CN106455370B - It is a kind of to improve the not full blind hole windowing production method of filling perforation - Google Patents
It is a kind of to improve the not full blind hole windowing production method of filling perforation Download PDFInfo
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- CN106455370B CN106455370B CN201611027703.9A CN201611027703A CN106455370B CN 106455370 B CN106455370 B CN 106455370B CN 201611027703 A CN201611027703 A CN 201611027703A CN 106455370 B CN106455370 B CN 106455370B
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- blind hole
- windowing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of not full blind hole windowing production methods of improvement filling perforation, including after being laminated to multiple substrates, beat internal layer wad cutter using X-ray target-shooting machine；The plate of internal layer wad cutter of having fought each other carries out graphic making, is exposed using the film of windowing catch point big 0.03mm to 0.06mm more unilateral than blind hole aperture, and makes blind hole windowing；Laser punching is carried out to the plate after blind hole windowing；Filling perforation plating is carried out to plate；Target when line pattern contraposition is using windowing, carries out Etching；Normal production subsequent handling.The present invention is by reducing blind hole windowing size, solve the problems, such as that filling perforation is not full, when through-hole and blind hole coexist, figure is aligned using blind hole registration holes, it is preferential to guarantee blind hole quality, so as to the quality problem for avoiding blind hole and pad tangency location pad from being etched, when greatly reducing production outer graphics because caused by blind hole position pad pasting sealing of hole is bad pad etching scrap, cost has been saved, has reduced and scraps.
Description
Technical field
The present invention relates to printed circuit boards, more specifically refer to a kind of blind hole windowing production side that improvement filling perforation is not full
Method.
Background technique
Printed circuit board (Printed circuit board, PCB) almost appears in each electronic equipment.
If having electronic component in some equipment, they are set on the PCB of different sizes.In addition to fixation is various small by zero
Outside part, the major function of PCB is to provide being electrically connected to each other for top items part.As electronic equipment becomes increasingly complex, need
The part wanted is more and more, and the route and part of PCB top are also more and more intensive.
In printed circuit board manufacturing process, when customer requirement presses plating using 0.5 ounce or more copper foil, while having sharp
When light blind hole filling perforation is electroplated, the direct radium-shine blind hole production method for beating copper cannot be generally used, but needs to add blind hole windowing
Process, in order to offset the bit errors of pressing target practice and laser drilling machine, existing standard is by blind hole windowing in radium-shine aperture base
Unilateral increasing 0.1mm production on plinth.
There are defects below for above-mentioned way:
1, two concave ends of blind hole windowing are deeper when filling perforation, can not fill and lead up；
2, when machine drilling and laser drill exist simultaneously, because being related to two sets of harmomegathus coefficients, figure uses CCD pairs of drilling
Blind hole will appear the tangent effect of deviation behind position；
3, when etching, because recess blind hole with the side pad is tangent leads to not sealing of hole, to occur etching away pad
Quality problem.
Chinese patent 201110000958.7 discloses a kind of laser blind hole windowing process of multi-layer H DI wiring board.It is described
Technique uses X-RAY machine target practice position first in PAD layers of laser blind hole bottom production wad cutter figure, then after pressing using resin copper foil
Hole is aligned and is exposed using automatic exposure machine, is finally developed, is etched windowing.The technique is broken current conventional laser blind hole and is added
Work mode (using three Guan Weikong positioning, drills out laser blind hole windowing location hole with machine drilling), using with laser blind hole bottom
Four wad cutters of the PAD layers of plate angle for being in approximately the same plane carry out exactitude position and use the accurate target-shooting machine target practice position X-RAY hole,
The reuse and machine drilling error in outer tube position hole are avoided, the final purpose realizing laser blind hole and accurately opening a window, technique
Simply, high-efficient.
But above-mentioned patent is the reuse and machine drilling error by avoiding outer tube position hole, reaches blind
The purpose that hole accurately opens a window, difficulty are larger.
Therefore, it is necessary to design a kind of blind hole windowing production method that improvement filling perforation is not full, reducing windowing reduces filling perforation
The difficulty filled and led up is electroplated, when reducing production outer graphics because caused by blind hole position pad pasting sealing of hole is bad pad etching scrap, save
Cost.
