CN109195313A - A kind of Novel back drilling testing hole production method - Google Patents
A kind of Novel back drilling testing hole production method Download PDFInfo
- Publication number
- CN109195313A CN109195313A CN201811113913.9A CN201811113913A CN109195313A CN 109195313 A CN109195313 A CN 109195313A CN 201811113913 A CN201811113913 A CN 201811113913A CN 109195313 A CN109195313 A CN 109195313A
- Authority
- CN
- China
- Prior art keywords
- drilling
- drilling position
- hole
- core material
- back drill
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
The invention discloses a kind of Novel back drilling testing hole production methods, when by making internal layer circuit on core material, three orifice rings being arranged successively are produced in the edges of boards of core material together, and the first two orifice ring connection at core material upper surface, latter two orifice ring connection at core material lower surface, it then drills on multilayer boards and makes hole metallization, it connect orifice ring with outer copper foil, after complete when making outer-layer circuit, independent copper ring is formed around hole, back drill finally is being carried out to intermediate hole, the projected depth of back drill controls in the dielectric layer of core material, it is whether qualified come the depth for judging back drill that the break-make situation of route between the first two hole and latter two hole is detected by universal meter in this way；Whether the present invention detects back drill by above three hole qualified, reduces the step of being sliced after back drill, avoids the problem of wiring board is scrapped because of slice, reduce production cost, and effectively increase the detection efficiency of back drill.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of Novel back drilling testing hole production method.
Background technique
Printed circuit partitioned signal " distortion " research shows that: influence signal system signal integrity principal element except design,
Outside the factors such as plate material, transmission line, connector, chip package, via hole also has large effect to signal integrity；To reduce
Noise interference and the use of buried blind via, improve signal integrity, reduce PCB manufacture difficulty；Fall not having by using back drill hole drill
The through hole section for playing any connection or transmitting effect avoids the reflection, scattering, delay of high speed transmission of signals, and bores back
During drilling, it is sampling and longitudinal section that the depth symbol in back drill hole, which does not meet design requirement common practice, passes through electronics
It is measured microscopically and confirms whether back drill depth is qualified, the specific steps are as follows:
(1) it requires to calculate back drill hole depth according to the depth, depth tolerances, level and the remaining thick control that mark in production instruction
And it is set in numerically controlled drill formula；
(2) PIN nail is installed on schmoll drilling machine, and the close peace backing plate of 2.0mm -- production plate -- 0.25mm aluminium is successively installed
Piece -- tape by locking schmoll drilling machine current sensing means -- 0.30mm cold punching plate --；
(3) it drills in back drill region and takes slice；
(4) whether grinding is sliced and is met the requirements using electron microscope confirmation back drill hole depth；
Above-mentioned way, which can have the following deficiencies: to be sliced after back drill, causes unrepairable to destroy production plate, causes
Production plate is scrapped, and production cost is improved；Slice grinding+gold picture is measured microscopically data and determines whether back drill depth is qualified,
Time is longer, and detection efficiency is low.
Summary of the invention
It is an object of the invention to provide a kind of Novel back drilling testing hole production method to overcome existing technological deficiency,
The step of whether this method is qualified to detect back drill depth by three back drill instrument connections of design, is sliced after reduction back drill, avoids
The problem of wiring board is scrapped because of slice, and effectively increase the detection efficiency of back drill.
