CN111432578A - Manufacturing method of ten-layer second-order positive and negative HDI board - Google Patents
Manufacturing method of ten-layer second-order positive and negative HDI board Download PDFInfo
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- CN111432578A CN111432578A CN202010255217.2A CN202010255217A CN111432578A CN 111432578 A CN111432578 A CN 111432578A CN 202010255217 A CN202010255217 A CN 202010255217A CN 111432578 A CN111432578 A CN 111432578A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
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Abstract
The invention provides a manufacturing method of a ten-layer second-order positive and negative HDI board, which mainly comprises the steps of drilling and filling plating of blind holes, manufacturing of circuits, aligning of lamination, pressing and the like, and CO is aligned2The laser pore-forming process parameters are optimized, under the condition of the optimized process parameters, the roundness of the 100-micron micro blind hole reaches 99.32%, the upper aperture ratio and the lower aperture ratio reach 82.36%, and the hole pattern can fully meet the requirements of subsequent production.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a ten-layer second-order positive and negative HDI board.
Background
Along with the development trend of diversification and modularization of electronic products, the variety of the electronic products is more and more. The traditional equal-thickness fine circuit printed circuit board is difficult to completely meet the requirements of the electronic industry, and custom circuit boards, such as a male-female circuit board, a step circuit board and the like, gradually appear. The step circuit means that the copper thickness of the fine circuit of the printed circuit board has a difference, namely, the copper thickness of the circuit has a certain gradient difference on one printed circuit board. Therefore, it is difficult to manufacture a step wiring board using a conventional fine wiring process. The male and female copper circuits mean that the thickness requirements of the copper layers of the circuits on two sides of the multilayer board laminated core board are different, namely the copper thicknesses of the circuits on the front side and the back side of the same core board are different. However, the traditional circuit manufacturing process is difficult to ensure the quality of the yin-yang circuit board.
Electronic designs are also striving to reduce their size while continuously improving overall performance. Among the small portable products ranging from cell phones to smart weapons, "small" is a constant pursuit. High Density Integration (HDI) technology can allow for more miniaturization of end product designs while meeting higher standards for electronic performance and efficiency. HDI is currently widely used in mobile phones, digital cameras (camcorders), MP3, MP4, notebook computers, automotive electronics, and other digital products, among which the mobile phones are the most widely used. The order of blind holes of the HDI board is developed from the first 3 th order to more than the current 7 th order, the HDI board with 10 th order is developed to the highest degree, and the technical requirements of manufacturing a male circuit board and a female circuit board are the biggest problems to be overcome in development opportunities, wherein the HDI board is low in hole forming roundness and upper-lower aperture ratio when micro blind holes are drilled.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the HDI board micro blind hole pore-forming true roundness, upper and lower aperture ratio are low problem.
In order to solve the technical problem, the invention provides a manufacturing method of a ten-layer second-order male and female HDI plate, which comprises the following steps:
s1, cutting the core board;
s2, manufacturing a fourth-layer circuit board, a fifth-layer circuit board, a sixth-layer circuit board, a seventh-layer circuit board and an AOI, and browning;
s3, manufacturing a third layer of circuit board and an eighth layer of circuit board, stacking and pressing the third layer of circuit board to the eighth layer of circuit board, and then reducing copper and drilling buried holes in the third layer of circuit board and the eighth layer of circuit board;
s4, carrying out copper deposition and electroplating on the third layer of circuit board and the eighth layer of circuit board, then carrying out hole plugging and burying on the third layer of circuit board and the eighth layer of circuit board, and carrying out manufacturing, AOI and browning;
s5, manufacturing a second-layer circuit board and a ninth-layer circuit board, stacking and pressing the second-layer circuit board to the ninth-layer circuit board, and then performing copper reduction and brown oxidation on the second-layer circuit board and the ninth-layer circuit board;
s6, for the second layer wirePerforming CO on the circuit board and the ninth layer of circuit board2Drilling blind holes and depositing copper by laser, then electroplating and filling holes in the second layer of circuit board and the ninth layer of circuit board, and manufacturing, AOI and browning; wherein said CO is2The pulse width of the laser drilling blind hole is 13.8 mu s, and the pulse energy is 14.8 mJ;
s7, manufacturing a first layer of circuit board and a tenth layer of circuit board, stacking and pressing the first layer of circuit board to the tenth layer of circuit board, and then reducing copper and browning the first layer of circuit board and the tenth layer of circuit board;
s8, carrying out CO treatment on the first layer circuit board and the tenth layer circuit board2Laser drilling blind holes and mechanical drilling, then carrying out copper deposition and electroplating on the first layer circuit board and the tenth layer circuit board, and carrying out manufacturing and AOI;
s9, finally, selecting and preparing a wet film, preparing gold, removing and preparing the wet film, and performing electrical measurement and OSP antioxidation after forming.