Summary of the invention
It is an object of the invention to overcome the deficiencies of existing technologies, a kind of improvement filling perforation not full blind hole windowing system is provided
Make method.
To achieve the above object, the invention adopts the following technical scheme: a kind of improvement filling perforation not full blind hole windowing system
Make method, comprising the following steps:
After being laminated to multiple substrates, internal layer wad cutter is beaten using X-ray target-shooting machine；
Fought each other internal layer wad cutter plate carry out graphic making, using windowing catch point big 0.03mm more unilateral than blind hole aperture extremely
The film of 0.06mm is exposed, and makes blind hole windowing；
Laser punching is carried out to the plate after blind hole windowing；
Filling perforation plating is carried out to plate；
Target when line pattern contraposition is using windowing, carries out Etching；
Normal production subsequent handling.
Its further technical solution are as follows: the plate of the internal layer wad cutter of having fought each other carries out graphic making, uses windowing catch point ratio
The film of the unilateral big 0.03mm to 0.06mm in blind hole aperture is exposed, and the step of making blind hole windowing, is specifically included following
Step:
Fought each other internal layer wad cutter plate carry out pre-treatment；
Pad pasting operation is carried out to plate；
Plate is exposed using the film of windowing catch point big 0.03mm to 0.06mm more unilateral than blind hole aperture；
Etching pressure and etching linear speed are adjusted according to practical copper thickness, carries out windowing etching.
Its further technical solution are as follows: the plate of the internal layer wad cutter of having fought each other carried out in the step of pre-treatment, microetch amount control
System is in 0.6um to 1.2um.
Its further technical solution are as follows: the plate of the internal layer wad cutter of having fought each other carried out in the step of pre-treatment, specifically pair
Plate carries out nog plate processing.
Its further technical solution are as follows: the phenanthrene using windowing catch point big 0.03mm to 0.06mm more unilateral than blind hole aperture
In the step of woods is exposed plate, specifically plate is carried out using the film of windowing catch point big 0.05mm more unilateral than blind hole aperture
Exposure.
Its further technical solution are as follows: it is described that etching pressure and etching linear speed are adjusted according to practical copper thickness, carry out windowing erosion
Before the step of quarter, need to make first plate.
Its further technical solution are as follows: in described the step of carrying out pad pasting operation to plate, specifically patch dry film, and pad pasting
When the underlying membrane of dry film is removed.
Its further technical solution are as follows: in the step of plate to after blind hole windowing carries out laser punching, specifically
It is normally to be made using the laser energy in corresponding aperture, contraposition uses the optics pad of windowing film quadrangle.
Its further technical solution are as follows: the step of the normal production subsequent handling, including outer layer development, erosion are carried out to plate
It carves, striping, and photosensitive solder resist and surface treatment is carried out to plate.
Compared with the prior art, the invention has the advantages that: a kind of not full blind hole windowing of improvement filling perforation of the invention
Production method solves the problems, such as that filling perforation is not full, when through-hole and blind hole coexist, figure is used by reducing blind hole windowing size
The contraposition of blind hole registration holes, it is preferential to guarantee blind hole quality, so as to the product for avoiding blind hole and pad tangency location pad from being etched
Geological Problems, greatly reduce production outer graphics when because blind hole position pad pasting sealing of hole it is bad caused by pad etching scrap, saved at
This, reduces and scraps.
The invention will be further described in the following with reference to the drawings and specific embodiments.
Detailed description of the invention
Fig. 1 is a kind of process of the not full blind hole windowing production method of improvement filling perforation for providing of the specific embodiment of the invention
Figure；
Fig. 2 is the idiographic flow block diagram for the graphic making that the specific embodiment of the invention provides.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention into
One step introduction and explanation, but not limited to this.
The specific embodiment as shown in Fig. 1~2, a kind of improvement filling perforation provided in this embodiment not full blind hole windowing system
Make method, can be used in during the filling perforation of printed circuit board, realizes that reducing windowing reduces the difficulty that filling perforation plating is filled and led up, from
And greatly reduce production outer graphics when because blind hole position pad pasting sealing of hole it is bad caused by pad etching scrap, saved cost, reduce
It scraps.Specifically, can be used in various multiple-plate manufacturing process.