In order to solve the above-mentioned technical problems, the present invention provides a kind of Novel back drilling testing hole production method, including it is following
Step:
S1, inner figure: the first drilling position for being arranged successively setting, the second drilling position are equipped on the edges of boards of core material
With third drilling position, the first drilling position, the second drilling position and third drilling position are the positions for needing to drill in following process；
The inner figure on the film is transferred on core material by negative film technique, the inner figure include inner line figure with
And three respectively around first drilling position, second drilling position and third drilling position orifice ring figure；
S2 internal layer circuit: copper exposed on core material is removed by etching, film is then moved back, is formed by inner line figure
Internal layer circuit forms orifice ring by the orifice ring figure；Wherein orifice ring is not connect with internal layer circuit, and is enclosed at core material upper surface
It is connected around the first drilling position with two orifice rings of the second drilling position, around the second drilling position and third at core material lower surface
Two orifice rings of drilling position are connected；
Core material and outer copper foil: being press-fitted together as one by S3 pressing by prepreg, forms multi-layer board；
S4 drilling: on multilayer boards perpendicular to the first drilling position, the second drilling position and third drilling position holes drilled through；
S5 sinks copper, electric plating of whole board: making via metal by heavy copper, electric plating of whole board；
S6, outer-layer circuit is then made on multilayer boards, and during making outer-layer circuit, around the through-hole
Form independent copper ring；
S7, back drill: boring back drill hole perpendicular to the second drilling position on multilayer boards, and the bottom in back drill hole is controlled in the internal layer
In the dielectric layer of core plate, back drill instrument connection is formed.
Preferably, in step S4, the diameter of the through-hole is 0.5mm.
Preferably, in step S6, the diameter in the back drill hole is 0.8mm.
Preferably, in step S1, the inner figure further includes the wire pattern being connected for two orifice ring figures；Its
In, two orifice ring figures of the first drilling position and the second drilling position are surrounded at core material upper surface and are located at internal layer core
Pass through wire pattern with two orifice ring figures of third drilling position around the second drilling position at plate lower surface to connect.
Preferably, in step S2, conducting wire is formed by the wire pattern after etching；First is surrounded at core material upper surface
Drill position and the second drilling position two orifice rings and core material lower surface at around the second drilling position and third drilling position
Two orifice rings are connected by conducting wire.
Compared with prior art, the invention has the following beneficial effects:
When the present invention on core material by making internal layer circuit, produces in the edges of boards of core material successively arrange together
Three orifice rings of column, and the first two orifice ring at core material upper surface connects, latter two orifice ring at core material lower surface
Connection, then drills on multilayer boards and makes hole metallization, connect orifice ring with outer copper foil, is making outer-layer circuit after complete
When, independent copper ring is formed around hole, back drill finally is being carried out to intermediate hole, the projected depth of back drill is controlled in internal layer
In the dielectric layer of core plate, the break-make situation of route between the first two hole and latter two hole is detected by universal meter in this way to judge
Whether the depth of back drill is qualified；The present invention detects whether back drill is qualified by above three hole, reduces and is sliced after back drill
Step avoids the problem of wiring board is scrapped because of slice, reduces production cost, and effectively increases the detection effect of back drill
Rate.
Detailed description of the invention
Fig. 1 is the top view for making orifice ring in embodiment on core plate；
Fig. 2 is the schematic diagram for making orifice ring and conducting wire in embodiment on core plate；
Fig. 3 is the schematic diagram in embodiment after multi-layer board back drill.
Specific embodiment
In order to more fully understand technology contents of the invention, below in conjunction with specific embodiment to technical side of the invention
Case is described further and illustrates.
Embodiment 1
The present embodiment provides a kind of production methods of wiring board, including Novel back drilling testing hole production method, specifically
Technique is as follows:
(1), sawing sheet: outputing core plate by jigsaw size 520mm × 620mm, core thickness 0.47mm, outer copper foil with a thickness of
0.5μm；According to design requirement, the reserved position there are three for drilling after pressing on core material, specially first is bored
The drilling position 2 of hole location 1, first and third drilling position 3, as shown in Figure 1.
