CN103687315A - Designing method of punching alignment target - Google Patents
Designing method of punching alignment target Download PDFInfo
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- CN103687315A CN103687315A CN201310684324.7A CN201310684324A CN103687315A CN 103687315 A CN103687315 A CN 103687315A CN 201310684324 A CN201310684324 A CN 201310684324A CN 103687315 A CN103687315 A CN 103687315A
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- punching
- alignment target
- distribution pattern
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- harmomegathus
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Abstract
The invention discloses a designing method of a punching alignment target. The designing method comprises the following steps that an original wire distribution graph is designed on a computer, wherein the original wire distribution graph comprises a punching alignment target graph; the original graph scale of the part of the punching alignment target graph in the original wire distribution graph is maintained, and expansion and contraction are conducted on the other parts in the wire distribution graph to obtain an expansion and contraction wire distribution graph. The expansion and contraction wire distribution graph is transferred onto a film, and a film graph is obtained accordingly. The designing method is beneficial for improving the punching precision.
Description
Technical field
The present invention relates to a kind of punching alignment target method for designing that is applied to multi-layer sheet wiring board.
Background technology
Along with the development of electronic product to miniaturization, multifunction and high integration, multi-layer sheet early becomes the main flow of wiring board.The multi-layer sheet number of plies is more and more higher, and wiring density is increasing, also more and more higher to the requirement of interlayer alignment precision.Multi-layer sheet is formed by multiple core material pressings, is designed with conductor fig on core material, and core material all adopts first punching, then, with the hole contraposition of punching, binds or riveted etc., guarantees the aligning accuracy of interlayer conductor fig.Therefore, the precision of punching is very large on final interlayer alignment precision impact.Perforating press is to utilize CCD camera lens to capture punching alignment target, and automatically adjusts core material placement location, guarantees punching precision.For guaranteeing the accuracy of CCD grabbing graphics, move the position that can only fix, the position of perforating press CCD camera lens.
As shown in Figure 1, in industry, for the punching of core material, all adopt and on the internal layer film, design punching aligning graph at present, then the figure on the film is transferred on core material, then carried out punching according to aligning graph.Because core material can size can change after lamination, and the central layer change in size of different-thickness is variant, and undistorted for guaranteeing production board size, internal layer film figure can carry out pre-harmomegathus, and inner figure is not 1:1.Can bring thus two problems:
(1), because CCD distance of camera lens is 1:1, punching alignment target and CCD camera lens, not in same upright position, have certain influence to the accuracy of CCD camera lens grabbing graphics, and then affect punching precision.
(2) punching target figure is not 1:1, and the multi-layer sheet perforating press using in industry is 1:1 punching, cause the relative figure in hole of rushing out that certain deviation can occur, because punching off normal occurs punching board sometimes, during hand inspection, this skew of bad judgement is that normal phenomenon or punching precision have problem.
Summary of the invention
Based on this, the invention reside in the defect that overcomes prior art, a kind of method for designing of punching alignment target is provided, this method for designing is conducive to improve punching precision.
Its technical scheme is as follows:
A method for designing for punching alignment target, comprises the following steps:
Design on computers original circuit distribution pattern, this original circuit distribution pattern includes punching alignment target figure;
Part to punching alignment target figure in original circuit distribution pattern keeps former graphics proportion, and the remainder of this circuit layout graph is carried out to harmomegathus, obtains harmomegathus circuit distribution pattern;
Harmomegathus circuit distribution pattern is transferred on the film, obtains film figure.
Further, described harmomegathus has corresponding harmomegathus value, and the scope of this harmomegathus value is greater than 0.997 and be less than 1 or be greater than 1 and be less than 1.003.
Further, when designing original circuit distribution pattern on computers, the ratio that makes original circuit distribution pattern and actual track distribution pattern is 1:1.
Below the advantage of aforementioned techniques scheme or principle are described:
1, perforating press, when core material is carried out to punching, is to arrest punching contraposition target by CCD camera lens, and then accurately determines punching position.Because carrying out figure with 1:1, CCD distance of camera lens arrests, by punching alignment target figure is not carried out to harmomegathus, can guarantee that the line at the center of CCD camera lens and the center of corresponding punching alignment target is perpendicular to core material, making CCD camera lens can comparatively accurately aim at corresponding punching alignment target arrests to carry out figure, and then in the situation that perforating press carries out punching with 1:1, can guarantee the precision of punching.Therefore the method for designing of described punching alignment target is conducive to improve the precision of punching.
2, because punching generation off normal is relevant with punching alignment target figure, also relevant with punching machine punch self in some cases, thereby, use after the method for designing of described punching alignment target, if still there is punching off normal problem, can judge it may is to have perforating press self punching to cause, so just can judge punching precision problem or normal phenomenon, thereby be conducive to carry out improvement problem.Therefore, by this method for designing and corresponding construction, can confirm intuitively that whether board punching precision is abnormal, avoid with special inspecting equipment, checking punching precision at every turn, can enhance productivity, and can save equipment Inspection cost.