It is a kind of to improve the not full blind hole windowing production method of filling perforation, comprising the following steps:
S10, after being laminated to multiple substrates, internal layer wad cutter is beaten using X-ray target-shooting machine；
The plate progress graphic making of S20, internal layer wad cutter of having fought each other, use windowing catch point big 0.03mm more unilateral than blind hole aperture
The film to 0.06mm is exposed, and makes blind hole windowing；
S30, laser punching is carried out to the plate after blind hole windowing；
S40, filling perforation plating is carried out to plate；
Target when S50, line pattern contraposition are using windowing, carries out Etching；
S60, subsequent handling is normally made.
Above-mentioned S10 step, is laminated multiple substrates, and each monolithic layer, which has to pressing, can just produce multi-layer board.
Pressing movement is included in each interlayer and insulating layer is added, and will stick jail etc. each other.If there is the guide hole through several layers, then often
Layer all has to reprocess.Wiring on multiple-plate outside two sides is then usually just handled after multi-layer board pressing.
In addition, lamination is divided into hot pressing and cold pressing, it is cold-pressed after first hot pressing.
Laminate thickness theoretical value formula: thickness+each layer base of thickness+core material (being free of base copper) of all prepregs
Thickness × respective layer residual copper ratio of copper, wherein copper/base copper of residual copper ratio=useful.
Also, it for lamination, need to be laminated according to lamination principle below:
1, preferential to select thick plate；
2, symmetrical configuration；
3, when two sides base copper thickness is all 18 μm, it can be used alone the prepreg of a model 1080；
4, the thickness of interlayer prepreg answers 2 times of base copper of >, when for yin-yang plate, then answers 2 times of > thick base copper；
5, prepreg should outer thin interior thickness；
6, the number of interlayer prepreg answers≤3；
7, core material should be consistent with the material of prepreg；
8, when customer requirement is not achieved in plate thickness, tabula rasa can be added.
In order to increase the area that can be routed, the multi-layer board wiring plate in more single or double faces.Multi-layer board uses number
Piece dual platen, and firm (pressing) is sticked after putting a layer insulating between every laminate.The number of plies of plank has just represented several layers of independences
Wiring layer, the usual number of plies is all even number, and includes outermost two layers.Most motherboard is all 4 to 8 layers of knot
Structure, but can technically accomplish nearly 100 layers of pcb board.Large-scale supercomputer uses the motherboard of suitable multilayer mostly,
But because this kind of computer can be replaced with the cluster of many common computers, super multi-layer board is not used gradually
?.Because each layer in PCB all closely combines, generally it is less susceptible to find out actual number.
If guide hole is applied on dual platen, one to establish a capital be to punch entire plank.But in multi-layer board, if
It merely desires to connect some of routes, then guide hole may waste some other layers of route space.Buried via hole and blind hole technology can
To avoid this problem because they only penetrate it is wherein several layers of.Blind hole is to connect several layers of internal PCB with surface PCB, is not necessary to wear
Saturating entire plank.Buried via hole then only connects internal PCB, so light is can't see from surface.
In multi-layer board PCB, flood is all directly connected to ground wire and power supply.So each layer is classified as signals layer
(Signal), bus plane (Power) or ground plane (Ground).If the part on PCB needs different power supplys to supply, lead to
Normal this kind of PCB has two layers or more of power supply and rewiring layer.
Further, the plate of the S20 step, internal layer wad cutter of having fought each other carries out graphic making, uses windowing catch point ratio
The film of the unilateral big 0.03mm to 0.06mm in blind hole aperture is exposed, and the step of making blind hole windowing, is specifically included following
Step:
The plate progress pre-treatment of S201, internal layer wad cutter of having fought each other；
S202, pad pasting operation is carried out to plate；
S203, plate is exposed using the film of windowing catch point big 0.03mm to 0.06mm more unilateral than blind hole aperture；
S204, etching pressure and etching linear speed are adjusted according to practical copper thickness, carry out windowing etching.
Specifically, the S203 step, uses the film of windowing catch point big 0.03mm to 0.06mm more unilateral than blind hole aperture
In the step of being exposed to plate, specifically plate is exposed using the film of windowing catch point big 0.05mm more unilateral than blind hole aperture
Light.By the way that the laser drilling orifice plate windowing of blind hole windowing is contracted to big 0.05mm more unilateral than laser aperture, i.e., original half can
To solve the problems, such as that filling perforation is not full, so as to solve the quality problem that blind hole is etched with pad tangency location pad.
