus 1A, each section of the region A2 of the substrate A before and after a part of the plurality of small electronic components B are mounted on the region A1. And all of the sections of the electronic component mounting surface of the board A are imaged, and the initial image is compared with the area A2 in the comparison image. Then, after determining whether there is a defect and eliminating or correcting the defective substrate, the remaining small electronic component B is mounted in the area A1 of the substrate A in the apparatus 2A, and the substrate after the small electronic component B is mounted. All the sections of the electronic component mounting surface A are imaged again.

  In this case, the comparison image of the substrate A after mounting all the small electronic components B is compared using the comparison image captured by the apparatus 1A as an initial image, and if the portion of the area A2 in both images is different. It is assumed that there is a defect, and if there is a defect, the defective substrate is eliminated or corrected. Since the comparison inspection at this time is performed while exchanging data via the network 41, an accurate comparison inspection can be performed even if the board recognition camera provided in the apparatus 1A is different from the board recognition camera provided in the apparatus 2A. . Moreover, even if there is a difference in performance such as size, distortion, and brightness between the two substrate recognition cameras, correct correction inspection can be performed. Furthermore, according to the present embodiment, even if the comparison image to be compared with the initial image is only the area A2, it is possible to confirm the entire state of the electronic component mounting surface after the small electronic component B is mounted. Other functions and effects of the electronic component mounting method using the electronic component mounting apparatus 40 are the same as those of the second embodiment described above.

  The electronic component mounting method according to the present invention is not limited to the above-described embodiment, and can be implemented with appropriate modifications. For example, in the third embodiment described above, only the area A2 is imaged in the initial imaging process, and the entire electronic component mounting surface is imaged in the comparative imaging process, but the entire electronic component mounting surface is imaged in the initial imaging process. Then, only the area A2 may be imaged in the comparative imaging process. In this case as well, the comparison is made in the area A2. Furthermore, in the above-described embodiment, the small electronic component B is mounted in the region A1, and the large electronic component C is mounted in the region A2. However, the small electronic component B and the large electronic component C are respectively mounted on the substrate A. It may be mounted scattered on the surface. The configuration of the electronic component mounting apparatus used in the electronic component mounting method according to the present invention can also be changed as appropriate.

  A ... substrate, A1 ... area, A2 ... area, B ... small electronic component, C ... large electronic component, 1-9 ... partition, 18 ... substrate recognition camera, 20 ... CPU board, 22 ... image input board, 26 ... memory apparatus.

Claims (6)

