CN112261788A - Manufacturing method of thick copper high-density interconnection printed board - Google Patents
Manufacturing method of thick copper high-density interconnection printed board Download PDFInfo
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- CN112261788A CN112261788A CN202011140993.4A CN202011140993A CN112261788A CN 112261788 A CN112261788 A CN 112261788A CN 202011140993 A CN202011140993 A CN 202011140993A CN 112261788 A CN112261788 A CN 112261788A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a method for manufacturing a thick copper high-density interconnection printed board, which comprises the following steps: manufacturing a blind hole windowing graph on a production board, removing a copper layer at a windowing position through etching, and drilling a blind hole at the windowing position by using laser; drilling plug holes on the production plate after the membrane is removed, and then metalizing the blind holes and the plug holes; manufacturing a plated hole pattern on the production board, and thickening the hole wall copper layer of the plug hole and the blind hole through electroplating; filling resin printing ink in the plug holes and the blind holes after the membrane is removed, solidifying, and grinding the plate to flatten the surface of the plate; making a hole masking pattern on the production plate, and thinning the thickness of the surface copper layer through microetching; flattening the surface of the plate by grinding the plate after film stripping; drilling through holes and through grooves on a production plate, and then metalizing the through holes and the through grooves; and (4) sequentially carrying out post-processes on the production board to obtain the thick-copper high-density interconnection printed board. The method realizes the manufacture of the large-aperture blind hole and the thick-copper high-density interconnection printed board, and also avoids the resin from entering the through hole and the groove which do not need to be plugged.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a thick copper high-density interconnection printed board.
Background
The thick copper circuit board is a product with a thicker copper thickness than that of a conventional circuit board, is used for bearing heavy current, dissipating heat and reducing thermal strain, and is mainly used for communication equipment, aerospace, network energy, new energy automobile power supplies and the like.
In recent years, new energy equipment facilities mainly focusing on electric automobiles rise rapidly, related supporting facilities such as charging piles, charging boxes and other equipment are also developed vigorously, and circuit boards serving as basic elements of electronic equipment are also indispensable links for promoting development of new energy industries.
A printed board that is used for the circuit board of new energy equipment to require to possess heavy current transmission ability, heat-sinking capability and intelligent support ability, and a collection thick copper, high density interconnection, multilayer design can satisfy these requirements. The conventional manufacturing process of the high-density interconnection printed board comprises the following steps: cutting → inner layer pattern → inner layer etching → inner layer AOI → brown oxidation → pressing → laser drilling → de-brown oxidation → mechanical drilling → copper deposition → whole plate electroplating → hole plating pattern → hole filling electroplating → selective resin hole plugging (if any) → ceramic grinding plate → outer layer pattern → pattern electroplating → outer layer etching → outer layer AOI → silk screen solder resist/character → nickel deposition → molding → electrical test → FOC → FQA → packaging.
A thick copper high-density interconnection printed board, its total number of layers is 14L, the inner core board uses 4/4OZ thick copper clad laminate (1OZ ≈ 35 μm), the aperture of laser blind hole is 0.25mm, the aperture of mechanical drilling is 0.4mm (the aspect ratio reaches 8:1), the outer copper foil uses 0.33OZ, and design has resin plug hole and metallization groove, the final requirement is that the outer copper thickness reaches 90 μm, the hole copper 50 μm, the metal sidewall copper 50 μm; the printed board is too difficult to manufacture by using a conventional technology, and cannot be manufactured, and the specific manufacturing process has the following problems:
1. before laser drilling, the outer copper foil needs to be treated by a browning process, so that the roughness is increased, the laser absorption capacity of the copper foil is improved, the whole copper foil loses 3-4 mu m of copper thickness in the browning process, the surface copper thickness cannot be guaranteed, and potential quality hazards are brought to subsequent copper deposition and full-plate electroplating;
2. the laser blind hole has the aperture of 0.25mm, is an ultra-large aperture blind hole, and cannot realize electroplating filling (the conventional blind hole is less than or equal to 0.15 mm);
3. the distance between the resin plug hole and the metalized through hole and the distance between the resin plug hole and the metalized groove are only 0.4mm, and the resin can enter the metalized through hole and the groove during plug hole;
4. the thickness-diameter ratio is 8:1, and the through blind holes cannot realize primary co-plating;
5. the hole copper is required to be 50 μm, and the surface copper is too thick by adopting the conventional electroplating method, so that the serious problems of incomplete circuit etching, drilling, burr forming and the like are caused.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a method for manufacturing a thick-copper high-density interconnection printed board, which realizes the manufacture of a large-aperture blind hole, and manufactures other metalized through holes and metalized grooves after the blind hole and a resin plug hole are manufactured, prevents resin from entering the through holes and the grooves, and realizes the manufacture of the thick-copper high-density interconnection printed board by optimizing the manufacturing process flow.