In addition, in other embodiments, can using windowing catch point big 0.03mm more unilateral than blind hole aperture the film to plate into
Row exposure；Or the film of windowing catch point big 0.04mm more unilateral than blind hole aperture；Or windowing catch point is more unilateral than blind hole aperture big
The film of 0.06mm.
In addition, generally using the positive film in S203 step in outer layer, process can be saved in this way, so to scheme to plate.Figure plating
When the first copper facing of 20 μm of copper facing, it is rear tin plating.Tin plating effect is that the route useful in etching is protected not to be etched.Work as internal layer
When the route positive film, figure plating only tin plating not copper facing, because internal layer circuit does not have to thicken.When for full plate coated plate, outer layer
Route only tin plating not copper facing, because full plate coated plate outer layer does not have to thicken.The tin plated when figure plating is pure tin, the welding performance of pure tin
It is bad, it fades away when so taking off tin later.
Pre-treatment is carried out in the plate of S201, internal layer wad cutter of having fought each other, nog plate processing specifically is carried out to plate, wherein nog plate
Processing includes two steps:
1, with pickling, in order to remove plate face oxide, prevent from sandwiching steam bubble and dry film corrugation.
2, it is washed with volcanic ash, it is therefore an objective to which the micro-rough for becoming plate face increases the binding force with prepreg.
Therefore, in processing before carrying out to plate, need each slot chemical concentration of strict control, the control of microetch amount 0.6um extremely
1.2um。
In addition, S204 step, the step of adjusting etching pressure and etching linear speed according to practical copper thickness, carry out windowing etching it
Before, it needs to make first plate, is done to prevent windowing big.
The S202 step, in the step of carrying out pad pasting operation to plate, specifically patch dry film, and dry film when pad pasting
Underlying membrane removes.
Three layers of dry film point: top layer is mylar；Middle layer is photoresist；Bottom is poly- alkene film.
When through-hole and blind hole coexist, figure is aligned using blind hole registration holes, preferential to guarantee blind hole quality, so as to keep away
Exempt from the quality problem that blind hole is etched with pad tangency location pad.
For above-mentioned S30 step, the step of laser punching is carried out to the plate after blind hole windowing, if production is
Multi-layer PCB board, and the inside, comprising buried via hole or blind hole, each laminate has to first drill and be electroplated before bonding.
If can not just be interconnected without the step.After being drilled according to drilling demand by machinery equipment, hole
Plating (plated through hole technology, Plated-Through-Hole technology, PTH) is had to pass through inside wall.Inside Kong Bi
After making metal processing, it can allow internal each sandwich circuit that can be connected to each other.Before starting plating, it is necessary to first fall in hole clearly
Sundries.This is because resin epoxy material can generate some chemical changes after the heating, and it can cover internal PCB layer, so
First to fall clearly, remove and plating movement can all be completed in chemical process.
Further, in the step of S50, to after blind hole windowing plate carry out laser punching the step of in, specifically
It is normally to be made using the laser energy in corresponding aperture, contraposition uses the optics pad of windowing film quadrangle.
In S60 step, normal the step of making subsequent handling, including outer layer development, etching, striping are carried out to plate, and right
Plate carries out photosensitive solder resist and surface treatment.
Specifically, carrying out photosensitive solder resist to plate, i.e., ink is printed on silk screen, general silk-screen solder mask is with a thickness of 10 μ
M, word are added in the word of solder mask silk-screen word, and alternatively referred to as green oil word, line width is generally 8mil.
In addition, generally to plate carry out photosensitive solder resist after, it is also necessary to welding resistance image shift, welding resistance windowing be the welding resistance film
On figure be called welding resistance windowing, the distance that headroom degree, that is, pad side to oil film is crossed, disk headroom degree >=2mil, square plate headroom degree
≥1mil。
One layer of gold or silver or tin are usually onboard plated in surface treatment.
