CN108495486A - A kind of production method and High speed rear panel of High speed rear panel - Google Patents
A kind of production method and High speed rear panel of High speed rear panel Download PDFInfo
- Publication number
- CN108495486A CN108495486A CN201810317680.8A CN201810317680A CN108495486A CN 108495486 A CN108495486 A CN 108495486A CN 201810317680 A CN201810317680 A CN 201810317680A CN 108495486 A CN108495486 A CN 108495486A
- Authority
- CN
- China
- Prior art keywords
- daughter board
- high speed
- production method
- rear panel
- prepreg
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
Abstract
The present invention relates to PCB technical fields, disclose a kind of production method and High speed rear panel of High speed rear panel, and the production method includes：Make the first daughter board, the second daughter board and solidification spacer, and drilled respectively to the first daughter board and the second daughter board, counterbore plating and graphic making；Motherboard is made in pressing after first daughter board, the first prepreg, the solidification spacer, the second prepreg and second daughter board are stacked gradually.The implementation of motherboard is made using first two daughter boards of making according still further to the sequence lamination pressing of " daughter board+prepreg+solidification spacer+prepreg+daughter board " for the embodiment of the present invention, by adding solidification spacer in the middle layer of multiple prepregs between two daughter boards, it can control effectively to gummosis amount in the hole of upper and lower daughter board, avoid the generation of cavity and lamination between multiple prepregs, and reduce the stress that motherboard pressing generates, improve the reliability of product.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed wiring board) technical fields, more particularly to one kind
The production method and High speed rear panel of High speed rear panel.
Background technology
With highly integrated and I/O quantity increase, the progress of electronics assembly technology and the letter of electronic component on wiring board
The high frequency and upgrading and the replacement demand of high-speed digitization development and electronic equipment high speed development of number transmission, PCB by
Gradually develop to directions such as bearing function daughter board, signal transmission and power deliveries, and its signal processing function is then gradually weakening, it should
Class PCB is backboard.Backboard (Backplane or Back panel) refers to being mainly used for holding with circuit and numerous socket holes
Other functional daughter boards and chip are carried, a type printed circuit board of high speed transmission of signals is played, as one of key element, quilt
It is widely used in the important events such as communication, space flight, supercomputer, Medical Devices, military base station.
High speed rear panel can also be achieved two-sided crimping while realizing through-hole and blind hole, improve wiring density, reduce
PCB sizes, thus have a wide range of applications.In being commonly designed, two-sided crimping High speed rear panel is by several core plates and prepreg
Two daughter boards are first completed after being sequentially laminated, after two daughter boards complete drilling, plating, graphic making and the surface treatment in crimping hole,
Two daughter boards are subjected to second pressing using multiple prepregs again, it is larger since many apertures can be opened up on daughter board before pressing
Crimping hole and back drill hole, prepreg can flow in crimping hole at high temperature in bonding processes, not only gummosis enter hole amount
It is difficult to control, and is susceptible to cavity and layering between prepreg.
Invention content
The purpose of the present invention is to provide a kind of production method of High speed rear panel and High speed rear panels, and the prior art is overcome to exist
Gummosis enter hole amount be difficult to control and multiple prepregs between easily occur cavity and layering defect.
For this purpose, the present invention uses following technical scheme：
A kind of production method of High speed rear panel, the production method include：
The first daughter board, the second daughter board and solidification spacer are made, and first daughter board and the second daughter board are carried out respectively
Drilling, counterbore plating and graphic making；
By first daughter board, the first prepreg, the solidification spacer, the second prepreg and second daughter board
Motherboard is made in pressing after stacking gradually.
Optionally, the solidification spacer is non-conductive, and thickness is 2mil~10mil.
Optionally, the solidification spacer is consistent with first daughter board or the size and shape of the second daughter board.
Optionally, it in the production method, is made according to the swell-shrink coefficient of first daughter board and the second daughter board described solid
Change spacer.
Optionally, first prepreg and the second prepreg are low fluidity prepreg.
Optionally, the quantity of first prepreg and the second prepreg is two, and every described the first half solid
The thickness for changing piece and every second prepreg is 3mil~3.5mil, and resin content is not less than 30%.
Optionally, the production method further includes：It is drilled on the motherboard, heavy copper is electroplated and graphic making.