Furthermore, the first layer of circuit board, the second layer of circuit board, the ninth layer of circuit board and the tenth layer of circuit board all contain second order blind holes.
Furthermore, different thicknesses of the same plate surface are measured after the browning is finished, the maximum thickness is not more than 12 micrometers, and the thickness difference of different areas is not more than 5 micrometers.
Furthermore, the electroplating filling hole is filled by adopting the combination of electroplating parameters of 1.8A/dm2 × 15min +1.0A/dm230min +1.8A/dm2 × 15 min.
Further, the manufacturing steps S2, S4, S6 and S8 include material cutting, plate grinding, film pasting, L DI exposure, development, etching, film stripping and detection.
Further, the etching uses a liquid photoresist.
Further, the fourth layer circuit board, the fifth layer circuit board, the sixth layer circuit board and the seventh layer circuit board are H/1OZ yin-yang core layers, and a medium with a gel content of 75% is adopted.
Further, the deformation coefficient of the board surface is measured after the pressing is finished, and the expansion and shrinkage of the board surface are controlled within 0.1%.
The invention has the beneficial effects that: the invention provides a manufacturing method of a ten-layer second-order positive and negative HDI plate, and solves the problems of roundness of a micro blind hole formed by an HDI plate and low upper and lower aperture ratio. And (3) optimizing CO2 laser pore-forming process parameters by taking the hole pattern of the blind micro-holes as an optimization target and applying a simplex optimization technology so as to obtain 100-micron optimized process parameters of the blind micro-holes. Under the condition of optimizing process parameters, the roundness of the 100-micron micro blind hole reaches 99.32%, the upper and lower aperture ratio reaches 82.36%, and the hole pattern can fully meet the requirements of subsequent production.
Drawings
The detailed structure of the invention is described in detail below with reference to the accompanying drawings
FIG. 1 is a schematic structural diagram of the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1, the invention provides a method for manufacturing a ten-layer second-order male-female HDI board, which includes the following steps:
s1, cutting the core board;
s2, manufacturing a fourth-layer circuit board L4, a fifth-layer circuit board L5, a sixth-layer circuit board L6, a seventh-layer circuit board L7 and an AOI, and browning;
s3, manufacturing a third-layer circuit board L3 and an eighth-layer circuit board L8, stacking and pressing the third-layer circuit board L3 to the eighth-layer circuit board L8, and then reducing copper and drilling and burying holes in the third-layer circuit board L3 and the eighth-layer circuit board L8;
s4, carrying out copper deposition and electroplating on the third-layer circuit board L3 and the eighth-layer circuit board L8, then carrying out hole plugging and burying on the third-layer circuit board L3 and the eighth-layer circuit board L8, and carrying out manufacturing, AOI and browning;
s5, manufacturing a second-layer circuit board L2 and a ninth-layer circuit board L9, stacking and pressing the second-layer circuit board L2 to the ninth-layer circuit board L9, and then performing copper reduction and brown oxidation on the second-layer circuit board L2 and the ninth-layer circuit board L9;
S6、performing CO on the second layer circuit board L2 and the ninth layer circuit board L92Laser drilling blind holes and depositing copper, then electroplating and filling holes in the second layer of circuit board L2 and the ninth layer of circuit board L9, manufacturing, AOI and browning, wherein CO is2The pulse width of the laser drilling blind hole is 13.8 mu s, and the pulse energy is 14.8 mJ;
s7, manufacturing a first-layer circuit board L1 and a tenth-layer circuit board L10, stacking and pressing the first-layer circuit board L1 to the tenth-layer circuit board L10, and then reducing copper and browning the first-layer circuit board L1 and the tenth-layer circuit board L10;
s8, carrying out CO treatment on the first layer circuit board L1 and the tenth layer circuit board L102Laser drilling blind holes and mechanical drilling, then carrying out copper deposition and electroplating on the first layer of circuit board L1 and the tenth layer of circuit board L10, and carrying out manufacturing and AOI;
s9, finally, selecting and preparing a wet film, preparing gold, removing and preparing the wet film, and performing electrical measurement and OSP antioxidation after forming.