For multi-layer board during making pcb board, the first step must all carry out sawing sheet, be to cover copper to copper-clad plate sawing sheet
Plate is exactly the core plate of two sides covering copper sheet.Copper-clad plate, which is constituted, is generally substrate+base copper, and substrate is configured to epoxy resin+glass fibers
Dimension, base material thickness >=0.05mm, base copper thickness are generally 18 μm, 35 μm, 70 μm of three specifications.
After the completion of sawing sheet, need to carry out interior tomographic image transfer, specific steps are as follows:
1, internal layer nog plate, in two steps:
1) pickling is used；
2) it is washed with volcanic ash；
2, internal layer pad pasting；
3, film aligning: being aligned by edges of boards geneva flange aperture, when contraposition, uses fitting strip, fitting strip will be put into two panels
Core material uniform thickness between gill fungus woods, the film are generally negative film.
4, it exposes: with white light to film vertical irradiation.
5, develop: the dry film not being exposed is melted.(note: removing top layer film after exposure, before development, if in advance
Remove teleblem, then oxygen can be spread to photoresist, destroy free radical, sensitivity is caused to decline.)
6, it etches: otiose copper is melted.
Etching is divided into corresponding etching to compensate and compensation etches:
A: it corresponding etching to compensate: is compensated on positive or negative film line film, that is, widens line width.
Compensation standard are as follows:
| Base copper is thick | Internal layer compensation | Outer layer compensation |
| 18μm | 0mil | 1mil |
| 35μm | 0.4mil | 1.5mil |
| 70μm | 1.0mil | 3.0mil |
Yin-yang plate notes when compensating: the thin one side of plate compensates more, because parameter temporal T when etching is to be with thick base copper
It is quasi-.Then have: 18/35 compensation: 1.2/0.4；35/70 compensation: 2.4/1.0.
B: compensation etching: is mended in time since the two sides etching solution concentration of the plate of same plate thickness is different
It repays, needs to carry out the time bias of a △ T more.
C: unit conversion: 1 foot=12 inches feet: foot inches: inch
1foot=12inch 1inch=1000mi l
1mm=39.37mil ≈ 40mil 1inch=25.4mm ≈ 25mm
1mil=0.025mm=25 μm
7, it takes off film: the dry film being exposed being melted, with highly basic (NaOH).
In addition, there are some pcb boards in the production process in other embodiments, need to carry out AOI after interior tomographic image transfer
Detection.
AOI, i.e. Automatic Optical Instrument, that is, automatic optics inspection, also known as half examines, and can check
Manufacturing issue out.
In addition, there are some pcb boards in the production process in other embodiments, need to carry out brownification after AOI detection,
Exactly make the cuprous oxide (CU that one layer of brown is generated on route2O), such purpose is to enhance and the combination of prepreg
Power.
The not full blind hole windowing production method of above-mentioned a kind of improvement filling perforation, by using windowing catch point than blind hole aperture
The film of unilateral big 0.05mm is exposed, and the laser drilling orifice plate windowing of blind hole windowing is contracted to more unilateral than laser aperture big
0.05mm reduces blind hole windowing size, solves the problems, such as that filling perforation is not full, and when through-hole and blind hole coexist, figure uses blind hole pair
The contraposition of position hole, it is preferential to guarantee blind hole quality, so as to the quality problem for avoiding blind hole and pad tangency location pad from being etched,
Greatly reduce production outer graphics when because blind hole position pad pasting sealing of hole it is bad caused by pad etching scrap, saved cost, reduced
It scraps.
It is above-mentioned that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand, but not
It represents embodiments of the present invention and is only limitted to this, any technology done according to the present invention extends or recreation, by of the invention
Protection.Protection scope of the present invention is subject to claims.
Claims (9)
1. a kind of improve the not full blind hole windowing production method of filling perforation, which comprises the following steps:
After being laminated to multiple substrates, internal layer wad cutter is beaten using X-ray target-shooting machine；
Fought each other internal layer wad cutter plate carry out graphic making, use windowing catch point big 0.03mm to 0.06mm more unilateral than blind hole aperture
The film be exposed, and make blind hole windowing；
Laser punching is carried out to the plate after blind hole windowing；
Filling perforation plating is carried out to plate；
Target when line pattern contraposition is using windowing, carries out Etching；
Normal production subsequent handling.