A kind of High speed rear panel, the High speed rear panel are made according to any production method as above.
Compared with prior art, beneficial effects of the present invention are：
The embodiment of the present invention is using first two daughter boards of making according still further to " daughter board+prepreg+solidification spacer+semi-solid preparation
The implementation of motherboard is made in the sequence lamination pressing of piece+daughter board ", by multiple prepregs between two daughter boards
Middle layer adds solidification spacer, can control effectively to gummosis amount in the hole of upper and lower daughter board, avoid multiple prepregs
Between cavity and lamination generation, and reduce motherboard pressing generate stress, improve the reliability of product.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the production method flow chart of High speed rear panel provided in an embodiment of the present invention；
Fig. 2 is the structure chart of daughter board provided in an embodiment of the present invention；
Fig. 3 is the structure chart of solidification spacer provided in an embodiment of the present invention；
Fig. 4 is lamination sequential schematic in pressing working procedure provided in an embodiment of the present invention.
Specific implementation mode
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
All other embodiment that those of ordinary skill is obtained without making creative work, belongs to protection of the present invention
Range.
Embodiment one
Referring to Fig. 1, present embodiments providing a kind of production method of High speed rear panel, including step：
Step 101, according to normal process flow, make the first daughter board and the second daughter board respectively.
In this step, each daughter board is by outer layer core plate and making has the core material of inner line figure to press,
Specifically manufacture craft is：
1) sawing sheet
According to design requirement, a copper-clad plate greatly is cut into required size, is convenient for rear process operations.
Copper-clad plate is pressed by copper foil and insulating materials (glass cloth and resin etc.), and according to plate thickness, copper is thick, material is different
There is different size.
After sawing sheet, edges of boards burr needs fillet to handle；It needs to be toasted after sawing sheet, to increase dimensional stability, avoid
Harmomegathus；Sawing sheet notes also consistent through, latitude direction and engineering instruction, avoids warpage issues.
2) pattern transfer principle is utilized to make internal layer circuit
Internal layer circuit is to make multiple-plate core process, is exerted a decisive influence to multi-layer board quality, production process
It is followed successively by：Pre-treatment, tabletting, contraposition/exposure are developed, and piece is moved back in etching, practices shooting, AOI (Automatic Optical
Inspection, automatic optics inspection).
The purpose of pre-treatment：The pollutant on copper face is removed, copper face roughness is increased, follow-up patch is more secured.
The purpose of tabletting：Substrate copper face is sticked into chromatic plate through hot pressing mode, as the basis for being subsequently formed circuit.
The purpose of exposure：It is irradiated through UV light and the circuit image on the film (egative film) is transferred on chromatic plate.Technique is former
Reason：The dry plate of white light transmission part sees UV light and photopolymerization reaction occurs, and the lighttight dry plate of black does not react.
The purpose of development：The dry plate that photopolymerization reaction does not occur is dissolved using sodium carbonate, image is allowed to display.Work
Skill principle：The dry plate of photopolymerization reaction does not occur can be carbonated sodium dissolving, and the dry plate that photopolymerization reaction occurs cannot dissolve
Fall, is retained in plate face, anticorrosion protection layer when as subsequent etch.
The purpose of acid etching：The copper corrosion exposed after development is fallen using etching solution, forms line pattern.Technique is former
Reason：It is dissolved since copper can be etched liquid, etching solution can be dissolved in by the copper that dry plate is protected, and by the copper of dry plate protection
It will not dissolve, ultimately form circuit.
Move back the purpose of piece：The resist layer of copper face will be protected to peel off using highly basic, exposes line pattern.
The purpose of target practice：The wad cutter of edges of boards is gone out using CCD para-position, convenient for riveted when follow-up lamination.
The purpose of AOI：It detects the disadvantage on circuit, is repaired, improve qualification rate.Technological principle：First by circuit text
Part calls in AOI equipment, and AOI device scans material object printed line road is made comparisons with the simulation files in equipment, finds out different position,
That is disadvantage position.
3) multiple core plates are laminated
Lamination flow is followed successively by：To target, brown, walkthrough/riveted, lamination, pressing plate, target practice/milling side.
