CN106793588A - Wiring board and preparation method thereof - Google Patents
Wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN106793588A CN106793588A CN201611218351.5A CN201611218351A CN106793588A CN 106793588 A CN106793588 A CN 106793588A CN 201611218351 A CN201611218351 A CN 201611218351A CN 106793588 A CN106793588 A CN 106793588A
- Authority
- CN
- China
- Prior art keywords
- copper
- wiring board
- preparation
- layer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to a kind of wiring board and preparation method thereof.The preparation method comprises the following steps：Sawing sheet：Double face copper is taken, the double face copper includes the first copper clad layers and second copper-clad layer；Drill for the first time：Thermal hole is bored in the double face copper；Inner figure layer makes：Conventionally first copper clad layers are carried out with pattern transfer, inner figure layer is formed；Pressing：Prepreg and Copper Foil are stacked gradually in the surface of inner figure layer；Pressing, obtains daughter board；Drill for second：The daughter board is drilled；Outer graphics layer makes：Pattern transfer is conventionally carried out to the Copper Foil, outer graphics layer is formed；Rear operation is conventionally carried out, the wiring board is obtained.Preparation method of the invention can be avoided additionally adding being produced when copper coin is pressed and combine unstable problem, while simplifying operation, with combining stabilization, wiring board properties of product reliability between good radiating effect, and each layer.
Description
Technical field
The present invention relates to wiring board, more particularly to a kind of wiring board and preparation method thereof.
Background technology
With the popularization and extensive use of electronic product, copper base make wiring board production and manufacturing technology also constantly more
New and development.Copper base is the excellent substrate of a kind of high-cooling property, excellent dimensional stability, high mechanical strength, processing characteristics,
Radiating effect is than aluminium base and iron substrate, it is adaptable to high-frequency circuit and high/low temperature change regional and accurate communication equipment greatly
Radiating.
The setting of current copper base is divided into two kinds of sandwich and core shift, the i.e. unilateral or interlayer in former circuit panel products and increases gold
Category copper coin is simultaneously pressed by prepreg and is increased radiating effect, is improved Quality of electronic products and is increased the service life, base
In the above method, copper coin combined with prepreg after integrity problem into industry key breakthrough problem.Existing production work
In skill and technology, to increase the adhesion between metal copper plate and prepreg, it will usually which copper coin is surface-treated,
Concrete technology has a chemical treatment methods such as black oxidation, brown, but the copper base that above-mentioned processing mode is obtained, with prepreg
With reference to or it is unstable, unfailing performance does not reach requirement yet, so as to influence the performance of whole wiring board.
The content of the invention
Based on this, it is necessary to provide a kind of good heat dissipation effect, and the reliable wiring board of properties of product preparation method.
A kind of preparation method of wiring board, comprises the following steps：
Sawing sheet：Double face copper is taken, the double face copper includes the first copper clad layers and second copper-clad layer；Described second covers
The thickness of layers of copper is 0.5~5mm；
Drill for the first time：Thermal hole is bored in the double face copper；
Inner figure layer makes：Conventionally first copper clad layers are carried out with pattern transfer, inner figure is formed
Layer；
Pressing：Prepreg and Copper Foil are stacked gradually in the surface of inner figure layer；Pressing, obtains daughter board；
Drill for second：The daughter board is drilled；
Outer graphics layer makes：Pattern transfer is conventionally carried out to the Copper Foil, outer graphics layer is formed；
Rear operation is conventionally carried out, the wiring board is obtained.
The preparation method of wiring board of the invention, novelty it is direct based on double face copper, by the double-sided copper-clad
The one side of plate is pressed as internal layer circuit layer by prepreg and outer graphics layer, another side then as heat dissipating layer,
Thus avoid generation when extra addition copper coin is pressed and combine unstable problem, while simplifying operation, with preferably scattered
Stabilization is combined between thermal effect, and each layer.
Coordinate the preparation method, it is necessary to rationally control the thickness of second copper-clad layer, it is excessively thin to be unfavorable for radiating, blocked up then hardly possible
To ensure its adhesion with double face copper core plate.It is 0.5~5mm that the present invention controls the thickness of second copper-clad layer, can
The good radiating effect of wiring board is obtained, and is difficult to peel off, adhesion is strong, wiring board properties of product reliability.
Wherein in one embodiment, the thickness of the second copper-clad layer is 0.5~2mm.
Wherein in one embodiment, the thickness of first copper clad layers is 0.5~5OZ；The thickness of the Copper Foil is 0.1
~2OZ.