(2) internal layer circuit production (negative film technique): inner figure transfer is coated on core plate photosensitive with vertical application machine
Film, 8 μm of the film thickness monitoring of light-sensitive surface are completed on core plate using Full-automatic exposure machine with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Inner figure exposure forms inner figure after developed, inner figure includes inner line figure, three respectively around first
Drilling position, the second drilling position and the orifice ring figure of third drilling position and the wire pattern being connected for two orifice ring figures；
Wherein, two orifice ring figures of the first drilling position and the second drilling position are surrounded at core material upper surface and are located at internal layer
Pass through wire pattern with two orifice ring figures of third drilling position around the second drilling position at core plate lower surface to connect；Internal layer erosion
It carves, the core plate after exposure development is etched into the conducting wire 5 (as depicted in figs. 1 and 2) between internal layer circuit, orifice ring 4 and orifice ring 4,
It is 3mil that internal layer line width, which measures,；Then internal layer AOI checks the defects of opening short circuit, route notch, route pin hole of internal layer circuit,
Defective to scrap processing, flawless product goes out to downstream.
(3), press: (specific plate-laying sequence is arrived from above after core plate and outer copper foil are superimposed together in advance with prepreg
Down it is copper foil, prepreg, core plate, prepreg, copper foil), then select lamination appropriate that will overlap according to plate Tg
Plate is pressed, and multi-layer board is formed.
(4), outer layer drills: according to borehole data, using the mode of machine drilling, on multilayer boards perpendicular to the first drilling
Position, the second drilling position and third drilling position holes drilled through 6 (as shown in Figure 3), the diameter of through-hole are 0.5mm.
(5), heavy copper: one layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(6), according to the mechanism of electrochemical reaction, upper one layer of copper electric plating of whole board: is electroplated on the basis of heavy copper.
(7), outer-layer circuit (positive blade technolgy) is made: outer graphics transfer, it is luxuriant and rich with fragrance using Full-automatic exposure machine and positive route
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule) on multilayer boards, developed, is formed on multilayer boards
Outer-layer circuit figure；Outer graphics plating, then distinguishes copper facing and tin plating on multilayer boards, is set according to desired completion copper thickness
Electroplating parameter, copper facing are the current density electric plating of whole board 60min with 1.8ASD, and tin plating be electroplated with the current density of 1.2ASD
10min, 3-5 μm of tin thickness；Then film is successively moved back again, etches and move back tin, outer-layer circuit is etched on multilayer boards, together in through-hole
Around form independent copper ring 7 (as shown in Figure 3)；Outer layer AOI, using automatic optical detecting system, by with CAM data
Whether comparison, detection outer-layer circuit have the defects of open circuit, notch, not clean, short-circuit etching.
(8), back drill: back drill hole 8 (as shown in Figure 3) is bored perpendicular to the second drilling position on multilayer boards, the diameter in back drill hole
For 0.8mm, electroplated layer a part of in the through-hole is removed to bore, and the projected depth control in back drill hole is being located at core material
In dielectric layer, back drill instrument connection is formed.
For above three hole, detect whether back drill hole depth is qualified, and specific detecting step is as follows using universal meter:
S1, omnipotent list index is adjusted to resistance grade, measures corresponding first drilling position and the second drilling using universal meter probe
The copper ring (i.e. the copper ring in L4 layer in Fig. 3) of non-back drill one side around two through-holes of position, if display numerical value is that ∞ is (infinite
Greatly), illustrate that the depth in back drill hole when back drill has drilled the orifice ring on L2 layer；If showing numerical value≤1 Ω, illustrate back drill when back drill
The depth in hole does not drill the orifice ring on L2 layer；
S2, non-back around two through-holes of corresponding second drilling position and third drilling position is then measured using universal meter probe
The copper ring (i.e. the copper ring in L4 layer in Fig. 3) of one side is bored, if display numerical value is ∞ (infinity), illustrates back drill hole when back drill
Depth drilled the orifice ring on L3 layer, with this judge setting back drill depth be underproof；If showing numerical value≤1 Ω,
Illustrate that the depth in back drill hole when back drill does not drill the orifice ring on L3 layer, judges that the back drill depth of setting is qualified with this；
S3, according to measurement result, when back drill depth is unqualified, the back drill depth of setting is finely adjusted.