Wherein CO is used2The laser drilling device is used for drilling blind holes on a circuit board, setting an optimized target as a blind hole pattern with the aperture of 100 mu m, adopting a simplex optimization method principle, firstly determining the number, the upper and lower bounds and the changed step value of main influence factors, then constructing an initial simplex model in a proper mode, synthesizing according to the influence effects of various indexes, calculating the comprehensive effect, comparing the obtained comprehensive effect, finding the worst experiment vertex, calculating the symmetry point of the worst point, then abandoning the worst point, taking the symmetry point as a new vertex, forming the new vertex and the previous vertex into a new simplex model, comparing the quality of each vertex in the new simplex, carrying out the next reflection, thereby realizing the transition of the simplex until the best experiment point is found, finally verifying whether the best experiment point can meet the convergence accuracy, if the best experiment point can meet the parameter value of the point, the worst experiment can be stopped, the convergence criterion of the simplex can be seen in formula 1, wherein the quality of the best experiment point is found in the formula R and the best experiment point are respectively represented by the error (ξ) or the error is allowed to be represented by the given value of the error (R) of the given value of the experiment point (ξ) respectivelyThe experimental error ξ is 3.5% for the machine itself.
Note: and (3) during normal reflection: a is 1, and a is 0.5 in shrinkage
The hole pattern contains two parameters, namely roundness and upper and lower aperture ratios. Therefore, the combined effect of the two factors is used as an evaluation index. Since the influence of the roundness on the metallization of the holes is slightly greater than that of the upper and lower hole diameters, the effect proportion of the roundness is defined as 60% and the effect proportion of the upper and lower hole diameters is defined as 40% when calculating the combined effect. It is believed that the upper and lower aspect ratios of the blind holes are best between 75% and 90%, for which the present invention is best targeted at its mean value (82.5%), i.e., the closer the upper and lower aspect ratios are to 82.5%, the better. Thus, the calculation formula for the combined effect is:
the influencing factors are as follows: CO22When the laser drilling device drills the blind hole, the main factors influencing the roundness of the blind hole and the ratio of the upper aperture to the lower aperture are as follows: pulse energy, pulse width, pulse number, aperture (Mask), upper and lower bounds of four factors, and step size. Wherein the range of the pulse energy is 13 mJ-15 mJ, the step length is 0.2, and the initial value is 13.8 mJ; the range of the pulse width is 12-14 mus, the length is 0.2, and the initial value is 13.2 mus; the range of the pulse times is 1-14, the step length is 1, and the initial value is 1.0; the range of the aperture diameter (mask) is 1.6mm to 5.4mm, the step length is 0.1, and the initial value is 2.2 mm.
Initial simplex formation: the initial simplex was constructed using table 1 for optimization of drilling parameters.
TABLE 1 coordinates of vertices of the original simplex
Pure form method for CO2And (3) optimizing parameters of the hole pattern of the laser drilling blind hole, and respectively carrying out effect analysis on factors influencing roundness and upper-lower aperture ratio through a horizontal effect table. The primary and secondary relation of the influence of the roundness is as follows: pulse energy>Pulse width>Number of pulses>Mask; the primary and secondary relationship to the effect on the upper and lower aperture ratio is: mask>Pulse energy>Pulse width>The number of pulses. The optimum parameters thus selected are: the power was 5600W, the pulse frequency was 5600Hz, the pulse width was 13.8. mu.s, the pulse energy was 14.8mJ, the number of pulses was 2, and MASK was 2.2 mm.
From the above description, the beneficial effects of the present invention are: the problem of HDI board blind hole that the pore-forming is real circularity, upper and lower aperture ratio is low is solved. Uses the hole pattern of the micro blind hole as an optimization target and applies a simplex optimization technology to CO2And optimizing the laser pore-forming process parameters to obtain 100-micron optimized micro blind hole process parameters. Under the condition of optimizing process parameters, the roundness of the 100-micron micro blind hole reaches 99.32%, the upper and lower aperture ratio reaches 82.36%, and the hole pattern can fully meet the requirements of subsequent production.
Furthermore, the first layer circuit board L1, the second layer circuit board L2, the ninth layer circuit board L9 and the tenth layer circuit board L10 all have second-order blind holes2The method is characterized in that the surface of the board is subjected to browning treatment before the blind hole is drilled, wherein the browning treatment is realized by using browning chemical liquid to carry out micro-etching treatment on the surface of copper, and the surface of the copper is roughened to form a browning film so as to enhance the binding force between a prepreg and an inner layer board. The roughened copper surface is in CO due to the uneven surface structure2The laser light is absorbed when it strikes its surface, reducing the reflection of light.