Coordinate the thickness of above-mentioned second copper-clad layer, the copper thickness to inner figure and outer graphics is rationally controlled, and is being protected
While card circuit is reliable and stable, be conducive to the heat that each layer is produced to be spread to second copper-clad layer, improve radiating efficiency.
Wherein in one embodiment, the thickness of first copper clad layers is 0.5~2OZ；The thickness of the Copper Foil is 0.1
~0.5OZ.
Wherein in one embodiment, the thermal hole is through hole, a diameter of 0.4~3mm.Using the heat conduction of the size
Hole, is more beneficial for the derivation of the heat that each layer of wiring board is produced.
Wherein in one embodiment, the technique of the first time drilling is：Rotating speed is 20~60rpm, enter speed for 20~
30 inch per minutes, R values are 300~500.
Wherein in one embodiment, a diameter of 4~7mil in the hole that second drilling is formed.
Wherein in one embodiment, the technique of second drilling is：Using laser drill, frequency is 180~
150Hz, pulse width is 3~15 μ s, and laser energy is 3~26mJ, and pulse number is that 1~7, Mask sizes are 1~4mm.By
This is that signal provides reliable basis in each interlayer conduction, and the installation of electronic component.
Wherein in one embodiment, the technique of the pressing is：Temperature is 150~190 DEG C, and pressure is 35~241N/
cm2, vacuum is 0.5~1.5bar.
The preparation method that the present invention also provides described wiring board makes the wiring board for obtaining.The wiring board radiating effect
It is good, stabilization is firmly combined with, reliability is high.
Brief description of the drawings
Fig. 1 is the structural representation that the embodiment of the present invention 1 makes the wiring board for obtaining.
Specific embodiment
Wiring board of the invention and preparation method thereof is described in further detail below in conjunction with specific embodiment.
The double face copper used in the embodiment of the present invention is purchased from EMC (platform photoelectron material Co., Ltd of Zhongshan city), type
Number be EM-MP C1100, thickness be 42.4+/- 4mil.
Prepreg is purchased from EMC (platform photoelectron material Co., Ltd of Zhongshan city), model 1080RC64.
1mil=25.4 μm in the present invention；1OZ=1.35mil, i.e., about 35 μm.
Embodiment 1
A kind of preparation method of wiring board of the present embodiment, comprises the following steps：
1st, the making of copper-based core plate
(1) sawing sheet：Double face copper is taken, the double face copper includes the first copper clad layers and second copper-clad layer, wherein first
The thickness of copper clad layers is 1OZ, and the thickness of second copper-clad layer is 1mm；Double face copper aniseed is cut into the small powder of specified size processed；
(2) drill for the first time：Thermal hole is bored on small powder, a diameter of 0.4~3mm of the thermal hole, bore process program
As shown in table 1；
Table 1
(3) inner figure makes：Using negative film egative film, conventionally etching is made in the first thick copper clad layers of 1OZ
Make inner figure；Specific process flow is nog plate-rumble film-exposure-development, and wherein rumble membrane process uses 1.5mil dry films；Second
Copper clad layers are not provided with circuit；
(4) automatic optics inspection (AOI) is carried out to inner figure according to normal process steps, checks inner figure circuit whether there is out
The problems such as road, short circuit, unnet erosion；
(5) melanism：Brown is carried out to the first copper clad layers according to normal process steps, successively including upper plate-oil removing-washing-preimpregnation-
Brown-washing-drying-plate-cooling-ejecting plate operation；Thus increase surface area, increase adhesion.
2nd, pressing plate：Striden by laminate structure successively layer and rapid 1 make the double face copper (the first copper clad layers are upward) that obtains, with
And prepreg and the thick Copper Foils of 1/3OZ, multi-layer sheet is then made at high temperature under high pressure, process is as shown in table 2.
Table 2
3rd, laser drill：Laser drill is carried out to multi-layer sheet, the aperture of formation is 4~7mil, is that signal is led in each interlayer
Lead to and assign some electronic components to provide basis.The technique that laser drill is used is as shown in table 3.
Table 3
4th, heavy copper, panel plating：The hole wall conventionally formed in laser drill using chemical reaction deposits copper, fills out
Flat laser drill.
5th, outer graphics make：Using positive egative film, conventionally etching makes outer layer figure on the thick Copper Foils of 3OZ
Shape；Specific process flow is nog plate-rumble film-exposure-development, and wherein rumble membrane process uses 2.0mil dry films.
6th, outer graphics are carried out with automatic optics inspection (AOI) according to normal process steps, checks outer graphics circuit whether there is out
The problems such as road, short circuit, unnet erosion.