To the purpose of target：The wad cutter of edges of boards is gone out using CCD para-position, convenient for riveted when follow-up lamination.
The purpose of brown：Roughening, cleaning copper face, enhancement line and resin contact surface area are allowed to press tighter, avoid
Layering.
The purpose of walkthrough/riveted：Multiple core materials are nailed together using rivet, interlayer is generated when avoiding subsequently pressing
Sliding.
The purpose of lamination：Multiple plates folded in advance are built up into multi-layer plate form to be pressed.
The purpose of pressing plate：The core material stacked is pressed into multi-layer board by hot pressing mode.
The purpose on target practice/milling side：There is provided follow-up milling side, drilling location hole；The extra side milling being laminated around back plate is fallen,
The edges of boards of formation rule are convenient for following process.
Step 102, according to normal process flow and design requirement, drilled respectively to the first daughter board and the second daughter board,
The operations such as counterbore plating, graphic making and surface treatment.
So far, it will be formed by greater number of crimping hole and back drill hole on the first daughter board and the second daughter board.
Step 103 makes solidification spacer compatible with the first daughter board and the second daughter board.
In this step, solidification spacer will be stacked between the first daughter board and the second daughter board in subsequent pressing working procedure,
Thus in order to keep the flatness of pressing postnotum, the size and shape for curing spacer need and the first daughter board and the second daughter board
It is almost the same.The solidification spacer is non-conductive, will not be softened in the case where being laminated hot conditions.
Simultaneously as in subsequent pressing working procedure, the first daughter board and the second daughter board can influence to generate breathing because of temperature, because
And the solidification spacer of suitable dimension can be made in this step according to the swell-shrink coefficient of daughter board.
Step 103 is pressed after stacking gradually the first daughter board, prepreg, solidification spacer, prepreg and the second daughter board
Motherboard is made in conjunction.
If cured, spacer is blocked up, and the thickness for not only resulting in entire backboard becomes larger, and occupies larger space, and can increase
Add and difficulty is electroplated in the drilling difficulty and hole of motherboard.Thus, the solidification spacer of the present embodiment is designed using suitable thickness, can
Think 2mil~10mil.
Prepreg preferably uses low fluidity prepreg.Prepreg between first daughter board and solidification spacer
The quantity of prepreg between quantity, and solidification spacer and the second daughter board may respectively be 2, the thickness of every prepreg
Degree can be 3mil~3.5mil.It on the one hand can avoid flowing into excessive glue amount in hole in this way, on the one hand can avoid because glue amount is inadequate
Cause filler insufficient.
Step 104 carries out drilling and the plating of heavy copper on motherboard, and makes outer-layer circuit figure, carries out other later often
Rule operation.
An application example is provided below：
First, two daughter boards 1 as shown in Figure 2 are made according to normal process flow, and pin is opened up in the edges of boards of daughter board 1
Hole；Then, solidification spacer 2 as shown in Figure 3 is made according to daughter board swell-shrink coefficient, and is opened up in the edges of boards of solidification spacer 2
The holes pin；Later, as shown in figure 4, according to " daughter board 1+ prepregs 3+ solidification spacer 2+ prepreg 3+ daughter boards 1 " sequence
Lamination presses, and motherboard is made.
To sum up, the present embodiment is using two daughter boards are first made, according still further to " daughter board+prepreg+solidification spacer+half is solid
The implementation of motherboard is made in the sequence lamination pressing of change piece+daughter board ", by multiple prepregs between two daughter boards
Middle layer add solidification spacer, the quantity and thickness parameter of prepreg are accurately set, can be to upper and lower daughter board
Hole in gummosis amount control effectively, while can avoid the generation of cavity and lamination between multiple prepregs, and reduce
The stress that motherboard pressing generates, improves the reliability of product.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Stating embodiment, invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
Modification or replacement, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution.
Claims (8)
1. a kind of production method of High speed rear panel, which is characterized in that the production method includes：
The first daughter board, the second daughter board and solidification spacer are made, and drilled respectively to first daughter board and the second daughter board,
Counterbore plating, graphic making and surface treatment；
Successively by first daughter board, the first prepreg, the solidification spacer, the second prepreg and second daughter board
Motherboard is made in pressing after stacking.
