CN102843875A - Alignment control method for multiple layers of PCBs - Google Patents

Alignment control method for multiple layers of PCBs Download PDF

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Publication number
CN102843875A
CN102843875A CN 201110167858 CN201110167858A CN102843875A CN 102843875 A CN102843875 A CN 102843875A CN 201110167858 CN201110167858 CN 201110167858 CN 201110167858 A CN201110167858 A CN 201110167858A CN 102843875 A CN102843875 A CN 102843875A
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CN
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Prior art keywords
alignment
pcb
pcbs
control method
holes
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CN 201110167858
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Chinese (zh)
Inventor
马洪伟
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昆山华扬电子有限公司
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Abstract

The invention discloses an alignment control method for multiple layers of PCBs (Printed Circuit Boards). The method comprises the steps as follows: (1) making drawings and hole position targets on each PCB respectively; (2) recognizing the hole position targets with a CCD (Charge Coupled Device) target shooting machine and targeting on the drawn PCBs; and (3) aligning and positioning the two or more layers of PCBs through the hole position targets. The method provided by the invention is not only simple, but also can realize high-precision interlayer alignment so as to increase production efficiency.

Description

多层PCB线路板对准度控制方法 Alignment of the multi-layer PCB board control method

技术领域 FIELD

[0001] 本发明涉及一种多层PCB线路板对准度控制方法。 [0001] The present invention relates to a multilayer PCB board alignment of the control method.

背景技术 Background technique

[0002] 为了顺应电子产品的多功能化、小型化、轻量化的发展趋势,下一代电子系统对PCB的要求是高密度、高集成、封装化、微细化、多层化,那么微孔技术、层间对准技术、高密度互联技术等就成为亟待解决的问题。 [0002] In order to accommodate multiple functions, miniaturization, weight reduction of the development trend of electronic products, demand for next-generation electronics PCB is a high-density, high integration, packaging and miniaturization, multilayered, then the micropores technology interlayer alignment techniques, high-density interconnect technology has become a serious problem. 而目前多层PCB线路板对准度控制一般采用在PCB图形制作前就用X-RAY打靶方式对对位孔进行打靶标示,这就造成多次对位产生的累积误差特别大。 At present, multi-layer PCB board generally used to control the degree of alignment of the alignment holes targeting designated by X-RAY targeting manner before making PCB pattern, which resulted in times of accumulated error generation is especially large.

发明内容 SUMMARY

[0003] 为了克服上述缺陷,本发明提供了一种多层PCB线路板对准度控制方法,该方法不仅简单,而且可实现高精度层间对准,提高生产效率。 [0003] In order to overcome the above drawbacks, the present invention provides a multi-layer PCB board of the alignment control method, the method is not only simple, but also to achieve high accuracy between the alignment layer, improve production efficiency.

[0004] 本发明为了解决其技术问题所采用的技术方案是:一种多层PCB线路板对准度控制方法,包括以下步骤:①分别在每层PCB线路板上制作图形和孔位靶标在上述制作完图形的PCB线路板上用CCD打靶机对所述孔位靶标进行识别并打靶;③将上述两层或多层PCB线路板通过孔位靶标进行对准定位。 [0004] Technical Solution In order to solve the technical problem is that: a multilayer circuit board PCB of the alignment control method, comprising: ① From respectively produced in each circuit board PCB pattern and the target hole After making the above-described circuit board PCB pattern for a CCD shooting machine the holes target recognition and targeting; ③ the above-described two or more layers PCB board by aligning the positioning holes target. 这样,可減少多次对位造成的累积误差,从而达到提闻对准度的目的。 This can reduce accumulation of errors caused by multiple alignment, so as to achieve alignment of the lifting smell.

[0005] 作为本发明的进ー步改进,所述孔位为铆合定位孔、成型定位孔或非金属化功能孔。 [0005] As a further development of the invention into ー, said positioning holes is a riveting hole, the positioning hole forming holes or non-features. 对于特殊性非金属化功能孔,可避免PCB线路板在图形制作时造成的油墨入孔及杂物 Non-metallized holes particularity function, avoids the ink inlet hole and the PCB board debris caused when graphics production

塞孔等难题。 Jack and other problems.

[0006] 本发明的有益效果是:该多层PCB线路板对准度控制方法将位置度管控严格的孔与线路图形一起制作,然后使用CCD打靶的方式制作出来,減少多次对位造成的累计误差,从而达到提高对准度的目的。 [0006] Advantageous effects of the present invention is that: the alignment of the control method of the multilayer PCB board production together with the position of a hole with a strict control line pattern, and using a CCD made out targeting manner, reducing the resulting multiple alignment accumulated error, so as to improve the degree of alignment. 其具有以下优点: Which has the following advantages:

[0007] ①对准精度高,大批量生产层间对准度可实现< O. 05mm ; [0007] ① high alignment accuracy between the alignment layer of the mass production can be achieved <O. 05mm;

[0008] ②适用范围广,适用于各种板厚规格、各种层间叠构、各种类型的产品; [0008] ② wide range of applications for a variety of specifications of thickness, laminated between the various configurations, types of products;

[0009] ③成本低廉,大约为高精度的自动对位曝光机10% ; [0009] ③ low cost, high accuracy of about automatic exposure machine position 10%;

[0010] ④效率高,较之目前常用的X-RAY打靶方式,C⑶打靶速度快,精度也完全可以达到X-RAY打靶的精度,而且它不会遇到像X-RAY打靶那样因为铜厚而能量衰减的问题。 [0010] ④ high efficiency, compared with the commonly used X-RAY shooting mode, fast C⑶ shooting speed, accuracy can be achieved X-RAY targeting accuracy, and because it does not encounter as copper thickness as targeting X-RAY the energy attenuation problems.

具体实施方式 detailed description

[0011 ] 一种多层PCB线路板对准度控制方法,包括以下步骤:①分别在每层PCB线路板上制作图形和孔位靶标在上述制作完图形的PCB线路板上用CCD打靶机对所述孔位靶标进行识别并打靶;③将上述两层或多层PCB线路板通过孔位靶标进行对准定位。 [0011] A multilayer circuit board PCB of the alignment control method, comprising: ① From each PCB circuit board respectively made the target pattern and the hole pattern of the finished circuit board PCB by the CCD shooting machine of the above prepared the holes identify and target shooting; ③ the above-described two or more layers PCB board by aligning the positioning holes target. 这样,可减少多次对位造成的累积误差,从而达到提高对准度的目的。 This can reduce accumulation of errors caused by multiple alignment, so as to improve the degree of alignment.

[0012] 上述孔位为铆合定位孔、成型定位孔或非金属化功能孔。 [0012] The positioning holes for the riveting hole, the positioning hole forming holes or non-features. 对于特殊性非金属化功能孔,可避免PCB线路板在图形制作时造成的油墨入孔及杂物塞孔等难题。 Non-metallized holes function particularity, PCB circuit board can be avoided due to problems in the production of graphic ink inlet hole and debris plugging the like.

Claims (2)

  1. 1. 一种多层PCB线路板对准度控制方法,其特征在于,其包括以下步骤:①分别在每层PCB线路板上制作图形和孔位靶标在上述制作完图形的PCB线路板上用CCD打靶机对所述孔位靶标进行识别并打靶;③将上述两层或多层PCB线路板通过孔位靶标进行对准定位。 A multilayer PCB board alignment of a control method characterized in that it comprises the following: ① From each PCB circuit board respectively made the target pattern and the hole pattern in the above production of finished circuit board with a PCB CCD shooting machine for the recognition holes and target shooting; ③ the above-described two or more layers PCB board by aligning the positioning holes target.
  2. 2.根据权利要求I所述的多层PCB线路板对准度控制方法,其特征在于:所述孔位为铆合定位孔、成型定位孔或非金属化功能孔。 According to claim I of the multi-layer PCB board of a control method of alignment, characterized in that: said positioning holes is a riveting hole, the positioning hole forming holes or non-features.
CN 201110167858 2011-06-21 2011-06-21 Alignment control method for multiple layers of PCBs CN102843875A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103635024A (en) * 2013-11-25 2014-03-12 东莞美维电路有限公司 Automatic partitioning board dividing method after lamination of printed wiring board
CN104519681A (en) * 2014-11-19 2015-04-15 沪士电子股份有限公司 Manufacturing method of ultralarge line-card type printed circuit boards with large layer number and high alignment degree
CN105101649A (en) * 2015-08-17 2015-11-25 景旺电子科技(龙川)有限公司 Multi-layer PCB (Printed Circuit Board) shooting method
CN105392305A (en) * 2015-10-21 2016-03-09 胜宏科技(惠州)股份有限公司 High-order HDI board aligning method
CN104111047B (en) * 2013-04-22 2017-02-08 北大方正集团有限公司 And a correction assist device calibrating method, test methods, calibration methods

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US5925206A (en) * 1997-04-21 1999-07-20 International Business Machines Corporation Practical method to make blind vias in circuit boards and other substrates
KR100632546B1 (en) * 2004-12-18 2006-10-09 삼성전기주식회사 Inter-matching method of the multilayer printed circuit board
CN101155476A (en) * 2006-09-28 2008-04-02 比亚迪股份有限公司 Preparation method for flexible circuit board
CN101668389A (en) * 2009-09-04 2010-03-10 东莞美维电路有限公司 Method for making high alignment printed circuit board
CN201550361U (en) * 2009-11-27 2010-08-11 深圳市集锦线路板科技有限公司 Multilayer printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5925206A (en) * 1997-04-21 1999-07-20 International Business Machines Corporation Practical method to make blind vias in circuit boards and other substrates
KR100632546B1 (en) * 2004-12-18 2006-10-09 삼성전기주식회사 Inter-matching method of the multilayer printed circuit board
CN101155476A (en) * 2006-09-28 2008-04-02 比亚迪股份有限公司 Preparation method for flexible circuit board
CN101668389A (en) * 2009-09-04 2010-03-10 东莞美维电路有限公司 Method for making high alignment printed circuit board
CN201550361U (en) * 2009-11-27 2010-08-11 深圳市集锦线路板科技有限公司 Multilayer printed circuit board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104111047B (en) * 2013-04-22 2017-02-08 北大方正集团有限公司 And a correction assist device calibrating method, test methods, calibration methods
CN103635024A (en) * 2013-11-25 2014-03-12 东莞美维电路有限公司 Automatic partitioning board dividing method after lamination of printed wiring board
CN104519681A (en) * 2014-11-19 2015-04-15 沪士电子股份有限公司 Manufacturing method of ultralarge line-card type printed circuit boards with large layer number and high alignment degree
CN104519681B (en) * 2014-11-19 2018-01-09 沪士电子股份有限公司 High degree of alignment of a high number of large size line method of making a printed wiring board Cards
CN105101649A (en) * 2015-08-17 2015-11-25 景旺电子科技(龙川)有限公司 Multi-layer PCB (Printed Circuit Board) shooting method
CN105101649B (en) * 2015-08-17 2018-03-20 景旺电子科技(龙川)有限公司 A multilayer pcb board targeting method
CN105392305A (en) * 2015-10-21 2016-03-09 胜宏科技(惠州)股份有限公司 High-order HDI board aligning method
CN105392305B (en) * 2015-10-21 2018-02-13 胜宏科技(惠州)股份有限公司 High - order hdi alignment plate method

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