7th, rear operation is conventionally carried out, wiring board is obtained final product, its structure is as shown in Figure 1.
Embodiment 2
A kind of preparation method of wiring board of the present embodiment, its step similar embodiment 1, difference is：
First copper clad layers thickness of the double face copper used in step 1 is 0.5OZ, and second copper-clad thickness degree is 5mm；Step
The copper thickness used in rapid 2 is 2OZ.
Embodiment 3
A kind of preparation method of wiring board of the present embodiment, its step similar embodiment 1, difference is：
First copper clad layers thickness of the double face copper used in step 1 is 5OZ, and second copper-clad thickness degree is 5mm；Step
The copper thickness used in 2 is 0.1OZ.
Comparative example 1
A kind of preparation method of wiring board of the present embodiment, its step similar embodiment 1, difference is：Comprise the following steps：
1st, the making of copper-based core plate
(1) sawing sheet：Double face copper is taken, the double face copper includes the first copper clad layers and second copper-clad layer, wherein first
The thickness of copper clad layers is 1OZ, and the thickness of second copper-clad layer is 1mm；Double face copper aniseed is cut into the small powder of specified size processed；
(2) graphic making：Using negative film egative film, conventionally etching is made in the first copper clad layers and second copper-clad layer
Make figure；Specific process flow is nog plate-rumble film-exposure-development, and wherein rumble membrane process uses 1.5mil dry films；
(4) carry out automatic optics inspection (AOI) to inner figure according to normal process steps, check figure circuit whether there is open circuit,
The problems such as short circuit, unnet erosion；
(5) melanism：First copper clad layers are carried out with melanism, technique is with embodiment 1.
2nd, pressing plate：Striden by laminate structure successively layer and rapid 1 make the double face copper (the first copper clad layers are upward) that obtains, with
And the thick Copper Foil of prepreg and 1/3OZ (figure not being made subsequently, using the Copper Foil as heat-conducting layer), then at high temperature under high pressure
Multi-layer sheet is made, technique is with embodiment 1.
Comparative example 2
A kind of preparation method of wiring board of this comparative example, its step similar embodiment 1, difference is：
First copper clad layers thickness of the double face copper used in step 1 is 1OZ, and second copper-clad thickness degree is 8mm；Step
The copper thickness used in 2 is 1/3OZ.
Peel strength measure of merit is carried out to the wiring board that the embodiment and comparative example are obtained.
Peel strength test method：Plate after the completion of taking, copper sheet is peeled off with the speed of 50mm/min, and device therefor is omnipotent
Material testing machine Germany BZ2.5/TNIS types, peel strength requirement >=1.0N/mm.
Test result is as shown in table 1.
Table 1
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed, but simultaneously
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of preparation method of wiring board, it is characterised in that comprise the following steps：
Sawing sheet：Double face copper is taken, the double face copper includes the first copper clad layers and second copper-clad layer；The second copper-clad layer
Thickness be 0.5~5mm；
Drill for the first time：Thermal hole is bored in the double face copper；
Inner figure layer makes：Conventionally first copper clad layers are carried out with pattern transfer, inner figure layer is formed；
Pressing：Prepreg and Copper Foil are stacked gradually in the surface of inner figure layer；Pressing, obtains daughter board；
Drill for second：The daughter board is drilled；
Outer graphics layer makes：Pattern transfer is conventionally carried out to the Copper Foil, outer graphics layer is formed；
Rear operation is conventionally carried out, the wiring board is obtained.
2. the preparation method of wiring board according to claim 1, it is characterised in that the thickness of the second copper-clad layer is
0.5~2mm.
3. the preparation method of wiring board according to claim 1, it is characterised in that the thickness of first copper clad layers is
0.5~5OZ；The thickness of the Copper Foil is 0.1~2OZ.
4. the preparation method of wiring board according to claim 3, it is characterised in that the thickness of first copper clad layers is
0.5~2OZ；The thickness of the Copper Foil is 0.1~0.5OZ.
5. the preparation method of the wiring board according to claim any one of 1-4, it is characterised in that the thermal hole is logical
Hole, a diameter of 0.4~3mm.
6. the preparation method of wiring board according to claim 5, it is characterised in that the technique of the first time drilling is：
Rotating speed is 20~60rpm, enters speed for 20~30 inch per minutes, and R values are 300~500.
7. the preparation method of the wiring board according to claim any one of 1-4, it is characterised in that the second drilling shape
Into hole a diameter of 4~7mil.
8. the preparation method of wiring board according to claim 7, it is characterised in that the technique of second drilling is：
Using laser drill, frequency is 180~150Hz, and pulse width is 3~15 μ s, and laser energy is 3~26mJ, and pulse number is 1
~7, Mask size are 1~4mm.