By above method, wiring board can avoid carrying out destructive slice to determine whether back drill depth is qualified, reduces
The step of being sliced after back drill avoids the problem of wiring board is scrapped because of slice, reduces production cost；Pass through universal meter simultaneously
Whether the method confirmation back drill for surveying circuit on-off, which meets the requirements, can reduce the grinding of back drill slice and gold confirms back drill as microscope
As a result the consumed time effectively increases the detection efficiency of back drill.
(9), welding resistance, silk-screen character: by making green oil layer and silk-screen character, green oil thickness are as follows: 10- in multi-layer board outer layer
50 μm, so as to so that production plate can reduce influence of the environmental change to it in the subsequent use process.
(10), surface treatment (heavy nickel gold): principle is learned in pad copper face Tonghua of welding resistance windowing position, and uniform deposition centainly requires
The nickel layer and layer gold of thickness, nickel layer thickness are as follows: 3-5 μm；Layer gold thickness are as follows: 0.05-0.1 μm.
(11), it forms: according to the prior art and pressing design requirement gong shape, route is made in the +/- 0.05mm of external form tolerance
Plate.
(12), electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(13), FQC: appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of production board etc. are checked whether
Meet the requirement of client.
(14), it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to production board, and
It is allowed to dry drying prescription and humidity card, then shipment.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (6)
1. a kind of Novel back drilling testing hole production method, which comprises the following steps:
S1, inner figure: the first drilling position, the second drilling position and for being arranged successively setting are equipped on the edges of boards of core material
Three drilling positions, the first drilling position, the second drilling position and third drilling position are the positions for needing to drill in following process；Pass through
Inner figure on the film is transferred on core material by negative film technique, and the inner figure includes inner line figure and three
It is a respectively around first drilling position, second drilling position and third drilling position orifice ring figure；
S2 internal layer circuit: copper exposed on core material is removed by etching, film is then moved back, internal layer is formed by inner line figure
Route forms orifice ring by the orifice ring figure；Wherein orifice ring is not connect with internal layer circuit, and around the at core material upper surface
One drilling position is connected with two orifice rings of the second drilling position, around the second drilling position and third drilling at core material lower surface
Two orifice rings of position are connected；
Core material and outer copper foil: being press-fitted together as one by S3 pressing by prepreg, forms multi-layer board；
S4 drilling: on multilayer boards perpendicular to the first drilling position, the second drilling position and third drilling position holes drilled through；
S5 sinks copper, electric plating of whole board: making via metal by heavy copper, electric plating of whole board；
S6, outer-layer circuit is then made on multilayer boards, and during making outer-layer circuit, formed around the through-hole
Independent copper ring；
S7, back drill: boring back drill hole perpendicular to the second drilling position on multilayer boards, and the bottom in back drill hole is controlled in the core material
Dielectric layer in, formed back drill instrument connection.
2. Novel back drilling testing according to claim 1 hole production method, which is characterized in that in step S4, the through-hole
Diameter be 0.5mm.
3. Novel back drilling testing according to claim 1 hole production method, which is characterized in that in step S6, the back drill
The diameter in hole is 0.8mm.
4. Novel back drilling testing according to claim 1 hole production method, which is characterized in that in step S1, the internal layer
Figure further includes the wire pattern being connected for two orifice ring figures；Wherein, it is located at core material upper surface and surrounds first
Drill position and the second drilling position two orifice ring figures and be located at core material lower surface around the second drilling position and third
Two orifice ring figures of drilling position are connected by wire pattern.
5. Novel back drilling testing according to claim 4 hole production method, which is characterized in that in step S2, after etching by
The wire pattern forms conducting wire；At core material upper surface around first drilling position and second drilling position two orifice rings and
Pass through conducting wire with two orifice rings of third drilling position around the second drilling position at core material lower surface to connect.