Furthermore, whether the surface flatness after browning is consistent or not and whether the surface copper thickness after browning meets the requirement or not will seriously affect the drilling quality of the blind hole. Therefore, different thicknesses of the same plate surface are required to be measured after the browning is finished, the maximum thickness is not more than 12 mu m, and the thickness difference of different areas is not more than 5 mu m.
The electroplating filling hole adopts the electroplating parameter combination of 1.8A/dm2 × 15min +1.0A/dm230min +1.8A/dm2 × 15min to fill the hole, wherein, the invention takes an insoluble material-titanium basket as an anode, compares the influence of the current size on the actual hole filling effect on the basis of the relationship between the current density and the filling explosion period of the micro blind hole, thereby determining the proper current size, solving the problems of poor filling effect, low efficiency and seamless mass production, and realizes the purpose of single filling hole filling, high filling rate of the blind hole, high filling effect and high electroplating filling quality of a blind hole area of which the filling rate is not suitable for 96.96% and the electroplating filling rate is high under the condition of combining process parameters.
Further, the manufacturing steps of S2, S4, S6 and S8 include cutting, grinding, pasting, L DI exposure, developing, etching, stripping and detection, pre-etching compensation is respectively carried out on lines with different thicknesses, fitting equations of etching compensation quantity and line width in the ladder lines are applied to manufacturing of 15 mu m/30 mu m male and female lines, the male and female copper lines are similar to the ladder lines and are lines with different thicknesses on the same board, except that the ladder lines are lines with different thicknesses on the same surface, and the female and male board lines are lines with different thicknesses on different surfaces, so that the lines can be manufactured at one time by applying the fitting equations of etching compensation quantity and line width in the 15 mu m/30 mu m ladder lines to manufacturing of the 15 mu m/30 mu m male and female lines, etching compensation is respectively carried out on lines with different thicknesses on the front and back surfaces, and then etching is carried out at the etching speed required by the copper lines with different thicknesses on the front and back surfaces is carried out etching compensation, so that the bonding effect of lamination is not easy to increase the lamination in the lamination process.
Furthermore, in the etching stage, due to the step difference of the copper thickness of the circuit, the line width and the line distance of areas with different copper thicknesses are difficult to ensure to be the same under the same etching condition, and the quality of the product is influenced. And with the increase of the copper thickness of the copper-clad plate, the advantage of the liquid photoresist for manufacturing the circuit is more obvious. The problem of HDI ladder circuit low in qualification rate is solved.
Furthermore, the fourth layer circuit board L4, the fifth layer circuit board L5, the sixth layer circuit board L6 and the seventh layer circuit board L7 are H/1OZ positive and negative core layers made of halogen-free epoxy glass fiber board and aluminum substrate material, the copper thicknesses of the fourth layer circuit board L4 and the seventh layer circuit board L7 layer are 30 μm, the copper thicknesses of the fifth layer circuit board L5 and the sixth layer circuit board L6 layer are 15 μm, the hole patterns of the dielectric layer with low gel content after laser drilling are poor, the influence of the hole patterns on hole metallization is great, and the good filling quality of the blind holes is directly influenced due to the poor hole patterns, so the dielectric with 75% gel content is adopted.
Furthermore, the plate surface needs to be browned before pressing. The purpose of surface browning prior to lamination is different from browning prior to laser drilling. Its purpose is through the roughness on increase copper surface, to increase the bonding effect of pressfitting, makes the board be difficult to the layering. The laminated board inevitably has the problem of expansion and shrinkage of the board surface due to different materials, so the deformation coefficient of the board surface needs to be measured after the pressing is finished, the expansion and shrinkage of the board surface are required to be controlled within 0.1 percent in the production, and the qualification beyond the range is not qualified.
In conclusion, the manufacturing method of the ten-layer second-order positive and negative HDI plate provided by the invention solves the problems that the micro blind hole forming roundness and the upper and lower aperture ratio of the HDI plate are low; the blind hole filling and plating effect is poor, the efficiency is low, and the blind hole filling and plating method is not suitable for mass production; the filling rate of the micro blind holes is low, and the electroplating time is long; the qualification rate of the HDI step line is low; the ten-layer second-order negative and positive HDI plate has the problems of complex manufacturing process and high cost.
The first … … and the second … … are only used for name differentiation and do not represent how different the importance and position of the two are.
