JP2011018816A5 - - Google Patents

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JP2011018816A5
JP2011018816A5 JP2009163351A JP2009163351A JP2011018816A5 JP 2011018816 A5 JP2011018816 A5 JP 2011018816A5 JP 2009163351 A JP2009163351 A JP 2009163351A JP 2009163351 A JP2009163351 A JP 2009163351A JP 2011018816 A5 JP2011018816 A5 JP 2011018816A5
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electronic component
mounting
imaging
substrate
small
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JP2009163351A
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JP2011018816A (en
JP5144599B2 (en
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Publication of JP2011018816A5 publication Critical patent/JP2011018816A5/ja
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基板の電子部品装着面に、小型電子部品を装着したのちに大型電子部品を装着する電子部品の装着方法であって、
前記両電子部品が装着される前の基板の電子部品装着面における大型電子部品を装着する部分を撮像装置で撮像する初期撮像工程と、
前記基板の電子部品装着面における小型電子部品を装着する部分に前記小型電子部品を装着する小型電子部品装着工程と、
前記小型電子部品が装着された基板の電子部品装着面における大型電子部品を装着する部分を撮像装置で撮像する比較撮像工程と、
前記初期撮像工程において撮像された画像と、前記比較撮像工程で撮像された画像とを比較して、両画像が同一であるか否かを判定する判定工程と、
前記判定工程において前記両画像が同一または違いが僅差であると判定された基板の電子部品装着面における大型電子部品を装着する部分に前記大型電子部品を装着する大型電子部品装着工程と
を備えた電子部品の装着方法。 An electronic component mounting method for mounting a large electronic component after mounting a small electronic component on the electronic component mounting surface of the substrate,
An initial imaging step of imaging with an imaging device a portion on which a large-sized electronic component is mounted on the electronic component mounting surface of the substrate before the both electronic components are mounted;
A small electronic component mounting step of mounting the small electronic component on a portion of the electronic component mounting surface of the substrate on which the small electronic component is mounted;
A comparative imaging step of imaging with an imaging device a portion on which the large electronic component is mounted on the electronic component mounting surface of the substrate on which the small electronic component is mounted;
A determination step of comparing the image captured in the initial imaging step with the image captured in the comparative imaging step to determine whether or not both images are the same;
A large electronic component mounting step for mounting the large electronic component on a portion where the large electronic component is mounted on the electronic component mounting surface of the board that has been determined to be the same or the difference between the two images in the determination step. How to install electronic components. 基板の電子部品装着面に、小型電子部品を装着したのちに大型電子部品を装着する電子部品の装着方法であって、
前記両電子部品が装着される前の基板の電子部品装着面を撮像装置で撮像する初期撮像工程と、
前記基板の電子部品装着面に前記小型電子部品を装着する小型電子部品装着工程と、
前記小型電子部品が装着された基板の電子部品装着面を撮像装置で撮像する比較撮像工程と、
前記初期撮像工程において撮像された画像における前記小型電子部品が装着される部分を除いた部分と、前記比較撮像工程で撮像された画像における前記小型電子部品が装着された部分を除いた部分とを比較して、両画像が同一であるか否かを判定する判定工程と、
前記判定工程において前記両画像が同一または違いが僅差であると判定された基板に前記大型電子部品を装着する大型電子部品装着工程と
を備えた電子部品の装着方法。 An electronic component mounting method for mounting a large electronic component after mounting a small electronic component on the electronic component mounting surface of the substrate,
An initial imaging step of imaging the electronic component mounting surface of the substrate before mounting both electronic components with an imaging device;
A small electronic component mounting step of mounting the small electronic component on the electronic component mounting surface of the substrate;
A comparative imaging step of imaging an electronic component mounting surface of the substrate on which the small electronic component is mounted with an imaging device;
A portion excluding a portion where the small electronic component is mounted in an image captured in the initial imaging step, and a portion excluding a portion where the small electronic component is mounted in an image captured in the comparative imaging step In comparison, a determination step of determining whether or not both images are the same,
A mounting method for an electronic component, comprising: a large electronic component mounting step for mounting the large electronic component on a substrate in which the images are determined to be the same or slightly different in the determination step. 基板の電子部品装着面に、小型電子部品を装着したのちに大型電子部品を装着する電子部品の装着方法であって、
前記両電子部品が装着される前の基板の電子部品装着面における少なくとも前記大型電子部品を装着する部分を含む所定の部分を撮像装置で撮像する初期撮像工程と、
前記基板の電子部品装着面における小型電子部品を装着する部分に前記小型電子部品を装着する小型電子部品装着工程と、
前記小型電子部品が装着された基板の電子部品装着面における少なくとも前記大型電子部品を装着する部分を含む所定の部分を撮像装置で撮像する比較撮像工程と、
前記初期撮像工程において撮像された画像における前記大型電子部品を装着する部分と、前記比較撮像工程で撮像された画像における前記大型電子部品を装着する部分とを比較して、両画像が同一であるか否かを判定する判定工程と、
前記判定工程において前記両画像が同一または違いが僅差であると判定された基板の電子部品装着面における大型電子部品を装着する部分に前記大型電子部品を装着する大型電子部品装着工程と
を備えた電子部品の装着方法。 An electronic component mounting method for mounting a large electronic component after mounting a small electronic component on the electronic component mounting surface of the substrate,
An initial imaging step of imaging with a imaging device a predetermined portion including at least a portion on which the large electronic component is mounted on the electronic component mounting surface of the substrate before the both electronic components are mounted;
A small electronic component mounting step of mounting the small electronic component on a portion of the electronic component mounting surface of the substrate on which the small electronic component is mounted;
A comparative imaging step of imaging a predetermined portion including at least a portion on which the large electronic component is mounted on the electronic component mounting surface of the substrate on which the small electronic component is mounted;
A portion where the large electronic component is mounted in the image captured in the initial imaging step is compared with a portion where the large electronic component is mounted in the image captured in the comparative imaging step, and both images are the same. A determination step of determining whether or not,
A large electronic component mounting step for mounting the large electronic component on a portion where the large electronic component is mounted on the electronic component mounting surface of the board that has been determined to be the same or the difference between the two images in the determination step. How to install electronic components. 前記基板の電子部品装着面に、前記小型電子部品を装着する領域と、前記大型電子部品を装着する領域とが備わっており、前記小型電子部品が前記小型電子部品を装着する領域に装着され、前記大型電子部品が前記大型電子部品を装着する領域に装着される請求項１ないし３のうちのいずれか一つに記載の電子部品の装着方法。   The electronic component mounting surface of the substrate includes a region for mounting the small electronic component and a region for mounting the large electronic component, and the small electronic component is mounted on a region for mounting the small electronic component, The electronic component mounting method according to any one of claims 1 to 3, wherein the large electronic component is mounted in a region where the large electronic component is mounted. 前記大型電子部品を装着する領域は、予め設定された大型電子部品の装着位置と、記憶手段によって予め記憶された大型電子部品の形状データとに基づいて算出手段が算出することにより特定される請求項４に記載の電子部品の装着方法。   The region for mounting the large electronic component is specified by the calculation means calculating based on a preset mounting position of the large electronic component and the shape data of the large electronic component stored in advance by the storage means. Item 5. The electronic component mounting method according to Item 4. 前記大型電子部品を装着する領域を複数の区画に分割し、隣り合う各区画間の境界部分を重複させた状態で、前記大型電子部品を装着する領域の各区画の撮像が行われる請求項４または５に記載の電子部品の装着方法。   5. The imaging of each section of the region for mounting the large electronic component is performed in a state in which the region for mounting the large electronic component is divided into a plurality of sections and the boundary portions between the adjacent sections are overlapped. Or the mounting method of the electronic component of 5. 前記基板に、基準点となるフィデューシャルマークが設けられており、前記基板の基準位置が前記撮像装置による前記フィデューシャルマークの撮像に基づいて認識される請求項１ないし６のうちのいずれか一つに記載の電子部品の装着方法。   The fiducial mark serving as a reference point is provided on the substrate, and the reference position of the substrate is recognized based on the imaging of the fiducial mark by the imaging device. The electronic component mounting method according to claim 1. 前記初期撮像工程において基板の電子部品装着面における大型電子部品を装着する部分を撮像する撮像装置と、前記比較撮像工程において基板の電子部品装着面における大型電子部品を装着する部分を撮像する撮像装置とが、異なる装置に備わっており、前記異なる両装置がネットワークを介して交信可能になっている請求項１ないし７のうちのいずれか一つに記載の電子部品の装着方法。An imaging device that images a portion on the electronic component mounting surface of the board in which the large electronic component is mounted in the initial imaging step, and an imaging device that images a portion on which the large electronic component is mounted on the electronic component mounting surface of the substrate in the comparative imaging step Are provided in different devices, and the two different devices can communicate with each other via a network.
JP2009163351A 2009-07-10 2009-07-10 Mounting method of electronic parts Active JP5144599B2 (en)