6. Novel back drilling testing according to claim 1 hole production method, which is characterized in that in step S3, in production plate
Pressure is handled after carrying out in 3-5min after completing outer-layer circuit exposure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811113913.9A CN109195313A (en) | 2018-09-25 | 2018-09-25 | A kind of Novel back drilling testing hole production method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811113913.9A CN109195313A (en) | 2018-09-25 | 2018-09-25 | A kind of Novel back drilling testing hole production method |
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| CN109195313A true CN109195313A (en) | 2019-01-11 |
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| CN201811113913.9A Pending CN109195313A (en) | 2018-09-25 | 2018-09-25 | A kind of Novel back drilling testing hole production method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110475432A (en) * | 2019-08-08 | 2019-11-19 | 沪士电子股份有限公司 | A kind of pcb board and its manufacture and back drilling method |
| CN110646726A (en) * | 2019-09-20 | 2020-01-03 | 胜宏科技（惠州）股份有限公司 | PCB back drilling nondestructive testing method |
| CN111830395A (en) * | 2020-07-14 | 2020-10-27 | 深圳市迅捷兴科技股份有限公司 | Method for detecting back drilling capability of circuit board |
| CN111867256A (en) * | 2020-07-31 | 2020-10-30 | 金禄电子科技股份有限公司 | Circuit board and manufacturing method |
| CN113301734A (en) * | 2021-05-06 | 2021-08-24 | 深圳崇达多层线路板有限公司 | Method for improving back drilling capability of high-multilayer circuit board |
| CN114501804A (en) * | 2021-11-29 | 2022-05-13 | 上海嘉捷通信息科技有限公司 | Depth control method for back drilling of 5G precision circuit board |
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| CN103731972A (en) * | 2012-10-15 | 2014-04-16 | 重庆方正高密电子有限公司 | Detecting method of drilling depth of PCB and in-process PCB |
| JP2014187153A (en) * | 2013-03-22 | 2014-10-02 | Via Mechanics Ltd | Back drilling method for multilayer printed wiring board, drill therefor and board drilling device |
| CN108366489A (en) * | 2018-01-22 | 2018-08-03 | 深圳崇达多层线路板有限公司 | A kind of undesirable method of optimization back drill aperture turmeric |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103731972A (en) * | 2012-10-15 | 2014-04-16 | 重庆方正高密电子有限公司 | Detecting method of drilling depth of PCB and in-process PCB |
| JP2014187153A (en) * | 2013-03-22 | 2014-10-02 | Via Mechanics Ltd | Back drilling method for multilayer printed wiring board, drill therefor and board drilling device |
| CN108366489A (en) * | 2018-01-22 | 2018-08-03 | 深圳崇达多层线路板有限公司 | A kind of undesirable method of optimization back drill aperture turmeric |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110475432A (en) * | 2019-08-08 | 2019-11-19 | 沪士电子股份有限公司 | A kind of pcb board and its manufacture and back drilling method |
| CN110646726A (en) * | 2019-09-20 | 2020-01-03 | 胜宏科技（惠州）股份有限公司 | PCB back drilling nondestructive testing method |
| WO2021051647A1 (en) * | 2019-09-20 | 2021-03-25 | 胜宏科技（惠州）股份有限公司 | Back-drilling nondestructive testing method for pcb |
| CN111830395A (en) * | 2020-07-14 | 2020-10-27 | 深圳市迅捷兴科技股份有限公司 | Method for detecting back drilling capability of circuit board |
| CN111867256A (en) * | 2020-07-31 | 2020-10-30 | 金禄电子科技股份有限公司 | Circuit board and manufacturing method |
| CN113301734A (en) * | 2021-05-06 | 2021-08-24 | 深圳崇达多层线路板有限公司 | Method for improving back drilling capability of high-multilayer circuit board |
| CN114501804A (en) * | 2021-11-29 | 2022-05-13 | 上海嘉捷通信息科技有限公司 | Depth control method for back drilling of 5G precision circuit board |
| CN114501804B (en) * | 2021-11-29 | 2024-03-29 | 上海嘉捷通信息科技有限公司 | Back drilling depth control method for 5G precise circuit board |
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