Here, the upper, lower, left, right, front, and rear merely represent relative positions thereof and do not represent absolute positions thereof
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A manufacturing method of a ten-layer second-order positive and negative HDI board is characterized by comprising the following steps: the method comprises the following steps:
s1, cutting the core board;
s2, manufacturing a fourth-layer circuit board, a fifth-layer circuit board, a sixth-layer circuit board, a seventh-layer circuit board and an AOI, and browning;
s3, manufacturing a third layer of circuit board and an eighth layer of circuit board, stacking and pressing the third layer of circuit board to the eighth layer of circuit board, and then reducing copper and drilling buried holes in the third layer of circuit board and the eighth layer of circuit board;
s4, carrying out copper deposition and electroplating on the third layer of circuit board and the eighth layer of circuit board, then carrying out hole plugging and burying on the third layer of circuit board and the eighth layer of circuit board, and carrying out manufacturing, AOI and browning;
s5, manufacturing a second-layer circuit board and a ninth-layer circuit board, stacking and pressing the second-layer circuit board to the ninth-layer circuit board, and then performing copper reduction and brown oxidation on the second-layer circuit board and the ninth-layer circuit board;
s6, carrying out CO treatment on the second layer circuit board and the ninth layer circuit board2Drilling blind holes and depositing copper by laser, then electroplating and filling holes in the second layer of circuit board and the ninth layer of circuit board, and manufacturing, AOI and browning; wherein said CO is2The pulse width of the laser drilling blind hole is 13.8 mu s, and the pulse energy is 14.8 mJ;
s7, manufacturing a first layer of circuit board and a tenth layer of circuit board, stacking and pressing the first layer of circuit board to the tenth layer of circuit board, and then reducing copper and browning the first layer of circuit board and the tenth layer of circuit board;
s8, carrying out CO treatment on the first layer circuit board and the tenth layer circuit board2Laser drilling blind holes and mechanical drilling, then carrying out copper deposition and electroplating on the first layer circuit board and the tenth layer circuit board, and carrying out manufacturing and AOI;
s9, finally, selecting and preparing a wet film, preparing gold, removing and preparing the wet film, and performing electrical measurement and OSP antioxidation after forming.
2. The method for manufacturing a ten-layer second-order male-female HDI plate according to claim 1, wherein the method comprises the following steps: the first layer of circuit board, the second layer of circuit board, the ninth layer of circuit board and the tenth layer of circuit board all contain second order blind holes.
3. The method for manufacturing a ten-layer second-order male-female HDI plate according to claim 2, wherein the method comprises the following steps: after the browning is finished, different thicknesses of the same plate surface are measured, the maximum thickness is not more than 12 micrometers, and the thickness difference of different areas is not more than 5 micrometers.
4. The method for manufacturing a ten-layer second-order male-female HDI board as claimed in claim 3, wherein the electroplating filling hole is filled by adopting the combination of electroplating parameters of 1.8A/dm2 × 15min +1.0A/dm230min +1.8A/dm2 × 15 min.
5. The method for manufacturing a ten-layer second-order positive and negative HDI board as claimed in claim 1, wherein the manufacturing steps S2, S4, S6 and S8 include material cutting, board grinding, film pasting, L DI exposure, developing, etching, film stripping and detection.
6. The method for manufacturing a ten-layer second-order male-female HDI plate according to claim 5, wherein the method comprises the following steps: the etching uses a liquid photoresist.
7. The method for manufacturing a ten-layer second-order male-female HDI plate according to claim 6, wherein the method comprises the following steps: the fourth layer circuit board, the fifth layer circuit board, the sixth layer circuit board and the seventh layer circuit board are H/1OZ yin-yang core layers, and a medium with the gel content of 75% is adopted.
8. The method for manufacturing a ten-layer second-order male-female HDI plate according to claim 1, wherein the method comprises the following steps: and measuring the deformation coefficient of the board surface after the pressing is finished, and controlling the expansion and shrinkage of the board surface within 0.1%.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114126221A (en) * | 2020-08-26 | 2022-03-01 | 深南电路股份有限公司 | Printed circuit board and rapid processing method and system for multi-layer board structure |
| CN114615828A (en) * | 2020-12-08 | 2022-06-10 | 深南电路股份有限公司 | HDI circuit board, manufacturing method thereof and millimeter wave radar sensor |
| CN116156741A (en) * | 2023-04-23 | 2023-05-23 | 南昌龙旗信息技术有限公司 | Printed circuit board and mobile device |
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| CN1568136A (en) * | 2003-07-08 | 2005-01-19 | 耀华电子股份有限公司 | Layer increasing method for multilayer printed circuit board and structure thereof |
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Application publication date: 20200717 |
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