In order to solve the technical problem, the invention provides a manufacturing method of a thick copper high-density interconnection printed board, which comprises the following steps:
s1, pasting a film on the production board, windowing the film at the position corresponding to the blind hole, removing a copper layer at the windowing position through etching, and drilling the blind hole at the windowing position by using laser;
s2, drilling a plug hole needing to be filled with resin on the production board after film stripping, and then sequentially performing copper deposition and full-board electroplating to metalize the blind hole and the plug hole;
s3, manufacturing plated hole patterns corresponding to the plug holes and the blind holes on the production board, and thickening the hole wall copper layers of the plug holes and the blind holes through electroplating;
s4, filling resin ink in the plug holes and the blind holes after film removal and curing, and then removing the resin ink on the hole rings at the hole openings and the protruded plate surface by grinding the plate;
s5, manufacturing hole masking patterns for protecting the plug holes and the blind holes on the production board, and then thinning the thickness of the surface copper layer through microetching;
s6, removing the resin ink protruding out of the plate surface and the hole ring at the hole by grinding the plate after film stripping;
s7, drilling through holes without resin filling and milling through grooves without resin filling on the production plate, and then metalizing the through holes and the through grooves by copper deposition and full-plate electroplating;
and S8, manufacturing the outer layer circuit, manufacturing the solder mask layer, performing surface treatment and forming on the production board sequentially to obtain the thick-copper high-density interconnection printed board.
Further, in step S1, the aperture of the blind hole is 0.25mm ± 12.5 μm; the outer copper foil thickness of the production board was 0.33 oz.
Further, in step S2, a full-plate via-filling electroplating is performed on the production plate between the copper deposition and the full-plate electroplating, and after the full-plate via-filling electroplating, the thickness of the copper layer on the plate surface is controlled to be 30 ± 5 μm, and the thickness of the copper on the walls of the blind holes and the plug holes is controlled to be 12 μm.
Further, in step S2, the full-plate electroplating is performed once by pulse electroplating, and the current density is 3.2ASD, the time is 45min, and the waveform is 9: 1, after the whole board is electroplated, the thickness of a copper layer on the board surface is controlled to be 55 +/-5 mu m, and the copper thickness of the hole walls of the blind holes and the plug holes is controlled to be 35 mu m.
Further, in step S3, the copper thickness of the via holes of the blind vias and the via holes is 50 μm after the electroplating thickening.
Further, in step S4, the resin ink on the hole ring and the protruded plate surface at the hole is removed by ceramic plate grinding to make the plate surface flat, and the thickness of the copper layer on the plate surface after plate grinding is controlled to be 50 ± 5 μm.
Further, in step S5, the thickness of the copper layer on the board surface is controlled to 38 + -5 μm after the copper is microetched.
Further, in step S6, the resin ink on the hole ring and the protruded plate surface at the hole is removed by ceramic plate grinding to make the plate surface flat, and the thickness of the copper layer on the plate surface after plate grinding is controlled to 33 ± 5 μm.
Further, in step S7, the full-plate electroplating is performed twice by pulse electroplating, and the current density of each time is 3.8ASD, the time is 45min, and the waveform is 9: 1, after the whole board is electroplated, the thickness of a copper layer on the board surface is more than or equal to 90 microns, and the thickness of copper on the wall surfaces of the through holes and the through grooves is more than or equal to 50 microns.
Further, in step S7, plating the copper layer on the board surface, the copper layer on the hole wall, and the copper layer on the groove wall to the thickness required by the design after the full board electroplating; in step S8, an outer layer circuit is formed on the production board by a positive process, and only tin plating and no copper plating are performed during pattern electroplating, and the outer layer is routed before etching.
Compared with the prior art, the invention has the following beneficial effects:
the method comprises the steps of firstly, manufacturing a blind hole windowing graph, etching away a copper layer corresponding to a blind hole, and burning resin at the windowing position by utilizing laser to drill the blind hole, so that the manufacturing of a large-aperture blind hole is realized, the thickness of the copper layer of the plate is unchanged after the blind hole is drilled by the laser, the copper thickness of the whole copper foil is prevented from being lost by 3-4 mu m in the browning process, and potential quality hazards are brought to subsequent copper deposition and whole plate electroplating; then, firstly drilling a hole and completing resin hole plugging, and then drilling and manufacturing a metalized through hole and a metalized groove to prevent resin from entering the through hole and the groove; when the thickness of the copper is reduced to be more than 10 micrometers, the copper can not be reduced simply by grinding the plate, the whole plate surface can be greatly stretched, hole copper separation is caused, and the like, and great quality hidden danger is caused, so that the thickness of the copper layer of the plate surface is gradually reduced by combining the microetching mode and the plate grinding mode, the thickness reduced during plate grinding is reduced, and the influence on the quality of the plate during plate grinding is avoided; when the plug holes and the blind holes are electroplated and thickened, the combination of the whole board hole filling electroplating, the whole board electroplating and the hole filling electroplating is adopted, so that the thickness of the hole wall copper layer of the plug holes and the blind holes can reach a proper size, the excessive thickness of the plate surface copper layer is avoided, and the thickness of copper which needs to be reduced at the later stage is reduced; and the outer layer circuit is milled before etching, so that burrs formed by milling the outer layer circuit can be removed by etching.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The manufacturing method of the thick copper high-density interconnection printed board shown in this embodiment sequentially includes the following processing steps:
(1) cutting: the core plate is cut according to the size of the jointed board of 520mm multiplied by 620mm, the thickness of the core plate is 0.11mm (excluding the thickness of the outer layer copper), and the thickness of the copper on the two surfaces of the core plate is 4OZ (1OZ is approximately equal to 35 mu m).
(2) And inner layer circuit manufacturing (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and completing the exposure of the inner layer circuit by using a full-automatic exposure machine and 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed core board to form an inner layer circuit, wherein the line width of the inner layer is measured to be 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And pressing: the browning speed is that a plurality of core plates, prepregs and outer copper foils are sequentially laminated according to requirements according to the thickness of bottom copper, and then the laminated plates are pressed by selecting proper lamination conditions according to the Tg of the plate materials to form a 14-layer production plate; the thickness of the outer copper foil was 0.33 OZ.
(4) And blind hole windowing graph: and pasting a film on the production board, windowing at the position corresponding to the blind hole through exposure and development, and then removing the copper layer at the windowing position through etching.
(5) Drilling a blind hole: and drilling blind holes with the aperture of 0.25mm +/-12.5 microns at the windowing part by burning resin through laser.
(6) Drilling a resin plug hole: after the film is removed, drilling a plug hole to be filled with resin on a production plate;
(7) and copper deposition: and (3) depositing a layer of thin copper on the plate surface and the hole wall by using an electroless copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(8) And whole board hole filling electroplating: and (3) thickening the hole wall copper layer and the board surface copper layer by whole board filling hole electroplating, controlling the thickness of the board surface copper layer to be 30 +/-5 mu m and controlling the thickness of the hole wall copper of the blind hole and the plug hole to be 12 mu m after the whole board filling hole electroplating.
(9) And electroplating the whole plate: electroplating once by adopting a pulse electroplating mode, specifically electroplating for 45min by using a current density full plate of 3.2ASD, wherein the waveform is 9: 1, after the whole board is electroplated, the thickness of a copper layer on the board surface is controlled to be 55 +/-5 mu m, and the copper thickness of the hole walls of the blind holes and the plug holes is controlled to be 35 mu m.
(10) And manufacturing a plated hole pattern: and pasting a film on the production board, and windowing at positions corresponding to the plug holes and the blind holes through exposure and development.
(11) Filling holes and electroplating: and then, hole wall copper layers of the plug holes and the blind holes are thickened through hole filling electroplating, so that the copper thickness of the blind holes and the hole walls of the plug holes is 50 micrometers.
(12) Resin hole plugging: and after the membrane is removed, filling resin printing ink in the plug holes and the blind holes through the screen printing plate in a vacuum plug hole mode and curing.
(13) Grinding a plate: and then removing the hole ring formed at the hole opening by filling hole electroplating and the resin printing ink protruding out of the board surface by a ceramic grinding board to flatten the board surface, and controlling the thickness of the copper layer on the board surface after grinding to be 50 +/-5 mu m.
(14) And manufacturing a hole masking pattern: a film is pasted on the production board, and a mask covering the same is formed at positions corresponding to the plug holes and the blind holes by exposure and development for protecting the resin in the holes.
(15) Micro-etching to reduce copper: and (3) reducing the thickness of the board surface copper layer by microetching, and controlling the thickness of the board surface copper layer to be 38 +/-5 mu m.