Using two electronic component mounting apparatuses provided with an imaging device, a region for mounting a small electronic component and a region for mounting a large electronic component are provided, and the region for mounting the large electronic component is divided into a plurality of sections. the electronic component mounting surface of the base plate, the large electronic components to a mounting method of the electronic component to be mounted on After mounting the small-type electronic component,
An initial imaging step of imaging with an imaging device a portion on which a large-sized electronic component is mounted on the electronic component mounting surface of the substrate before the both electronic components are mounted;
A small electronic component mounting step of mounting the small electronic component on a portion of the electronic component mounting surface of the substrate on which the small electronic component is mounted;
A comparative imaging step of imaging with an imaging device a portion on which the large electronic component is mounted on the electronic component mounting surface of the substrate on which the small electronic component is mounted;
A determination step of comparing the image captured in the initial imaging step with the image captured in the comparative imaging step to determine whether or not both images are the same;
A large-sized electronic component is mounted on a portion where the large-sized electronic component is mounted on the electronic component-mounting surface of the board, in which it is determined in the determining step that the two images are the same or a difference that cannot be recognized by comparing the images. Electronic component mounting process,
The imaging device of one electronic component mounting device captures an initial image and a comparative image, the comparative image is captured by the imaging device of the other electronic component mounting device, and is captured by the imaging device of the one electronic component mounting device. The comparison image is used as an initial image for comparison with a comparison image captured by the other electronic component mounting device ,
Further, the imaging of the part where the large electronic component is mounted is performed by imaging each section in a state where the boundary part between adjacent sections of the area where the large electronic component is mounted is overlapped . Wearing method. An electronic component mounting method for mounting a large electronic component after mounting a small electronic component on an electronic component mounting surface of a substrate using two electronic component mounting devices provided with an imaging device,
An initial imaging step of imaging the electronic component mounting surface of the substrate before mounting both electronic components with an imaging device of one electronic component mounting device;
A small electronic component mounting step of mounting some of the small electronic components on the electronic component mounting surface of the substrate;
A comparative imaging step of imaging the electronic component mounting surface of the substrate on which the small electronic components are mounted with the imaging device of the one electronic component mounting device;
A portion excluding a portion where the small electronic component is mounted in an image captured in the initial imaging step, and a portion excluding a portion where the small electronic component is mounted in an image captured in the comparative imaging step In comparison, a determination step of determining whether or not both images are the same,
After it is determined in the determination step that the two images are the same or a difference that cannot be recognized by comparing the images, the electronic component mounting surface of the board on which the part of the electronic components is mounted is used as the other electronic component. An initial imaging step of imaging with the imaging device of the component mounting device;
A small electronic component mounting step of mounting the remaining small electronic components of the small electronic components on the electronic component mounting surface of the substrate;
A comparative imaging step of imaging the electronic component mounting surface of the substrate on which all the small electronic components are mounted with the imaging device of the other electronic component mounting device;
Using the imaging device of the other electronic component mounting device, the portion other than the portion where the small electronic component is mounted in the image captured in the initial imaging process using the imaging device of the other electronic component mounting device, and the imaging device of the other electronic component mounting device A determination step of comparing whether or not both images are the same by comparing a portion excluding a portion where the small electronic component is mounted in the image captured in the comparative imaging step;
In the determination step, the large-sized electronic component is placed on the board that has been determined that the two images captured using the imaging device of the other electronic component mounting device are the same or a difference that cannot be recognized by comparing the images. for example Bei and a large electronic component mounting step of mounting,
The electronic component mounting surface of the substrate includes a region for mounting the small electronic component and a region for mounting the large electronic component, and the small electronic component is mounted on the region for mounting the small electronic component, A large electronic component is mounted in an area where the large electronic component is mounted,
Further, the area in which the large electronic component is mounted is divided into a plurality of sections, and an image of each section in the area in which the large electronic component is mounted is performed in a state where boundary portions between adjacent sections are overlapped. How to install parts. Using two electronic component mounting apparatuses provided with an imaging device, a region for mounting a small electronic component and a region for mounting a large electronic component are provided, and the region for mounting the large electronic component is divided into a plurality of sections. the electronic component mounting surface of the base plate, the large electronic components to a mounting method of the electronic component to be mounted on After mounting the small-type electronic component,
An initial imaging step of imaging a predetermined portion including at least a portion on which the large electronic component is mounted on the electronic component mounting surface of the substrate before the both electronic components are mounted, with an imaging device of one electronic component mounting device;
A small electronic component mounting step of mounting a part of the small electronic components on a portion of the electronic component mounting surface of the substrate on which the small electronic components are mounted;
A comparative imaging step of imaging a predetermined portion including at least a portion on which the large electronic component is mounted on the electronic component mounting surface of the substrate on which the partial small electronic component is mounted with the imaging device of the one electronic component mounting device; ,
A portion where the large electronic component is mounted in the image captured in the initial imaging step is compared with a portion where the large electronic component is mounted in the image captured in the comparative imaging step, and both images are the same. A determination step of determining whether or not,
After it is determined in the determination step that the two images are the same or a difference that is not recognizable by comparing the images, the remaining small electronic components of the small electronic components on the electronic component mounting surface of the substrate A small electronic component mounting process for mounting,
A comparative imaging step of imaging the electronic component mounting surface of the substrate on which all the small electronic components are mounted with the imaging device of the other electronic component mounting device;
The portion for mounting the large electronic component in the image captured in the comparative imaging step using the imaging device of the one electronic component mounting device and the comparative imaging step using the imaging device of the other electronic component mounting device A step of determining whether or not both images are the same by comparing the portion where the large electronic component is mounted in the image taken in
In the determination step, in the portion where the large electronic component is mounted on the electronic component mounting surface of the substrate, in which it is determined that the images captured in the two comparative imaging steps are the same or a difference that cannot be recognized by comparing the images e Bei a large electronic component mounting step of mounting the large electronic components,
Further, the imaging of the part where the large electronic component is mounted is performed by imaging each section in a state where the boundary part between adjacent sections of the area where the large electronic component is mounted is overlapped . Wearing method. The region for mounting the large electronic component is specified by the calculation means calculating based on a preset mounting position of the large electronic component and the shape data of the large electronic component stored in advance by the storage means. Item 4. The electronic component mounting method according to any one of Items 1 to 3 . The substrate, fiducial mark serving as a reference point is provided, of the claims 1 to 4 the reference position of the substrate is recognized based on the imaging of the fiducial mark by the imaging device The mounting method of the electronic component as described in any one. Method of mounting an electronic component according to any one of the two electronic component mounting apparatus claims 1 are enabled communication via the network 5.

Images