3, the scope of described harmomegathus value is greater than 0.997 and be less than 1 or be greater than 1 and be less than 1.003, the production board size problem of dtmf distortion DTMF that can avoid core material to cause because of change in size after lamination, and then be conducive to guarantee the quality of production board.
4,, when designing original circuit distribution pattern on computers, the ratio that makes original circuit distribution pattern and actual track distribution pattern is 1:1, the actual track of having guaranteed wiring board distribute can with original circuit distribution pattern phase or basically identical.
5, after obtaining described film figure, ratio by this film figure with 1:1 is transferred on core material, perforating press can carry out punching according to this film figure, in addition, and the also making on the enterprising line of core material road according to this film figure in subsequent handling.
6, the method for designing of described punching alignment target does not increase flow process and production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the punching off normal that occurs while all carrying out harmomegathus of original circuit distribution pattern.
Fig. 2 is the dependency structure schematic diagram that adopts punching after the method for designing of the punching alignment target described in the present embodiment.
Fig. 3 is the flow chart of the method for designing of the punching alignment target described in the embodiment of the present invention.
Description of reference numerals:
10, core material, 20, punching alignment target, 30, the hole gone out, 40, CCD camera lens.
Embodiment
Below embodiments of the invention are elaborated:
As shown in Figures 2 and 3, a kind of method for designing of punching alignment target, comprises the following steps:
Design on computers original circuit distribution pattern, this original circuit distribution pattern includes punching alignment target figure;
Part to punching alignment target figure in original circuit distribution pattern keeps former graphics proportion, and the remainder of this circuit layout graph is carried out to harmomegathus, obtains harmomegathus circuit distribution pattern;
Harmomegathus circuit distribution pattern is transferred on the film, obtains film figure.
Further, described harmomegathus has corresponding harmomegathus value, and the scope of this harmomegathus value is greater than 0.997 and be less than 1 or be greater than 1 and be less than 1.003.
Further, when designing original circuit distribution pattern on computers, the ratio that makes original circuit distribution pattern and actual track distribution pattern is 1:1.
The present embodiment has the following advantages or principle:
1, perforating press, when core material 10 is carried out to punching, is to arrest punching alignment target 20 by CCD camera lens 40, and then accurately determines punching position.Because CCD camera lens 40 is arrested apart from carrying out figure with 1:1, by punching alignment target figure is not carried out to harmomegathus, can guarantee that the line at CCD camera lens 40 center and corresponding punching alignment target 20 center is perpendicular to core material 10, making CCD camera lens 40 can comparatively accurately aim at corresponding punching alignment target 20 arrests to carry out figure, and then in the situation that perforating press carries out punching with 1:1, can guarantee the precision of punching.Therefore the method for designing of described punching alignment target 20 is conducive to improve the precision of punching.As shown in Figure 2, by adopting described method, there is not off normal in the hole 30 of going out, and CCD camera lens 40 center and corresponding punching alignment target 20 center align.
2, because punching generation off normal is relevant with punching alignment target figure, also relevant with punching machine punch self in some cases, thereby, use after the method for designing of described punching alignment target 20, if still there is punching off normal problem, can judge it may is to have perforating press self punching to cause, so just can judge punching precision problem or normal phenomenon, thereby be conducive to carry out improvement problem.Therefore, by this method for designing and corresponding construction, can confirm intuitively that whether board punching precision is abnormal, avoid with special inspecting equipment, checking punching precision at every turn, can enhance productivity, and can save equipment Inspection cost.
3, the scope of described harmomegathus value is greater than 0.997 and be less than 1 or be greater than 1 and be less than 1.003, the production board size problem of dtmf distortion DTMF that can avoid core material 10 to cause because of change in size after lamination, and then be conducive to guarantee the quality of production board.
4,, when designing original circuit distribution pattern on computers, the ratio that makes original circuit distribution pattern and actual track distribution pattern is 1:1, the actual track of having guaranteed wiring board distribute can with original circuit distribution pattern phase or basically identical.
5, after obtaining described film figure, ratio by this film figure with 1:1 is transferred on core material 10, perforating press can carry out punching according to this film figure, in addition, and the also making on the enterprising line of core material 10 road according to this film figure in subsequent handling.
6, the method for designing of described punching alignment target does not increase flow process and production cost.
The above embodiment has only expressed the specific embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (4)
1. a method for designing for punching alignment target, is characterized in that, comprises the following steps:
Design on computers original circuit distribution pattern, this original circuit distribution pattern includes punching alignment target figure;
Part to punching alignment target figure in original circuit distribution pattern keeps former graphics proportion, and the remainder of this circuit layout graph is carried out to harmomegathus, obtains harmomegathus circuit distribution pattern;
Harmomegathus circuit distribution pattern is transferred on the film, obtains film figure.