2. a kind of blind hole windowing production method that improvement filling perforation is not full according to claim 1, which is characterized in that described
Fought each other internal layer wad cutter plate carry out graphic making, use windowing catch point big 0.03mm to 0.06mm more unilateral than blind hole aperture phenanthrene
Woods is exposed, and the step of making blind hole windowing, specifically includes the following steps:
Fought each other internal layer wad cutter plate carry out pre-treatment；
Pad pasting operation is carried out to plate；
Plate is exposed using the film of windowing catch point big 0.03mm to 0.06mm more unilateral than blind hole aperture；
Etching pressure and etching linear speed are adjusted according to practical copper thickness, carries out windowing etching.
3. a kind of not full blind hole windowing production method of filling perforation that improves according to claim 2 is it is characterized in that, described
Fought each other internal layer wad cutter plate carry out pre-treatment the step of in, microetch amount control in 0.6um to 1.2um.
4. a kind of blind hole windowing production method that improvement filling perforation is not full according to claim 3, which is characterized in that described
Fought each other internal layer wad cutter plate carry out pre-treatment the step of in, specifically to plate carry out nog plate processing.
5. a kind of blind hole windowing production method that improvement filling perforation is not full according to claim 4, which is characterized in that described
In the step of being exposed using the film of windowing catch point big 0.03mm to 0.06mm more unilateral than blind hole aperture to plate, specifically adopt
Plate is exposed with the film of windowing catch point big 0.05mm more unilateral than blind hole aperture.
6. a kind of blind hole windowing production method that improvement filling perforation is not full according to claim 5, which is characterized in that described
Before the step of adjusting etching pressure and etching linear speed according to practical copper thickness, carry out windowing etching, need to make first plate.
7. a kind of blind hole windowing production method that improvement filling perforation is not full according to claim 6, which is characterized in that described
In the step of carrying out pad pasting operation to plate, dry film is specifically pasted, and the underlying membrane of dry film is removed when pad pasting.
8. a kind of blind hole windowing production method that improvement filling perforation is not full according to any one of claims 1 to 6, feature
It is, in the step of plate to after blind hole windowing carries out laser punching, specifically using the laser energy in corresponding aperture
The normal production of amount, contraposition use the optics pad of windowing film quadrangle.
9. a kind of blind hole windowing production method that improvement filling perforation is not full according to claim 8, which is characterized in that described
The step of normal production subsequent handling, including outer layer development, etching, striping carried out to plate, and to plate carry out photosensitive solder resist and
Surface treatment.
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| CN201611027703.9A CN106455370B (en) | 2016-11-17 | 2016-11-17 | It is a kind of to improve the not full blind hole windowing production method of filling perforation |
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| CN201611027703.9A CN106455370B (en) | 2016-11-17 | 2016-11-17 | It is a kind of to improve the not full blind hole windowing production method of filling perforation |
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| CN108925043A (en) * | 2018-06-04 | 2018-11-30 | 广州美维电子有限公司 | A kind of CO for PCB2The foolproof method that laser is uncapped |
| CN110430677B (en) * | 2019-07-11 | 2022-01-04 | 珠海崇达电路技术有限公司 | PCB preparation method for improving burr of back drilling hole and smaller press connection hole |
| CN112333918B (en) * | 2020-10-27 | 2022-07-01 | 定颖电子（昆山）有限公司 | Manufacturing method of printed circuit board 8-shaped blind hole |
| CN113556877B (en) * | 2021-07-20 | 2023-01-17 | 全成信电子（深圳）股份有限公司 | Process for rapidly treating small holes after etching of inner layer circuit |
| CN117979561A (en) * | 2024-03-29 | 2024-05-03 | 淄博芯材集成电路有限责任公司 | Printed circuit board manufacturing method capable of improving exposure target reading rate |
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| CN105263274A (en) * | 2015-10-28 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Manufacture method of high density interconnection board |
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| JPH05259640A (en) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | Manufacture of high density printed wiring board with blind hole |
| CN102036508A (en) * | 2011-01-05 | 2011-04-27 | 惠州中京电子科技股份有限公司 | Multi-layer HDI circuit board blind hole windowing process |
| CN103841773A (en) * | 2012-11-20 | 2014-06-04 | 深南电路有限公司 | Method and device for electroplating blind holes |
| CN105263274A (en) * | 2015-10-28 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Manufacture method of high density interconnection board |
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