2. the production method of High speed rear panel according to claim 1, which is characterized in that the solidification spacer is non-conductive
Property, thickness is 2mil~10mil.
3. the production method of High speed rear panel according to claim 1, which is characterized in that the solidification spacer and described first
The size and shape of daughter board or the second daughter board are consistent.
4. the production method of High speed rear panel according to claim 3, which is characterized in that in the production method, according to described
The swell-shrink coefficient of first daughter board and the second daughter board makes the solidification spacer.
5. the production method of High speed rear panel according to claim 1, which is characterized in that first prepreg and the second half
Cured sheets are low fluidity prepreg.
6. the production method of High speed rear panel according to claim 1, which is characterized in that first prepreg and the second half
The quantity of cured sheets is two, and the thickness of every first prepreg and every second prepreg is 3mil
~3.5mil, resin content are not less than 30%.
7. the production method of High speed rear panel according to claim 1, which is characterized in that the production method further includes：Institute
State drilled on motherboard, the plating of heavy copper and graphic making.
8. a kind of High speed rear panel, which is characterized in that the High speed rear panel is according to any production method system of claim 1 to 7
At.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810317680.8A CN108495486A (en) | 2018-04-10 | 2018-04-10 | A kind of production method and High speed rear panel of High speed rear panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810317680.8A CN108495486A (en) | 2018-04-10 | 2018-04-10 | A kind of production method and High speed rear panel of High speed rear panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108495486A true CN108495486A (en) | 2018-09-04 |
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ID=63315629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810317680.8A Pending CN108495486A (en) | 2018-04-10 | 2018-04-10 | A kind of production method and High speed rear panel of High speed rear panel |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110708896A (en) * | 2019-10-18 | 2020-01-17 | 生益电子股份有限公司 | PIN hole machining method and HDI board manufacturing method |
| CN110708894A (en) * | 2019-10-18 | 2020-01-17 | 生益电子股份有限公司 | Manufacturing method of HDI board |
| CN110996558A (en) * | 2019-10-31 | 2020-04-10 | 华宇华源电子科技（深圳）有限公司 | Pressing process of super-thick multilayer board |
| CN111315158A (en) * | 2020-03-27 | 2020-06-19 | 深圳市景旺电子股份有限公司 | Circuit board manufacturing method and circuit board |
| CN113873745A (en) * | 2021-09-18 | 2021-12-31 | 华为技术有限公司 | Printed Circuit Board (PCB) and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5672226A (en) * | 1995-10-11 | 1997-09-30 | Delco Electronics Corporation | Process of forming multilayer circuit boards |
| CN101784163A (en) * | 2010-03-26 | 2010-07-21 | 华为技术有限公司 | Printed circuit board and processing method of printed circuit board |
| CN104812174A (en) * | 2015-03-27 | 2015-07-29 | 深圳市五株科技股份有限公司 | Prepreg blind hole and slot forming method |
-
2018
- 2018-04-10 CN CN201810317680.8A patent/CN108495486A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5672226A (en) * | 1995-10-11 | 1997-09-30 | Delco Electronics Corporation | Process of forming multilayer circuit boards |
| CN101784163A (en) * | 2010-03-26 | 2010-07-21 | 华为技术有限公司 | Printed circuit board and processing method of printed circuit board |
| CN104812174A (en) * | 2015-03-27 | 2015-07-29 | 深圳市五株科技股份有限公司 | Prepreg blind hole and slot forming method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110708896A (en) * | 2019-10-18 | 2020-01-17 | 生益电子股份有限公司 | PIN hole machining method and HDI board manufacturing method |
| CN110708894A (en) * | 2019-10-18 | 2020-01-17 | 生益电子股份有限公司 | Manufacturing method of HDI board |
| CN110996558A (en) * | 2019-10-31 | 2020-04-10 | 华宇华源电子科技（深圳）有限公司 | Pressing process of super-thick multilayer board |
| CN111315158A (en) * | 2020-03-27 | 2020-06-19 | 深圳市景旺电子股份有限公司 | Circuit board manufacturing method and circuit board |
| CN113873745A (en) * | 2021-09-18 | 2021-12-31 | 华为技术有限公司 | Printed Circuit Board (PCB) and preparation method thereof |
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Application publication date: 20180904 |
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