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JP2011018816A JP2011018816A (en) 2011-01-27
JP2011018816A5 true JP2011018816A5 (en) 2012-08-30
JP5144599B2 JP5144599B2 (en) 2013-02-13

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* Cited by examiner, † Cited by third party
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JP5728977B2 (en) * 2011-02-01 2015-06-03 富士通株式会社 Work support device, work support program, and work support method
JP6108380B2 (en) * 2012-06-05 2017-04-05 ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． Electronic component mounting equipment
JP6259274B2 (en) * 2012-12-11 2018-01-10 ヤマハ発動機株式会社 Component mounting device
JP6335246B2 (en) * 2016-11-07 2018-05-30 株式会社Ｆｕｊｉ Inspection management apparatus and inspection management method
JP7249426B2 (en) * 2019-09-19 2023-03-30 株式会社Fuji Mounting machine

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JP4667681B2 (en) * 2001-09-28 2011-04-13 パナソニック株式会社 Mounting inspection system and mounting inspection method
JP4563205B2 (en) * 2005-02-08 2010-10-13 富士機械製造株式会社 Inspection method and apparatus for mounted electronic component
JP2007335524A (en) * 2006-06-13 2007-12-27 Fuji Mach Mfg Co Ltd Mounting line
JP2008227301A (en) * 2007-03-14 2008-09-25 Fuji Mach Mfg Co Ltd Inspecting method and device for electronic circuit component mounting

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