(16) Grinding a plate: and then removing a hole ring formed at the hole opening due to copper reduction and resin ink protruding out of the board surface through a ceramic grinding board to enable the board surface to be flat, and controlling the thickness of a copper layer on the board surface after the board is ground to be 33 +/-5 mu m.
(17) Drilling and milling grooves: and drilling through holes without resin filling and milling through grooves without resin filling on the production plate by using the drilling data.
(18) And copper deposition: and depositing a layer of thin copper on the plate surface, the hole wall and the groove wall by using a chemical copper plating method, and testing the backlight to 10 grades, wherein the thickness of the deposited copper in the hole is 0.5 mu m.
(19) And electroplating the whole plate: electroplating twice by adopting a pulse electroplating mode, wherein the electroplating is carried out for 45min in a current density full-plate mode of 3.8ASD, and the waveform is 9: 1, plating a plate surface copper layer, a hole wall copper layer and a groove wall copper layer to the thickness required by design in a manner of electroplating twice; specifically, after the whole board is electroplated, the thickness of a copper layer on the board surface is more than or equal to 90 microns, and the thickness of copper on the wall surfaces of the through holes and the through grooves is more than or equal to 50 microns.
(20) And manufacturing an outer layer circuit (positive process): the method comprises the following steps:
a. adopting a full-automatic exposure machine and a positive film circuit film, completing outer layer circuit exposure by using 5-7 exposure rulers (21 exposure rulers), and forming an outer layer circuit graph on a production board through development;
b. then plating tin on the production plate, wherein the tin plating is to electroplate for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m to form an etching protective layer;
c. according to the design requirement, the appearance of the gong is produced;
d. then sequentially removing the film, etching and tin, etching an outer layer circuit on the production board, and removing burrs formed by the gong shape by etching;
e. and then, detecting the defects of open short circuit, circuit gaps, circuit pinholes and the like of the outer layer circuit, discarding the defects, and discharging the defect-free product to the next flow.
(21) Solder resist and silk screen printing of characters: after the solder resist ink is printed on the surface of the production board in a silk-screen manner, the solder resist ink is cured into a solder resist layer through pre-curing, exposure, development and thermocuring treatment in sequence; specifically, TOP surface solder resist ink is printed by a white screen, and the TOP surface characters are added with UL marks, so that a protective layer which prevents bridging between circuits during welding and provides a permanent electrical environment and chemical corrosion resistance is coated on the circuits and the base materials which do not need to be welded, and the effect of beautifying the appearance is achieved.
(22) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm to obtain the thick copper high-density interconnection printed board.
(23) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(24) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the thick copper high-density interconnection printed board is inspected, if a defect exists, the defect is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(25) FQA: and measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the thick copper high-density interconnection printed board meet the requirements of customers or not.
(26) And packaging: and hermetically packaging the thick copper high-density interconnected printed boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A manufacturing method of a thick copper high-density interconnection printed board is characterized by comprising the following steps:
s1, pasting a film on the production board, windowing the film at the position corresponding to the blind hole, removing a copper layer at the windowing position through etching, and drilling the blind hole at the windowing position by using laser;
s2, drilling a plug hole needing to be filled with resin on the production board after film stripping, and then sequentially performing copper deposition and full-board electroplating to metalize the blind hole and the plug hole;
s3, manufacturing plated hole patterns corresponding to the plug holes and the blind holes on the production board, and thickening the hole wall copper layers of the plug holes and the blind holes through electroplating;
s4, filling resin ink in the plug holes and the blind holes after film removal and curing, and then removing the resin ink on the hole rings at the hole openings and the protruded plate surface by grinding the plate;
s5, manufacturing hole masking patterns for protecting the plug holes and the blind holes on the production board, and then thinning the thickness of the surface copper layer through microetching;
s6, removing the resin ink protruding out of the plate surface and the hole ring at the hole by grinding the plate after film stripping;
s7, drilling through holes without resin filling and milling through grooves without resin filling on the production plate, and then metalizing the through holes and the through grooves by copper deposition and full-plate electroplating;
and S8, manufacturing the outer layer circuit, manufacturing the solder mask layer, performing surface treatment and forming on the production board sequentially to obtain the thick-copper high-density interconnection printed board.
2. The method for manufacturing a thick copper high-density interconnection printed board according to claim 1, wherein in step S1, the aperture of the blind hole is 0.25mm ± 12.5 μm; the outer copper foil thickness of the production board was 0.33 oz.