2. the method for designing of punching alignment target according to claim 1, is characterized in that, described harmomegathus has corresponding harmomegathus value, and the scope of this harmomegathus value is greater than 0.997 and be less than 1 or be greater than 1 and be less than 1.003.
3. the method for designing of punching alignment target according to claim 1 and 2, is characterized in that, when designing original circuit distribution pattern on computers, the ratio that makes original circuit distribution pattern and actual track distribution pattern is 1:1.
4. the method for designing of punching alignment target according to claim 1, is characterized in that, further comprising the steps of: the ratio by obtained film figure with 1:1 is transferred on core material.
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| CN201310684324.7A CN103687315B (en) | 2013-12-12 | 2013-12-12 | Designing method of punching alignment target |
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| CN201310684324.7A CN103687315B (en) | 2013-12-12 | 2013-12-12 | Designing method of punching alignment target |
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| CN103687315B CN103687315B (en) | 2017-02-15 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104270889A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Local high-precision printed circuit board and manufacturing method thereof |
| CN104302098A (en) * | 2014-10-31 | 2015-01-21 | 华进半导体封装先导技术研发中心有限公司 | Circuit board lamination alignment target structure and manufacturing method thereof |
| CN104470265A (en) * | 2014-11-19 | 2015-03-25 | 广州兴森快捷电路科技有限公司 | Manufacturing method of multi-layer circuit board |
| CN105632941A (en) * | 2016-02-02 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | Expansion and shrinkage process control-based production method for package substrate |
| CN106793474A (en) * | 2017-01-19 | 2017-05-31 | 广州美维电子有限公司 | A kind of printed circuit board (PCB) and its processing method |
| CN107295749A (en) * | 2017-07-12 | 2017-10-24 | 奥士康精密电路（惠州）有限公司 | A kind of inclined management-control method in pcb board hole |
| CN110708874A (en) * | 2019-09-24 | 2020-01-17 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN112440329A (en) * | 2020-11-04 | 2021-03-05 | 东莞王氏港建机械有限公司 | Multilayer board punching method and punching machine with double-sided circuit based on layer deviation detection |
| CN114501799A (en) * | 2020-10-27 | 2022-05-13 | 健鼎（无锡）电子有限公司 | Alignment method and composite target point for circuit board manufacturing process |
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| JP2001085836A (en) * | 1999-09-14 | 2001-03-30 | Nippon Avionics Co Ltd | System for adjusting pattern forming film of printed wiring board |
| CN101640978A (en) * | 2009-08-29 | 2010-02-03 | 深圳市深联电路有限公司 | Method and device for manufacturing single-side nickel-plated sheet |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104270889B (en) * | 2014-09-28 | 2017-06-13 | 广州兴森快捷电路科技有限公司 | Partial high-precision printed wiring board and preparation method thereof |
| CN104270889A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Local high-precision printed circuit board and manufacturing method thereof |
| CN104302098A (en) * | 2014-10-31 | 2015-01-21 | 华进半导体封装先导技术研发中心有限公司 | Circuit board lamination alignment target structure and manufacturing method thereof |
| CN104470265A (en) * | 2014-11-19 | 2015-03-25 | 广州兴森快捷电路科技有限公司 | Manufacturing method of multi-layer circuit board |
| CN104470265B (en) * | 2014-11-19 | 2017-09-22 | 广州兴森快捷电路科技有限公司 | A kind of preparation method of multilayer circuit board |
| CN105632941A (en) * | 2016-02-02 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | Expansion and shrinkage process control-based production method for package substrate |
| CN105632941B (en) * | 2016-02-02 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | A kind of production and processing method of the package substrate based on harmomegathus process control |
| CN106793474A (en) * | 2017-01-19 | 2017-05-31 | 广州美维电子有限公司 | A kind of printed circuit board (PCB) and its processing method |
| CN107295749A (en) * | 2017-07-12 | 2017-10-24 | 奥士康精密电路（惠州）有限公司 | A kind of inclined management-control method in pcb board hole |
| CN107295749B (en) * | 2017-07-12 | 2019-09-17 | 奥士康精密电路（惠州）有限公司 | A kind of inclined management-control method in pcb board hole |
| CN110708874A (en) * | 2019-09-24 | 2020-01-17 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN110708874B (en) * | 2019-09-24 | 2021-06-04 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN114501799A (en) * | 2020-10-27 | 2022-05-13 | 健鼎（无锡）电子有限公司 | Alignment method and composite target point for circuit board manufacturing process |
| CN114501799B (en) * | 2020-10-27 | 2023-05-30 | 健鼎（无锡）电子有限公司 | Alignment method for circuit board manufacturing process and composite target point |
| CN112440329A (en) * | 2020-11-04 | 2021-03-05 | 东莞王氏港建机械有限公司 | Multilayer board punching method and punching machine with double-sided circuit based on layer deviation detection |
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