CN108366489A - A kind of undesirable method of optimization back drill aperture turmeric - Google Patents
A kind of undesirable method of optimization back drill aperture turmeric Download PDFInfo
- Publication number
- CN108366489A CN108366489A CN201810060131.7A CN201810060131A CN108366489A CN 108366489 A CN108366489 A CN 108366489A CN 201810060131 A CN201810060131 A CN 201810060131A CN 108366489 A CN108366489 A CN 108366489A
- Authority
- CN
- China
- Prior art keywords
- hole
- back drill
- aperture
- production plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of undesirable methods of optimization back drill aperture turmeric, include the following steps：It drills on production plate on production plate, the hole bored includes needing the through-hole of back drill, and make via metal by heavy copper and electric plating of whole board；It makes outer-layer circuit successively on production plate and makes solder mask；To producing the welding resistance windowing position on plate and the through-hole of back drill being needed to carry out heavy nickel gold processing；Back drill is carried out on the through-hole for needing to carry out back drill, drills out back drill hole as required, the aperture in the back drill hole is more than the aperture of the through-hole；Then molding and electric performance test process are carried out to production plate successively, detection is qualified, finished product.The method of the present invention is by optimized production process flow, under the premise of not increasing flow and cost, can solve the defect of the heavy nickel gold plating leakage of aperture back drill.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of undesirable side of optimization back drill aperture turmeric
Method.
Background technology
In order to increase the signal integrity of impedance transmission lines, generally use back drill removes copper extra in telltale hole；It is existing
Back drill hole production method be after plank graphic plating etch before carry out back drill, to drill out back drill hole, but for small
The telltale hole in aperture is easy to cause tin with copper by aperture clogs, etching is moved back difficult when tin if aperture is less than the hole of 0.35mm after back drill
It is clean in removal, it will appear plating leakage defect when rear process being caused to be surface-treated heavy nickel gold；Also one is by such telltale hole more
It is changed to filling holes with resin, but flow and cost can be increased in this way, production efficiency is reduced, can also bring quality risk, as abrasive band flattens
Shi Rongyi grinds away plate, at the same time can increase the difficulty for making outer-layer circuit, and not necessarily meet the requirement of client.
Invention content
There is drawbacks described above in the present invention, it is undesirable to provide a kind of optimization back drill aperture turmeric for existing line plate
Method, this method is by optimized production process flow, under the premise of not increasing flow and cost, can solve the heavy nickel of aperture back drill
The defect of golden plating leakage.
In order to solve the above technical problem, the present invention provides a kind of undesirable methods of optimization back drill aperture turmeric, including
Following steps：
S1, it drills on production plate, the hole bored includes needing the through-hole of back drill, and make through-hole by heavy copper and electric plating of whole board
Metallization；
S2, it makes outer-layer circuit successively on production plate and makes solder mask；
S3, it handles producing the welding resistance windowing position on plate and the through-hole of back drill being needed to carry out heavy nickel gold；
S4, back drill is carried out on the through-hole for needing to carry out back drill, drills out back drill hole as required, the aperture in the back drill hole is big
In the aperture of the through-hole；
S5 and then molding and electric performance test process are carried out to production plate successively, detection is qualified, finished product.
Preferably, in step S4, the big 0.15-0.25mm in aperture of through-hole described in the aperture ratio in the back drill hole.
Preferably, the method is suitable for the through-hole aperture less than 0.35mm, and radius-thickness ratio is more than 6:1 plank.
Preferably, the production plate is to have been subjected to the plank being pressed together.
Compared with prior art, the present invention has the advantages that：
Back drill process is put and is carried out after the surface treatment by optimized production process flow by the present invention, in this way will not volume
Outer increase flow and cost are also not present when surface treatment and heavy nickel gold are caused the problem of plating leakage occur because of plug-hole, and it is heavy to solve
The defect of nickel gold plating leakage；It the back drill hole made by the method for the invention will not even if forming copper/ni au plug-hole in aperture
Influence that client is subsequent to install and use and the reliability of product.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment 1
A kind of undesirable method of optimization back drill aperture turmeric, is less than in particular for aperture shown in the present embodiment
0.35mm, radius-thickness ratio are more than 6:The 1 undesirable method of aperture turmeric includes following treatment process successively：
(1), sawing sheet：Core plate is outputed by jigsaw size 320mm × 420mm, core plate plate thickness is 1mm, the outer layer copper face of core plate
Thickness is 1OZ.
(2), internal layer circuit (negative film technique) is made：According to figure location hole, with the coating sense of vertical application machine on core plate
Light film, 8 μm of the film thickness monitoring of light-sensitive surface complete interior layer line using Full-automatic exposure machine with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Road exposes, and inner line figure is formed after developed；Internal layer etches, and the core plate after exposure imaging is etched internal layer circuit, interior
Wide measure of layer line is 3mil；Then internal layer AOI checks the defects of opening short circuit, circuit notch, circuit pin hole of internal layer circuit, has
Defect scraps processing, and flawless product goes out to downstream.
(3), it presses：Brown speed carries out brown according to bottom copper copper thickness, by outer copper foil, prepreg, core plate, semi-solid preparation
Piece, outer copper foil overlap successively as required, then select lamination appropriate to be pressed according to plate Tg, form production
Plate.
(4) outer layer drills：Drilling processing is carried out to production plate using borehole data, the hole bored includes needing leading to for back drill
The aperture in hole, the through-hole is 0.25mm.
(5), heavy copper:The hole metallization on production plate, backlight is set to test 10 grades, the heavy copper thickness in hole is 0.5 μm.
(6), electric plating of whole board：According to the prior art and by design requirement to production plate carry out electric plating of whole board, thicken plate face and
Layers of copper in hole.
(7), outer-layer circuit makes (positive blade technolgy)：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, and outer-layer circuit figure is formed on production plate
Shape；Outer graphics are electroplated, then the copper facing and tin plating respectively on production plate, and copper facing is the current density electric plating of whole board with 1.8ASD
60min, tin plating is that 10min, 3-5 μm of tin thickness is electroplated with the current density of 1.2ASD；Then it moves back film successively again, etch and move back tin,
Outer-layer circuit is etched on production plate；Outer layer AOI, then check outer-layer circuit opens short circuit, circuit notch, circuit pin hole etc.
Defect, defective to scrap processing, flawless product goes out to downstream.
(8), welding resistance, silk-screen character：Solder mask and silk-screen are made according to the prior art and by design requirement on production plate
Character.
(9), surface treatment (heavy nickel gold)：It is surface-treated, hinders according to the prior art and by design requirement on production plate
The copper face for welding windowing position and the through-hole for needing back drill lead to the principles of chemistry, and uniform deposition centainly requires the nickel layer and gold of thickness in layers of copper
Layer.
(10), back drill hole：Back drill is carried out on the through-hole for needing to carry out back drill, the depth by required making back drill hole and hole
Diameter requires to drill out back drill hole, and the big 0.15-0.25mm in aperture of the aperture ratio through-hole in back drill hole, such as the aperture in back drill hole is
0.5mm；After making back drill hole by the above method, even if copper/ni au plug-hole is formed in through-holes, after client will not being influenced
Continuous to install and use and the reliability of product, the problem of heavy nickel gold plating leakage, is also resolved, and will not increase additional flow
And cost.
(11), it is molded：According to the prior art and design requirement gong shape is pressed, circuit is made in the +/- 0.05mm of external form tolerance
Plate.
(12), electric performance test：The electric property for detecting wiring board detects qualified wiring board and enters next processing
Link；
(13), final inspection：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, the internal layer copper thickness etc. of finished product are taken a sample test respectively,
Qualified product can shipment.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (3)
1. a kind of undesirable method of optimization back drill aperture turmeric, which is characterized in that include the following steps：
S1, it drills on production plate, the hole bored includes needing the through-hole of back drill, and make via metal by heavy copper and electric plating of whole board
Change；
S2, it makes outer-layer circuit successively on production plate and makes solder mask；
S3, it handles producing the welding resistance windowing position on plate and the through-hole of back drill being needed to carry out heavy nickel gold；
S4, back drill is carried out on the through-hole for needing to carry out back drill, drills out back drill hole as required, the aperture in the back drill hole is more than institute
State the aperture of through-hole；
S5 and then molding and electric performance test process are carried out to production plate successively, detection is qualified, finished product.
2. the undesirable method of optimization back drill aperture turmeric according to claim 1, which is characterized in that described in step S4
The big 0.15-0.25mm in the aperture of through-hole described in the aperture ratio in back drill hole.
3. the undesirable method of optimization back drill aperture turmeric according to claim 1, which is characterized in that the production plate is
By the plank being pressed together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810060131.7A CN108366489B (en) | 2018-01-22 | 2018-01-22 | A kind of undesirable method of optimization back drill aperture turmeric |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810060131.7A CN108366489B (en) | 2018-01-22 | 2018-01-22 | A kind of undesirable method of optimization back drill aperture turmeric |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108366489A true CN108366489A (en) | 2018-08-03 |
| CN108366489B CN108366489B (en) | 2019-10-22 |
Family
ID=63006834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810060131.7A Active CN108366489B (en) | 2018-01-22 | 2018-01-22 | A kind of undesirable method of optimization back drill aperture turmeric |
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| CN (1) | CN108366489B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195313A (en) * | 2018-09-25 | 2019-01-11 | 深圳崇达多层线路板有限公司 | A kind of Novel back drilling testing hole production method |
| CN111065207A (en) * | 2019-12-31 | 2020-04-24 | 广合科技（广州）有限公司 | Method for processing poor back-drilled board of PCB |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861058A (en) * | 2010-06-04 | 2010-10-13 | 深南电路有限公司 | Method of PCB board processing technology |
| CN105491800A (en) * | 2015-12-23 | 2016-04-13 | 江门崇达电路技术有限公司 | Fabrication method of PCB with back-drill hole |
| CN105578801A (en) * | 2015-12-15 | 2016-05-11 | 深圳崇达多层线路板有限公司 | Manufacturing method of back-drilling hole of solder resist ink half-plug hole |
| JP2016152256A (en) * | 2015-02-16 | 2016-08-22 | 日本電気株式会社 | Electronic component mounting method |
| US20160278208A1 (en) * | 2015-03-19 | 2016-09-22 | Multek Technologies Ltd. | Selective segment via plating process and structure |
-
2018
- 2018-01-22 CN CN201810060131.7A patent/CN108366489B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861058A (en) * | 2010-06-04 | 2010-10-13 | 深南电路有限公司 | Method of PCB board processing technology |
| JP2016152256A (en) * | 2015-02-16 | 2016-08-22 | 日本電気株式会社 | Electronic component mounting method |
| US20160278208A1 (en) * | 2015-03-19 | 2016-09-22 | Multek Technologies Ltd. | Selective segment via plating process and structure |
| CN105578801A (en) * | 2015-12-15 | 2016-05-11 | 深圳崇达多层线路板有限公司 | Manufacturing method of back-drilling hole of solder resist ink half-plug hole |
| CN105491800A (en) * | 2015-12-23 | 2016-04-13 | 江门崇达电路技术有限公司 | Fabrication method of PCB with back-drill hole |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109195313A (en) * | 2018-09-25 | 2019-01-11 | 深圳崇达多层线路板有限公司 | A kind of Novel back drilling testing hole production method |
| CN111065207A (en) * | 2019-12-31 | 2020-04-24 | 广合科技（广州）有限公司 | Method for processing poor back-drilled board of PCB |
| CN111065207B (en) * | 2019-12-31 | 2021-10-08 | 广州广合科技股份有限公司 | Method for processing poor back-drilled board of PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108366489B (en) | 2019-10-22 |
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