3. The method for manufacturing a thick copper high-density interconnection printed board according to claim 1, wherein in step S2, a full board filling electroplating is further performed on the production board between the copper deposition and the full board electroplating, and after the full board filling electroplating, the thickness of the board surface copper layer is controlled to be 30 ± 5 μm, and the thickness of the hole wall copper of the blind holes and the plug holes is controlled to be 12 μm.
4. The method for manufacturing a thick copper high-density interconnection printed board according to claim 3, wherein in step S2, the full board electroplating is performed once by pulse electroplating, and the current density is 3.2ASD, the time is 45min, and the waveform is 9: 1, after the whole board is electroplated, the thickness of a copper layer on the board surface is controlled to be 55 +/-5 mu m, and the copper thickness of the hole walls of the blind holes and the plug holes is controlled to be 35 mu m.
5. The method for manufacturing a thick copper high density interconnection printed board according to claim 4, wherein in step S3, the copper thickness of the via holes of the blind holes and the plug holes is 50 μm after the electroplating thickening.
6. The method for manufacturing a thick copper high-density interconnection printed board according to claim 5, wherein in step S4, the resin ink protruding from the hole ring and the board surface at the hole is removed by ceramic grinding to make the board surface flat, and the thickness of the copper layer on the board surface after grinding is controlled to be 50 ± 5 μm.
7. The method for manufacturing a thick copper high-density interconnection printed board according to claim 6, wherein in step S5, the thickness of the copper layer on the board surface is controlled to be 38 ± 5 μm after the copper is removed by microetching.
8. The method for manufacturing a thick copper high-density interconnection printed board according to claim 7, wherein in step S6, the resin ink protruding from the hole ring and the board surface at the hole is removed by ceramic grinding to make the board surface flat, and the thickness of the copper layer on the board surface after grinding is controlled to be 33 ± 5 μm.
9. The method for manufacturing a thick copper high-density interconnection printed board according to claim 8, wherein in step S7, electroplating is performed twice in a pulse electroplating manner during full board electroplating, and the current density at each time is 3.8ASD, the time is 45min, and the waveform is 9: 1, after the whole board is electroplated, the thickness of a copper layer on the board surface is more than or equal to 90 microns, and the thickness of copper on the wall surfaces of the through holes and the through grooves is more than or equal to 50 microns.
10. The method for manufacturing a thick copper high-density interconnection printed board according to any one of claims 1 to 9, wherein in step S7, the board surface copper layer, the hole wall copper layer and the groove wall copper layer are all plated to a thickness required by design after the full board electroplating; in step S8, an outer layer circuit is formed on the production board by a positive process, and only tin plating and no copper plating are performed during pattern electroplating, and the outer layer is routed before etching.
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| CN202011140993.4A CN112261788A (en) | 2020-10-22 | 2020-10-22 | Manufacturing method of thick copper high-density interconnection printed board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113194616A (en) * | 2021-05-21 | 2021-07-30 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing resin plug hole without plating filling |
| CN113564654A (en) * | 2021-07-15 | 2021-10-29 | 深圳市拓普联科技术股份有限公司 | Needle tube and method for producing needle tube |
| CN113709981A (en) * | 2021-08-25 | 2021-11-26 | 江西志浩电子科技有限公司 | Processing technology for dry film cover resin hole plugging micro-etching |
| CN113905521A (en) * | 2021-09-17 | 2022-01-07 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with two different hole copper thicknesses |
| CN114401584A (en) * | 2021-11-01 | 2022-04-26 | 安捷利美维电子(厦门)有限责任公司 | High-density interconnected circuit board interlayer interconnection structure and processing technology |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113194616A (en) * | 2021-05-21 | 2021-07-30 | 深圳市迅捷兴科技股份有限公司 | Method for manufacturing resin plug hole without plating filling |
| CN113564654A (en) * | 2021-07-15 | 2021-10-29 | 深圳市拓普联科技术股份有限公司 | Needle tube and method for producing needle tube |
| CN113709981A (en) * | 2021-08-25 | 2021-11-26 | 江西志浩电子科技有限公司 | Processing technology for dry film cover resin hole plugging micro-etching |
| CN113905521A (en) * | 2021-09-17 | 2022-01-07 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with two different hole copper thicknesses |
| CN114401584A (en) * | 2021-11-01 | 2022-04-26 | 安捷利美维电子(厦门)有限责任公司 | High-density interconnected circuit board interlayer interconnection structure and processing technology |
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