9. the preparation method of the wiring board according to claim any one of 1-4, it is characterised in that the technique of the pressing
For：Temperature is 150~190 DEG C, and pressure is 35~241N/cm2, vacuum is 0.5~1.5bar.
10. the preparation method of the wiring board described in any one of claim 1-9 makes the wiring board for obtaining.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611218351.5A CN106793588A (en) | 2016-12-26 | 2016-12-26 | Wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611218351.5A CN106793588A (en) | 2016-12-26 | 2016-12-26 | Wiring board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106793588A true CN106793588A (en) | 2017-05-31 |
Family
ID=58926097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611218351.5A Pending CN106793588A (en) | 2016-12-26 | 2016-12-26 | Wiring board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793588A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946010A (en) * | 2017-11-15 | 2018-04-20 | 江苏苏杭电子有限公司 | Processing technology based on circuit board production technology processing thermistor semiconductor |
| CN108430173A (en) * | 2018-03-08 | 2018-08-21 | 皆利士多层线路版(中山)有限公司 | Wiring board and preparation method thereof |
| CN111432578A (en) * | 2020-04-02 | 2020-07-17 | 深圳市精莞盈电子有限公司 | Manufacturing method of ten-layer second-order positive and negative HDI board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738317A (en) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | Packaging method for light source used in LED fluorescent lamp and light source |
| CN102883524A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method |
| CN104349609A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
| CN104427759A (en) * | 2013-08-30 | 2015-03-18 | 深南电路有限公司 | Thick copper circuit board and processing method thereof |
-
2016
- 2016-12-26 CN CN201611218351.5A patent/CN106793588A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102738317A (en) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | Packaging method for light source used in LED fluorescent lamp and light source |
| CN102883524A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method |
| CN104349609A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing method thereof |
| CN104427759A (en) * | 2013-08-30 | 2015-03-18 | 深南电路有限公司 | Thick copper circuit board and processing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946010A (en) * | 2017-11-15 | 2018-04-20 | 江苏苏杭电子有限公司 | Processing technology based on circuit board production technology processing thermistor semiconductor |
| CN108430173A (en) * | 2018-03-08 | 2018-08-21 | 皆利士多层线路版(中山)有限公司 | Wiring board and preparation method thereof |
| CN111432578A (en) * | 2020-04-02 | 2020-07-17 | 深圳市精莞盈电子有限公司 | Manufacturing method of ten-layer second-order positive and negative HDI board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102438413B (en) | Second-order ladder groove bottom graphical printed board and processing method thereof | |
| CN102883558B (en) | Manufacturing method of single plating hole copper | |
| JP5915882B2 (en) | Wiring board and manufacturing method thereof | |
| CN108834335B (en) | PCB manufacturing method and PCB | |
| KR20090116027A (en) | Method for manufacturing printed circuit board and printed circuit board manufactured by the same | |
| KR101049678B1 (en) | Heat spreading printed-circuit-board and method fabricating the same | |
| CN106455370B (en) | It is a kind of to improve the not full blind hole windowing production method of filling perforation | |
| TW200950616A (en) | High density package substrate and method for fabricating the same | |
| CN106793588A (en) | Wiring board and preparation method thereof | |
| JP2014120756A (en) | Method of manufacturing printed circuit board | |
| CN113141712A (en) | Method for manufacturing double-sided aluminum substrate | |
| CN104378931A (en) | Method for manufacturing metallized counterbore in PCB | |
| CN108430173A (en) | Wiring board and preparation method thereof | |
| TW201340806A (en) | Method for manufacturing printed circuit board | |
| KR20100002664A (en) | Metal clad laminate and manufacturing method thereof | |
| TW200536455A (en) | Structure for connecting circuits and manufacturing process thereof | |
| KR20040085374A (en) | Method for making through-hole of multi-layer flexible printed circuit board | |
| JP4972753B2 (en) | Method for manufacturing printed circuit board | |
| CN103607845B (en) | Manufacturing method of flexible printed circuit board | |
| KR20070079794A (en) | Manufacturing method of printed circuit board | |
| CN204090296U (en) | Blind buried via hole printed circuit board (PCB) | |
| TW201108903A (en) | Printed wiring board and method for producing the same | |
| JP2010129997A (en) | Printed-circuit board with embedded pattern, and its manufacturing method | |
| CN110602871B (en) | Graphene heat-conducting PCB and preparation method thereof | |
| KR20090106723A (en) | Manufacturing method of build-up multi pcb using CO2 laser direct method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |