CN107295749B - A kind of inclined management-control method in pcb board hole - Google Patents
A kind of inclined management-control method in pcb board hole Download PDFInfo
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- CN107295749B CN107295749B CN201710563809.9A CN201710563809A CN107295749B CN 107295749 B CN107295749 B CN 107295749B CN 201710563809 A CN201710563809 A CN 201710563809A CN 107295749 B CN107295749 B CN 107295749B
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- Prior art keywords
- film
- hole
- egative film
- pcb board
- development
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
The invention discloses a kind of inclined management-control methods in pcb board hole, comprising the following steps: (1) drills；(2) heavy copper；(3) pattern transfer, the pattern transfer include pre-treatment, press mold, standing, contraposition, exposure, development；Method of the invention is in the case where equipment is constant, by controlling drilling parameter, the control of outer layer exposure parameter, and line film Data Design optimization, so that it is abnormal to avoid the occurrence of batch hole partially to supervisory function bit is played in actual production process；The solution of the present invention can effectively prevent batch hole partially and scrap, and it is bad to reduce inclined hole, improves product first-pass yield.
Description
Technical field
The present invention relates to pcb board production technical field more particularly to a kind of management-control methods that pcb board hole is inclined.
Background technique
With the multifunctionality development of electronic product, PCB using more and more extensive, printed circuit board is intended to volume
It is small, slimming, high-accuracy, hole ring design≤4mil of more and more consumer products.The two big reasons for causing hole inclined are bored for drilling
Partially, route is to inclined；In most of printed circuit board factory, orifice ring≤4mil wiring board, the inclined scrappage in acid etching process hole compared with
It is high；Therefore, how to manage that inclined hole is bad, to reduce inclined hole bad is a problem of route board industry.
Summary of the invention
It can prevent pcb board batch hole partially technical problem to be solved by the invention is to provide one kind to scrap, reduce inclined hole
It is bad, improve the inclined management-control method in pcb board hole of product yield.
In order to solve the above technical problems, the technical solution adopted by the present invention is that: a kind of inclined management-control method in pcb board hole, including
Following steps:
(1) it drills；
(2) heavy copper；
(3) pattern transfer, the pattern transfer include pre-treatment, press mold, standing, contraposition, exposure, development；
Wherein, in step (1), drill lamination parameter are as follows:
Drilling board is selected as: board main shaft beat dynamic RUNOUT value≤15um；Drill maximum offset≤3mil；
CPK≥1.33；
In step (3), the control of outer layer exposure parameter: 1., taking 4/4 mode (contraposition, 4 point inspections) at 4 points, open divide equally,
Egative film audit function；
2. egative film error amount setting≤50um；Egative film harmomegathus value setting≤50um；Workpiece ← → upper and lower egative film setting value≤
50um；The equal score value setting≤50um of workpiece ← → Best Point；
3. platform frame degree of exhaustion: 20Hg -30Hg；Egative film vacuum degree: -680mmHg--760mmHg；
In step (3), the development film harmomegathus control are as follows: new film harmomegathus value ± 1mil, very poor 1.5mil；The old film
Harmomegathus value ± 2mil, very poor 2mil；
Outer layer film drone design are as follows: the face GTL center is an outer diameter 2.0mm, internal diameter 1.4mm, the ring of ring width 0.3mm；
The face GBL center is the circle of a 1.0mm diameter；Two sides adds a 8mil ring width at distance 3.2mm wad cutter hole wall 10mil
Ring.
In conclusion having the following beneficial effects: that the solution of the present invention is constant in equipment with technical solution of the present invention
In the case where, by controlling drilling parameter, the control of outer layer exposure parameter, line film Data Design optimization, thus to reality
Supervisory function bit is played in production process, and it is abnormal to avoid the occurrence of batch hole partially；The solution of the present invention can effectively prevent the inclined hole of batch
It scraps, it is bad to reduce inclined hole, improves product first-pass yield.
Detailed description of the invention
Fig. 1 is the face GTL of the present invention schematic diagram；
Fig. 2 is the face GBL of the present invention schematic diagram；
Fig. 3 is effect after the existing wad cutter design development of the present invention；
Fig. 4 is that wad cutter designs effect after development after the present invention optimizes.
Fig. 5 is wad cutter detection schematic diagram after optimization.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, but do not constitute limiting the scope of the invention.
The present invention provides a kind of inclined management-control method in pcb board hole, specifically includes the following steps:
(1) it drills: including upper PIN → automatic adhesive-tape application → plate → upper plate to be drilled → brill initial workpiece → lower plate → X-RAY is examined
(multilayer) → plate → lower plate → examination board → nog plate → ejecting plate is bored, these belong to the conventional method of this field, are not of the invention
Emphasis is not being discussed herein；
(2) it sinks copper: sink copper → VCP including, nog plate → PTH and is electroplated；These belong to the conventional method of this field, are not these
The emphasis of invention is not being discussed herein；
(3) pattern transfer, the pattern transfer include pre-treatment, press mold, standing, contraposition, exposure, development；
Wherein, pre-treatment: i.e. nog plate, using needle brush or volcanic ash two ways；
Wherein, needle brush line nog plate is the following steps are included: enter plate-high cutting-pressure (hydraulic) water of pickling-washing-needle brush-
Wash-water column type flushing-addition washing-DI washing-sponge blot-high wind drying-hot blast drying-cooling wind is (dustless
It is indoor)；
Volcano gray line nog plate is the following steps are included: enter the high cutting-volcanic ash of plate-pickling-washing-- dirt removal washing-
Pressurization washing-ultrasonic wave embathes-wash water that overflows washes-water column type flushing-pressurization washing-sponge and blots-high wind drying-heat
Dry-cooling wind of wind and etc.；
Press mold: it is clean by copper that PCB is firmly attached to by the hot pressing rumble that heats, pressurize, by photosensitive semi-solid medium dry film
Process on face；
It stands；
Contraposition；
Exposure: including cleaning board, the Fei Sen-dress film-frame gas guide bar-cleaning table top/film-- CCD pairs of upper plate
Position-suction vacuum-exposure-lower plate-standing；
Development；Even if completing the transfer of outer graphics by exposure development with light actuating resisting corrosion dry film, so as to lower process into
Row is manufactured；Specifically, development includes but is not limited to following below scheme: putting -1 section of development cylinder-of plate and wave-develop 2 sections of cylinder -
Wave-developing 3 sections of cylinder-wave-dirt removal water-pressurization washing-clear water wash-high wind drying-hot blast drying-QC fishplate bar insert
Frame；
Wherein, in step (1), drill lamination parameter are as follows:
Drilling board is selected as: board main shaft beat dynamic RUNOUT value≤15um；Drill maximum offset≤3mil；
CPK≥1.33；
In step (3), the control of outer layer exposure parameter: 1., 4/4 mode (4 points of contrapositions, 4 point inspections) are taken, to guarantee PCB
The Aligning degree of plate and the upper and lower film, exposure machine take wad cutter center and the phenanthrene at four camera crawl four angles of pcb board when exposing
The center of woods target；Open divide equally and (prevent occurring the pcb board past inclined phenomenon in one side whole with respect to the film during exposure aligning),
Egative film (film) audit function (checks whether the film shifts, deforms up and down)；Above a series of measures is provided to mention
Its high Aligning degree, can be achieved this function in equipment.
Egative film 2. (film) error amount setting≤50um；Egative film harmomegathus value setting≤50um；Workpiece ← → upper and lower egative film is set
Definite value≤50um；The equal score value setting≤50um of workpiece ← → Best Point；
3. platform frame degree of exhaustion: 20Hg -30Hg；Egative film vacuum degree: -680mmHg--760mmHg；
In step (3), the development film harmomegathus control are as follows: new film harmomegathus value ± 1mil, very poor 1.5mil；The old film
Harmomegathus value ± 2mil, very poor 2mil；
As shown in Figure 1, 2, outer layer film drone design are as follows: the face GTL center is an outer diameter 2.0mm, internal diameter 1.4mm, ring
The ring of wide 0.3mm；The face GBL center is the circle of a 1.0mm diameter；Two sides adds one at distance 3.2mm wad cutter hole wall 10mil
The ring of 8mil ring width.
As shown in Fig. 3,4,5, for the Contrast on effect after the method for the present invention development, have the advantage that
1, clearly device to hole monitoring can be carried out partially, while effectively identify the raw process of oblique presentation of portalling, be for drilling or line
Road；
2, after developing outside 4 target holes the mostly ring of a 8mil ring width, according to the distance and deviation of hole edge to ring side
Analysis reaches a kind of pcb board hole and monitors means in real time partially；
3, for GBL as effect after the development of the face GTL2, such as 4 target holes and the consistent single side of ring presentation are inclined, then are determined as
For route to inclined, it is consistent simultaneously partially that such as 4 target holes and ring are presented 2 faces, then is judged to drilling inclined.(it can timely answer device to hole inclined
Producing cause makes Improving Measurements).
4, the development before after excellent only shows with a hole, it is excellent after development further include a detection annulus.
The solution of the present invention is in the case where equipment is constant, by controlling drilling parameter, the control of outer layer exposure parameter, and line
Road film Data Design optimization, so that it is abnormal to avoid the occurrence of batch hole partially to supervisory function bit is played in actual production process；This hair
Bright scheme can effectively prevent batch hole partially and scrap, and it is bad to reduce inclined hole, improves product first-pass yield.
Our company production plate leads to the area scrapped monthly 0.82% because of inclined hole at present, exposes to drilling parameter control, outer layer
State modulator, the optimization of line film Data Design, can reduce scrappage 0.23%.By our company drilling monthly 120000 ㎡ of output,
400 yuan of every square meter calculating, annual reduction scrap cost are as follows:
400 yuan of December=132.48 ten thousand yuan * ten thousand ㎡ * of 0.23%*12.
Inventor by research and development obtain it is a kind of improve drilling, outer layer aligning accuracy and to actual production process monitoring side
Method reduces inclined hole scrappage, improves the promotion of our company making technology ability, better meets the requirement of client.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (1)
1. a kind of inclined management-control method in pcb board hole, which comprises the following steps:
(1) it drills；
(2) heavy copper；
(3) pattern transfer, the pattern transfer include pre-treatment, press mold, standing, contraposition, exposure, development；
Wherein, in step (1), drill lamination parameter are as follows:
Drilling board is selected as: board main shaft beat dynamic RUNOUT value≤15um；Drill maximum offset≤3mil；CPK≥
1.33；
In step (3), the control of outer layer exposure parameter: 1., taking 4/4 mode, open divide equally, egative film audit function；It is described to divide equally
Function is whole with respect to the film inclined toward one side to prevent exposure aligning from occurring pcb board in the process；The egative film audit function is to check
Whether the upper and lower film shifts, deforms；
2. egative film error amount setting≤50um；Egative film harmomegathus value setting≤50um；Workpiece ← → upper and lower egative film setting value≤
50um；The equal score value setting≤50um of workpiece ← → Best Point；
3. platform frame degree of exhaustion: 20Hg -30Hg；Egative film vacuum degree: -680mmHg--760mmHg；
In step (3), the development film harmomegathus control are as follows: new film harmomegathus value ± 1mil, very poor 1.5mil；Old film harmomegathus
Value ± 2mil, very poor 2mil；
Outer layer film drone design are as follows: the face GTL center is an outer diameter 2.0mm, internal diameter 1.4mm, the ring of ring width 0.3mm；The face GBL
Center is the circle of a 1.0mm diameter；Two sides adds the ring of a 8mil ring width at distance 3.2mm wad cutter hole wall 10mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710563809.9A CN107295749B (en) | 2017-07-12 | 2017-07-12 | A kind of inclined management-control method in pcb board hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710563809.9A CN107295749B (en) | 2017-07-12 | 2017-07-12 | A kind of inclined management-control method in pcb board hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107295749A CN107295749A (en) | 2017-10-24 |
| CN107295749B true CN107295749B (en) | 2019-09-17 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195342A (en) * | 2018-09-14 | 2019-01-11 | 奥士康精密电路（惠州）有限公司 | A kind of broken method for generating and improving efficiency of anti-film |
| CN109104822A (en) * | 2018-11-15 | 2018-12-28 | 梅州市志浩电子科技有限公司 | The alignment method of the film and exposure machine |
| CN112672525B (en) * | 2020-11-12 | 2022-05-17 | 广州广合科技股份有限公司 | Treatment method for incomplete etching in PCB negative film process |
| CN114179163A (en) * | 2021-12-03 | 2022-03-15 | 苏州市伟杰电子有限公司 | PCB (printed circuit board) hole forming device and hole forming method |
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| CN105282983A (en) * | 2015-10-14 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Lead wire etching technology with gold fingers with three surfaces wrapped by gold |
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|---|---|---|---|---|
| CN103906376A (en) * | 2012-12-28 | 2014-07-02 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
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|---|---|---|---|---|
| CN101166392A (en) * | 2006-10-18 | 2008-04-23 | 比亚迪股份有限公司 | A laminated multi-layer flexible printed circuit board and its making method |
| CN101537505A (en) * | 2008-12-30 | 2009-09-23 | 南京依利安达电子有限公司 | Small-aperture high-density drilling method of printed circuit board |
| CN102145397A (en) * | 2011-03-25 | 2011-08-10 | 奥士康精密电路（惠州）有限公司 | Drilling method for improving benefits |
| CN102607772A (en) * | 2012-03-06 | 2012-07-25 | 常熟金像电子有限公司 | Testing method for marginal adaptation of exposure table of exposure machine |
| CN103687315A (en) * | 2013-12-12 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Designing method of punching alignment target |
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| CN107295749A (en) | 2017-10-24 |
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Effective date of registration: 20230629 Address after: 526070 Floor 1, Building 1, Xizhen Science Park, No. 11, Kechuang Avenue, Zhaoqing New District, Dinghu District, Huizhou City, Guangdong Province Patentee after: Guangdong Xizhen Circuit Technology Co.,Ltd. Address before: Xin Wei Zhen Chang Bu Cun, Huizhou District of Huiyang City, Guangdong province 516223 Patentee before: AOSHIKONG PRECISION CIRCUIT (HUIZHOU) Co.,Ltd. |